JP2016051993A - Piezoelectric piece bend-off device and manufacturing method for piezoelectric piece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric piece bend-off device that is able to hold a piezoelectric wafer appropriately.SOLUTION: A bend-off device 1 comprises: a tray table 13; a tray 15; a suction device 17; and a head device 11. The tray table 13 has a first suction hole 13h that is open in the upper surface. The tray 15 has: an accommodating recess 21r that is open in the upper surface; and a second suction hole 21h passing through from the lower surface to the upper surface around the accommodating recess 21r. The tray is placed on the upper surface of the tray table 13 such that the second suction hole 21h and the first suction hole 13h communicate with each other. The suction device 17 exhausts the second suction hole 21h via the first suction hole 13h, and sucks a crystal wafer 121 onto the upper surface of the tray 15. The head device 11 pushes downward a predetermined portion located on the accommodating recess 21r of the crystal wafer 121, bends the predetermined portion off the other portion of the crystal wafer 121, thereby using the predetermined portion as a crystal piece 115.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a piezoelectric piece breaker that breaks a piezoelectric piece from a piezoelectric wafer, and a method for manufacturing the piezoelectric piece. The piezoelectric piece is used for, for example, a piezoelectric oscillator and a piezoelectric vibrator for generating an oscillation signal. The piezoelectric piece is, for example, a crystal piece.

  2. Description of the Related Art As a crystal oscillator or a crystal resonator, one having a crystal resonator element configured by providing an excitation electrode on a plate-shaped crystal piece is known. For example, the quartz resonator element is manufactured as follows. First, the crystal wafer is etched to form a portion that becomes a crystal piece and a frame-like portion that is connected to one side of the crystal piece and supports the crystal piece. Next, an excitation electrode is formed on the crystal piece. Thereafter, the portion between the crystal piece and the frame-like portion is folded (broken) to completely separate the crystal piece.

  For example, a technique described in Patent Document 1 is known as an apparatus for folding a crystal piece from a frame-shaped portion. The folding device of Patent Document 1 includes a tray on which a crystal wafer is placed and a pressing plate that presses the crystal wafer from above. The tray has a recess formed at a position corresponding to the crystal piece, and the pressing plate has an opening formed at a position corresponding to the crystal piece. Then, the folding device pushes the crystal piece downward (a concave portion of the tray) through the opening of the pressing plate by the nozzle-like head, and folds the crystal piece from the crystal wafer.

JP 2010-258790 A

  In the technique of Patent Document 1, the piezoelectric wafer is fixed by pressing the piezoelectric wafer from above with a pressing plate. Therefore, for example, even when the piezoelectric wafer can be properly positioned on the tray, when the piezoelectric wafer is pressed by the pressing plate, the positional deviation of the piezoelectric wafer may occur due to the positional shift of the pressing plate. Further, for example, the pressing plate may damage the piezoelectric piece or the excitation electrode on the piezoelectric piece. Furthermore, the cost for providing a pressing plate is required, and productivity may be reduced.

  Therefore, it is desirable to provide a piezoelectric piece breaker and a method for manufacturing a piezoelectric piece that can suitably hold a piezoelectric wafer.

  A piezoelectric piece folding device according to an aspect of the present invention penetrates in a vertical direction around a tray base having a first suction hole formed in an upper surface, an accommodation recess opened in the upper surface, and the accommodation recess. A second suction hole, and a tray placed on an upper surface of the tray base so that the second suction hole and the first suction hole communicate with each other, and the second suction through the first suction hole. A suction device that evacuates the holes and attracts the piezoelectric wafer to the upper surface of the tray, and a predetermined portion of the piezoelectric wafer that is positioned on the receiving recess is pushed downward or pulled upward, and the predetermined portion is A head device that is folded from another portion of the piezoelectric wafer and uses the predetermined portion as a piezoelectric piece.

  Preferably, the plurality of second suction holes extend in a predetermined direction in parallel in a plan view.

  Preferably, the plurality of first suction holes extend in parallel in a direction orthogonal to the predetermined direction in a plan view and intersect the plurality of second suction holes.

  Preferably, the plurality of first suction holes have the same width and a constant interval in the width direction, and the plurality of second suction holes have the same width, and the width. The interval in the direction is constant.

  Preferably, the total opening area of the second suction holes is smaller than the total opening area of the first suction holes.

  Preferably, the tray has a tray body having a plurality of the receiving recesses and a plurality of the second suction holes, and a support member having a connection hole on which the tray body is placed and communicated with the plurality of the second suction holes. And having.

  Preferably, a plurality of the tray main bodies are placed in parallel on the support member.

  Suitably, the said tray stand has a convex part which the said 1st adsorption | suction hole opens on the upper surface, and fits into the said connection hole.

  Preferably, the tray includes a lower layer member having a third suction hole that constitutes a lower portion of the second suction hole, a through hole that constitutes the housing recess, and an upper portion of the second suction hole. And an upper layer member stacked on the lower layer member.

  Preferably, the apparatus further includes a tray exchange device for exchanging the tray placed on the upper surface of the tray table.

  In the piezoelectric piece manufacturing method according to one aspect of the present invention, a piezoelectric wafer is placed on an upper surface of a tray having an accommodation recess opening in the upper surface and a second suction hole penetrating in the vertical direction around the accommodation recess. A step of placing a piezoelectric wafer, and a step of placing the tray on which the piezoelectric wafer is placed on a top surface of a tray base having a first suction hole opening on the top surface, the second suction hole and the first suction hole. A tray placement step for placing the wafer in communication, an adsorption step for evacuating the second adsorption hole through the first adsorption hole and adsorbing the piezoelectric wafer to the upper surface of the tray, and among the piezoelectric wafers A predetermined part located on the receiving recess is pushed downward or pulled upward, the predetermined part is broken from the other part of the piezoelectric wafer, and an individualization step using the predetermined part as a piezoelectric piece, have.

  According to said structure or procedure, a piezoelectric wafer can be suitably hold | maintained at the time of bending of a piezoelectric piece.

The disassembled perspective view which shows the usage example of a crystal piece. The top view which shows a part of crystal wafer from which many crystal pieces are taken. The typical perspective view which shows the structure of the principal part of the folding apparatus which concerns on embodiment of this invention. FIG. 4 is an exploded perspective view of a tray and the like of the folding device in FIG. 3. FIG. 5 is a schematic cross-sectional view of a part of the folding device of FIG. 3 taken along the line VV of FIG. 2. The top view which shows the upper layer member which comprises the tray of the folding apparatus of FIG. The top view which shows a part of lower layer member which comprises the tray of the folding apparatus of FIG. The top view which shows a part of tray stand of the folding apparatus of FIG. The flowchart which shows the procedure of the process which the folding apparatus of FIG. 3 performs.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones.

