JP2016066607A - Exfoliation method, light-emitting device, module and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve yield in an exfoliation step and to provide a light-emitting device or the like which improves adhesion of layers and is unlikely to be destroyed.SOLUTION: An exfoliation method includes the steps of: forming an exfoliation layer on a first substrate; forming an exfoliated layer on the exfoliation layer; overlapping an adhesive layer on the exfoliation layer and the exfoliated layer; curing the adhesive layer; forming a starting point of exfoliation by removing a part of the exfoliated layer that is overlapped with the exfoliation layer and the adhesion layer; and separating the first substrate and the exfoliated layer. A force separating the first substrate and the exfoliated layer is equal to or more than a force required for separating the first substrate and the exfoliated layer. The force required for separating the first substrate and the exfoliated layer is smaller than a force required for generating interface destruction between the exfoliated layer and the adhesive layer that is cured in the third step.SELECTED DRAWING: Figure 1

Description

One embodiment of the present invention relates to a peeling method, a method for manufacturing a device including a peeling step, a light-emitting device, an input / output device, a module, and an electronic device.

Note that one embodiment of the present invention is not limited to the above technical field. As a technical field of one embodiment of the present invention, a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, an electronic device, a lighting device, an input device (eg, a touch sensor), an input / output device (eg, a touch panel) ), A driving method thereof, or a manufacturing method thereof can be given as an example.

In recent years, development of a flexible device in which functional elements such as a semiconductor element, a display element, and a light emitting element are provided over a flexible substrate (hereinafter also referred to as a flexible substrate) has been advanced. Typical examples of the flexible device include various semiconductor circuits having semiconductor elements such as transistors in addition to lighting devices and image display devices.

As a method for manufacturing a device using a flexible substrate, a functional element such as a thin film transistor or an organic EL (Electroluminescence) element is manufactured on a manufacturing substrate such as a glass substrate or a quartz substrate, and then the functional element is formed on the flexible substrate. A technology for transposing has been developed. In this method, a step of peeling a layer including a functional element from a manufacturing substrate (also referred to as a peeling step) is necessary.

For example, in the peeling technique using laser ablation disclosed in Patent Document 1, first, a separation layer made of amorphous silicon or the like is provided on a substrate, and a layer to be peeled made of a thin film element is provided on the separation layer. The layer to be peeled is adhered to the transfer body by the adhesive layer. Then, the separation layer is ablated by irradiation with laser light to cause separation of the separation layer.

Patent Document 2 describes a technique for performing peeling with a physical force such as a human hand. In Patent Document 2, a metal layer is formed between a substrate and an oxide layer, and peeling is performed at the interface between the oxide layer and the metal layer by utilizing weak bonding at the interface between the oxide layer and the metal layer. As a result, the layer to be peeled and the substrate are separated.

Japanese Patent Laid-Open No. 10-125931 JP 2003-174153 A

In the peeling step, if the peelability at the peeling interface is inferior, a large stress is applied to the peeled layer, and cracks may enter the peeled layer or the functional element may be destroyed.

In addition, if the layer to be peeled has a portion with low adhesion, the portion with low adhesion becomes easy to peel off in the peeling step, and film peeling occurs in the layer to be peeled off, making peeling at a desired interface difficult. There is a risk of problems such as becoming.

An object of one embodiment of the present invention is to improve yield in the separation step. An object of one embodiment of the present invention is to provide a light-emitting device in which each layer has high adhesion and is not easily broken.

Another object of one embodiment of the present invention is to improve yield in a manufacturing process of a device such as a light-emitting device, a display device, a semiconductor device, an input / output device, an electronic device, or a lighting device. In particular, an object is to improve the yield in a manufacturing process of a light-emitting device such as a light-emitting device that is lightweight, thin, or flexible.

Another object of one embodiment of the present invention is to provide a peeling method with high peelability. Another object of one embodiment of the present invention is to provide a method for manufacturing a highly productive device.

Another object of one embodiment of the present invention is to provide a highly reliable light-emitting device or the like. Another object of one embodiment of the present invention is to provide a light-emitting device or the like with high light extraction efficiency.

Note that the description of these problems does not disturb the existence of other problems. Note that one embodiment of the present invention does not have to solve all of these problems. It should be noted that other issues can be extracted from the description, drawings, and claims.

One embodiment of the present invention is a peeling method including first to fifth steps, in which the first step includes a step of forming a peeling layer over the first substrate, and the second step includes: Forming a layer to be peeled on the peeling layer, and the third step includes a step of overlaying the adhesive layer on the peeling layer and the layer to be peeled, and a step of curing the adhesive layer, The step includes a step of removing a part of the layer to be peeled which overlaps with the peeling layer and the adhesive layer to form a peeling starting point, and the fifth step is a step of separating the first substrate and the layer to be peeled off. The force for separating the first substrate and the layer to be peeled in the fifth step is to separate the first substrate and the layer to be peeled after forming the separation starting point in the fourth step. The force required to separate the first substrate and the layer to be peeled after forming the starting point of peeling in the fourth step is hard in the layer to be peeled and the third step. Less than the force required to cause interfacial failure between the adhesive layer, a release method.

In the above method, the force required to cause interface fracture between the peeled layer and the adhesive layer cured in the third step is preferably 0.14 N / 25 mm or more.

In the above method, the force required to cause cohesive failure of the adhesive layer cured in the third step is preferably 0.14 N / 25 mm or more.

In the above method, the force for separating the first substrate and the layer to be peeled in the fifth step is preferably 0.10 N / 25 mm or less.

Alternatively, according to one embodiment of the present invention, the first flexible substrate, the second flexible substrate, the first adhesive layer, the second adhesive layer, the first insulating layer, and the first functional layer are provided. And the first adhesive layer is located between the first flexible substrate and the first insulating layer, and the second adhesive layer is formed between the second flexible substrate and the first functional layer. The first adhesive layer and the second adhesive layer are located between each other and overlap with each other with the first insulating layer and the first functional layer interposed therebetween. The first functional layer has a light emitting element. However, the force required to cause interface fracture between the second adhesive layer and the first functional layer or between the second adhesive layer and the second flexible substrate is 0.14 N / 25 mm or more is a light emitting device.

In the above configuration, the force required to cause cohesive failure of the second adhesive layer is preferably 0.14 N / 25 mm or more.

Alternatively, according to one embodiment of the present invention, the first flexible substrate, the second flexible substrate, the first adhesive layer, the second adhesive layer, the third adhesive layer, the first insulating layer, Two insulating layers, a first functional layer, and a second functional layer, wherein the first adhesive layer is located between the first flexible substrate and the first insulating layer, The adhesive layer is located between the second flexible substrate and the second insulating layer, and the third adhesive layer is located between the first functional layer and the second functional layer. The adhesive layer and the third adhesive layer have portions that overlap each other via the first insulating layer and the first functional layer, and the second adhesive layer and the third adhesive layer include the second insulating layer and the third insulating layer. The first functional layer includes a light emitting element, the second functional layer includes a colored layer, the third adhesive layer, and the first adhesive layer. Interfacial fracture between functional layers or between the third adhesive layer and the second functional layer The force required to cause is 0.14 N / 25 mm or more, a light emitting device.

In the above configuration, the force required to cause the cohesive failure of the third adhesive layer is preferably 0.14 N / 25 mm or more.

A device such as a display device, a semiconductor device, or an input / output device to which any of the above structures is applied is also one embodiment of the present invention. Each of these devices has different functional elements included in the functional layer. For example, the display device of one embodiment of the present invention includes a display element as a functional element. The semiconductor device of one embodiment of the present invention includes a semiconductor element as a functional element. The input / output device of one embodiment of the present invention includes a light-emitting element or a display element as a functional element, and a touch sensor.

Another embodiment of the present invention is a light-emitting device, a display device, a semiconductor device, or an input / output device to which any of the above structures is applied, a flexible printed circuit (hereinafter referred to as an FPC) or A module such as a module to which a connector such as a TCP (Tape Carrier Package) is attached or a module in which an integrated circuit (IC) is mounted by a COG (Chip On Glass) method or the like.

Another embodiment of the present invention is an electronic device including the above module and an antenna, a battery, a housing, a speaker, a microphone, an operation switch, or an operation button.

According to one embodiment of the present invention, yield in the separation step can be improved. According to one embodiment of the present invention, a light-emitting device that has high adhesion between layers and is not easily broken can be provided.

Alternatively, according to one embodiment of the present invention, yield in a manufacturing process of a light-emitting device, a display device, a semiconductor device, an input / output device, an electronic device, a lighting device, or the like can be improved. In particular, the yield in the manufacturing process of a light-emitting device such as a light-emitting device that is lightweight, thin, or flexible can be improved.

Alternatively, according to one embodiment of the present invention, a peeling method with high peelability can be provided. Alternatively, according to one embodiment of the present invention, a method for manufacturing a highly productive device can be provided.

Alternatively, according to one embodiment of the present invention, a highly reliable light-emitting device or the like can be provided. Alternatively, according to one embodiment of the present invention, a light-emitting device with high light extraction efficiency can be provided.

Note that the description of these effects does not disturb the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. It should be noted that other effects can be extracted from the description, drawings, and claims.

The figure which shows an example of the peeling method. The figure which shows an example of the peeling method. The figure which shows an example of the peeling method. The figure which shows an example of the peeling method. The figure which shows an example of the peeling method. The figure which shows an example of a peeling method and an example of a peeling test method. FIG. 6 illustrates an example of a light-emitting device. FIG. 6 illustrates an example of a light-emitting device. FIG. 6 illustrates an example of a light-emitting device. The figure which shows an example of an input / output device. The figure which shows an example of an input / output device. The figure which shows an example of an input / output device. The figure which shows an example of an input / output device. FIG. 6 illustrates an example of an electronic device and a lighting device. FIG. 14 illustrates an example of an electronic device. FIG. 14 illustrates an example of an electronic device.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below.

Note that in structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated. In addition, in the case where the same function is indicated, the hatch pattern is the same, and there is a case where no reference numeral is given.

In addition, the position, size, range, and the like of each component illustrated in the drawings may not represent the actual position, size, range, or the like for easy understanding. Therefore, the disclosed invention is not necessarily limited to the position, size, range, or the like disclosed in the drawings.

Note that the terms “film” and “layer” can be interchanged with each other depending on circumstances or circumstances. For example, the term “conductive layer” can be changed to the term “conductive film”. Alternatively, for example, the term “insulating film” can be changed to the term “insulating layer”.

Moreover, in this specification etc., "separate A and B" may peel B from A, and may peel A from B. Further, A and B may be separated using a method other than peeling.

(Embodiment 1)
In this embodiment, a peeling method of one embodiment of the present invention will be described with reference to drawings.

One embodiment of the present invention is a first step of forming a release layer over a first substrate, a second step of forming a release layer over the release layer, and an adhesive layer overlaid on the release layer and the release layer. A third step of curing the adhesive layer, a fourth step of removing a part of the peeling layer and the layer to be peeled that overlaps with the adhesive layer, and forming a starting point of peeling, and a first substrate and the layer to be peeled The force for separating the first substrate and the layer to be peeled in the fifth step separates the first substrate and the layer to be peeled after the fourth step. The force required for separating the first substrate and the layer to be peeled after the fourth step is an interface between the layer to be peeled and the adhesive layer cured in the third step. This is a peeling method that is smaller than the force required to cause destruction.

From the start of separation to the end of separation, it is preferable that the first substrate and the layer to be peeled can be separated with a force smaller than the force required to cause the interface fracture, since the separation yield is particularly high. However, in one embodiment of the present invention, the force required to separate the first substrate and the layer to be peeled is cured in the third layer and the layer to be peeled at some timing from the start of separation to the end of separation. It may be greater than the force required to cause interfacial fracture with the adhesive layer.

In the peeling method of one embodiment of the present invention, the adhesive layer is cured in the third step so that a large force is required to cause interface fracture between the peeled layer and the adhesive layer. The adhesiveness of the adhesive layer is sufficiently increased. Next, a separation starting point is formed in the fourth step so that the force required to separate the first substrate and the layer to be separated is reduced. Thereby, the force required to separate the first substrate and the layer to be peeled can be made smaller than the force required to cause interface breakdown between the layer to be peeled and the adhesive layer. Then, in the fifth step, the first substrate and the layer to be peeled are separated, so that peeling can be performed with a high yield.

In the present specification and the like, the interface failure between A and B means that at least part of the interface between A and B is broken, and the interface between A and B Overall destruction may occur. Interfacial fracture is also referred to as adhesive fracture, and means that at least a part of the interface between the adhesive layer and the adherend layer is destroyed.

In one embodiment of the present invention, the force required to cause interface fracture between the layer to be peeled and the adhesive layer cured in the third step is 0.14 N / 25 mm or more (also referred to as 0.056 N / 10 mm or more). It is preferable that

In one embodiment of the present invention, the force required to cause cohesive failure of the adhesive layer cured in the third step is preferably 0.14 N / 25 mm or more.

In this specification and the like, the phrase “A cohesive failure occurs” means that it is sufficient that at least a portion of A breaks. The cohesive failure means that at least a part of the cured adhesive layer is destroyed.

Alternatively, in the above method, the force required to separate the first substrate and the layer to be peeled after the fourth step is preferably 0.10 N / 25 mm or less. In one embodiment of the present invention, the force required to separate the first substrate and the layer to be peeled may be 0.10 N / 25 mm or less at some timing from the start of separation to the end of separation. In order to separate one substrate from the layer to be peeled, a portion requiring a force greater than 0.10 N / 25 mm may be included.

Alternatively, in the above method, the force for separating the first substrate and the layer to be peeled in the fifth step is preferably 0.10 N / 25 mm or less. In one embodiment of the present invention, the force for separating the first substrate and the layer to be peeled may be 0.10 N / 25 mm or less at some timing from the start of separation to the end of separation, and 0.10 N / The first substrate and the layer to be peeled may be separated by a force larger than 25 mm.

An example of a method for evaluating force required to separate the first substrate and the layer to be peeled in the peeling method of one embodiment of the present invention will be described with reference to FIG.

Below, the evaluation method of the force required in order to peel a layer to be peeled from the 1st substrate is shown. For the evaluation, a jig as shown in FIG. 6A can be used. The jig illustrated in FIG. 6A includes a plurality of guide rollers 154 and a support roller 153.

