JP2016129213A - Electronic device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device which enables improvement of the assembly workability and assembly accuracy of heating components, and to provide a manufacturing method of the electronic device.SOLUTION: An electronic device 100 according to one embodiment of the invention includes: a heating component 12; a heat radiation member 11; and a holding member 18. The heat radiation member 11 has a support surface 110 supporting the heating component 12. The holding member 18 has a positioning part 183 and a fixing part 184. The positioning part 183 positions the heating component 12 to a predetermined position on the support surface 110. The fixing part 184 presses the heating component 12 positioned at the predetermined position to the support surface 110 to fix the heating component 12. The holding member 18 is attached to the heat radiation member 11.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an electronic device including a heat generating component and a method for manufacturing the same.

  In recent years, an electronic control unit (ECU) including a power system board on which a power circuit is mounted and a control system board that generates a control signal is used as a control unit for electric power steering. The ECU drives, for example, a motor for assisting the driver's steering force based on outputs from a steering torque sensor, a vehicle speed sensor, and the like. For example, a heat-generating switching element such as a power MOSFET is used as a component constituting the circuit for driving the motor. For this reason, in the ECU, a heat sink for dissipating heat generated by the heat generating component is provided at the bottom, and a case configured as a side wall of a housing or the like is disposed around the heat sink.

  For example, Patent Document 1 describes a current switching circuit device having a plurality of switching transistors. In this device, each of the plurality of switching transistors is fixed to a heat sink by screws.

  On the other hand, Patent Document 2 describes a heat generating component fixing structure capable of fixing a plurality of heat generating components to a heat sink at once. In this fixing structure, a heat sink is disposed around the printed wiring board, and a plurality of heat-generating components electrically connected to the printed wiring board are arranged in a straight line on the heat sink at regular intervals or at intervals. They are arranged at equal intervals. The fixing structure is configured to collectively press and fix a plurality of heat generating components to the heat sink by a fixing bracket fixed to the heat sink.

JP 2003-309384 A JP 2013-214770 A

  However, in the configuration of Patent Document 1, since it is necessary to individually fix a plurality of heat generating components to the heat sink, there is a problem that the number of assembling steps increases as the number of heat generating components increases.

  Further, in the configuration of Patent Document 2, the positional accuracy of each heat generating component with respect to the heat sink cannot be secured stably before the fixing bracket is fixed to the heat sink. For this reason, there is a possibility that the mounting posture of each heat generating component with respect to the printed wiring board and the shape of the heat radiating member may be limited, or the stable heat radiating action of the heat generating component may not be ensured.

  In view of the circumstances as described above, it is an object of the present invention to provide an electronic device and a method for manufacturing the same that can improve the assembly workability and assembly accuracy of a heat-generating component.

In order to achieve the above object, an electronic apparatus according to an embodiment of the present invention includes a heat generating component, a heat radiating member, and a holding member.
The heat radiating member has a support surface that supports the heat generating component.
The holding member has a positioning part and a fixing part. The positioning portion positions the heat generating component at a predetermined position on the support surface. The fixing portion presses and fixes the heat generating component positioned at the predetermined position to the support surface. The holding member is attached to the heat dissipation member.

In the electronic device, the heat generating component is fixed on the support surface of the heat dissipation member by the holding member. The holding member is typically attached to a positioning portion of a holding member that is attached in advance to the heat dissipation member. The heat generating component mounted on the positioning portion is pressed and fixed on the support surface by the fixing portion of the holding member.
According to the electronic device, it is possible to suppress a decrease in assembly workability due to an increase in the number of heat generating components. Moreover, since the assembly accuracy of the heat generating component with respect to the heat radiating member can be improved, a stable heat radiating action of the heat generating component can be ensured.

  The heat radiating member further includes a plate-shaped pedestal portion and a slope portion that is inclined with respect to the pedestal portion and forms the support surface, and the positioning portion accommodates the heat-generating component and the slope portion. You may have the accommodating part positioned in. As a result, even when the support surface is formed of a slope portion, it is possible to improve the assembly workability and the assembly accuracy of the heat generating component.

