JP2016114377A - Data creation device and data creation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To create point data that enables increase in inspection accuracy.SOLUTION: A data creation device comprises a processing unit that defines a probing point causing a probe 11 to be probed upon inspecting with respect to an inspected portion of a circuit substrate 30, and creates point data. The processing unit is configured to: identify a pad matching a definition condition of pads in a first wiring pattern to be directly connected to the inspected portion as a first matching point; when it is determined that a probing condition of probing with respect to the first matching point being possible without interfering with a magnetic sensor 21 is matched, define the first matching point as a probing point; when it is determined that the probing condition is not matched, determine whether a second matching point as a pad matching the probing condition is present in other pads in the first wiring pattern; and when it is determined that the second matching point is present therein, define the second matching point as the probing point.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a data generation apparatus and a data generation method for defining a probing point for probing a probe when inspecting an electrical component of a circuit board and generating point data indicating the probing point.

  As this type of data generation apparatus, a data generation apparatus disclosed by the applicant in Patent Document 1 below is known. This data generation device shows electronic component data including information that can specify the position of the tip of each connection terminal in the electronic component, the position of the electronic component on the circuit board when the electronic component is mounted on the circuit board, and the like. Electronic components are mounted based on mounter data including information and wiring pattern data (CAD data and Gerber data) including information that can specify the position and width (shape) of the wiring pattern and land on the circuit board. When inspecting an existing circuit board, a probing position (inspection position) with which the inspection probe is brought into contact (probing) is specified and position data is generated. Specifically, in this data generation device, the position of the tip of the connection terminal in the electronic component in the mounted state is specified based on the electronic component data and the mounter data, and the position of the land is specified based on the wiring pattern data. Then, when it is determined that a land exists at the position of the tip of the connection terminal, the position of the land is specified as the probing position.

JP 2010-107265 A (page 5-6, FIG. 1)

  However, the above data generation apparatus has the following problems to be improved. That is, in this data generation device, the position of the land existing at the tip of the connection terminal in the electronic component is specified as the probing position. On the other hand, for example, when performing an inspection on an electronic component mounted on a circuit board (for example, an inspection of whether or not a connection state between a connection terminal of an electronic component and a wiring pattern is good), an inspection signal is obtained by probing the probe at a probing position. In a state where a sensor (for example, a magnetic sensor) is positioned above the electronic component and the electronic component is inspected based on a physical quantity (for example, a magnetic field) detected by the sensor, that is, a probe In addition, an inspection apparatus using a sensor (for example, a circuit board inspection apparatus disclosed by the applicant in Japanese Patent Laid-Open No. 2006-343103) is known. However, since the above data generation apparatus does not generate position data in consideration of using this type of sensor, the inspection apparatus using this type of sensor uses the position data generated by the above data generation apparatus. When attempting to probe the probe at the indicated probing position, the probe and the sensor may come into contact. In this case, in this type of inspection apparatus, generally, a range in which the probe and the sensor are in contact with each other is defined in advance, and when the probing position is defined within the range, the probe is probed to the probing position. The inspection step to be performed is skipped (jumped). For this reason, when performing an inspection using position data generated by a conventional data generation device, there is a possibility that an inspection step is omitted and an uninspected part is generated, which makes it difficult to improve inspection accuracy. Improvement of the point is desired.

  The present invention has been made in view of such a problem, and a main object of the present invention is to provide a data generation apparatus and a data generation method capable of generating point data capable of improving inspection accuracy.