First, a first step of forming a peeling layer 156 on the first substrate 155, a second step of forming a peelable layer (not shown) on the peeling layer 156, an adhesive layer on the peeling layer 156 and the peelable layer A third step of stacking (not shown) and curing the adhesive layer, a fourth step of removing a part of the peeling layer 156 and a part of the layer to be peeled that overlaps the adhesive layer, and forming a starting point of peeling (not shown) I do. Thereafter, the following evaluation is performed.

A tape 151 is attached to a layer 150 (a layer to be peeled off or an adhesive layer) including a layer to be peeled formed on the first substrate 155 in advance, and a part of the end portion is peeled off. Next, the first substrate 155 is attached to a jig so that the tape 151 is hooked on the support roller 153 so that the layer 150 including the tape 151 and the layer to be peeled is perpendicular to the first substrate 155. . Here, the tape 151 is pulled in the vertical direction with respect to the first substrate 155 (speed: 20 mm / min), and when the layer 150 including the layer to be peeled is peeled from the first substrate 155, the pulling force in the vertical direction is applied. By measuring, the force required for peeling can be measured.

Here, while peeling is in progress, the first substrate 155 travels in the surface direction along the guide roller 154 with the peeling layer 156 exposed. The support roller 153 and the guide roller 154 are rotatably provided in order to eliminate the influence of friction while the layer 150 including the layer to be peeled and the first substrate 155 are traveling.

The test method can refer to the pressure-sensitive adhesive tape / pressure-sensitive sheet test method based on Japanese Industrial Standard (JIS) standard number JIS Z0237. Evaluation can be performed using various testing machines capable of performing the above test. The sample size can be, for example, 126 mm × 25 mm.

In the following, two examples of the peeling method of one embodiment of the present invention are illustrated. The peeling method 1 has a peeling process once, and the peeling method 2 has a peeling process twice.

<Peeling method 1>
First, the separation layer 103 is formed over the manufacturing substrate 101, and the separation layer 105 is formed over the separation layer 103 (FIG. 1A). Here, an example in which an island-shaped release layer is formed is shown, but the present invention is not limited thereto. Alternatively, the layer to be peeled 105 may be formed in an island shape. In this step, when the manufacturing substrate 101 and the layer to be peeled 105 are separated, separation occurs in the interface between the manufacturing substrate 101 and the peeling layer 103, the interface between the peeling layer 103 and the layer to be peeled 105, or the peeling layer 103. The right material. In this embodiment, the case where separation occurs at the interface between the separation layer 105 and the separation layer 103 is illustrated; however, the present invention is not limited to this depending on the combination of materials used for the separation layer 103 and the separation layer 105.

As the manufacturing substrate 101, a substrate having heat resistance that can withstand at least a processing temperature during the manufacturing process is used. As the manufacturing substrate 101, for example, a glass substrate, a quartz substrate, a sapphire substrate, a semiconductor substrate, a ceramic substrate, a metal substrate, a resin substrate, a plastic substrate, or the like can be used.

Note that a large glass substrate is preferably used as the formation substrate 101 in order to improve mass productivity. For example, 3rd generation (550 mm × 650 mm), 3.5th generation (600 mm × 720 mm, or 620 mm × 750 mm), 4th generation (680 mm × 880 mm, or 730 mm × 920 mm), 5th generation (1100 mm × 1300 mm), 6th generation (1500 mm × 1850 mm), 7th generation (1870 mm × 2200 mm), 8th generation (2200 mm × 2400 mm), 9th generation (2400 mm × 2800 mm, 2450 mm × 3050 mm), 10th generation (2950 mm × 3400 mm), etc. A glass substrate or a glass substrate larger than this can be used.

In the case where a glass substrate is used as the manufacturing substrate 101, an insulating film such as a silicon oxide film, a silicon oxynitride film, a silicon nitride film, or a silicon nitride oxide film is formed as a base film between the manufacturing substrate 101 and the separation layer 103. Then, contamination from the glass substrate can be prevented, which is preferable.

The separation layer 103 is formed using an element selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, and silicon, an alloy material containing the element, or the element It can form using the compound material etc. which contain. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline. Alternatively, a metal oxide such as aluminum oxide, gallium oxide, zinc oxide, titanium dioxide, indium oxide, indium tin oxide, indium zinc oxide, or In—Ga—Zn oxide may be used. It is preferable to use a refractory metal material such as tungsten, titanium, or molybdenum for the separation layer 103 because the degree of freedom in the formation process of the separation layer 105 is increased.

The peeling layer 103 can be formed by, for example, a sputtering method, a plasma CVD method, a coating method (including a spin coating method, a droplet discharge method, a dispensing method, or the like), a printing method, or the like. The thickness of the peeling layer 103 is, for example, 1 nm to 200 nm, preferably 10 nm to 100 nm.

In the case where the separation layer 103 has a single-layer structure, a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum is preferably formed. Alternatively, a layer containing tungsten oxide or oxynitride, a layer containing molybdenum oxide or oxynitride, or a layer containing an oxide or oxynitride of a mixture of tungsten and molybdenum may be formed. Note that the mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

In the case where the stacked layer structure including a layer containing tungsten and a layer containing tungsten oxide is formed as the separation layer 103, a layer containing tungsten is formed, and an insulating film formed of an oxide is formed thereover. Thus, the fact that a layer containing an oxide of tungsten is formed at the interface between the tungsten layer and the insulating film may be utilized. Further, the surface of the layer containing tungsten is subjected to thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N ₂ O) plasma treatment, treatment with a solution having strong oxidizing power such as ozone water, and the like to form tungsten oxide. An included layer may be formed. Plasma treatment and heat treatment may be performed in oxygen, nitrogen, nitrous oxide alone, or a mixed gas atmosphere of the gas and other gases. By changing the surface state of the release layer 103 by the plasma treatment or the heat treatment, the adhesion between the release layer 103 and an insulating layer to be formed later can be controlled.

Note that in the case where peeling is possible at the interface between the manufacturing substrate and the layer to be peeled, the peeling layer is not necessarily provided. For example, glass is used as a manufacturing substrate, and an organic resin such as polyimide, polyester, polyolefin, polyamide, polycarbonate, or acrylic is formed in contact with the glass. Next, the adhesion between the manufacturing substrate and the organic resin is improved by performing laser irradiation or heat treatment. Then, an insulating film, a transistor, or the like is formed over the organic resin. Then, laser irradiation can be performed at an energy density higher than that of the previous laser irradiation, or heat treatment can be performed at a temperature higher than that of the previous heat treatment, so that separation can be performed at the interface between the formation substrate and the organic resin. Further, at the time of peeling, the liquid may penetrate into the interface between the manufacturing substrate and the organic resin to be separated.

In this method, since an insulating film, a transistor, or the like is formed over an organic resin with low heat resistance, it is difficult to apply a high temperature to the substrate in the manufacturing process. Here, a transistor including an oxide semiconductor can be favorably formed over an organic resin because a high-temperature manufacturing process is not essential.

Note that the organic resin may be used as a substrate included in the device, or the organic resin may be removed and another substrate may be bonded to the exposed surface of the layer to be peeled using an adhesive.

Alternatively, a metal layer may be provided between the manufacturing substrate and the organic resin, and current may be supplied to the metal layer to heat the metal layer, and separation may be performed at the interface between the metal layer and the organic resin.

There is no particular limitation on the layer formed as the layer to be peeled 105. In this embodiment, an insulating layer in contact with the separation layer 103 is formed as the separation layer 105. Further, a functional element may be formed over the insulating layer.

The insulating layer over the separation layer 103 is preferably formed as a single layer or a multilayer using a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon nitride oxide film, or the like.

The insulating layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. For example, by forming the insulating layer at a film formation temperature of 250 ° C. to 400 ° C. by a plasma CVD method. It can be made into a dense and very high moisture-proof film. Note that the thickness of the insulating layer is preferably 10 nm to 3000 nm, and more preferably 200 nm to 1500 nm.

Next, the peelable layer 105 and the substrate 109 are attached to each other using the adhesive layer 107, and the adhesive layer 107 is cured (FIG. 1B). FIG. 1B corresponds to a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. 1C is a plan view seen from the substrate 109 (not shown) side.

Here, when the manufacturing substrate 101 and the substrate 109 are bonded to each other by the adhesive layer 107 without overlapping with the separation layer 103 as in a region surrounded by a dotted line in the cross-sectional view of FIG. Depending on the degree of adhesion between the substrate 101 and the substrate 109 (or the adhesion between the layer on the manufacturing substrate 101 and the layer on the substrate 109 that are in contact with the adhesive layer 111), the yield of the subsequent separation step may be reduced. 2A shows a plan view viewed from the substrate 109 side and a cross-sectional view taken along the alternate long and short dash line B1-B2 in the plan view (the substrate 109 is not shown in the plan view).

On the other hand, when the interface failure between the peeled layer 105 and the adhesive layer 107 is likely to occur or the adhesive layer 107 is liable to cause cohesive failure, the manufacturing substrate 101 and the peelable layer 105 are bonded at a desired interface. It may be difficult to peel off. Therefore, the adhesion between the layer to be peeled 105 and the adhesive layer 107 needs to be sufficiently high. The adhesive layer 107 needs to be sufficiently cured.

In one embodiment of the present invention, when the substrate 109 on the side where the release layer 103 is not provided can be cut with a blade or the like, a cut can be made in the substrate 109, the adhesive layer 107, and the peeled layer 105 (FIG. 2 ( (See arrow P2 in B)). For example, the cutting can be made with a sharp blade such as a cutter. Note that FIG. 2B shows a plan view viewed from the substrate 109 side and a cross-sectional view taken along the alternate long and short dash line B3-B4 in the plan view (the substrate 109 is not shown in the plan view). Here, an example is shown in which a starting point of peeling is formed in a solid line shape by cutting in a frame shape in a region where the adhesive layer 107 and the peeling layer 103 overlap. According to this method, even when the adhesion between the manufacturing substrate 101 and the substrate 109 is high, the separation layer 103 and the layer to be separated 105 can be easily separated (FIG. 2C). , It is possible to suppress a decrease in the yield of the peeling step.

Alternatively, in one embodiment of the present invention, the adhesive layer 107 is disposed so as to overlap with the separation layer 103 and the layer to be separated 105. 1C, the end portion of the adhesive layer 107 is preferably not located outside the end portion of the release layer 103. In other words, the adhesive layer 107 is preferably located inside the release layer 103 or the end portion of the adhesive layer 107 and the end portion of the release layer 103 are preferably overlapped.

For the adhesive layer 107, for example, various curable adhesives such as a photo-curable adhesive such as an ultraviolet curable adhesive, a reactive curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenol resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like. In particular, a material with low moisture permeability such as an epoxy resin is preferable.

Further, the resin may contain a desiccant. For example, a substance that adsorbs moisture by chemical adsorption, such as an alkaline earth metal oxide (such as calcium oxide or barium oxide), can be used. Alternatively, a substance that adsorbs moisture by physical adsorption, such as zeolite or silica gel, may be used. When a desiccant is contained, it is preferable because deterioration of the functional element due to intrusion of moisture in the atmosphere can be suppressed and the reliability of the apparatus is improved.

The resin may contain a leveling agent or a surfactant.

By adding a leveling agent or a surfactant to the resin, the surface tension of the resin can be lowered and the wettability of the resin can be improved. The higher the wettability, the more uniformly the resin can be applied. Thus, bubbles can be prevented from being mixed when the pair of substrates are bonded to each other, and a cohesive failure of the adhesive layer and an interface failure between the adhesive layer and the adherend layer can be prevented. Further, display defects in the light emitting device and the display device can be suppressed.

As the leveling agent or surfactant, a material that does not adversely affect the elements and the like included in the layer to be peeled is used. For example, a material obtained by adding a 0.2 wt% silicone leveling agent to an epoxy resin may be used.

As the adhesive, it is preferable to use a material having low fluidity so that it can be disposed only in a desired region. It is possible to prevent the adhesive layer 107 from spreading outside the peeling layer 103 and further reduce the yield of the peeling process. And the yield of a peeling process can be improved. In addition, when a material having low fluidity is used for the adhesive layer, waste of the material that protrudes from a desired region, labor for wiping, and the like can be reduced. Therefore, the cost of the material and the time required for manufacturing the device can be reduced, which is preferable. For example, an adhesive sheet, an adhesive sheet, a sheet-like or film-like adhesive may be used. For example, an OCA (Optical Clear Adhesive) film can be suitably used.

Note that the layer to be peeled 105 and the substrate 109 are preferably bonded in a reduced pressure atmosphere.

The adhesive may have adhesiveness before bonding, and may exhibit adhesiveness by heating or light irradiation after bonding.

In addition, the substrate 109 and the layer to be peeled 105 are chemically or physically bonded as necessary, such as an adhesive that is soluble in water or a solvent, or an adhesive that can be plasticized by irradiation with ultraviolet rays or the like. An adhesive that can be separated may be used. For example, a sheet-like adhesive using a water-soluble resin may be applied.

In one embodiment of the present invention, an adhesive film, an adhesive film, or the like in which a sheet-like adhesive and a substrate are stacked may be used.

As the substrate 109, various substrates that can be used for the manufacturing substrate 101 can be used. Further, a flexible substrate such as a film may be used.

Further, a frame-like adhesive layer surrounding the adhesive layer 107 may be provided. By providing the frame-shaped adhesive layer, it is possible to suppress the adhesive layer 107 from spreading outside the release layer 103 and further to reduce the yield of the release process. An example using a frame-shaped adhesive layer will be described in detail in the peeling method 2.

In addition, as illustrated in FIG. 2D, a resin layer 113 may be provided outside the adhesive layer 107. FIG. 2D shows a plan view viewed from the substrate 109 side and a cross-sectional view taken along the alternate long and short dash line C1-C2 in the plan view (the substrate 109 is not shown in the plan view). By providing the resin layer 113, impurities such as moisture can be prevented from entering the layer to be peeled 105 even when the light-emitting device in the manufacturing process is exposed to an air atmosphere.

For the resin layer 113, a material similar to the material that can be used for the adhesive layer 107 can be used.

