JP2016115834A - Electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance current detection accuracy, without compromising heat dissipation of components.SOLUTION: An electronic circuit device including a shunt resistor (22) also includes a dielectric substrate (21), first wiring patterns (26, 27) provided on the surface of the substrate (21), and a first shunt resistor (22a) provided on the surface of the substrate (21), and connected electrically with the first wiring patterns (26, 27). Furthermore, the electronic circuit device included second wiring patterns (36, 37) provided on the back of the substrate (21), a second shunt resistor (22b) provided on the back of the substrate (21), and connected electrically with the second wiring patterns (36, 37), and vias (24) penetrating the substrate (21) on the inflow side and outflow side of current, and electrically connecting the first wiring patterns (26, 27) and second wiring patterns (36, 37).SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic circuit device provided with a shunt resistor for detecting a current of a circuit.

  As shown in FIG. 11, the conductive pattern (116, 117) on which the shunt resistor (112) for detecting the current of the circuit is mounted passes the current in a direction perpendicular to the electrodes (112a, 112b). A pattern according to the width of the electrodes (112a, 112b) is recommended. However, since the width of the conductive pattern (116, 117) in this case is relatively small, the heat dissipation by the conductive pattern (116, 117) is low, and the temperature of the circuit component becomes high.

  Furthermore, as shown in FIG. 12, the width of the conductive pattern (116, 117) is larger than the length of the electrode (112a, 112b) due to restrictions such as the layout of circuit components. Furthermore, the planar shape of the conductive pattern (116, 117) may be asymmetrical, and the current inlet (116a) and the current outlet (117a) are arranged obliquely across the shunt resistor (112). It is often different from the recommended pattern shown in FIG. In such a case, since the current spreads in the conductive pattern (116, 117), it passes from not only the direction perpendicular to the electrodes (112a, 112b) but also from an oblique direction. As a result, a potential difference is generated in a direction parallel to the electrodes (112a, 112b), and there is a problem that an error occurs in the voltage value detected at the central portion of the electrodes (112a, 112b).

  Conventionally, as shown in FIG. 13, slits (117a, 117b) are provided in the peripheral region of the shunt resistor (112) in the conductive pattern (116, 117), and the current path is provided to the electrode (112a, A method is adopted in which the current detection accuracy is improved by controlling in the direction perpendicular to 112b). However, in such a method, since the spread of heat in the conductive pattern (116, 117) is suppressed, the heat dissipation of the shunt resistor (112) is reduced, resulting in an increase in the temperature of the component. Challenges arise.

  In response to the problem of a decrease in heat dissipation, Patent Document 1 below describes a configuration in which a heat sink (15) is attached to a shunt resistor (13) for cooling.

  In Patent Document 2 below, the mounting pattern of the shunt resistor (12) is separated from the current generation side pattern (16) and the current inflow side pattern (17), and a conductor such as a bus bar (20, 21) is used. A configuration is described in which heat dissipation and current detection accuracy are improved by connecting the two.

Japanese Patent Laying-Open No. 2009-010082 (see FIGS. 3 and 4) Japanese Patent Laying-Open No. 2014-056951 (see FIGS. 2 and 3)

  However, in Patent Document 1, although the conductive pattern is provided in an ideal shape (recommended pattern) from the viewpoint of current detection accuracy and can be performed by a heat sink from the viewpoint of heat dissipation, the heat sink is not connected to the shunt resistor. It is not easy to attach to.

  Also in Cited Document 2, it is necessary to add a new connecting member such as a bus bar, and the addition of materials, the addition of manufacturing steps, and the like occur, resulting in an increase in manufacturing cost.

  The present invention has been made in view of the above points, and an object thereof is to improve current detection accuracy without impairing heat dissipation of components.

  A first invention is directed to an electronic circuit device (20) having a shunt resistor (22), and includes a substrate (21) made of a dielectric, and a first wiring pattern (on the surface of the substrate (21)) ( 26, 27), a first shunt resistor (22a) provided on the surface of the substrate (21) and electrically connected to the first wiring pattern (26, 27), and a back surface of the substrate (21). The second wiring pattern (36, 37) provided and the second shunt resistor (22b) provided on the back surface of the substrate (21) and electrically connected to the second wiring pattern (36, 37). And a via that penetrates the substrate (21) on the current inflow side and the current outflow side to electrically connect the first wiring pattern (26, 27) and the second wiring pattern (36, 37). (24).

