JP2016102724A - Appearance inspection method of flat enameled wire and visual inspection apparatus of flat enameled wire - Google Patents
Appearance inspection method of flat enameled wire and visual inspection apparatus of flat enameled wire Download PDFInfo
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Abstract
Description
本発明は、平角エナメル線の外観検査方法および平角エナメル線の外観検査装置に関する。 The present invention relates to a method for inspecting a flat enameled wire and a device for inspecting a flat enameled wire.
線の外観検査方法として、線を移動しながら表面を撮像し、撮像データから線表面の欠陥を検出する方法が知られている。
このような外観検査方法を適用した例として、光を丸エナメル線表面に対して垂直に照射して線表面を撮像し、撮像データから表面欠陥を検出する、エナメル線の外観検査装置が知られている。（例えば、特許文献１。）
また、エナメル線の長手方向から光を照射して線表面を撮像し、撮像データからエナメルの膨れ欠陥を検出する、エナメル線の欠陥検出方法が知られている。（例えば、特許文献２）
As a method for inspecting the appearance of a line, a method is known in which a surface is imaged while moving a line and a defect on the line surface is detected from the imaged data.
As an example of applying such an appearance inspection method, there is known an enamel wire appearance inspection apparatus that irradiates light perpendicularly to the surface of a round enamel line, images the surface of the line, and detects surface defects from the imaging data. ing. (For example, Patent Document 1)
In addition, a defect detection method for enameled wire is known in which light is irradiated from the longitudinal direction of the enameled wire to image the surface of the wire, and an enamel blistering defect is detected from the imaged data. (For example, Patent Document 2)
近年、巻線の小型化を目的として、巻線のエナメル線に平角エナメル線を用いることがある。平角エナメル線は、面に方向性があり、丸エナメル線と同様に外観検査を行うと、表面欠陥を見落としてしまう可能性がある。
例えば、特許文献１の外観検査装置を用いて平角エナメル線の外観検査を行うと、線の角部を暗く撮像してしまうことがあり、角部に欠陥が無いにもかかわらず、角部に欠陥があると誤検出してしまう可能性がある。また、特許文献１の外観検査装置は、色調変化の小さい欠陥を見落としてしまう可能性があり、緩やかな小さい凸にして色調変化の小さいエナメルの膨れ欠陥を見落としてしまう可能性がある。
また、特許文献２の欠陥検出方法を用いて平角エナメル線の外観検査を行うと、凹凸の小さい欠陥は検出できるものの、エナメル膜内に異物が混入した凹凸のない欠陥や、過加熱によるエナメル膜の焦げ付きなどの色調欠陥を見落としてしまう可能性がある。
In recent years, a rectangular enameled wire is sometimes used as the enameled wire for the purpose of reducing the size of the winding. A flat enameled wire has directionality on the surface, and when a visual inspection is performed in the same manner as a round enameled wire, a surface defect may be overlooked.
For example, when the appearance inspection of the flat enameled wire is performed using the appearance inspection apparatus of Patent Document 1, the corner of the line may be imaged darkly. If there is a defect, it may be erroneously detected. In addition, the appearance inspection apparatus of Patent Document 1 may miss a defect with a small change in color tone, and may overlook a blister defect of enamel with a small color change with a moderately small protrusion.
In addition, when the appearance inspection of a flat enameled wire is performed using the defect detection method of Patent Document 2, a defect with small unevenness can be detected, but a defect without unevenness in which foreign matter is mixed in the enamel film, or an enamel film caused by overheating There is a possibility of overlooking color defects such as scorching.
本発明は、上記従来技術に鑑みてなされたものであり、平角エナメル線の表面欠陥について、凹凸欠陥および色調欠陥を精度良く検出することが可能な、平角エナメル線の外観検査方法および平角エナメル線の外観検査装置を提供することを目的とする。 The present invention has been made in view of the above-described prior art, and is a method for inspecting the appearance of a flat enameled wire and a flat enameled wire that can accurately detect irregularities and color defects of surface defects of the flat enameled wire. An object of the present invention is to provide a visual inspection apparatus.
本発明の平角エナメル線の外観検査方法は、長手方向に移動する平角エナメル線の平面および角面に明視野撮像光を照射し、前記平面および前記角面の明視野像を撮像する工程と、前記平角エナメル線の長手方向に沿って暗視野撮像光を照射し、前記平面および前記角面の暗視野像を撮像する工程と、前記明視野像と前記暗視野像から、前記平面および前記角面における欠陥の有無を判定する工程とを有している。 The method of inspecting the appearance of a flat enameled wire according to the present invention is a step of irradiating a bright field imaging light onto a plane and a square surface of a flat enameled wire moving in the longitudinal direction, and capturing a bright field image of the plane and the square surface, Irradiating dark-field imaging light along the longitudinal direction of the flat enameled line to capture a dark-field image of the plane and the angular plane; from the bright-field image and the dark-field image, the plane and the angle And determining the presence or absence of defects on the surface.
そして、本発明の外観検査方法では、前記暗視野撮像光を、前記長手方向に沿って対向する２方向から照射し、該照射の対向する間隔の中央部で暗視野像を撮像することが好ましい。 In the appearance inspection method of the present invention, it is preferable that the dark field imaging light is irradiated from two opposite directions along the longitudinal direction, and a dark field image is picked up at a central portion of the opposed interval of the irradiation. .
また、本発明の平角エナメル線の外観検査装置は、長手方向に移動する平角エナメル線の平面および角面に明視野撮像光を照射する明視野撮像用照明装置と、前記平面および前記角面の明視野像を撮像する明視野撮像装置と、前記平角エナメル線の長手方向に沿って暗視野撮像光を照射する暗視野撮像用照明装置と、前記平面および前記角面の暗視野像を撮像する暗視野撮像装置と、前記明視野像と前記暗視野像から、前記平面および前記角面における欠陥の有無を判定する判定部とを具備している。 In addition, the flat enameled wire visual inspection device according to the present invention includes a bright field imaging illumination device that irradiates bright field imaging light onto a flat surface and a square surface of a flat enameled wire that moves in the longitudinal direction, and the flat surface and the angular surface. A bright-field imaging device that captures a bright-field image, a dark-field imaging illumination device that irradiates dark-field imaging light along the longitudinal direction of the flat-angle enamel line, and a dark-field image of the flat surface and the angular surface A dark-field imaging device; and a determination unit that determines from the bright-field image and the dark-field image whether there is a defect on the plane and the corner.
