JP2015176874A - electronic component device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component device capable of being sealed with high airtightness even when the device is reduced in size furthermore.SOLUTION: An electronic component element is hermetically sealed by a base 1 including a housing recessed part formed of a metal material and a lid 2 covering an open part side of the housing recessed part, the electronic component element being a quartz oscillator, a battery, a sensor component or the like housed in the housing recessed part. A sealed structure of the base 1 and the lid 2 is a fitting structure comprising a fitting recessed part 21 and a fitting projecting part 11 which are formed at an open tip part of a side wall of the base 1 and an outer peripheral edge part of the lid 2, and metal bonding such as seam welding is performed at a fitting portion. By the fitting structure where the fitting projecting part 11 is fitted into the fitting recessed part 21, a wider bonding area (a bottom face of the fitting recessed part, both side faces of the fitting recessed part, and a plurality of faces (four faces or five faces) of one side or both sides of a tip part face of the fitting recessed part) can be secured, so that higher sealing ability can be obtained.

Description

  The present invention relates to an electronic component device, for example, an electronic component device in which electronic component elements such as a crystal resonator, a battery, and a sensor component are accommodated.

In recent years, a conventional electronic component device using an electronic component element such as a crystal resonator has been widely used. In this electronic component device, the electronic component element is generally housed in a cylindrical metal package, and electrode leads are generally taken out from the cylindrical metal package opening and sealed with a metal lid.
However, as the application of the semiconductor light emitting device is expanded, there is a demand for a rectangular parallelepiped electronic component device having a smaller size.
For example, in an electronic component device used for a mobile phone or a smart phone, the temperature of the device changes in a wide range from −20 ° C. to 80 ° C. and is also exposed to vibration. In such a case, it is impossible to mount in a limited space by sealing with a cylindrical metal package as described above, and even an environmental test cannot be performed.
In view of this, Japanese Patent Application Laid-Open No. H10-228667 proposes a technique of performing a package made of ceramic and glass instead of sealing with a cylindrical metal package.

FIG. 7 is a schematic cross-sectional view of a crystal resonator device containing a crystal resonator as an example of a ceramic type package which is one type of such a package.
The crystal resonator device shown in FIG. 7 includes a base body 10 made of an electrically insulating material such as alumina ceramics and a lid body 20 made of an electrically insulating material such as glass and ceramics. It is composed of
The crystal resonator 8 accommodated in the base 10 is connected to the internal wiring 30 by a conductive adhesive 70, and the internal wiring 30 is electrically connected to the external electrode 50 formed outside the bottom surface of the base 10. Yes.
The base 10 and the lid 20 are bonded together by a sealing member 90 made of organic resin, glass, low melting point brazing material, or the like in a vacuum, so that the crystal unit 8 is hermetically sealed.
In this manner, the crystal resonator device in which the package is made of ceramic has high reliability and is excellent in moisture resistance, heat resistance, and airtightness when it is a certain size or larger.

However, in an electronic component device, for example, in order to ensure high reliability, it is important to seal the inside of the package with good airtightness. However, as the size is reduced, the thickness of the package material decreases. For this reason, when a conventional ceramic package is used, it is difficult to uniformly bond the ceramics together, and there is a possibility that the manufacturing yield and the reliability of airtightness are lowered.
In the case of a ceramic package, if the material thickness is 0.2 mm or less, the strength of the entire package may be reduced.
Furthermore, there is a possibility that cracks may occur at the weld interface due to stress strain occurring during welding with the lid 20.

Japanese Utility Model Publication No. 4-23326

The first object of the present invention is to provide a highly airtight seal even when the device is further downsized.
The second object of the present invention is to reduce the size with a thinner material while maintaining the overall strength.