  In the first invention, a first wiring pattern and a second wiring pattern are provided on the front surface and the back surface of the substrate made of a dielectric, respectively, and a first shunt resistor connected to the first wiring pattern, A second shunt resistor connected to the wiring pattern is provided. Further, since the first wiring pattern and the second wiring pattern are electrically connected by vias penetrating the substrate on the current inflow side and the current outflow side, the first wiring pattern and the second wiring pattern are connected to each other. The wiring pattern has the same potential. Thus, since the shunt resistor is divided and provided on the front surface and the back surface of the substrate, the first shunt resistor and the second shunt resistor each have a smaller wattage than the case where there is one shunt resistor. That is, the outer shape of each can be reduced. Therefore, even if the planar shape of each wiring pattern is made larger than the length of the electrical connection part (electrode), the amount of current passing in an oblique direction with respect to the connection direction of the electrical connection part can be reduced. Furthermore, since the width of each wiring pattern can be made larger than the shunt resistance, and it is not necessary to provide a slit in each wiring pattern, heat dissipation is improved.

  The second invention is characterized in that the via (24) is arranged in a region where the first shunt resistor (22a) and the second shunt resistor (22b) in the substrate (21) overlap in a plan view. To do.

  In the second invention, since each via is arranged in a region where the shunt resistors on the substrate overlap each other in plan view, when the potential difference between the shunt resistors is detected in the two wiring patterns, the via is generated only by the shunt resistor. The voltage to be detected can be detected.

  The third invention is characterized in that the first shunt resistor (22a) and the second shunt resistor (22b) are provided so that at least a part of each other overlaps in a plan view.

  In the third invention, since the two shunt resistors are provided so that at least a part of each other overlaps in a plan view, if the voltage generated by both the shunt resistors is detected from both wiring patterns in the overlapping portion, A voltage generated only by the shunt resistor can be detected.

  According to the present invention, it is possible to reduce the outer shape of the two shunt resistors provided on the front and back surfaces of the substrate, respectively, and further, the first wiring pattern and the second wiring pattern provided on the front and back surfaces of the substrate are Since the same potential is provided by the via, it can be handled in the same manner as an electronic circuit device having a shunt resistor provided only on one side of the substrate. As a result, even if the width of the planar shape of each wiring pattern on the front and back surfaces is made larger than the length of each shunt resistor, the current passing through in an oblique direction with respect to the connection direction of the electrical connection portion of each shunt resistor is reduced. As a result, the current detection accuracy can be improved. In addition, the width of the planar shape of each wiring pattern can be made larger than the length of each shunt resistor, and no slits or the like that inhibit the spread of heat dissipation are provided in the wiring pattern, so the heat dissipation from each shunt resistor is also good. .

  According to the second aspect of the invention, when detecting a potential difference at the shunt resistor in the two wiring patterns, it is possible to detect a voltage generated only by the shunt resistor, thereby improving the current detection accuracy. be able to.

  According to the third aspect of the invention, if the voltage is detected at the overlapping portion of the two shunt resistors in plan view, the voltage generated by only the shunt resistor can be detected, so that the current detection accuracy is improved. can do.

FIG. 1 is a circuit diagram showing a power conversion device including an electronic circuit device according to Embodiment 1 of the present invention. FIG. 2 is a schematic plan view showing the electronic circuit device according to Embodiment 1 of the present invention. FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. FIG. 4A is a perspective view showing a recommended pattern having a normal shunt resistance. FIG. 4B is a perspective view showing a comparative pattern in which a wiring pattern is provided on each of the front surface side and the back surface side, and a normal shunt resistor is disposed only on the front surface side. FIG. 4C is a perspective view showing the electronic circuit device according to Embodiment 1 of the present invention. 5A and 5B show a recommended pattern, a comparison pattern, and a simulation result in the electronic circuit device according to the present embodiment, and FIG. 5A is a table of each current detection value. (B) is a measurement figure showing the temperature of a shunt resistance in the electronic circuit device concerning a comparison pattern and this embodiment. FIG. 6 is a partially enlarged view of the main part of FIG. FIG. 7A is a schematic partial enlarged cross-sectional view showing a main part of an electronic circuit device according to a first modification of Embodiment 1 of the present invention. FIG. 7B is a partially transparent perspective view showing the main part of the electronic circuit device according to the first modification. FIG. 8 is a schematic partial enlarged cross-sectional view showing a main part of an electronic circuit device according to a second modification of Embodiment 1 of the present invention. FIG. 9 is a schematic partial enlarged cross-sectional view showing the main part of an electronic circuit device according to a third modification of Embodiment 1 of the present invention. FIG. 10 is a schematic plan view showing an electronic circuit device according to Embodiment 2 of the present invention. FIG. 11 is a schematic plan view showing a conventional recommended pattern and its current flow. FIG. 12 is a schematic plan view showing the comparison pattern and the current flow. FIG. 13 is a schematic plan view showing a wiring pattern processed by inserting a slit in a region in the vicinity of a shunt resistor according to a conventional example and a current flow thereof.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Embodiment 1 of the Invention
-Configuration of power converter-
A first embodiment of the present invention will be described.