そして、本発明の外観検査装置は、前記暗視野撮像用照明装置が、前記暗視野撮像光を、前記長手方向に沿って対向する２方向から照射するものであることが好ましい。 In the appearance inspection apparatus of the present invention, it is preferable that the dark field imaging illumination device irradiates the dark field imaging light from two opposite directions along the longitudinal direction.
本発明は、平角エナメル線の形状に対応する照明を用い、平角エナメル線の表面欠陥の有無を、平面および角面の明視野像と暗視野像から判定しているので、平角エナメル線の表面欠陥を精度良く検出することができる。 Since the present invention uses illumination corresponding to the shape of the flat enameled wire and determines the presence or absence of surface defects in the flat enameled wire from the bright-field image and the dark-field image of the flat and square surfaces, the surface of the flat enameled wire Defects can be detected with high accuracy.
以下、本発明の実施形態である平角エナメル線の外観検査装置について、図面を参照しながら説明する。 Hereinafter, a flat enameled wire appearance inspection apparatus according to an embodiment of the present invention will be described with reference to the drawings.
まず、本発明の検査対象となる平角エナメル線の外観形状の一例を図１に示す。
通常の平角エナメル線は、平角エナメル線１０のように、角の稜辺に面取りを施している。本実施形態の外観検査装置は、図１に示すような平角エナメル線を外観検査する装置であり、以下の説明では、平角エナメル線１０の平らな面を平面１０ａ、面取りを角面１０ｂとしている。
First, an example of the external shape of a flat enameled wire to be inspected according to the present invention is shown in FIG.
A normal flat enameled wire is chamfered at the edge of the corner like the flat enameled wire 10. The appearance inspection apparatus of this embodiment is an apparatus for inspecting the appearance of a flat enameled wire as shown in FIG. 1. In the following description, the flat surface of the flat enameled wire 10 is a flat surface 10a, and the chamfer is a rectangular surface 10b. .
次に、本実施形態の外観検査装置の概略構成の一例を図２に示す。本実施形態の外観検査装置は、平角エナメル線１０表面の明視野像を撮像する明視野撮像ユニット１と、平角エナメル線１０表面の暗視野像を撮像する暗視野撮像ユニット２と、コンピュータ３とを具備している。
そして上記構成に加え、本実施形態の外観検査装置は、平角エナメル線１０を移動させる搬送装置４と、平角エナメル線１０の振動を抑制するガイドローラ５とを具備している。
以下、これら構成要素について詳細に説明する。
Next, an example of a schematic configuration of the appearance inspection apparatus of the present embodiment is shown in FIG. The visual inspection apparatus according to the present embodiment includes a bright field imaging unit 1 that captures a bright field image on the surface of the flat enameled wire 10, a dark field imaging unit 2 that captures a dark field image on the surface of the flat enameled wire 10, and a computer 3. It has.
In addition to the above configuration, the appearance inspection apparatus according to the present embodiment includes a conveying device 4 that moves the flat enameled wire 10 and a guide roller 5 that suppresses vibration of the flat enameled wire 10.
Hereinafter, these components will be described in detail.
（明視野撮像ユニット）
図２に示すように、本実施形態の装置は、明視野撮像ユニット１を、搬送装置４の巻出しローラ４ａと巻取りローラ４ｂとの間に配していて、平角エナメル線１０を巻出しローラ４ａ側から内部に通して、巻取りローラ４ｂ側に排出している。そして、図３に示すように、平角エナメル線１０表面を撮像する４基の明視野撮像装置１ａ、１ｂ、１ｃ、１ｄと、平角エナメル線１０表面に明視野撮像光を照射する、４基の明視野撮像用照明装置１ｅ、１ｆ、１ｇ、１ｈを有している。
(Bright field imaging unit)
As shown in FIG. 2, the apparatus of the present embodiment has a bright field imaging unit 1 arranged between the unwinding roller 4 a and the winding roller 4 b of the transport device 4 and unwinds the flat enamel wire 10. It passes through the inside from the roller 4a side and is discharged to the winding roller 4b side. Then, as shown in FIG. 3, four bright-field imaging devices 1a, 1b, 1c, and 1d that image the surface of the flat enameled wire 10 and four bright-field imaging light that irradiate the surface of the flat enameled wire 10 with bright-field imaging light. Bright field imaging illumination devices 1e, 1f, 1g, and 1h are provided.
そして、図２と図４（ａ）に示すように、４基の明視野撮像装置は、光軸ｍ１、ｍ２、ｍ３、ｍ４を、平角エナメル線１０の４つの平面１０ａに対して垂直にしていて、４基の明視野撮像装置が、平面１０ａの正対視像を撮像するようにしている。また、図３には示していないが、４基の明視野撮像装置はコンピュータ３に接続していて、コンピュータ３が、これら撮像装置の撮像データを取得するようにしている。 As shown in FIGS. 2 and 4A, the four bright-field imaging devices have the optical axes m1, m2, m3, and m4 perpendicular to the four planes 10a of the flat enamel wire 10. Thus, the four bright-field imaging devices capture the front-view image of the plane 10a. Although not shown in FIG. 3, the four bright-field imaging devices are connected to the computer 3, and the computer 3 acquires the imaging data of these imaging devices.
ここで、４基の明視野撮像装置には、カラーまたはモノクロのＣＣＤカメラ、ＣＭＯＳカメラ等を用いることができる。そして、これら撮像装置は、平角エナメル線を高速で移動しても精度良く撮像できるよう、小さい撮像間隔で撮像可能な撮像装置を用いることが好ましく、１／１００００秒程度の間隔で撮像可能な撮像装置を用いることがより好ましい。 Here, for the four bright-field imaging devices, a color or monochrome CCD camera, a CMOS camera, or the like can be used. These imaging devices preferably use an imaging device capable of imaging at a small imaging interval so that high-precision imaging can be performed even when a rectangular enamel wire is moved at a high speed, and imaging capable of imaging at an interval of about 1/10000 seconds. More preferably, an apparatus is used.
