JP2016108578A5 - - Google Patents

Claims (20)

A vapor deposition mask in which a metal mask is laminated on one surface side of a resin mask,
The metal mask is provided with an alignment mark detected by reflected light of alignment light,
When the outer edge of the alignment mark when the vapor deposition mask is viewed in plan is a starting point, the other surface side of the resin mask is reflected from the position overlapping the starting point toward the outer peripheral direction of the resin mask. Layers are provided,
Reflectance of the alignment light on the surface of the reflective layer is higher than the reflectance of the alignment light on the surface of the alignment mark, and the surface of the resin mask,
Deposition mask. The resin mask has an alignment mark opening for exposing only the alignment mark without exposing the surface of the metal mask .
The vapor deposition mask of Claim 1.   The shape of the inner wall surface when the alignment mark opening is viewed in cross-section exhibits a shape that expands from one surface side of the resin mask toward the other surface side of the resin mask.
  The vapor deposition mask of Claim 2.   The reflective layer is provided on the inner wall surface of the alignment mark opening,
  The vapor deposition mask of Claim 3.   The shape of the facing inner wall surface when the alignment mark opening is viewed in cross-section is substantially parallel,
  The vapor deposition mask of Claim 2.   The region of the resin mask that overlaps the reflective layer is thinned from the other surface side of the resin mask toward the one surface side of the resin mask.
  The vapor deposition mask of any one of Claims 1, 2, and 5.   The reflective layer further overlaps with an unthinned region of the resin mask;
  The vapor deposition mask of Claim 6.   There are a plurality of the alignment marks,
  When the vapor deposition mask is viewed in plan, one of the reflective layers is positioned so as to collectively surround the plurality of alignment marks.
  The vapor deposition mask of any one of Claims 1 thru | or 7.   A vapor deposition mask in which a metal mask is laminated on one surface side of a resin mask,
  The metal mask is provided with an alignment mark detected by reflected light of alignment light,
  The resin mask has an alignment mark opening for exposing the alignment mark,
  When the deposition mask is viewed in plan, the size of the opening on one surface side of the resin mask of the alignment mark opening is larger than the size of the alignment mark,
  When the outer edge of the alignment mark opening when the vapor deposition mask is viewed in plan from the resin mask side is a starting point, the other surface side of the resin mask is directed from the starting point toward the outer periphery of the resin mask. A reflective layer is provided,
  The reflectance of the alignment light on the surface of the reflective layer is higher than the reflectance of the alignment light on the surface of the alignment mark and the surface of the resin mask.
  Deposition mask.   Also on the metal mask overlapping the alignment mark opening, the reflective layer has a higher reflectance of the alignment light on the surface than the alignment light on the surface of the alignment mark and the surface of the resin mask. Is provided,
  The vapor deposition mask of Claim 9.   The alignment mark material is a material having a lower reflectance of the alignment light than the reflective layer material.
  The vapor deposition mask of any one of Claims 1 thru | or 10.   The alignment mark is an alignment mark made of a resin material.
  The vapor deposition mask of any one of Claims 1 thru | or 10.   The alignment mark is a colored alignment mark,
  The vapor deposition mask of any one of Claims 1 thru | or 10.   The alignment mark is a through-hole penetrating the metal mask;
  The vapor deposition mask of any one of Claims 1 thru | or 10.   A vapor deposition mask preparation for obtaining the vapor deposition mask according to any one of claims 1 to 14,
  A metal mask is located on one side of the resin plate,
  The metal mask has the alignment mark;
  The reflective layer is provided on the other surface side of the resin plate,
  Deposition mask preparation.   The vapor deposition mask according to claim 1 is fixed to a frame.
  Vapor deposition mask with frame. A method for producing an organic semiconductor element, comprising:
Use the vapor deposition mask according to any one of claims 1 to 14, or the vapor deposition mask with a frame according to claim 16.
A method for producing an organic semiconductor element.   Using the alignment mark, the vapor deposition mask or the vapor deposition mask with a frame is aligned with a vapor deposition target, and the organic semiconductor element is manufactured.
  The manufacturing method of the organic-semiconductor element of Claim 17.   A method of forming a pattern produced by vapor deposition,
  Use the vapor deposition mask according to any one of claims 1 to 14, or the vapor deposition mask with a frame according to claim 16.
  Pattern formation method.   Using the alignment mark, the vapor deposition mask or the vapor deposition mask with the frame is aligned with the vapor deposition object, and the pattern is formed.
  The pattern formation method according to claim 19.