JP2016080553A - Manufacturing method of probe pin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively form a projection at an upper end of a probe pin made of a hard material.SOLUTION: A wire 30 for probe pins with a diameter of 50 μm is prepared which is made of a hard material like rhodium, and is cut into a length equivalent to two probe pins. When the center of the wire 30 for probe pins is viewed as projection portion side, an insulation coating 31 like parylene is formed on predetermined parts to be insulated which respectively extend from lower sides of the projection portions to positions slightly inward from both sides of the wire. Next, a portion of the wire 30 for probe pins, which extends from the center towards both ends thereof and has a length obtained by adding together each of heights of the projection portions, is sandwiched and pressed perpendicularly to an axial direction using a pinching jig 40 so as to be crushed and deformed so that a cross section of the wire has a slender and substantially rectangular shape. In this case, a deformed portion 32 is prepared so that a long side of the cross section thereof is longer than the diameter of the wire 30 for probe pins by about 17 to 26 μm. Then, the wire 30 for probe pins is divided into two probe pins 1A by cutting the center of the deformed portion 32 perpendicularly to the axial direction using a blade 50.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing a probe pin, and more particularly to a method for manufacturing a probe pin used in a vertical probe card.

In a semiconductor manufacturing line, the electrical characteristics of a large number of LSI chips formed on a wafer are measured by interposing a probe card having a large number of probe pins between the electrode pads of the LSI chip and a measuring device. The probe card has a large number of probe pins that come into contact with an object to be inspected and a disk-like probe card substrate for electrically connecting each probe pin to the outside.
In the vertical probe card, the probe pins 1 are arranged in the vertical direction as shown in FIG. 1, and are positioned by a needle guide plate 2 for positioning the needle base and a needle tip guide plate 3 for positioning the needle tip. Has been. The tip portion of the probe pin 1 can be in contact with the inspection object, and the upper end portion on the needle base side can be in contact with the conductive portion 5 formed on the lower surface of the probe card substrate 4. The needle base guide plate 2 is arranged in parallel with a certain distance from the probe card substrate 4, and the needle tip guide plate 3 is arranged in parallel with the needle base guide plate 2 at a certain distance. ing. The needle base guide plate 2 and the needle tip guide plate 3 are attached to the probe card substrate 4 by a bracket 6. For each probe pin 1, guide holes 7 and 8 are formed in the needle base guide plate 2 and the needle tip guide plate 3 one by one, and these guide holes 7 and 8 are located on the same vertical line. Yes. The probe pin 1 is formed slightly narrower than the guide holes 7 and 8 and can slide up and down in the guide holes 7 and 8. A disc-shaped protrusion 9 is formed at the upper end of the probe pin 1 on the needle base side so that the probe pin 1 does not fall out of the needle base guide plate 2. The distance between the lower surface of the probe card substrate 4 and the upper surface of the needle guide plate 2 is slightly larger than the sum of the height of the protrusion 9 and the thickness of the conductive portion 5 on the lower surface of the probe card substrate 4. When the probe pin 1 is in a released state where it is not in contact with the object to be inspected, the tip of the probe pin 1 protrudes below the needle tip guide plate 3 by a certain length. The probe pin 1 is located from the lower side of the projection 9 to the vicinity of the needle tip guide plate 3 (a position N / 5 away from the needle tip guide plate 3 where N is the distance between the needle guide plate 2 and the needle tip guide plate 3). Up to) The insulating coating 10 is coated to ensure insulation between adjacent probe pins.

  At the time of inspection, the table 21 on which the wafer 20 is sucked and fixed rises from the lower standby position with respect to the probe pins 1 (FIG. 2A). When the tip of the probe pin 1 comes into contact with the electrode pad 22 of the LSI chip on the wafer 20, the probe pin 1 slides upward in the guide holes 7 and 8 of the needle base guide plate 2 and the needle tip guide plate 3, The protruding portion 9 at the upper end of the probe pin 1 contacts the conductive portion 5 on the lower surface of the probe card substrate 4 (FIG. 2B). The table 21 stops rising when it is overdriven by about 100 μm from the contact start position, the needle pin guide plate 2 and the probe tip guide plate 3 of the probe pin 1 are slightly bent, and the tip of the probe pin 1 is in a certain contact. The electrode pad 22 is brought into contact with the pressure (FIG. 2C). In this state, the electrode pad 22 is connected to a measuring device (not shown) via the probe pin 1 and the probe card substrate 4, and various electrical characteristics are measured.

