JP2016051773A - Package of electric element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package of an electric element which enables reduction of the size and thickness of the package, reduction of power consumption and displacement caused by temperature regulation of the package, stably conducts optical input/output in between the interior and exterior of the package with high reliability, and needs the temperature regulation.SOLUTION: In a package, a chip carrier 107 incorporates a heater 109 that is a temperature regulating element and is integrally held with an electric element 103 in a fixing manner. Out of the electric element 103 and the chip carrier 107, only the electric element 103 is fixed to an inner surface of a package container 100 through a fixing part 120. The structure allows a large portion of heat generated by the heater 109 to be effectively provided for temperature regulation of the electric element 103 and thereby significantly reduces leakage of the heat to the package container 100 or an exterior part of the container 100.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a package on which a component is mounted, and more particularly to a package of an electrical element that contains an electrical element and is hermetically sealed.

  Electrical elements such as laser diodes, MEMS (Micro Electro Mechanical Systems) sensor elements, and liquid crystal elements are subject to changes in characteristics, aging, and the like depending on environmental conditions such as humidity. In order to prevent these problems and realize stabilization and high reliability of the characteristics of the electric element, the electric element described above is configured as a package hermetically sealed in a predetermined container. For example, the operation of the MEMS mirror array module for wavelength selective switch shown in Non-Patent Document 1 may be affected by the capacitance change related to the mirror array due to humidity, with the electrical elements exposed to the environment. It has been reported. In addition, in a fine structure manufactured using a MEMS manufacturing technique, there is a possibility that interference or sticking of the mechanically movable part may be caused by foreign matter that has entered from the outside. As can be seen from these examples, a module on which an electrical element having a fine structure is mounted is usually used in a state of being hermetically sealed in a container.

  FIG. 3 is a diagram showing a configuration example of a general package of electric elements used in the prior art. FIG. 3 schematically shows a cross section of the entire package 300 including the electric element 304 therein. This package is configured in the form of a container 300 including a lid portion 301 and a container lower portion 302. The lid portion 301 and the container lower portion 302 are joined to each other by seam welding, solder joining, or the like, thereby forming a shielding space 303 in which the entry and exit of substances from the outside are blocked.

  The lid 301 is configured by joining a glass optical window 313 to a window frame 312 made of Kovar. The container lower portion 302 is composed of a ceramic substrate 305 at the bottom, a ceramic frame portion 310, and a Kovar frame portion 311. By bonding the peripheral portion of the window frame 312 and the upper surface of the frame portion 311, a sealed state of the package can be obtained.

  An electric element 304 such as a laser diode, a MEMS sensor element, or a liquid crystal element is disposed in the shielding space 303 of the container 300 configured as described above. The electric element 304 is fixed on the ceramic substrate 305 by an adhesive layer 309 such as solder. The electrical element 304 including the elements as described above may require temperature adjustment. Further, the container 300 includes an optical window 313 in order to optically input and output these electric elements 304 with the outside world. The shielded space 303 inside the package is also used to obtain an operation area of the movable part constituting the MEMS. The entire package is hermetically sealed in order to avoid changes in humidity and oxidation of the electric element 304 and improve long-term reliability.

  A plurality of metal pins 306 having a diameter of about 0.5 mm are provided on the back side of the ceramic substrate 305. Such a structure having a plurality of metal pins 306 is called a pin grid array (PGA). The electric element 304 is connected to an electric wiring (not shown) in the container lower portion 302 via the bonding wire 307 and is connected to the metal pin 306 via this electric wiring. The package 300 is fixed by inserting metal pins 306 into the socket substrate 308.

Mitsuo Usui, Shingo Uchiyama, Atsushi Hashimoto et al., “MEMS Mirror Array Module for Wavelength Selective Switch (WSS)”, IEICE Technical Report, 2009, R2009-7, CPM2009-7, OPE2009-7, 35− 39 pages

  In the conventional PGA format package as shown in FIG. 3, the overall size generally has to be relatively thick for the following reason. The heater 322 for adjusting the temperature is provided in the temperature adjusting unit 321 disposed outside the frame portion 310 of the container lower portion 302, and thus is located away from the electric element 304. In addition, a metal pin 306 is provided in the heat path between the heater 322 and the electric element 304. For this reason, the heat generated from the heater 322 escapes to the socket substrate 308 via the metal pins 306. A considerable portion of the heat generated from the heater 322 is consumed for heating the metal pins 306 and the socket substrate 308, and the electric power from the heater 322 is not effectively used for temperature adjustment of the target electric element 304. It was. As a result, there has been a problem that a large amount of power is required to drive the heater for temperature adjustment. Further, in such a package structure that requires a large amount of heat generation, the volume of the heater 322 itself has to be increased, and there is a problem that the entire package is further increased in thickness and size.