  Further, for the purpose of clarifying the relationship between the drawings, the rectangular coordinate system xyz may be attached to the drawings for the sake of convenience. The x-axis, y-axis, and z-axis are defined for convenience based on the shape of the member and the like, and do not mean the electric axis, mechanical axis, and optical axis of the piezoelectric body.

  First, prior to description of the crystal piece breaker (hereinafter, “crystal piece” is omitted) according to the embodiment of the present invention, a crystal piece that is a manufacturing target of the breaker device will be described.

  FIG. 1 is an exploded perspective view showing a schematic configuration of a crystal resonator 101 (hereinafter, “crystal” is omitted), which is an example of using a crystal piece.

  The vibrator 101 includes, for example, an element mounting member 103 in which a recess 103a is formed, a crystal resonator element 105 (hereinafter, “crystal” is omitted) accommodated in the recess 103a, and a lid member 107 that closes the recess 103a. doing.

  The vibrator 101 has, for example, a generally thin rectangular parallelepiped shape with the concave portion 103a closed by the lid member 107, and the dimensions thereof may be set as appropriate. For example, in a comparatively small thing, the length of a long side or a short side is 1-2 mm, and thickness is 0.2-0.4 mm. The recess 103a is sealed with a lid member 107, and the inside thereof is, for example, evacuated or is filled with an appropriate gas (for example, nitrogen).

  The element mounting member 103 includes, for example, a base body 109 as a main component of the element mounting member 103, an element mounting pad 111 for mounting the vibration element 105, and an external for mounting the vibrator 101 on a circuit board (not shown). Terminal 113. The base 109 is made of an insulating material such as ceramic and constitutes the concave portion 103a. The element mounting pad 111 and the external terminal 113 are made of, for example, a conductive layer made of metal or the like, and are connected to each other by a conductor (not shown) disposed in the base 109. The lid member 107 is made of metal, for example, and is joined to the upper surface of the element mounting member 103 by seam welding or the like.

  The vibration element 105 includes, for example, a crystal piece 115, a pair of excitation electrodes 117 for applying a voltage to the crystal piece 115 (one excitation electrode 117 is hidden by the crystal piece 115 and not shown), and the vibration element 105. A pair of extraction electrodes 119 for mounting on the element mounting pad 111 is provided.

  The crystal piece 115 is formed in a substantially rectangular plate shape, for example. The crystal piece 115 is made of, for example, an AT cut crystal piece. The pair of excitation electrodes 117 are provided in a layered manner on the center side of both main surfaces of the crystal piece 115, for example. The pair of extraction electrodes 119 are extracted from the pair of excitation electrodes 117 and provided on one end side portion in the longitudinal direction of the crystal piece 115. The pair of excitation electrodes 117 and the pair of extraction electrodes 119 are, for example, centers (not shown) extending in the longitudinal direction of the crystal piece 115 so that either of the main surfaces of the vibration element 105 may be the bottom surface side of the recess 103a. It is formed in a 180 ° rotationally symmetric shape with respect to the line.

  The vibration element 105 is accommodated in the recess 103a with the main surface facing the bottom surface of the recess 103a. The extraction electrode 119 is bonded to the element mounting pad 111 by a bump (not shown). Thereby, the vibration element 105 is supported by the element mounting member 103 like a cantilever. In addition, the pair of excitation electrodes 117 is electrically connected to the pair of element mounting pads 111, and by extension, is electrically connected to any two of the plurality of external terminals 113. The bump is made of, for example, a conductive adhesive.

  FIG. 2 is a diagram for explaining the outline of the method for manufacturing the vibration element 105, and specifically shows a part of the crystal wafer 121 from which a large number of crystal pieces 115 are taken. The vibration element 105 is manufactured as follows, for example.

  First, a quartz wafer 121 formed to have the same thickness as the quartz piece 115 is prepared. The outer edge of the crystal wafer 121 is not limited to a circle, and may be a polygon, for example. In this embodiment, the quartz wafer 121 whose outer edge is rectangular is illustrated.

  Next, etching is performed on the crystal wafer 121 and, as shown in FIG. 2, a frame portion 123 that is connected to a portion that becomes the crystal piece 115 and one side of the crystal piece 115 and supports the crystal piece 115. And form.

  More specifically, for example, the crystal pieces 115 are arranged in a direction parallel to the short side (y direction) to form a column, and a plurality of the columns are configured in a direction parallel to the long side (x direction). Thus, the crystal wafer 121 is formed. Note that the positions of the crystal pieces 115 in the y direction between the rows of the crystal pieces 115 may be the same as illustrated in FIG. 2, or may be different from each other unlike FIG. 2.

  For example, the frame part 123 is formed in a substantially lattice shape. That is, the frame portion 123 includes an outer frame 123a (consisting of four rectangular sides in the present embodiment; only a part of one side is shown in FIG. 2) surrounding both crystal pieces 115, and both sides of the outer frame 123a in the y direction. And a plurality of branches 123b extending in the y direction so as to connect the two portions (two sides). The branches 123b extend between the rows of crystal pieces 115. For example, the width of the branch 123b is narrower than the width of the outer frame 123a.

  Then, the crystal piece 115 has an outer frame 123a for the branch 123b (the row of crystal pieces 115 located on the most positive side in the x direction) on the short side on the side (x direction positive side) where the pair of extraction electrodes 119 are arranged. Are connected to one side on the positive side in the x direction). More specifically, for example, both ends of the short side are connected by the connection portion 123c.

  Next, the excitation electrode 117 and the extraction electrode 119 are formed on the crystal piece 115. For example, a mask made of a resist is formed on the surface of the crystal piece 115 by photolithography, and a metal film is formed on the surface of the crystal piece 115 by vapor deposition or the like through the mask. The opening 123h formed between the two connecting portions 123c contributes to the formation of a portion that conducts between both main surfaces of the crystal piece 115 in the extraction electrode 119.

  Then, it breaks by folding the boundary portion between the crystal piece 115 and the connecting portion 123c. That is, the crystal piece 115 is broken from the frame portion 123 (crystal wafer 121) to completely separate the crystal piece 115. The folding is performed, for example, by pressing the main surface of the crystal piece 115 with a pin-shaped or nozzle-shaped member.

  FIG. 3 is a schematic perspective view showing a configuration of a main part of the folding device 1 for folding the crystal piece 115 from the crystal wafer 121.

  The folding device 1 includes, for example, a main body 3 that folds the crystal piece 115, a storage portion 5 that stores the crystal piece 115 that has been broken, and a next crystal in which the crystal piece 115 is broken by the main body portion 3. It has the preparation part 7 which prepares the wafer 121, and the control apparatus 8 for controlling these each part.

  In FIG. 3, the preparation unit 7, the main body unit 3, and the storage unit 5 are sequentially arranged on a straight line, and each unit is illustrated in a region obtained by dividing one base. Actually, the respective units may be arranged in an appropriate positional relationship without being arranged on a straight line, or may be separated or integrated as appropriate.