If the resin layer 113 is in a cured state, the yield of a subsequent peeling step may be reduced depending on the degree of adhesion between the manufacturing substrate 101 and the substrate 109. Therefore, it is preferable that at least a part of the resin layer 113 is in a semi-cured state or an uncured state. By using a high-viscosity material for the resin layer 113, the effect of suppressing impurities such as moisture in the air from entering the layer to be peeled 105 can be enhanced even in a semi-cured state or an uncured state. .

Further, for example, a part of the resin layer 113 may be set in a cured state by using a light curable resin as the resin layer 113 and irradiating a part thereof with light. Setting a part in a cured state is preferable because the distance and position between the manufacturing substrate 101 and the substrate 109 can be kept constant even when the process is moved from a reduced-pressure atmosphere to an atmospheric pressure atmosphere during the process.

The shorter the curing time of the adhesive layer 107, the shorter the production time of the device, which is preferable. For example, when a thermosetting resin is used for the adhesive layer 107, the curing time can be shortened by increasing the heating temperature. However, a large amount of bubbles are generated in the resin, and the yield of the apparatus may be reduced. Thus, in one embodiment of the present invention, heating is performed while applying pressure. Thereby, even if heating temperature is made high, generation | occurrence | production of a bubble can be suppressed. For example, the resin can be cured using a pressure deaerator (such as an autoclave).

For example, for a resin that requires heating for about 12 hours to cure at 40 ° C., bubbles are generated when heated at 80 ° C. for 1 hour without pressurization, but by heating at 80 ° C. for 1 hour at 0.5 MPa. The generation of bubbles can be suppressed, and the resin can be cured in a short time. By performing heating and pressurization at the same time, bubbles generated upon bonding can be dissolved in the resin. Moreover, it is possible to remove bubbles generated before heating and pressurization. After heating, no bubbles are generated even when stored at room temperature under atmospheric pressure.

The step of curing the adhesive layer by heating while applying pressure can be applied in addition to the step of curing the adhesive layer 107.

Next, a separation starting point is formed by laser light irradiation (FIGS. 1B and 1D).

Laser light is applied to a region where the cured adhesive layer 107, the layer to be peeled 105, and the peeling layer 103 overlap (see arrow P1 in FIG. 1B). The laser light may be irradiated from either side of the substrate, but it is preferable to irradiate from the side of the manufacturing substrate 101 provided with the release layer 103 in order to suppress the scattered light from being irradiated to the functional element or the like. . Note that a material that transmits the laser light is used for the substrate on the laser light irradiation side.

A starting point of peeling can be formed by cracking a layer in contact with the peeling layer 103 included in the peeled layer 105 (generating a film crack or a crack) (see an area surrounded by a dotted line in FIG. 1D). Here, an example in which part of each layer included in the layer to be peeled 105 is removed is shown). At this time, not only the layer to be peeled but also a part of the peeling layer 103 and the adhesive layer 107 may be removed. By irradiation with laser light, part of the film included in the separation layer 105, the separation layer 103, or the adhesive layer 107 can be dissolved, evaporated, or thermally destroyed.

At the time of the peeling process, it is preferable that the force for separating the peeled layer 105 and the peeling layer 103 is concentrated on the starting point of peeling, so that the starting point of peeling is formed near the end rather than the center part of the cured adhesive layer 107. Is preferred. In particular, it is preferable to form the separation starting point in the vicinity of the corner portion, in the vicinity of the edge portion, in comparison with the vicinity of the side portion. In the case where the separation starting point is formed at a position that does not overlap with the adhesive layer 107, in order to reliably separate the separation layer 103 and the layer to be peeled 105, the distance from the adhesion layer 107 is preferably as the formation position of the separation starting point. Specifically, it is preferable to form the separation starting point within a distance of 1 mm from the end of the adhesive layer 107.

There is no particular limitation on the laser used to form the separation starting point. For example, a continuous wave laser or a pulsed laser can be used. Laser light irradiation conditions (frequency, power density, energy density, beam profile, and the like) are appropriately controlled in consideration of the thickness, material, and the like of the manufacturing substrate 101 and the separation layer 103.

The use of laser light is preferable because it is not necessary to cut the substrate in order to form the starting point of peeling, and the generation of dust and the like can be suppressed. In addition, the time required for forming the starting point of peeling can be shortened. In addition, since dust remaining on the surface of the manufacturing substrate 101 can be reduced, the manufacturing substrate 101 can be easily reused. Moreover, since there is no abrasion of sharp blades, such as a cutter, there exists an advantage that cost can be suppressed and it is easy to apply to mass production. Moreover, since peeling can be started by pulling the end of any substrate, it is easy to apply to mass production.

Then, the layer to be peeled 105 and the manufacturing substrate 101 are separated from the starting point of the peeling (FIGS. 1E and 1F). Thus, the layer 105 to be peeled can be transferred from the manufacturing substrate 101 to the substrate 109. At this time, it is preferable to fix one substrate to an adsorption stage or the like. For example, the manufacturing substrate 101 may be fixed to an adsorption stage, and the layer to be peeled 105 may be peeled from the manufacturing substrate 101. Alternatively, the substrate 109 may be fixed to the suction stage and the manufacturing substrate 101 may be peeled from the substrate 109.

For example, the layer to be peeled 105 and the manufacturing substrate 101 may be separated from the starting point of peeling by a physical force (a process of peeling with a human hand or a jig, a process of separating while rotating a roller, or the like).

Alternatively, the manufacturing substrate 101 and the layer to be peeled 105 may be separated by infiltrating a liquid such as water into the interface between the peeling layer 103 and the layer to be peeled 105. The liquid can be easily separated by permeating between the peeling layer 103 and the peeled layer 105 by capillary action. In addition, static electricity generated at the time of peeling can be prevented from adversely affecting the functional elements included in the layer to be peeled 105 (such as a semiconductor element being destroyed by static electricity). The liquid may be sprayed in the form of mist or steam. As the liquid, pure water, an organic solvent, or the like can be used, and a neutral, alkaline, or acidic aqueous solution, an aqueous solution in which a salt is dissolved, or the like may be used.

When the layer to be peeled 105 and the adhesive layer 107 are not sufficiently adhered in the previous step, interface breakage may occur between the layer to be peeled 105 and the adhesive layer 107. FIG. 6B illustrates an example in which interface breakdown occurs between the layer to be peeled 105 and the adhesive layer 107. Even when a separation starting point is provided, when the force required to separate the manufacturing substrate 101 and the layer to be peeled 105 is larger than the force required to cause the interface fracture, FIG. As shown, the formation substrate 101 and the layer to be peeled 105 are not separated from each other and may be defective.

Similarly, when the substrate 109 and the adhesive layer 107 are not sufficiently brought into close contact with each other in the previous step, interface destruction may occur between the substrate 109 and the adhesive layer 107. FIG. 6C shows an example in which interface breakdown occurs between the substrate 109 and the adhesive layer 107.

Alternatively, when the adhesive layer 107 is not sufficiently cured in the previous step, the adhesive layer 107 may be coherently broken. FIG. 6D shows an example in which the adhesive layer 107 coheses and breaks.

In one embodiment of the present invention, the adhesive layer is cured so that a large force is required to cause interface fracture between the peeled layer 105 and the adhesive layer 107 or between the substrate 109 and the adhesive layer 107. In addition, the adhesion between the adhesive layer and the adherend layer is sufficiently enhanced. The curing of the adhesive layer 107 also has an effect of increasing the force required to cause cohesive failure of the adhesive layer 107.

Further, in one embodiment of the present invention, the separation starting point is formed so that the force required to separate the manufacturing substrate 101 and the layer to be separated 105 is reduced. Accordingly, the force required to separate the manufacturing substrate 101 and the layer to be peeled 105 can be made smaller than the force required to cause the interface failure or the cohesive failure. Then, separation is performed with high yield by separating the manufacturing substrate 101 and the layer to be peeled 105 by a force required to separate the manufacturing substrate 101 and the layer to be peeled 105 (a larger force may be used). be able to.

Note that the adhesive layer 107 or the resin layer 113 that does not contribute to the adhesion between the layer to be peeled 105 and the substrate 109 remaining on the substrate 109 after the peeling may be removed. By removing, it is possible to suppress adverse effects on the functional elements in the subsequent steps (mixing of impurities, etc.), which is preferable. For example, unnecessary resin can be removed by wiping, washing, or the like. Note that the adhesive layer 107 formed outside the separation starting point remains on at least one of the manufacturing substrate 101 and the substrate 109. Although FIGS. 1E and 1F show examples that remain on both sides, the present invention is not limited to this.

For example, in the case where the separation layer 103 has a stacked structure of a tungsten film and a tungsten oxide film, separation occurs at the interface between the tungsten film and the tungsten oxide film (or in the vicinity of the interface), so that the separation layer 103 is formed on the separation layer 105 side. Part (here, tungsten oxide film) may remain. Further, the peeling layer 103 remaining on the peeling layer 105 side may be removed thereafter.

<Peeling method 2>
First, the separation layer 203 is formed over the formation substrate 201, and the separation layer 205 is formed over the separation layer 203 (FIG. 3A). Further, the separation layer 223 is formed over the manufacturing substrate 221 and the layer to be separated 225 is formed over the separation layer 223 (FIG. 3B).

Next, the manufacturing substrate 201 and the manufacturing substrate 221 are bonded to each other using the adhesive layer 207 and the frame-shaped adhesive layer 211 so that the surfaces on which the separation layers are formed face each other, and the adhesive layer 207 is cured. (FIG. 3C).

The frame-like adhesive layer 211 may be in a cured state, a semi-cured state, or an uncured state as long as the adhesive layer 207 is prevented from flowing outside the release layer 203 or the release layer 223. In the case where the frame-shaped adhesive layer 211 is in a cured state, it is preferable to form a starting point of peeling described later in a region overlapping the frame-shaped adhesive layer 211. Thus, after peeling, the frame-like adhesive layer 211 can be used as a layer for sealing the peeled layer together with the adhesive layer 207, and deterioration of the functional element due to intrusion of moisture in the atmosphere can be suppressed. Thus, a highly reliable device can be manufactured. Note that when the frame-shaped adhesive layer 211 is in a cured state, the end portion of the frame-shaped adhesive layer 211 is not positioned outside the end portion of the release layer 103 in order to prevent a decrease in the yield of the separation process. It is preferable to do.

Note that the bonding of the manufacturing substrate 201 and the manufacturing substrate 221 is preferably performed in a reduced-pressure atmosphere.

Note that FIG. 3C illustrates the case where the size of the separation layer 223 is different from that of the separation layer 203; however, a separation layer having the same size may be used as illustrated in FIG.

The adhesive layer 207 is disposed so as to overlap with the separation layer 203, the separation layer 205, the separation layer 225, and the separation layer 223. And it is preferable that the edge part of the contact bonding layer 207 is located inside the edge part of at least one of the peeling layer 203 or the peeling layer 223 (one to peel first). Accordingly, it is possible to suppress the manufacturing substrate 201 and the manufacturing substrate 221 from being in close contact with each other, and it is possible to suppress a decrease in yield of a subsequent peeling step.

Next, a starting point of peeling is formed by laser light irradiation (FIGS. 4A and 4B).

The manufacturing substrate 201 and the manufacturing substrate 221 may be separated from each other. When the size of the release layer is different, the release layer may be peeled off from the substrate on which the large release layer is formed, or may be peeled off from the substrate on which the small release layer is formed. In the case where an element such as a semiconductor element, a light-emitting element, or a display element is formed over only one substrate, the element may be separated from the substrate on which the element is formed or may be separated from the other substrate. Here, an example in which the manufacturing substrate 201 is peeled first is shown.

The laser light is applied to a region where the cured adhesive layer 207, the layer to be peeled 205, and the peeling layer 203 overlap (see arrow P3 in FIG. 4A).

By removing a part of the layer to be peeled off, a starting point of peeling can be formed (see a region surrounded by a dotted line in FIG. 4B). At this time, not only the layer to be peeled 205 but also a part of the peeling layer 203 and the adhesive layer 207 may be removed.

The laser light is preferably irradiated from the substrate side provided with a release layer to be peeled off. In the case of irradiating the region where the separation layer 203 and the separation layer 223 overlap with each other, by selectively cracking only the layer to be separated 205 of the layer to be separated 205 and the layer to be separated 225, the formation substrate 201 and The peeling layer 203 can be peeled (see a region surrounded by a dotted line in FIG. 4B. Here, an example in which part of each layer included in the peeled layer 205 is removed is shown).

In the case where laser light is applied to a region where the separation layer 203 and the separation layer 223 overlap, if a separation starting point is formed in both the separation layer 205 on the separation layer 203 side and the separation layer 225 on the separation layer 223 side, It may be difficult to selectively peel off one of the manufacturing substrates. Therefore, the laser light irradiation conditions may be limited so that only one peeled layer can be cracked.

Then, the layer to be peeled 205 and the manufacturing substrate 201 are separated from the starting point of the peeling (FIGS. 4C and 4D). Accordingly, the layer to be peeled 205 can be transferred from the manufacturing substrate 201 to the manufacturing substrate 221. Note that the adhesive layer 207 and the frame-shaped adhesive layer 211 formed outside the separation starting point remain on at least one of the manufacturing substrate 201 and the manufacturing substrate 221. FIGS. 4C and 4D show examples that remain on both sides, but the present invention is not limited to this.

Next, the exposed layer 205 to be peeled and the substrate 231 are attached to each other using the adhesive layer 233, and the adhesive layer 233 is cured (FIG. 5A). Here, a frame-shaped adhesive layer 235 and an adhesive layer 233 inside the frame-shaped adhesive layer 235 are provided over the layer to be peeled 225, and the layer to be peeled 225 and the substrate 231 are attached to each other.

Note that the layer to be peeled 205 and the substrate 231 are preferably attached in a reduced pressure atmosphere.

Next, a starting point of peeling is formed by laser light irradiation (FIGS. 5B and 5C).

Here, an example is shown in which the adhesive layer 233 is in a cured state and the frame-like adhesive layer 235 is not in a cured state, and the cured adhesive layer 233 is irradiated with laser light (see arrow P4 in FIG. 5B). ). By removing a part of the layer to be peeled, a starting point of peeling can be formed (see a region surrounded by a dotted line in FIG. 5C).