  In addition to the above-described problem of the amount of heat generated by the heater, the positional deviation of the optical axis due to heat has also been a problem. The electric element 304 including at least a part of the optical element performs optical input / output via the optical window 313. It is necessary to match the optical axis with the required accuracy inside and outside the package. In a package accompanying heating using the heater 322 for temperature adjustment, a problem occurs in that the position of the package exceeds the alignment accuracy required for optical input / output due to thermal expansion of each part of the package and the mechanism outside the package. There was also. As a result, positional shift occurs with environmental temperature fluctuations, and optical input / output cannot be performed properly, so that the function of a sufficient electrical element may not be achieved.

  The present invention has been made in view of such problems, and an object of the present invention is to further reduce the size and thickness of an electric element package that requires temperature adjustment and to further reduce power consumption. . Further, it is to reduce the positional shift accompanying the temperature adjustment of the package so that optical input / output between the inside and outside of the package can be stably performed with high reliability.

  In order to achieve the above-mentioned object, the present invention according to claim 1 is directed to a package having an electrical element housed in an internal space and having an optical window, the electrical element, and the optical element of the electrical element. A carrier substrate fixed via an adhesive layer on the element surface opposite to the target window side, and a temperature adjusting means for adjusting the temperature of the electric element, which is configured inside or on the carrier substrate surface. A container for accommodating the electric element and the carrier substrate inside and forming an airtight seal while forming a space on the electric element, and the carrier substrate is formed from an opposing surface of the container on the inner space side. The package is characterized in that it is held by the electric element at a distance, and only the electric element is fixed on the inner surface of the container via a fixing portion.

  According to a second aspect of the present invention, there is provided a package in which an electric element is housed in an internal space and has an optical window, and the electric element and an element surface opposite to the optical window side of the electric element are interposed via an adhesive layer. A carrier substrate fixed on the carrier substrate, temperature adjusting means for adjusting the temperature of the electric device, which is configured in the carrier substrate or on the surface of the carrier substrate, and forming the space on the electric device, while the electric device And a container for hermetically sealing the carrier substrate therein, the carrier substrate being held by the electric element spaced from the opposing surface of the container on the inner space side, and It is the package characterized by being fixed on the inner surface of the said container only through the part.

  The invention according to claim 3 is the package according to claim 2, wherein the electric element is bonded and fixed to the first substrate located on the optical window side and at least a part of the first substrate. It is comprised from the 2nd board | substrate, It is fixing on the said inner surface of the said container through a part of said 1st board | substrate.

  The invention according to claim 4 is the package according to claim 3, wherein the first substrate is a glass substrate, the second substrate is a semiconductor substrate, and the electric element is the first substrate. The liquid crystal element is characterized in that a liquid crystal is held in a central portion of the first substrate between the substrate and the second substrate.

  In the package according to any one of claims 1 to 4, light can be input / output between the optical device outside the package and the electric element through the optical window.

  The invention according to claim 5 is the package according to any one of claims 1 to 4, wherein the temperature adjusting means is a resistance heating element formed on the carrier substrate.

  According to a sixth aspect of the present invention, there is provided a package having an optical window opened from the internal space to the outside, wherein the electrical element is accommodated in the internal space, and light is input / output between the external optical device and the electrical element. And an electric element partially including a functional part that can be optically coupled to the external optical device, and the electric element on an element surface opposite to the optical window side of the electric element via an adhesive layer A carrier substrate fixed integrally with the substrate, temperature adjusting means for adjusting the temperature of the electric element, which is formed inside or on the surface of the carrier substrate, and forming a space on the electric element, An electrical element and a container for hermetically sealing the carrier substrate, the carrier substrate being held by the electrical element apart from the opposing surface of the container on the inner space side. The only electrical elements through the fixing unit, or a package which is characterized in that it is fixed through only a portion of the electrical device on the inner surface of said container.