  FIG. 1 shows an example of a circuit of a power conversion device (1) provided with the electronic circuit device according to the first embodiment.

  The power converter (1) according to the present embodiment includes a converter unit (2) that converts an AC voltage from an AC power source (not shown) into a DC voltage, and a DC voltage converted by the converter unit (2) that is converted into a three-phase AC. The inverter part (3) which converts into a voltage, and the capacitor | condenser (C) for DC smoothing arrange | positioned between this inverter part (3) and converter part (2) are provided. The inverter unit (3) includes six switching elements (for example, IGBTs (insulated gate bipolar transistors) or MOSFETs (metal-oxide-semiconductor field effect transistors)) in which diodes (D) are connected in antiparallel. 5) is configured with a three-phase bridge connection. The inverter unit (3) is connected to, for example, a three-phase motor (4) that drives a compressor of the air conditioner, and supplies power from the power converter (1) to the air conditioner. As the three-phase motor (4), for example, an IPM (embedded magnet type) synchronous motor can be used.

  In the power converter (1), an electronic circuit device (20) including a shunt resistor (22) is arranged at the connection portion with the capacitor (C) in order to detect the current of the three-phase motor (4). . When the current from the three-phase motor (4) flows into the capacitor (C) through the shunt resistor (22), the current flowing through the shunt resistor (22) is detected by the current detection circuit (7). The current detected by the current detection circuit (7) is sent to the controller (8), and the controller (8) uses the six motors of the inverter unit (3) based on the motor current detected by the current detection circuit (7). The PWM (pulse width modulation) control signal output to the switching element (5) is adjusted to control the voltage supplied to the three-phase motor (4) to a three-phase AC voltage.

-Configuration of electronic circuit device-
Next, the electronic circuit device (20) including the shunt resistor (22) will be described with reference to FIGS. FIG. 2 shows a planar configuration, and FIG. 3 shows a cross-sectional configuration taken along line III-III in FIG. As shown in FIGS. 2 and 3, the electronic circuit device (20) according to this embodiment includes a substrate (21) made of a dielectric and a first conductor made of a conductor provided on the surface of the substrate (21). The front inflow side wiring pattern (26) and the front outflow side wiring pattern (27) as wiring patterns, and the back inflow side wiring pattern (36 as a second wiring pattern made of a conductor provided on the back surface of the substrate (21). ) And a backside outflow side wiring pattern (37). The surface inflow side wiring pattern (26) and the surface outflow side wiring pattern (27) are arranged on the surface of the substrate (21) at a predetermined interval. Also, the back inflow side wiring pattern (36) and the back outflow side wiring pattern (37) are arranged on the back surface of the substrate (21) at a predetermined interval with the surface inflow side wiring pattern (26) and the surface outflow side. The wiring patterns (27) are arranged so as to face each other. Furthermore, the front inflow side wiring pattern (26) and the back side inflow side wiring pattern (36), and the front outflow side wiring pattern (27) and the back surface outflow side wiring pattern (37) are respectively connected to the substrate (21). They are electrically connected to each other by a plurality of penetrating vias (24). Here, the planar shapes of the surface inflow side wiring pattern (26) and the surface outflow side wiring pattern (27) may not be the same as shown in FIG. Also good. The same applies to the back-surface inflow side wiring pattern (36) and the back-surface outflow side wiring pattern (37).