The laser light is preferably irradiated from the manufacturing substrate 221 side provided with the separation layer 223.

Then, the layer to be peeled 225 and the manufacturing substrate 221 are separated from the starting point of the peeling (FIG. 5D). Accordingly, the layer to be peeled 205 and the layer to be peeled 225 can be transferred to the substrate 231.

In the peeling method of one embodiment of the present invention described above, a pair of manufacturing substrates each having a layer to be peeled can be bonded in advance, and then the substrates can be bonded to form a device to be manufactured. . Therefore, when the layers to be peeled are bonded to each other, manufacturing substrates having low flexibility can be bonded to each other, and the alignment accuracy of the bonding can be improved as compared to the case where the flexible substrates are bonded to each other. it can.

As described above in this embodiment, in one embodiment of the present invention, the force required for separation between a manufacturing substrate and a layer to be peeled after formation of a separation starting point is the interface breakdown between the adhesive layer and the layer to be adhered. Smaller than the force required for cohesion and cohesive failure of the adhesive layer. Therefore, in the peeling step, it is possible to suppress film peeling in the peeled layer and peeling at an unintended interface. That is, it can suppress that the yield of a peeling process falls.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 2)
In this embodiment, a light-emitting device of one embodiment of the present invention will be described with reference to drawings.

In this embodiment, a light-emitting device mainly using an organic EL element is exemplified, but one embodiment of the present invention is not limited thereto.

One embodiment of the present invention includes a first flexible substrate, a first adhesive layer, a first insulating layer, a first functional layer, a second adhesive layer, and a second flexible substrate in this order. A light-emitting device having a stacked structure. The light-emitting device of one embodiment of the present invention includes a light-emitting element in the first functional layer. One embodiment of the present invention can be applied to a display device including a display element in the first functional layer, a semiconductor device including a semiconductor element in the first functional layer, or the like.

In the light-emitting device of one embodiment of the present invention, interface destruction is unlikely to occur between the second adhesive layer and the adherend layer. Specifically, according to one embodiment of the present invention, interface fracture occurs between the second adhesive layer and the first functional layer, or between the second adhesive layer and the second flexible substrate. It is a light-emitting device that requires a force of 0.14 N / 25 mm or more. The force required to cause the interface breakage between the second adhesive layer and the first functional layer and between the second adhesive layer and the second flexible substrate is 0. It is preferably 14 N / 25 mm or more.

In the light-emitting device of one embodiment of the present invention, even when a force of less than 0.14 N / 25 mm is applied, the light-emitting device is interposed between the second adhesive layer and the first functional layer or between the second adhesive layer and the second functional layer. It can also be said that no interface breakage occurs between the flexible substrate.

In the above configuration, the force required to cause cohesive failure of the second adhesive layer is preferably 0.14 N / 25 mm or more.

It can be said that the light-emitting device of one embodiment of the present invention does not cause cohesive failure of the second adhesive layer even when a force of less than 0.14 N / 25 mm is applied.

Alternatively, according to one embodiment of the present invention, the first flexible substrate, the first adhesive layer, the first insulating layer, the first functional layer, the third adhesive layer, the second functional layer, the second A light-emitting device having an insulating layer, a second adhesive layer, and a second flexible substrate stacked in this order. The light-emitting device of one embodiment of the present invention includes a light-emitting element in the first functional layer and a colored layer in the second functional layer. One embodiment of the present invention can also be applied to a touch panel or the like having a light-emitting element or a display element in a first functional layer and a touch sensor in a second functional layer.

In the light-emitting device of one embodiment of the present invention, interface breakdown is unlikely to occur between the third adhesive layer and the adherend layer. Specifically, according to one embodiment of the present invention, an interface breakage occurs between the third adhesive layer and the first functional layer or between the third adhesive layer and the second functional layer. The light-emitting device requires a force of 0.14 N / 25 mm or more. The force required to cause interface fracture between the third adhesive layer and the first functional layer and between the third adhesive layer and the second functional layer is 0.14 N / It is preferable that it is 25 mm or more.

In the above configuration, the force required to cause the cohesive failure of the third adhesive layer is preferably 0.14 N / 25 mm or more.

<Specific example 1>
FIG. 7A illustrates a plan view of the light-emitting device, and FIG. 7C illustrates an example of a cross-sectional view taken along the dashed-dotted line D1-D2 in FIG. The light-emitting device shown in Example 1 is a top emission type light-emitting device using a color filter method. In this embodiment, the light-emitting device includes, for example, a configuration in which one color is expressed by three subpixels of R (red), G (green), and B (blue), or R, G, B, and W ( A configuration in which one color is expressed by sub-pixels of four colors (white), a configuration in which one color is expressed by sub-pixels of four colors of R, G, B, and Y (yellow) can be applied. The color element is not particularly limited, and colors other than RGBWY may be used. For example, cyan or magenta may be used.

A light-emitting device illustrated in FIG. 7A includes a light-emitting portion 804, a driver circuit portion 806, and an FPC 808.

A light-emitting device illustrated in FIG. 7C includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a first functional layer (a plurality of transistors, a conductive layer 857, an insulating layer). 815, an insulating layer 817, a plurality of light emitting elements, and an insulating layer 821), a third adhesive layer 822, a second functional layer (colored layer 845 and a light shielding layer 847), a second insulating layer 715, a second adhesive It has a layer 713 and a second flexible substrate 711. The third adhesive layer 822, the second insulating layer 715, the second adhesive layer 713, and the second flexible substrate 711 transmit visible light. Light-emitting elements and transistors included in the light-emitting portion 804 and the driver circuit portion 806 are sealed with a first flexible substrate 701, a second flexible substrate 711, and a third adhesive layer 822.

The light-emitting portion 804 includes a transistor 820 and a light-emitting element 830 over the first flexible substrate 701 with the first adhesive layer 703 and the first insulating layer 705 interposed therebetween. The light-emitting element 830 includes a lower electrode 831 over the insulating layer 817, an EL layer 833 over the lower electrode 831, and an upper electrode 835 over the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. An end portion of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

In addition, the light-emitting portion 804 includes a colored layer 845 that overlaps with the light-emitting element 830 and a light-blocking layer 847 that overlaps with the insulating layer 821. A space between the light emitting element 830 and the colored layer 845 is filled with a third adhesive layer 822.

The insulating layer 815 has an effect of suppressing diffusion of impurities into a semiconductor included in the transistor. As the insulating layer 817, an insulating layer having a planarization function is preferably selected in order to reduce surface unevenness due to the transistor.

The driver circuit portion 806 includes a plurality of transistors over the first flexible substrate 701 with the first adhesive layer 703 and the first insulating layer 705 interposed therebetween. In FIG. 7D, one transistor of the transistors included in the driver circuit portion 806 is illustrated.

The first insulating layer 705 and the first flexible substrate 701 are attached to each other with a first adhesive layer 703. In addition, the second insulating layer 715 and the second flexible substrate 711 are attached to each other with a second adhesive layer 713. When a highly moisture-proof film is used for the first insulating layer 705 and the second insulating layer 715, entry of impurities such as water into the light-emitting element 830 and the transistor 820 can be suppressed, and the reliability of the light-emitting device is improved. Therefore, it is preferable.

The conductive layer 857 is electrically connected to an external input terminal that transmits an external signal (a video signal, a clock signal, a start signal, a reset signal, or the like) or a potential to the driver circuit portion 806. Here, an example in which an FPC 808 is provided as an external input terminal is shown. In order to prevent an increase in the number of steps, the conductive layer 857 is preferably formed using the same material and the same steps as the electrodes and wirings used for the light-emitting portion and the driver circuit portion. Here, an example in which the conductive layer 857 is manufactured using the same material and the same process as the electrode included in the transistor 820 is described.

In the light-emitting device illustrated in FIG. 7C, the FPC 808 is located over the second flexible substrate 711. The connection body 825 is provided through an opening provided in the second flexible substrate 711, the second adhesive layer 713, the second insulating layer 715, the third adhesive layer 822, the insulating layer 817, and the insulating layer 815. The conductive layer 857 is connected. Further, the connection body 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected through the connection body 825. In the case where the conductive layer 857 and the second flexible substrate 711 overlap with each other, the conductive layer 857 and the connection body 825 are opened by opening the second flexible substrate 711 (or using a substrate having an opening). , And the FPC 808 can be electrically connected.

<Specific example 2>
FIG. 7B is a plan view of the light-emitting device, and FIG. 8A illustrates an example of a cross-sectional view taken along dashed-dotted line D3-D4 in FIG. 7B. The light emitting device shown in the second specific example is a top emission type light emitting device using a color filter method, which is different from the first specific example. Here, only the points different from the specific example 1 will be described in detail, and the description of the points common to the specific example 1 will be omitted.

The light-emitting device illustrated in FIG. 8A is different from the light-emitting device illustrated in FIG.

A light-emitting device illustrated in FIG. 8A includes an insulating layer 817a and an insulating layer 817b, and a conductive layer 856 over the insulating layer 817a. The source or drain electrode of the transistor 820 and the lower electrode of the light-emitting element 830 are electrically connected to each other through the conductive layer 856.

The light-emitting device illustrated in FIG. 8A includes a spacer 823 over the insulating layer 821. By providing the spacer 823, the distance between the first flexible substrate 701 and the second flexible substrate 711 can be adjusted.

The light-emitting device illustrated in FIG. 8A includes an overcoat 849 that covers the coloring layer 845 and the light-blocking layer 847. A space between the light emitting element 830 and the overcoat 849 is filled with an adhesive layer 822.

In addition, the size of the light-emitting device illustrated in FIG. 8A differs between the first flexible substrate 701 and the second flexible substrate 711. The FPC 808 is located over the second insulating layer 715 and does not overlap with the second flexible substrate 711. The connection body 825 is connected to the conductive layer 857 through an opening provided in the second insulating layer 715, the third adhesive layer 822, the insulating layer 817, and the insulating layer 815. Since there is no need to provide an opening in the second flexible substrate 711, the material of the second flexible substrate 711 is not limited.

Note that as illustrated in FIG. 8B, the light-emitting element 830 may include an optical adjustment layer 832 between the lower electrode 831 and the EL layer 833. The optical adjustment layer 832 is preferably formed using a light-transmitting conductive material. With a combination of the color filter (colored layer) and the microcavity structure (optical adjustment layer), light with high color purity can be extracted from the light-emitting device of one embodiment of the present invention. The film thickness of the optical adjustment layer may be changed according to the color of each subpixel.

<Specific example 3>
FIG. 7B is a plan view of the light-emitting device, and FIG. 8C illustrates an example of a cross-sectional view taken along the dashed-dotted line D3-D4 in FIG. The light-emitting device shown in the specific example 3 is a top emission type light-emitting device using a painting method.

A light-emitting device illustrated in FIG. 8C includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a first functional layer (a plurality of transistors, a conductive layer 857, an insulating layer). 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 821, and a spacer 823), a second adhesive layer 713, and a second flexible substrate 711. The second adhesive layer 713 and the second flexible substrate 711 transmit visible light.

In the light-emitting device illustrated in FIG. 8C, the connection body 825 is located over the insulating layer 815. The connection body 825 is connected to the conductive layer 857 through an opening provided in the insulating layer 815. Further, the connection body 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected through the connection body 825.

<Specific Example 4>
FIG. 7B is a plan view of the light-emitting device, and FIG. 9A illustrates an example of a cross-sectional view taken along dashed-dotted line D3-D4 in FIG. 7B. The light emitting device shown in the specific example 4 is a bottom emission type light emitting device using a color filter method.

A light-emitting device illustrated in FIG. 9A includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a first functional layer (a plurality of transistors, a conductive layer 857, an insulating layer). 815, a colored layer 845, an insulating layer 817a, an insulating layer 817b, a conductive layer 856, a plurality of light-emitting elements, and an insulating layer 821), a second adhesive layer 713, and a second flexible substrate 711. The first flexible substrate 701, the first adhesive layer 703, the first insulating layer 705, the insulating layer 815, the insulating layer 817a, and the insulating layer 817b transmit visible light.

The light-emitting portion 804 includes a transistor 820, a transistor 824, and a light-emitting element 830 over the first flexible substrate 701 with the first adhesive layer 703 and the first insulating layer 705 interposed therebetween. The light-emitting element 830 includes a lower electrode 831 over the insulating layer 817b, an EL layer 833 over the lower electrode 831, and an upper electrode 835 over the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. An end portion of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 transmits visible light. There is no particular limitation on the position at which the colored layer 845 which overlaps with the light-emitting element 830, and for example, the colored layer 845 may be provided between the insulating layer 817a and the insulating layer 817b or between the insulating layer 815 and the insulating layer 817a.

The driver circuit portion 806 includes a plurality of transistors over the first flexible substrate 701 with the first adhesive layer 703 and the first insulating layer 705 interposed therebetween. In FIG. 9B, two transistors among the transistors included in the driver circuit portion 806 are illustrated.

The first insulating layer 705 and the first flexible substrate 701 are attached to each other with a first adhesive layer 703. It is preferable to use a highly moisture-proof film for the first insulating layer 705 because impurities such as water can be prevented from entering the light-emitting element 830, the transistor 820, and the transistor 824, and the reliability of the light-emitting device is increased.

The conductive layer 857 is electrically connected to an external input terminal that transmits an external signal or potential to the driver circuit portion 806. Here, an example in which an FPC 808 is provided as an external input terminal is shown. Here, an example in which the conductive layer 857 is manufactured using the same material and the same process as the conductive layer 856 is described.

<Specific Example 5>
FIG. 9B shows an example of a light emitting device different from the specific examples 1 to 4.

A light-emitting device illustrated in FIG. 9B includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a first functional layer (a conductive layer 814, a conductive layer 857a, and a conductive layer. 857b, a light-emitting element 830, and an insulating layer 821), a second adhesive layer 713, and a second flexible substrate 711.

The conductive layers 857a and 857b are external connection electrodes of the light-emitting device and can be electrically connected to an FPC or the like.

The light-emitting element 830 includes a lower electrode 831, an EL layer 833, and an upper electrode 835. An end portion of the lower electrode 831 is covered with an insulating layer 821. The light-emitting element 830 is a bottom emission type, a top emission type, or a dual emission type. The electrode, substrate, insulating layer, and the like on the light extraction side each transmit visible light. The conductive layer 814 is electrically connected to the lower electrode 831.