  The holding member may further include a restricting portion. The restricting part restricts lifting of the heat generating component pressed by the fixing part from the support surface. As a result, it is possible to improve the positioning accuracy of the heat generating component.

  The holding member may further include a main body portion. The body portion supports the positioning portion and the fixing portion, and is attached to the heat dissipation member. In this case, the fixing portion includes at least one arm portion configured to be elastically deformable with respect to the main body portion. This facilitates the assembly of the heat generating component to the heat radiating member, and improves workability.

  The holding member is typically composed of an injection molded body of a synthetic resin material. Thereby, the holding member which has a positioning part and a fixing | fixed part can be produced easily. In addition, it is possible to easily form an elastically deformable fixing portion using the elasticity of the synthetic resin material.

  The heat generating component is not limited to a single component, and may include a plurality of heat generating components respectively disposed at a plurality of predetermined positions on the support surface. Similarly, the positioning unit may include a plurality of positioning units that respectively position the plurality of heat generating components at the plurality of predetermined positions. Thereby, a plurality of heat generating components can be collectively held by one holding member.

  The electronic device may further include a wiring board that is electrically connected to the heat generating component. Since the heat generating component is arranged with high positioning accuracy on the support surface of the heat radiating member by the holding member, the electrical connection work between the heat generating component and the wiring board can be easily performed.

On the other hand, the manufacturing method of the electronic device which concerns on one form of this invention includes installing the holding member which has a positioning part and a fixing | fixed part in the support surface of a heat radiating member.
The heating part is positioned at a predetermined position on the support surface by the positioning portion.
The heat generating component is pressed and fixed to the support surface by the fixing portion.

  According to the method for manufacturing an electronic device, it is possible to suppress a decrease in assembly workability associated with an increase in the number of heat generating components. Moreover, since the assembly accuracy of the heat generating component with respect to the heat radiating member can be improved, a stable heat radiating action of the heat generating component can be ensured.

  The heat generating component may be fixed to the support surface by the fixing portion at the same time as being positioned at the predetermined position by the positioning portion. Thereby, the assembly workability | operativity of the heat-emitting component with respect to a heat radiating member can be improved.

  Typically, after the heat generating component is fixed to the support surface, the heat generating component is electrically connected to the wiring board. Since the heat generating component is arranged with high positioning accuracy on the support surface of the heat radiating member by the holding member, the electrical connection work between the heat generating component and the wiring board can be easily performed.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device which can aim at the improvement of the assembly workability | operativity and assembly accuracy of a heat-emitting component, and its manufacturing method can be provided.

It is a perspective view which shows the electronic device which concerns on one Embodiment of this invention. It is a disassembled perspective view of the said electronic device. It is an expanded sectional view of the important section of the heat dissipation member in the above-mentioned electronic device. It is a whole perspective view of the holding member in the above-mentioned electronic device. It is a front view of the principal part of the said holding member. It is principal part sectional drawing explaining the mounting process of the heat-emitting component to the said heat radiating member. It is a principal part perspective view explaining the mounting process of the heat-emitting component to the said heat radiating member. It is principal part sectional drawing explaining the modification of a structure of the said heat radiating member.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing an electronic apparatus according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view thereof. In each figure, the X axis, the Y axis, and the Z axis indicate three axes orthogonal to each other, the X axis and Y axis directions indicate in-plane directions, and the Z axis direction indicates the thickness direction (vertical direction).

  The electronic device 100 according to the present embodiment is used as an electronic control unit (ECU) for electric power steering, for example. The electric power steering system is a mechanism that assists the steering of the vehicle driver by controlling a motor for assisting the steering force of the driver based on the steering torque of the steering wheel and the vehicle speed. The electronic device 100 controls the driving of the motor based on output from a torque sensor, a vehicle speed sensor, or the like (not shown). Hereinafter, the configuration of the electronic device 100 will be described.

