JP2007064801A - Lighting system and appearance inspection device equipped with it - Google Patents

Lighting system and appearance inspection device equipped with it Download PDF

Info

Publication number
JP2007064801A
JP2007064801A JP2005251427A JP2005251427A JP2007064801A JP 2007064801 A JP2007064801 A JP 2007064801A JP 2005251427 A JP2005251427 A JP 2005251427A JP 2005251427 A JP2005251427 A JP 2005251427A JP 2007064801 A JP2007064801 A JP 2007064801A
Authority
JP
Japan
Prior art keywords
light
electronic component
light projecting
imaging
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005251427A
Other languages
Japanese (ja)
Other versions
JP4713279B2 (en
Inventor
Osamu Suzuki
修 鈴木
Kouji Matsui
公児 松井
Akihisa Kato
秋久 加藤
Original Assignee
Daiichi Jitsugyo Viswill Co Ltd
第一実業ビスウィル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiichi Jitsugyo Viswill Co Ltd, 第一実業ビスウィル株式会社 filed Critical Daiichi Jitsugyo Viswill Co Ltd
Priority to JP2005251427A priority Critical patent/JP4713279B2/en
Publication of JP2007064801A publication Critical patent/JP2007064801A/en
Application granted granted Critical
Publication of JP4713279B2 publication Critical patent/JP4713279B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting system capable of more certainly showing a flaw part to perform precise inspection of appearance. <P>SOLUTION: The lighting system 21 is composed of first, second and third projection mechanisms 22, 23 and 24 which are provided on an appearance inspection device for photographing an electronic component C to inspect the appearance thereof to illuminate the electronic component C at the time of photographing and are provided with a plurality of light emitting diodes 22a, 23a and 24a arranged annually respectively and irradiating light toward the electronic component C. The first, second and third projection mechanisms 22, 23 and 24 are arranged so that the annular arranging center axes of the respective light emitting diodes 22a, 23a and 24a cross a horizontal surface at right angles so as to be mutually arranged coaxially. The first, second and third projection mechanisms are respectively arranged at upper, middle and lower stages. Further, the first projection mechanism 22 emits blue light and the second and third projection mechanisms 23 and 24 emit a red light. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電子部品を撮像してその外観を検査する外観検査装置に設けられ、前記電子部品の撮像時にこれを照明する照明装置、及びこの照明装置を備えた外観検査装置に関する。   The present invention relates to an illumination device that is provided in an appearance inspection apparatus that images an electronic component and inspects the appearance of the electronic component, and illuminates the electronic component when the electronic component is imaged, and an appearance inspection apparatus including the illumination device.

電子部品である積層コンデンサ(検査対象物)などを撮像してその外観を検査する外観検査装置用の照明装置として、従来、例えば、特公平6−78989号公報に開示されたものが知られている。この照明装置は、適宜搬送装置によって所定の搬送方向に搬送される積層コンデンサをその上方から照明するもので、高輝度ランプと、積層コンデンサを上方から覆うように設けられる半球状の拡散透光性部材と、一端面が高輝度ランプと、他端面が拡散透光性部材の外周面と一定間隔を隔てて設けられ、高輝度ランプからの光を一端側から他端側に伝送する光ファイバ束とから構成される。   2. Description of the Related Art Conventionally, as an illumination device for an appearance inspection apparatus that images a multilayer capacitor (inspection object) that is an electronic component and inspects its appearance, for example, the one disclosed in Japanese Patent Publication No. 6-78989 is known. Yes. This illuminating device illuminates a multilayer capacitor, which is appropriately transported in a predetermined transport direction by a transport device, from above. A high-intensity lamp and a hemispherical diffuse translucent provided to cover the multilayer capacitor from above. An optical fiber bundle that transmits a light from a high-intensity lamp from one end side to the other end side with a member, a high-intensity lamp at one end surface, and the other end surface spaced apart from the outer peripheral surface of the diffuse translucent member It consists of.

前記拡散透光性部材は、その頂部に貫通穴を備えるとともに、その下部側に、搬送装置によって搬送される積層コンデンサをその搬送方向に通過させるための切り欠き状の開口部を2つ備えている。尚、前記貫通穴は、積層コンデンサを撮像する撮像機構が拡散透光性部材の頂部上方に配置されることから、この撮像機構が当該貫通穴から積層コンデンサの表面を撮像するために設けられているものである。   The diffuse translucent member has a through-hole at the top and two cut-out openings for allowing the multilayer capacitor conveyed by the conveying device to pass in the conveying direction on the lower side. Yes. In addition, since the imaging mechanism for imaging the multilayer capacitor is disposed above the top of the diffuse translucent member, the imaging mechanism is provided for imaging the surface of the multilayer capacitor from the through hole. It is what.

前記光ファイバ束は、その他端側が複数に分岐してその各他端面が拡散透光性部材の外周面に略等間隔で対峙しており、一端側から入射した光を伝送して各他端面から拡散透光性部材の外周面に向けて照射する。   The other end side of the optical fiber bundle is branched into a plurality, and the other end surfaces of the optical fiber bundle are opposed to the outer peripheral surface of the diffuse translucent member at substantially equal intervals, and transmits the light incident from one end side to each other end surface. To the outer peripheral surface of the diffuse translucent member.

この照明装置によれば、高輝度ランプからの光は、光ファイバ束の一端側に入射して、当該光ファイバ束により他端側に向けて伝送され、この後、各他端面から拡散透光性部材の外周面に向けて照射される。そして、この光は、拡散透光性部材により拡散された後、当該拡散透光性部材の内部を搬送装置によって搬送されている積層コンデンサに照射される。   According to this illumination device, light from the high-intensity lamp enters one end side of the optical fiber bundle and is transmitted toward the other end side by the optical fiber bundle, and then diffused light is transmitted from each other end surface. Irradiation toward the outer peripheral surface of the sex member. Then, after the light is diffused by the diffuse translucent member, the multilayer capacitor transported by the transport device is irradiated inside the diffuse translucent member.

このように、光ファイバ束の他端側を複数に分岐して拡散透光性部材の外周面に略等間隔で対峙させるとともに、光ファイバ束の各他端面から照射された光をこの拡散透光性部材によって拡散させるようにしているので、積層コンデンサをあらゆる方向から均一に照明することができる。   As described above, the other end side of the optical fiber bundle is branched into a plurality of parts so as to face the outer peripheral surface of the diffusive translucent member at substantially equal intervals, and the light irradiated from each other end surface of the optical fiber bundle is transmitted to the diffusive transmissive member. Since the light-diffusing member diffuses the multilayer capacitor, the multilayer capacitor can be illuminated uniformly from all directions.

特公平6−78989号公報Japanese Patent Publication No. 6-78989

しかしながら、上記従来の照明装置では、高輝度ランプからの光を積層コンデンサに照射して、クラック,キズ,欠け,積層された誘電体及び内部電極の浮き上がりなどの欠陥部分を際立たせるようにしており、このような欠陥のすべてを同じレベルで際立たせることは難しいという問題があった(即ち、欠陥部分を際立たせることができる欠陥の種類もあれば、欠陥部分をさほど際立たせることができない欠陥の種類もあるという問題があった)。   However, in the above conventional illumination device, light from a high-intensity lamp is irradiated to the multilayer capacitor so that defective portions such as cracks, scratches, chipping, laminated dielectric and internal electrode floating are conspicuous. However, it is difficult to make all of these defects stand out at the same level (i.e., there are some types of defects that can make the defective part stand out, and there are defects that cannot make the defective part stand out so much). There was a problem that there was also a kind).

このため、当該照明装置を備えた外観検査装置によって積層コンデンサの外観検査を行うと、撮像機構により撮像された積層コンデンサの画像において欠陥部分が際立っていないものも含まれることとなり、欠陥部分の抽出が困難となって高精度に検査することができなかった。   For this reason, when the appearance inspection of the multilayer capacitor is performed by the appearance inspection apparatus provided with the illumination device, an image of the multilayer capacitor picked up by the image pickup mechanism includes a case where the defective portion is not conspicuous. It was difficult to perform inspection with high accuracy.

本発明は、以上の実情に鑑みなされたものであって、より確実に欠陥部分を際立たせて精度の良い外観検査を可能にする照明装置、及びこれを備えた外観検査装置の提供をその目的とする。   The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an illuminating device that enables more accurate appearance inspection by highlighting defective portions more reliably, and an appearance inspection device including the same. And

上記目的を達成するための本発明は、
電子部品を撮像してその外観を検査する外観検査装置に設けられ、前記電子部品の撮像時にこれを照明する照明装置であって、
前記電子部品に向けて光を照射する複数の投光部を有し、該各投光部が環状に配置された投光手段を複数備え、
前記各投光手段が同軸に配置されて軸線(投光部の環状配置中心軸線)方向に並設されるとともに、該各投光手段の内、少なくとも一つの投光手段が他の投光手段とは異なる色の光を前記投光部から前記電子部品に向けて照射するように構成されてなることを特徴とする照明装置に係る。
To achieve the above object, the present invention provides:
Provided in an appearance inspection apparatus that images an electronic component and inspects its appearance, and an illumination device that illuminates the electronic component during imaging,
It has a plurality of light projecting units that irradiate light toward the electronic component, and includes a plurality of light projecting means in which each light projecting unit is arranged in an annular shape,
The light projecting means are arranged coaxially and arranged in parallel in the direction of the axis (annular arrangement center axis of the light projecting portion), and at least one of the light projecting means is another light projecting means. The illumination device is configured to irradiate light having a color different from that of the light projecting unit toward the electronic component.

