KR100555612B1 - Board cutting type probe and method thereby - Google Patents

Abstract

Disclosed is a plate cut-out probe formed by bending a conductive plate and then bending the conductive plate.

The plate cutaway probe of the present invention comprises a plate-shaped body portion made of a conductive material and a cutout portion formed by bending at a predetermined angle to cross each other after cutting the body portion, thereby manufacturing a plate cutaway probe of the present invention. The scanning part of the plate-shaped body portion of the conductive material and the other edge surface of the conductive material is scanned and cut inwardly to form an incision alternately, or a recess shape and an inverted recess shape are formed on the surface of the body portion. The laser beam is scanned and cut in a shape of a) to alternately form cutouts spaced at predetermined intervals and bend at a predetermined angle.

Therefore, it is easy to cope with fine pitch spacing and various types of pad array shapes of highly integrated semiconductor devices, and it is possible to solve the problems of the MEMS process.

Probe, incision, laser, bending, testing

Description

Sheet cutting type probe and method for manufacturing same

1A is a perspective view of a plate cutaway probe according to a first embodiment of the present invention, and FIG. 1B is a perspective view of a plate cutaway probe according to a second embodiment of the present invention.

2A is a perspective view of a plate cutaway probe according to a third embodiment of the present invention, and FIG. 2B is a perspective view of a plate cutaway probe according to a fourth embodiment of the present invention.

3A is a perspective view of a plate cutaway probe according to a fifth embodiment of the present invention, and FIG. 3B is a perspective view of a plate cutaway probe according to a sixth embodiment of the present invention.

4 is a process chart for explaining a method for manufacturing a plate cut-out probe according to the first and second embodiments of the present invention.

5 is a flowchart illustrating a method of manufacturing a plate cutaway probe according to a third embodiment to a sixth embodiment of the present invention.

6A and 6B are cross-sectional views illustrating a state in which a plate cutaway probe according to the present invention comes into contact with a ball type electrode pad.

7A and 7B are cross-sectional views illustrating a state in which a plate cutaway probe according to the present invention contacts an electrode pad having a flat top surface.

8 is a cross-sectional view illustrating a probe card having a plate cutaway probe according to the present invention.

<Description of the symbols for the main parts of the drawings>

Body: 10, 20, 33, 40, 60, 70, 90, 100

Incision: 12, 16, 22, 26, 30, 34, 35, 42, 46, 50, 62, 66, 72, 76, 80, 92, 94, 102, 104

Contacts: 14,18,24,28,32,36,3844,48,5264,68,74,78,82,96,98,106,108

The present invention relates to a plate cut-out probe and a method of manufacturing the same, and more particularly, to a plate cut-out probe and a method of manufacturing the same is formed by cutting a conductive plate of a predetermined size, then bent at a predetermined angle.

In general, semiconductor devices, such as 256MDRAM and 1GDRAM, are implemented on a semiconductor substrate, that is, by a wafer processing process such as an oxidation process, a diffusion process, an ion implantation process, a photolithography process, and a metal process.

After performing the semiconductor device manufacturing process as described above, a probing test is performed on each chip implemented on the semiconductor substrate to select a normal chip and an abnormal chip, and packaging only the selected normal chip. Done.

In addition, the packaged semiconductor product is removed by performing a burn-in process under test conditions such as the worst temperature and voltage to eliminate the shipment of the degraded semiconductor product at an early stage.

In this probing test, after the test apparatus applies a predetermined electrical signal through a probe of a probe card in contact with the electrode pad of each chip implemented on the semiconductor substrate, the test apparatus receives the corresponding electrical signal again. Each chip implemented on the semiconductor substrate is tested for normal and abnormality.

In addition, a probe card for testing a wafer, that is, a semiconductor chip in the state thus completed, includes a printed circuit board having a circuit, a reinforcing plate provided at the center of the upper surface of the printed circuit board, and a probe contacting the electrode pad of the wafer. Also provided with a needle connected to the circuit of the printed circuit board and the bottom of the printed circuit board is formed of a fixed plate for holding and holding the probe and the insulating material for fixing the probe to the fixed plate.