また、４基の明視野撮像装置は、平角エナメル線１０の表面全体を撮像可能な角度範囲において、平面１０ａに対する光軸の角度を垂直以外にすることができる。例えば、図４（ｂ）に示すように、光軸を平面１０ａに対して傾けることができ、図には示していないが、隣り合う光軸とのなす角度を９０°から任意の角度に変えることもできる。 Further, the four bright-field imaging devices can make the angle of the optical axis with respect to the plane 10a other than vertical in an angle range in which the entire surface of the flat enamel wire 10 can be imaged. For example, as shown in FIG. 4B, the optical axis can be tilted with respect to the plane 10a, and although not shown in the figure, the angle between the adjacent optical axes is changed from 90 ° to an arbitrary angle. You can also
また、図３に示すように、４基の明視野撮像装置に対応する位置に、４基の明視野撮像用照明装置１ｅ、１ｆ、１ｇ、１ｈを配していて、明視野撮像光を、平面１０ａおよび角面１０ｂに対して照射して、４基の明視野撮像装置が平面１０ａおよび角面１０ｂの明視野像を撮像するようにしている。 Also, as shown in FIG. 3, four bright field imaging illumination devices 1e, 1f, 1g, and 1h are arranged at positions corresponding to the four bright field imaging devices, and the bright field imaging light is Irradiation is performed on the flat surface 10a and the square surface 10b, and four bright field imaging devices capture bright field images of the flat surface 10a and the angular surface 10b.
図５は、明視野撮像用照明装置１ｅについて示したものである。なお、残る明視野撮像用照明装置１ｆ、１ｇ、１ｈは、明視野撮像用照明装置１ｅと同じ構成であり、説明は省略する。図５に示すように、明視野撮像用照明装置１ｅは、１基の落射照明具１ｅａと２基の板状照明具１ｅｂ、１ｅｃを有している。 FIG. 5 shows the bright field imaging illumination device 1e. The remaining bright field imaging illumination devices 1f, 1g, and 1h have the same configuration as the bright field imaging illumination device 1e, and a description thereof will be omitted. As shown in FIG. 5, the bright field imaging illumination device 1e includes one epi-illuminator 1ea and two plate-shaped illuminators 1eb and 1ec.
落射照明具１ｅａは、平角エナメル線１０の平面１０ａに、明視野撮像光Ｌ１であるＬ１ａを照射し、明視野撮像装置１ａが、平面１０ａの正常部位を高輝度像にして撮像するようにしている。板状照明具１ｅｂ、１ｅｃは、上記平面１０ａの両脇の角面１０ａに、明視野撮像光Ｌ１であるＬ１ａ、Ｌ１ｂを照射し、明視野撮像装置１ａが、角面１０ｂの正常部位を高輝度像にして撮像するようにしている。 The epi-illuminator 1ea irradiates the flat surface 10a of the flat enameled wire 10 with L1a, which is bright-field imaging light L1, so that the bright-field imaging device 1a captures a normal part of the flat surface 10a as a high luminance image. Yes. The plate-shaped illuminators 1eb and 1ec irradiate the square surfaces 10a on both sides of the plane 10a with L1a and L1b that are bright-field imaging light L1, and the bright-field imaging device 1a increases the normal part of the angular surface 10b. A luminance image is captured.
ここで、明視野撮像用照明装置１ｅには、白色および有色のＬＥＤ照明、蛍光灯等を用いることができる。そしてこれら照明装置は、照射範囲内を均一照度にできるものであることが好ましい。 Here, white and colored LED illumination, fluorescent lamps, and the like can be used for the bright field imaging illumination device 1e. And it is preferable that these illuminating devices can make the illumination range uniform illumination intensity.
また、図５に示す角度θ、すなわち、平面１０ａに対する２基の板状照明具の傾斜角度は、明視野撮像装置１ａが角面１０ｂの正常部位を高輝度像として撮像できるよう適宜設定することが好ましく、２０°から５０°に設定することが好ましい。 In addition, the angle θ shown in FIG. 5, that is, the inclination angle of the two plate-shaped illuminators with respect to the plane 10a, should be set as appropriate so that the bright field imaging device 1a can capture the normal part of the angular surface 10b as a high-luminance image. Is preferably set to 20 ° to 50 °.
以上、上記４基の明視野撮像用照明装置と４基の明視野撮像装置の構成により、明視野撮像ユニット１は、平角エナメル線１０の平面１０ａおよび角面１０ｂにおける異物付着、疵、色調変化等の欠陥部位を、明視野像中の低輝度像として撮像することができる。これにより、平角エナメル線１０表面の上記欠陥部位を精度良く検出することができる。 As described above, with the configuration of the four bright-field imaging illumination devices and the four bright-field imaging devices, the bright-field imaging unit 1 allows the foreign object adhesion, wrinkles, and color change on the flat surface 10a and the rectangular surface 10b of the flat enameled wire 10. Or the like can be captured as a low-luminance image in the bright-field image. Thereby, the said defect site | part of the flat enameled wire 10 surface can be detected with a sufficient precision.
（暗視野撮像ユニット）
図６に示すように、本実施形態の装置は、暗視野撮像ユニット２を、搬送装置４の巻出しローラ４ａと巻取りローラ４ｂとの間に配していて、平角エナメル線１０を巻出しローラ４ａ側から内部に通して、巻取りローラ４ｂ側に排出するようにしている。そして、図６に示すように、平角エナメル線１０表面を撮像する４基の暗視野撮像装置２ａ、２ｂ、２ｃ、２ｄと、平角エナメル線１０の長手方向から平面１０ａおよび角面１０ｂに沿って暗視野撮像光を照射する、２基のリング照明具（暗視野撮像用照明装置）２ｅ、２ｆを有している。
(Dark field imaging unit)
As shown in FIG. 6, in the apparatus of this embodiment, the dark field imaging unit 2 is arranged between the unwinding roller 4 a and the winding roller 4 b of the transport device 4, and unwinds the flat enamel wire 10. It passes through the inside from the roller 4a side and is discharged to the winding roller 4b side. Then, as shown in FIG. 6, four dark field imaging devices 2a, 2b, 2c, and 2d that image the surface of the flat enameled wire 10 and along the flat surface 10a and the angular surface 10b from the longitudinal direction of the flat enameled wire 10. It has two ring illuminators (dark field imaging illumination devices) 2e and 2f that irradiate dark field imaging light.