  In order to achieve the above object, the data generation apparatus according to claim 1, wherein a wiring pattern is formed and a probing point for probing the probe at the time of inspection of a part to be inspected on a circuit board on which an electrical component is mounted is provided in the wiring pattern. A data generation device including a processing unit that executes a prescribing process defined from the point candidates provided in the point to generate point data indicating the probing point, wherein the processing unit includes: The point candidate that conforms to the prescribed conditions defined in advance among the point candidates provided in the first wiring pattern as the wiring pattern that is directly connected to the site to be inspected is specified as the first conforming point, Without interfering with components of the circuit board and components of the apparatus used for the inspection When a first determination process is performed to determine whether or not the probing condition that the probe can be probed with respect to the first matching point is met, and it is determined that the probe condition is met in the first determination process The first matching point is defined as the probing point, and when it is determined in the first determination process that the probing condition is not met, among the other point candidates in the first wiring pattern excluding the first matching point. When a second determination process is performed to determine whether or not there is a second matching point as a point candidate that matches the probing condition, and it is determined in the second determination process that the second matching point exists, Define the second matching point as the probing point .

  According to a second aspect of the present invention, in the data generation device according to the first aspect, when the processing unit determines in the second determination process that there are a plurality of the second matching points, the electrical component is provided. The second matching point at which the moving time of the probe from the other probing point that is probed immediately before the inspection is shortest is defined as the probing point.

  Further, the data generation device according to claim 3 is the data generation device according to claim 1 or 2, wherein the processing unit makes the detected amount close to the inspection site when the inspection site is inspected. When both the first sensor as the component to be detected and the probe are located on one side of the circuit board, the first determination process and the second determination process are executed, 2 In the determination process, when it is determined that the second matching point does not exist, the probe is positioned on the one surface side, and the first sensor is separated from the inspection site and detects the detection amount. When the second sensor as the component is located on the other surface side of the circuit board, it is determined whether or not the second matching point exists on the one surface side. Run the third determination process, when it is determined that the second adaptation points in the third determination process are present, which defines the second adaptation point as the probing point.

  According to a fourth aspect of the present invention, there is provided a data generation method in which a wiring pattern is formed and a probing point for probing a probe at the time of inspection of a part to be inspected on a circuit board on which an electrical component is mounted is provided in the wiring pattern. A data generation method for generating point data indicating a probing point by executing a defining process defined from among point candidates, and in the defining process, as the wiring pattern directly connected to the site to be inspected Among the point candidates provided in the first wiring pattern, a point candidate that conforms to a predetermined regulation condition is identified as a first conforming point, and the components of the circuit board and the configuration of the apparatus used for the inspection The probe relative to the first adaptation point without interfering with an element. A first determination process is performed to determine whether or not a probing condition that roving is possible is satisfied, and when it is determined that the probing condition is satisfied in the first determination process, the first matching point is determined as the probing. If the point is defined as a point and it is determined that the probing condition is not met in the first determination process, the point candidate that matches the probing condition among the other point candidates in the first wiring pattern excluding the first conforming point The second determination process for determining whether or not the second matching point exists is executed, and when it is determined that the second matching point exists in the second determination process, the second matching point is determined as the probing point. It prescribes as

  In the data generation device according to claim 1 and the data generation method according to claim 4, the second determination process is executed when it is determined that the probing condition is not met in the first determination process, and the other process is performed in the second determination process. When it is determined that there is a second matching point that matches the probing condition among the point candidates, the second matching point is defined as the probing point. For this reason, according to this data generation device and data generation method, a point including only information of probing points that can probe the probe without interfering with the circuit board or the components of the device used for the inspection (matching the probing conditions) Data can be generated. Therefore, according to the data generation device and the data generation method, the inspection step is omitted due to the fact that the probing point information that is difficult to probe is included in the point data (an uninspected region to be inspected is generated). It is possible to generate point data that can sufficiently improve the inspection accuracy while suppressing this sufficiently small.

  According to the data generating device of the second aspect, in the second determination process, when it is determined that there are a plurality of second matching points, probes from other probing points that are probed immediately before the inspection of the inspected site are performed. By defining the second matching point with the shortest moving time as the probing point, it is possible to generate point data that can sufficiently shorten the moving time of the probe and sufficiently improve the inspection efficiency. .