この照明装置によれば、各投光手段の点灯状態が適宜制御されて、各投光手段の内、同じ色の光を照射する投光手段から電子部品に向けて光が照射されるとともに、光を照射する投光手段が切り換えられることで、少なくとも2つの色の光が電子部品に照射される。   According to this illuminating device, the lighting state of each light projecting means is appropriately controlled, and among the light projecting means, light is emitted from the light projecting means that irradiates light of the same color toward the electronic component, By switching the light projecting means for irradiating light, at least two colors of light are applied to the electronic component.

尚、少なくとも2つの色の光を電子部品に照射するようにしているのは、近年の研究において、特定の色の光を電子部品に照射すると、特定の欠陥部分を際立たせ易いことがわかってきたからであり、一方の色の光では欠陥部分を際立たせることができなくても、他方の色の光では当該欠陥部分を際立たせることが可能となるからである。また、電子部品としては、例えば、積層コンデンサ,チップ型発光ダイオード及びチップ型インダクタなど、誘電体や内部電極を備えたものを挙げることができる。   In addition, in recent studies, it has been found that when an electronic component is irradiated with light of a specific color, it is easy to make a specific defective portion stand out. This is because even if the light of one color cannot make the defective portion stand out, the light of the other color can make the defective portion stand out. Examples of the electronic component include those provided with a dielectric and internal electrodes such as a multilayer capacitor, a chip type light emitting diode, and a chip type inductor.

このように、本発明に係る照明装置によれば、少なくとも2つの色の光を電子部品に照射可能であるので、一方の色の光では際立たせることができないような欠陥部分であっても、他方の色の光を照射することによって際立たせることができる。   Thus, according to the illumination device according to the present invention, it is possible to irradiate at least two colors of light onto an electronic component, so even if it is a defective portion that cannot be highlighted with one color of light, It can be made to stand out by irradiating the other color.

尚、前記各投光手段の中には、前記投光部から青色の光を前記電子部品に向けて照射する投光手段と、前記投光部から赤色の光を前記電子部品に向けて照射する投光手段とが少なくとも含まれていることが好ましい。   Each of the light projecting units includes a light projecting unit that irradiates blue light from the light projecting unit toward the electronic component, and a red light that irradiates the electronic component from the light projecting unit. It is preferable that at least a light projecting unit is included.

これは、青色の光を電子部品に照射すると、クラックやキズといった、電子部品表面に存在する欠陥部分を際立たせ易いからであり、赤色の光を電子部品に照射すると、積層コンデンサの積層された誘電体及び内部電極の浮き上がりといった、電子部品内部に存在する欠陥部分を際立たせ易いからである。したがって、青色及び赤色の光を照射する投光手段を組み合わせて照明装置を構成すれば、より効果的に、各種欠陥部分を際立たせることができる。   This is because when an electronic component is irradiated with blue light, defects such as cracks and scratches on the surface of the electronic component tend to stand out. When an electronic component is irradiated with red light, the multilayer capacitor is laminated. This is because it is easy to make a defective portion existing in the electronic component such as the dielectric and the internal electrode lift up. Therefore, if a lighting device is configured by combining the light projecting means for irradiating blue and red light, various defect portions can be more effectively made to stand out.

また、前記各投光手段は、軸線方向に3つ並設された第1投光手段,第2投光手段及び第3投光手段からなり、前記第1投光手段は、その軸線(投光部の環状配置中心軸線)に対して前記投光部の照射光軸が15°〜35°傾くように配置されるとともに、青色の光を前記電子部品に向けて照射するように構成され、前記第2投光手段は、その軸線(投光部の環状配置中心軸線)に対して前記投光部の照射光軸が40°〜50°傾くように配置されるとともに、赤色の光を前記電子部品に向けて照射するように構成され、前記第3投光手段は、その軸線(投光部の環状配置中心軸線)に対して前記投光部の照射光軸が55°〜75°傾くように配置されるとともに、赤色の光を前記電子部品に向けて照射するように構成されていることが好ましい。   Each of the light projecting means includes a first light projecting means, a second light projecting means, and a third light projecting means arranged in parallel in the axial direction, and the first light projecting means has its axis (projected). Arranged so that the irradiation optical axis of the light projecting unit is inclined by 15 ° to 35 ° with respect to the annular arrangement central axis of the optical unit), and configured to irradiate blue light toward the electronic component, The second light projecting means is disposed so that an irradiation optical axis of the light projecting unit is inclined by 40 ° to 50 ° with respect to its axis (annular arrangement center axis of the light projecting unit), and the red light is The third light projecting unit is configured to irradiate the electronic component, and the irradiation light axis of the light projecting unit is inclined by 55 ° to 75 ° with respect to its axis (annular arrangement center axis of the light projecting unit). And is preferably configured to irradiate red light toward the electronic component.

これは、青色の光を、投光部の照射光軸を投光手段の中心軸線から15°〜35°(電子部品の表面に対して55°〜75°)傾けて照射することで、クラックやキズといった、電子部品表面に存在する欠陥部分をより効果的に際立たせることができるからであり、また、赤色の光を、投光部の照射光軸を投光手段の中心軸線から40°〜50°(電子部品の表面に対して40°〜50°)傾けて及び55°〜75°(積層コンデンサの表面に対して15°〜35°)傾けて照射することで、積層コンデンサの積層された誘電体及び内部電極の浮き上がりといった、電子部品内部に存在する欠陥部分をより効果的に際立たせることができるからである。また、照射光軸と電子部品表面との間の角度を小さくすることで、欠けといった、電子部品の形状不良を検出し易くなるからでもある。また、赤色の光を照射する投光手段を2つ設けているのは、電子部品の表面に照射される光の光量を多くするためである。したがって、上記のようにすれば、各種欠陥部分を際立たせるのにより有効となる。   This is caused by irradiating blue light with the irradiation optical axis of the light projecting unit inclined by 15 ° to 35 ° (55 ° to 75 ° with respect to the surface of the electronic component) from the central axis of the light projecting means, thereby causing cracks. This is because defects such as scratches and flaws existing on the surface of the electronic component can be more effectively highlighted, and the red light is emitted by 40 ° from the central axis of the light projecting unit. The multilayer capacitor is laminated by irradiating at an angle of -50 ° (40 ° -50 ° with respect to the surface of the electronic component) and 55 ° -75 ° (15 ° -35 ° with respect to the surface of the multilayer capacitor). This is because it is possible to more effectively highlight defective portions existing inside the electronic component such as floating of the dielectric and the internal electrode. Moreover, it is because it becomes easy to detect the shape defect of electronic components, such as a chip, by making the angle between an irradiation optical axis and the electronic component surface small. Also, the reason for providing two light projecting means for irradiating red light is to increase the amount of light emitted to the surface of the electronic component. Therefore, if it does as mentioned above, it will become more effective by making various defect parts stand out.

また、本発明は、
電子部品を撮像してその外観を検査する外観検査装置であって、
前記電子部品を所定の搬送方向に搬送する搬送機構と、
前記搬送機構により搬送されて撮像領域内を通過する電子部品の表面を撮像する撮像機構と、
前記搬送機構によって前記撮像領域内を搬送される電子部品を照明する、前記請求項1乃至3記載のいずれかの照明装置と、
前記撮像機構によって撮像された電子部品の画像を基に、該電子部品の外観の良否判定を行う判定処理部と、
前記照明装置及び撮像機構の作動を制御する制御部とを備えてなり、
前記撮像機構は、その撮像光軸が前記各投光手段の投光部の配置環内に位置するように配置され、
前記制御部は、前記各投光手段を制御して、該各投光手段の内、同じ色の光を照射する投光手段から前記電子部品に向けて光を照射するとともに、前記電子部品が前記撮像領域内を通過中に、光を照射する投光手段を切り換えて該電子部品に照射される光の色を変えるように構成され、且つ、前記撮像機構を制御して、前記電子部品に照射される光の色毎に該電子部品の表面を撮像するように構成され、
前記判定処理部は、前記電子部品に照射される光の色毎に撮像された各画像を基に良否判定を行うように構成されてなることを特徴とする外観検査装置に係る。
The present invention also provides:
An appearance inspection apparatus for imaging an electronic component and inspecting its appearance,
A transport mechanism for transporting the electronic component in a predetermined transport direction;
An imaging mechanism that images the surface of the electronic component that is transported by the transport mechanism and passes through the imaging region;
The illumination device according to any one of claims 1 to 3, which illuminates an electronic component conveyed in the imaging region by the conveyance mechanism;
A determination processing unit that determines the quality of the appearance of the electronic component based on the image of the electronic component imaged by the imaging mechanism;
A control unit for controlling the operation of the illumination device and the imaging mechanism,
The imaging mechanism is arranged such that its imaging optical axis is located within the arrangement ring of the light projecting portion of each of the light projecting means,
The control unit controls each light projecting unit to irradiate light from the light projecting unit that emits light of the same color among the light projecting units toward the electronic component. While passing through the imaging area, the light projecting means for irradiating light is switched to change the color of light irradiated to the electronic component, and the imaging mechanism is controlled to It is configured to image the surface of the electronic component for each color of irradiated light,
The determination processing unit is configured to perform pass / fail determination based on each image captured for each color of light irradiated on the electronic component.