The substrate on the light extraction side may have a hemispherical lens, a microlens array, a film with a concavo-convex structure, a light diffusion film, or the like as the light extraction structure. For example, a substrate having a light extraction structure can be formed by adhering the lens or film on a resin substrate using an adhesive having the same refractive index as the substrate or the lens or film. .

The conductive layer 814 is not necessarily provided, but is preferably provided because a voltage drop due to the resistance of the lower electrode 831 can be suppressed. For the same purpose, a conductive layer electrically connected to the upper electrode 835 may be provided over the insulating layer 821, the EL layer 833, the upper electrode 835, or the like.

The conductive layer 814 is a single layer or a stacked layer using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material containing these as a main component. Can be formed. The film thickness of the conductive layer 814 can be, for example, 0.1 μm to 3 μm, and preferably 0.1 μm to 0.5 μm.

<Example of material>
Next, materials that can be used for the light-emitting device will be described. In addition, description may be abbreviate | omitted about the structure demonstrated previously in this specification.

For the substrate, materials such as glass, quartz, organic resin, metal, and alloy can be used. A substrate that extracts light from the light-emitting element is formed using a material that transmits the light.

In particular, it is preferable to use a flexible substrate. For example, organic resin or flexible glass, metal, or alloy can be used.

Since the specific gravity of an organic resin is smaller than that of glass, it is preferable to use an organic resin as the flexible substrate because the light-emitting device can be reduced in weight compared to the case of using glass.

It is preferable to use a material having high toughness for the substrate. Thereby, it is possible to realize a light emitting device that is excellent in impact resistance and is not easily damaged. For example, by using an organic resin substrate, a thin metal substrate, or an alloy substrate, a light-emitting device that is lighter and less likely to be damaged than a glass substrate can be realized.

Metal materials and alloy materials are preferable because they have high thermal conductivity and can easily conduct heat to the entire substrate, which can suppress a local temperature increase of the light-emitting device. The thickness of the substrate using a metal material or an alloy material is preferably 10 μm to 200 μm, and more preferably 20 μm to 50 μm.

The material constituting the metal substrate or the alloy substrate is not particularly limited. For example, aluminum, copper, nickel, or an alloy of a metal such as an aluminum alloy or stainless steel can be preferably used.

In addition, when a material having a high thermal emissivity is used for the substrate, an increase in the surface temperature of the light-emitting device can be suppressed, and destruction of the light-emitting device and a decrease in reliability can be suppressed. For example, the substrate may have a stacked structure of a metal substrate and a layer having a high thermal emissivity (for example, a metal oxide or a ceramic material can be used).

Examples of the material having flexibility and translucency include, for example, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, Examples include polyethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, polytetrafluoroethylene (PTFE), and the like. In particular, a material having a low linear expansion coefficient is preferably used. For example, polyamideimide resin, polyimide resin, polyamide resin, PET, or the like can be suitably used. In addition, a substrate in which a fibrous body is impregnated with a resin (also referred to as a prepreg) or a substrate in which an inorganic filler is mixed with an organic resin to reduce the linear expansion coefficient can be used.

As a flexible substrate, a layer using the above material is a hard coat layer (for example, a silicon nitride layer) that protects the surface of the device from scratches, or a layer of a material that can disperse the pressure (for example, an aramid resin). Layer etc.) may be laminated.

The flexible substrate can be used by stacking a plurality of layers. In particular, when the glass layer is used, the barrier property against water and oxygen can be improved and a highly reliable light-emitting device can be obtained.

For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are stacked from the side close to the light-emitting element can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less, preferably 25 μm or more and 100 μm or less. The glass layer having such a thickness can simultaneously realize a high barrier property and flexibility against water and oxygen. The thickness of the organic resin layer is 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing such an organic resin layer outside the glass layer, it is possible to suppress breakage and cracking of the glass layer and improve mechanical strength. By applying such a composite material of a glass material and an organic resin to a substrate, a highly reliable flexible light-emitting device can be obtained.

For the adhesive layer, various curable adhesives such as an ultraviolet curable photocurable adhesive, a reactive curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenol resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like. In particular, a material with low moisture permeability such as an epoxy resin is preferable. Alternatively, a two-component mixed resin may be used. Further, an adhesive sheet or the like may be used.

Further, the resin may contain a desiccant. For example, a substance that adsorbs moisture by chemical adsorption, such as an alkaline earth metal oxide (such as calcium oxide or barium oxide), can be used. Alternatively, a substance that adsorbs moisture by physical adsorption, such as zeolite or silica gel, may be used. The inclusion of a desiccant is preferable because impurities such as moisture can be prevented from entering the functional element and the reliability of the light-emitting device is improved.

Moreover, the light extraction efficiency from a light emitting element can be improved by mixing the said resin with a filler with a high refractive index, or a light-scattering member. For example, titanium oxide, barium oxide, zeolite, zirconium, or the like can be used.

As the first insulating layer 705 and the second insulating layer 715, an insulating film with high moisture resistance is preferably used. Alternatively, the first insulating layer 705 and the second insulating layer 715 preferably have a function of preventing diffusion of impurities into the light-emitting element.

Examples of the highly moisture-proof insulating film include a film containing nitrogen and silicon such as a silicon nitride film and a silicon nitride oxide film, and a film containing nitrogen and aluminum such as an aluminum nitride film. Alternatively, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

For example, the moisture permeation amount of the highly moisture-proof insulating film is 1 × 10 ⁻⁵ [g / (m ² · day)] or less, preferably 1 × 10 ⁻⁶ [g / (m ² · day)] or less, More preferably, it is 1 × 10 ⁻⁷ [g / (m ² · day)] or less, and further preferably 1 × 10 ⁻⁸ [g / (m ² · day)] or less.

In the light-emitting device, at least one of the first insulating layer 705 and the second insulating layer 715 needs to transmit light emitted from the light-emitting element. Of the first insulating layer 705 or the second insulating layer 715, the insulating layer on the side that transmits light emitted from the light-emitting element has a higher average transmittance at a wavelength of 400 nm to 800 nm than the other insulating layer. preferable.

There is no particular limitation on the structure of the transistor included in the light-emitting device. For example, a staggered transistor or an inverted staggered transistor may be used. Further, a top-gate or bottom-gate transistor structure may be employed. A semiconductor material used for the transistor is not particularly limited, and examples thereof include silicon, germanium, and an organic semiconductor. Alternatively, an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In—Ga—Zn-based metal oxide, may be used.

There is no particular limitation on the crystallinity of a semiconductor material used for the transistor, and any of an amorphous semiconductor and a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially including a crystal region) is used. May be used. It is preferable to use a crystalline semiconductor because deterioration of transistor characteristics can be suppressed.

In order to stabilize the characteristics of the transistor, it is preferable to provide a base film. As the base film, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a silicon nitride oxide film can be used, which can be formed as a single layer or a stacked layer. The base film is formed by sputtering, CVD (Chemical Vapor Deposition) (plasma CVD, thermal CVD, MOCVD (Metal Organic CVD), etc.), ALD (Atomic Layer Deposition), coating, printing, etc. it can. Note that the base film is not necessarily provided if not necessary. In each of the above specific examples, the first insulating layer 705 can also serve as a base film of the transistor.

As the light-emitting element, an element capable of self-emission can be used, and an element whose luminance is controlled by current or voltage is included in its category. For example, a light emitting diode (LED), an organic EL element, an inorganic EL element, or the like can be used.

The light emitting element may be any of a top emission type, a bottom emission type, and a dual emission type. A conductive film that transmits visible light is used for the electrode from which light is extracted. In addition, a conductive film that reflects visible light is preferably used for the electrode from which light is not extracted.

The conductive film that transmits visible light is formed using, for example, indium oxide, indium tin oxide (ITO), indium zinc oxide, zinc oxide (ZnO), zinc oxide to which gallium is added, or the like. Can do. In addition, a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, an alloy including these metal materials, or a nitride of these metal materials (for example, Titanium nitride) can also be used by forming it thin enough to have translucency. In addition, a stacked film of the above materials can be used as a conductive layer. For example, it is preferable to use a laminated film of silver and magnesium alloy and ITO because the conductivity can be increased. Further, graphene or the like may be used.

For the conductive film that reflects visible light, for example, a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy including these metal materials is used. Can do. In addition, lanthanum, neodymium, germanium, or the like may be added to the metal material or alloy. Also, alloys containing aluminum (aluminum alloys) such as aluminum and titanium alloys, aluminum and nickel alloys, aluminum and neodymium alloys, aluminum, nickel, and lanthanum alloys (Al-Ni-La), silver and copper Or an alloy containing silver such as an alloy of silver, palladium and copper (also referred to as Ag-Pd-Cu or APC), an alloy of silver and magnesium, or the like. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, the oxidation of the aluminum alloy film can be suppressed by stacking the metal film or the metal oxide film in contact with the aluminum alloy film. Examples of the material for the metal film and metal oxide film include titanium and titanium oxide. Alternatively, the conductive film that transmits visible light and a film made of a metal material may be stacked. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, or the like can be used.

The electrodes may be formed using a vapor deposition method or a sputtering method, respectively. In addition, it can be formed using a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method.

When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835, holes are injected into the EL layer 833 from the anode side and electrons are injected from the cathode side. The injected electrons and holes are recombined in the EL layer 833, and the light-emitting substance contained in the EL layer 833 emits light.

The EL layer 833 includes at least a light-emitting layer. The EL layer 833 is a layer other than the light-emitting layer as a substance having a high hole-injecting property, a substance having a high hole-transporting property, a hole blocking material, a substance having a high electron-transporting property, a substance having a high electron-injecting property, or a bipolar property A layer containing a substance (a substance having a high electron transporting property and a high hole transporting property) or the like may be further included.

For the EL layer 833, either a low molecular compound or a high molecular compound can be used, and an inorganic compound may be included. The layers constituting the EL layer 833 can be formed by a method such as a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an ink jet method, or a coating method.

The light emitting element 830 may contain two or more light emitting substances. Thereby, for example, a white light emitting element can be realized. For example, white light emission can be obtained by selecting the light emitting material so that the light emission of each of the two or more light emitting materials has a complementary color relationship. For example, a light-emitting substance that emits light such as R (red), G (green), B (blue), Y (yellow), or O (orange), or spectral components of two or more colors of R, G, and B A light-emitting substance that emits light containing can be used. For example, a light-emitting substance that emits blue light and a light-emitting substance that emits yellow light may be used. At this time, the emission spectrum of the luminescent material that emits yellow light preferably includes green and red spectral components. The emission spectrum of the light-emitting element 830 preferably has two or more peaks in the visible wavelength range (eg, 350 nm to 750 nm, 400 nm to 800 nm, or the like).

The EL layer 833 may include a plurality of light-emitting layers. In the EL layer 833, the plurality of light-emitting layers may be stacked in contact with each other or may be stacked with a separation layer interposed therebetween. For example, a separation layer may be provided between the fluorescent light emitting layer and the phosphorescent light emitting layer.

The separation layer can be provided, for example, to prevent energy transfer (particularly triplet energy transfer) by a Dexter mechanism from an excited state of the phosphorescent material generated in the phosphorescent light emitting layer to the fluorescent material in the fluorescent light emitting layer. The separation layer may have a thickness of about several nm. Specifically, the thickness is 0.1 nm to 20 nm, or 1 nm to 10 nm, or 1 nm to 5 nm. The separation layer includes a single material (preferably a bipolar substance) or a plurality of materials (preferably a hole transport material and an electron transport material).

The separation layer may be formed using a material included in the light emitting layer in contact with the separation layer. This facilitates the production of the light emitting element and reduces the driving voltage. For example, when the phosphorescent light-emitting layer is formed of a host material, an assist material, and a phosphorescent material (guest material), the separation layer may be formed using the host material and the assist material. In other words, the separation layer has a region not containing a phosphorescent material, and the phosphorescent light-emitting layer has a region containing a phosphorescent material. Thereby, the separation layer and the phosphorescent light emitting layer can be deposited with or without the phosphorescent material. Further, with such a structure, the separation layer and the phosphorescent light emitting layer can be formed in the same chamber. Thereby, manufacturing cost can be reduced.

The light-emitting element 830 may be a single element having one EL layer or a tandem element having a plurality of EL layers stacked with a charge generation layer interposed therebetween.

The light-emitting element is preferably provided between a pair of insulating films with high moisture resistance. Thereby, impurities such as water can be prevented from entering the light emitting element, and a decrease in reliability of the light emitting device can be suppressed.

As the insulating layer 815, for example, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film can be used. As the insulating layer 817, the insulating layer 817a, and the insulating layer 817b, organic materials such as polyimide, acrylic, polyamide, polyimide amide, and benzocyclobutene resin can be used, for example. Further, a low dielectric constant material (low-k material) or the like can be used. Each insulating layer may be formed by stacking a plurality of insulating films.

The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. As the resin, for example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy resin, phenol resin, or the like can be used. In particular, a photosensitive resin material is preferably used so that an opening is formed over the lower electrode 831 so that the side wall of the insulating layer 821 has an inclined surface formed with a curvature.

A method for forming the insulating layer 821 is not particularly limited, and a photolithography method, a sputtering method, a vapor deposition method, a droplet discharge method (such as an ink jet method), a printing method (such as screen printing or offset printing) may be used.

The spacer 823 can be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, as the inorganic insulating material and the organic insulating material, various materials that can be used for the insulating layer can be given. As the metal material, titanium, aluminum, or the like can be used. With the structure in which the spacer 823 including a conductive material is electrically connected to the upper electrode 835, a potential drop due to the resistance of the upper electrode 835 can be suppressed. Further, the spacer 823 may have a forward tapered shape or a reverse tapered shape.

A conductive layer used for a light-emitting device that functions as an electrode or a wiring of a transistor or an auxiliary electrode of a light-emitting element is a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium, or these An alloy material containing any of the above elements can be used to form a single layer or a stacked layer. The conductive layer may be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (such as In ₂ O ₃ ), tin oxide (such as SnO ₂ ), ZnO, ITO, indium zinc oxide (such as In ₂ O ₃ —ZnO), or a metal oxide material thereof. The one containing silicon oxide can be used.