In this case, the predetermined portion of the probe tip is bent downward in a horizontal direction, that is, a predetermined angle in the electrode pad direction of each chip implemented on the wafer.

The probe card configured as described above moves up and down by a jig so that the probe is in contact with the center of the electrode pad to check for abnormality of the semiconductor chip.

However, such a needle type probe has a problem in that the predetermined portion is bent downward in the horizontal direction, that is, a predetermined angle in the electrode pad direction, so that it is difficult to cope with the highly integrated semiconductor device.

That is, the probe mounted on the probe card has a predetermined portion bent downward in a horizontal direction, that is, a predetermined angle in the direction of the electrode pad, so that it is impossible to arrange the probe on the fixed plate of the probe card with high density. There was a problem that could not be coped.

In addition, the needle-type probe has a problem in that contact is difficult due to the sliding of the probe in the ball type electrode pad that is mainly used in recent years, that is, the ball type electrode pad in which the upper surface protrudes upward.

Recently, a probe using MEMS (Micro Electro Mechanical System) technology, which mainly uses a semiconductor manufacturing process such as a photolithography process and an etching process, has been developed and used to easily cope with small pitch intervals of highly integrated semiconductor devices. have.

However, the probe using MEMS technology has many advantages such as responsiveness to small pitch intervals and mass productivity of semiconductor devices. However, the cost of manufacturing probes due to the purchase of expensive semiconductor equipment and the operation of a clean room is increased. It raises the disadvantage which raises.

In particular, the probe using the MEMS technology also had a problem in that it is not easy to respond to the ball-type electrode pads in the same way as the needle-type probe.

An object of the present invention is to provide a plate cut-out probe and a method of manufacturing the same that can reduce the manufacturing cost.

Another object of the present invention is to provide a plate cut type probe and a method of manufacturing the same, which are easy to cope with a small pitch interval of a semiconductor device.

Still another object of the present invention is to provide a plate cutaway probe and a method of manufacturing the same, which can solve various problems occurring in the MEMS process.                         

Still another object of the present invention is to provide a plate cutaway probe and a method of manufacturing the same, which can be in precise contact with a ball type electrode pad.

Plate cut-out probe according to the present invention for achieving the above object, the body portion of a conductive material consisting of a square plate; And a cutout portion formed by cutting a predetermined length in the main body portion inward direction from the one side edge surface and the other edge surface of the main body portion at the mutually displaced position, and then bending a predetermined angle to cross each other in the main body portion inward direction. It is characterized by.

In this case, at least two cutouts may be provided, and a contact portion may be further provided at an end portion of the cutout by bending a predetermined portion of the cutout.

The width, length, bending angle, and bending angle of the contact body may be equal to each other, and the bending angle of the cutout may be 30 ° to 60 °.

In addition, the body portion may be made of any one material of copper, tungsten, copper alloy and tungsten alloy, and the cut portion may be rounded.

In addition, another plate cut-out probe according to the present invention, the main body portion of a conductive material consisting of a plate; And a cutout portion formed by alternately cutting the surface of the main body portion at predetermined intervals in a recess shape and an inverted recess shape, and being bent at a predetermined angle to cross each other.

Here, the body portion may be formed in a rectangular plate or a disk shape, the cut portion may be rounded.

In addition, the method for manufacturing a plate cutaway probe according to the present invention comprises the steps of preparing a body portion of a conductive material consisting of a square plate; Forming an incision by cutting a predetermined length by scanning a laser beam inwardly of the main body part from one edge surface of the main body portion and the other edge surface of the displaced position; And bending the cut portions at a predetermined angle to intersect each other.

A femto second laser may be used as the laser beam, and the contact portion may be formed at the end of the cut portion by bending a predetermined portion of the cut portion at an angle.

In addition, the step of rounding the cut may be further performed while bending at a predetermined angle to cross each cut.