この外観検査装置によれば、搬送機構によって搬送される電子部品が撮像機構の撮像領域内を通過する際に、照明装置によって当該電子部品が照明されるとともに、撮像機構によって当該電子部品の表面が撮像される。   According to this appearance inspection apparatus, when the electronic component conveyed by the conveyance mechanism passes through the imaging region of the imaging mechanism, the electronic component is illuminated by the illumination device, and the surface of the electronic component is illuminated by the imaging mechanism. Imaged.

具体的には、制御部による制御の下、まず、各投光手段の内、同じ色の光を照射する投光手段から撮像領域内を通過中の電子部品に向けて所定の色の光が照射されるとともに、撮像機構によって電子部品の表面が撮像される。次に、光を照射する投光手段が切り換えられて、前記所定の色とは異なる色の光が投光手段から撮像領域内を通過中の電子部品に向けて照射されるとともに、撮像機構によって電子部品の表面が撮像される。   Specifically, under the control of the control unit, first, light of a predetermined color is emitted from the light projecting unit that irradiates the same color of light to the electronic component passing through the imaging region. Irradiation is performed, and the surface of the electronic component is imaged by the imaging mechanism. Next, the light projecting means for irradiating light is switched, and light of a color different from the predetermined color is emitted from the light projecting means toward the electronic component passing through the imaging region, and by the imaging mechanism. The surface of the electronic component is imaged.

そして、このようにして、電子部品の少なくとも2つの画像(電子部品に照射される光の色毎に撮像された各画像)が得られると、当該各画像を基に、判定処理部によって、電子部品の外観の良否が判定される。   When at least two images of the electronic component (each image captured for each color of light irradiated on the electronic component) are obtained in this way, the determination processing unit performs electronic processing based on each image. The quality of the appearance of the part is determined.

このように、本発明に係る外観検査装置によれば、照明装置から少なくとも2つの色の光を電子部品に照射して各色毎に当該電子部品の表面を撮像し、各色毎に得られた画像に基づいて良否判定を行っており、上述のように、少なくとも2つの色の光を電子部品に向けて照射することで、一方の色の光では際立たせることができないような欠陥部分であっても、他方の色の光を照射することによって際立たせることができることから、より高精度な外観検査を実施することができる。   As described above, according to the visual inspection apparatus according to the present invention, at least two colors of light are emitted from the illumination device to the electronic component, and the surface of the electronic component is imaged for each color, and the image obtained for each color. As described above, it is a defective portion that cannot be distinguished by light of one color by irradiating at least two colors of light toward the electronic component as described above. Moreover, since it can be made to stand out by irradiating the light of the other color, a more accurate external appearance inspection can be implemented.

また、例えば、照明装置が一つの色の光しか照射することができない場合、電子部品に照射する光の色を変えて当該電子部品の表面の撮像画像を取得するためには、電子部品の搬送方向に複数の検査領域を設けて各検査領域に照明装置及び撮像機構をそれぞれ配置しなければならないが、本発明では、一つの照明装置が少なくとも2つの色の光を照射可能であるので、検査領域は1ヶ所で良く、これにより、照明装置及び撮像機構の配設数を減らしてコスト低減を図ることができる。   In addition, for example, when the lighting device can irradiate only one color of light, in order to acquire a captured image of the surface of the electronic component by changing the color of the light irradiated to the electronic component, the electronic component is transported. It is necessary to provide a plurality of inspection regions in the direction and to arrange the illumination device and the imaging mechanism in each inspection region. However, in the present invention, since one illumination device can irradiate light of at least two colors, The number of areas may be one, and this can reduce the number of the illuminating devices and the imaging mechanisms, thereby reducing the cost.

以上のように、本発明に係る照明装置によれば、少なくとも2つの色の光を電子部品に向けて照射することで、より確実に欠陥部分を際立たせることができる。また、本発明に係る外観検査装置によれば、少なくとも2つの色の光を電子部品に向けて照射し、より確実に欠陥部分を際立たせることで、電子部品の外観を精度良く検査することができ、また、照明装置が少なくとも2つの色の光を照射可能であるので、照明装置及び撮像機構の配設数を減らしてコストを低く抑えることができる。   As described above, according to the illuminating device of the present invention, it is possible to make the defective portion stand out more reliably by irradiating the electronic component with light of at least two colors. In addition, according to the appearance inspection apparatus according to the present invention, it is possible to accurately inspect the appearance of the electronic component by irradiating at least two colors of light toward the electronic component and more reliably highlighting the defective portion. In addition, since the lighting device can irradiate light of at least two colors, the number of the lighting devices and the imaging mechanism can be reduced and the cost can be reduced.

以下、本発明の具体的な実施形態について、添付図面に基づき説明する。尚、図1は、本発明の一実施形態に係る外観検査装置の一部の概略構成を一部断面で示した正面図であり、図2は、図1に示した外観検査装置の平面図である。   Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings. 1 is a front view showing a partial schematic configuration of a part of the appearance inspection apparatus according to the embodiment of the present invention, and FIG. 2 is a plan view of the appearance inspection apparatus shown in FIG. It is.

図1及び図2に示すように、本例の外観検査装置1は、例えば、積層セラミックチップコンデンサなどの積層コンデンサCを供給する供給部(図示せず)と、供給部(図示せず)から供給される積層コンデンサCを所定の搬送方向(図1の矢示方向)に搬送する搬送部10と、搬送部10により搬送される積層コンデンサCを照明する照明部20と、照明部20により照明された積層コンデンサCを撮像する撮像部11と、撮像部11によって撮像された積層コンデンサCの画像を基に、当該積層コンデンサCの外観の良否判定を行う判定処理部13と、判定処理部13によって不良品と判定された場合に、その不良品の積層コンデンサCを回収する不良品回収部(図示せず)と、良品の積層コンデンサCを回収する良品回収部(図示せず)と、照明部20,撮像部11及び不良品回収部(図示せず)の作動を制御する制御部12とを備える。尚、本例では、検査対称物たる電子部品として、積層コンデンサCを一例に挙げて説明するが、検査対称物は、これに限定されるものではなく、チップ型発光ダイオードやチップ型インダクタなど、誘電体や内部電極を備えた電子部品を検査するようにしても良い。   As shown in FIGS. 1 and 2, the appearance inspection apparatus 1 of this example includes, for example, a supply unit (not shown) that supplies a multilayer capacitor C such as a multilayer ceramic chip capacitor, and a supply unit (not shown). A transport unit 10 that transports the supplied multilayer capacitor C in a predetermined transport direction (the direction indicated by an arrow in FIG. 1), an illumination unit 20 that illuminates the multilayer capacitor C transported by the transport unit 10, and illumination by the illumination unit 20 An imaging unit 11 that captures the multilayer capacitor C that has been captured, a determination processing unit 13 that determines whether the appearance of the multilayer capacitor C is acceptable based on an image of the multilayer capacitor C captured by the imaging unit 11, and a determination processing unit 13 , A defective product collecting unit (not shown) for collecting the defective multilayer capacitor C and a good product collecting unit (not shown) for collecting the non-defective multilayer capacitor C. , The illumination unit 20, and a control unit 12 for controlling the operation of the imaging unit 11 and a defective article collecting unit (not shown). In this example, the multilayer capacitor C is described as an example of an electronic component that is an inspection symmetrical object, but the inspection symmetrical object is not limited to this, and a chip-type light emitting diode, a chip-type inductor, etc. You may make it test | inspect the electronic component provided with the dielectric material and the internal electrode.

前記搬送部10は、透明な搬送ベルト10aと、この搬送ベルト10aを回動させる駆動機構(図示せず)などから構成されており、搬送方向上流側において供給部(図示せず)から搬送ベルト10aの上面に供給された積層コンデンサCを搬送方向下流側に向けて一定速度で搬送する。   The transport unit 10 includes a transparent transport belt 10a, a drive mechanism (not shown) that rotates the transport belt 10a, and the like, and the transport belt from the supply unit (not shown) on the upstream side in the transport direction. The multilayer capacitor C supplied to the upper surface of 10a is transported at a constant speed toward the downstream side in the transport direction.