[Configuration of electronic equipment]
As shown in FIG. 1, the electronic device 100 is formed in a substantially rectangular parallelepiped shape as a whole. The electronic device 100 includes a heat dissipating member 11, a plurality of heat generating components 12 disposed on the heat dissipating member 11, a holding member 18 that fixes the plurality of heat generating components 12 to the heat dissipating member 11, a plurality of heat generating components 12, and And a case 10 for housing the first and second wiring boards 13 and 14.

(Heat dissipation member)
The heat radiating member 11 constitutes the bottom of the electronic device 100 and functions as a heat sink that radiates heat from the heat generating component 12 to the outside. The heat radiating member 11 is typically made of a metal material having excellent thermal conductivity such as aluminum. The heat radiating member 11 includes a plate-like pedestal portion 111 having a substantially rectangular planar shape, and a structure portion 112 provided on one main surface (upper surface in FIG. 2) constituting the inner surface of the pedestal portion 111. The structure portion 112 has a substantially trapezoidal cross-sectional shape, and is provided at the bottom of a recess 113 formed in a substantially central portion of the upper surface of the pedestal portion 111.

  FIG. 3 is an enlarged cross-sectional view of a main part of the heat dissipation member 11. The structure portion 112 includes a top portion 112t facing the pedestal portion 111, and a pair of slope portions 112s provided between the pedestal portion 111 and the top portion 112t. The top portion 112 s projects upward from the upper surface of the pedestal portion 111, and is formed by a rectangular plane parallel to the pedestal portion 111. The pair of slope portions 112s is formed of a plane having a predetermined inclination angle connected to each of the long sides of the top portion 112s (only one slope portion 112s is shown in FIG. 3). Each inclined surface portion 112s is formed to be inclined with respect to the pedestal portion 111, and constitutes a support surface 110 that supports the plurality of heat generating components 12 in the heat radiating member 11. In addition, the base part 111 and the structure part 112 are not necessarily limited to the case where they are configured by an integral member. For example, the heat radiating member 11 may be configured by combining a member constituting the pedestal portion 111 and a member constituting the structural portion 112 with each other.

(Heat generation parts)
Each heat generating component 12 is configured by a semiconductor switching element such as a power MOSFET (Metal-Oxide Semiconductor Field-Effect Transistor). Each heat generating component 12 includes a resin-molded rectangular parallelepiped element body 121 and a plurality of terminal portions 122 protruding from one end of the element body 121. A plurality of each heat generating component 12 is mounted on each inclined surface portion 112 s with the terminal portion 122 facing the top portion 112 t of the structure portion 112.

  In the present embodiment, each heat generating component 12 is supported by the support surface 110 of the heat dissipation member 11 via the heat dissipation sheet 19. The heat radiating sheet 19 is made of an electrically insulating material having excellent heat conductivity, and is typically bonded to the support surface 110 via an adhesive layer. The heat dissipating sheet 19 is configured by a single sheet common to the individual heat generating components 12 in each inclined surface portion 112s, but is not limited thereto, and may be configured by a plurality of sheets corresponding to the individual heat generating components 12. Good.

(Holding member)
The holding member 18 is attached to the upper surface of the heat radiating member 11 and fixes the plurality of heat generating components 12 to the support surface 110 of the heat radiating member 11.

  FIG. 4 is an overall perspective view of the holding member 18. FIG. 5 is a front view of the main part of the holding member 18.

  The holding member 18 has a three-dimensional structure bent into a shape capable of covering the top 112t and the slope 112s of the structure 112 of the heat dissipation member 11. The holding member 18 includes a main body portion 181, a top surface portion 182, a positioning portion 183 formed between the main body portion 181 and the top surface portion 182, and a fixing portion 184.

  The main body portion 181 supports the positioning portion 183 and the fixing portion 184 and is fixed to the upper surface of the pedestal portion 111 of the heat dissipation member 11. The main body 181 is formed at both ends of the holding member 18 in the X-axis direction. Each main body portion 181 is configured by a plate portion having a longitudinal direction in the Y-axis direction, and a plurality of screw holes 181a into which the screw member S1 (see FIG. 3) is inserted are provided at predetermined positions thereof. The screw member S <b> 1 is screwed into a screw hole (not shown) formed on the upper surface of the pedestal part 111, whereby each main body part 181 is fixed to the pedestal part 111.