  The main body 3 includes, for example, a holding device 9 that holds the crystal wafer 121 in the state illustrated in FIG. 2, and a head device that pushes the crystal piece 115 of the crystal wafer 121 held by the holding device 9 and breaks the crystal piece 115. 11.

  The holding device 9 is configured to hold the crystal wafer 121 by, for example, so-called vacuum suction, and is placed on the tray base 13, the tray base 13, and the tray 15 on which the crystal wafer 121 is placed, A suction device 17 (vacuum device) for sucking the atmosphere on the tray 15 through the tray base 13 is provided.

  The tray base 13 is provided on an appropriate main body base 18, for example. The tray base 13 may be provided so as not to move with respect to the main body base 18 or may be provided so as to be movable in the horizontal direction (xy plane). The tray base 13 may be formed of an appropriate material such as metal or resin.

  For example, the tray 15 can be carried into and out of the tray table 13 (detachable and replaceable). Therefore, the crystal wafer 121 can be carried into and transferred to the tray table 13 while being placed on the tray 15.

  The tray 15 includes, for example, a support member 19 and a tray main body 21 supported by the support member 19.

  For example, one support member 19 is placed on one tray table 13. On one support member 19, for example, two tray bodies 21 are placed. On each tray body 21, for example, one crystal wafer 121 is placed. The tray body 21 is formed thinner than the support member 19, for example. The support member 19 and the tray body 21 may be formed of an appropriate material such as metal or resin.

  The suction device 17 is connected to a connection port 13 p formed on the tray base 13. The connection port 13p is provided for each tray body 21 (crystal wafer 121), for example, and two connection ports 13p are provided in total in the present embodiment. However, one connection port 13p may be provided in common for all tray bodies 21.

  The suction device 17 is constituted by, for example, a pump type suction device. Specifically, for example, the suction device 17 includes a vacuum pump 23, a pump motor 25 that drives the vacuum pump 23, a vacuum tank 27 exhausted by the vacuum pump 23, a vacuum tank 27, and a connection port 13p. And a tray valve 29 that allows or prohibits the flow of gas (air) therebetween. The tray valve 29 is provided for each connection port 13p, for example.

  For example, the suction device 17 evacuates the vacuum tank 27 in advance by the vacuum pump 23 with the tray valve 29 closed, and sets the pressure of the vacuum tank 27 to a predetermined pressure lower than the atmospheric pressure. When exhausting from the connection port 13p, the tray valve 29 is opened. Further, the suction device 17 drives the vacuum pump 23 so that the pressure of the vacuum tank 27 is maintained at a predetermined pressure while the tray valve 29 is opened.

  The vacuum pump 23 may be a rotary pump, a plunger pump, a constant capacity type, or a variable capacity type. The pump motor 25 may be controlled in an open loop or may be a servo motor that performs feedback control. The tray valve 29 may basically realize only an open state and a closed state, or may be a servo valve whose opening degree can be adjusted steplessly. In addition to the above configuration, the suction device 17 may include a pressure sensor that detects the pressure of the vacuum tank 27 and / or a pressure control valve that keeps the pressure of the vacuum tank 27 and the like constant.

  The head device 11 includes, for example, a nozzle 31 for pushing the crystal piece 115 and a nozzle moving device 33 for moving the nozzle 31 with respect to the crystal wafer 121. The head device 11 shares part of the suction device 17 (the vacuum pump 23, the pump motor 25 and the vacuum tank 27) with the holding device 9, and also allows the gas flow between the vacuum tank 27 and the nozzle 31 to flow. The nozzle valve 35 is allowed or prohibited.

  The nozzle 31 has an opening at the tip (see FIG. 5), and can suck the crystal piece 115 at the tip by being evacuated. Therefore, for example, the nozzle 31 can hold the crystal piece 115 after being broken by pressing the crystal piece 115 while the crystal piece 115 is adsorbed.

  The nozzle moving device 33 is constituted by, for example, a robot, and drives the nozzle 31 in the vertical direction and the horizontal direction. As a result, the operation of pushing and folding an arbitrary crystal piece 115 in the crystal wafer 121 by the nozzle 31 and the operation of transporting the crystal piece 115 that has been folded and held by the nozzle 31 are enabled.

  The robot constituting the nozzle moving device 33 may be, for example, a vertical articulated robot, a SCARA robot, or an orthogonal robot. However, when the crystal piece 115 is folded, the crystal piece 115 is inclined with the connecting portion 123c side as a fulcrum, so that the robot (including the attachment for holding the nozzle 31) matches the inclination of the crystal piece 115. It is preferable that the nozzle 31 has a function capable of inclining.

  The nozzle moving device 33 is not particularly shown, but in addition to the basic configuration such as an arm, the imaging device and the image processing device for specifying the position of the crystal piece 115 and / or the pressing force by the nozzle 31 or You may have a sensor etc. which detect the displacement with respect to the frame part 123 of the crystal wafer 121. FIG.

  The configuration of the suction device 17 is as described above. The nozzle 31 is evacuated by opening the nozzle valve 35. As with the tray valve 29, the nozzle valve 35 may basically realize only the open state and the closed state, or may be a servo valve capable of adjusting the opening degree in a stepless manner. Also good.

  The storage unit 5 includes, for example, a storage tray 37 that stores the broken crystal piece 115 and a transport device (not shown) that transports the storage tray 37.

  Although not particularly illustrated, the storage tray 37 has, for example, a plurality of recesses that open upward and can store a plurality of crystal pieces 115. The broken crystal piece 115 is accommodated in the recess when the nozzle 31 sucking the crystal piece 115 is conveyed onto the recess by the head device 11 and the suction by the nozzle 31 is released.

  It should be noted that the number of crystal pieces 115 that can be accommodated in one storage tray 37 may be less than, equal to, or greater than the number of crystal pieces 115 that are broken off from one crystal wafer 121. . Preferably, the crystal piece 115 that can be accommodated in the storage tray 37 so that the storage tray 37 can be replaced when the tray 15 is replaced (so that there is no need to replace the storage tray 37 during folding). Is preferably equal to or greater than the number of crystal pieces 115 broken from the crystal wafer 121 on one tray 15.

  A transport device (not shown) that transports the storage tray 37 carries, for example, an empty storage tray 37 onto the storage base 39, and also carries out the storage tray 37 that stores the crystal piece 115 from the storage base 39. To do. The transfer device is constituted by a robot, for example. The storage tray 37 may be simply positioned and placed on the storage base 39, or may be held on the storage base 39 by appropriate suction means.

  The preparation unit 7 prepares the tray 15 on which the crystal wafer 121 in the state shown in FIG. For example, the preparation unit 7 includes a tray transfer device 41 that can transfer the tray 15 and a wafer transfer device 43 that can transfer the crystal wafer 121.