The colored layer is a colored layer that transmits light in a specific wavelength band. For example, a color filter that transmits light in a red, green, blue, or yellow wavelength band can be used. Each colored layer is formed at a desired position using a variety of materials by a printing method, an inkjet method, an etching method using a photolithography method, or the like. In the white sub-pixel, a transparent or white resin may be disposed so as to overlap the light emitting element.

The light shielding layer is provided between the adjacent colored layers. The light shielding layer shields light from adjacent light emitting elements and suppresses color mixing between adjacent light emitting elements. Here, light leakage can be suppressed by providing the end portion of the colored layer so as to overlap the light shielding layer. For the light-blocking layer, a material that blocks light emitted from the light-emitting element can be used. For example, a black matrix may be formed using a metal material, a resin material containing a pigment, or a dye. Note that the light shielding layer is preferably provided in a region other than the light emitting portion such as the drive circuit portion because unintended light leakage due to guided light or the like can be suppressed.

Moreover, you may provide the overcoat which covers a colored layer and a light shielding layer. By providing the overcoat, diffusion of impurities and the like contained in the colored layer to the light emitting element can be prevented. The overcoat is made of a material that transmits light emitted from the light emitting element. For example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film, or an organic insulating film such as an acrylic film or a polyimide film can be used. A laminated structure of a film and an inorganic insulating film may be used.

Further, when the adhesive layer material is applied on the colored layer and the light shielding layer, it is preferable to use a material having high wettability with respect to the adhesive layer material as the overcoat material. For example, it is preferable to use an oxide conductive film such as an ITO film or a metal film such as an Ag film that is thin enough to have translucency as the overcoat.

By using a material having high wettability with respect to the material of the adhesive layer as the overcoat material, the material of the adhesive layer can be uniformly applied. Thus, bubbles can be prevented from being mixed when a pair of substrates are bonded to each other, and a configuration in which cohesive failure of the adhesive layer and interfacial failure between the adhesive layer and the adherend layer are less likely to occur. .

As the connection body, various anisotropic conductive films (ACF: Anisotropic Conductive Film), anisotropic conductive pastes (ACP: Anisotropic Conductive Paste), and the like can be used.

As described above, one embodiment of the present invention can be applied to various devices such as a semiconductor device, a light-emitting device, a display device, and an input / output device.

Examples of display elements include EL elements (EL elements including organic and inorganic substances, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.), liquid crystal elements, electrophoretic elements, Examples thereof include a display element using MEMS (micro electro mechanical system).

Note that the light-emitting device of one embodiment of the present invention may be used as a display device or a lighting device. For example, you may utilize as light sources, such as a backlight and a front light, ie, an illuminating device for a display panel.

As described above in this embodiment, the light-emitting device of one embodiment of the present invention has a structure that is difficult to break because an interface failure between an adhesive layer and an adherend layer and a cohesive failure of the adhesive layer hardly occur. By applying one embodiment of the present invention, a highly reliable light-emitting device can be manufactured.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 3)
In this embodiment, an input / output device of one embodiment of the present invention is described with reference to drawings. Note that among the components included in the input / output device, the above description can be referred to for components similar to those of the light-emitting device described in Embodiment 2. In this embodiment, an input / output device using a light-emitting element is illustrated, but the present invention is not limited to this. The input / output device described in this embodiment can also be referred to as a touch panel.

The input / output device of one embodiment of the present invention has a structure that is difficult to break because the interface failure between the adhesive layer and the adherend layer and the cohesive failure of the adhesive layer hardly occur. By applying one embodiment of the present invention, a highly reliable input / output device can be manufactured.

<Configuration example 1>
FIG. 10A is a top view of the input / output device. FIG. 10B is a cross-sectional view taken along the dashed-dotted line AB in FIG. 10A and between the dashed-dotted line CD. FIG. 10C is a cross-sectional view taken along alternate long and short dash line E-F in FIG.

An input / output device 390 illustrated in FIG. 10A includes a display portion 301 (also serving as an input portion), a scanning line driver circuit 303g (1), an imaging pixel driver circuit 303g (2), and an image signal line driver circuit 303s (1). And an imaging signal line driver circuit 303s (2).

The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308.

The pixel 302 has a plurality of subpixels. Each subpixel includes a light emitting element and a pixel circuit.

The pixel circuit can supply power for driving the light emitting element. The pixel circuit is electrically connected to a wiring that can supply a selection signal. The pixel circuit is electrically connected to a wiring that can supply an image signal.

The scan line driver circuit 303g (1) can supply a selection signal to the pixel 302.

The image signal line driver circuit 303 s (1) can supply an image signal to the pixel 302.

A touch sensor can be configured using the imaging pixel 308. Specifically, the imaging pixel 308 can detect a finger or the like that touches the display unit 301.

The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit.

The imaging pixel circuit can drive the photoelectric conversion element. The imaging pixel circuit is electrically connected to a wiring that can supply a control signal. The imaging pixel circuit is electrically connected to a wiring that can supply a power supply potential.

As the control signal, for example, a signal that can select an imaging pixel circuit that reads a recorded imaging signal, a signal that can initialize the imaging pixel circuit, and a time during which the imaging pixel circuit detects light are determined. The signal etc. which can be mentioned can be mentioned.

The imaging pixel drive circuit 303g (2) can supply a control signal to the imaging pixel 308.

The imaging signal line driver circuit 303s (2) can read the imaging signal.

As shown in FIGS. 10B and 10C, the input / output device 390 includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, and a second flexible substrate. 711, a second adhesive layer 713, and a second insulating layer 715. In addition, the first flexible substrate 701 and the second flexible substrate 711 are attached to each other with a third adhesive layer 360.

The first flexible substrate 701 and the first insulating layer 705 are attached to each other with a first adhesive layer 703. In addition, the second flexible substrate 711 and the second insulating layer 715 are bonded to each other with a second adhesive layer 713. Embodiment 2 can be referred to for materials that can be used for the substrate, the adhesive layer, and the insulating layer.

The pixel 302 includes a sub-pixel 302R, a sub-pixel 302G, and a sub-pixel 302B (FIG. 10C).

For example, the subpixel 302R includes a light emitting element 350R and a pixel circuit. The pixel circuit includes a transistor 302t that can supply power to the light-emitting element 350R. The sub-pixel 302R further includes an optical element (eg, a colored layer 367R that transmits red light).

The light-emitting element 350R includes a lower electrode 351R, an EL layer 353, and an upper electrode 352 which are stacked in this order (FIG. 10C).

The EL layer 353 includes a first EL layer 353a, an intermediate layer 354, and a second EL layer 353b which are stacked in this order.

Note that a microcavity structure can be provided in the light-emitting element 350R so that light with a specific wavelength can be extracted efficiently. Specifically, an EL layer may be disposed between a film that reflects visible light and a semi-reflective / semi-transmissive film that is arranged so that specific light can be extracted efficiently.

For example, the sub-pixel 302R includes a third adhesive layer 360 that is in contact with the light-emitting element 350R and the coloring layer 367R. The colored layer 367R is in a position overlapping the light emitting element 350R. Thus, part of the light emitted from the light emitting element 350R passes through the third adhesive layer 360 and the colored layer 367R and is emitted to the outside of the sub-pixel 302R as indicated by an arrow in the drawing.

The input / output device 390 includes a light shielding layer 367BM. The light shielding layer 367BM is provided so as to surround the colored layer (for example, the colored layer 367R).

The input / output device 390 includes an antireflection layer 367 p at a position overlapping the display portion 301. For example, a circularly polarizing plate can be used as the antireflection layer 367p.

The input / output device 390 includes an insulating layer 321. The insulating layer 321 covers the transistor 302t and the like. Note that the insulating layer 321 can be used as a layer for planarizing unevenness caused by a pixel circuit or an imaging pixel circuit. The transistor 302t and the like are preferably covered with an insulating layer capable of suppressing diffusion of impurities into the transistor 302t and the like.

The input / output device 390 includes a partition wall 328 that overlaps an end portion of the lower electrode 351R. In addition, a spacer 329 for controlling the distance between the first flexible substrate 701 and the second flexible substrate 711 is provided over the partition 328.

The image signal line driver circuit 303s (1) includes a transistor 303t and a capacitor 303c. Note that the driver circuit can be formed over the same substrate in the same process as the pixel circuit. As illustrated in FIG. 10B, the transistor 303t may include the second gate 304 over the insulating layer 321. The second gate 304 may be electrically connected to the gate of the transistor 303t, or a different potential may be applied thereto. If necessary, the second gate 304 may be provided in the transistor 308t, the transistor 302t, or the like.

The imaging pixel 308 includes a photoelectric conversion element 308p and an imaging pixel circuit. The imaging pixel circuit can detect light applied to the photoelectric conversion element 308p. The imaging pixel circuit includes a transistor 308t. For example, a pin-type photodiode can be used for the photoelectric conversion element 308p.

The input / output device 390 includes a wiring 311 that can supply a signal, and a terminal 319 is provided in the wiring 311. An FPC 309 that can supply a signal such as an image signal and a synchronization signal is electrically connected to the terminal 319. A printed wiring board (PWB) may be attached to the FPC 309.

Note that transistors such as the transistor 302t, the transistor 303t, and the transistor 308t can be formed in the same process. Or you may form in a respectively different process.

<Configuration example 2>
11A and 11B are perspective views of the input / output device 505. FIG. Note that representative components are shown for clarity. 12 is a cross-sectional view taken along alternate long and short dash line X1-X2 in FIG.

As shown in FIGS. 11A and 11B, the input / output device 505 includes a display portion 501, a scan line driver circuit 303g (1), a touch sensor 595, and the like. The input / output device 505 includes a first flexible substrate 701, a second flexible substrate 711, and a flexible substrate 590.

The input / output device 505 includes a plurality of pixels and a plurality of wirings 311. The plurality of wirings 311 can supply signals to the pixels. The plurality of wirings 311 are routed to the outer peripheral portion of the first flexible substrate 701, and a part thereof constitutes a terminal 319. The terminal 319 is electrically connected to the FPC 509 (1).

The input / output device 505 includes a touch sensor 595 and a plurality of wirings 598. The plurality of wirings 598 are electrically connected to the touch sensor 595. The plurality of wirings 598 are routed around the outer peripheral portion of the flexible substrate 590, and a part thereof constitutes a terminal. The terminal is electrically connected to the FPC 509 (2). Note that in FIG. 11B, for clarity, electrodes, wirings, and the like of the touch sensor 595 provided on the back surface side of the flexible substrate 590 (the surface side facing the second flexible substrate 711) are indicated by solid lines. Show.

As the touch sensor 595, for example, a capacitive touch sensor can be applied. Examples of the electrostatic capacity method include a surface electrostatic capacity method and a projection electrostatic capacity method. Here, a case where a projected capacitive touch sensor is applied is shown.

As the projected capacitance method, there are mainly a self-capacitance method and a mutual capacitance method due to a difference in driving method. The mutual capacitance method is preferable because simultaneous multipoint detection is possible.

Note that as the touch sensor 595, various sensors that can detect the proximity or contact of a detection target such as a finger can be used.

The projected capacitive touch sensor 595 includes an electrode 591 and an electrode 592. The electrode 591 is electrically connected to any one of the plurality of wirings 598, and the electrode 592 is electrically connected to any one of the plurality of wirings 598.

As shown in FIGS. 11A and 11B, the electrode 592 has a shape in which a plurality of quadrilaterals repeatedly arranged in one direction are connected at corners.

The electrode 591 has a quadrangular shape, and is repeatedly arranged in a direction intersecting with the direction in which the electrode 592 extends. Note that the plurality of electrodes 591 are not necessarily arranged in a direction orthogonal to the one electrode 592, and may be arranged at an angle of less than 90 degrees.

The wiring 594 is provided so as to cross the electrode 592. The wiring 594 electrically connects two electrodes 591 sandwiching the electrode 592. At this time, a shape in which the area of the intersection of the electrode 592 and the wiring 594 is as small as possible is preferable. Thereby, the area of the area | region in which the electrode is not provided can be reduced, and the nonuniformity of the transmittance | permeability can be reduced. As a result, luminance unevenness of light transmitted through the touch sensor 595 can be reduced.

Note that the shapes of the electrode 591 and the electrode 592 are not limited thereto, and various shapes can be employed.

As shown in FIG. 12A, the input / output device 505 includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a second flexible substrate 711, and a second flexible substrate 701. An adhesive layer 713 and a second insulating layer 715. In addition, the first flexible substrate 701 and the second flexible substrate 711 are attached to each other with a third adhesive layer 360.

The adhesive layer 597 bonds the flexible substrate 590 to the second flexible substrate 711 so that the touch sensor 595 overlaps the display portion 501. The adhesive layer 597 has a light-transmitting property.

The electrodes 591 and 592 are formed using a light-transmitting conductive material. As the light-transmitting conductive material, a conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, or zinc oxide to which gallium is added can be used. Note that a film containing graphene can also be used. The film containing graphene can be formed, for example, by reducing a film containing graphene oxide formed in a film shape. Examples of the reduction method include a method of applying heat.

In addition, a conductive film such as the electrode 591, the electrode 592, and the wiring 594, that is, a transparent conductive film (for example, ITO) containing indium oxide, tin oxide, zinc oxide, or the like as a material used for the wiring or the electrodes constituting the touch panel. Can be mentioned. Moreover, it is preferable that the material which can be used for the wiring and electrode which comprise a touch panel has low resistance value. As an example, silver, copper, aluminum, carbon nanotube, graphene, metal halide (such as silver halide), or the like may be used. Furthermore, a metal nanowire that is made very thin (for example, a diameter of several nanometers) and includes a plurality of conductors may be used. Or you may use the metal mesh which made the conductor a mesh shape. As an example, Ag nanowire, Cu nanowire, Al nanowire, Ag mesh, Cu mesh, Al mesh, or the like may be used. For example, when Ag nanowires are used for the wiring and electrodes constituting the touch panel, the transmittance in visible light can be 89% or more and the sheet resistance value can be 40Ω / □ or more and 100Ω / □ or less. In addition, metal nanowires, metal meshes, carbon nanotubes, graphene, and the like, which are examples of materials that can be used for the wiring and electrodes included in the touch panel described above, have high transmittance in visible light; For example, it may be used as a pixel electrode or a common electrode.