  The top surface portion 182 is configured by a plate portion extending in parallel to the Y-axis direction so as to face the top portion 112t of the heat radiating member 11. The top surface portion 182 is typically configured to come into contact with the top portion 112t when the main body portion 181 is fixed to the pedestal portion 111. However, the top surface portion 182 is not limited to this, and a predetermined gap is provided between the top surface portion 182 and the top portion 112. May be formed.

  The positioning portion 183 is formed between each main body portion 181 and the top surface portion 182. The positioning portion 183 includes a plurality of shaft portions 183a arranged in a grid so as to face the support surface 110 (slope portion 112s) of the heat radiating member 11, and a connecting portion 183b that connects these shaft portions 183a at their lower end portions. including. Each shaft portion 183a is linearly formed in a direction orthogonal to the Y-axis direction, and the connecting portion 183b is linearly formed in parallel to the Y-axis direction.

  A plurality of accommodating portions 185 capable of accommodating the heat generating components 12 one by one are formed between the shaft portions 183a. The positioning unit 183 positions each heat generating component 12 such that each heat generating component 12 housed in the housing portion 185 is disposed at a predetermined position on the support surface 110. In this embodiment, each accommodating part 185 is comprised so that each heat-emitting component can each be positioned in the slope part 112s.

  Each accommodating portion 185 is configured by a substantially rectangular opening that can accommodate the heat generating component 12. Each accommodating portion 185 is partitioned by two shaft portions 183a and a connecting portion 183b, and is formed to have a size capable of accommodating each heat generating component 12 with a predetermined positioning accuracy.

  The fixing part 184 presses and fixes the heat generating component 12 positioned by the positioning part 183 to the support surface 110. One fixing portion 184 is provided between two adjacent shaft portions 183a. In the present embodiment, the fixing portion 184 includes an arm portion configured to be elastically deformable with respect to the main body portion 181.

  The fixing portion 184 is configured by a plate portion extending from the main body portion 181 toward the top surface portion 182. The fixing portion 184 faces the support surface 110 via the housing portion 185, one end portion (base portion) of the fixing portion 184 is fixed to the main body portion 181, and the other end portion (tip portion) is positioned at the approximate center of the housing portion 185. doing. A protrusion 184a that protrudes toward the inside of the accommodating portion 185 is formed at the distal end of the fixed portion 184, and the protrusion 184a is formed on the element main body 121 of the heat generating component 12 accommodated in the accommodating portion 185 as shown in FIG. Configured to make elastic contact.

  The holding member 18 further includes a restricting portion 186 that restricts lifting of the heat-generating component 12 pressed by the fixing portion 184 from the support surface 110. The restricting portion 186 is formed on the upper surface of the lattice-shaped shaft portion 183a, and is composed of a plurality of plate portions that shield a part of the opening that constitutes the accommodating portion 185.

  The restricting portion 186 is typically provided at a predetermined position between the main body portion 181 and the top surface portion 182. In the present embodiment, the restricting portion 186 is at a position facing the tip end portion 184a of the fixed portion 184 in the Y-axis direction. Provided.

  The holding member 18 is composed of an injection molded body of a synthetic resin material. The synthetic resin material is not particularly limited, and typically, an electrically insulating resin material having heat resistance such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate) is used. Thereby, the holding member 18 which has the positioning part 183, the fixing | fixed part 184, etc. can be produced easily. In addition, the elastically deformable fixing portion 184 can be easily formed using the elasticity of the synthetic resin material. Furthermore, the holding member 18 capable of simultaneously holding the plurality of heat generating components 12 can be easily manufactured.

(Case)
The case 10 is configured as a housing of the electronic device 100 and includes, for example, a case main body 15 and a lid portion 16. The case 10 is assembled to the heat radiating member 11 via a seal ring (not shown), for example. The fixing structure between the case 10 and the heat radiating member 11 is not particularly limited, and typically, a plurality of fasteners such as screws and bolts inserted into the four corners of the case 10 (the case main body 15 and the lid portion 16) are used. The case 10 and the heat dissipation member 11 are coupled to each other.