前記照明部20は、搬送ベルト10aの上方に配設され、当該搬送ベルト10aによって搬送される積層コンデンサCの表面(上面)を照明する第1照明装置21と、搬送ベルト10aの下方に配設され、当該搬送ベルト10aによって搬送される積層コンデンサCの裏面(下面)を照明する第2照明装置(図示せず)とからなる。尚、第1照明装置21の方が第2照明装置(図示せず)よりも搬送方向上流側に設けられている。   The illumination unit 20 is disposed above the transport belt 10a, and is disposed below the transport belt 10a and a first illumination device 21 that illuminates the surface (upper surface) of the multilayer capacitor C transported by the transport belt 10a. And a second illumination device (not shown) for illuminating the back surface (lower surface) of the multilayer capacitor C conveyed by the conveyance belt 10a. The first lighting device 21 is provided on the upstream side in the transport direction from the second lighting device (not shown).

前記第1照明装置21は、積層コンデンサCに向けて光を照射する複数の発光ダイオード22a,23a,24aをそれぞれ備え、当該各発光ダイオード22a,23a,24aが水平面内で環状に配置された第1投光機構22,第2投光機構23及び第3投光機構24と、これら第1投光機構22,第2投光機構23及び第3投光機構24を支持する支持部材25とから構成され、下方の積層コンデンサCに向けて光を照射する。   The first lighting device 21 includes a plurality of light emitting diodes 22a, 23a, and 24a that irradiate light toward the multilayer capacitor C, and each of the light emitting diodes 22a, 23a, and 24a is annularly arranged in a horizontal plane. The first light projecting mechanism 22, the second light projecting mechanism 23, and the third light projecting mechanism 24, and the support member 25 that supports the first light projecting mechanism 22, the second light projecting mechanism 23, and the third light projecting mechanism 24. It is comprised and irradiates light toward the multilayer capacitor C below.

前記第1投光機構22,第2投光機構23及び第3投光機構24は、各発光ダイオード22a,23a,24aの環状配置中心軸線が水平面と直交し且つ互いに同軸となるように配置されるとともに、第1投光機構22が上段に、第2投光機構23が中段に、第3投光機構24が下段に配置されている。   The first light projecting mechanism 22, the second light projecting mechanism 23, and the third light projecting mechanism 24 are disposed such that the annular arrangement center axes of the light emitting diodes 22a, 23a, and 24a are orthogonal to the horizontal plane and are coaxial with each other. In addition, the first light projecting mechanism 22 is disposed in the upper stage, the second light projecting mechanism 23 is disposed in the middle stage, and the third light projecting mechanism 24 is disposed in the lower stage.

前記第1投光機構22は、その各発光ダイオード22aが青色の光を積層コンデンサCに向けて照射するとともに、当該各発光ダイオード22aの照射光軸の前記環状配置中心軸線に対する傾斜角度θが15°〜35°(積層コンデンサCの表面に対して55°〜75°)に設定されている。 The first light projecting system 22, together with the light emitting diode 22a is irradiated with blue light in the multilayer capacitor C, the inclination angle theta 1 with respect to the annular arrangement the central axis of the irradiation optical axis of each of the light emitting diode 22a is It is set to 15 ° to 35 ° (55 ° to 75 ° with respect to the surface of the multilayer capacitor C).

前記第2投光機構23は、その各発光ダイオード23aが赤色の光を積層コンデンサCに向けて照射するとともに、当該各発光ダイオード23aの照射光軸の前記環状配置中心軸線に対する傾斜角度θが40°〜50°(積層コンデンサCの表面に対して40°〜50°)に設定されている。 The second light projecting system 23, together with the light emitting diode 23a is irradiated with red light in the multilayer capacitor C, the inclination angle theta 2 with respect to the annular arrangement the central axis of the irradiation optical axis of each of the light emitting diode 23a is It is set to 40 ° to 50 ° (40 ° to 50 ° with respect to the surface of the multilayer capacitor C).

前記第3投光機構24は、その各発光ダイオード24aが赤色の光を積層コンデンサCに向けて照射するとともに、当該各発光ダイオード24aの照射光軸の前記環状配置中心軸線に対する傾斜角度θが55°〜75°(積層コンデンサCの表面に対して15°〜35°)に設定されている。 The third light emitting mechanism 24, together with their respective light emitting diodes 24a are irradiated with red light in the multilayer capacitor C, the inclination angle theta 3 relative to the annular arrangement the central axis of the irradiation optical axis of each of the light emitting diode 24a is It is set to 55 ° to 75 ° (15 ° to 35 ° with respect to the surface of the multilayer capacitor C).

尚、前記各投光機構22,23,24の各発光ダイオード22a,23a,24aは、その照射光軸と前記環状配置中心軸線との交点と、当該各発光ダイオード22a,23a,24aの先端部との間の距離が等しくなるように配置されている。   The light emitting diodes 22a, 23a, 24a of the light projecting mechanisms 22, 23, 24 have intersections between the irradiation optical axis and the center axis of the annular arrangement, and tip portions of the light emitting diodes 22a, 23a, 24a. Are arranged so that the distance between them becomes equal.

前記支持部材25は、上下に開口するとともに、下部開口部25aが上部開口部25bよりも大径に形成された筒状の部材から構成され、上部開口部25bが搬送ベルト10aによって搬送される積層コンデンサCの上方に位置するように配設されており、その内周面に、各投光機構22,23,24の各発光ダイオード22a,23a,24aを、前記環状配置中心軸線と下部開口部25a及び上部開口部25bの軸線とが同軸となるように収容している。   The support member 25 is formed of a cylindrical member having an opening up and down, a lower opening 25a having a larger diameter than the upper opening 25b, and the upper opening 25b being conveyed by the conveying belt 10a. The light emitting diodes 22a, 23a, and 24a of the light projecting mechanisms 22, 23, and 24 are arranged on the inner peripheral surface of the light emitting diodes 22a, 23a, and 24a on the inner peripheral surface thereof. It accommodates so that the axis line of 25a and the upper opening part 25b may become coaxial.

前記第2照明装置(図示せず)は、第1照明装置21が逆さまに設けられた構成を備え、上方の積層コンデンサCに向けて光を照射するものである。したがって、その詳しい説明は省略する。   The second illumination device (not shown) has a configuration in which the first illumination device 21 is provided upside down, and irradiates light toward the upper multilayer capacitor C. Therefore, the detailed description is abbreviate | omitted.

尚、このように、青色の光を積層コンデンサCに照射するようにしているのは、当該青色の光を積層コンデンサCに照射すると、クラックやキズといった、積層コンデンサCの表面に存在する欠陥部分を際立たせ易いからである。また、発光ダイオード22aの照射光軸の、前記環状配置中心軸線に対する傾斜角度θを15°〜35°としているのは、この範囲内であれば、積層コンデンサCの表面に存在する欠陥部分をより効果的に際立たせることができるからである。 In this way, the blue light is irradiated onto the multilayer capacitor C because the defective portion existing on the surface of the multilayer capacitor C such as cracks and scratches when the blue light is irradiated onto the multilayer capacitor C. It is because it is easy to make it stand out. Further, the irradiation optical axis of the light emitting diodes 22a, are we inclined angle theta 1 to 15 ° to 35 ° with respect to the annular arrangement central axis, as long as it is within this range, the defect existing on the surface of the multilayer capacitor C It is because it can make it stand out more effectively.

また、赤色の光を積層コンデンサCに照射するようにしているのは、当該赤色の光を積層コンデンサCに照射すると、積層された誘電体及び内部電極の浮き上がりといった、積層コンデンサCの内部に存在する欠陥部分を際立たせ易いからである。また、発光ダイオード23aの照射光軸の、前記環状配置中心軸線に対する傾斜角度θを40°〜50°と、発光ダイオード24aの照射光軸の、前記環状配置中心軸線に対する傾斜角度θを55°〜75°としているのは、この範囲内であれば、積層コンデンサCの内部に存在する欠陥部分をより効果的に際立たせることができるからである。また、照射光軸と積層コンデンサCの表面との間の角度を小さくすることで、欠けといった、積層コンデンサCの形状不良を検出し易くなるからでもある。また、赤色の光を照射する投光機構23,24を2つ設けているのは、積層コンデンサCの表面に照射される光の光量を多くするためである。 Also, the red light is applied to the multilayer capacitor C because when the red light is applied to the multilayer capacitor C, the multilayer dielectric C and the internal electrode are lifted up. This is because it is easy to make the defective part to stand out. Further, the irradiation optical axis of the light emitting diode 23a, the inclination angle theta 2 to 40 ° to 50 ° with respect to the annular arrangement central axis of the irradiation optical axis of the light emitting diode 24a, the inclination angle theta 3 relative to the annular arrangement center axis 55 The reason why the angle is in the range of 75 ° to 75 ° is that if it is within this range, the defective portion existing inside the multilayer capacitor C can be more effectively highlighted. Further, by reducing the angle between the irradiation optical axis and the surface of the multilayer capacitor C, it becomes easier to detect a shape defect of the multilayer capacitor C such as a chip. The reason why the two light projection mechanisms 23 and 24 for irradiating red light are provided is to increase the amount of light radiated to the surface of the multilayer capacitor C.

