WO2016031117A1

WO2016031117A1 - Electrical-device package

Info

Publication number: WO2016031117A1
Application number: PCT/JP2015/003409
Authority: WO
Inventors: 佐藤　昇男; 山口　城治; 悦橋本; 鈴木　賢哉; 神　好人; 文博海老澤
Original assignee: 日本電信電話株式会社; Ｎｔｔエレクトロニクス株式会社
Priority date: 2014-08-29
Filing date: 2015-07-07
Publication date: 2016-03-03
Also published as: JP2016051773A

Abstract

The purposes of the present invention are to reduce the overall thickness, to reduce the power consumption of a heater for temperature adjustment, and to suppress positional deviation of an optical axis due to heat in a package (100) in which an electrical device (103) such as a laser diode, a MEMS sensor device, or a liquid crystal device is hermetically sealed. In the package (100) according to the present invention, a chip carrier (107) includes a temperature adjusting device, such as a heater (109), and the chip carrier (107) is fixed and held integrally with the electrical device (103). Of the electrical device (103) and the chip carrier (107), only the electrical device (103) is fixed to the inner surface of the casing of the package via a fixing part (120). With this configuration, most of the heat generated from the heater (109) is supplied efficiently for temperature adjustment of the electrical device (103), and it is possible to considerably suppress transfer of heat to the casing of the package or leakage of heat to the outside of the casing.

Description

Electrical element package

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a package for mounting components, and more particularly, to a package of an electric element housed and hermetically sealed.

Electrical elements such as laser diodes, micro electro mechanical systems (MEMS) sensor elements, liquid crystal elements, and the like depend on environmental conditions such as humidity to cause changes in characteristics and deterioration over time. In order to prevent these problems and achieve stabilization and high reliability of the characteristics of the electrical element, the above-mentioned electrical element is configured as a package hermetically sealed in a predetermined container. For example, in the MEMS mirror array module for wavelength selective switch shown in Non-Patent Document 1, when the electrical element is left exposed to the environment, its operation is affected by the change in capacitance associated with the mirror array due to humidity. It has been reported. Further, in a fine structure manufactured using a MEMS manufacturing technique, there is also a possibility that interference or sticking of a mechanically movable portion may be caused by a foreign matter which has invaded from the outside. As can be understood from these examples, a module mounted with an electrical element having a microstructure is generally used in a hermetically sealed state in a container.

FIG. 3 is a view showing an example of the configuration of a general package of an electric element used in the prior art. FIG. 3 schematically shows a cross section of the entire package 300 including the electric element 304 inside. The package is configured in the form of a container 300 comprised of a lid 301 and a container lower portion 302. The lid portion 301 and the container lower portion 302 are joined to each other by seam welding, solder bonding or the like to form a shielding space 303 in which the ingress and egress of the substance from the outside are blocked.

The lid portion 301 is configured by bonding a glass optical window 313 to a window frame portion 312 made of Kovar. The lower part 302 of the container is composed of a ceramic substrate 305 at the bottom, a frame 310 made of ceramic, and a frame 311 made of Kovar. By bonding the peripheral portion of the window frame 312 and the upper surface of the frame portion 311, a sealed state of the package is obtained.

In the shielding space 303 of the container 300 configured as described above, an electric element 304 such as a laser diode, a MEMS sensor element, or a liquid crystal element is disposed. The electric element 304 is fixed on the ceramic substrate 305 by an adhesive layer 309 such as solder. Electrical elements 304 that include elements as described above may require temperature regulation. Further, the container 300 is provided with an optical window 313 because these electric elements 304 optically input and output with the outside world. The shielded space 303 inside the package is also used to obtain the operating region of the movable part that constitutes the MEMS. The entire package is hermetically sealed in order to improve long-term reliability by avoiding humidity change and oxidation of the electric element 304.