  For example, the tray transport device 41 takes out one tray 15 from a container (not shown) that accommodates the plurality of trays 15 or a conveyor that transports the plurality of trays 15 and places the tray 15 on the preparation base 42. For example, the wafer transfer device 43 takes out the crystal wafers 121 one by one from a container (not shown) that accommodates the plurality of crystal wafers 121 or a conveyor that transports the plurality of crystal wafers 121, and the tray 15 on the preparation base 42. Place on top. Thereby, the tray 15 on which the crystal wafer 121 is placed is prepared on the preparation base 42. Further, the tray transfer device 41 carries out, for example, the tray 15 on which the crystal wafer 121 that has been completely folded is placed from the main body 3, and carries the tray 15 prepared on the preparation base 42 into the main body 3. The operation to perform is also performed. By doing so, it is possible to prepare a crystal wafer 121 aligned with the tray 15 in advance, so that after the tray 15 after the folding is finished, the crystal wafer 121 is immediately attached. Since the aligned tray 15 can be carried in, cycle time can be shortened.

  The tray transfer device 41 and the wafer transfer device 43 are configured by a robot, for example. The robot constituting the nozzle moving device 33 may be, for example, a vertical articulated robot, a SCARA robot, or an orthogonal robot. As a mechanism for holding the tray 15 or the crystal wafer 121, for example, an adsorption type is used.

  The control device 8 includes, for example, a CPU, a ROM, a RAM, an external storage device, and the like, although not particularly illustrated. And each part is controlled according to the procedure previously memorize | stored in ROM thru | or the external storage device.

  FIG. 4 is an exploded perspective view of the tray base 13 and the tray 15.

  As described above, the tray 15 includes the support member 19 and the tray main body 21. The support member 19 is formed in a frame shape, for example, and has a connection hole 19h. The tray body 21 is placed on the support member 19 so as to close the connection hole 19h. The tray main body 21 is formed with a plurality of second suction holes 21h penetrating the tray main body 21 in the vertical direction.

  On the other hand, on the upper surface of the tray base 13, a convex portion 13a that fits into the connection hole 19h is formed. A plurality of first suction holes 13h connected to the connection port 13p through the flow path 13r (see FIG. 5) inside the tray base 13 are opened on the upper surface (top surface) of the convex portion 13a.

  Therefore, when the tray 15 is placed on the tray base 13, the convex portion 13 a is fitted into the connection hole 19 h, and thereby the tray 15 is positioned with respect to the tray base 13 in the xy direction. At this time, the first suction hole 13h and the second suction hole 21h communicate with each other, and the second suction hole 21h is connected to the suction device 17 via the first suction hole 13h and the connection port 13p. Therefore, the quartz wafer 121 can be adsorbed on the upper surface of the tray 15 by exhausting air from the connection port 13p by the suction device 17.

  In addition, the planar shape of the connection hole 19h (convex portion 13a) may be appropriately set, and is, for example, a rectangle. As illustrated in FIG. 4, the connection hole 19 h (projection 13 a) may be provided in common for the plurality of tray main bodies 21, or may be provided for each tray main body 21.

  The support member 19 and the tray body 21 may be appropriately positioned in the planar direction. For example, a plurality of pins may be provided on one of the two members, a plurality of through holes may be formed on the other, and positioning may be performed by fitting them together.

  FIG. 5 is a schematic cross-sectional view of a part of the tray base 13, the tray 15, the crystal wafer 121, and the nozzle 31. In the figure, the arrows without reference numerals indicate the flow of air.

  The left part of FIG. 5 corresponds to the position of the VV line in FIG. 2, and in the left part, the crystal wafer 121 is connected to the branch 123b, the connection part 123c extending from the branch 123b, and the crystal connected to the connection part 123c. The piece 115 and a slit 123s (see also FIG. 2) between the free end of the crystal piece 115 and the branch 123b are shown. The right side portion of FIG. 5 corresponds to a cross section including the end portion of the tray base 13 on the connection port 13p side. In the right side portion, the quartz wafer 121 has one side of the outer frame 123a.

  As described above, the tray 15 is placed on the tray base 13 so that the convex portion 13a of the tray base 13 is fitted into the connection hole 19h of the support member 19, and the first suction hole 13h of the tray base 13 is connected. The second suction hole 21h of the tray 15 is connected.

  More specifically, for example, the support member 19 is placed on the upper surface of the tray base 13. Further, the upper surface of the convex portion 13a is in contact with the lower surface of the tray body 21, and the first suction hole 13h and the second suction hole 21h directly overlap each other.

  The tray 15 has a concave accommodating recess 21r that opens on the upper surface thereof. The second suction hole 21h is located around the periphery. The crystal wafer 121 is placed on the tray 15 such that the crystal piece 115 is positioned on the accommodation recess 21r and the frame portion 123 is positioned on the second suction hole 21h. Accordingly, when the second suction hole 21 h is exhausted, the frame portion 123 (mainly the outer frame 123 a and the branch 123 b) is sucked onto the upper surface of the tray 15.

  Further, the crystal piece 115 can be inclined with respect to the frame portion 123 such that the free end is accommodated in the accommodating recess 21r. Therefore, it is possible to fold the crystal piece 115 from the frame portion 123 by pushing the crystal piece 115 downward by the nozzle 31.

  Since the bending moment distribution of the cantilever becomes the largest at the fixed end, the crystal piece 115 is bent at the connection portion 123c. By forming a not-illustrated groove (extending in the y direction) across the connection portion 123c on the upper surface and / or the lower surface of the connection portion 123c to facilitate stress concentration, the folding position may be accurately controlled.

  The tray body 21 is composed of, for example, two plate-like members. That is, the tray main body 21 has a lower layer member 21a placed on the support member 19 and an upper layer member 21b stacked on the lower layer member 21a. The lower layer member 21a and the upper layer member 21b are bonded to each other by, for example, an adhesive.

  The second suction hole 21h is configured by overlapping a third suction hole 21ah formed in the lower layer member 21a and a fourth suction hole 21bh formed in the upper layer member 21b. The accommodation recess 21r is formed, for example, by forming a through hole 21br penetrating from the lower surface to the upper surface of the upper layer member 21b, and the upper surface of the lower layer member 21a closing the opening below the through hole 21br to become the bottom surface of the recess. It is configured.

  FIG. 6 is a plan view showing the upper layer member 21b.

  The through-hole 21br constituting the housing recess 21r is, for example, roughly formed in the same size and shape as the crystal piece 115 in plan view, and is arranged in the same manner as the crystal piece 115. That is, the through holes 21br are formed in a substantially rectangular shape, arranged in the direction in which the short sides extend (y direction), and a plurality of the arrangements are provided in the direction in which the long sides extend (x direction).