  In the data generation device according to claim 3, there is no second matching point in the second determination process executed when both the first sensor and the probe are located on one surface side of the circuit board. If the first sensor is separated from the electrical component and the second sensor is located on the other surface side of the circuit board, the probe is located on one surface side. A third determination process for determining whether or not a second matching point exists is executed, and when it is determined in the third determination process that a second matching point exists, the second matching point is defined as a probing point. For this reason, according to this data generation device, even when it is determined that there is no second matching point in a state where the first magnetic sensor is close to the inspected site, the first magnetic sensor is removed from the inspected site. In a state of being separated, a point candidate that becomes the second matching point can be defined as a probing point. Therefore, according to this data generation device, since there is no probing point that matches the probing conditions, the inspection step is omitted (the occurrence of an uninspected part to be inspected) is minimized, and the inspection accuracy is further improved. The point data that can be generated can be generated. Further, there are generally more point candidates for probing the probe on one surface side than on the other surface side of the circuit board. For this reason, according to the data generation device that determines whether or not the second matching point exists on one surface side of the circuit board in the third determination process, for example, the second matching point exists in the second determination process. In the third determination process, compared to a configuration in which a process for determining whether or not a point candidate that can be the second matching point exists on the other surface side when it is determined not to be performed is substituted for the third determination process. The second matching point can be found with a high probability.

It is a block diagram which shows the structure of the data generation apparatuses 1 and 1A. 2 is a configuration diagram showing a configuration of a circuit board 30. FIG. It is the sectional view on the AA line in FIG. It is the 1st explanatory view for explaining a data generation method. 5 is a flowchart of data generation processing 50. It is the 2nd explanatory view for explaining a data generation method. It is the 1st explanatory view for explaining other examples of a data generation method. It is the 2nd explanatory view for explaining other examples of a data generation method.

  Hereinafter, an embodiment of a data generation device and a data generation device will be described with reference to the drawings.

  First, the configuration of the data generation device 1 shown in FIG. 1 as an example of the data generation device will be described. For example, the data generation apparatus 1 performs an inspection on a portion to be inspected (for example, a connection portion between wiring patterns 32a to 32h described later and connection terminals 41a to 41h of the integrated circuit 33) on the circuit board 30 illustrated in FIGS. The point data Dp indicating the probing point Pp (see FIG. 4) for probing the probe 11 (see FIGS. 2 and 3) by a probing mechanism (not shown) can be generated. 2 and 3 and FIGS. 4 and 6 to be described later, only a part of the circuit board 30 is illustrated.

  In this case, as an example, as shown in FIGS. 2 and 3, the circuit board 30 includes a board 31 and wiring patterns 32 a to 32 h (hereinafter, also referred to as “wiring pattern 32” when not distinguished) formed on the board 31. , And an integrated circuit 33 as an example of an electrical component mounted (mounted) on the substrate 31. The substrate 31 includes a resist layer (not shown) formed so as to cover the wiring pattern 32. The resist layer is provided with an opening for enabling the probe 11 to contact (electrically connect) to the wiring pattern 32. In this case, the part exposed by the opening in the wiring pattern 32 (part serving as the bottom of the opening) corresponds to a point candidate. Hereinafter, these parts are referred to as “pads Pta to Ptm (“ pad Pt ”when not distinguished). (Refer to FIG. 2). Further, as an example, the integrated circuit 33 has a BGA (Ball) in which a plurality of connection terminals 41a to 41h (hereinafter also referred to as “connection terminals 41” when not distinguished) are arranged on the back surface (the back surface in the drawing). Grid array) type integrated circuit, and each connection terminal 41 is mounted on the substrate 31 in a state of being connected to each wiring pattern 32.

  Further, in the inspection apparatus that performs the inspection on the inspected portion using the point data Dp, as shown in FIG. 3, an electrical signal for inspection is supplied through the probe 11 probed to the probing point Pp. In this state, the magnetic sensor 21 as an example of the sensor is brought close to the integrated circuit 33 (inspected part) to detect a magnetic field, and the inspected part is inspected based on the detection result of the magnetic field. In this case, in this inspection apparatus, both the probe 11 and the magnetic sensor 21 are located on one surface (the upper surface in the figure) side of the circuit board 30.