On the back surface side of the ceramic substrate 305, a plurality of metal pins 306 having a diameter of about 0.5 mm are provided. Such a structure having a plurality of metal pins 306 is called a pin grid array (PGA). The electrical element 304 is connected to an electrical wire (not shown) in the lower part 302 of the container via the bonding wire 307 and is connected to the metal pin 306 via the electrical wire. The package 300 is fixed by inserting the metal pins 306 into the socket substrate 308.

In the prior art PGA type package as shown in FIG. 3, generally, the overall size has to be relatively thick for the following reasons. The heater 322 for temperature control is provided in the temperature control unit 321 disposed outside the frame portion 310 of the lower part 302 of the container, and so is located at a distance from the electric element 304. In addition, the heat passage between the heater 322 and the electrical element 304 is provided with a metal pin 306. Therefore, the heat generated from the heater 322 is escaped to the socket substrate 308 through the metal pin 306. A considerable portion of the heat generated from the heater 322 is consumed for heating the metal pins 306 and the socket substrate 308, and the power from the heater 322 is not effectively used for temperature control of the target electrical element 304 The As a result, there is a problem that a large amount of power consumption is required to drive the heater for temperature adjustment. Further, in the package structure requiring such a large amount of heat generation, it is necessary to increase the volume of the heater 322 itself, and there is a problem that the entire package becomes thicker and larger.

In addition to the problem of the amount of heat generation of the heater described above, positional deviation of the optical axis due to heat has also been a problem. An electric element 304 including at least a part of an optical element optically inputs and outputs through an optical window 313. The optical axes need to be matched with the required accuracy, inside and outside the package. In the package accompanied by heating using heater 322 for temperature control, due to thermal expansion of parts of the package and the mechanism outside the package, misalignment occurs beyond the alignment accuracy required for optical input / output. There was also a problem. As a result, the positional deviation of the electric element occurs with the environmental temperature fluctuation, and the optical input / output can not be properly performed, so that the function of the electric element may not be able to be sufficiently performed.

The present invention has been made in view of such problems, and an object of the present invention is to reduce the size and thickness of a package of an electrical element requiring temperature control and to further reduce power consumption. . Furthermore, it is possible to suppress the positional deviation of the electric element accompanying the temperature adjustment of the package, and to stably and reliably perform the optical input / output between the inside and the outside of the package.

In order to achieve such an object, an embodiment of the present invention accommodates an electrical element in an internal space, and in a package having an optical window, the electrical element is opposite to the optical window side of the electrical element. A carrier substrate fixed via an adhesive layer on the element surface on the side, a temperature control unit configured to control the temperature of the electric element, which is configured inside the carrier substrate or on the carrier substrate surface, and above the electric element A container for containing the electric element and the carrier substrate inside while forming a space therein, and hermetically sealing the container, and the carrier substrate is separated from the facing surface on the inner space side of the container and the electric A package is provided which is held by the element and fixed on the inner surface of the container via only a part of the electrical element.

Preferably, the electric element comprises a first substrate located on the optical window side, and a second substrate adhesively fixed to at least a part of the first substrate, and one of the first substrate It can be fixed on the inner surface of the container via a part.

More preferably, the first substrate is a glass substrate, the second substrate is a semiconductor substrate, and the electric element is the first substrate between the first substrate and the second substrate. The liquid crystal element can be a liquid crystal element held at the center of the substrate.

In the package of each embodiment of the present invention, light can be input and output between the optical device outside the package and the electric element through the optical window.

Further, in the package of each embodiment of the present invention, the temperature control means can be a resistance heating element formed on the carrier substrate.

According to another embodiment of the present invention, an electrical element is housed in an internal space, and a package having an optical window, wherein the electrical element and an adhesive layer on the element surface of the electrical element opposite to the optical window side Via the carrier substrate fixed via the carrier substrate, the temperature control means for adjusting the temperature of the electric element, which is formed inside the carrier substrate or on the carrier substrate surface, and while forming a space above the electric element, The device and the carrier substrate are housed inside, and the container is hermetically sealed. The carrier substrate is separated from the facing surface of the container on the inner space side and held by the electric device, and only the electric device is Provides a package which is fixed on the inner surface of the container via a fixing part.