  The case main body 15 is formed in a rectangular frame shape, and is fixed to the periphery of the pedestal 111 of the heat radiating member 11 to constitute a side surface (circumferential surface) of the electronic device 100. The case body 15 incorporates a first wiring board 13, a second wiring board 14, or a bus bar (not shown) connected to both of them. Further, the case main body 15 is formed with a plurality of connectors 151 connected to external devices such as motors and sensors, and the cables connected to the connectors 151 are connected to the first wiring board 13 via the bus bar. The second wiring substrate 14 or both of them are electrically connected.

  The case main body 15 is formed of an injection-molded body of an electrically insulating resin material having heat resistance such as PPS and PBT. The bus bar is built in the case body 15 by insert molding.

  The first wiring board 13 is typically composed of a metal substrate or a ceramic substrate having excellent heat resistance. As shown in FIG. 3, the first wiring substrate 13 is disposed immediately above the heat radiating member 11 and is electrically connected to the plurality of heat generating components 12 held by the heat radiating member 11 by the holding member 18. The terminal portion 122 of each heat generating component 12 extends upward toward the first wiring board 13 and is inserted and mounted in a terminal hole provided in the first wiring board 13.

  The second wiring substrate 14 is typically composed of an organic substrate composed of glass epoxy resin or the like. An integrated circuit such as an IC chip and its peripheral components are mounted on the second wiring board 14, and the second wiring board 14 is configured as a control board that controls the entire electronic device 100.

  The first and second wiring boards 13 and 14 are accommodated in the case body 15. Typically, the first and second wiring boards 13 and 14 are spaced apart so as to face each other in the Z-axis direction. The support structure of the first and second wiring boards 13 and 14 is not particularly limited. For example, the peripheral parts of the wiring boards 13 and 14 are locked to the inner peripheral part of the case main body 15.

  The lid portion 16 is disposed on the case main body 15 via a seal ring (not shown). The lid portion 16 constitutes the upper surface of the electronic device 100 and is formed in a rectangular shape having substantially the same size as the heat dissipation member 11 and the case main body 15 in plan view. The constituent material of the lid portion 16 is not particularly limited, and is made of, for example, the same material as that of the case main body 15, that is, an electrically insulating resin material having heat resistance such as PPS and PBT.

[Manufacturing method of electronic equipment]
Next, a method for manufacturing the electronic device 100 configured as described above will be described.

  First, the holding member 18 is installed in the structure portion 112 of the heat dissipation member 11. When the holding member 18 is installed on the structure portion 112, after the positioning portion 183 is disposed on the support surface 110 (the slope portion 112s), each main body portion 181 is placed on the upper surface of the heat radiating member 11 via the plurality of screw members S1. Fixed. The heat dissipation sheet 19 is affixed to the support surface 110 before the holding member 18 is attached.

  Subsequently, the heat generating components 12 are mounted on the support surfaces 110 partitioned into a plurality of accommodating portions 185 by the positioning portions 183, respectively. FIG. 6 is a cross-sectional view of a main part for explaining a mounting process of the heat generating component 12 to the housing part 185, and FIG.

  As shown in FIG. 6 and FIG. 7, each heat generating component 12 is inserted into a storage portion 185 that opens to the top surface portion 182 side, with the end portion 123 opposite to the end portion from which the terminal portion 122 protrudes at the top. The At this time, the side surface of each shaft portion 183 a of the positioning portion 183 functions as a guide surface that guides insertion of the heat generating component 12 by contacting both side surfaces of the element body 121. The heat-generating component 12 inserted into the storage portion 185 elastically deforms the fixing portion 184 with respect to the main body portion 181 in the clockwise direction in FIG. 6 while abutting against the tip end portion (projection 184a) of the fixing portion 184. Then, the heat generating component 12 is pushed into the storage portion 185 until the end portion 123 of the heat generating component 12 contacts the connecting portion 183b.