  As described above, according to the present invention, it is possible to reduce the size of the heater mechanism in the package of the electric elements, further reduce the size and thickness of the entire package, and further reduce the power consumption. The conventional technology in which both the electric element and the heater are fixed to the container by fixing the temperature adjusting means having a large thermal deformation only to the electric element, and further, only the electric element is fixed to the inner surface of the container of the package by the fixing portion. In comparison, complicated distortion and stress generated in each part of the package at the time of temperature adjustment are alleviated, and displacement of the electric element can be reduced.

FIG. 1 is a cross-sectional view showing a configuration of a first embodiment of an electrical element package according to the present invention. FIG. 2 is a cross-sectional view showing a configuration of a second embodiment of the electrical element package of the present invention. FIG. 3 is a diagram showing a configuration of a general electrical device package used in the prior art.

  In the package of the electric element of the present invention, a chip carrier for holding and fixing the electric element is fixed to the package container by a method different from the prior art. The chip carrier incorporates, for example, a heater which is a temperature adjusting element, and is configured integrally with the electric element. Only the electric element and the chip carrier are fixed to the inner surface of the container via the fixing portion. With this configuration, most of the heat generated from the heater is efficiently applied to adjust the temperature of the electric element, and leakage of the package to the outside of the container or the container can be significantly suppressed. The heater can be downsized and the package itself can be downsized. The power consumption of the heater can also be reduced. As the electric element, a two-layer substrate composed of a first substrate and a second substrate can be used and fixed to the inner surface of the container using only the first substrate. Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, a first embodiment of the electrical element package of the present invention will be described with reference to FIG.

[Embodiment 1]
FIG. 1 is a cross-sectional view showing a configuration of a first embodiment of an electrical element package according to the present invention. The electric element package 100 according to the present invention is roughly constituted of a lid part 101 and a container lower part 102, and is configured as a container 100 in which an electric element 103 is accommodated. A space for hermetically sealing the electric element 103 is provided inside the container 100. In the package of the present invention, the configuration of the electric element 103 disposed in the container 100 and the chip carrier (substrate) 107 on which the electric element 103 is mounted have characteristics different from those of the prior art. In the electrical element package of the present invention, the term “package” means a storage container in which the electrical element is accommodated and molded integrally at least during operation. A certain function is realized by inputting / outputting at least an electric signal between the electric element and an external device / circuit of the package. Preferably, it is more effective in optical input / output between the outside of the package and the electric element. Therefore, the package has an optical window opened from the internal space to the outside for inputting / outputting light between an external optical device and the electric element.

  In the package of this embodiment, the chip carrier 107 is made of ceramic which is an insulator. The electric element 103 is fixed integrally on the chip carrier 107 with an adhesive layer 108 made of solder, resin, or the like. The adhesive layer 108 can be improved in thermal conductivity if it is made of a metal material such as solder.

  The electrical element package of the present invention includes a heater 109 built in the chip carrier 107 as temperature adjusting means. The chip carrier 107 is housed in the space in the container 100 as an integral part with the electric element 103. The heater 109 may be provided in the chip carrier 107 in the vicinity of the region where the electric element 103 is disposed.

  The lid portion 101 includes a window frame portion 111 made of Kovar and an optical window 104 made of sapphire. The container lower part 102 includes a container support substrate 116 made of ceramic, a frame part 110 made of ceramic, and a frame part 112 made of Kovar. The container support substrate 116 and the frame part 110 can be integrally molded. As long as electrical wiring to the outside described later can be formed, separate container support substrate 116 and frame portion 110 may be combined. Furthermore, in order to make electrical connection between the electric element 103 and an external device / external circuit of the package, the flexible printed wiring 117 is connected to the outside of the container 100 at, for example, an end portion of the container support substrate 116.