In the present invention, preferably, the optical window is configured to open from the internal space to the outside and to input and output light between an external optical device and the electric element, and the electric element is partially connected to the electric element. It can include functional parts that can be optically coupled to an external light device.

As described above, according to the present invention, it is possible to miniaturize the heater mechanism in the package of the electric element, further miniaturize and thin the entire package size, and further reduce the power consumption. The temperature control means having large thermal deformation is fixed only to the electric element, and the fixing portion fixes only the electric element to the inner surface of the container of the package. As a result, in comparison with the prior art package in which both the electric element and the heater are fixed to the container, the complex strain and stress generated in each part of the package at the time of temperature control are alleviated and the positional deviation of the electric element is suppressed. Can.

FIG. 1 is a cross-sectional view showing a configuration of a first embodiment of a package of an electric element of the present invention. FIG. 2 is a cross-sectional view showing the configuration of a second embodiment of the package of the electric element of the present invention. FIG. 3 is a view showing a configuration of a package of a general electric element used in the prior art.

The package of the electric device of the present invention fixes the chip carrier for holding and fixing the electric device to the package container by a method different from the prior art. The chip carrier incorporates a temperature control element, for example, a heater, and is integrated with the electric element. The electric element and the chip carrier are fixed to the inner surface of the container only through the fixing portion. By this configuration, most of the heat generated from the heater can be efficiently provided for temperature control of the electric element, and the leakage of the heat to the container of the package or the outside of the container can be significantly suppressed. The heater can be miniaturized, and the package itself can be miniaturized. It is also possible to reduce the power consumption of the temperature adjustment operation of the heater. It can also be fixed to the inner surface of the container using only the first substrate, using the structure of the two-layer substrate consisting of the first substrate and the second substrate as the electric element. Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, a first embodiment of the package of the electric device of the present invention will be described with reference to FIG.
Embodiment 1

FIG. 1 is a cross-sectional view showing a configuration of a first embodiment of a package of an electric element of the present invention. The package 100 of the electric element of the present invention is roughly formed of a lid portion 101 and a container lower portion 102, and is configured as a container 100 in which the electric element 103 is accommodated. A space for hermetically sealing the electric element 103 is provided inside the container 100. In the package of the present invention, the configuration of the electric element 103 disposed inside the container 100 and the chip carrier (substrate) 107 on which the electric element 103 is mounted has characteristics different from those of the prior art. In the package of the electric device of the present invention, the term "package" means a storage container in which the electric device is housed and formed at least at one time in operation. A certain function is realized by inputting / outputting at least an electric signal between an electric element in the package and an external device / circuit of the package. The package of the electric device of the present invention is more effective particularly in those which perform optical input / output between the outside of the package and the electric device. Therefore, the package has an optical window opened from the internal space to the outside for light input / output between an external light device and the electrical element.

In the package of the present embodiment, the chip carrier 107 is made of ceramic which is an insulator. The electric element 103 is integrally fixed on the chip carrier 107 by an adhesive layer 108 made of solder, resin or the like. The thermal conductivity between the electric element 103 and the chip carrier 107 can be further improved by forming the adhesive layer 108 from a metal material such as solder.

The package of the electric device of the present invention is provided with a heater 109 incorporated in a chip carrier 107 as temperature control means. The chip carrier 107 is housed in the space in the container 100 as an integral part of the electric element 103. The heater 109 may be provided in the vicinity of the area where the electric element 103 is disposed in the chip carrier 107.