  On the other hand, the data generation device 1 includes an operation unit 2, a display unit 3, a storage unit 4, and a processing unit 5, as shown in FIG. The operation unit 2 includes an input device such as a keyboard, and outputs an operation signal to the processing unit 5 according to an operation. The display unit 3 displays various images according to the control of the processing unit 5.

  The storage unit 4 includes, for example, a magnetic storage medium, a RAM, and the like, and stores a processing program Pr that causes the processing unit 5 to execute the data generation process 50 (FIG. 5). The storage unit 4 stores design data Dd for the circuit board 30. The design data Dd is data used in the data generation processing 50, and is data that can specify the shape of the wiring pattern 32 on the circuit board 30 and the position of the wiring pattern 32 on the substrate 31, and is formed in the resist layer. It includes data that can specify the shape of the opening and the position on the substrate 31. In this case, the design data Dd is described in a Gerber format as an example. Further, the storage unit 4 stores mount data Dm for the circuit board 30. The mount data Dm can specify the size and mounting position of the electrical component mounted on the circuit board 30, the wiring pattern 32 to which the connection terminal of the electrical component is connected, and the connection position of the wiring pattern 32 with the connection terminal. Consists of data. The storage unit 4 stores the point data Dp generated in the data generation process 50.

  The processing unit 5 controls each unit constituting the data generation device 1 according to the operation signal output from the operation unit 2. Further, the processing unit 5 executes the data generation processing 50 shown in FIG. 5 to define the above probing points Pp from the pads Pt (point candidates) provided in the wiring pattern 32 (regulation processing). To generate point data Dp indicating the probing point Pp.

  Next, as an example, the data generator 1 is used to inspect the probe 11 at the time of inspection of the inspected portion of the circuit board 30 shown in FIG. 2 (connection portion between the wiring pattern 32 and the connection terminal 41 of the integrated circuit 33). The data generation method for generating the point data Dp by specifying the probing point Pp to be probed, and the operation of the data generation device 1 at that time will be described with reference to the drawings. In this case, it is assumed that the above-described processing program Pr, design data Dd and mount data Dm for the circuit board 30 are already stored in the storage unit 4.

  First, the operation unit 2 is operated to instruct execution of processing. In response to this, the processing unit 5 reads the processing program Pr from the storage unit 4. Next, the processing unit 5 executes a data generation process 50 shown in FIG. 5 according to the processing program Pr. In the data generation process 50, the processing unit 5 reads the design data Dd and the mount data Dm from the storage unit 4 (step 51).

  Subsequently, the processing unit 5 specifies the shape of the wiring pattern 32 and the position of the wiring pattern 32 on the substrate 31 based on the design data Dd, and the shape and opening of the opening formed in the resist layer. The position on the substrate 31, that is, the position of the pad Pt (point candidate) provided on the wiring pattern 32 is specified (step 52).

  Next, the processing unit 5 identifies the wiring pattern 32 to which each connection terminal 41 of the integrated circuit 33 is connected and the connection position with each connection terminal 41 in the wiring pattern 32 based on the mount data Dm (step 53). .

  Subsequently, the processing unit 5 selects, for example, the connection terminal 41a (see FIG. 2) as one of the connection terminals 41, and executes the defining process for the connection terminal 41a. In this regulation process, the processing unit 5 is in the pad Pt provided in the wiring pattern 32a to be directly connected to the connection terminal 41a (the first wiring pattern directly connected to the part to be inspected: see the same figure). The pad Pta (first conforming point: see the same figure) that conforms to the condition that the distance along the wiring pattern 32a from the connection position between the wiring pattern 32a and the connection terminal 41a is the shortest (predetermined defining condition). ) Is specified (step 54).

  Next, the processing unit 5 executes a first determination process. In the first determination process, the processing unit 5 includes an integrated circuit 33 (an example of a component of the circuit board 30) mounted on the circuit board 30 and a magnetic sensor 21 (an example of a component of an apparatus used for inspection). It is determined whether or not the probe 11 satisfies the probing condition that the probe 11 can be probed with respect to the pad Pta (first matching point) without interference (step 55).