また、図２と図７（ａ）に示すように、４基の暗視野撮像装置は、光軸ｎ１、ｎ２、ｎ３、ｎ４を、平角エナメル線１０の４つの平面１０ａに対して垂直にしていて、４基の暗視野撮像装置が、平面１０ａの正対視像を撮像するようにしている。そして、光軸ｎ１、ｎ２、ｎ３、ｎ４は、２基のリング照明具２ｅ、２ｆにおける間隔の中央部に位置している。また、図３には示していないが、４基の暗視野撮像装置はコンピュータ３に接続していて、コンピュータ３が、これら撮像装置の撮像データを取得するようにしている。 As shown in FIGS. 2 and 7A, the four dark-field imaging devices have the optical axes n1, n2, n3, and n4 perpendicular to the four planes 10a of the flat enamel wire 10. Thus, the four dark-field imaging devices capture a directly facing image on the plane 10a. The optical axes n1, n2, n3, and n4 are located at the center of the interval between the two ring illuminators 2e and 2f. Although not shown in FIG. 3, the four dark field imaging devices are connected to the computer 3, and the computer 3 acquires the imaging data of these imaging devices.
ここで、４基の暗視野撮像装置には、明視野撮像装置と同様、カラーまたはモノクロのＣＣＤカメラ、ＣＭＯＳカメラ等を用いることができる。そして、これら撮像装置は、平角エナメル線を高速で移動しても精度良く撮像できるよう、小さい撮像間隔で撮像可能な撮像装置を用いることが好ましく、１／１００００秒程度の間隔で撮像可能な撮像装置を用いることがより好ましい。 Here, as with the four dark field imaging devices, a color or monochrome CCD camera, CMOS camera, or the like can be used as in the bright field imaging device. These imaging devices preferably use an imaging device capable of imaging at a small imaging interval so that high-precision imaging can be performed even when a rectangular enamel wire is moved at a high speed, and imaging capable of imaging at an interval of about 1/10000 seconds. More preferably, an apparatus is used.
また、４基の暗視野撮像装置は、平角エナメル線１０の表面全体を撮像可能な角度範囲において、平面１０ａに対する光軸の角度を垂直以外にすることができる。例えば、図７（ｂ）に示すように、光軸を平面１０ａに対して傾けることができ、図には示していないが、隣り合う光軸とのなす角度を９０°から任意の角度に変えることもできる。 Further, the four dark-field imaging devices can make the angle of the optical axis with respect to the plane 10a other than vertical in an angle range in which the entire surface of the flat enamel wire 10 can be imaged. For example, as shown in FIG. 7B, the optical axis can be tilted with respect to the plane 10a, and although not shown in the figure, the angle between the adjacent optical axes is changed from 90 ° to an arbitrary angle. You can also
また、図６に示すように、平角エナメル線１０を内側に貫通するように、２基のリング照明具２ｅ、２ｆを対向配置していて、暗視野撮像光を平面１０ａおよび角面１０ｂに沿って照射するようにしている。 In addition, as shown in FIG. 6, two ring illuminators 2e and 2f are arranged opposite to each other so as to penetrate the flat enamel wire 10 inward, and dark field imaging light is directed along the plane 10a and the square surface 10b. To irradiate.
図８に示すように、２基のリング照明具は、暗視野撮像装置の光軸と平角エナメル線１０の交差する位置を中央にする間隔を形成していて、平角エナメル線１０の長手方向から平面１０ａおよび角面１０ｂに沿って、暗視野撮像光Ｌ２であるＬ２ａおよびＬ２ｂを照射するようにしている。これにより、暗視野撮像装置２は、平面１０ａおよび角面１０ｂの正常部位を、低輝度像として撮像するようにし、平面１０ａおよび角面１０ｂの異常部位である凹凸欠陥を、光の乱反射による高輝度像として撮像するようにしている。 As shown in FIG. 8, the two ring illuminators form an interval centered at the position where the optical axis of the dark-field imaging device and the flat enamel wire 10 intersect, and from the longitudinal direction of the flat enamel wire 10. L2a and L2b, which are dark field imaging light L2, are irradiated along the plane 10a and the corner surface 10b. Thereby, the dark field imaging device 2 is configured to capture normal portions of the plane 10a and the corner surface 10b as low-luminance images, and to detect uneven defects that are abnormal portions of the plane 10a and the corner surface 10b due to irregular reflection of light. An image is taken as a luminance image.
ここで、リング照明具２ｅ、２ｆには、白色および有色のＬＥＤ照明、蛍光灯等を用いることができる。そしてこれら照明装置は、照射範囲内を均一照度にできることが好ましい。 Here, white and colored LED illumination, fluorescent lamps, and the like can be used for the ring illumination tools 2e and 2f. And it is preferable that these illuminating devices can make the illumination range uniform illumination intensity.
また、図８に示すリング照明具２ｅ、２ｆの内径ｒａ、ｒｂは、平角エナメル線１０が通過可能な寸法範囲で、より小さくすることが好ましい。このようにすることで、より平行な光を凹凸欠陥に対して照射することができ、小さい凹凸欠陥であっても光を乱反射させて高輝度像にし、凹凸欠陥をより精度良く検出することができる。 Further, the inner diameters ra and rb of the ring illuminators 2e and 2f shown in FIG. 8 are preferably made smaller in a dimension range in which the flat enamel wire 10 can pass. By doing so, it is possible to irradiate the concavo-convex defect with more parallel light, and even with a small concavo-convex defect, the light is diffusely reflected to form a high-luminance image, and the concavo-convex defect can be detected more accurately. it can.
また、リング照明具は、２ｅ、２ｆのいずれか一方だけにすることもできる。しかし、凹凸欠陥をより高輝度にし、平角エナメル線１０の長手方向に非対称な欠陥であっても、高輝度像にできることから、リング照明具は、２ｅ、２ｆの２基を対向して配することが好ましい。 Moreover, only one of 2e and 2f can be used as the ring illumination tool. However, since the uneven defect is made to have higher brightness and even a defect that is asymmetric in the longitudinal direction of the flat enamel wire 10 can be made to have a high brightness image, the ring illuminator is arranged with 2e and 2f facing each other. It is preferable.