  In the electrical element package of the present invention, the chip carrier 107 and the electrical element 103 are integrated with each other, disposed above the container support substrate 116 inside the frame portion 110 of the container lower part 102, spaced apart from the substrate surface. It is fixed via a bridge-shaped fixing part 120. As described above, the configuration in which the heater 109 is provided in the chip carrier 107 integrated with the electric element 103 prevents heat generated from the heater 109 from being directly supplied to the electric element 103 and escaping to the container support substrate 116 side. be able to. By the fixing method of the electric element by the fixing part 120 and the heater configuration in the package of the present invention, the heat generated from the heater is efficiently transmitted to the electric element 103 without loss, and the temperature of the electric element 103 is adjusted with a smaller amount of heat generation. be able to.

  Accordingly, the electrical element package according to the present invention is a package that houses the electrical element in the internal space and has the optical window 104. In the package having the electrical element 103 and the electrical element on the side opposite to the optical window side. A carrier substrate 107 fixed via an adhesive layer, a temperature adjusting means 109 for adjusting the temperature of the electric element, which is formed inside or on the surface of the carrier substrate, and a space on the electric element. A container 100 for housing and electrically sealing the electric element and the carrier substrate while forming the carrier element, the carrier substrate being separated from an opposing surface of the container on the inner space side by the electric element. It is possible to realize that only the electric element is held and fixed on the inner surface of the container via the fixing portion 120.

  The fixing between the fixing part 120 and the electric element 103 and the fixing between the fixing part 120 and the container lower part 102 may be performed with solder, resin, or the like. For example, when importance is attached to thinning of the container 100 of the package and low power consumption of the temperature adjusting means, the space between the fixed portion 120 and the electric element 103 and the space between the fixed portion 120 and the lower portion 102 of the container. Each may be fixed with a material having low thermal conductivity such as resin. Further, in the case of further reducing the positional fluctuation due to thermal expansion and contraction, the fixing between the fixing part 120 and the electric element 103, the fixing between the fixing part 120 and the container lower part 102 is fixed using solder, respectively. The electrical element 103 and the chip carrier 107 may be fixed using a resin having a low elastic modulus and capable of partially absorbing the deformation of the chip carrier 107.

  The resin material used for the above-described adhesion is required to have less degassing for use in a hermetically sealed container and to prevent the electric element from being displaced with respect to a predetermined optical axis. In order to satisfy the requirement for preventing misalignment, the difference in thermal expansion coefficient between the chip carrier and the ceramic that composes the container is small, the curing shrinkage as an adhesive is small, and misalignment during high temperature storage and operation In order to reduce the size, a resin material that satisfies a high glass transition temperature is suitable. Specifically, as an example of an adhesive which is an epoxy resin system with less uncured components and less degassing, and taking into account differences in thermal expansion coefficient, curing shrinkage, and glass transition temperature, 353ND manufactured by EPOTEK or NTT Advanced Technology AT4291A.

  FIG. 1 shows one cross section of the package of the present invention, and only one fixing portion 120 is shown. However, depending on the required fixing strength, a plurality of fixing portions are used to fix the package at a plurality of different locations. Also good. Preferably, as shown in the cross-sectional view of FIG. 1, it is desirable that the fixing portion 120 is single and has a small cross-sectional area. With the above-described fixing method, stress due to a difference in thermal expansion coefficient between the material of the fixing portion 120 and the material forming the electric element 103 is less likely to be generated, and the position variation and temporal change of the element due to thermal expansion and thermal contraction can be reduced. If a larger bonding area is required to maintain mechanical strength against vibration and impact, a plurality of fixing portions 120 may be provided instead of a single one.

  The container support substrate 116 is formed by laminating an unfired green sheet and a wiring structure and firing them. A wiring pattern is formed on the green sheet by screen printing using a paste material containing a metal material, and a new green sheet is laminated thereon to form the shape of the container support substrate 116. By firing these, the container support substrate 116 made of alumina ceramic and having the internal wiring structure 106 therein can be produced.

  Although a green sheet is an example, it is produced as follows. For example, first, a slurry in which the powder is dispersed in a dispersion medium made of an organic solvent such as 2-propanol is prepared by adding a polyvinyl binder and a surfactant to a metal oxide powder such as alumina. To do. Next, the produced slurry is formed by, for example, a well-known doctor blade method to form a slurry layer, and the dispersion medium is removed from the slurry layer to be dried to obtain a green sheet.