  Here, as shown by a broken line in FIG. 2, when the probe 11 is to be probed on the pad Pta, the interference between the magnetic sensor 21 and the arm portion 12 that holds the probe 11 or the support portion 13 that supports the arm portion 12. Probing becomes difficult. That is, the pad Pta does not meet the probing conditions. At this time, the processing unit 5 determines in step 55 that the probing condition is not met, and then executes a second determination process. In the second determination process, the processing unit 5 performs the second matching with the probing condition in the other pads Pt (point candidates) in the wiring pattern 32a (first wiring pattern) excluding the pad Pta (first matching point). It is determined whether a matching point exists (step 56).

  In this case, since the probe 11 can be probed with respect to the pad Ptb without interfering with the integrated circuit 33 and the magnetic sensor 21 as indicated by a broken line in FIG. 4, the processing unit 5 meets the probing condition in step 56. It is determined that the pad Ptb exists as the second matching point, and then the pad Ptb is defined as the probing point Pp (step 57).

  Next, the processing unit 5 determines whether or not the defining process has been executed for all the connection terminals 41 of the integrated circuit 33 (step 58). In this case, since the defining process has not been completed for all the connection terminals 41, the processing unit 5 selects the connection terminal 41 b as the next connection terminal 41 and executes the above-described step 54.

  In this case, in step 54, the processing unit 5 specifies the pad Ptc shown in FIG. 6 as the first matching point for the connection terminal 41b. Subsequently, the processing unit 5 executes step 55 described above to determine whether or not the probing condition is met. In this case, as indicated by a broken line in FIG. 4, when the probe 11 is to be probed on the pad Ptc, probing becomes difficult due to interference between the arm part 12 and the support part 13 and the magnetic sensor 21, so that the processing part 5 Determines in step 55 that the probing condition is not met, and then executes step 56 (second determination process).

  In this case, as indicated by a broken line in FIG. 6, the pads Ptd and Pte provided on the wiring pattern 32b to be directly connected to the connection terminal 41b do not interfere with the integrated circuit 33 and the magnetic sensor 21. Since probing of the probe 11 is possible, the processing unit 5 determines in step 56 that two pads Ptd and Pte exist as second matching points that match the probing conditions, and then executes step 57. A probing point Pp is defined.

  Here, when the processing unit 5 determines that there are a plurality of second matching points as described above, the movement time of the probe 11 from another probing point Pp that is probed immediately before the examination of the inspected site. Is defined as the probing point Pp. Specifically, for example, when the probing point Pp to be probed immediately before is the pad Ptb (see FIG. 6), the shortest moving distance to the pad Ptb as the second matching point at which the moving time of the probe 11 is the shortest. The pad Ptd having the shortest (straight line distance) is defined as the probing point Pp.

  Next, the processing unit 5 executes Step 58 to determine whether or not the defining process has been performed for all the connection terminals 41 of the integrated circuit 33. In this case, since the regulation process has not been completed for all the connection terminals 41, the processing unit 5 selects the connection terminal 41 that has not performed the regulation process and performs the above-described steps 54 to 58 (regulation process). Run. In this case, the processing unit 5 defines the pad Ptg (see FIG. 6) as the probing point Pp by executing the defining process for the connection terminal 41c (see FIG. 6), and executes the defining process for the connection terminal 41d. As a result, the pad Pti (see the figure) is defined as the probing point Pp.

  Further, in the defining process for the connection terminal 41e (see FIG. 6), the processing unit 5 determines that the pad Ptj (see the same figure) as the first matching point is suitable for the probing condition (step 55). At this time, the processing unit 5 defines the pad Ptj as the first matching point as the probing point Pp (step 60). Similarly, the processing unit 5 determines that the pads Ptk, Ptl, and Ptm (see the same figure) as the first matching points are probing conditions in each defining process for the connection terminals 41f, 41g, and 41h (see the same figure). (Step 55), the pads Ptk, Ptl, and Ptm are defined as probing points Pp, respectively (step 60).