The lid portion 101 includes a window frame portion 111 made of Kovar and an optical window 104 made of sapphire. Further, the lower part 102 of the container includes a container support substrate 116 made of ceramic, a frame 110 made of ceramic, and a frame 112 made of Kovar. The container support substrate 116 and the frame 110 can be integrally formed. As long as an electrical wiring between the outside and the outside described later can be formed, the separate container support substrate 116 and the frame portion 110 may be formed in combination. Furthermore, in order to electrically connect the electric element 103 to an external device / external circuit of the package, the flexible printed wiring 117 is connected to, for example, an end of the container support substrate 116 outside the container 100.

In the package of the electric element of the present invention, the chip carrier 107 and the electric element 103 are integrally formed on the inner side of the frame portion 110 of the container lower portion 102 above the container support substrate 116 and separated from the substrate surface. , And fixed via a bridge-like fixing portion 120. Thus, with the configuration in which the heater 109 is provided in the chip carrier 107 integrated with the electric element 103, the heat generated from the heater 109 is directly supplied to the electric element 103 and escapes to the container support substrate 116 side. It can be suppressed. By the fixing method of the electric element by the fixing portion 120 in the package of the present invention and the configuration of the heater, the heat generation from the heater is efficiently transmitted to the electric element 103 without loss, and the temperature of the electric element 103 is adjusted with a smaller heat generation amount. be able to.

Therefore, the package of the electric device of the present invention accommodates the electric device in the inner space, and in the package having the optical window 104, the electric device 103 and the device surface of the electric device opposite to the optical window side A carrier substrate 107 fixed via an adhesive layer, a temperature control unit 109 configured to adjust the temperature of the electric element, which is formed inside the carrier substrate or on the carrier substrate surface, and a space is provided on the electric element A container 100 is provided that houses the electric element and the carrier substrate inside and forms an airtight seal, and the carrier substrate is separated from the facing surface of the inner space of the container by the electric element. It can be realized as held and only the electric element is fixed on the inner surface of the container via the fixing portion 120.

The fixing between the fixing portion 120 and the electric element 103 and the fixing between the fixing portion 120 and the container lower portion 102 may be performed using solder, resin or the like. For example, in the case where weight reduction of the container 100 of the package and reduction in power consumption of the temperature control means are more important, between the fixed portion 120 and the electric element 103 and between the fixed portion 120 and the lower portion 102 of the container. And each may be fixed with a material having a low thermal conductivity such as a resin. In order to further reduce positional fluctuations due to thermal expansion or thermal contraction, the fixing between the fixing part 120 and the electric element 103 and the fixing between the fixing part 120 and the container lower part 102 are fixed using solder, Between the electric element 103 and the chip carrier 107, a resin having a low elastic modulus and capable of partially absorbing the deformation of the chip carrier 107 may be fixed.

The resin material used for the adhesion described above is required to have low degassing for use in the hermetically sealed container, and to prevent the electrical element from being displaced with respect to a predetermined optical axis. In order to satisfy the requirement for prevention of misalignment, the difference in thermal expansion between the chip carrier and the ceramic constituting the container is small, the curing shrinkage as an adhesive is small, and the misalignment during high temperature storage and operation A resin material that satisfies the high glass transition temperature is suitable for reducing the size. Specifically, an epoxy resin system with few uncured components and little degassing, and an example of an adhesive taking into consideration the difference in thermal expansion coefficient, curing shrinkage and glass transition temperature, such as 353ND made by EPOTEK and made by NTT Advanced Technology And AT4291A.

Although one cross section of the package of the present invention is shown in FIG. 1 and only one fixing portion 120 is shown, it is fixed at a plurality of different points using a plurality of fixing portions according to the required fixing strength. Also good. Preferably, as shown in the cross-sectional view of FIG. 1, it is desirable that the fixing portion 120 be single and have a small cross-sectional area. By the above-described fixing method, stress due to the difference in thermal expansion coefficient between the material of the fixing portion 120 and the material forming the electric element 103 is less likely to be generated, thereby reducing the positional fluctuation and time-dependent change of the element due to thermal expansion and thermal contraction. Can. If a larger bonding area is required to maintain mechanical strength against vibration and impact, a plurality of fixing portions 120 may be provided instead of a single one.