  The fourth suction holes 21bh (21bh-1, 21bh-2) constituting the upper part of the second suction holes 21h are, for example, in positions overlapping with the outer frame 123a and the plurality of branches 123b in plan view. It is formed in a groove shape extending along. That is, the upper layer member 21b includes a plurality of fourth suction holes 21bh-1 extending along the four sides of the rectangle surrounding all the through holes 21br, and a plurality of first holes extending along the row between the rows of the through holes 21br. 4 adsorption holes 21bh-2 are formed.

  For example, the fourth suction holes 21bh-1 corresponding to the outer frame 123a have the same width. The plurality of fourth suction holes 21bh-2 corresponding to the plurality of branches 123b have the same width and length, for example, and are arranged at regular intervals. In the example of FIG. 6, the fourth suction hole 21bh-1 corresponding to the outer frame 123a is formed wider than the fourth suction hole 21bh-2 corresponding to the branch 123b. However, these may have the same width.

  FIG. 7 is a plan view showing the lower layer member 21a.

  The third suction holes 21ah (21ah-1, 21ah-2) constituting the lower side portion of the second suction holes 21h have, for example, the same shape and size as the fourth suction holes 21bh in plan view. Then, the upper layer member 21b is overlapped with the lower layer member 21a so that the third suction hole 21ah and the fourth suction hole 21bh match in plan view. In the present embodiment, since the shape and size of the third suction hole 21ah and the fourth suction hole 21bh are the same, the third suction hole 21ah and the fourth suction hole shown in FIGS. The planar shape of 21bh may be regarded as the planar shape of the second suction hole 21h.

  FIG. 8 is a top view showing a part of the upper surface of the tray base 13 (range corresponding to the tray main body 21). In FIG. 8, the second suction holes 21h (21h-1, 21h-2) of the tray body 21 are also indicated by dotted lines.

  The first suction holes 13h (13h-1, 13h-2) are formed in a groove shape in a plan view, for example. More specifically, for example, the tray base 13 includes a first suction hole 13h-1 extending along four rectangular sides surrounding all the through holes 21br (FIG. 6), and an arrangement region of the plurality of through holes 21br. Are formed with a plurality of first suction holes 13h-2 extending in a direction orthogonal to the plurality of second suction holes 21h-2.

  For example, the plurality of first suction holes 13h-1 overlap most of the plurality of second suction holes 21h-1 in plan view, and thereby communicate with the second suction holes 21h-1. For example, the total opening area of the first suction holes 13h-1 is larger than the total opening area of the second suction holes 21h-1. More specifically, for example, the width of the first suction hole 13h-1 is larger than the width of the second suction hole 21h-1, and the sum of the lengths of both is substantially the same. For example, the plurality of first suction holes 13h-1 have the same width.

  The plurality of first suction holes 13h-2 intersects the plurality of second suction holes 21h-2, for example, in plan view, and thereby the plurality of second suction holes 21h-2 at the intersection Cr. It communicates with. For example, the plurality of first suction holes 13h-2 have, for example, the same width and length as each other, and are arranged at regular intervals.

  Since the width and interval of the plurality of first adsorption holes 13h-2 are constant, and the width and interval of the plurality of second adsorption holes 21h-2 are constant, the intervals in the x direction of the plurality of intersecting portions Cr, The interval and area in the y direction are constant. The plurality of first suction holes 13h are arranged, for example, over the entire length of the second suction hole 21h, and the plurality of intersecting portions Cr are distributed over substantially the entire arrangement region of all the through holes 21br. doing.

  For example, the total opening area of the first suction holes 13h-2 is larger than the total opening area of the second suction holes 21h-2. For example, the width of the first suction hole 13h-2 is larger than the width of the second suction hole 21h-2.

  In the example of FIG. 8, the first suction hole 13h-1 and the first suction hole 13h-2 have the same width, but, like the second suction hole 21h, the first suction hole 13h- The width of 1 may be made larger than the width of the first suction hole 13h-2.

  As described above, the total opening area of the first suction holes 13h-1 is, for example, larger than the total opening area of the second suction holes 21h-1, and the total opening area of the first suction holes 13h-2 is Since the total opening area of the second suction holes 21h-2 is larger than the total opening area of the first suction holes 13h, the total opening area of the second suction holes 21h is larger.

  Various dimensions of the first suction hole 13h and the second suction hole 21h may be set as appropriate. As an example, the length (width) of the short side of the first suction hole 13h is 1.0 mm or more and 2.0 mm or less, and the length of the long side of the first suction hole 13h is 100 mm or more and 300 mm or less, The length (width) of the short side of the second suction hole 21h is 0.1 mm or more and 0.2 mm or less, and the length of the long side of the second suction hole 21h is 50 mm or more and 70 mm or less.

  Although not particularly illustrated, the planar shape of the flow path 13r connecting the connection port 13p and the plurality of first suction holes 13h may be an appropriate shape. For example, the flow path 13r may have a planar shape that is branched from the connection port 13p by an appropriate number and connected to the plurality of first suction holes 13h, or the plurality of first suction holes 13h (or 13h). -2) may have a planar shape having a rectangular portion extending over the area.

  FIG. 9 is a flowchart showing a procedure of processing executed by the folding device 1 (control device 8).

  In step ST <b> 1, the control device 8 controls the tray transfer device 41 so that the tray 15 on which the crystal wafer 121 is not yet placed is placed on the preparation base 42.

  In step ST2, the control device 8 includes the crystal wafer 121 (the crystal piece 115 is connected to the frame portion 123, and the excitation electrode 117 and the extraction electrode 119 are formed on the tray 15 placed on the preparation base 42. The wafer transfer device 43 is controlled so as to place the device in the state. In this case, a known method may be adopted for alignment of the crystal wafer 121 and the tray 15 in the planar direction. For example, a method of aligning both alignment marks by image recognition processing or a method of bringing the edge of the crystal wafer 121 into contact with a positioning portion provided on the tray 15 may be employed.

  In step ST <b> 3, the control device 8 carries out the tray 15 on which the crystal wafer 121 is placed from the preparation base 42 and places it on the tray base 13. At this time, as described above, the tray 15 is positioned by fitting the convex portion 13a of the tray base 13 to the connection hole 19h of the tray 15, and the first suction hole 13h of the tray base 13 and the tray 15 are positioned. The second suction hole 21h is overlapped (connected).

  In step ST4, the control device 8 opens the tray valve 29 and exhausts the second suction hole 21h through the connection port 13p and the first suction hole 13h. As a result, the crystal wafer 121 is attracted to the tray 15.