In addition, another method for manufacturing a plate cutaway probe according to the present invention comprises the steps of preparing a body portion of a conductive material; Forming an incision by cutting the surface of the main body part by a predetermined interval alternately in a dichroic (c) shape and an inverse diyza (c) shape using a laser beam; And bending the cut portions at a predetermined angle to intersect each other.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A is a perspective view of a plate cutaway probe according to a first embodiment of the present invention, and FIG. 1B is a perspective view of a plate cutaway probe according to a second embodiment of the present invention.

The plate cutaway probe according to the first embodiment of the present invention is made of copper, tungsten, copper alloy, and tungsten alloy material which has a predetermined ductility and elasticity and has conductivity as shown in FIG. 1A. And a main body portion 10 made of a very thin rectangular plate shape having several micrometers (µm).

Then, after cutting by using a laser beam in a predetermined width and length in the main body portion 10 inward direction from one side of the main body portion 10, 30 ° to 60 °, preferably 45 ° rounding rounding A first cutout 12 is provided.

In addition, after cutting with a laser beam at a predetermined width and length from the other edge surface of the main body portion 10 at the position shifted from the cutting point of the first cutout portion 12 to the inside of the main body portion 10, a predetermined angle is obtained. A bent and rounded second cutout 16 is provided.

In this case, the first cutout 12 and the second cutout 16 are provided to face each other and cross each other, and the width, length and bending of the first cutout 12 and the second cutout 16 are provided. The angles are the same.

In addition, the first contact portion 14 and the second contact portion 18 formed by bending each end of the first cutout portion 12 and the second cutout portion 16 in parallel with the upper surface of the main body portion 10 are provided, respectively. The bending angles of the first contact portion 14 and the second contact portion 18 are the same.

In addition, in the sheet cutaway probe according to the second exemplary embodiment of the present invention, as illustrated in FIG. 1B, the first cutout part 22 and the second cutout part having the first contact part 24 and the second contact part 28 are provided. A third cutout 30 having a third contact portion 32 formed on one side of the cutout 26 by the same method as in the first embodiment is further provided.

In this case, the third cutout 30 having the third contact portion 32 may include the first cutout 22 and the second cutout including the first contact portion 24 and the second contact portion 28 of the first embodiment. It is produced in the same structure by the same manufacturing method as the part 26.

 2A is a perspective view of a plate cutaway probe according to a third embodiment of the present invention, and FIG. 2B is a perspective view of a plate cutaway probe according to a fourth embodiment of the present invention.

The plate cutaway probe according to the third embodiment of the present invention is made of copper, tungsten, copper alloy, and tungsten alloy material which has a predetermined ductility and elastic force and has conductivity as shown in FIG. 2A. And a main body portion 33 made of a rectangular plate shape having a very thin thickness of several micrometers (µm).

In addition, a first cutout portion 34 formed by cutting using a laser beam apparatus in the shape of a depression (c) is provided so that a cutout portion may be formed on an upper center surface of the main body portion 33, and the first cutout portion is provided. A second cutout part 35 is formed by cutting using a laser beam device in a reversed-shaped (c) shape so that a cutout part may be formed on the lower central surface of the main body part 33 spaced apart from the 34. .

At this time, the first cutout portion 34 and the second cutout portion 35 are rounded and rounded by 30 ° to 60 °, preferably 45 ° inwardly of the body part 33, and the cutout 34, The width, length and bending angle of 35) are the same.

In addition, a first contact portion 36 formed by bending an end portion of the first cutout portion 34 in parallel with an upper surface of the main body portion 33 is provided, and an end portion of the second cutout portion 35 is provided in the main body portion 33. A second contact portion 38 formed by bending parallel to the upper surface is provided.

At this time, the bending angles of the first contact portion 36 and the second contact portion 38 are the same.

In addition, in the sheet cutaway probe according to the fourth exemplary embodiment of the present invention, as illustrated in FIG. 2B, the first cutout part 42 and the second cutout part having the first contact part 44 and the second contact part 48 are provided. A third cutout 50 having a third contact part 52 formed on one side of the cutout 46 by the same method as in the third embodiment is further provided.