  By the way, it is preferable to use a rare metal material such as rhodium or rhodium alloy having excellent oxidation resistance in addition to electrical characteristics such as contact resistance as the material of the vertical probe 1. It was difficult to form a protrusion on the upper end of the plate.

JP 2013-192754 A

  The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide a method of manufacturing a probe pin that can efficiently form a protrusion on the upper end portion of a hard probe pin.

In invention of Claim 1,
A method of manufacturing a probe pin having a protrusion on the upper end,
Of the two wire lengths for the probe pin, the length portion of the probe pin projections aligned from the center to both sides is clamped vertically in the axial direction so that the cross-sectional shape of the wire becomes elongated. Transformed into
Cutting the center of the deformed portion viewed in the axial direction perpendicularly to the axial direction and separating it into two probe pins;
It is characterized by.
In invention of Claim 2,
A method of manufacturing a probe pin having a protrusion on the upper end,
Centering the length of one wire from the tip of the probe pin wire that is longer than two probe pins at the center, the length of one probe pin projection on each side is sandwiched vertically in the axial direction. And deform so that the cross-sectional shape of the wire becomes elongated,
The center of the deformed portion viewed in the axial direction is cut perpendicularly to the axial direction, and two probe wires are cut perpendicularly to the axial direction at two lengths from the tip. Separating into pins,
It is characterized by.
In invention of Claim 3,
A method of manufacturing a probe pin having a protrusion on the upper end,
Of the four wire lengths for the probe pin, the length of the probe pin protrusions on both sides is perpendicular to the axial direction, centered on the point separated by one from each end. Deformed so that the cross-sectional shape of the wire becomes elongated by pinching to
Cutting the center of the deformed portion viewed in the axial direction and the center of the probe pin wire rod having a length of four pieces perpendicular to the axial direction, and separating the probe pin into four probe pins;
It is characterized by.
In invention of Claim 4,
A method of manufacturing a probe pin having a protrusion on the upper end,
Of the probe pin wire having a length of 2K (where K is an integer of 3 or more), one portion separated from one end, (1 + 2) portions separated, (1 + 2K−) 2) Centering on the separated part, the length part of one probe pin projection on each side is clamped perpendicularly in the axial direction so that the cross-sectional shape of the wire is elongated,
The center of the deformed part viewed in the axial direction, the part separated from the one end side of the wire for the probe pin, the part separated from the one end side, the part separated from the one end side, (2K-2) parts separated Cutting the part perpendicular to the axial direction and separating it into 2K probe pins;
It is characterized by.
In invention of Claim 5,
In the pre-process or post-process of the clamping process, an insulating film is formed on the part to be insulated in the probe pin wire,
It is characterized by.
In invention of Claim 6,
In the subsequent step of the cutting process, an insulation film is formed on the portion to be insulated in the probe pin,
It is characterized by.

  According to the present invention, the probe pin wire is deformed by being clamped perpendicular to the axial direction, and the center of the deformed portion is cut, so even a hard material such as rhodium is relatively easy. A protrusion at the upper end of the probe pin can be formed. Moreover, it is possible to efficiently create protrusions for two probe pins only by performing a pinching process and a cutting process once for one point in the middle of the probe pin wire.

It is the block diagram which abbreviate | omitted partially showing an example of the conventional vertical probe card. It is operation | movement explanatory drawing of the probe pin of FIG. It is explanatory drawing of the manufacturing method of the probe pin which concerns on 1st Example of this invention (Example 1). It is explanatory drawing of the manufacturing method of the probe pin which concerns on the 2nd Example of this invention (Example 2).

  Hereinafter, the best mode of the present invention will be described based on examples.