以上、上記リング照明具２ｅ、２ｆと４基の暗視野撮像装置により、暗視野撮像ユニット２は、平角エナメル線１０の平面１０ａおよび角面１０ｂにおける凹凸欠陥を、暗視野像中の高輝度像として撮像することができる。これにより、平角エナメル線１０表面において、緩やかな小さい凸にして色調変化の小さい膨れ欠陥であっても精度良く検出することができる。 As described above, the ring illumination tools 2e, 2f and the four dark field imaging devices allow the dark field imaging unit 2 to detect uneven defects on the flat surface 10a and the square surface 10b of the flat enameled wire 10 as a high brightness image in the dark field image. Can be imaged. As a result, even on the surface of the flat enameled wire 10, even a bulge defect having a moderately small convexity and a small change in color tone can be detected with high accuracy.
（コンピュータ）
図１に示すように、コンピュータ３は、記憶部３ａと、判定部３ｂ、制御部３ｃを有していて、明視野撮像ユニット１と、暗視野撮像ユニット２に接続している。
記憶部３ａは、明視野撮像ユニット１の４基の明視野撮像装置と、暗視野ユニット２の４基の暗視野撮像装置が撮像した撮像データを記憶するようにしている。
判定部３ｂは、記憶部３ａに記憶した撮像データを基に、平角エナメル線１０表面の欠陥の有無を判定可能にしている。
制御部３ｃは、明視野撮像ユニット１の４基の明視野撮像装置と、暗視野ユニット２の４基の暗視野撮像装置に接続し、各撮像装置の撮像のタイミングを制御するとともに、各撮像装置が撮像した撮像データを取得して、記憶部３ａに転送するようにしている。
なお、記憶部３ａには、別途取得した撮像位置あるいは撮像時刻に関するデータを記憶しても良く、撮像データとともに参照できるようにして、欠陥発生位置の特定に利用しても良い。
(Computer)
As shown in FIG. 1, the computer 3 includes a storage unit 3 a, a determination unit 3 b, and a control unit 3 c, and is connected to the bright field imaging unit 1 and the dark field imaging unit 2.
The storage unit 3a stores imaging data captured by the four bright field imaging devices of the bright field imaging unit 1 and the four dark field imaging devices of the dark field unit 2.
The determination unit 3b makes it possible to determine whether there is a defect on the surface of the flat enameled wire 10 based on the imaging data stored in the storage unit 3a.
The control unit 3c is connected to the four bright-field imaging devices of the bright-field imaging unit 1 and the four dark-field imaging devices of the dark-field unit 2, and controls the imaging timing of each imaging device. Image data captured by the apparatus is acquired and transferred to the storage unit 3a.
Note that the storage unit 3a may store separately acquired data relating to the imaging position or imaging time, and may be used for specifying the defect occurrence position so that it can be referred to together with the imaging data.
（搬送装置）
図１に示すように、搬送装置４は、平角エナメル線１０を巻出す巻出しローラ４ａと、平角エナメル線を巻取る巻取りローラ４ｂを有している。これらローラは、各々に接続する不図示のモータにより駆動し、平角エナメル線１０を、巻出しローラ４ａから巻取りローラ４ｂに、適度に張力を加えた状態にして、定速移動するようにしている。
(Transport device)
As shown in FIG. 1, the transport device 4 includes an unwinding roller 4 a that unwinds the flat enamel wire 10 and a winding roller 4 b that winds the flat enamel wire. These rollers are driven by motors (not shown) connected to the respective rollers so that the flat enameled wire 10 is moved at a constant speed with moderate tension applied from the unwinding roller 4a to the winding roller 4b. Yes.
（ガイドローラ）
図１に示すように、ガイドローラ５は、巻出しローラ４ａと巻取りローラ４ｂ間に位置し、移動する平角エナメル線１０を上下左右方向から支持して、平角エナメル線１０のぶれを抑制している。このようにすることで、明視野撮像ユニット１および暗視野撮像ユニット２における平角エナメル線１０の撮像を安定にすることができ、より精度良く欠陥を検出することができる。なお、図１に示すように、ガイドローラ５は、明視野撮像ユニット１および暗視野撮像ユニット２の通過前後において、平角エナメル線１０を支持するように配置することが好ましい。
(Guide roller)
As shown in FIG. 1, the guide roller 5 is located between the unwinding roller 4a and the winding roller 4b, and supports the moving flat enamel wire 10 from above, below, left and right, and suppresses the blurring of the flat enamel wire 10. ing. By doing in this way, the imaging of the flat enamel wire 10 in the bright field imaging unit 1 and the dark field imaging unit 2 can be stabilized, and a defect can be detected with higher accuracy. As shown in FIG. 1, the guide roller 5 is preferably disposed so as to support the flat enamel wire 10 before and after passing through the bright field imaging unit 1 and the dark field imaging unit 2.
次に、本実施形態の外観検査装置の動きについて説明する。
まず、図２に示す装置において、搬送装置４により、平角エナメル線１０を長手方向に一定速度で移動させる。
そして、図３に示す明視野撮像ユニット１において、平角エナメル線１０の平面１０ａおよび角面１０ｂに、明視野撮像用照明装置１ｅ、１ｆ、１ｇ、１ｈから明視野撮像光を照射し、明視野撮像光を照射した位置における平面１０ａおよび角面１０ｂの明視野像を明視野撮像装置１ａ、１ｂ、１ｃ、１ｄにより撮像する。
そして、図６に示す暗視野撮像ユニット２において、平角エナメル線１０の長手方向に沿って、暗視野撮像用照明装置であるリング照明具２ｅ、２ｆから暗視野撮像光を照射し、暗視野撮像光を照射した位置における平面１０ａおよび角面１０ｂの暗視野像を暗視野撮像装置２ａ、２ｂ、２ｃ、２ｄにより撮像する。
そして、両ユニットで撮像した明視野像と暗視野像の撮像データを、接続するコンピュータ３が取得して記憶部３ａに記憶し、記憶した撮像データを基に判定部３ｂが欠陥の有無を判定する。
Next, the movement of the appearance inspection apparatus according to this embodiment will be described.