In this case, the third cutout 50 having the third contact portion 52 may include the first cutout 42 and the second cutout including the first contact portion 44 and the second contact portion 48 of the third embodiment. It is produced in the same structure by the same manufacturing method as the part 46.

3A is a perspective view of a plate cutaway probe according to a fifth embodiment of the present invention, and FIG. 3B is a perspective view of a plate cutaway probe according to a sixth embodiment of the present invention.

In the sheet cutaway probe according to the fifth exemplary embodiment, the first cutout 66 having the first contact portion 68 and the second cutout portion 62 having the second contact portion 64 are formed. The method and the structure thereof are the same as in the above-described third embodiment, but the main body 60 has a disc shape.

Therefore, in the plate cutaway probe of the fifth embodiment, the main body portion 60 is formed in a disk shape, so that it is easy to attach the probe card having a cylindrical connection portion to the space converter.

In addition, the plate cutaway probe according to the sixth embodiment of the present invention includes a first cutout 72 having a first contact portion 74 and a second cutout 76 having a second contact portion 78. And the method of forming the third cutout 80 having the third contact portion 82 and the structure thereof are the same as those of the fourth embodiment described above, but the main body portion 70 has a disc shape.

Therefore, in the plate cutaway probe of the sixth embodiment, since the main body portion 70 has a disc shape, it is easy to attach the probe card having the cylindrical connection portion to the space converter.

In addition, the length from one end portion of the sheet cut-out probe to the other end portion of the plate cut-out probe according to the present invention as described above may be accommodated in the test point, that is, the pad of the semiconductor device. To be smaller than the pad size.

4 is a process chart for explaining a method for manufacturing a plate cut-out probe according to the first and second embodiments of the present invention.

The method for manufacturing a plate cutaway probe according to the first and second embodiments of the present invention, as shown in FIG. 4, has a predetermined ductility and elasticity and has conductivity, copper, tungsten, A main body 90 made of a copper alloy and a tungsten alloy material is prepared. At this time, the body portion 90 has a very thin thickness of several micrometers (μm) in the shape of a square plate.

Next, a first cutout 92 is formed by making a cut in a predetermined width and length in the inner side of the main body 90 at one edge of the plate-shaped main body 90 and forming the first cutout 92. The second cut-out portion 94 is formed by making a cut in a predetermined width and length in the inward direction from the other edge of the main body portion 90 at a position shifted from the cut-off point of.

In this case, the widths X1 and X2 and the lengths Y1 and Y2 of the first cutout 92 and the second cutout 94 are cut to be the same, and the cut of the plate-shaped main body 90 is performed by laser. This is done using a beam.

In more detail with respect to the cutting of the body portion 90 using the laser equipment, after placing the body portion 90 on the movable table of the laser equipment, by applying a laser beam to the body portion 90, the body portion 90 ), And the laser beam may use a femto second laser device capable of precision processing, and the laser beam generated by the femto second laser device may have a pulse of 10 ^-14 to 10 ^-16 sec. pulses, preferably ^10-15 SEC.

 Subsequently, the first cutout 92 is bent by 30 ° to 60 °, preferably 45 °, and then the end of the first cutout 92 is bent in parallel with the upper surface of the main body 90 so that the first cutout 92 is bent. The contact 96 is formed.

Finally, the second cutout 94 is also bent in the same manner as the first cutout 92, that is, 30 ° to 60 °, preferably 45 °, and then the end of the first cutout 92 is The second contact portion 98 is formed by bending parallel to the upper surface of the main body portion 90.

In this case, the first cutout 92 and the second cutout 94 cross each other.

5 is a process chart for explaining a method for manufacturing a plate cutaway probe according to a second embodiment of the present invention.

The method of manufacturing a plate cutaway probe according to the third to sixth embodiments of the present invention, as shown in FIG. 5, has a predetermined ductility and elasticity and has conductivity, copper, tungsten, A main body 100 made of a copper alloy and a tungsten alloy material is prepared.

At this time, the main body portion 100 is formed in a plate shape having a very thin thickness of several micrometers (μm) as a rectangular shape, in another embodiment the main body portion 100 may be formed in a circular shape.