  In step ST5, the control device 8 controls the head device 11 so as to break the crystal piece 115. For example, first, the nozzle 31 is horizontally moved onto the crystal piece 115 to be broken by the nozzle moving device 33. Next, the nozzle 31 is moved downward by the nozzle moving device 33 in a state where the nozzle valve 35 is opened and suction is performed by the nozzle 31. The crystal piece 115 is pushed downward by the nozzle 31 while being attracted by the nozzle 31, and is broken off from the crystal wafer 121. The broken crystal piece 115 is conveyed onto the storage tray 37 by the movement of the nozzle 31 by the nozzle moving device 33. When the nozzle valve 35 is closed, the broken crystal piece 115 is released from the suction by the nozzle 31 and stored in the storage tray 37.

  In step ST6, the control device 8 determines whether or not all the crystal pieces 115 have been folded. If not completed, the control device 8 returns to the process of step ST5. As a result, the series of folding operations described above are sequentially performed on the plurality of crystal pieces 115. When the folding of all the crystal pieces 115 is completed, the control device 8 proceeds to step ST7.

  In step ST <b> 7, the control device 8 closes the tray valve 29 and releases the suction of the crystal wafer 121.

  In step ST <b> 8, the control device 8 controls the tray transport device 41 so that the tray 15 on which the crystal wafer 121 from which all the crystal pieces 115 are broken is placed is unloaded from the tray base 13. For example, the tray 15 is transported to a post-processing device (not shown) by the tray transport device 41, and dust and the like are removed by the post-processing device. Thereafter, the processed tray 15 is transported to the preparation unit 7 and used again for holding the crystal wafer 121.

  In parallel with steps ST3 to ST8, the control device 8 performs a process for preparing the crystal wafer 121 to be folded next. That is, in steps ST9 and ST10, the same processing as in steps ST1 and ST2 is performed.

  By doing so, the piezoelectric wafer 121 is not pressed by the pressing plate as in the conventional method of manufacturing a crystal piece, and thus the displacement of the crystal wafer 121 can be reduced. Further, since the pressing plate is not used, the pressing plate can prevent the crystal piece 15 or the excitation electrode 117 on the crystal piece 15 from being damaged, so that the fluctuation of the oscillation frequency of the crystal piece can be reduced. it can.

  As described above, the folding device 1 according to the present embodiment includes the tray base 13, the tray 15, the suction device 17, and the head device 11. The tray base 13 has a first suction hole 13h that opens to the upper surface. The tray 15 has a concave housing recess 21r that opens on the upper surface, and a second suction hole 21h that penetrates in the vertical direction around the housing recess 21r. The second suction hole 21h and the first suction hole 13h include It is placed on the upper surface of the tray base 13 so as to communicate. The suction device 17 exhausts the second suction hole 21 h through the first suction hole 13 h and sucks the crystal wafer 121 on the upper surface of the tray 15. The head device 11 pushes a predetermined portion (portion corresponding to the crystal piece 115) of the crystal wafer 121 on the accommodation recess 21r downward, and the predetermined portion is moved from the other portion (frame portion 123) of the crystal wafer 121. The predetermined part is taken as a crystal piece 115.

  From another viewpoint, the manufacturing method of the crystal piece 115 according to the present embodiment includes a concave housing recess 21r that opens to the upper surface, and a second suction hole 21h that penetrates in the vertical direction around the housing recess 21r. The crystal wafer mounting step (step ST2 and / or ST10) for mounting the crystal wafer 121 on the upper surface of the tray 15 and the first suction hole 13h opening the tray 15 on which the crystal wafer 121 is mounted on the upper surface. A tray placement step (step ST3) for placing the second suction hole 21h and the first suction hole 13h on the upper surface of the tray base 13 having a second suction hole through the first suction hole 13h. 21h is evacuated to suck the quartz wafer 121 on the upper surface of the tray 15 (step ST4), and a predetermined portion of the quartz wafer 121 located on the accommodation recess 21r is moved downward. Press, has broken off a predetermined portion from the other portions of the crystal wafer 121, the singulation step of the crystal piece 115 a predetermined portion (step ST5), the.

  Therefore, for example, a pressing plate that presses the crystal wafer 121 from above (sandwiches the crystal wafer 121 with the tray 15) is unnecessary. As a result, when the quartz wafer 121 is pressed by the holding plate, the quartz wafer 121 is not displaced due to the displacement of the holding plate. For example, the quartz wafer 121 or the excitation electrode 117 is not damaged by the pressing plate. Furthermore, the cost for providing the pressing plate can be reduced.

  In addition, for example, the type of the crystal wafer 121 to be broken is changed (the size of the crystal piece 115 and the arrangement of the crystal piece 115 in the crystal wafer 121 are changed), and the accommodation recesses and the suction holes are changed. When it becomes necessary to change the shape, size, etc., it is possible to replace only the tray 15 without replacing the tray base 13. As a result, various crystal wafers 121 can be handled at low cost.

  Further, for example, the crystal wafer 121 can be transported on the tray 15, and since the second suction hole 21 h for holding the crystal wafer 121 is formed in the tray 15, the main body portion 3, it is not necessary to align the crystal wafer 121 with respect to the second suction hole 21 h. That is, in parallel with the folding of the crystal piece 115 in the main body 3, the crystal wafer 121 to be broken next can be aligned with the second suction hole 21 h in the preparation unit 7. As a result, it is expected that the folding cycle is shortened and the productivity is improved.

  Further, for example, since the second suction hole 21h is exhausted through the first suction hole 13h, unlike the case where the second suction hole 21h is directly exhausted, the crystal wafer 121 is sucked by the tray base 13, The tray 15 is sandwiched between them. From another viewpoint, the crystal wafer 121 and the tray 15 are attracted to the tray base 13. Therefore, the suction device 17 for attracting the crystal wafer 121 to the tray 15 is also used to attract the tray 15 to the tray base 13. Therefore, the configuration is simple.

  In the present embodiment, the plurality of second suction holes 21h-2 extend in a predetermined direction (y direction) in parallel in a plan view.

  Therefore, by superposing the frame portion 123 (branch 123b in the embodiment) of the crystal wafer 121 on the second suction hole 21h, the suction force acts on the crystal piece 115 while increasing the suction force acting on the frame portion 123. Can be suppressed.

  In the present embodiment, the plurality of first suction holes 13h-2 extend in parallel in a direction orthogonal to the predetermined direction (x direction) in plan view, and thereby extend in parallel in the predetermined direction (y direction). It intersects with the plurality of first suction holes 13h-2.

  Therefore, for example, even if the tray 15 is replaced and the width or interval of the plurality of second suction holes 21h-2 is changed, the plurality of first suction holes 13h-2 and the plurality of second suction holes 21h- 2 can communicate with each other. For example, if the plurality of first suction holes 13h-2 are parallel to the plurality of second suction holes 21h-2, the width and interval of the plurality of second suction holes 21h-2 are set to When set according to the width and interval of the branch 123b, the plurality of second suction holes 21h-2 and the plurality of first suction holes 13h-2 may not overlap, but such inconvenience does not occur. . Further, for example, each of the tray base 13 and the tray 15 is configured to have a plurality of beams between the plurality of suction holes, and is a member having high rigidity against a bending moment in a side view of the plurality of beams. And since the tray stand 13 and the tray 15 are piled up so that several beams may mutually orthogonally cross, rigidity becomes high as a whole.