A method for manufacturing a probe pin according to a first embodiment of the present invention will be described with reference to FIG.
First, a probe pin wire 30 made of a hard material such as rhodium or a rhodium alloy and cut into a length 2L (for example, 2L = 23 mm) of two probe pins with a wire diameter of 50 μm is prepared (FIG. 3A). )reference). A predetermined insulation target portion (FIG. 1) from the lower side of the projecting portion to the inside of both ends when the center of the two probe pin wires 30 is viewed as the projecting portion (see reference numeral 9 in FIG. 1). The insulating film 31 is formed by coating an insulating material such as parylene to a thickness of 1 to 2 μm (see the portion 10 of FIG. 3).
Next, in the probe pin wire 30, a pinch jig perpendicular to the axial direction is set to a length 2H (for example, 2H = 1.0 mm) obtained by combining the heights of the protrusions one by one from the center to both sides. 40 is used to squeeze and deform so that the cross-sectional shape of the wire becomes an elongated, substantially rectangular shape. At this time, the long side of the cross-sectional shape of the deformed portion 32 is set to be about 17 to 26 μm longer than the wire diameter of the probe pin wire 30 (see FIGS. 3C, 3D, and 3D when viewed from the side). (See (D ′)).
Next, the center of the portion 32 subjected to the pinching deformation is cut with a blade 50 perpendicular to the axial direction and separated into two probe pins 1A (see FIGS. 3E and 3F). The cutting process at this time is preferably performed in a direction in which the thickness of the deformed portion 32 by the clamping pressure is small (see FIG. 3F).

  According to this embodiment, since the probe pin wire 30 is clamped and deformed perpendicularly to the axial direction and the center of the deformed portion 32 is cut, it is made of a material having high hardness such as rhodium or rhodium alloy. However, the protrusion 9A at the upper end of the probe pin can be formed relatively easily. In addition, the projecting portions 9A for two probe pins can be efficiently created by performing only one clamping process and one cutting process for one point in the middle of the probe pin wire 30.

  As shown by the broken line 30A in FIG. 3, when the probe pin wire is longer than 2L, the insulating coating is applied to the portion of the length of two from the tip (lower end in FIG. 3) in the same manner as in the above embodiment. After forming 31, the cross-sectional shape of the wire is elongated by pinching the length portion of one probe pin projection on both sides centered on one side from the tip perpendicularly in the axial direction. The center of the deformed portion 32 as viewed in the axial direction is cut perpendicularly to the axial direction, and the probe pin wire 30A has a length corresponding to two from the end to the axial direction by the blade 51. Cut vertically and separate into two.

A method for manufacturing a probe pin according to a second embodiment of the present invention will be described with reference to FIG. In the first embodiment, an example in which a probe wire having a length of two probe pins is used is shown. In the second embodiment, an example in which a wire having a length of four is used.
First, a probe pin wire rod 300 made of a material such as rhodium or a rhodium alloy and cut to a length of 4L (for example, 4L = 46 mm) with a wire diameter of 50 μm is prepared (FIG. 4A). reference). When the four probe pin wires 300 are assumed to face the probe pin protrusions at locations one by one away from both ends, a predetermined distance from the lower side of the protrusions to the inside of the probe pin tip slightly inside. An insulating film 31 is formed by coating the insulating target portion with an insulating material such as parylene to a thickness of 1 to 2 μm (see FIG. 4B).
Next, a portion having a length of 2H (for example, 2H = 1.0 mm) obtained by combining one protrusion on each side of the probe pin wire rod 300 on both sides is centered on a portion separated from both ends of the probe pin wire rod 300 by one. A pinch jig 40 is used for clamping in a direction perpendicular to the axial direction, and the wire is crushed and deformed so that the cross-sectional shape of the wire becomes an elongated, substantially rectangular shape. At this time, the long side of the cross-sectional shape of the deformed portion 32 is set to be 17 to 26 μm longer than the wire diameter of the probe pin wire 300 (see FIGS. 4C and 4D).
Next, the center of the portion 32 subjected to the pinching deformation and the center of the probe pin wire rod 300 are cut perpendicularly to the axial direction with the blade 50 and separated into four probe pins 1A (FIG. 4E). ) And (F)).

  Also in this embodiment, the probe pin wire rod 300 is clamped and deformed perpendicularly to the axial direction, and the center of the deformed portion 32 is cut, so that it is a material having high hardness such as rhodium or rhodium alloy. However, the protrusion 9A at the upper end of the probe pin can be formed relatively easily. Moreover, four probe pins 1A with protrusions 9A can be obtained by simply crushing two points in the middle of the probe pin wire 300 and cutting the center of the pinched portion and the center of the probe pin wire 300. Can be created efficiently.

