JP2016152382A5 - - Google Patents

Description

According to a second aspect of the substrate cleaning apparatus adjustment method of the present invention, the substrate is rotated by rotating the roller while holding the peripheral edge of the substrate with a plurality of rollers, and the cleaning member is brought into contact with the rotating substrate. In the adjustment method of the substrate cleaning apparatus for cleaning the substrate by supplying the cleaning liquid to the substrate, the rotation state of the substrate is monitored while changing the pressing force of the roller against the substrate while the cleaning member is in contact with the substrate. It is characterized by doing.
In a preferred aspect of the present invention, the pressing force of the roller is gradually reduced, and the pressing force of the roller when the slip between the substrate and the roller starts is obtained.
Another aspect of the substrate cleaning apparatus according to the present invention includes a plurality of rollers that hold the peripheral edge of the substrate and rotate the substrate, a cleaning liquid supply nozzle that supplies a cleaning liquid to the surface of the substrate, and a substrate that is rotated by the plurality of rollers. A cleaning member that contacts the surface of the substrate to clean the surface of the substrate, a controller that controls the pressing force of the plurality of rollers against the substrate, and an optical sensor that includes a light receiving unit and a light projecting unit, An optical axis is provided at a position where the notch of the rotating substrate can be detected, and when the notch of the substrate passes through the optical axis, the light receiving unit receives light from the light projecting unit and outputs an electrical signal. Generating and outputting the electrical signal to the controller.

Claims (15)

In a substrate cleaning apparatus for cleaning a substrate by supplying a cleaning liquid to the substrate while rotating the substrate by rotating the roller while holding the peripheral portion of the substrate with a plurality of rollers and bringing a cleaning member into contact with the rotating substrate ,
Slip detecting means for detecting a slip generated between the substrate and the roller that is in a state where the rotational speed of the substrate is lower than the set rotational speed;
A roller pressing mechanism that presses the roller against the substrate with a predetermined pressing force;
A substrate cleaning apparatus, comprising: a controller that increases a pressing force by the roller pressing mechanism when the slip detection means detects a slip between the substrate and the roller.   2. The substrate cleaning apparatus according to claim 1, wherein the slip detection means includes a vibration sensor that detects vibration generated in the roller when a notch in a peripheral portion of the substrate hits the roller.   2. The substrate cleaning apparatus according to claim 1, wherein the slip detection means comprises an optical sensor capable of detecting a notch in the peripheral edge of the substrate.   2. The substrate cleaning apparatus according to claim 1, wherein the slip detection means comprises a driven roller that rotates in contact with the peripheral edge of the substrate, and a speed sensor that measures the rotational speed of the driven roller.   The substrate cleaning apparatus according to claim 1, wherein the roller pressing mechanism includes an air cylinder or an electric cylinder.   6. The substrate according to claim 1, wherein the control unit increases a pressing force by the roller pressing mechanism when a signal received from the slip detection unit falls below a predetermined threshold value. Cleaning device. In the substrate cleaning method of cleaning the substrate by supplying the cleaning liquid to the substrate while rotating the substrate by rotating the roller while holding the peripheral edge of the substrate with a plurality of rollers and bringing the cleaning member into contact with the rotating substrate,
A plurality of rotating rollers are pressed against the substrate with a predetermined pressing force, the substrate is rotated at a set rotation speed, and the cleaning member is brought into contact with the rotating substrate for cleaning.
During the cleaning, the presence or absence of slip generated between the substrate and the roller, where the rotation speed of the substrate becomes lower than the set rotation speed, is monitored,
When the slip occurs, the substrate cleaning method is characterized in that the pressing force of the roller against the substrate is increased to continue the cleaning of the substrate.   8. The substrate cleaning method according to claim 7, wherein the slip is detected by a vibration sensor that detects vibration generated in a roller when a notch in a peripheral edge of the substrate hits the roller.   8. The substrate cleaning method according to claim 7, wherein the slip is detected by monitoring the rotation of the substrate by an optical sensor capable of detecting a notch in the peripheral edge of the substrate.   8. The substrate cleaning method according to claim 7, wherein the slip is detected by monitoring the rotation of a driven roller rotating in contact with the peripheral edge of the substrate by a speed sensor. Adjustment of a substrate cleaning apparatus that rotates the substrate by rotating the roller while holding the peripheral edge of the substrate with a plurality of rollers, and supplies the cleaning liquid to the substrate while cleaning the substrate while bringing the cleaning member into contact with the rotating substrate. In the method
A method for adjusting a substrate cleaning apparatus, comprising: monitoring a rotation state of a substrate while changing a pressing force of the roller against the substrate while the cleaning member is not in contact with the substrate.   12. The method of adjusting a substrate cleaning apparatus according to claim 11, wherein the pressing force of the roller is gradually increased to obtain the pressing force of the roller when the rotation of the substrate starts. A substrate cleaning apparatus for cleaning a substrate by supplying a cleaning liquid to the substrate while rotating the substrate by rotating the roller while holding the peripheral portion of the substrate by a plurality of rollers, and contacting a cleaning member to the rotating substrate. In the adjustment method,
A method for adjusting a substrate cleaning apparatus, comprising: monitoring a rotation state of a substrate while changing a pressing force of the roller against the substrate while the cleaning member is in contact with the substrate.   The method for adjusting a substrate cleaning apparatus according to claim 13, wherein the pressing force of the roller is gradually reduced to determine the pressing force of the roller when the slip between the substrate and the roller starts. A plurality of rollers for holding the periphery of the substrate and rotating the substrate;
A cleaning liquid supply nozzle for supplying a cleaning liquid to the surface of the substrate;
A cleaning member for cleaning the substrate surface in contact with the surface of the substrate rotated by the plurality of rollers;
A controller for controlling the pressing force of the plurality of rollers against the substrate;
An optical sensor comprising a light receiving part and a light projecting part;
The optical sensor is provided with an optical axis at a position where the notch of the rotating substrate can be detected, and the light receiving unit receives light from the light projecting unit when the notch of the substrate passes the optical axis. A substrate cleaning apparatus that generates an electrical signal and outputs the electrical signal to the controller.