The container support substrate 116 is formed by laminating unfired green sheets and a wiring structure and baking them. A wiring pattern is formed on the green sheet by screen printing using a paste material containing a metal material, and a new green sheet is laminated thereon to form a container support substrate 116. By firing these, it is possible to produce a container support substrate 116 made of alumina ceramic and provided with the internal wiring structure 106 inside.

Although a green sheet is an example, it is produced as follows. For example, first, a polyvinyl binder and a surfactant are added to a powder of metal oxide such as alumina to prepare a slurry in which the powder is dispersed in a dispersion medium consisting of an organic solvent such as 2-propanol or the like. Do. Next, the prepared slurry is formed, for example, by a well-known doctor blade method to form a layer of the slurry, and the dispersion medium is removed from the layer of the slurry and dried to form a green sheet.

The heater 109 in the chip carrier 107 used in the package of the present invention is an example, but can be configured as follows. It is possible to incorporate an internal wiring structure in the chip carrier 107, and in the region where the electric element 103 is fixed, a wiring having a high resistance value can be formed inside. More specifically, the resistance value can be increased by narrowing the width of the wiring forming the internal wiring structure or by designing the wiring shape such as lengthening the wiring. Moreover, the wiring part which comprises the area | region to which the electric element 103 is fixed can also be comprised from the metal material with high electrical resistance. Thus, the wiring portion formed in the chip carrier serves as a resistance heating element that generates heat when current flows, and can be operated as the heater 109. The heater 109 adjusts the temperature of the electric element 103 fixed integrally with the chip carrier 107 in the shielded space formed by the container 100 and above the container support substrate 116 and away from the surface of the substrate 116. Do.

As described above, by incorporating the heater 109 in the chip carrier 107, the package is compared with the configuration having the heater disposed along the package height direction outside the lower portion of the container as in the prior art. Can be made thinner. Further, heat conduction can be improved by increasing the overlapping area of the region where the heater 109 is formed and the region of the electric element 103 or shortening the separation distance between the heater 109 and the electric element 103. In the package of the present invention, the chip carrier 107 incorporating the heater and the electric element 103 are integrated, so that the temperature of the electric element 103 targeted by a smaller amount of heat generation (power consumption) compared to the package of the prior art. Adjustments can be made. Since the amount of heat generation required for temperature control can be reduced, the volume of the heater 109 itself can be reduced, and the temperature control mechanism itself can be miniaturized.

As described above, the package of the present invention is more efficient at generating heat from the heater, as compared with the configuration in which the amount of heat generated by the heater is wasted because the distance between the electric element and the heater is large as in the prior art. Can be transmitted to the electric element, and the package can be thinned and the power consumption of the temperature control mechanism can be reduced.

The electric element 103 in the package of the present invention is fixed to the frame portion 110 of the container lower portion 102 by the fixing portion 120 in a state where there is almost no passage through which the heat from the heater 109 flows to the outside of the package. On the other hand, the chip carrier 107 including the heater 109 is disposed adjacent to the electric element 103 as one unit. Therefore, the temperature change of the fixed portion 120 and the container lower portion 102 is small with respect to the temperature change of the heater 109. For this reason, the electric element 103 is not easily affected by thermal expansion or thermal displacement due to temperature change, and positional fluctuation of the electric element 103 can be reduced. The optical characteristic deterioration such as the decrease in the coupling efficiency due to the position fluctuation when inputting and outputting light with the outside through the optical window 104 by the fixing method of the electric element by the fixing part 120 in the package of the present invention and the construction method of the heater. Can be reduced.

