JP2016089090A5 - - Google Patents
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- Publication number
- JP2016089090A5 JP2016089090A5 JP2014227040A JP2014227040A JP2016089090A5 JP 2016089090 A5 JP2016089090 A5 JP 2016089090A5 JP 2014227040 A JP2014227040 A JP 2014227040A JP 2014227040 A JP2014227040 A JP 2014227040A JP 2016089090 A5 JP2016089090 A5 JP 2016089090A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- propylene
- composition according
- functional group
- structural unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims 17
- 239000004711 α-olefin Substances 0.000 claims 10
- 125000000524 functional group Chemical group 0.000 claims 9
- 229920000098 polyolefin Polymers 0.000 claims 9
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 9
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 9
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims 7
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive effect Effects 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 229920001187 thermosetting polymer Polymers 0.000 claims 5
- 239000012790 adhesive layer Substances 0.000 claims 3
- 229920001577 copolymer Polymers 0.000 claims 3
- 239000010410 layer Substances 0.000 claims 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims 2
- -1 aromatic vinyl compound Chemical class 0.000 claims 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 2
- 239000012787 coverlay film Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 claims 2
- 238000005160 1H NMR spectroscopy Methods 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 238000010559 graft polymerization reaction Methods 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000012766 organic filler Substances 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 150000003460 sulfonic acids Chemical class 0.000 claims 1
- 229920006337 unsaturated polyester resin Polymers 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014227040A JP6383258B2 (ja) | 2014-11-07 | 2014-11-07 | 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014227040A JP6383258B2 (ja) | 2014-11-07 | 2014-11-07 | 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016089090A JP2016089090A (ja) | 2016-05-23 |
| JP2016089090A5 true JP2016089090A5 (cg-RX-API-DMAC7.html) | 2017-08-24 |
| JP6383258B2 JP6383258B2 (ja) | 2018-08-29 |
Family
ID=56018792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014227040A Active JP6383258B2 (ja) | 2014-11-07 | 2014-11-07 | 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6383258B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102479228B1 (ko) | 2016-12-22 | 2022-12-21 | 도아고세이가부시키가이샤 | 접착제 조성물 그리고 이것을 사용한 커버레이 필름, 본딩 시트, 동장 적층판 및 전자파 실드재 |
| TWI637405B (zh) * | 2017-03-15 | 2018-10-01 | 臻鼎科技股份有限公司 | 低介電樹脂組合物及應用其的膠片及電路板 |
| US11739239B2 (en) | 2017-07-11 | 2023-08-29 | Sunstar Engineering Inc. | Thermally crosslinkable composition |
| US20210009865A1 (en) * | 2018-03-07 | 2021-01-14 | Toagosei Co., Ltd. | Adhesive composition, and adhesive layer-equipped layered product using same |
| CN112469794B (zh) * | 2018-08-02 | 2023-02-17 | 出光兴产株式会社 | 聚丙烯系粘接剂和其制造方法 |
| JPWO2021256416A1 (cg-RX-API-DMAC7.html) * | 2020-06-16 | 2021-12-23 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2281859B1 (en) * | 2004-12-21 | 2014-03-26 | Dow Global Technologies LLC | Polypropylene-based adhesive compounds |
| JP5539257B2 (ja) * | 2011-04-22 | 2014-07-02 | 三井化学株式会社 | オレフィン系重合体、該オレフィン系重合体の製造方法、オレフィン系重合体を用いてなる光硬化性組成物、硬化物の製造方法及び硬化物 |
-
2014
- 2014-11-07 JP JP2014227040A patent/JP6383258B2/ja active Active
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