  Subsequently, when the defining process is completed for all the connection terminals 41, the processing unit 5 determines that in step 58, and then indicates the probing point Pp (information that can specify the probing point Pp such as position information). Point data Dp is generated (step 59). Subsequently, the processing unit 5 stores the point data Dp in the storage unit 4 and ends the data generation processing 50. When the processing unit 5 determines in step 56 (second determination processing) that the second matching point does not exist, information indicating that the probing point Pp for the target connection terminal 41 does not exist is point data. Include in Dp.

  As described above, in the data generation device 1 and the data generation method, the second determination process is executed when it is determined in the first determination process that the probing condition is not satisfied, and the other determination is made in the other pads Pt in the second determination process. When it is determined that there is a second matching point that meets the probing condition, the second matching point is defined as the probing point Pp. Therefore, according to the data generation device 1 and the data generation method, information on only the probing point Pp that can probe the probe 11 without interfering with the circuit board 30 or the components of the inspection device (matching the probing condition) is obtained. Including point data Dp can be generated. Therefore, according to the data generation device 1 and the data generation method, the inspection step is omitted because the point data Dp includes information on the probing point Pp that is difficult to probe (the uninspected region to be inspected is included). The point data Dp that can sufficiently improve the inspection accuracy can be generated.

  Further, according to the data generation device 1 and the data generation method, when it is determined in the second determination process that there are a plurality of second matching points, the travel time from another probing point Pp that is probed immediately before the inspection is determined. By defining the second matching point that is the shortest as the probing point Pp, it is possible to generate point data Dp that can sufficiently shorten the moving time of the probe 11 and sufficiently improve the inspection efficiency.

  Note that the data generation device 1 and the data generation method are not limited to the configuration described above. For example, in the above configuration and method, when it is determined in the second determination process (step 56 of the data generation process 50) that the second matching point does not exist, the probing point Pp for the target connection terminal 41 does not exist. Although the information shown is included in the point data Dp, when it is determined that the second matching point does not exist in the second determination process, the data generation device 1A that executes a third determination process described below (see FIG. 1). ) And data generation methods can also be employed. In the following description, the same components as those in the data generation device 1 and the data generation method described above are denoted by the same reference numerals, and redundant description is omitted.

  The data generation device 1A and the data generation method use two magnetic sensors 21a and 21b (first sensor and second sensor) as sensors to be used in close proximity to the integrated circuit 33 (inspected part) when inspecting the inspected part. The point data Dp used in the inspection apparatus provided with (refer to FIG. 7) is generated. In this case, in the data generation apparatus 1A and the data generation method, as shown in the figure, both the magnetic sensor 21a (first sensor) and the probe 11 are on one surface (upper surface in the figure) side of the circuit board 30. When it is assumed that it is located, the processing unit 5 executes the first determination process and the second determination process described above.

  In this case, as shown in FIG. 7, for example, in the case where only the pad Ptn is provided in the vicinity of the integrated circuit 33 in the wiring pattern 32i to be directly connected to the connection terminal 41i (part to be inspected) of the integrated circuit 33. When the data generation process 50 described above is executed when the magnetic sensor 21a is close to the integrated circuit 33, the processing unit 5 first identifies the pad Ptn as the first matching point in the identification process, and then In the first determination process, it is determined that the probing condition is not met. Subsequently, in the second determination process, it is determined that there is no second matching point. At this time, the processing unit 5 executes a third determination process.