  On the substrate (21), the surface side shunt resistor (electrical connection part) which is fixed by the electrode (23) so as to straddle the surface inflow side wiring pattern (26) and the surface outflow side wiring pattern (27) ( 22a) is provided. Similarly, a back side shunt resistor (22b) fixed by an electrode (23) as an electrical connection is provided so as to straddle the back side inflow side wiring pattern (36) and the back side outflow side wiring pattern (37). ing. Here, as an example, the front surface side shunt resistor (22a) and the rear surface side shunt resistor (22b) are arranged at positions that overlap in plan view. As an example, the planar dimensions of the front surface shunt resistor (22a) and the rear surface shunt resistor (22b) are the same. Note that the planar dimensions of the front surface shunt resistor (22a) and the rear surface shunt resistor (22b) are not necessarily the same.

  As shown in FIG. 2, the current inflow portion into which the output current from the three-phase motor (4) shown in FIG. 1 flows is located at a position away from the surface side shunt resistor (22a) in the surface inflow side wiring pattern (26). (26a) is provided. On the other hand, a current outflow portion (27a) through which current flows out to the capacitor (C) shown in FIG. 1 is provided at a position away from the surface side shunt resistor (22a) in the surface outflow side wiring pattern (27). Although not shown, the current inflow portion (26a) penetrates the substrate (21) and is electrically connected to the back surface inflow side wiring pattern (36) and also in the current outflow portion (27a). The substrate (21) penetrates and is electrically connected to the back surface outflow side wiring pattern (37).

  As described above, the shunt resistor (22) constituting the electronic circuit device (20) according to the present embodiment has a reduced length (length in the direction in which the electrodes (23) are parallel to each other) and surface inflow. The surface side shunt resistor (22a) is overlapped with the area where the side wiring pattern (26) and the front surface outflow side wiring pattern (27) overlap with the back surface inflow side wiring pattern (36) and the back surface outflow side wiring pattern (37). And the rear shunt resistor (22b) and are electrically mounted in parallel. Here, since each shunt resistor (22a, 22b) is divided into two parts, the respective shunt resistors can be set to a predetermined (specified) wattage as a shunt resistor by making each length smaller than the conventional one. It becomes possible.

  Thus, by using the shunt resistor (22a, 22b) whose longitudinal direction is shorter than usual, the potential difference of the current component flowing in the longitudinal direction of the electrode (23) is reduced, so the detection accuracy of the detected current is improved. To do. In FIG. 2, the voltage detector (7a) is connected to each electrode (23), and the voltage detector (7a) is included in the current detection circuit (7) shown in FIG. The current value is obtained from the detected voltage value and the known resistance value of the shunt resistor (22a, 22b). Further, in the present embodiment, the portions located in the center of the electrode (23) in the surface inflow side wiring pattern (26) and the surface outflow side wiring pattern (27) are on the side facing the electrode (23), respectively. The current detection pattern (26b, 27b) protruding in the line is provided. The current detection pattern (26b, 27b) serves as a connection portion with the voltage detector (7a).

-Effect of Embodiment 1-
The effects of the electronic circuit device according to the present embodiment will be described with reference to FIGS. 4 (a) to 4 (c), 5 (a), and 5 (b). FIG. 4A is a perspective view of a recommended pattern having a normal (long-sided) shunt resistor (22A). FIG. 4B is a perspective view showing a comparative pattern having a normal shunt resistance (22A). The front inflow side wiring pattern (26), the front outflow side wiring pattern (27), and the back inflow side wiring pattern ( 36) and a back surface outflow side wiring pattern (37) are provided, and the shunt resistor (22A) is provided only on the front surface side. FIG. 4C is a perspective view showing the electronic circuit device according to this embodiment shown in FIGS. 2 and 3.

  5A and 5B show the recommended pattern, the comparison pattern, and the simulation result in the electronic circuit device according to the present embodiment, and FIG. 5A shows the respective current detection values. (B) represents the temperature of the shunt resistance in the comparative pattern and the electronic circuit device according to the present embodiment.

  As can be seen from FIG. 5A, the comparison pattern having the same size as the recommended pattern and the shunt resistor (22A) provided only on the surface has an error of about 1.148 in the current detection value from the recommended pattern. %. On the other hand, in the electronic circuit device having the shunt resistor (22a, 22b) according to the present embodiment, the error from the recommended pattern in the current detection value is about 0.675%.