  The heater 109 in the chip carrier 107 used in the package of the present invention is an example, but can be configured as follows. An internal wiring structure can be built in the chip carrier 107, and a wiring having a high resistance value can be formed inside in a region where the electric element 103 is fixed. That is, the resistance value can be increased by designing the wiring shape such as narrowing the width of the wiring constituting the internal wiring structure and lengthening the wiring. Moreover, the wiring part which comprises the area | region where the electric element 103 is fixed can also be comprised from a metal material with high electrical resistance. The wiring portion formed in the chip carrier in this way becomes a resistance heating element that generates heat when an electric current flows, and can be operated as the heater 109. The heater 109 adjusts the temperature of the electric element 103 fixed integrally with the chip carrier 107 inside the shielding space formed by the container 100 and above the container support substrate 116 and spaced from the surface of the substrate 116. Do.

  As described above, by incorporating the heater 109 in the chip carrier 107, the package can be formed in comparison with the case of configuring the heater arranged along the package height direction outside the side portion of the lower part of the container as in the prior art. It becomes possible to make it thinner. Further, the heat conduction can be improved by increasing the area where the formation region of the heater 109 and the region of the electric element 103 overlap or by shortening the distance between the heater 109 and the electric element 103. In the package of the present invention, the chip carrier 107 having a built-in heater and the electric element 103 are integrally formed, so that the temperature of the target electric element 103 can be adjusted with a smaller amount of heat generation (power consumption) than in the prior art. It can be carried out. Since the amount of heat generated for adjustment can be reduced, the volume of the heater 109 itself can be reduced, and the temperature adjustment mechanism itself can be downsized. As described above, the present invention efficiently generates heat from the heater as compared with the configuration in which the heating value of the heater is wasted because the distance between the electric element and the heater is long as in the prior art. Since it can be transmitted to the element, it is possible to reduce the thickness of the package and reduce the power consumption of the temperature adjustment mechanism.

  The electric element 103 in the package of the present invention is fixed to the frame part 110 of the container lower part 102 by the fixing part 120 in a state where there is almost no passage through which heat from the heater 109 flows outside the package. On the other hand, the chip carrier 107 including the heater 109 is disposed adjacent to the electric element 103 as an integral part. Therefore, the temperature change of the fixed part 120 and the container lower part 102 is small with respect to the temperature change of the heater 109. For this reason, the electric element 103 is not easily affected by the positional deviation of thermal expansion and thermal contraction due to a temperature change, and the position variation of the electric element 103 can be reduced. By the method of fixing the electric element by the fixing unit 120 and the heater configuration in the package of the present invention, when inputting / outputting light to / from the outside through the optical window 104, optical characteristic deterioration such as coupling efficiency reduction due to position fluctuation is suppressed. be able to.

  As described above, the internal wiring structure 106 formed on the container support substrate 116 electrically connects the inside and the outside of the shielding space of the container 100. The internal wiring structure 106 is electrically connected to the flexible printed wiring 117 outside the package, such as at the end of the substrate 116. The flexible printed wiring 117 further provides electrical connection between the electrical elements in the package container 100 and the external device / external circuit. If the terminal on the electric element 103 and the terminal arranged on the inner side of the shielding space of the internal wiring structure 106 are connected by the bonding wire 113 or the like, the electric element 103 in the package and the external circuit are electrically connected via the wire 113. Can be connected. Similarly, if the heater 109 and a terminal arranged inside the shielding space of the internal wiring structure 106 are connected by a bonding wire 114 or the like, the heater 109 and the external circuit are connected via the wire 114. Can be electrically connected.

  The electric element 103 in the package of the present invention is, for example, a MEMS sensor element, and external light is input into the package through the optical window 104 through which light is transmitted, or light is output from the package to the outside. In this way, when the light is coupled inside and outside the package, it is necessary to adjust the optical axis of the electric element 103 to coincide with an external optical device or the like. When the temperature of the package is adjusted by the heater 109, depending on the coefficient of thermal expansion of the external structure (such as the socket substrate 308 in FIG. 3) to which the container 100 is mechanically fixed, Stress acts to cause a positional shift with respect to the optical axis once adjusted. For example, in the conventional PGA, the package is mechanically fixed to the board by inserting metal pins into a socket board which is an external structure, and the heat generated from the heater also flows into the socket board side. The problem of misalignment due to the difference in expansion rate occurs.