Next, the upper center surface of the main body portion 100 is cut in a recess shape (c) to form a first cutout portion 102, and the main body portion at a position spaced apart from the first cutout portion 102 by a predetermined interval. The lower center surface of the 100 is cut in the shape of an inverted recess (c) to form the second cutout 104.

In this case, the widths X3 and X4 and the lengths Y3 and Y4 of the first cutout 102 and the second cutout 104 are cut to be the same, and the cutting of the main body 100 is performed as described above. Using the same femto second laser device.

Subsequently, the first cutout 102 is bent by 30 ° to 60 °, preferably 45 °, and then the end of the first cutout 102 is bent in parallel with the upper surface of the main body 100 to obtain the first cutout 102. Form a contact 106.

Finally, the second cutout 104 is also bent in the same manner as the first cutout 102, that is, 30 ° to 60 °, preferably 45 °, and then the end of the second cutout 104 is The second contact portion 108 is formed by bending parallel to the upper surface of the main body portion 100.

6A and 6B are cross-sectional views illustrating a state in which a plate cutaway probe according to the present invention contacts a ball type electrode pad, and FIGS. 7A and 7B illustrate an electrode having a flat top surface according to the present invention. It is sectional drawing for demonstrating the state which contacts a pad.

Plate cut-out probe according to the present invention, as shown in Figures 6a and 7a is fixed to the lower surface of the test equipment structure (not shown), such as a space expander of the probe card is fixed to the ball type of the upper surface protruding upwards The electrode pad 120 or the upper surface is vertically lowered by a predetermined physical force F in the direction of the flat electrode pad 130.

Next, as shown in FIGS. 6B and 7B, the probe descends and presses the electrode pads 120 and 130 having a ball type or a flat top surface, so that the contact portions 116 and 118 of the probe move to the electrode pads 120 and 130. The incisions 112 and 114 are inflated to the outside and are opened. That is, the contact parts 116 and 118 slide a predetermined distance to contact the electrode pads 120 and 130 in a shape that surrounds the electrode pads 120 and 130. Done.

Then, when the probe is raised, the open cut 112, 114 is restored to its original position by its elastic force.

8 is a cross-sectional view illustrating a probe card having a plate cutaway probe according to the present invention.

A probe card having a plate cutaway probe according to the present invention includes a printed circuit board 140 having a through hole (not numbered) connected to a multilayer internal circuit, as shown in FIG. A plurality of pogo pins 148 of elastic material are inserted into the through holes of 140 to protrude downward.

At this time, the pogo pin 148 is provided with an elastic body such as a spring (Spring) so that a predetermined clearance is generated up and down to adjust the vertical gap.

In addition, the pogo pin 148 inserted into the through-hole of the printed circuit board 140 and the connection pad 152 on the space converter 146 having the multilayer internal circuit 150 are connected by soldering or the like. It is.

In addition, the upper reinforcement plate 142 and the lower reinforcement plate 144 are provided at the upper and lower portions of the printed circuit board 140 and the space converter 146 connected by the pogo pin 148 and fastened by bolts (not numbered). As a result, the printed circuit board 140 and the space converter 146 are fixed.

In addition, the plate cutaway probe 160 according to the present invention is provided below the space transformer 146 by a connecting means (not shown) using a material such as an epoxy resin.

At this time, the space transducer 146 is plate 160 probe according to the present invention is attached to the space transducer 146 vertically attached to the probe 160 to be extremely tightly arranged to correspond to the small pitch interval of the semiconductor device ) Is electrically connected to the printed circuit board 140 that is installed in a relatively wide array.

In addition, the probe 160, the space converter 146 having the multilayer internal circuit 150, the pogo pin 148, and the internal circuits of the printed circuit board 140 are electrically connected to each other.

 According to the present invention, by attaching vertically to the space converter of the probe card, it is easy to cope with the fine pitch spacing of recently integrated semiconductor devices, and it is easy to cope with various types of pad array shapes. .