前記撮像部11は、第1照明装置21の上方に配設された第1CCDカメラ11aと、第2照明装置(図示せず)の下方に配設された第2CCDカメラ(図示せず)とからなる。第1CCDカメラ11aは、その撮像光軸が前記環状配置中心軸線並びに支持部材25の下部開口部25a及び上部開口部25bの軸線と同軸となるように配置されており、搬送ベルト10aにより搬送され所定の撮像領域内を通過する積層コンデンサCの表面を支持部材25の上部開口部25b,内部空間及び下部開口部25aを介して撮像する。   The imaging unit 11 includes a first CCD camera 11 a disposed above the first illumination device 21 and a second CCD camera (not illustrated) disposed below the second illumination device (not illustrated). Become. The first CCD camera 11a is arranged so that the imaging optical axis thereof is coaxial with the annular arrangement center axis and the axes of the lower opening 25a and the upper opening 25b of the support member 25, and is conveyed by the conveyance belt 10a and is predetermined. The surface of the multilayer capacitor C passing through the imaging region is imaged through the upper opening 25b, the internal space, and the lower opening 25a of the support member 25.

第2CCDカメラ(図示せず)は、第1CCDカメラ11aが逆さまに設けられた構成を備え、搬送ベルト10aにより搬送され所定の撮像領域内を通過する積層コンデンサCの裏面を撮像する。   The second CCD camera (not shown) has a configuration in which the first CCD camera 11a is provided upside down, and images the back surface of the multilayer capacitor C that is transported by the transport belt 10a and passes through a predetermined imaging region.

前記制御部12は、第1照明装置21の各投光機構22,23,24を制御して各発光ダイオード22a,23a,24aの点灯状態を制御し、第1CCDカメラ11aの撮像領域内を通過中の積層コンデンサCに向けて光を照射するとともに、第1CCDカメラ11aの撮像タイミングを制御して、各発光ダイオード22a,23a,24aから光が照射された積層コンデンサCの表面を撮像する。   The controller 12 controls the light projecting mechanisms 22, 23, 24 of the first illumination device 21 to control the lighting state of the light emitting diodes 22a, 23a, 24a, and passes through the imaging area of the first CCD camera 11a. While irradiating light toward the multilayer capacitor C therein, the imaging timing of the first CCD camera 11a is controlled to image the surface of the multilayer capacitor C irradiated with light from the respective light emitting diodes 22a, 23a, and 24a.

具体的には、発光受光型のセンサ14によって、搬送ベルト10aにより搬送される積層コンデンサCが検出されてから所定時間(積層コンデンサCがセンサ14の検知領域を通過後、第1CCDカメラ11aの撮像領域内の所定位置に搬送されるまでの時間)の経過後、図3に示すように、まず、第1投光機構22の各発光ダイオード22aを点灯させて青色の光を積層コンデンサCに向けて照射し、第1CCDカメラ11aにより当該積層コンデンサCの表面を撮像する。   Specifically, a predetermined time after the multilayer capacitor C conveyed by the conveyor belt 10a is detected by the light emitting / receiving sensor 14 (after the multilayer capacitor C passes the detection area of the sensor 14, the first CCD camera 11a takes an image. After the elapse of time until it is conveyed to a predetermined position in the area, first, each light emitting diode 22a of the first light projecting mechanism 22 is turned on to direct blue light to the multilayer capacitor C as shown in FIG. The surface of the multilayer capacitor C is imaged by the first CCD camera 11a.

この後、第1投光機構22の各発光ダイオード22aを消灯し、第2投光機構23及び第3投光機構24の各発光ダイオード23a,24aを点灯させて赤色の光を積層コンデンサCに向けて照射した後、第1CCDカメラ11aにより当該積層コンデンサCの表面を撮像し、第2投光機構23及び第3投光機構24の各発光ダイオード23a,24aを消灯する。このようにして、搬送ベルト10aにより一定速度で搬送される積層コンデンサCは、第1CCDカメラ11aの撮像領域内を通過中に、青色の光が照射された状態と赤色の光が照射された状態で表面が撮像される。   Thereafter, the light emitting diodes 22a of the first light projecting mechanism 22 are turned off, the light emitting diodes 23a and 24a of the second light projecting mechanism 23 and the third light projecting mechanism 24 are turned on, and red light is applied to the multilayer capacitor C. Then, the surface of the multilayer capacitor C is imaged by the first CCD camera 11a, and the light emitting diodes 23a and 24a of the second light projecting mechanism 23 and the third light projecting mechanism 24 are turned off. In this way, the multilayer capacitor C conveyed at a constant speed by the conveyor belt 10a is irradiated with blue light and irradiated with red light while passing through the imaging area of the first CCD camera 11a. The surface is imaged.

また、制御部12は、第2照明装置(図示せず)及び第2CCDカメラ(図示せず)を、第1照明装置21及び第1CCDカメラ11aと同様にして制御する。具体的には、前記発光受光型のセンサ14によって積層コンデンサCが検出されてから所定時間(積層コンデンサCがセンサ14の検知領域を通過後、第2CCDカメラ(図示せず)の撮像領域内の所定位置に搬送されるまでの時間)の経過後、第2照明装置(図示せず)により青色の光を照射して積層コンデンサCの裏面を第2CCDカメラ(図示せず)により撮像し、ついで、第2照明装置(図示せず)により赤色の光を照射して積層コンデンサCの裏面を第2CCDカメラ(図示せず)により撮像する。   The control unit 12 controls the second illumination device (not shown) and the second CCD camera (not shown) in the same manner as the first illumination device 21 and the first CCD camera 11a. Specifically, a predetermined time after the multilayer capacitor C is detected by the light emitting / receiving sensor 14 (after the multilayer capacitor C has passed the detection region of the sensor 14, within the imaging region of the second CCD camera (not shown)). After a lapse of time until it is transported to a predetermined position, the second illumination device (not shown) emits blue light and the back surface of the multilayer capacitor C is imaged by a second CCD camera (not shown). The second illumination device (not shown) emits red light and the back surface of the multilayer capacitor C is imaged by a second CCD camera (not shown).

前記判定処理部13は、第1CCDカメラ11aによって撮像された積層コンデンサCの表面の各画像(青色の光が照射されているときの画像と赤色の光が照射されているときの画像)と、第2CCDカメラ(図示せず)によって撮像された積層コンデンサCの裏面の各画像(青色の光が照射されているときの画像と赤色の光が照射されているときの画像)とをそれぞれ解析して良否を判定する。   The determination processing unit 13 includes images of the surface of the multilayer capacitor C captured by the first CCD camera 11a (an image when the blue light is irradiated and an image when the red light is irradiated), Analyzing each image (image when irradiated with blue light and image when irradiated with red light) on the back surface of the multilayer capacitor C imaged by a second CCD camera (not shown). Pass or fail.

具体的には、青色の光が照射されているときに撮像された画像から、クラックやキズといった、積層コンデンサCの表面又は裏面に存在する欠陥部分Kを検出し(図4参照)、赤色の光が照射されているときに撮像された画像から、積層された誘電体及び内部電極の浮き上がりといった、積層コンデンサCの内部に存在する欠陥部分K(図5参照)や、欠けといった、積層コンデンサCの形状不良を検出する。そして、不良を検出した場合には、不良品回収信号を前記制御部12に送信する。   Specifically, a defect portion K existing on the front surface or the back surface of the multilayer capacitor C such as a crack or a scratch is detected from an image captured when blue light is irradiated (see FIG. 4), and the red color is detected. A multilayer capacitor C such as a defective portion K (see FIG. 5) existing in the multilayer capacitor C, such as floating of the laminated dielectric and internal electrodes, or a chipping from an image captured when light is irradiated. Detect shape defects. When a defect is detected, a defective product collection signal is transmitted to the control unit 12.

前記不良品回収部(図示せず)は、照明部20及び撮像部11よりも搬送方向下流側で、搬送ベルト10aの上方に設けられた吸引ノズル(図示せず)を備えており、判定処理部13から送信された不良品回収信号が制御部12によって受信され、当該受信から所定時間(第1CCDカメラ11aにより表面が、第2CCDカメラ(図示せず)により裏面が撮像された積層コンデンサCが吸引ノズル(図示せず)の吸引領域に到達するまでの時間)が経過した後、作動せしめられるようになっている。そして、この作動により、前記吸引ノズル(図示せず)から不良品の積層コンデンサCが吸引,回収される。   The defective product collection unit (not shown) includes a suction nozzle (not shown) provided on the conveyance belt 10a on the downstream side in the conveyance direction with respect to the illumination unit 20 and the imaging unit 11, and a determination process. The defective product collection signal transmitted from the unit 13 is received by the control unit 12, and the multilayer capacitor C in which the front surface is imaged by the first CCD camera 11 a and the back surface by the second CCD camera (not shown) is received for a predetermined time from the reception. After a lapse of a time until a suction nozzle (not shown) reaches a suction area, the nozzle is actuated. By this operation, the defective multilayer capacitor C is sucked and collected from the suction nozzle (not shown).

