JP2016108578A5 - - Google Patents

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Publication number
JP2016108578A5
JP2016108578A5 JP2014244261A JP2014244261A JP2016108578A5 JP 2016108578 A5 JP2016108578 A5 JP 2016108578A5 JP 2014244261 A JP2014244261 A JP 2014244261A JP 2014244261 A JP2014244261 A JP 2014244261A JP 2016108578 A5 JP2016108578 A5 JP 2016108578A5
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JP
Japan
Prior art keywords
mask
vapor deposition
alignment mark
deposition mask
resin
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Application number
JP2014244261A
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English (en)
Japanese (ja)
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JP2016108578A (ja
JP6375906B2 (ja
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Priority to JP2014244261A priority Critical patent/JP6375906B2/ja
Priority claimed from JP2014244261A external-priority patent/JP6375906B2/ja
Publication of JP2016108578A publication Critical patent/JP2016108578A/ja
Publication of JP2016108578A5 publication Critical patent/JP2016108578A5/ja
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Publication of JP6375906B2 publication Critical patent/JP6375906B2/ja
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JP2014244261A 2014-12-02 2014-12-02 蒸着マスク、蒸着マスク準備体、フレーム付き蒸着マスク及び有機半導体素子の製造方法 Active JP6375906B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014244261A JP6375906B2 (ja) 2014-12-02 2014-12-02 蒸着マスク、蒸着マスク準備体、フレーム付き蒸着マスク及び有機半導体素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014244261A JP6375906B2 (ja) 2014-12-02 2014-12-02 蒸着マスク、蒸着マスク準備体、フレーム付き蒸着マスク及び有機半導体素子の製造方法

Publications (3)

Publication Number Publication Date
JP2016108578A JP2016108578A (ja) 2016-06-20
JP2016108578A5 true JP2016108578A5 (zh) 2018-03-15
JP6375906B2 JP6375906B2 (ja) 2018-08-22

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ID=56121998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014244261A Active JP6375906B2 (ja) 2014-12-02 2014-12-02 蒸着マスク、蒸着マスク準備体、フレーム付き蒸着マスク及び有機半導体素子の製造方法

Country Status (1)

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JP (1) JP6375906B2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6891449B2 (ja) * 2016-10-27 2021-06-18 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、及び有機ｅｌディスプレイの製造方法
CN106637074B (zh) * 2017-01-09 2019-02-22 昆山国显光电有限公司 蒸镀掩膜板、oled基板及测量蒸镀像素偏位的方法
CN111485194A (zh) * 2019-01-29 2020-08-04 大日本印刷株式会社 蒸镀掩模、蒸镀掩模装置及其制造方法、中间体、蒸镀方法及有机el显示装置的制造方法
JP7406719B2 (ja) 2019-01-29 2023-12-28 大日本印刷株式会社 蒸着マスク及びその製造方法、蒸着マスク装置及びその製造方法、中間体、蒸着方法、並びに有機ｅｌ表示装置の製造方法
CN111876726B (zh) * 2020-08-04 2022-12-20 京东方科技集团股份有限公司 金属掩膜板和蒸镀方法，显示面板和显示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2889062B2 (ja) * 1991-10-24 1999-05-10 松下電器産業株式会社 Ｘ線マスクおよびその製造方法
JPH05188579A (ja) * 1992-01-08 1993-07-30 Seiko Epson Corp フォトマスク、及び、半導体装置の製造方法
JP3446943B2 (ja) * 1998-09-21 2003-09-16 大日本印刷株式会社 描画用アライメントマークを有する位相シフトマスク
JP2010106358A (ja) * 2008-09-30 2010-05-13 Canon Inc 成膜用マスク及びそれを用いた成膜方法
US9108216B2 (en) * 2012-01-12 2015-08-18 Dai Nippon Printing Co., Ltd. Vapor deposition mask, method for producing vapor deposition mask device and method for producing organic semiconductor element

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