First, in the apparatus shown in FIG. 2, the flat enameled wire 10 is moved at a constant speed in the longitudinal direction by the transport device 4.
Then, in the bright field imaging unit 1 shown in FIG. 3, the bright field imaging light is irradiated from the bright field imaging illumination devices 1e, 1f, 1g, and 1h onto the flat surface 10a and the rectangular surface 10b of the flat enameled wire 10. Bright field images of the plane 10a and the corner surface 10b at the position where the imaging light is irradiated are captured by the bright field imaging devices 1a, 1b, 1c, and 1d.
Then, in the dark field imaging unit 2 shown in FIG. 6, dark field imaging light is emitted along the longitudinal direction of the flat enamel wire 10 from the ring illumination tools 2e and 2f which are dark field imaging illumination devices. Dark field images of the plane 10a and the corner surface 10b at the position where the light is irradiated are captured by the dark field imaging devices 2a, 2b, 2c, and 2d.
Then, the connected computer 3 acquires and stores the bright field image and dark field image data captured by both units in the storage unit 3a, and the determination unit 3b determines whether there is a defect based on the stored image data. To do.
次に、判定部３ｂが、明視野撮像ユニット１にて撮像した撮像データ、すなわち明視野像について、欠陥の有無を判定する手順について説明する。
図９に示すように、判定部３ｂは、ステップＳ１１にて、記憶部３ａから撮像データ（明視野像）を取得した後、ステップＳ１２にて、像の平滑化処理を行って、銅線の加工痕による微小ノイズを除去する。その後、ステップＳ１３にて、像の輝度変化について強調処理を行って、輝度コントラストの低い欠陥を検出可能にし、ステップ１４にて、輝度２値化を行って、低輝度に写る欠陥部位のみを抽出し、ステップＳ１５にて、膨張伸縮処理を行って、微小低輝度像の集合を一つの像に合体させる。以上の処理を行った像について、ステップＳ１６にて、低輝度像のサイズを測定し、ステップＳ１７にて、閾値との比較を行う。そして、低輝度像のサイズが、閾値より小さい場合は、ステップＳ１８に進んで、欠陥無しと判定し、閾値より大きい場合は、ステップＳ１９に進んで、欠陥有りと判定する。
判定部３ｂが欠陥有りと判定した場合、判定部３ｂは、欠陥有りと判定した撮像データの撮像時間と欠陥の大きさを記憶部３ｂに記憶し、後で参照できるようにする。
Next, a procedure for the determination unit 3b to determine the presence / absence of a defect in the imaging data captured by the bright field imaging unit 1, that is, the bright field image will be described.
As illustrated in FIG. 9, the determination unit 3b acquires imaging data (bright field image) from the storage unit 3a in step S11, and then performs image smoothing processing in step S12 to obtain the copper wire. Removes minute noise caused by machining marks. Thereafter, in step S13, enhancement processing is performed on the luminance change of the image so that a defect having a low luminance contrast can be detected, and in step 14, luminance binarization is performed, and only a defective portion appearing in low luminance is extracted. In step S15, an expansion / contraction process is performed to merge a set of minute low-intensity images into one image. For the image subjected to the above processing, the size of the low-luminance image is measured in step S16, and is compared with a threshold value in step S17. If the size of the low-luminance image is smaller than the threshold, the process proceeds to step S18, where it is determined that there is no defect. If it is greater than the threshold, the process proceeds to step S19, where it is determined that there is a defect.
When the determination unit 3b determines that there is a defect, the determination unit 3b stores the imaging time of the imaging data determined to have a defect and the size of the defect in the storage unit 3b so that they can be referred to later.
次に、判定部３ｂが、暗視野撮像ユニット２にて撮像した撮像データ、すなわち暗視野像について、欠陥の有無を判定する手順について説明する。
図１０に示すように、判定部３ｂは、ステップＳ２１にて、記憶部３ａから撮像データ（暗視野像）を取得した後、ステップＳ２２にて、像の平滑化処理を行って、銅線の加工痕による微小ノイズを除去する。その後、ステップＳ２３にて、輝度２値化を行って、高低輝度に写る欠陥部位のみを抽出し、ステップＳ２４にて、膨張伸縮処理を行って、微小高輝度像の集合を一つの像に合体させる。以上の処理を行った像について、ステップＳ２５にて、高輝度像のサイズを測定し、ステップＳ２６にて、閾値との比較を行う。そして、高輝度像のサイズが、閾値より小さい場合は、ステップＳ２７に進んで、欠陥無しと判定し、閾値より大きい場合は、ステップＳ２８に進んで、欠陥有りと判定する。なお、判定に用いる閾値は、明視野像の判定に用いた閾値と別の値にしても良い。
判定部３ｂが欠陥有りと判定した場合、判定部３ｂは、欠陥有りと判定した撮像データの撮像時間と欠陥の大きさを記憶部３ｂに記憶し、後で参照できるようにする。
Next, a description will be given of a procedure in which the determination unit 3b determines the presence / absence of a defect with respect to imaging data captured by the dark field imaging unit 2, that is, a dark field image.
As shown in FIG. 10, the determination unit 3b acquires imaging data (dark field image) from the storage unit 3a in step S21, and then performs image smoothing processing in step S22 to obtain the copper wire. Removes minute noise caused by machining marks. After that, in step S23, luminance binarization is performed, and only defective portions appearing in high and low luminance are extracted. In step S24, expansion / contraction processing is performed, and a set of minute high luminance images is combined into one image. Let For the image subjected to the above processing, the size of the high-intensity image is measured in step S25, and compared with the threshold value in step S26. If the size of the high-intensity image is smaller than the threshold value, the process proceeds to step S27, where it is determined that there is no defect. Note that the threshold used for the determination may be different from the threshold used for the determination of the bright field image.
When the determination unit 3b determines that there is a defect, the determination unit 3b stores the imaging time of the imaging data determined to have a defect and the size of the defect in the storage unit 3b so that they can be referred to later.