前記良品回収部(図示せず)は、搬送ベルト10aの搬送方向下流端側下方に配置された良品回収ボックスからなり、当該搬送ベルト10aの搬送方向下流端側の端部から排出されて落下した積層コンデンサCを良品として回収する。   The non-defective product recovery unit (not shown) is a non-defective product recovery box disposed below the downstream end of the transport belt 10a in the transport direction, and is discharged from the end of the transport belt 10a on the downstream end side in the transport direction and dropped. Collect the multilayer capacitor C as a good product.

以上のように構成された本例の外観検査装置1によれば、供給部(図示せず)から搬送ベルト10a上に積層コンデンサCが供給され、供給された積層コンデンサCは、所定の搬送方向に搬送される。   According to the appearance inspection apparatus 1 of the present example configured as described above, the multilayer capacitor C is supplied from the supply unit (not shown) onto the transport belt 10a, and the supplied multilayer capacitor C is in a predetermined transport direction. It is conveyed to.

そして、その搬送途中では、制御部12による制御の下、第1CCDカメラ11aによって、第1照明装置21から青色の光が照射されているときと赤色の光が照射されているときの積層コンデンサCの表面が撮像されるとともに、第2CCDカメラ(図示せず)によって、第2照明装置(図示せず)から青色の光が照射されているときと赤色の光が照射されているときの積層コンデンサCの裏面が撮像される。   In the middle of the conveyance, the multilayer capacitor C when the blue light and the red light are emitted from the first illumination device 21 by the first CCD camera 11a under the control of the control unit 12 is used. The multilayer capacitor when the surface of the image sensor is imaged and when the second CCD camera (not shown) emits the blue light and the red light from the second illumination device (not shown) The back side of C is imaged.

この後、判定処理部13により、第1CCDカメラ11a及び第2CCDカメラ(図示せず)によって撮像された積層コンデンサCの表面及び裏面の各画像を基に、積層コンデンサCの外観の良否が判定され、不良と判定された場合には、制御部12による制御の下、吸引ノズル(図示せず)から不良品の積層コンデンサCが不良品回収部(図示せず)に吸引,回収され、良品と判定された場合には、良品回収部(図示せず)に回収される。   Thereafter, the determination processing unit 13 determines whether the appearance of the multilayer capacitor C is good or bad based on the images of the front and back surfaces of the multilayer capacitor C taken by the first CCD camera 11a and the second CCD camera (not shown). If it is determined as defective, under the control of the control unit 12, the defective multilayer capacitor C is sucked and collected from the suction nozzle (not shown) to the defective product collecting unit (not shown). If determined, the product is collected by a non-defective product collection unit (not shown).

このように、本例の外観検査装置1によれば、第1照明装置21及び第2照明装置(図示せず)から青色と赤色の光を積層コンデンサCに照射して各色毎に当該積層コンデンサCの表面及び裏面を撮像し、各色毎に得られた画像に基づいて良否判定を行っており、上述のように、青色と赤色の光を積層コンデンサCに向けて照射することで、一方の色の光では際立たせることができないような欠陥部分であっても、他方の色の光を照射することによって際立たせることができることから(青色の光は、クラックやキズといった、積層コンデンサCの表面に存在する欠陥部分を際立たせることができ、赤色の光は、積層された誘電体及び内部電極の浮き上がりといった、積層コンデンサCの内部に存在する欠陥部分を際立たることができることから)、より高精度な外観検査を実施することができる。   Thus, according to the appearance inspection apparatus 1 of this example, the multilayer capacitor C is irradiated with blue and red light from the first illumination device 21 and the second illumination device (not shown), and the multilayer capacitor is associated with each color. The front and back surfaces of C are imaged, and pass / fail judgment is performed based on the images obtained for each color. As described above, by irradiating the multilayer capacitor C with blue and red light, Even a defective portion that cannot be highlighted by colored light can be highlighted by irradiating the light of the other color (blue light is the surface of the multilayer capacitor C such as cracks and scratches). And the red light can stand out the defective portion existing inside the multilayer capacitor C, such as the floating of the laminated dielectric and the internal electrode. Et al), can be performed with higher precision appearance inspection.

また、青色の光を照射する発光ダイオード22aの照射光軸の傾斜角度θを15°〜35°とすることで、積層コンデンサCの表面に存在する欠陥部分をより効果的に際立たせることができるとともに、赤色の光を照射する発光ダイオード23a,24aの照射光軸の傾斜角度θ,θをそれぞれ40°〜50°及び55°〜75°とすることで、積層コンデンサCの内部に存在する欠陥部分をより効果的に際立たせることができ、また、発光ダイオード23a,24aの照射光軸と積層コンデンサCの表面との間の角度を小さくすることで、欠けといった、積層コンデンサCの形状不良を検出し易くすることができ、更に、赤色の光を照射する投光機構23,24を2つ設けることで、積層コンデンサCに照射される光の光量を多くすることができることから、これらのことによっても、より精度良く外観を検査することができる。 Further, by setting the inclination angle theta 1 of the irradiation optical axis of the light emitting diode 22a for irradiating blue light with 15 ° to 35 °, it is possible to more effectively accentuate the defective portions on the surface of the multilayer capacitor C In addition, the inclination angles θ 2 and θ 3 of the irradiation optical axes of the light emitting diodes 23a and 24a that emit red light are set to 40 ° to 50 ° and 55 ° to 75 °, respectively, so that the inside of the multilayer capacitor C can be obtained. The existing defective portion can be more effectively highlighted, and the angle between the irradiation optical axis of the light emitting diodes 23a and 24a and the surface of the multilayer capacitor C can be reduced to reduce chipping such as chipping. The shape defect can be easily detected, and furthermore, by providing two light projecting mechanisms 23 and 24 for irradiating red light, the amount of light irradiated to the multilayer capacitor C can be increased. Therefore, the appearance can be inspected with higher accuracy than these.

また、例えば、第1照明装置21及び第2照明装置(図示せず)が一つの色の光しか照射することができないとすると、積層コンデンサCに照射する光の色を変えて当該積層コンデンサCの表面及び裏面の撮像画像を取得するためには、積層コンデンサCの搬送方向に複数の検査領域を設けて各検査領域に照明装置及びCCDカメラをそれぞれ配置しなければならないが、本例では、一つの第1照明装置21及び第2照明装置(図示せず)が青色と赤色の光を照射可能であるので、検査領域は1ヶ所で良く、これにより、照明装置及びCCDカメラの配設数を減らしてコスト低減を図ることができる。   Further, for example, if the first lighting device 21 and the second lighting device (not shown) can irradiate only one color of light, the color of the light irradiating the multilayer capacitor C is changed to change the multilayer capacitor C. In order to obtain captured images of the front and back surfaces of the substrate, it is necessary to provide a plurality of inspection areas in the transport direction of the multilayer capacitor C and to arrange an illumination device and a CCD camera in each inspection area. Since one first lighting device 21 and two second lighting devices (not shown) can radiate blue and red light, only one inspection area is required, which allows the number of lighting devices and CCD cameras to be provided. This can reduce the cost.

以上、本発明の一実施形態について説明したが、本発明の採り得る具体的な態様は、何らこれに限定されるものではない。   As mentioned above, although one Embodiment of this invention was described, the specific aspect which this invention can take is not limited to this at all.

上例では、各投光機構22,23,24の各発光ダイオード22a,23a,24aを、その照射光軸と前記環状配置中心軸線との交点と、当該各発光ダイオード22a,23a,24aの先端部との間の距離が等しくなるように配置したが、これに限られるものではなく、図6に示すように、各発光ダイオード22a,23a,24aを、その環状配置径が等しくなるように配置することもできる。   In the above example, the light emitting diodes 22a, 23a, and 24a of the light projecting mechanisms 22, 23, and 24 are formed by intersecting the irradiation optical axis with the annular arrangement center axis and the tips of the light emitting diodes 22a, 23a, and 24a. However, the present invention is not limited to this, and as shown in FIG. 6, the light emitting diodes 22a, 23a, and 24a are arranged so that their annular arrangement diameters are equal. You can also

また、上例では、第1照明装置21及び第2照明装置(図示せず)が、青色と赤色の光を照射するように構成したが、これに限られるものではなく、青色と赤色に加えて更に異なる色の光を照射可能に構成したり、青色や赤色とは異なる少なくとも2つの色の光を照射可能に構成することもできる。   In the above example, the first lighting device 21 and the second lighting device (not shown) are configured to emit blue and red light. However, the present invention is not limited to this, and in addition to blue and red light. Further, it is possible to irradiate light of different colors, or to irradiate light of at least two colors different from blue and red.

また、更に、上例では、積層コンデンサCの表面及び裏面を検査するように構成したが、検査面は、表面及び裏面に限定されるものではない。   Furthermore, in the above example, the configuration is such that the front and back surfaces of the multilayer capacitor C are inspected, but the inspection surface is not limited to the front and back surfaces.

また、上例では、搬送部10を搬送ベルト10aなどから構成し、この搬送ベルト10aにより積層コンデンサCを搬送するように構成したが、搬送部10を透明なガラス製のターンテーブルなどから構成して、このターンテーブルにより積層コンデンサCを搬送するようにしても良い。   In the above example, the transport unit 10 is configured by a transport belt 10a and the like, and the multilayer capacitor C is transported by the transport belt 10a. However, the transport unit 10 is configured by a transparent glass turntable or the like. The multilayer capacitor C may be transported by this turntable.