  When the end portion 123 of the heat generating component 12 comes into contact with the connecting portion 183b, the mounting operation of the heat generating component 12 to the storage portion 185 is completed. In this state, the protrusion 184 a of the fixing portion 184 presses the element body 121 of the heat generating component 12 toward the support surface 110 (heat dissipating sheet 19) by the elastic restoring force of the fixing portion 184. Therefore, in the present embodiment, the heat generating component 12 is positioned at a predetermined position on the support surface 110 by the positioning portion 183 and is fixed to the support surface 110 by the fixing portion 184 at the same time.

  The elastic restoring force of the fixing portion 184 is not particularly limited, and is set to a size that can press the heat generating component 12 toward the support surface 110 with a predetermined holding force. In the present embodiment, the protrusion 184a moves relative to the element main body 121 until the heat generating component 12 reaches a predetermined position (position where the end 123 contacts the connecting portion 183b) after riding on the upper surface of the element main body 121. . Therefore, the elastic restoring force of the fixing portion 184 is preferably set to an appropriate size that can move the heat generating component 12 to the predetermined position from the viewpoint of workability.

  Here, as shown in FIG. 7, an engagement recess 121 a in which the protrusion 184 a of the fixing portion 184 can be engaged may be provided on the upper surface of the element body 121. The engagement recess 121a is typically provided at a position where the heat generating component 12 can be engaged with the protrusion 184a when the heat generation component 12 reaches the predetermined position. Thereby, a fixed retaining action can be obtained for the heat-generating component 12 mounted at a predetermined position.

  Further, the heat generating component 12 is prevented from being lifted from the support surface 110 or the storage portion 185 by the restriction portion 186. That is, when the protrusion 184 a of the fixing portion 184 rides on the element main body 121 of the heat generating component 12, the element main body 121 is a force that rises from the storage portion 185 by a moment with the protrusion 184 a as a fulcrum by the elastic return force of the fixing portion 184. Works. Since the restricting portion 186 is provided so as to shield a part of the storage portion 185, the above-described rise of the element body 121 is suppressed, and thereby the stable insertion posture of the heat generating component 12 is maintained. In addition, even after the heat generating component 12 reaches a predetermined position, the restricting portion 186 can prevent the heat generating component 12 from floating and dropping from the storage portion 185, so that the positioning accuracy of the heat generating component 12 can be improved. become.

  After the heat generating component 12 is mounted, the first wiring board 13 is disposed at a position immediately above the heat radiating member 11 and then electrically connected to each heat generating component 12. The first wiring board 13 may be disposed before the case main body 15 is assembled to the heat radiating member 11, or may be disposed after the case main body 15 is assembled to the heat radiating member 11. Alternatively, the first wiring board 13 may be assembled to the heat radiating member 11 in a state of being integrated with the case main body 15.

  The electrical connection between the first wiring board 13 and the heat generating component 12 typically employs soldering (insertion mounting). In this case, since the heat generating component 12 is accurately positioned and arranged at a predetermined position, the relative position between each terminal portion 122 and the first wiring board 13 can be easily set or adjusted.

  Thereafter, the second wiring board 14 is electrically connected to the case main body 15 or the first wiring board 13, and the lid portion 16 is fixed to the case main body 15. The electronic device 100 is assembled as described above.

  According to this embodiment, it is possible to fix the heat generating component 12 at a predetermined position on the support surface 110 with high accuracy only by incorporating the heat generating component 12 into the accommodating portion 185 of the holding member 18 installed in advance on the heat radiating member 11. it can. Therefore, since the plurality of heat generating components 12 can be fixed to the heat radiating member 11 without screwing them individually, it is possible to suppress a decrease in assembly workability due to an increase in the number of heat generating components 12. Moreover, since the positioning part 183 is provided in each accommodating part 185, the assembly precision of the heat-emitting component 12 with respect to the heat radiating member 11 can be improved. Furthermore, since the heat generating component 12 can be pressed and held by utilizing the elastic deformation of the fixing portion 184, the heat generating component 12 can be easily fixed and a stable heat radiation action can be ensured.