  In the present embodiment, in addition to the plurality of first suction holes 13h-2 and the plurality of second suction holes 21h-2 being orthogonal, the plurality of first suction holes 13h-2 have the same width. In addition, the interval (y direction) is constant, the plurality of second suction holes 21h-2 have the same width, and the interval (x direction) is constant.

  Therefore, for example, the communication part (intersection Cr) between the two is evenly distributed. As a result, the distribution of force for attracting the crystal wafer 121 to the tray 15 tends to be uniform. As a result, for example, when the crystal wafer 121 is sucked, the possibility that the crystal wafer 121 is displaced with respect to the tray 15 is reduced.

  In the present embodiment, the total opening area of the second suction holes 21h is smaller than the total opening area of the first suction holes 13h.

  Therefore, as compared with the case where the crystal wafer 121 is directly placed on the tray table 13, the area of the suction holes can be reduced, and the possibility that portions other than the frame portion 123 of the crystal wafer 121 will be sucked can be reduced. Further, since a negative pressure is generated between the tray base 13 and the tray 15, it is expected that the tray 15 is directly adsorbed by the tray base 13, and the positional deviation between the two is suppressed.

  In the present embodiment, the tray 15 includes a tray body 21 having a plurality of receiving recesses 21r and a plurality of second suction holes 21h, and a connection hole on which the tray body 21 is placed and communicates with the plurality of second suction holes 21h. And a support member 19 having 19h.

  Therefore, for example, the tray main body 21 is a thin plate-like member in which a plurality of relatively fine receiving recesses 21r and a plurality of second suction holes 21h can be easily formed. A frame-like member (a plate-like member in which the connection hole 19h is formed) that is thicker than the tray main body 21 that can easily ensure the strength can be obtained. That is, it is possible to achieve both a fine shape and strength. Further, for example, when the type of the crystal wafer 121 to be broken is changed, and it becomes necessary to change the shape and size of the housing recess and the suction hole, the support member 19 is not replaced and the tray is replaced. It is possible to respond by exchanging only the main body 21. As a result, various crystal wafers 121 can be handled at low cost.

  In the present embodiment, a plurality of tray main bodies 21 are placed in parallel on the support member 19.

  Therefore, while the crystal wafer 121 and the tray main body 21 are easily aligned (steps ST2 and / or ST10), the loading and unloading (steps ST3 and ST8) of the plurality of tray main bodies 21 to the tray base 13 are performed simultaneously. And cycle time can be reduced.

  Moreover, in this embodiment, the tray base 13 has the convex part 13b which the 1st suction hole 13h opens on the upper surface, and fits into the connection hole 19h.

  Therefore, as described above, the support member 19 that contributes to improving the strength or the like can be used as a positioning portion for the tray 15 with respect to the tray base 13, and the first suction hole 13 h and the second suction hole 21 h of the tray body 21. Can be brought closer to each other (or directly superimposed).

  Moreover, in this embodiment, the tray 15 has the lower layer member 21a and the upper layer member 21b. The lower layer member 21 a has a third suction hole 21 ah that constitutes a lower portion of the second suction hole 21 h and is placed on the tray table 13. The upper layer member 21b has a through hole 21br constituting the accommodating recess 21r and a fourth suction hole 21bh constituting the upper side portion of the second suction hole 21h, and is overlapped with the lower layer member 21a.

  Therefore, for example, the accommodation recess 21r can be easily formed. Further, for example, when the shape and size of the crystal piece 115 and / or the frame portion 123 are slightly changed, it is possible to cope with the design change of only the upper layer member 21b.

  In the above embodiment, the folding device 1 is an example of a piezoelectric piece folding device, the crystal wafer 121 is an example of a piezoelectric wafer, and the crystal piece 115 is an example of a piezoelectric piece.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The piezoelectric wafer and the piezoelectric piece are not limited to the quartz wafer and the quartz piece, and may be made of ceramic, for example. The piezoelectric piece is not limited to one that constitutes a vibrator for generating an oscillation signal. For example, one that constitutes a piezoelectric substrate of a SAW (Surface Acoustic Wave) filter or a vibrator of a vibrating gyroscope You may do. Further, the piezoelectric device for generating the oscillation signal is not limited to the vibrator, and may be an oscillator including an oscillation circuit, for example. Further, the structure of the vibrator or the oscillator is not limited to that illustrated in the embodiment, and may be an appropriate structure such as one having an H-type element mounting member.

  The arrangement of the piezoelectric pieces and the shape of the frame portion in the piezoelectric wafer may be set as appropriate. For example, in the embodiment, as the configuration of the frame portion 123, the outer frame 123a and a plurality of branches 123b having the same width extending so as to connect two sides on both sides in the y direction of the outer frame 123a are shown. In order to ensure the strength of 123, an appropriate number of branches connecting two sides on both sides in the x direction of the outer frame 123a are provided, or one of the plurality of branches extending in the x direction or the y direction has a different width. It may be made wider than the width of the branches. For example, a cross-shaped partition (branch) having a width equal to that of the outer frame 123a is provided so as to partition the inside of the outer frame 123a into four regions, and each of the four regions has a relatively narrow width and extends in the y direction. The branch 123b may be provided.

  In the embodiment, the connection portion 123c has been described as a portion (a part of the frame portion 123) remaining on the crystal wafer 121 when the crystal piece 115 is broken, but the connection portion 123c is in the middle or on the branch 123b side. The crystal piece 115 may be partly or entirely part of the crystal piece 115.

  The shape and size of the first suction hole and the second suction hole may be set as appropriate, and are not limited to those exemplified in the embodiment. For example, the shape and size of the first suction hole and the second suction hole may be the same. Further, for example, the first suction hole may be a rectangle or a circle having a relatively large area (for example, overlapping the plurality of second suction holes). Further, for example, the second suction hole may be a relatively small rectangle or circle, and a plurality of second suction holes may be arranged along the frame portion of the piezoelectric wafer. In addition, for example, the first suction hole and / or the second suction hole may have a cross-sectional shape and / or a cross-sectional area that is orthogonal to the penetration direction and changes in the penetration direction.

  The first suction holes or the second suction holes extending in a groove shape are divided into an appropriate number in the length direction for the purpose of ensuring the strength of the tray, and are shorter than the length of the outer frame or branch of the piezoelectric wafer. (For example, half to ¼ length). In addition, for example, as described above, when the frame portion of the piezoelectric wafer has branches connecting two sides on both sides in the x direction or has branches wider than other branches, it is adjusted accordingly. The second suction holes extending in the x direction may be formed between the plurality of storage recesses, or the widths of the second suction holes extending between the plurality of storage recesses may be different from each other. Moreover, the direction in which the groove-shaped first suction hole and the second suction hole extend may be set as appropriate with respect to the arrangement direction of the plurality of tray bodies, the positions of the connection ports, and the like. For example, in the embodiment, contrary to the drawing, the first suction hole 13h may extend in the y direction, and the second suction hole 21h may extend in the x direction.