  On the other hand, in the package of the present invention, since the heater 109 is not in direct contact with the container 100, the flow of heat from the heater to the outside of the package is very small, and the temperature of the external structure is difficult to rise. Furthermore, even if the external structure is deformed by heat at the time of temperature adjustment, the external structure can be electrically connected to the outside using the flexible printed wiring 117 to avoid mechanical fixation with the external structure. It can prevent stress from the body from acting on the package. As described above, in the package of the present invention, the chip carrier 107 including the heater 109 and the electric element 103 are integrally configured, and the package and the external circuit are relatively loosely coupled to each other by a flexible printed wiring or the like. Problems caused by such misalignment can be suppressed.

  In the conventional PGA type package, a plurality of metal pins having a diameter of about 0.5 mm are provided on the bottom surface of the package, and in a quad flat package (QFP), a plurality of metals having a width of about 0.5 mm are provided. Leads are provided on each side of the bottom of the package. Due to the metal pin and lead configuration itself, the overall size of the package is increased, making it difficult to reduce the thickness. Furthermore, in the package of the prior art, since there are a plurality of metal bodies in the vicinity of the heater, the heat conduction is increased and the heat of the heater that heats the electric element leaks to the outside of the package through the metal bodies.

  On the other hand, according to the package of the present invention, since the flexible printed wiring 117 extending in the horizontal direction is used instead of pins and leads as a connection means between the package and the external circuit, the entire layer can be thinned. It is. Further, since the flexible printed wiring 117 is provided in the horizontal direction away from the heater, there is little heat conduction from the heater and it is difficult for heat to escape from inside the package. Furthermore, since the flexible printed wiring itself is composed of wiring having a cross-sectional width of about 200 μm, a thickness of about 20 μm, and a length of several centimeters, the thermal conductivity is low. The amount of heat generated from the heater leaking outside the package is smaller in the configuration of the present invention than in the configuration of the prior art, and the amount of heat generated by the heater can also be reduced. Since the amount of generated heat can be reduced, the volume of the heater itself can be reduced and the size can be reduced. According to the package of the present invention, it is possible to reduce the thickness of the electrical element package and to reduce the power consumption of the temperature adjustment mechanism.

[Embodiment 2]
FIG. 2 is a cross-sectional view showing a configuration of a second embodiment of the electrical element package of the present invention. The configuration in FIG. 2 is different from the configuration in the first embodiment shown in FIG. 1 only in the configuration in which the electric element 103 is connected to the container lower portion 102. Therefore, only the differences will be described below. In the configuration of FIG. 2, the electric element 103 has a two-layer structure including at least an upper layer substrate 118 and a lower layer substrate 119, and part of the upper layer substrate 118 protrudes in one direction from the lower layer substrate 119. An element 103 is provided. In the package of this embodiment, the protruding portion of the upper substrate 118 is used to fix and connect to the container lower part 102.

  Therefore, the electrical element package of the present invention is an electrical element housed in an internal space and has an optical window 104.In the package of the electrical element 103 and the electrical element on the side opposite to the optical window side, A carrier substrate 107 fixed via an adhesive layer, temperature adjusting means 109 for adjusting the temperature of the electric element, which is formed inside or on the surface of the carrier substrate, and a space is formed on the electric element. However, the container 100 accommodates the electrical element and the carrier substrate inside and hermetically seals the carrier substrate, and the carrier substrate is held by the electrical element apart from the facing surface of the container on the inner space side. It can also be realized as being fixed on the inner surface of the container through only a part 118 of the electric element.

  An example of such an electric element 103 having a two-layer structure is a MEMS mirror array module. The MEMS mirror array module has an array of mirrors created by a MEMS process as an upper layer substrate 118, a semiconductor substrate through which the mirror is driven so that the mirror can be electrostatically driven from below, and a lower substrate 119 as the mirror described above. And a semiconductor substrate including an electrode that is electrostatically driven in the vicinity of the lower portion of the substrate. The two substrates of the MEMS mirror array module are silicon-silicon bonded.