(1) In the first aspect of the present invention, in order to achieve the first object, an electronic component element and an accommodating recess for accommodating the electronic component element are formed, and a side wall of the accommodating recess is released. Airtightly seals the receiving recess, in which a base portion having an annular first fitting portion formed on a side end portion and a second fitting portion that fits over the entire circumference of the first fitting portion are formed. An electronic component device comprising a lid, an external electrode disposed outside the housing recess, and a wiring for electrically connecting the electronic component element and the external electrode, wherein the first fitting portion The second fitting portion has an electronic component device in which a fitting concave portion is formed on one side and a fitting convex portion is formed on the other side.
(2) In the invention according to claim 2, the fitting recess and the fitting projection are formed with a recess and a projection in a horizontal direction or a vertical direction with respect to the inner bottom surface of the receiving recess. The electronic component device according to claim 1 is provided.
(3) In the invention described in claim 3, the fitting convex portion is formed with a convex portion in a direction orthogonal to a surface on which the fitting convex portion is formed. An electronic component device according to 2 is provided.
(4) In the invention described in claim 4, in order to achieve the second object, the base and the lid are formed of metal, and the external electrode and the wiring are arranged via an insulating material. The electronic component device according to claim 1, 2, or 3 is provided.
(5) In the invention according to claim 5, the electronic component device according to claim 4, wherein the base and the lid have a thickness of 0.05 mm to 0.2 mm. To do.
(6) The electronic component device according to claim 4, wherein the base and the lid have a thickness of 0.05 mm to 0.1 mm. To do.
(7) In the invention according to claim 7, the first fitting portion and the second fitting portion are metal-bonded at the entire portion facing each other by fitting. An electronic component device according to claim 4, claim 5 or claim 6 is provided.

According to the present invention, since the base and the lid for housing the electronic component element are fitted with the fitting recess and the fitting convex, the contact is made with a larger contact area. High sealing is possible.
According to invention of Claim 4, since the base and the cover body are formed with the metal, it can reduce in size with the thinner material, maintaining the whole intensity | strength.

It is explanatory drawing which showed typically the side cross section of the electronic component apparatus which accommodated the crystal oscillator concerning this embodiment. It is a figure showing the internal structure of an electronic component apparatus, and represents the AA cross section of FIG. It is explanatory drawing showing the detail of the fitting recessed part in a cover body. It is explanatory drawing about the deformation | transformation state of the fitting part with respect to the pressure of the thickness direction of an electronic component apparatus. It is explanatory drawing showing the side cross section of the electronic component apparatus which concerns on a 1st modification. It is explanatory drawing about the fitting structure part of the electronic component apparatus which concerns on a 2nd-4th modification. It is sectional drawing which shows the conventional electronic component apparatus.

Preferred embodiments and modifications of the electronic component device of the present invention will be described below with reference to FIGS.
(1) Outline of Embodiment The electronic component device of the present embodiment is housed in the housing recess by the base 1 in which the housing recess is formed of a metal material and the lid (lid) 2 that covers the open portion side of the housing recess. The electronic component elements such as the crystal resonator, the battery, and the sensor component are hermetically sealed.
In the present embodiment, as a sealing structure of the base 1 and the lid 2, the fitting is formed with a fitting recess formed in the distal end portion where the side wall of the base 1 (side wall of the housing recess) is opened and the outer peripheral edge portion of the lid 2. A fitting structure with the convex portion is used, and the fitting portion is subjected to metal bonding such as seam welding.

Thus, in the electronic component device according to the present embodiment, the fitting structure is configured such that the fitting convex portion is fitted into the fitting concave portion, not the joining by the area of only the abutting portion between the front end of the housing concave portion and the lid body 2. This ensures a wider joint area (fitting recess bottom surface, both sides of the fitting recess, and multiple surfaces (four or five surfaces) on one side or both sides of the fitting recess tip surface), and a higher degree of sealing. Can be obtained.
In particular, with the fitting structure of the present embodiment, it is possible to reduce the generation of stress to the joint portion even against the force pressing the central portion of the electronic component device.
In addition, by forming the base 1 and the lid 2 with a metal material, for example, it is possible to sufficiently ensure the strength even with a thin material of 0.2 mm or less, and can be easily formed by pressing or drawing. Will also be possible.