また、上例では、第2投光機構23及び第3投光機構24の両方から積層コンデンサCに向けて赤色の光を照射するように構成したが、これに限られるものではなく、赤色の光の照射時に、第2投光機構23は点灯させず、第3投光機構24のみを点灯させるようにすることもできる。例えば、黒い検査対象物を検査する場合には、第2投光機構23及び第3投光機構24の両方を点灯させ、白い検査対象物を検査する場合には、第3投光機構24のみを点灯させるというように、検査対象物の特性に合わせて第2投光機構23を点灯させるか否かを制御し、検査対象物に向けて照射される光の光量を調整すれば、より高精度に検査することが可能となる。このように、第1投光機構22,第2投光機構23及び第3投光機構24のすべてを点灯させる(使用する)必要は無く、検査対象物の特性に応じて点灯させる投光機構22,23,24を適宜設定すると良い。   In the above example, the red light is emitted from both the second light projecting mechanism 23 and the third light projecting mechanism 24 toward the multilayer capacitor C. However, the present invention is not limited to this. It is also possible to turn on only the third light projecting mechanism 24 without lighting the second light projecting mechanism 23 at the time of light irradiation. For example, when inspecting a black inspection object, both the second light projection mechanism 23 and the third light projection mechanism 24 are turned on. When inspecting a white inspection object, only the third light projection mechanism 24 is used. If the amount of light irradiated toward the inspection object is adjusted by controlling whether or not to turn on the second light projecting mechanism 23 in accordance with the characteristics of the inspection object, It becomes possible to inspect with accuracy. As described above, it is not necessary to turn on (use) all of the first light projecting mechanism 22, the second light projecting mechanism 23, and the third light projecting mechanism 24, and the light projecting mechanism that lights the light according to the characteristics of the inspection object. 22, 23, and 24 may be set as appropriate.

また、上例では、各投光機構22,23,24を発光ダイオード22a,23a,24aから構成したが、これに限られるものではなく、光源と、一端側が光源と一定間隔を隔てて配置され、他端側が複数に分岐してその各端部が環状(放射状)に配置された光ファイバなどから構成することもできる。この場合、光源からの青色の光や赤色の光は、光ファイバの一端側から入射して当該光ファイバの各他端側に伝送され、当該各他端側から積層コンデンサCに向けて照射される。   In the above example, each of the light projecting mechanisms 22, 23, and 24 is composed of the light emitting diodes 22a, 23a, and 24a. However, the present invention is not limited to this, and the light source and one end side are arranged at a predetermined interval from the light source. The other end side can also be constituted by an optical fiber or the like in which the other end is branched into a plurality and each end is arranged in a ring shape (radially). In this case, blue light and red light from the light source enter from one end side of the optical fiber, are transmitted to the other end side of the optical fiber, and are irradiated toward the multilayer capacitor C from the other end side. The

本発明の一実施形態に係る外観検査装置の一部の概略構成を一部断面で示した正面図である。It is the front view which showed the one part schematic structure of the external appearance inspection apparatus which concerns on one Embodiment of this invention in the partial cross section. 図1に示した外観検査装置の平面図である。It is a top view of the external appearance inspection apparatus shown in FIG. 本実施形態に係る、照明装置及びCCDカメラの制御状態を示したタイミングチャートである。It is a timing chart which showed the control state of an illuminating device and a CCD camera concerning this embodiment. 積層コンデンサの欠陥例を示した説明図である。It is explanatory drawing which showed the defect example of the multilayer capacitor. 積層コンデンサの欠陥例を示した説明図である。It is explanatory drawing which showed the defect example of the multilayer capacitor. 本発明の他の実施形態に係る照明装置の概略構成を示した断面図である。It is sectional drawing which showed schematic structure of the illuminating device which concerns on other embodiment of this invention.

符号の説明Explanation of symbols

1 外観検査装置
10 搬送部
10a 搬送ベルト
11 撮像部
11a 第1CCDカメラ
12 制御部
13 判定処理部
14 発光受光型センサ
20 照明部
21 第1照明装置
22 第1投光機構
22a 発光ダイオード
23 第2投光機構
23a 発光ダイオード
24 第3投光機構
24a 発光ダイオード
25 支持部材
C 積層コンデンサ
DESCRIPTION OF SYMBOLS 1 Appearance inspection apparatus 10 Conveyance part 10a Conveyor belt 11 Imaging part 11a 1st CCD camera 12 Control part 13 Judgment processing part 14 Light emission light reception type sensor 20 Illumination part 21 1st illumination device 22 1st light projection mechanism 22a Light emitting diode 23 2nd light projection Optical mechanism 23a Light emitting diode 24 Third light projecting mechanism 24a Light emitting diode 25 Support member C Multilayer capacitor

Claims (4)

電子部品を撮像してその外観を検査する外観検査装置に設けられ、前記電子部品の撮像時にこれを照明する照明装置であって、
前記電子部品に向けて光を照射する複数の投光部を有し、該各投光部が環状に配置された投光手段を複数備え、
前記各投光手段が同軸に配置されて軸線方向に並設されるとともに、該各投光手段の内、少なくとも一つの投光手段が他の投光手段とは異なる色の光を前記投光部から前記電子部品に向けて照射するように構成されてなることを特徴とする照明装置。
Provided in an appearance inspection apparatus that images an electronic component and inspects its appearance, and an illumination device that illuminates the electronic component during imaging,
It has a plurality of light projecting units that irradiate light toward the electronic component, and includes a plurality of light projecting means in which each light projecting unit is arranged in an annular shape,
Each of the light projecting means is disposed coaxially and arranged in the axial direction, and at least one of the light projecting means emits light of a color different from that of the other light projecting means. The illumination device is configured to irradiate the electronic component from a portion.
前記各投光手段の中には、前記投光部から青色の光を前記電子部品に向けて照射する投光手段と、前記投光部から赤色の光を前記電子部品に向けて照射する投光手段とが少なくとも含まれていることを特徴とする請求項1記載の照明装置。   Each of the light projecting units includes a light projecting unit that emits blue light from the light projecting unit toward the electronic component, and a light projecting unit that emits red light from the light projecting unit toward the electronic component. The lighting device according to claim 1, further comprising at least light means. 前記各投光手段は、軸線方向に3つ並設された第1投光手段,第2投光手段及び第3投光手段からなり、
前記第1投光手段は、その軸線に対して前記投光部の照射光軸が15°〜35°傾くように配置されるとともに、青色の光を前記電子部品に向けて照射するように構成され、
前記第2投光手段は、その軸線に対して前記投光部の照射光軸が40°〜50°傾くように配置されるとともに、赤色の光を前記電子部品に向けて照射するように構成され、
前記第3投光手段は、その軸線に対して前記投光部の照射光軸が55°〜75°傾くように配置されるとともに、赤色の光を前記電子部品に向けて照射するように構成されてなることを特徴とする請求項2記載の照明装置。
Each of the light projecting means comprises a first light projecting means, a second light projecting means and a third light projecting means arranged in parallel in the axial direction.
The first light projecting unit is arranged so that an irradiation optical axis of the light projecting unit is inclined by 15 ° to 35 ° with respect to an axis thereof, and configured to irradiate blue light toward the electronic component. And
The second light projecting unit is arranged so that an irradiation optical axis of the light projecting unit is inclined by 40 ° to 50 ° with respect to an axis thereof, and configured to irradiate red light toward the electronic component. And
The third light projecting means is arranged so that an irradiation optical axis of the light projecting unit is inclined by 55 ° to 75 ° with respect to an axis thereof, and is configured to irradiate red light toward the electronic component. The lighting device according to claim 2, wherein
電子部品を撮像してその外観を検査する外観検査装置であって、
前記電子部品を所定の搬送方向に搬送する搬送機構と、
前記搬送機構により搬送されて撮像領域内を通過する電子部品の表面を撮像する撮像機構と、
前記搬送機構によって前記撮像領域内を搬送される電子部品を照明する、前記請求項1乃至3記載のいずれかの照明装置と、
前記撮像機構によって撮像された電子部品の画像を基に、該電子部品の外観の良否判定を行う判定処理部と、
前記照明装置及び撮像機構の作動を制御する制御部とを備えてなり、
前記撮像機構は、その撮像光軸が前記各投光手段の投光部の配置環内に位置するように配置され、
前記制御部は、前記各投光手段を制御して、該各投光手段の内、同じ色の光を照射する投光手段から前記電子部品に向けて光を照射するとともに、前記電子部品が前記撮像領域内を通過中に、光を照射する投光手段を切り換えて該電子部品に照射される光の色を変えるように構成され、且つ、前記撮像機構を制御して、前記電子部品に照射される光の色毎に該電子部品の表面を撮像するように構成され、
前記判定処理部は、前記電子部品に照射される光の色毎に撮像された各画像を基に良否判定を行うように構成されてなることを特徴とする外観検査装置。
An appearance inspection apparatus for imaging an electronic component and inspecting its appearance,
A transport mechanism for transporting the electronic component in a predetermined transport direction;
An imaging mechanism that images the surface of the electronic component that is transported by the transport mechanism and passes through the imaging region;
The illumination device according to any one of claims 1 to 3, which illuminates an electronic component conveyed in the imaging region by the conveyance mechanism;
A determination processing unit that determines the quality of the appearance of the electronic component based on the image of the electronic component imaged by the imaging mechanism;
A control unit for controlling the operation of the illumination device and the imaging mechanism,
The imaging mechanism is arranged such that its imaging optical axis is located within the arrangement ring of the light projecting portion of each of the light projecting means,
The control unit controls each light projecting unit to irradiate light from the light projecting unit that emits light of the same color among the light projecting units toward the electronic component. While passing through the imaging area, the light projecting means for irradiating light is switched to change the color of light irradiated to the electronic component, and the imaging mechanism is controlled to It is configured to image the surface of the electronic component for each color of irradiated light,
The appearance inspection apparatus, wherein the determination processing unit is configured to perform pass / fail determination based on each image captured for each color of light irradiated on the electronic component.
JP2005251427A 2005-08-31 2005-08-31 Illumination device and visual inspection apparatus equipped with the same Active JP4713279B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005251427A JP4713279B2 (en) 2005-08-31 2005-08-31 Illumination device and visual inspection apparatus equipped with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005251427A JP4713279B2 (en) 2005-08-31 2005-08-31 Illumination device and visual inspection apparatus equipped with the same