  Another example of the electric element having a two-layer structure includes a glass plate which is an optical window as the upper substrate 118 and an arrayed pixel electrode and a driving circuit which are optical reflecting surfaces as the lower substrate 119 at the same time. There is a liquid crystal element having a configuration in which a liquid crystal is held at the central portion in the plane and bonded and fixed at the outer peripheral portion in the plane between the glass plate and the semiconductor substrate. Therefore, preferably, the electric element 103 includes a first substrate 118 located on the optical window side, and a second substrate 119 bonded and fixed to at least a part of the first substrate. The substrate 118 may be fixed on the inner surface of the container 100 through a part of the substrate 118.

  In the package of the present embodiment, the lower surface of the upper substrate 118 is directly fixed to the container lower part 102 without using the bridge-shaped fixing portion in the first embodiment shown in FIG. In the first embodiment, fixing between the fixing unit 120 and the electric element 103 and fixing between the fixing unit 120 and the container lower part 102 are necessary. On the other hand, in this embodiment, it is necessary to fix only between the upper substrate 118 and the container lower part 102, and the number of connection parts is small. For this reason, according to the structure of this embodiment, the position fluctuation | variation by thermal expansion and thermal contraction can be reduced more compared with Embodiment 1. FIG.

  As described above, since the substrate (chip carrier) on which the electric element is mounted is provided with temperature adjusting means such as a heater so that the chip carrier and the electric element are integrated, the electric element that requires temperature adjustment. The package can be made smaller and thinner, and the power consumption in the heater can be reduced. Further, the temperature adjusting means is fixed only to the electric element, and heat is not likely to flow out of the package container or the package from the temperature adjusting means. Since there is almost no heat conduction path that flows from the temperature control means to the outside of the package, even if the electrical element performs optical input / output through the optical window, the difference in thermal expansion of each part of the package due to the heat of the heater The amount of misalignment due to is limited, and the required alignment accuracy of the optical axis inside and outside the package can be maintained.

  The package of the present invention is not limited to the configuration of the embodiment described above, and other configurations can be applied, and many variations and combinations are possible. For example, the fixing between the electric element and the lower portion of the container is not limited to the upper surface of the frame portion 110 but may be the inner side surface of the frame portion or the bottom surface of the support substrate 116. The shape of the fixing portion 120 is not a plate shape, but may be an L shape or other shapes. The specific material constituting each part of the container and the manufacturing method of each part are not limited to those of the above-described embodiment. Furthermore, although the configuration of only the heater has been described as the temperature adjusting means, in the case where the element temperature is adjusted to a temperature lower than room temperature, a cooling means such as a Peltier element may be configured in the chip carrier. Further, a heater and a cooling element may be combined. Further, the structure for sealing the electric element may be not only hermetic sealing but also resin sealing.

  As described above in detail, according to the present invention, the heater mechanism in the package of the electric element can be downsized, the size of the entire package can be further downsized and thinned, and the power consumption can be reduced. The conventional technology in which both the electric element and the heater are fixed to the container by fixing the temperature adjusting means having a large thermal deformation only to the electric element, and further, only the electric element is fixed to the inner surface of the container of the package by the fixing portion. In comparison, complicated distortion and stress generated in each part of the package at the time of temperature adjustment are alleviated, and displacement of the electric element can be reduced.

  The present invention can be used for a package on which a component such as an electric element is mounted. In particular, it can be used for packages such as liquid crystal elements and MEMS sensor elements that can be optically coupled to an external optical device.

100, 300 Package container 101, 301 Container lid 102, 302 Container lower part 103, 304 Electrical element 104, 313 Optical window 106 Internal wiring 107 Chip carrier 108, 309 Adhesive 109, 322 Heater 113, 114, 307 Bonding wire 116 Support substrate 117 Flexible printed wiring 120 Fixed portion 306 Metal pin 308 Socket substrate

In order to achieve the above-mentioned object, the present invention according to claim 1 is directed to a package having an electrical element housed in an internal space and having an optical window, the electrical element, and the optical element of the electrical element. A carrier substrate integrally fixed via an adhesive layer made of a resin material having a lower elastic modulus than the material of the electric element on the element surface opposite to the target window side, and the inside of the carrier substrate or the carrier substrate A temperature adjusting means configured to adjust the temperature of the electric element configured on a surface, and a container for accommodating the electric element and the carrier substrate inside and forming an airtight seal while forming a space on the electric element; And the carrier substrate is held by the electric element apart from the facing surface on the inner space side of the container, and only the electric element is fixed on the inner surface of the container via a fixing portion. A package which is characterized in that is.