As described above, the internal wiring structure 106 formed on the container support substrate 116 electrically connects between the inside and the outside of the shielded space of the container 100. The internal wiring structure 106 is electrically connected to the flexible printed wiring 117 outside the package at the end of the substrate 116 or the like. The flexible printed wiring 117 further provides an electrical connection between the electric element in the container 100 of the package and the external device / external circuit. If the terminal on the electric element 103 and the terminal arranged on the inner side of the shielding space of the internal wiring structure 106 are connected by the bonding wire 113 or the like, the electric element 103 in the package and the external circuit are electrically Can be connected. Similarly, if the heater 109 and the terminal disposed on the inner side of the shielding space of the internal wiring structure 106 are connected by the bonding wire 114 or the like, the heater 109 and the external circuit are connected via the wire 114. It can be connected electrically.

The electric element 103 in the package of the present invention is, for example, a MEMS sensor element, and inputs external light into the package through the optical window 104 through which light is transmitted, or outputs light from the package to the outside. As described above, when light is coupled in and out of the package, it is necessary to adjust the optical axis of the electric element 103 to be matched with an external optical device or the like. When the temperature of the package is adjusted by the heater 109, the coefficient of thermal expansion of the external structure (such as the socket substrate 308 in FIG. 3) to which the container 100 is mechanically fixed causes the container lower portion 102 or the electric element 103 to be adjusted. Stress is exerted to cause positional deviation with respect to the optical axis once adjusted. For example, in the prior art PGA, the package is mechanically fixed to the substrate by inserting a metal pin into the socket substrate which is an external structure, and the heat generated from the heater flows also to the socket substrate side to cause the above-mentioned thermal expansion. There is a problem of misalignment due to the difference in rates.

On the other hand, in the package of the present invention, since the heater 109 is not in direct contact with the container 100, the flow of heat from the heater to the outside of the package is very small, and the temperature of the external structure hardly rises. Furthermore, even if the external structure is deformed by heat at the time of temperature adjustment, the external structure is electrically connected to the outside using the flexible printed wiring 117 to avoid mechanical fixation with the external structure, thereby the external structure. Stress from the body can be prevented from acting on the package. As described above, in the package of the present invention, the chip carrier 107 incorporating the heater 109 and the electric element 103 are integrally configured, and the package and the external circuit are relatively loosely coupled by flexible printed wiring or the like. It is possible to suppress the problems caused by the positional deviation such as.

In the prior art PGA type package, a plurality of metal pins having a diameter of about 0.5 mm are provided on the bottom of the package, and in a quad flat package (QFP), a plurality of metals having a width of about 0.5 mm are provided. Leads are provided on each side of the bottom of the package. Due to the configuration of these metal pins and leads themselves, the overall size of the package is thick and it is difficult to reduce the thickness. Furthermore, in the prior art package, since there were a plurality of metal bodies in the vicinity of the heater, the heat conduction became large and the heat of the heater for heating the electric element leaked to the outside of the package through the metal body.

In contrast, according to the package of the present invention, since the flexible printed wiring 117 extending in the horizontal direction is used instead of the pins and leads as the connection means between the package and the external circuit, thinning of the entire package is achieved. It is possible. Further, since the flexible printed wiring 117 is provided horizontally away from the heater, the heat conduction from the heater is small, and the heat is difficult to escape from the inside of the package. Furthermore, since the flexible printed wiring itself is also composed of, for example, a wiring having a width of 200 μm, a thickness of 20 μm, and a length of several centimeters in cross section, its thermal conductivity is low. In the package of the present invention, the amount of heat generation from the heater leaks to the outside of the package compared to the configuration of the prior art, and the amount of heat generation of the heater can also be reduced. Since the calorific value of the heater can be reduced, the volume of the heater itself can also be miniaturized. According to the package of the present invention, it is possible to make the package of the electric element thinner and reduce the power consumption of the temperature control mechanism.
Second Embodiment