以上のように、本実施形態の平角エナメル線の外観検査装置は、コンピュータ３の判定部３ｂが、平角エナメル線１０の表面欠陥の有無を、平面１０ａおよび角面１０ｂの明視野像と暗視野像それぞれにより判定している。これにより、凹凸の小さい欠陥や色調欠陥を、明視野像中の低輝度像として検出することができ、凹凸欠陥を、暗視野像中の高輝度像として検出することができる。特に、暗視野像において、緩やかな小さい凸にして色調変化の小さい膨れ欠陥を検出することができるので、平角エナメル線１０の表面欠陥を精度良く検出することができる。 As described above, in the flat enameled wire appearance inspection apparatus according to the present embodiment, the determination unit 3b of the computer 3 determines the presence or absence of surface defects in the flat enameled wire 10, the bright field image of the plane 10a and the square surface 10b, and the dark field. Judgment is made for each image. Thereby, a defect with a small unevenness | corrugation and a color tone defect can be detected as a low-intensity image in a bright-field image, and an uneven | corrugated defect can be detected as a high-intensity image in a dark-field image. In particular, in a dark field image, it is possible to detect a blister defect with a small and small convexity and a small change in color tone, so that a surface defect of the flat enamel line 10 can be detected with high accuracy.
（実施例）
以下に、本発明の平角エナメル線の外観検査装置を用いて、平角エナメル線の外観検査を行った実施例について示す。
本実施例では、断面が３．５ｍｍ×２．５ｍｍ、長さが８００ｍｍの平角エナメル線を、１０ｍ／分の速度で移動しながら外観検査を行った。
外観検査装置の構成について説明すると、明視野撮像ユニットは、落射照明具にハーフミラーを内蔵したＬＥＤ照明、板状照明具に板状のＬＥＤ照明を用い、平角エナメル線の平面および角面に白色光を照射した。なお、平角エナメル線の平面に対する板状照明具の照射角度は３０°とした。そして、明視野撮像装置には、モノクロ２００万画素のＣＭＯＳカメラを用い、シャッタースピードを１／５０００秒に制御した。
また、暗視野撮像ユニットは、２基のリング照明具に内径３０ｍｍの環状ＬＥＤ照明を用い、平角エナメル線の長手方向に沿って、対向して白色光を照射した。そして、暗視野撮像装置にも、モノクロ２００万画素のＣＭＯＳカメラを用い、シャッタースピードを１／５０００秒に制御した。
表面欠陥の判定では、明視野像および暗視野像ともに、判定の閾値を０．２平方ｍｍとし、これ以上の面積である異常部位を欠陥と判定するようにした。
また、本実施例の比較例として、同じ平角エナメル線について、明視野撮像ユニットだけの外観検査、暗視野撮像ユニットだけの外観検査、目視による外観検査を行い、検査結果の比較を行った。
(Example)
Hereinafter, an example in which an appearance inspection of a flat enameled wire is performed using the flatness enameled wire visual inspection apparatus of the present invention will be described.
In this example, an appearance inspection was performed while moving a rectangular enameled wire having a cross section of 3.5 mm × 2.5 mm and a length of 800 mm at a speed of 10 m / min.
The configuration of the appearance inspection apparatus will be described. The bright-field imaging unit uses LED illumination with a built-in half mirror in the epi-illuminator and plate-like LED illumination in the plate-like illuminator. Irradiated with light. In addition, the irradiation angle of the plate-shaped illuminating tool with respect to the plane of the flat enamel wire was 30 °. In the bright field imaging device, a monochrome 2 million pixel CMOS camera was used, and the shutter speed was controlled to 1/5000 seconds.
In addition, the dark field imaging unit used annular LED illumination with an inner diameter of 30 mm for two ring illuminators, and irradiated white light facing each other along the longitudinal direction of the flat enamel wire. The dark field imaging device was also a monochrome 2 million pixel CMOS camera, and the shutter speed was controlled to 1/5000 second.
In the determination of the surface defect, both the bright-field image and the dark-field image have a determination threshold value of 0.2 square mm, and an abnormal part having an area larger than this is determined as a defect.
Further, as a comparative example of the present embodiment, the same flat enamel wire was subjected to an appearance inspection only for the bright field imaging unit, an appearance inspection only for the dark field imaging unit, and an appearance inspection by visual observation, and the inspection results were compared.
本実施例において、平角エナメル線の明視野像と暗視野像は、例えば図１１および図１２に示すように撮像された。図１１の明視野像中における低輝度像Ｆ１が表面欠陥であり、この欠陥は異物付着による凸状欠陥であった。また、図１２の暗視野像中における高輝度像Ｆ２も表面欠陥であり、この欠陥はエナメルの膨れ欠陥であった。 In this example, a bright field image and a dark field image of a flat enamel line were picked up as shown in FIGS. 11 and 12, for example. The low-luminance image F1 in the bright field image of FIG. 11 is a surface defect, and this defect is a convex defect due to foreign matter adhesion. Further, the high-intensity image F2 in the dark field image of FIG. 12 is also a surface defect, and this defect is an enamel blister defect.
そして、図１３に示すように、目視による外観検査では、平角エナメル線から３７個の表面欠陥を検出した。これに対し、明視野撮像ユニットだけの外観検査では、目視検査で検出できた表面欠陥の内、３３個を検出できたが、４個の表面欠陥を見落としていた。そして、見落とした表面欠陥を調べたところ、これらは全てエナメルの膨れ欠陥であった。また、暗視野撮像ユニットだけの外観検査では、目視検査で検出できた表面欠陥の内、３１個を検出できたが、６個の表面欠陥を見落としていた。そして、見落とした表面欠陥を調べたところ、これらは全てエナメルが焼付いた色調欠陥であった。
本実施例である、明視野撮像ユニットと暗視野撮像ユニットによる外観検査では、目視検査で検出できた表面欠陥すべてを検出することができ、精度良く外観検査できることが
確認できた。
As shown in FIG. 13, in the visual appearance inspection, 37 surface defects were detected from the flat enamel wire. On the other hand, in the appearance inspection using only the bright-field imaging unit, 33 of the surface defects detected by the visual inspection could be detected, but four surface defects were overlooked. When the surface defects that were overlooked were examined, all of them were enamel blister defects. Further, in the appearance inspection using only the dark field imaging unit, 31 surface defects that could be detected by visual inspection could be detected, but 6 surface defects were overlooked. Then, when the surface defects that were overlooked were examined, all of these were color defects with seizure of enamel.