Publications (2)

Publication Number Publication Date
JP2007064801A true JP2007064801A (en) 2007-03-15
JP4713279B2 JP4713279B2 (en) 2011-06-29

Family

ID=37927170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005251427A Active JP4713279B2 (en) 2005-08-31 2005-08-31 Illumination device and visual inspection apparatus equipped with the same

Country Status (1)

Country Link
JP (1) JP4713279B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009008486A (en) * 2007-06-27 2009-01-15 Techno Soft Systemnics:Kk Inspection device and inspection method of laminated capacitor
JP2010101863A (en) * 2008-10-27 2010-05-06 Tdk Corp External appearance inspection apparatus
JP2010175558A (en) * 2010-04-01 2010-08-12 Daiichi Jitsugyo Viswill Co Ltd Inspection device
JP2010230514A (en) * 2009-03-27 2010-10-14 Tdk Corp Appearance-inspecting apparatus
JP2010249513A (en) * 2009-04-10 2010-11-04 Tdk Corp Visual examination device
KR20150119884A (en) * 2013-02-20 2015-10-26 다이이치지쯔교 비스위루 가부시키가이샤 Inspection device
US9838612B2 (en) 2015-07-13 2017-12-05 Test Research, Inc. Inspecting device and method for inspecting inspection target

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101931166B1 (en) 2016-12-06 2018-12-20 이승훈 Dome type lighting device

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04166711A (en) * 1990-10-30 1992-06-12 Omron Corp Surface-state observing apparatus
JPH0625713A (en) * 1992-07-13 1994-02-01 Kubota Corp Method for sintering cr-base heat-resistant alloy powder
JPH0760531A (en) * 1993-08-20 1995-03-07 Yasuharu Tokukatsu Hoop material cutter
JPH09232797A (en) * 1996-02-27 1997-09-05 Omron Corp Ic component position detecting device
JP2000088543A (en) * 1998-09-16 2000-03-31 Nec Corp Method and system for visually inspecting electronic device
JP2002071577A (en) * 2000-08-28 2002-03-08 Matsushita Electric Ind Co Ltd Visual inspection apparatus and visual inspection method
JP2003247959A (en) * 2002-02-22 2003-09-05 Omron Corp Surface observation device and optical transducer
JP2004502168A (en) * 2000-06-28 2004-01-22 テラダイン・インコーポレーテッド Illumination equipment for automatic optical inspection systems
JP2005274558A (en) * 2004-02-27 2005-10-06 Omron Corp Surface condition inspecting method, surface condition inspecting apparatus employing it, and substrate inspecting apparatus
WO2005119227A1 (en) * 2004-06-04 2005-12-15 Tokyo Seimitsu Co., Ltd. Semiconductor appearance inspecting device and illuminating method
JP2006047290A (en) * 2004-06-30 2006-02-16 Omron Corp Image generation method for board inspection, board inspecting device and illumination device for board inspection
JP2006322951A (en) * 2004-02-27 2006-11-30 Omron Corp Method and device for surface condition inspection, and device for inspecting substrate

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04166711A (en) * 1990-10-30 1992-06-12 Omron Corp Surface-state observing apparatus
JPH0625713A (en) * 1992-07-13 1994-02-01 Kubota Corp Method for sintering cr-base heat-resistant alloy powder
JPH0760531A (en) * 1993-08-20 1995-03-07 Yasuharu Tokukatsu Hoop material cutter
JPH09232797A (en) * 1996-02-27 1997-09-05 Omron Corp Ic component position detecting device
JP2000088543A (en) * 1998-09-16 2000-03-31 Nec Corp Method and system for visually inspecting electronic device
JP2004502168A (en) * 2000-06-28 2004-01-22 テラダイン・インコーポレーテッド Illumination equipment for automatic optical inspection systems
JP2002071577A (en) * 2000-08-28 2002-03-08 Matsushita Electric Ind Co Ltd Visual inspection apparatus and visual inspection method
JP2003247959A (en) * 2002-02-22 2003-09-05 Omron Corp Surface observation device and optical transducer
JP2005274558A (en) * 2004-02-27 2005-10-06 Omron Corp Surface condition inspecting method, surface condition inspecting apparatus employing it, and substrate inspecting apparatus
JP2006322951A (en) * 2004-02-27 2006-11-30 Omron Corp Method and device for surface condition inspection, and device for inspecting substrate
WO2005119227A1 (en) * 2004-06-04 2005-12-15 Tokyo Seimitsu Co., Ltd. Semiconductor appearance inspecting device and illuminating method
JP2006047290A (en) * 2004-06-30 2006-02-16 Omron Corp Image generation method for board inspection, board inspecting device and illumination device for board inspection

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009008486A (en) * 2007-06-27 2009-01-15 Techno Soft Systemnics:Kk Inspection device and inspection method of laminated capacitor
JP2010101863A (en) * 2008-10-27 2010-05-06 Tdk Corp External appearance inspection apparatus
JP2010230514A (en) * 2009-03-27 2010-10-14 Tdk Corp Appearance-inspecting apparatus
JP2010249513A (en) * 2009-04-10 2010-11-04 Tdk Corp Visual examination device
JP2010175558A (en) * 2010-04-01 2010-08-12 Daiichi Jitsugyo Viswill Co Ltd Inspection device
KR20150119884A (en) * 2013-02-20 2015-10-26 다이이치지쯔교 비스위루 가부시키가이샤 Inspection device
KR102148965B1 (en) * 2013-02-20 2020-08-28 다이이치지쯔교 비스위루 가부시키가이샤 Inspection device
US9838612B2 (en) 2015-07-13 2017-12-05 Test Research, Inc. Inspecting device and method for inspecting inspection target
TWI620929B (en) * 2015-07-13 2018-04-11 德律科技股份有限公司 Inspecting device and method for inspecting inspection target

Also Published As

Publication number Publication date
JP4713279B2 (en) 2011-06-29

Similar Documents

Publication Publication Date Title
JP4713279B2 (en) Illumination device and visual inspection apparatus equipped with the same
JP2006162427A (en) Method and device for inspecting led chip
JP2007057421A (en) Ring lighting system
KR20060053847A (en) Method for inspecting defects of glass plate and apparatus thereof
JP2009031247A (en) Article appearance inspecting apparatus and surface inspecting apparatus
CN107430076B (en) Optical inspection device and method for objects, in particular metal lids
JP2005308623A (en) Optical member inspection device
JP4493048B2 (en) Inspection device
JP4619880B2 (en) Cylindrical object appearance inspection device
JP2010107254A (en) Device and method for inspecting led chip
JP2006226724A (en) Label inspection method and label inspection device
JP2009288121A (en) Apparatus and method for inspecting lens
JP2014037977A (en) Press component inspection apparatus
TWI747365B (en) Visual inspection device
JP5726628B2 (en) Appearance inspection apparatus and appearance inspection method for transparent body bottle
JP2005345425A (en) Visual inspection device, and ultraviolet light lighting system
JP2017067630A (en) Visual checkup apparatus
JP2006244869A (en) Plasma display panel inspection device, manufacturing method of plasma display panel, and device inspection method
TWM582136U (en) Inspection module and inspection table
JP2010261837A (en) Appearance inspection apparatus and appearance inspecting optical apparatus
KR101177163B1 (en) Light source for illumination and pattern inspection apparatus using the same
JP5100371B2 (en) Foreign matter inspection method and foreign matter inspection apparatus for wafer peripheral edge
CN111458294A (en) Inspection apparatus
JP2020204470A (en) Lighting device and exterior appearance inspection device provided with the same
JP2010175558A (en) Inspection device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080730

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101209

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110128

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110223

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110324

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250