  Further, according to the present embodiment, since the heat generating component 12 is positioned at a predetermined position by the positioning portion 183 and is fixed to the support surface 110 by the fixing portion 184, heat generation to the heat radiating member 11 is achieved. The assembly workability of the part 12 can be improved.

  Further, in the present embodiment, the support surface 110 that supports the heat generating component 12 is provided on the slope portion 112 s of the structure portion 112, and each housing portion 185 of the holding member 18 opens to the top portion 112 t side of the structure portion 112. Yes. For this reason, it becomes easy to insert the heat generating component 12 into the accommodating portion 185, and workability can be improved. Further, since the relative distance between the heat generating component 12 and the first wiring board 13 can be reduced, the length of the terminal portion 122 can be shortened.

  As mentioned above, although embodiment of this invention was described, this invention is not limited only to the above-mentioned embodiment, Of course, a various change can be added.

  For example, in the above embodiment, the support surface 110 of the heat radiating member 11 that supports the heat generating component 12 is configured by the slope portion 112s, but is not limited thereto, and may be configured by a flat surface.

  Further, in the above embodiment, one fixing part 184 is provided in each storage part 185, but a plurality of fixing parts 184 may be provided in each storage part 185. Moreover, the fixing | fixed part 184 may be comprised with a different member from the main-body part 184 grade | etc., For example, may be comprised with metal leaf | plate springs. Furthermore, the fixing portion may be configured by a mechanical component that can press the heat generating component toward the support surface for the first time when the heat generating component is disposed at a predetermined position.

  Furthermore, although the above embodiment demonstrated the example in which the same kind of several heat-emitting component 12 was pressed and hold | maintained with the one holding member 18, a heat-generating component may be single and several heat-generation different in a kind and a shape. The component may be configured to be held by one holding member.

  Furthermore, the structure part 112 of the heat radiating member 11 is not limited to the case where the cross-sectional shape is a trapezoidal structure. For example, as shown in FIG. 8, the structure part 212 may be configured by a structure having a triangular cross section having a top part 112t. In this case, the slope portion 212 s of the structure portion 212 is configured as a support surface 110 for supporting the heat generating component 12.

  In the embodiment described above, the electronic power steering ECU has been described as an example of the electronic device 100. However, the electronic device 100 is not limited to this, and the present invention is not limited to an automobile engine control system, brake control system, suspension control system, and the like. An on-vehicle ECU or the like may be used.

DESCRIPTION OF SYMBOLS 10 ... Case 11 ... Heat-radiating member 12 ... Heat-emitting component 13 ... 1st wiring board 14 ... 2nd wiring board 15 ... Case main body 16 ... Cover part 18 ... Holding member 100 ... Electronic equipment 111 ... Base part 110 ... Support surface 181 ... Main body 183 ... Positioning part 184 ... Fixing part 185 ... Accommodating part 186 ... Regulating part

Claims (5)

Heat-generating parts,
A heat dissipating member having a support surface for supporting the heat generating component;
A positioning portion for positioning the heat generating component at a predetermined position on the support surface; and a fixing portion for pressing and fixing the heat generating component positioned at the predetermined position against the support surface, and is attached to the heat radiating member. An electronic device comprising a holding member. The electronic device according to claim 1,
The heat dissipating member further includes a plate-shaped pedestal portion and a slope portion that is formed to be inclined with respect to the pedestal portion and constitutes the support surface,
The electronic device having an accommodating portion that accommodates the heat-generating component and positions the inclined portion on the inclined portion. The electronic device according to claim 2,
The electronic device further includes a restricting portion that restricts the heating component pressed from the support surface from being pressed by the fixing portion. The electronic device according to any one of claims 1 to 3,
The holding member further includes a main body portion that supports the positioning portion and the fixing portion and is attached to the heat dissipation member,
The said fixing | fixed part is an electronic device containing at least 1 arm part comprised so that elastic deformation with respect to the said main-body part was possible. A holding member having a positioning part and a fixing part is installed on the support surface of the heat dissipation member,
The heating part is positioned at a predetermined position on the support surface by the positioning part,
The method for manufacturing an electronic device, wherein the heat generating component is pressed and fixed to the support surface by the fixing portion.

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