In the appearance inspection using the bright-field imaging unit and dark-field imaging unit in this example, it was possible to detect all surface defects that could be detected by visual inspection, and to confirm that the appearance inspection could be performed with high accuracy.
以上、本発明の実施形態と実施例について説明してきたが、本発明は、上記実施形態と実施例に限定されるものでない。特許請求の範囲に示される技術範囲において実施形態を変更可能である。 As mentioned above, although embodiment and the Example of this invention have been demonstrated, this invention is not limited to the said embodiment and Example. The embodiments can be changed within the technical scope indicated in the claims.
例えば、上記実施形態では、移動する平角エナメル線１０の上流側に明視野撮像ユニット１、下流側に暗視野撮像ユニット２を配しているが、これらの位置を逆にしても構わない。 For example, in the above embodiment, the bright field imaging unit 1 is arranged on the upstream side of the moving flat enamel wire 10 and the dark field imaging unit 2 is arranged on the downstream side, but these positions may be reversed.
また、上記実施形態の明視野撮像ユニットでは、明視野撮像用照明装置を、落射照明具と板状照明具に分けていたが、明視野撮像装置が平角エナメル線の角面を高輝度像にして撮像できる構成であれば、明視野撮像用照明装置を一体物の照明装置としても良い。 In the bright field imaging unit of the above embodiment, the bright field imaging illumination device is divided into the epi-illumination device and the plate illumination device. However, the bright field imaging device converts the square surface of the flat enamel line into a high luminance image. If it is the structure which can be imaged in this way, it is good also considering the illuminating device for bright-field imaging as an integrated illuminating device.
また、本発明の外観検査装置は、平角エナメル線の外観検査に適した検査装置ではあるが、明視野撮像用照明装置を調整することにより、丸エナメル線の外観検査にも用いることができる。 The appearance inspection apparatus of the present invention is an inspection apparatus suitable for the appearance inspection of a flat enamel wire, but can also be used for the appearance inspection of a round enamel wire by adjusting the illumination device for bright field imaging.
１：明視野撮像ユニット
１ａ，１ｂ，１ｃ，１ｄ：明視野撮像装置
１ｅ，１ｆ，１ｇ，１ｈ：明視野撮像用照明装置
１ｅａ：落射照明具
１ｅｂ，１ｅｃ：板状照明具
２：暗視野撮像ユニット
２ａ，２ｂ，２ｃ，２ｄ：暗視野撮像装置
２ｅ，２ｆ：リング照明具（暗視野撮像用照明装置）
３：コンピュータ
３ａ：記憶部
３ｂ：判定部
３ｃ：制御部
４：搬送装置
４ａ：巻出しローラ
４ｂ：巻取りローラ
５:ガイドローラ
１０：平角エナメル線
Ｌ１：明視野撮像光
Ｌ２：暗視野撮像光
1: Bright field imaging unit 1a, 1b, 1c, 1d: Bright field imaging device 1e, 1f, 1g, 1h: Illumination device for bright field imaging
1ea: Epi-illuminator
1eb, 1ec: plate-shaped illuminator 2: dark field imaging unit 2a, 2b, 2c, 2d: dark field imaging device 2e, 2f: ring illumination device (dark field imaging illumination device)
3: Computer 3a: Storage unit 3b: Determination unit 3c: Control unit 4: Conveying device 4a: Unwinding roller 4b: Winding roller 5: Guide roller 10: Flat enameled wire
L1: Bright field imaging light L2: Dark field imaging light
Claims (4)
前記平角エナメル線の長手方向に沿って暗視野撮像光を照射し、前記平面および前記角面の暗視野像を撮像する工程と、
前記明視野像と前記暗視野像から、前記平面および前記角面における欠陥の有無を判定する工程と
を有することを特徴とする平角エナメル線の外観検査方法。 Illuminating bright-field imaging light on a plane and a square surface of a flat enamel wire moving in the longitudinal direction, and capturing a bright-field image of the plane and the square surface;
Irradiating dark field imaging light along the longitudinal direction of the flat enamel line, and capturing a dark field image of the flat surface and the square surface; and
A method for inspecting the appearance of a rectangular enamel wire, comprising: determining from the bright field image and the dark field image whether or not there is a defect on the plane and the corner.
ことを特徴とする請求項１に記載の平角エナメル線の外観検査方法。 2. The flat angle enamel according to claim 1, wherein the dark field imaging light is irradiated from two opposite directions along the longitudinal direction, and a dark field image is picked up at a central portion of the opposed interval of the irradiation. Line appearance inspection method.
前記平面および前記角面の明視野像を撮像する明視野撮像装置と、
前記平角エナメル線の長手方向に沿って暗視野撮像光を照射する暗視野撮像用照明装置と、
前記平面および前記角面の暗視野像を撮像する暗視野撮像装置と、
前記明視野像と前記暗視野像から、前記平面および前記角面における欠陥の有無を判定する判定部と
を具備することを特徴とする平角エナメル線の外観検査装置 A bright-field imaging illumination device that irradiates bright-field imaging light on the plane and square surfaces of a flat enameled wire that moves in the longitudinal direction;
A bright-field imaging device that captures a bright-field image of the plane and the angular plane;
A dark field imaging illumination device that irradiates dark field imaging light along a longitudinal direction of the flat enamel wire;
A dark field imaging device that captures a dark field image of the plane and the angular plane;
An apparatus for inspecting the appearance of a rectangular enamel wire, comprising: a determination unit that determines whether or not there is a defect in the plane and the corner plane from the bright field image and the dark field image.
ことを特徴とする請求項３に記載の平角エナメル線の外観検査装置。 The illumination device for dark-field imaging irradiates the dark-field imaging light from two opposite directions along the longitudinal direction, and picks up a dark-field image at the center of the opposed interval of the irradiation. A flat enameled wire appearance inspection apparatus according to claim 3.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115046931A (en) * | 2022-07-19 | 2022-09-13 | 红旗集团江西铜业有限公司 | Flat enameled wire defect monitoring device |
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