After forming a light-transmitting conductive material over the flexible substrate 590 by a sputtering method, unnecessary portions are removed by various patterning techniques such as a photolithography method to form the electrode 591 and the electrode 592. can do.

The electrodes 591 and 592 are covered with an insulating layer 593. An opening reaching the electrode 591 is provided in the insulating layer 593, and the wiring 594 electrically connects the adjacent electrodes 591. Since the light-transmitting conductive material can increase the aperture ratio of the input / output device, it can be preferably used for the wiring 594. A material having higher conductivity than the electrodes 591 and 592 can be preferably used for the wiring 594 because electric resistance can be reduced.

Note that an insulating layer that covers the insulating layer 593 and the wiring 594 can be provided to protect the touch sensor 595.

In addition, the connection layer 599 electrically connects the wiring 598 and the FPC 509 (2).

The display portion 501 includes a plurality of pixels arranged in a matrix. Since the pixels are the same as those in Configuration Example 1, description thereof is omitted.

Note that as illustrated in FIG. 12B, the touch panel may be formed using two substrates of the first flexible substrate 701 and the second flexible substrate 711 without using the flexible substrate 590. Good. A second flexible substrate 711 and a second insulating layer 715 are attached to each other with a second adhesive layer 713, and a touch sensor 595 is provided in contact with the second insulating layer 715. A colored layer 367R and a light-blocking layer 367BM are provided in contact with the insulating layer 589 that covers the touch sensor 595. The insulating layer 589 is not provided, and the coloring layer 367R and the light-blocking layer 367BM may be provided in contact with the wiring 594.

<Configuration example 3>
FIG. 13 is a cross-sectional view of the input / output device 505B. In the input / output device 505B described in this embodiment, the supplied image information is displayed on a side where a transistor is provided and a touch sensor is provided on the first flexible substrate 701 side of the display portion. This is different from the input / output device 505 of the configuration example 2. Here, different configurations will be described in detail, and the above description is used for the portions where the same configurations can be used.

The colored layer 367R is in a position overlapping the light emitting element 350R. In addition, the light-emitting element 350R illustrated in FIG. 13A emits light to the side where the transistor 302t is provided. Thereby, part of the light emitted from the light emitting element 350R passes through the colored layer 367R and is emitted to the outside of the input / output device 505B in the direction of the arrow shown in the drawing.

The input / output device 505B includes a light-blocking layer 367BM in the direction of emitting light. The light shielding layer 367BM is provided so as to surround the colored layer (for example, the colored layer 367R).

The touch sensor 595 is provided not on the second flexible substrate 711 side but on the first flexible substrate 701 side (FIG. 13A).

The adhesive layer 597 bonds the flexible substrate 590 to the first flexible substrate 701 so that the touch sensor 595 overlaps the display portion. The adhesive layer 597 has a light-transmitting property.

A structure in the case where a bottom-gate transistor is applied to the display portion 501 is illustrated in FIGS.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 302t and the transistor 303t illustrated in FIG.

For example, a semiconductor layer containing polycrystalline silicon or the like can be used in the transistor 302t and the transistor 303t illustrated in FIG.

A structure in the case of using a top-gate transistor is illustrated in FIG.

For example, a semiconductor layer including a single crystal silicon film or the like transferred from polycrystalline silicon or a single crystal silicon substrate can be applied to the transistor 302t and the transistor 303t illustrated in FIG.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 4)
In this embodiment, an electronic device and a lighting device of one embodiment of the present invention will be described with reference to drawings.

A light-emitting device, a display device, a semiconductor device, or the like that can be used for an electronic device or a lighting device can be manufactured with high yield by applying the peeling method of one embodiment of the present invention. By applying the peeling method of one embodiment of the present invention, an electronic device or a lighting device with high productivity and a curved surface or flexibility can be manufactured.

Further, a highly reliable electronic device or lighting device can be manufactured using the light-emitting device, the display device, the input / output device, or the like of one embodiment of the present invention. Further, with the use of the light-emitting device, display device, input / output device, or the like of one embodiment of the present invention, a highly reliable electronic device or lighting device having a curved surface or flexibility can be manufactured.

Examples of the electronic device include a television device (also referred to as a television or a television receiver), a monitor for a computer, a digital camera, a digital video camera, a digital photo frame, a mobile phone (also referred to as a mobile phone or a mobile phone device). ), Large game machines such as portable game machines, portable information terminals, sound reproducing devices, and pachinko machines.

In addition, since the electronic device or the lighting device of one embodiment of the present invention has flexibility, it can be incorporated along an inner wall or an outer wall of a house or a building, or a curved surface of an interior or exterior of an automobile.

The electronic device of one embodiment of the present invention may include a secondary battery, and it is preferable that the secondary battery can be charged using non-contact power transmission.

Secondary batteries include, for example, lithium ion secondary batteries such as lithium polymer batteries (lithium ion polymer batteries) using gel electrolyte, nickel metal hydride batteries, nickel-cadmium batteries, organic radical batteries, lead storage batteries, air secondary batteries, nickel A zinc battery, a silver zinc battery, etc. are mentioned.

The electronic device of one embodiment of the present invention may include an antenna. By receiving a signal with an antenna, video, information, and the like can be displayed on the display unit. In the case where the electronic device has an antenna and a secondary battery, the antenna may be used for non-contact power transmission.

FIGS. 14A, 14B, 14C1, 2D, and 1E each illustrate an example of an electronic device having a curved display portion 7000. FIG. The display portion 7000 is provided with a curved display surface, and can perform display along the curved display surface. Note that the display portion 7000 may have flexibility.

The display portion 7000 is manufactured using the light-emitting device, the display device, the input / output device, or the like of one embodiment of the present invention.

According to one embodiment of the present invention, an electronic device including a curved display portion can be provided with high yield. Alternatively, according to one embodiment of the present invention, a highly reliable electronic device including a curved display portion can be provided.

FIG. 14A illustrates an example of a mobile phone. A cellular phone 7100 includes a housing 7101, a display portion 7000, operation buttons 7103, an external connection port 7104, a speaker 7105, a microphone 7106, and the like.

A cellular phone 7100 illustrated in FIG. 14A includes a touch sensor in the display portion 7000. All operations such as making a call or inputting characters can be performed by touching the display portion 7000 with a finger or a stylus.

Further, by operating the operation button 7103, the power ON / OFF operation and the type of image displayed on the display portion 7000 can be switched. For example, the mail creation screen can be switched to the main menu screen.

FIG. 14B illustrates an example of a television device. In the television device 7200, a display portion 7000 is incorporated in a housing 7201. Here, a structure in which the housing 7201 is supported by a stand 7203 is shown.

Operation of the television device 7200 illustrated in FIG. 14B can be performed with an operation switch included in the housing 7201 or a separate remote controller 7211. Alternatively, the display unit 7000 may be provided with a touch sensor, and may be operated by touching the display unit 7000 with a finger or the like. The remote controller 7211 may include a display unit that displays information output from the remote controller 7211. Channels and volume can be operated with an operation key or a touch panel included in the remote controller 7211, and an image displayed on the display portion 7000 can be operated.

Note that the television device 7200 is provided with a receiver, a modem, and the like. A general television broadcast can be received by the receiver. In addition, by connecting to a wired or wireless communication network via a modem, information communication is performed in one direction (from the sender to the receiver) or in two directions (between the sender and the receiver or between the receivers). It is also possible.

An example of a portable information terminal is shown in FIGS. 14 (C1), (C2), (D), and (E). Each portable information terminal includes a housing 7301 and a display portion 7000. Furthermore, an operation button, an external connection port, a speaker, a microphone, an antenna, a battery, or the like may be included. The display unit 7000 includes a touch sensor. The portable information terminal can be operated by touching the display portion 7000 with a finger or a stylus.

14C1 is a perspective view of the portable information terminal 7300, and FIG. 14C2 is a top view of the portable information terminal 7300. FIG. FIG. 14D is a perspective view of the portable information terminal 7310. FIG. 14E is a perspective view of the portable information terminal 7320.

The portable information terminal exemplified in this embodiment has one or a plurality of functions selected from, for example, a telephone, a notebook, an information browsing device, or the like. Specifically, each can be used as a smartphone. The portable information terminal exemplified in this embodiment can execute various applications such as mobile phone, e-mail, text browsing and creation, music playback, Internet communication, and computer games.

The portable information terminal 7300, the portable information terminal 7310, and the portable information terminal 7320 can display characters and image information on a plurality of surfaces. For example, as shown in FIGS. 14C1 and 14D, three operation buttons 7302 can be displayed on one surface, and information 7303 indicated by a rectangle can be displayed on the other surface. 14C1 and 14C2 illustrate examples in which information is displayed on the upper side of the portable information terminal, and FIG. 14D illustrates an example in which information is displayed on the side of the portable information terminal. Information may be displayed on three or more surfaces of the portable information terminal. FIG. 14E illustrates an example in which information 7304, information 7305, and information 7306 are displayed on different surfaces.

Examples of information include SNS (social networking service) notifications, displays that notify incoming calls such as e-mails and telephone calls, e-mail titles or sender names, date and time, time, battery level, antenna There is the strength of reception. Alternatively, an operation button, an icon, or the like may be displayed instead of the information at a position where the information is displayed.

For example, the user of the portable information terminal 7300 can check the display (information 7303 in this case) in a state where the portable information terminal 7300 is stored in the chest pocket of clothes.

Specifically, the telephone number or name of the caller of the incoming call is displayed at a position where the mobile information terminal 7300 can be observed from above. The user can check the display and determine whether to receive a call without taking out the portable information terminal 7300 from the pocket.

FIGS. 14F to 14H illustrate an example of a lighting device having a curved light emitting portion.

Light-emitting portions included in the lighting devices illustrated in FIGS. 14F to 14H are manufactured using the light-emitting device of one embodiment of the present invention.

According to one embodiment of the present invention, a lighting device including a curved light-emitting portion can be provided with high yield. Alternatively, according to one embodiment of the present invention, a highly reliable lighting device including a curved light-emitting portion can be provided.

A lighting device 7400 illustrated in FIG. 14F includes a light-emitting portion 7402 having a wavy light-emitting surface. Therefore, the lighting device has high design.

A light emitting portion 7412 included in the lighting device 7410 illustrated in FIG. 14G has a structure in which two light emitting portions curved in a convex shape are arranged symmetrically. Therefore, all directions can be illuminated around the lighting device 7410.

A lighting device 7420 illustrated in FIG. 14H includes a light-emitting portion 7422 curved in a concave shape. Therefore, the light emitted from the light emitting unit 7422 is condensed on the front surface of the lighting device 7420, which is suitable for brightly illuminating a specific range. In addition, with such a configuration, there is an effect that it is difficult to make a shadow.

In addition, each light emitting unit included in the lighting device 7400, the lighting device 7410, and the lighting device 7420 may have flexibility. The light emitting portion may be fixed by a member such as a plastic member or a movable frame, and the light emitting surface of the light emitting portion may be freely bent according to the application.

Each of the lighting device 7400, the lighting device 7410, and the lighting device 7420 includes a base portion 7401 including an operation switch 7403 and a light emitting portion supported by the base portion 7401.

Note that although the lighting device in which the light emitting unit is supported by the base is illustrated here, a housing including the light emitting unit can be fixed to the ceiling or can be used to hang from the ceiling. Since the light emitting surface can be curved and used, the light emitting surface can be curved concavely to illuminate a specific area, or the light emitting surface can be curved convexly to illuminate the entire room.

FIGS. 15A1 to 15I each show an example of a portable information terminal including a flexible display portion 7001. FIG.

The display portion 7001 is manufactured using the light-emitting device, the display device, the input / output device, or the like of one embodiment of the present invention. For example, a light-emitting device, a display device, or an input / output device that can be bent with a curvature radius of 0.01 mm to 150 mm can be used. The display portion 7001 may include a touch sensor, and the portable information terminal can be operated by touching the display portion 7001 with a finger or the like.

According to one embodiment of the present invention, an electronic device including a flexible display portion can be provided with high yield. Alternatively, according to one embodiment of the present invention, a highly reliable electronic device including a flexible display portion can be provided.

FIG. 15A1 is a perspective view illustrating an example of a portable information terminal, and FIG. 15A2 is a side view illustrating an example of a portable information terminal. A portable information terminal 7500 includes a housing 7501, a display portion 7001, a drawer member 7502, operation buttons 7503, and the like.

A portable information terminal 7500 includes a flexible display portion 7001 wound in a roll shape in a housing 7501.

Further, the portable information terminal 7500 can receive a video signal by a built-in control unit, and can display the received video on the display unit 7001. In addition, the portable information terminal 7500 has a built-in battery. Further, a terminal portion for connecting a connector to the housing 7501 may be provided, and a video signal and power may be directly supplied from the outside by wire.

Further, operation buttons 7503 can be used to perform power ON / OFF operations, switching of displayed images, and the like. Note that FIGS. 15A1, 15 </ b> A <b> 2, and 15 </ b> B illustrate an example in which the operation button 7503 is arranged on the side surface of the portable information terminal 7500, but the present invention is not limited to this, and the same surface as the display surface of the portable information terminal 7500 (Front surface) or on the back surface.

FIG. 15B illustrates the portable information terminal 7500 with the display portion 7001 pulled out. In this state, an image can be displayed on the display portion 7001. The display portion 7001 can be pulled out using a pullout member 7502. In addition, the portable information terminal 7500 performs different display according to the state of FIG. 15A1 in which part of the display portion 7001 is rolled up and the state of FIG. 15B in which the display portion 7001 is pulled out. Also good. For example, in the state of FIG. 15A1, power consumption of the portable information terminal 7500 can be reduced by hiding a portion of the display portion 7001 wound in a roll shape.

Note that a reinforcing frame may be provided on a side portion of the display portion 7001 in order to fix the display surface of the display portion 7001 so that the display surface becomes flat when the display portion 7001 is pulled out.

In addition to this configuration, a speaker may be provided in the housing, and audio may be output by an audio signal received together with the video signal.