In more detail, the space between the probe and the probe can be extremely tightly attached to the space transducer of the probe card so as to correspond to the fine pitch of the highly integrated semiconductor device.

In particular, the electrode pad array shape of the recent semiconductor device is easy to be deformed into various shapes such as an area array, out of a line on center (LOC) and a lead on two end (LOT). There is an effect that can be responded.

In addition, the probe according to the present invention has an effect that can solve all the problems of the MEMS process, such as an increase in the maintenance cost of the manufacturing equipment of the MEMS process.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and modifications belong to the appended claims.

Claims (23)

A main body portion made of a conductive material having a plate shape; A predetermined length is cut in each of the main body part in one side edge surface and the other edge surface of the main body part in a displaced position, and then bent at a predetermined angle to cross each other in the main body part inward direction, and contact with a ball type electrode pad An incision to be used; And And a contact portion which is bent at an end portion of the cut portion at a predetermined angle to be flat at the end portion of the cut portion and is used in contact with an electrode pad having a flat top surface. A main body; A cutout projecting downward from the main body to be used in contact with a ball type electrode pad; And And a contact portion extending from the end of the cut-out portion so that an upper surface thereof is in contact with the flat electrode pad. The plate cutaway probe according to claim 1 or 2, wherein at least two cutouts are provided. 4. The plate cutaway probe of claim 3, wherein a width, a length, a bending angle, and a bending angle of the contact body are the same. 5. The plate cutaway probe according to claim 4, wherein the bending angle of the cutout portion is 30 ° to 60 °. The plate cutaway probe according to claim 1 or 2, wherein the main body is made of any one material of copper, tungsten, copper alloy, and tungsten alloy. The plate cutaway probe according to claim 1 or 2, wherein the cutout is rounded. A main body portion of a plate-like conductive material; And An incision portion formed by alternately cutting the surface of the main body portion in a recess shape and an inverted recess shape in a predetermined interval, and bent at a predetermined angle to cross each other; Plate cutaway probe characterized in that it comprises a. The plate cutaway probe of claim 8, wherein at least two cutouts are provided. 10. The plate cutaway probe according to claim 9, wherein a contact portion formed by bending a predetermined portion of the cutout portion at a predetermined angle is further provided at an end portion of the cutout portion. The plate cutaway probe according to claim 10, wherein the width, length, bending angle, and bending angle of the contact body are the same. 12. The plate cutaway probe according to claim 11, wherein the bending angle of the cutout portion is 30 ° to 60 °. 9. The plate cutaway probe according to claim 8, wherein the main body is made of any one of copper, tungsten, copper alloy, and tungsten alloy. 9. The plate cutaway probe according to claim 8, wherein the main body is formed in a rectangular or disc shape. 9. The plate cutaway probe according to claim 8, wherein the cutout is rounded.  Preparing a main body of a conductive material formed in a rectangular plate shape; Forming an incision by cutting a predetermined length by scanning a laser beam inwardly of the main body part from one edge surface of the main body portion and the other edge surface of the displaced position; And Bending the cutouts at a predetermined angle to intersect each other; Method of manufacturing a plate cutaway probe comprising a. The method of claim 16, wherein a femto second laser is used as the laser beam. 17. The method of claim 16, further comprising forming a contact portion at an end portion of the cut portion by bending a predetermined portion of the cut portion at a predetermined angle. 17. The method of claim 16, further comprising rounding the cutout while bending the cutout at a predetermined angle to cross each other. Preparing a main body of a conductive material; Forming an incision by cutting the surface of the main body part by a predetermined interval alternately in a dichroic (c) shape and an inverse diyza (c) shape using a laser beam; And Bending the cut portions at a predetermined angle to intersect with each other; Method of manufacturing a plate cutaway probe comprising a. 21. The method of claim 20, wherein a femto second laser is used as the laser beam. 21. The method of claim 20, further comprising forming a contact portion at an end portion of the cut portion by bending a predetermined portion of the cut portion at a predetermined angle. 21. The method of claim 20, further comprising rounding the cutout while bending the cutout at a predetermined angle to intersect each other.

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