Invention according to claim 2, housing the electric element in the internal space, in the packaging with an optical window, and the electrical device, in the device surface opposite the optical window-side of the electric element, said electric element adjusting a carrier substrate fixed integrally configured inside or on the carrier substrate surface of the carrier substrate, the temperature of the electric element through the adhesive layer to which the elastic modulus becomes a low resin material compared to the material Temperature adjusting means, and a container for accommodating the electric element and the carrier substrate inside and forming an airtight seal while forming a space on the electric element, and the carrier substrate includes the inner space of the container. The package is characterized in that it is held by the electric element apart from the opposite facing surface and is fixed on the inner surface of the container through only a part of the electric element.

The invention according to claim 5 is the package according to any one of claims 1 to 4, wherein the temperature adjusting means is a resistance heating element formed on the carrier substrate.

The invention according to claim 6 is the package according to claim 2, wherein the part of the electric element is a part of the surface to which the carrier substrate is bonded and fixed, and the inner surface of the container is the surface of the container It is an optical window side surface.
The invention according to claim 7 is the package according to claim 1, wherein the electric element is fixed to the fixing portion at a part of the surface of the electric element on the optical window side, and the inner surface of the container is It is a surface on the optical window side.
The invention according to an eighth aspect is the package according to any one of the first to seventh aspects, wherein the container includes a container support substrate having an internal wiring for electrical connection with the internal space, and the internal wiring Is electrically connected to the flexible printed wiring at the end of the container support substrate.

Claims (6)

In a package that houses an electrical element in an internal space and has an optical window,
An electrical element;
A carrier substrate fixed via an adhesive layer on an element surface opposite to the optical window side of the electric element;
A temperature adjusting means configured to adjust the temperature of the electric element, which is configured inside the carrier substrate or on the surface of the carrier substrate;
A container for accommodating the electric element and the carrier substrate inside and forming an airtight seal while forming a space on the electric element;
The carrier substrate is held by the electric element apart from the facing surface on the inner space side of the container, and only the electric element is fixed on the inner surface of the container via a fixing portion. Package. In a package that houses an electrical element in an internal space and has an optical window,
An electrical element;
On the element surface opposite to the optical window side of the electric element, a carrier substrate fixed via an adhesive layer;
A temperature adjusting means configured to adjust the temperature of the electric element, which is configured inside the carrier substrate or on the surface of the carrier substrate;
A container for accommodating the electric element and the carrier substrate inside and forming an airtight seal while forming a space on the electric element;
The carrier substrate is held by the electric element apart from the facing surface on the inner space side of the container, and is fixed on the inner surface of the container through only a part of the electric element. Package. The electrical element is
A first substrate located on the optical window side;
A second substrate bonded and fixed to at least a part of the first substrate;
The package according to claim 2, wherein the package is fixed on the inner surface of the container through a part of the first substrate. The first substrate is a glass substrate and the second substrate is a semiconductor substrate;
4. The package according to claim 3, wherein the electrical element is a liquid crystal element in which liquid crystal is held in a central portion of the first substrate between the first substrate and the second substrate. .   The package according to any one of claims 1 to 4, wherein the temperature adjusting means is a resistance heating element formed on the carrier substrate. In a package having an optical window opened from the internal space to the outside, wherein the electrical element is housed in the internal space, and light is input and output between the external optical device and the electrical element.
An electrical element including in part a functional part that can be optically coupled to the external optical device;
On the element surface opposite to the optical window side of the electric element, a carrier substrate fixed integrally with the electric element via an adhesive layer;
A temperature adjusting means configured to adjust the temperature of the electric element, which is configured inside the carrier substrate or on the surface of the carrier substrate;
A container for accommodating the electric element and the carrier substrate inside and forming an airtight seal while forming a space on the electric element;
The carrier substrate is held by the electric element so as to be separated from the facing surface on the inner space side of the container, and only the electric element is interposed via a fixing portion or only part of the electric element. A package characterized by being fixed on the inner surface of a container.

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