JP2016098398A - 金属表面の処理方法並びに当該方法により処理された銀被着銅及び複合金属体 - Google Patents
金属表面の処理方法並びに当該方法により処理された銀被着銅及び複合金属体 Download PDFInfo
- Publication number
- JP2016098398A JP2016098398A JP2014235893A JP2014235893A JP2016098398A JP 2016098398 A JP2016098398 A JP 2016098398A JP 2014235893 A JP2014235893 A JP 2014235893A JP 2014235893 A JP2014235893 A JP 2014235893A JP 2016098398 A JP2016098398 A JP 2016098398A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- copper
- fine particles
- compound
- alkylamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract 20
- 229910052802 copper Inorganic materials 0.000 title claims abstract 20
- 239000010949 copper Substances 0.000 title claims abstract 20
- 229910052709 silver Inorganic materials 0.000 title claims abstract 20
- 239000004332 silver Substances 0.000 title claims abstract 19
- 229910052751 metal Inorganic materials 0.000 title claims abstract 12
- 239000002184 metal Substances 0.000 title claims abstract 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims 16
- 239000002131 composite material Substances 0.000 title claims 5
- 238000000034 method Methods 0.000 title claims 5
- 150000003973 alkyl amines Chemical class 0.000 claims abstract 8
- 150000001412 amines Chemical class 0.000 claims abstract 4
- 229940100890 silver compound Drugs 0.000 claims abstract 4
- 150000003379 silver compounds Chemical class 0.000 claims abstract 4
- 238000010438 heat treatment Methods 0.000 claims abstract 3
- 238000004381 surface treatment Methods 0.000 claims abstract 2
- 239000006185 dispersion Substances 0.000 claims 3
- 239000010419 fine particle Substances 0.000 claims 2
- 229910001111 Fine metal Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000002612 dispersion medium Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 150000003378 silver Chemical group 0.000 claims 1
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims 1
- 229940071536 silver acetate Drugs 0.000 claims 1
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical compound [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 239000002244 precipitate Substances 0.000 abstract 1
- 238000003672 processing method Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Powder Metallurgy (AREA)
- Non-Insulated Conductors (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Chemically Coating (AREA)
- Conductive Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014235893A JP2016098398A (ja) | 2014-11-20 | 2014-11-20 | 金属表面の処理方法並びに当該方法により処理された銀被着銅及び複合金属体 |
| PCT/JP2015/082794 WO2016080544A1 (ja) | 2014-11-20 | 2015-11-20 | 金属表面の処理方法並びに当該方法により処理された銀被着銅及び複合金属体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014235893A JP2016098398A (ja) | 2014-11-20 | 2014-11-20 | 金属表面の処理方法並びに当該方法により処理された銀被着銅及び複合金属体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016098398A true JP2016098398A (ja) | 2016-05-30 |
| JP2016098398A5 JP2016098398A5 (enExample) | 2017-11-30 |
Family
ID=56014074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014235893A Pending JP2016098398A (ja) | 2014-11-20 | 2014-11-20 | 金属表面の処理方法並びに当該方法により処理された銀被着銅及び複合金属体 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2016098398A (enExample) |
| WO (1) | WO2016080544A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016129101A (ja) * | 2015-01-09 | 2016-07-14 | 日立化成株式会社 | 複合粒子及びその製造方法、導電性ペースト、焼結体、並びに半導体装置 |
| JP2017201052A (ja) * | 2016-05-06 | 2017-11-09 | 株式会社村田製作所 | 金属粉末の製造方法 |
| JP2022071739A (ja) * | 2020-10-28 | 2022-05-16 | 学校法人 関西大学 | 混合インク及びその製造方法、並びに、混合インクの焼結方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116219415A (zh) * | 2022-12-06 | 2023-06-06 | 东北大学 | 一种银基镀液和在铜及其合金表面镀银的方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1072673A (ja) * | 1996-04-30 | 1998-03-17 | Nippon Terupen Kagaku Kk | 金属ペースト及び金属膜の製造方法 |
| JP2008111175A (ja) * | 2006-10-31 | 2008-05-15 | Fujikura Kasei Co Ltd | 複合金属粉とその製造方法および導電性ペースト |
| JP2009024193A (ja) * | 2007-07-17 | 2009-02-05 | Nippon Shokubai Co Ltd | 金属ナノ粒子の製造方法、金属ナノ粒子、金属ナノ粒子分散体および金属被膜 |
| JP2010275638A (ja) * | 2010-07-12 | 2010-12-09 | Dowa Holdings Co Ltd | 銀被覆銅粉および導電ペースト |
-
2014
- 2014-11-20 JP JP2014235893A patent/JP2016098398A/ja active Pending
-
2015
- 2015-11-20 WO PCT/JP2015/082794 patent/WO2016080544A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1072673A (ja) * | 1996-04-30 | 1998-03-17 | Nippon Terupen Kagaku Kk | 金属ペースト及び金属膜の製造方法 |
| JP2008111175A (ja) * | 2006-10-31 | 2008-05-15 | Fujikura Kasei Co Ltd | 複合金属粉とその製造方法および導電性ペースト |
| JP2009024193A (ja) * | 2007-07-17 | 2009-02-05 | Nippon Shokubai Co Ltd | 金属ナノ粒子の製造方法、金属ナノ粒子、金属ナノ粒子分散体および金属被膜 |
| JP2010275638A (ja) * | 2010-07-12 | 2010-12-09 | Dowa Holdings Co Ltd | 銀被覆銅粉および導電ペースト |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016129101A (ja) * | 2015-01-09 | 2016-07-14 | 日立化成株式会社 | 複合粒子及びその製造方法、導電性ペースト、焼結体、並びに半導体装置 |
| JP2017201052A (ja) * | 2016-05-06 | 2017-11-09 | 株式会社村田製作所 | 金属粉末の製造方法 |
| JP2022071739A (ja) * | 2020-10-28 | 2022-05-16 | 学校法人 関西大学 | 混合インク及びその製造方法、並びに、混合インクの焼結方法 |
| JP7568891B2 (ja) | 2020-10-28 | 2024-10-17 | 学校法人 関西大学 | 混合インク及びその製造方法、並びに、混合インクの焼結方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016080544A1 (ja) | 2016-05-26 |
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