  5B, the temperature of the shunt resistor (22) in the electronic circuit device according to this embodiment is 42.54 ° C., which is 42.59 which is the temperature of the shunt resistor (22A) of the comparative pattern. Not much different from ℃.

  As described above, the electronic circuit device (20) having the shunt resistor (22a, 22b) according to the present embodiment has a shunt resistor or the like as compared with the case where current detection is performed using the conventional shunt resistor (22A). The current detection accuracy can be improved without increasing the temperature of the components.

  Further, the electronic circuit device (20) according to the present embodiment needs to be modified such as slitting the pattern shape around the shunt resistor (22a, 22b) in each wiring pattern (26, 27, 36, 37). There is no. For this reason, the heat dissipation of components is not impaired. Therefore, the electronic circuit device (20) having the shunt resistors (22a, 22b) according to the present embodiment can improve the current detection accuracy without impairing the heat dissipation of the components.

<Modification>
Below, various formation positions of current detection patterns (26b, 27b), which are protrusions constituting the electrical connection between each wiring pattern (26, 27, 36, 37) and voltage detector (7a) A modification will be described.

  As shown in FIG. 6 which is an enlarged cross-sectional view of the main part of FIG. 3, the current detection pattern (26b, 27b) is similar to the comparison pattern in that the top surface inflow side wiring pattern (26) and the surface outflow side wiring It is provided so as to protrude from the pattern (27) to the opposing electrode (23) side. Here, the value of the voltage detected by the voltage detector (7a) is the voltage generated in part A in the front side wiring pattern (26, 27) shown in FIG. 6 and the back side wiring pattern (36, 37). It is determined by the voltage generated in part B. The voltage generated at part A is approximately the voltage value generated at the front side shunt resistor (22a), but the voltage generated at part B is the back side in addition to the voltage value generated at the back side shunt resistor (22b). Since the voltage values generated in the inflow side wiring pattern (36), the back surface outflow side wiring pattern (37), and the via (24) are added, it may be a factor of an error in the detection voltage.

-First modification-
FIGS. 7A and 7B are current detection patterns according to the first modification of the first embodiment. FIG. 7A shows a cross-sectional configuration of the main part, and FIG. The perspective perspective view of a part is represented. As shown in FIGS. 7A and 7B, the current detection pattern according to the first modification is the current detection provided in the surface inflow side wiring pattern (26) and the surface outflow side wiring pattern (27). In addition to the pattern (26b, 27b), the current detection pattern (36b) provided on the back surface inflow side wiring pattern (36) and the back surface outflow side wiring pattern (37) to face the current detection pattern (26b, 27b), respectively. 37b). Further, at least one via (24) located inside the electrode (23) electrically connects the current detection pattern (26b, 27b) and the current detection pattern (36b, 37b) facing each other. Is provided.

  With this configuration, as shown in FIG. 7A, the voltage value generated at part A in the front-side wiring pattern (26, 27) is substantially the same as the voltage value generated at the front-side shunt resistor (22a). The voltage value generated in part B consisting of the side wiring pattern (36, 37) and the via (24) located inside the electrode (23) is substantially the voltage value generated in the back side shunt resistor (22b). . This is because almost no current flows through the vias (24) arranged inside each electrode (23), and therefore almost no voltage is generated. As described above, the error of the detection voltage in the electronic circuit device (20) can be extremely reduced.

-Second modification-
FIG. 8 shows a cross-sectional configuration of the main part of the current detection pattern according to the second modification. As shown in FIG. 8, in the second modification, the current detection pattern (36b) of the back surface inflow side wiring pattern (36) and the current detection pattern (27b) of the front surface outflow side wiring pattern (27) are voltage detected. Connected to the vessel (7a).

  Even in this case, the voltage value generated in the part A composed of the wiring patterns (26, 27) on the surface side and the vias (24) located inside the electrodes (23) is substantially equal to the shunt resistance (22a) on the surface side. The voltage value generated in part B consisting of the wiring pattern (36, 37) on the back surface side and the via (24) located inside the electrode (23) is substantially the shunt resistance (22b ) Is generated. Therefore, the same effect as that of the first modification can be obtained.