  The housing recess may not be provided for each piezoelectric piece. For example, in the embodiment, the plurality of receiving recesses arranged in the y direction may be connected to each other by an appropriate number and may be formed in a groove shape extending in the y direction.

  In the embodiment, the lower surface of the tray main body 21 and the upper surface of the convex portion 13a of the tray base 13 are in contact with each other, but they may not be in contact with each other with a gap therebetween. In other words, the first suction hole and the second suction hole may be communicated via part or all of the connection hole.

  In the embodiment, one support member 19, two tray bodies 21, and two crystal wafers 121 are placed in order on one tray table 13. The combination of the number of these members may be changed as appropriate. For example, three or more tray bodies may be placed on the support member. In the embodiment, one piezoelectric wafer is placed on one tray body, and a plurality of tray bodies are placed on one tray base and one support member. As described above, it is preferable that a plurality of piezoelectric wafers can be simultaneously loaded into or unloaded from the tray table while facilitating the handling of the alignment of the piezoelectric wafer and the tray body.

  The tray does not have a support member (in another aspect, a connection hole), and may be configured only from the tray body. The tray may be formed integrally with a portion having a connection hole and a portion having a plurality of suction holes. The tray main body may not be composed of two layers (a plurality of layers) of the upper layer member and the lower layer member but may be composed of one layer.

  As will be understood from the fact that the connection hole may not be provided in the tray, the convex portion of the tray base may not be provided. Even when the connection hole is provided in the tray, the first suction hole and the second suction hole may be communicated by the connection hole without providing the convex portion of the tray base. Further, as described above, when the piezoelectric wafer is partitioned into a plurality of regions, the convex portion of the tray base may be formed so as to correspond to each region (for one piezoelectric wafer). A plurality of connection holes and protrusions may be formed).

  The suction device (vacuum device) is not limited to a pump type (in a narrow sense). For example, it may be an ejector type that ejects compressed air and performs suction by a negative pressure generated on its side, or a cylinder type that performs suction by sliding the piston in one direction within the cylinder. It may be. In the suction device, the vacuum tank and the valve can be omitted. In the embodiment, the suction device 17 is shared by the holding device 9 and the head device 11, but a suction device may be provided for each of them without being shared.

  The configuration for transporting the piezoelectric wafer, the tray, and the like may be changed as appropriate. For example, the tray transfer device and the wafer transfer device may be integrated, or the tray transfer device may be separated for preparation and replacement.

  Further, for example, the folded piezoelectric piece may be mounted on the element mounting member (in the embodiment, the element mounting member 103) as it is, instead of being stored in the storage tray. That is, instead of the storage portion 5 of the embodiment, a mounting portion for mounting the piezoelectric piece may be provided.

  In the embodiment, the head device 11 pushes the crystal piece 115 downward to break the crystal piece 115. However, the piezoelectric piece may be broken by being pulled upward. For example, a piezoelectric piece may be vacuum-sucked by a nozzle, the nozzle may be moved upward, and the piezoelectric piece may be broken off.

  DESCRIPTION OF SYMBOLS 1 ... Folding device (piezoelectric piece folding device), 13 ... Tray base, 13h ... First suction hole, 15 ... Tray, 21r ... Storage recess, 21h ... Second suction hole, 17 ... Suction device, 115 ... Quartz piece 121 ... Quartz wafer (piezoelectric wafer).

Claims (11)

A tray base having a first suction hole opened on the upper surface;
An upper surface of the tray base having an accommodation recess opened on the upper surface and a second suction hole penetrating in the vertical direction around the accommodation recess, so that the second suction hole and the first suction hole communicate with each other. A tray placed on the
A suction device that evacuates the second suction hole through the first suction hole and sucks the piezoelectric wafer onto the upper surface of the tray;
A head in which a predetermined portion of the piezoelectric wafer located on the receiving recess is pushed downward or pulled upward, the predetermined portion is folded from another portion of the piezoelectric wafer, and the predetermined portion is a piezoelectric piece. Equipment,
A piezoelectric piece breaker having the above structure. The piezoelectric piece folding device according to claim 1, wherein the plurality of second suction holes extend in a predetermined direction in parallel in a plan view. The piezoelectric piece folding device according to claim 2, wherein the plurality of first suction holes extend in parallel in a direction perpendicular to the predetermined direction in a plan view and intersect the plurality of second suction holes. The plurality of first suction holes have the same width and a constant interval in the width direction,
The piezoelectric piece folding device according to claim 3, wherein the plurality of second suction holes have the same width and a constant interval in the width direction. The piezoelectric piece folding device according to any one of claims 1 to 4, wherein a total opening area of the second suction holes is smaller than a total opening area of the first suction holes. The tray
A tray body having a plurality of the accommodating recesses and a plurality of the second suction holes;
A support member on which the tray main body is mounted and having a connection hole communicating with the plurality of second suction holes;
The piezoelectric piece folding apparatus according to any one of claims 1 to 5. The piezoelectric piece breaker according to claim 6, wherein a plurality of the tray main bodies are placed in parallel on the support member. The piezoelectric piece folding apparatus according to claim 6 or 7, wherein the tray base has a convex portion that has an opening on the top surface and the first suction hole is fitted into the connection hole. The tray
A lower layer member having a third suction hole constituting a lower portion of the second suction hole;
2. An upper layer member that has a through hole that constitutes the housing recess, and a fourth adsorption hole that constitutes an upper portion of the second adsorption hole, and is superposed on the lower layer member. The piezoelectric piece breaker according to any one of -8. The piezoelectric piece folding device according to any one of claims 1 to 9, further comprising a tray replacement device that replaces the tray placed on the upper surface of the tray base. A piezoelectric wafer mounting step of mounting a piezoelectric wafer on the upper surface of a tray having an accommodation recess opening in the upper surface and a second suction hole penetrating in the vertical direction around the accommodation recess;
Tray placement for placing the tray on which the piezoelectric wafer is placed on a top surface of a tray base having a first suction hole opening on the upper surface so that the second suction hole and the first suction hole are communicated with each other. Steps,
An adsorption step of exhausting the second adsorption hole through the first adsorption hole and adsorbing the piezoelectric wafer to the upper surface of the tray;
A portion of the piezoelectric wafer that is located on the receiving recess is pushed downward or pulled upward, the predetermined portion is folded from another portion of the piezoelectric wafer, and the predetermined portion is used as a piezoelectric piece. A cleanup step,
Method of manufacturing a piezoelectric piece having

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