  In the third determination process, as shown in FIG. 8, the processing unit 5 is configured such that the probe 11 is positioned on one surface (upper surface) side of the circuit board 30 and the magnetic sensor 21 a is the integrated circuit 33 (part to be inspected). The magnetic sensor 21b (second sensor) is located on the other surface (lower surface) side of the circuit board 30 (in this example, the magnetic sensor 21b is close to the circuit board 30). Sometimes, it is determined whether or not the second matching point exists on one surface (upper surface) side. In this case, as shown in the figure, in a state where the magnetic sensor 21a is separated from the integrated circuit 33, the pad Ptn conforms to the probing condition. Therefore, the processing unit 5 performs the second conforming point in the third determination process. And the pad Ptn as the second matching point is defined as the probing point Pp.

  According to the data generation device 1A and the data generation method, as described above, when it is determined that the second matching point does not exist in the state where the magnetic sensor 21a is close to the integrated circuit 33 (part to be inspected). In addition, when the magnetic sensor 21a is separated from the integrated circuit 33 (part to be inspected), the pad Pt serving as the second matching point can be defined as the probing point Pp. For this reason, according to the data generation device 1A and the data generation method, there is no probing point Pp that can be probed (compatible with the probing conditions) without interfering with the magnetic sensor 21a (component of the device used for inspection). Thus, it is possible to generate point data Dp that can further improve the inspection accuracy by suppressing the inspection step from being omitted (occurrence of uninspected parts). Further, more pads Pt for probing the probe 11 are generally present on one surface (upper surface) side than on the other surface (lower surface) side of the circuit board 30. Therefore, according to the data generation device 1A and the data generation method for determining whether or not the second matching point exists on one surface side of the circuit board 30 in the third determination process, for example, in the second determination process Compared with a configuration in which the process of determining whether or not the pad Pt that can be the second matching point exists on the other surface side when it is determined that the second matching point does not exist is executed instead of the third determination process. In the third determination process, the second matching point can be found with high probability.

  In the data generation apparatus 1A and the data generation method described above, instead of using the two magnetic sensors, the magnetic sensor 21a as the first sensor and the magnetic sensor 21b as the second sensor, one magnetic sensor 21 is used. A configuration and a method for generating point data Dp used for an inspection apparatus that functions as both the first sensor and the second sensor may be employed. In this configuration and method, the first determination process and the second determination process are performed when both the magnetic sensor 21 and the probe 11 are located on one surface side of the circuit board 30, and the second determination process When it is determined that the second matching point does not exist, when the magnetic sensor 21 is moved from one surface side of the circuit board 30 to the other surface side, the third determination process is executed in that state. Also in this configuration and method, it is possible to realize the effects of the data generation device 1A and the data generation method described above.

  Further, when it is determined in the second determination process that the second matching point does not exist, the magnetic sensor 21 is positioned on one surface side of the circuit board 30 and the probe 11 is positioned on the other surface side of the circuit board 30. It is also possible to adopt a configuration and a method for executing the process of determining whether or not the second matching point exists on the other surface side instead of the above-described third determination process. In this configuration and method, the magnetic sensor 21 is arranged on one side of the circuit board 30 and the probing mechanism for probing the probe 11 is arranged on both the one side and the other side of the circuit board 30. A probing mechanism in which the apparatus and the magnetic sensor 21 are disposed on one surface side of the circuit board 30 and the probe 11 can be moved to both the one surface side and the other surface side of the circuit board 30 for probing. It is possible to generate point data Dp used in the inspection apparatus having the same.

  Further, in the data generation device 1 and the data generation method described above, when it is determined in the second determination process that there are a plurality of second matching points, the movement time of the probe 11 from another probing point Pp to be probed immediately before is determined. The second matching point that is the shortest is specified as the probing point Pp, but the second matching point that is closest to the first matching point (the straight line distance to the first matching point is shortest) is specified as the probing point Pp. Alternatively, it is also possible to adopt a configuration and method in which the second matching point that is farthest from the first matching point is defined as the probing point Pp.

  In addition, the example in which the connection part between the wiring pattern 32 and the connection terminal 41 of the integrated circuit 33 is a part to be inspected is described above, but any part in the wiring pattern 32 (part other than the connection part with the connection terminal 41) or The body part of the electrical component (a part other than the connection terminal) can also be used as a part to be inspected.

