JP2016066607A5

JP2016066607A5 - Peeling method and light emitting device

Info

Publication number: JP2016066607A5
Application number: JP2015181422A
Authority: JP
Filing date: 2015-09-15
Publication date: 2018-10-25

Claims

A first step of forming a peeling layer over a first substrate,
A second step of forming a layer to be peeled before Symbol peeling layer,
A front SL layer to be peeled and the second substrate, bonded by using an adhesive layer, and a third step of curing the adhesive layer,
A fourth step you divided part of the pre-Symbol peeling layer and the layer to be peeled overlapping with the adhesive layer,
A fifth step of separating the before and Symbol first substrate said layer to be peeled, and
The force for separating the first substrate and the layer to be peeled in the fifth step is greater than or equal to the force required for separating the first substrate and the layer to be peeled,
The force required for separating the peeled layer and the first substrate, the more force required to cause interfacial failure between the adhesive layer cured by the layer to be peeled the third step A peeling method characterized by being small.

In claim 1,
A peeling method characterized in that a force required to cause interface fracture between the peelable layer and the adhesive layer cured in the third step is 0.14 N / 25 mm or more.

In claim 1 or 2,
A peeling method, wherein a force required to cause cohesive failure of the adhesive layer cured in the third step is 0.14 N / 25 mm or more.

In any one of Claims 1 thru | or 3,
It said fifth step with a force separating the peeled layer and the first substrate is peeled wherein the at 0.10 N / 25 mm or less.

A first flexible substrate, a second flexible substrate, a first adhesive layer, a second adhesive layer, a first insulating layer, and a first functional layer;
The first adhesive layer is located between the first flexible substrate and the first insulating layer,
The second adhesive layer is located between the second flexible substrate and the first functional layer,
The first adhesive layer and the second adhesive layer have portions that overlap each other via the first insulating layer and the first functional layer,
The first functional layer has a light emitting element,
The force required to cause interface fracture between the second adhesive layer and the first functional layer or between the second adhesive layer and the second flexible substrate is 0. A light-emitting device characterized by being 14 N / 25 mm or more.

In claim 5,
A light emitting device characterized in that a force required to cause cohesive failure of the second adhesive layer is 0.14 N / 25 mm or more.

First flexible substrate, second flexible substrate, first adhesive layer, second adhesive layer, third adhesive layer, first insulating layer, second insulating layer, first function A layer, and a second functional layer,
The first adhesive layer is located between the first flexible substrate and the first insulating layer,
The second adhesive layer is located between the second flexible substrate and the second insulating layer;
The third adhesive layer is located between the first functional layer and the second functional layer,
The first adhesive layer and the third adhesive layer have portions that overlap each other via the first insulating layer and the first functional layer,
The second adhesive layer and the third adhesive layer have portions that overlap each other via the second insulating layer and the second functional layer,
The first functional layer has a light emitting element,
The second functional layer has a colored layer,
The force required to cause interface breakdown between the third adhesive layer and the first functional layer or between the third adhesive layer and the second functional layer is 0.14 N / 25 mm or more A light emitting device characterized by the above .

In claim 7,
A light emitting device characterized in that a force required to cause cohesive failure of the third adhesive layer is 0.14 N / 25 mm or more.