FIGS. 15C to 15E show examples of portable information terminals that can be folded. In FIG. 15C, the mobile information terminal in the expanded state, in FIG. 15D, in the middle of changing from one of the expanded state or the folded state to the other, in FIG. 15E, in the folded state. 7600 is shown. The portable information terminal 7600 is excellent in portability in the folded state, and in the expanded state, the portable information terminal 7600 is excellent in listability due to a seamless wide display area.

The display portion 7001 is supported by three housings 7601 connected by a hinge 7602. By bending between the two housings 7601 through the hinge 7602, the portable information terminal 7600 can be reversibly deformed from a developed state to a folded state.

FIGS. 15F and 15G show examples of portable information terminals that can be folded. FIG. 15F illustrates the portable information terminal 7650 in a state where the display portion 7001 is folded so as to be on the inside, and FIG. 15G illustrates a portable information terminal 7650 in a state where the display portion 7001 is folded on the outside. The portable information terminal 7650 includes a display portion 7001 and a non-display portion 7651. When the portable information terminal 7650 is not used, the display portion 7001 can be folded so that the display portion 7001 is on the inner side, whereby the display portion 7001 can be prevented from being dirty or damaged.

FIG. 15H illustrates an example of a flexible portable information terminal. A portable information terminal 7700 includes a housing 7701 and a display portion 7001. Further, buttons 7703a and 7703b as input means, speakers 7704a and 7704b as sound output means, an external connection port 7705, a microphone 7706, and the like may be provided. In addition, the portable information terminal 7700 can be equipped with a flexible battery 7709. The battery 7709 may be disposed so as to overlap with the display portion 7001, for example.

The housing 7701, the display portion 7001, and the battery 7709 have flexibility. Therefore, it is easy to curve the portable information terminal 7700 into a desired shape or to twist the portable information terminal 7700. For example, the portable information terminal 7700 can be used by being folded so that the display portion 7001 is inside or outside. Alternatively, the portable information terminal 7700 can be used in a rolled state. In this manner, since the housing 7701 and the display portion 7001 can be freely deformed, the portable information terminal 7700 is hardly damaged even when it is dropped or an unintended external force is applied. There are advantages.

Further, since the portable information terminal 7700 is lightweight, it can be used by holding the top of the housing 7701 with a clip or the like and hanging it, or by fixing the housing 7701 to a wall surface with a magnet or the like. Can be used conveniently.

FIG. 15I illustrates an example of a wristwatch-type portable information terminal. A portable information terminal 7800 includes a band 7801, a display portion 7001, input / output terminals 7802, operation buttons 7803, and the like. The band 7801 has a function as a housing. Further, the portable information terminal 7800 can be equipped with a flexible battery 7805. The battery 7805 may be disposed so as to overlap with the display portion 7001 or the band 7801, for example.

The band 7801, the display portion 7001, and the battery 7805 are flexible. Therefore, it is easy to curve the portable information terminal 7800 into a desired shape.

The operation button 7803 can have various functions such as time setting, power on / off operation, wireless communication on / off operation, manner mode execution and release, and power saving mode execution and release. . For example, the function of the operation button 7803 can be freely set by an operating system incorporated in the portable information terminal 7800.

In addition, an application can be started by touching an icon 7804 displayed on the display portion 7001 with a finger or the like.

In addition, the portable information terminal 7800 can perform short-range wireless communication with a communication standard. For example, it is possible to talk hands-free by communicating with a headset capable of wireless communication.

Further, the portable information terminal 7800 may include an input / output terminal 7802. In the case of having the input / output terminal 7802, data can be directly exchanged with another information terminal via a connector. Charging can also be performed through the input / output terminal 7802. Note that the charging operation of the portable information terminal exemplified in this embodiment may be performed by non-contact power transmission without using an input / output terminal.

FIG. 16A illustrates the appearance of an automobile 9700. FIG. FIG. 16B shows a driver's seat of an automobile 9700. The automobile 9700 includes a vehicle body 9701, wheels 9702, a dashboard 9703, lights 9704, and the like. The display device, the input / output device, or the like of one embodiment of the present invention can be used for a display portion of an automobile 9700 or the like. For example, the display device or the input / output device of one embodiment of the present invention can be provided in the display portion 9710 to the display portion 9715 illustrated in FIG.

A display portion 9710 and a display portion 9711 are display devices provided on the windshield of the automobile. The display device, the input / output device, or the like of one embodiment of the present invention can be in a so-called see-through state in which the opposite side can be seen through by forming electrodes and wirings using a light-transmitting conductive material. When the display portion 9710 and the display portion 9710 are in a see-through state, the visibility is not hindered even when the automobile 9700 is driven. Therefore, the display device, the input / output device, or the like of one embodiment of the present invention can be provided on the windshield of the automobile 9700. Note that in the case where a transistor for driving a display device, an input / output device, or the like is provided, a light-transmitting transistor such as an organic transistor using an organic semiconductor material or a transistor using an oxide semiconductor is used. Good.

A display portion 9712 is a display device provided in the pillar portion. For example, the field of view blocked by the pillar can be complemented by displaying an image from the imaging means provided on the vehicle body on the display portion 9712. A display portion 9713 is a display device provided in the dashboard portion. For example, by displaying an image from an imaging unit provided on the vehicle body on the display portion 9713, the view blocked by the dashboard can be complemented. That is, by projecting an image from the imaging means provided outside the automobile, the blind spot can be compensated and safety can be improved. Also, by displaying a video that complements the invisible part, it is possible to confirm the safety more naturally and without a sense of discomfort.

FIG. 16C shows the interior of an automobile in which bench seats are used for the driver seat and the passenger seat. The display portion 9721 is a display device provided in the door portion. For example, the field of view blocked by the door can be complemented by displaying an image from an imaging unit provided on the vehicle body on the display portion 9721. The display portion 9722 is a display device provided on the handle. The display unit 9723 is a display device provided at the center of the seat surface of the bench seat. Note that the display device can be installed on a seating surface or a backrest portion, and the display device can be used as a seat heater using heat generated by the display device as a heat source.

The display portion 9714, the display portion 9715, or the display portion 9722 can provide various other information such as navigation information, a speedometer and a tachometer, a travel distance, an oil supply amount, a gear state, and an air conditioner setting. In addition, display items, layouts, and the like displayed on the display unit can be changed as appropriate according to the user's preference. Note that the above information can also be displayed on the display portion 9710 to the display portion 9713, the display portion 9721, and the display portion 9723. The display portions 9710 to 9715 and the display portions 9721 to 9723 can also be used as lighting devices. The display portions 9710 to 9715 and the display portions 9721 to 9723 can also be used as heating devices.

The display portion to which the light-emitting device, the display device, the input / output device, or the like of one embodiment of the present invention is applied may be a flat surface. In this case, the light-emitting device, the display device, the input / output device, or the like of one embodiment of the present invention may have a curved surface or no flexibility.

A portable game machine shown in FIG. 16D includes a housing 9801, a housing 9802, a display portion 9803, a display portion 9804, a microphone 9805, a speaker 9806, operation keys 9807, a stylus 9808, and the like.

A portable game machine shown in FIG. 16D includes two display portions (a display portion 9803 and a display portion 9804). Note that the number of display portions included in the electronic device of one embodiment of the present invention is not limited to two, and may be one or three or more. In the case where the electronic device includes a plurality of display portions, at least one display portion only needs to include the light-emitting device, the display device, the input / output device, or the like of one embodiment of the present invention.

FIG. 16E illustrates a laptop personal computer, which includes a housing 9821, a display portion 9822, a keyboard 9823, a pointing device 9824, and the like.

This embodiment can be combined with any of the other embodiments as appropriate.

DESCRIPTION OF SYMBOLS 101 Preparation substrate 103 Peeling layer 105 Peeling layer 107 Adhesion layer 109 Substrate 111 Adhesion layer 113 Resin layer 150 Layer 151 containing a peeling layer Tape 153 Support roller 154 Guide roller 155 First substrate 156 Peeling layer 201 Preparation substrate 203 Peeling layer 205 layer to be peeled 207 adhesive layer 211 adhesive layer 221 fabrication substrate 223 peeling layer 225 substrate to be peeled 231 substrate 233 adhesive layer 235 adhesive layer 301 display portion 302 pixel 302B subpixel 302G subpixel 302R subpixel 302t transistor 303c capacitor 303g (1) Scanning line driving circuit 303g (2) Imaging pixel driving circuit 303s (1) Image signal line driving circuit 303s (2) Imaging signal line driving circuit 303t Transistor 304 Gate 308 Imaging pixel 308p Photoelectric conversion element 308t Transistor 309 FP
311 Wiring 319 Terminal 321 Insulating layer 328 Partition 329 Spacer 350R Light emitting element 351R Lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Intermediate layer 360 Adhesive layer 367BM Light shielding layer 367p Antireflection layer 367R Coloring layer 390 Input / output device 501 Display unit 505 I / O device 505B I / O device 509 FPC
589 Insulating layer 590 Flexible substrate 591 Electrode 592 Electrode 593 Insulating layer 594 Wiring 595 Touch sensor 597 Adhesive layer 598 Wiring 599 Connection layer 701 First flexible substrate 703 Adhesive layer 705 Insulating layer 711 Second flexible substrate 713 Adhesive layer 715 Insulating layer 804 Light emitting portion 806 Drive circuit portion 808 FPC
814 Conductive layer 815 Insulating layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 Transistor 821 Insulating layer 822 Adhesive layer 823 Spacer 824 Transistor 825 Connection element 830 Light emitting element 831 Lower electrode 832 Optical adjustment layer 833 EL layer 835 Upper electrode 845 Colored layer 847 Light-shielding layer 849 Overcoat 856 Conductive layer 857 Conductive layer 857a Conductive layer 857b Conductive layer 7000 Display unit 7001 Display unit 7100 Mobile phone 7101 Case 7103 Operation button 7104 External connection port 7105 Speaker 7106 Microphone 7200 Television device 7201 Case 7203 Stand 7211 Remote controller 7300 Portable information terminal 7301 Case 7302 Operation button 7303 Information 7304 Information 7305 Information 7306 Information 7310 Portable information terminal 7 320 portable information terminal 7400 lighting device 7401 base unit 7402 light emitting unit 7403 operation switch 7410 lighting device 7412 light emitting unit 7420 lighting device 7422 light emitting unit 7500 portable information terminal 7501 housing 7502 member 7503 operation button 7600 portable information terminal 7601 housing 7602 hinge 7650 Portable information terminal 7651 Non-display unit 7700 Portable information terminal 7701 Case 7703a Button 7703b Button 7704a Speaker 7704b Speaker 7705 External connection port 7706 Microphone 7709 Battery 7800 Portable information terminal 7801 Band 7802 Input / output terminal 7803 Operation button 7804 Icon 7805 Battery 9700 Car 9701 Car body 9702 Wheel 9703 Dashboard 9704 Light 9710 Display unit 9711 Display unit 9712 Display unit 9713 Display unit 9714 Display unit 9715 Display unit 9721 Display unit 9721 Display unit 9722 Display unit 9723 Display unit 9801 Housing 9802 Housing 9803 Display unit 9804 Display unit 9805 Microphone 9806 Speaker 9807 Operation key 9808 Stylus 9821 Housing 9822 Display unit 9823 Keyboard 9824 pointing device

Claims (10)

A peeling method having first to fifth steps,
The first step includes a step of forming a release layer on the first substrate,
The second step includes a step of forming a layer to be peeled on the peeling layer,
The third step includes a step of overlaying an adhesive layer on the release layer and the layer to be peeled, and a step of curing the adhesive layer,
The fourth step includes a step of removing a part of the layer to be peeled that overlaps the peeling layer and the adhesive layer to form a starting point of peeling,
The fifth step includes a step of separating the first substrate and the layer to be peeled,
The force for separating the first substrate and the layer to be peeled in the fifth step is greater than or equal to the force required for separating the first substrate and the layer to be peeled,
The force required to separate the first substrate and the layer to be peeled is greater than the force required to cause interface fracture between the layer to be peeled and the adhesive layer cured in the third step. Small peeling method. In claim 1,
A peeling method, wherein a force required to cause interface fracture between the peelable layer and the adhesive layer cured in the third step is 0.14 N / 25 mm or more. In claim 1 or 2,
The peeling method wherein the force required to cause cohesive failure of the adhesive layer cured in the third step is 0.14 N / 25 mm or more. In any one of Claims 1 thru | or 3,
A peeling method in which the force for separating the first substrate and the layer to be peeled in the fifth step is 0.10 N / 25 mm or less. A first flexible substrate, a second flexible substrate, a first adhesive layer, a second adhesive layer, a first insulating layer, and a first functional layer;
The first adhesive layer is located between the first flexible substrate and the first insulating layer,
The second adhesive layer is located between the second flexible substrate and the first functional layer,
The first adhesive layer and the second adhesive layer have portions that overlap each other via the first insulating layer and the first functional layer,
The first functional layer has a light emitting element,
The force required to cause interface fracture between the second adhesive layer and the first functional layer or between the second adhesive layer and the second flexible substrate is 0. A light emitting device of 14 N / 25 mm or more. In claim 5,
The light-emitting device, wherein a force required to cause cohesive failure of the second adhesive layer is 0.14 N / 25 mm or more. First flexible substrate, second flexible substrate, first adhesive layer, second adhesive layer, third adhesive layer, first insulating layer, second insulating layer, first function A layer, and a second functional layer,
The first adhesive layer is located between the first flexible substrate and the first insulating layer,
The second adhesive layer is located between the second flexible substrate and the second insulating layer;
The third adhesive layer is located between the first functional layer and the second functional layer,
The first adhesive layer and the third adhesive layer have portions that overlap each other via the first insulating layer and the first functional layer,
The second adhesive layer and the third adhesive layer have portions that overlap each other via the second insulating layer and the second functional layer,
The first functional layer has a light emitting element,
The second functional layer has a colored layer,
The force required to cause interface breakdown between the third adhesive layer and the first functional layer or between the third adhesive layer and the second functional layer is 0.14 N / 25 mm or more A light emitting device. In claim 7,
The light-emitting device, wherein the force required to cause cohesive failure of the third adhesive layer is 0.14 N / 25 mm or more. A light emitting device according to any one of claims 5 to 8,
And a flexible printed circuit board. A module according to claim 9;
An electronic device including an antenna, a battery, a housing, a speaker, a microphone, an operation switch, or an operation button.

Images