  In the above configuration and method, the integrated circuit 33 is exemplified as the “component of the circuit board 30” included in the probing condition. However, the component of the circuit board 30 includes other components than the integrated circuit 33. Also included are electrical components and metal fittings (none of which are shown) used when attaching the circuit board 30 to a housing or the like. In the above configuration and method, the magnetic sensors 21, 21a, and 21b are given as examples of “components of the apparatus used for the inspection” included in the probing conditions. However, there are a plurality of components of the apparatus used for the inspection. The other probe 11 in the apparatus which inspects using this probe 11 and a probing mechanism (none of which is shown) for moving the other probe 11 are included.

DESCRIPTION OF SYMBOLS 1,1A Data production | generation apparatus 5 Processing part 11 Probe 12 Arm part 13 Support part 21,21a, 21b Magnetic sensor 32a-32i Wiring pattern 33 Integrated circuit 41a-41i Connection terminal Dd Design data Dm Mount data Dp Point data Pp Probing point Pta ~ Ptn pad

Claims (4)

When a wiring pattern is formed and a circuit board on which an electrical component is mounted, a probing point for probing a probe when inspecting a part to be inspected is specified from point candidates provided in the wiring pattern. A data generation apparatus including a processing unit that generates point data indicating the probing point,
In the defining process, the processing unit is a point candidate that conforms to a predefined defining condition among the point candidates provided in the first wiring pattern as the wiring pattern that is directly connected to the site to be inspected. Is identified as the first fit point,
A first determination for determining whether or not a probing condition is satisfied that the probe can be probed with respect to the first matching point without interfering with a component of the circuit board and a component of the apparatus used for the inspection. Execute the process,
When it is determined that the probing condition is met in the first determination process, the first matching point is defined as the probing point,
When it is determined in the first determination process that the probing condition is not met, second matching as a point candidate that matches the probing condition among other point candidates in the first wiring pattern excluding the first matching point. Execute a second determination process for determining whether or not a point exists,
A data generation device that defines the second matching point as the probing point when it is determined in the second determination process that the second matching point exists.   When the processing unit determines in the second determination process that there are a plurality of the second matching points, the probe moves from the other probing points that are probed immediately before the inspection of the inspected site. The data generation apparatus according to claim 1, wherein the second matching point having the shortest time is defined as the probing point. The processing unit is configured such that both the first sensor and the probe serving as the constituent elements that detect the detected amount in the vicinity of the inspection site when the inspection of the inspection site is performed are on one side of the circuit board. When the first determination process and the second determination process are performed,
In the second determination process, when it is determined that the second matching point does not exist, the probe is located on the one surface side, the first sensor is separated from the inspection site, and the detected amount is determined. When the second sensor as the component to be detected is located on the other surface side of the circuit board, the third sensor determines whether or not the second matching point exists on the one surface side. Execute the judgment process
3. The data generation device according to claim 1, wherein when it is determined in the third determination process that the second matching point exists, the second matching point is defined as the probing point. When a wiring pattern is formed and a circuit board on which an electrical component is mounted, a probing point for probing a probe when inspecting a part to be inspected is specified from point candidates provided in the wiring pattern. A data generation method for generating point data indicating the probing point,
In the specifying process, a point candidate that matches a predetermined specifying condition among the point candidates provided in the first wiring pattern as the wiring pattern that is directly connected to the inspected site is a first matching point. Identified as
A first determination for determining whether or not a probing condition is satisfied that the probe can be probed with respect to the first matching point without interfering with a component of the circuit board and a component of the apparatus used for the inspection. Execute the process,
When it is determined that the probing condition is met in the first determination process, the first matching point is defined as the probing point,
When it is determined in the first determination process that the probing condition is not met, second matching as a point candidate that matches the probing condition among other point candidates in the first wiring pattern excluding the first matching point. Execute a second determination process for determining whether or not a point exists,
A data generation method that defines the second matching point as the probing point when it is determined in the second determination process that the second matching point exists.

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