-Third modification-
FIG. 9 shows a cross-sectional configuration of a main part of a current detection pattern according to the third modification. As shown in FIG. 9, in the third modification, a multilayer wiring board (21A) having at least one wiring layer (25) formed inside the board is used as the board.

  As shown in FIG. 9, the current detection patterns (25a, 25b) according to the third modification are provided at the ends facing each other inside the electrode (23) in the wiring layer (25). The current detection patterns (25a, 25b) are electrically connected to the via (24) located inside the electrode (23).

  Even in this case, the voltage value generated in the part A composed of the wiring patterns (26, 27) on the surface side and the vias (24) located inside the electrodes (23) is substantially equal to the shunt resistance (22a) on the surface side. The voltage value generated in part B consisting of the wiring pattern (36, 37) on the back surface side and the via (24) located inside the electrode (23) is substantially the shunt resistance (22b ) Is generated. Therefore, the same effect as that of the first modification can be obtained.

<< Embodiment 2 of the Invention >>
A second embodiment of the present invention will be described.

  FIG. 10 shows a schematic plan configuration of the electronic circuit device (20) including the shunt resistor (22). As shown in FIG. 10, the front side shunt resistor (22a) and the rear side shunt resistor (22b) constituting the electronic circuit device (20) according to the present embodiment are arranged so as to be shifted in the longitudinal direction of the electrode (23). However, they are arranged so that parts of each other overlap each other in plan view.

-Effect of Embodiment 2-
Vias (24) for electrically connecting the wiring patterns (26, 27) on the front surface side and the wiring patterns (not shown) on the back surface side are the same as in the first embodiment, such as the wiring patterns (26, 27). You may provide only in a main body. In this case, the same effect as in the first embodiment can be obtained.

  Further, as in the first to third modifications of the first embodiment, at least two vias (24) are directly connected to the current detection patterns (26b, 27b) protruding inside the electrodes (23) facing each other. With this configuration, the same effects as those of the first to third modifications can be obtained.

-Modification of Embodiment 2-
As a modification of the present embodiment, the surface side shunt resistance (22a) and the back surface side shunt resistance (22b) may have different plane dimensions as long as a prescribed wattage is secured.

  In addition, the above embodiment and modification are essentially preferable illustrations, Comprising: It does not intend restrict | limiting the range of this invention, its application thing, or its use.

  INDUSTRIAL APPLICABILITY The present invention is useful for an electronic circuit device that includes a shunt resistor for current detection and improves current detection accuracy without impairing heat dissipation of components.

1 Power converter
7 Current detection circuit
7a Voltage detector
20 Electronic circuit equipment
21 Board
21A multilayer wiring board
22 Shunt resistor
22a Surface side shunt resistance (first shunt resistance)
22b Back side shunt resistor (second shunt resistor)
23 Electrodes (electrical connections)
24 Via
25 Wiring layer
25a Current detection pattern
25b Current detection pattern
26 Surface inflow side wiring pattern (first wiring pattern)
26a Current inlet
26b Current detection pattern
27 Surface outflow side wiring pattern (first wiring pattern)
27a Current source
27b Current detection pattern
36 Back side inflow wiring pattern (second wiring pattern)
36b Current detection pattern
37 Backside outflow side wiring pattern (second wiring pattern)
37b Current detection pattern

Claims (3)

An electronic circuit device having a shunt resistor,
A dielectric substrate (21);
A first wiring pattern (26, 27) provided on the surface of the substrate (21);
A first shunt resistor (22a) provided on the surface of the substrate (21) and electrically connected to the first wiring pattern (26, 27);
A second wiring pattern (36, 37) provided on the back surface of the substrate (21);
A second shunt resistor (22b) provided on the back surface of the substrate (21) and electrically connected to the second wiring pattern (36, 37);
The first wiring pattern (26, 27) and the second wiring pattern (36, 37) are electrically connected through the substrate (21) on the current inflow side and the current outflow side. An electronic circuit device comprising a via (24). In claim 1,
The via (24) is arranged in a region where the first shunt resistor (22a) and the second shunt resistor (22b) in the substrate (21) overlap in a plan view. Circuit device. In claim 1 or 2,
The electronic circuit device, wherein the first shunt resistor (22a) and the second shunt resistor (22b) are provided so that at least a part of each other overlaps in a plan view.