FIG. 2 is a cross-sectional view showing the configuration of a second embodiment of the package of the electric element of the present invention. The configuration of FIG. 2 is different from the configuration of the first embodiment shown in FIG. 1 only in the configuration of connecting the electric element 103 to the lower part 102 of the container. Therefore, hereinafter, only differences from the first embodiment will be described. In the configuration of the second embodiment of FIG. 2, the electric element 103 has a two-layer structure including at least the upper layer substrate 118 and the lower layer substrate 119. A part of the upper layer substrate 118 protrudes in one direction to the outside of the substrate surface area of the lower layer substrate 119. In the package of the present embodiment, the protruding portion of the upper layer substrate 118 is used to fix and connect the electric element 103 and the container lower portion 102.

Therefore, in the package of the electric element of the present invention, the electric element is housed in the inner space, and in the package having the optical window 104, the electric element 103 and the element surface of the electric element opposite to the optical window side A carrier substrate 107 fixed via an adhesive layer, a temperature control unit 109 for adjusting the temperature of the electric element, which is formed inside the carrier substrate or on the carrier substrate surface, and a space is formed on the electric element And the container 100 containing the electric element and the carrier substrate inside and hermetically sealing the carrier substrate, and the carrier substrate is held by the electric element at a distance from the facing surface of the inner space of the container. It can be realized as being fixed on the inner surface of the container only via the part 118 of the electrical element.

An example of such an electrical element 103 having a two-layer structure is a MEMS mirror array module. The MEMS mirror array module has an array of mirrors formed by the MEMS process as the upper layer substrate 118, a semiconductor substrate through which the substrate is penetrated so that the mirror can be electrostatically driven from the lower portion, and the above mirror as the lower layer substrate 119. And a semiconductor substrate provided with an electrostatically driven electrode in the vicinity of the lower part of the semiconductor substrate. The two substrates of the MEMS mirror array module are silicon-silicon bonded.

Another example of the electric element having a two-layer structure is a glass plate as an optical window as the upper layer substrate 118, an optical reflecting surface as the lower layer substrate 119, and an array of pixel electrodes and a driving circuit simultaneously. And a liquid crystal is held between the glass plate and the semiconductor substrate in the in-plane central portion, and the glass plate and the semiconductor substrate are bonded and fixed in the in-plane outer peripheral portion. There is a liquid crystal element. Therefore, preferably, the electric element 103 is composed of a first substrate 118 located on the optical window side, and a second substrate 119 adhesively fixed to at least a part of the first substrate, The substrate 118 is fixed on the inner surface of the container 100 through a part of the substrate 118.

In the package of this embodiment, the lower surface of the upper layer substrate 118 is directly fixed to the lower portion 102 of the container without the bridge-like fixing portion in the first embodiment shown in FIG. In the first embodiment, it is necessary to fix the fixing portion 120 and the electric element 103 and to fix the fixing portion 120 and the lower portion 102 of the container. On the other hand, in the present embodiment, only the upper substrate 118 and the container lower portion 102 may be fixed, and the number of connection sites is small. For this reason, according to the configuration of the present embodiment, the positional variation of the electric element due to the thermal expansion or thermal contraction can be further reduced as compared with the package of the first embodiment.

As described above, the package of the electric element of the present invention is configured such that the substrate (chip carrier) on which the electric element is mounted (chip carrier) is provided with temperature control means such as a heater, and the chip carrier and the electric element are integrated. Ru. As a result, the package of the electric element can be further miniaturized and thinned, and the power consumption necessary for temperature control in the heater can be reduced. Furthermore, the package of the electric device of the present invention has a configuration in which the temperature control means is fixed only to the electric device, and heat is less likely to flow out of the container and further out of the package from the temperature control means. Since there is almost no path for heat conduction from the temperature control means to the outside of the package, even if the electrical element performs optical input / output through the optical window, the difference in thermal expansion of each part of the package due to the heat of the heater As a result, it is possible to suppress the amount of misalignment due to the above, and to maintain the accuracy necessary for the alignment of the optical axis inside and outside the package.