In addition, it can also manufacture using the wire for probe pins which has the length of 2K probe pins (however, K is an integer greater than or equal to 3). In this case, the protruding portion of the probe pin faces the part separated from one end side of the probe pin wire, the part separated by (1 + 2), and the part separated by (1 + 2K-2). Insulating material such as parylene is coated to a predetermined insulation target portion from the lower side of the projecting portion to the inside of the probe pin tip to a thickness of 1 to 2 μm. Next, a point separated from one end of the probe pin wire, (1 + 2) separated points,..., (1 + 2K-2) separated points, with probe pins on both sides. A length portion of each protrusion is combined so as to be perpendicular to the axial direction and deformed so that the cross-sectional shape of the wire becomes elongated. Lastly, the center of the deformed part viewed in the axial direction, the part separated from the one end side of the probe pin wire, the part separated from the one end side, four parts from the one end side, (2K-2) What is necessary is just to isolate | separate into 2K probe pins with a projection part by cut | disconnecting the isolate | separated location perpendicularly | vertically with respect to an axial direction.
Further, in each of the above-described embodiments and modifications, an insulating film is formed before the pinching process with the pinch jig, but before the cutting process with the blade after the pinching process with the pinch jig. An insulating film may be formed, or an insulating film may be formed on the probe pin after cutting with a blade.

  The present invention is applicable to a probe pin used for a vertical probe card.

DESCRIPTION OF SYMBOLS 1A Probe pin 9A Protrusion part 30,30A, 300 Probe pin wire material 31 Insulation film 32 Deformation place 40 Pinch jig 50, 51 Blade

Claims (6)

A method of manufacturing a probe pin having a protrusion on the upper end,
The cross-sectional shape of the wire is elongated by pressing the length portion of the probe pin wire material corresponding to one probe pin protruding from the center to both sides of the probe pin wire length in the axial direction. Deformed as
Cutting the center of the deformed portion viewed in the axial direction perpendicularly to the axial direction and separating it into two probe pins;
A method of manufacturing a probe pin characterized by the above. A method of manufacturing a probe pin having a protrusion on the upper end,
Centering the length of one wire from the tip of the probe pin wire that is longer than two probe pins at the center, the length of one probe pin projection on each side is sandwiched vertically in the axial direction. And deform so that the cross-sectional shape of the wire becomes elongated,
The center of the deformed portion viewed in the axial direction is cut perpendicularly to the axial direction, and two probe wires are cut perpendicularly to the axial direction at two lengths from the tip. Separating into pins,
A method of manufacturing a probe pin characterized by the above. A method of manufacturing a probe pin having a protrusion on the upper end,
The length of the length of the probe wire that is 4 probe pins long in the axial direction, with one probe pin protrusion on each side, centered on the point separated by 1 from each end. Deformation so that the cross-sectional shape of the wire becomes elongated by pinching vertically
Cutting the center of the deformed portion viewed in the axial direction and the center of the probe pin wire rod having a length of four pieces perpendicular to the axial direction, and separating the probe pin into four probe pins;
A method of manufacturing a probe pin characterized by the above. A method of manufacturing a probe pin having a protrusion on the upper end,
Of the probe pin wire with a length of 2K probe pins (where K is an integer greater than or equal to 3), one part is separated from one end, (1 + 2) part is separated, (1 + 2K) -2) With the separated part as the center, the length portion of the probe pin projections on both sides is clamped perpendicularly in the axial direction and deformed so that the cross-sectional shape of the wire becomes elongated,
The center of the deformed part viewed in the axial direction, the part separated from the one end side of the wire for the probe pin, the part separated from the one end side, the part separated from the one end side, (2K-2) parts separated Cutting the part perpendicular to the axial direction and separating it into 2K probe pins;
A method of manufacturing a probe pin characterized by the above. In the pre-process or post-process of the clamping process, an insulating film is formed on the part to be insulated in the probe pin wire,
The method for manufacturing a probe pin according to any one of claims 1 to 4. In the subsequent step of the cutting process, an insulation film is formed on the portion to be insulated in the probe pin,
The method for manufacturing a probe pin according to any one of claims 1 to 4.

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