The package of the present invention is not limited to the configuration of the embodiment described above, and other configurations are applicable, and many modifications and combinations are possible. For example, the fixing between the electric element and the lower part of the container is not limited to the upper surface of the frame 110 but may be fixed to the electric element at the inner side surface of the frame or the bottom surface of the support substrate 116. The shape of the fixing portion 120 is not plate-like but may be L-shaped or other shape. The specific material which comprises each part of a container, and the preparation methods of each part are not restricted only to the thing of the above-mentioned embodiment. Furthermore, although only the heater has been described as the temperature control means, when the element temperature is adjusted to a temperature lower than normal temperature, a cooling means such as a Peltier element may be provided in the chip carrier. A heater and a cooling element may be combined as a temperature control means. Further, the structure for sealing the electric element may be resin sealing as well as hermetic sealing.

As described above in detail, according to the present invention, it is possible to miniaturize the heater mechanism in the package of the electric element, further miniaturize and reduce the size of the entire package, and further reduce the power consumption. The prior art in which both the electric element and the heater are fixed to the container by fixing the temperature adjustment means having large thermal deformation only to the electric element and further fixing only the electric element to the inner surface of the container of the package by the fixing portion. In comparison, complicated strain and stress generated in each part of the package at the time of temperature control can be alleviated, and the displacement of the electric element can be reduced.

The present invention can be used for a package on which components such as electrical elements are mounted. In particular, it can be used for packages such as liquid crystal elements and MEMS sensor elements that can be optically coupled to an external optical device.

DESCRIPTION OF

SYMBOLS

100, 300

Package container

101, 301

Container lid

102, 302 Container

lower part

103, 304

Electric element

104, 313 Optical window 106 Internal wiring 107

Chip carrier

108, 309

Adhesive

109, 322

Heater

113, 114, 307 Bonding wire 116 Support substrate 117 flexible printed wiring 120 fixing portion 306 metal pin 308 socket substrate

Claims

In a package containing an electric element in an inner space and having an optical window,
Electric element,
A carrier substrate fixed via an adhesive layer on an element surface opposite to the optical window side of the electric element;
A temperature control unit configured to control the temperature of the electric element, which is configured inside the carrier substrate or on the carrier substrate surface;
A container that accommodates the electric element and the carrier substrate inside while forming a space on the electric element, and airtightly seals the container;
The carrier substrate is held by the electric element at a distance from the facing surface on the inner space side of the container, and is fixed on the inner surface of the container through only a part of the electric element. Package to be
The electric element is
A first substrate located on the optical window side;
And a second substrate adhesively fixed to at least a part of the first substrate,
The package according to claim 1, wherein the package is fixed on the inner surface of the container via a portion of the first substrate.
The first substrate is a glass substrate, and the second substrate is a semiconductor substrate.
The package according to claim 2, wherein the electric element is a liquid crystal element in which liquid crystal is held at a central portion of the first substrate between the first substrate and the second substrate. .
The package according to any one of claims 1 to 3, wherein the temperature control means is a resistance heating element formed on the carrier substrate.
In a package containing an electric element in an inner space and having an optical window,
Electric element,
A carrier substrate fixed via an adhesive layer on an element surface of the electric element opposite to the optical window side;
A temperature control unit configured to control the temperature of the electric element, which is configured inside the carrier substrate or on the carrier substrate surface;
A container that accommodates the electric element and the carrier substrate inside while forming a space on the electric element, and airtightly seals the container;
The carrier substrate is separated from the facing surface on the inner space side of the container and held by the electric element, and only the electric element is fixed on the inner surface of the container via a fixing portion. Package to be
The optical window is configured to open from the interior space to the outside and to input and output light between an external optical device and the electrical element, and the electrical element is partially optical to the external optical device A package according to claim 1 or 5, characterized in that it comprises functional parts that can be attached to.