(2) Details of Embodiment FIG. 1 is a diagram schematically showing a side cross-section of an electronic component device containing a crystal resonator according to this embodiment. FIG. 1 shows a BB cross section of FIG.
FIG. 2 is a diagram illustrating the internal structure of the electronic component device, and represents a cross section taken along the line AA of FIG.
Further, in the present specification, with respect to the base 1 and the lid body 2, the side facing the housing recess where the crystal resonator 8 is installed is referred to as the inside, and the opposite side is referred to as the outside.
As shown in FIG. 1, the electronic component device according to the present embodiment includes a base 1 in which an accommodation recess is formed and a lid 2, and the inside of the accommodation recess in which the crystal resonator 8 is disposed is inactive. It is hermetically sealed in a gas or vacuum state.
The external dimensions of the electronic component device are 0.5 mm in height (depth direction of the housing recess), 1.6 mm in length direction (lateral direction in FIG. 2), and 1.2 mm in vertical direction (vertical direction in FIG. 2). Is formed.

  The shape and size of the electronic component device relate to the present embodiment that accommodates a crystal resonator as an electronic component element, and the electronic component device that accommodates other electronic component elements has other shapes and sizes. It is formed. For example, the shape of the electronic component device may be circular or elliptical when viewed from above.

In the base 1, a housing recess for housing the crystal resonator 8 is configured by a bottom surface portion 1 t and a side surface portion 1 s. The base 1 is formed by pressing or drawing a metal material. The metal material and formation will be described later.
The material thickness of the bottom surface portion 1t is preferably 0.05 mm to 0.2 mm, more preferably 0.05 mm to 0.1 mm.
On the other hand, the material thickness of the side surface portion 1s (peripheral portion) of the base portion 1 is preferably 0.05 mm to 0.2 mm, and more preferably 0.05 mm to 0.1 mm.

Inside the bottom surface portion 1t, a crystal resonator 8 as an electronic component element is disposed substantially at the center.
The crystal resonator 8 has a pair of positive and negative electrodes on one end side. As shown in FIG. 1, the crystal resonator 8 has the other end side floating at a predetermined distance from the bottom surface portion 1 t of the base portion 1, and both electrodes on one end side are connected to the base portion 1 by the conductive adhesives 7 a and 7 b. It is fixed.

Inside the bottom surface portion 1t, through holes penetrating in the thickness direction one by one are formed on both the left and right sides of the crystal resonator 8, and as shown in FIG. 2, the conductive adhesive 7a is formed from both through holes. , 7b, internal wirings 3a, 3b are formed.
External electrodes 5a and 5b are formed in a predetermined region including both through holes on the outer side of the bottom surface portion 1t, and a through hole for electrically connecting the internal wiring 3a and the external electrode 5a is formed in one through hole. An electrode 4a is provided, and a through electrode 4b for connecting the internal wiring 3b and the external electrode 5b is provided in the other through hole.
The through electrodes 4a and 4b are formed of a metal having the same thermal expansion coefficient as that of the bottom surface material, for example, an alloy of Fe 50% and Ni 50%.
The through electrodes 4a and 4b may be inserted with pin-shaped electrodes, or may be formed by filling and filling the through holes by applying and filling a metal paste. Moreover, after inserting a pin-shaped electrode in a through-hole, through-electrode 4a, 4b may be made to fill the clearance gap between a pin-shaped electrode and a through-hole with a metal paste.

  The external electrodes 5a and 5b form a mounting surface when the electronic component device is mounted on the mounting substrate. Thereby, the crystal resonator 8 housed in the central bottom portion of the base 1 receives power via the conductive adhesives 7a and 7b, the internal wirings 3a and 3b, the through electrodes 4a and 4b, and the external electrodes 5a and 5b. And electrical signal output.

In addition, since the base 1 of the present embodiment is formed of a metal material, in order to insulate from the base 1, the inner side of the bottom surface portion 1 t, the inner peripheral surface of the through hole, and the predetermined region outside the bottom surface portion 1 t are An electrical insulating film 6 such as silicon dioxide is formed. Conductive adhesives 7a and 7b, internal wirings 3a and 3b, through electrodes 4a and 4b, and external electrodes 5a and 5b are formed on the electrical insulating film 6 (inside).
In the present embodiment, the electrical insulating film 6 is formed in regions corresponding to the internal wirings 3a and 3b and the external electrodes 5a and 5b. However, the electrical insulating film is formed on the inside and outside of the bottom surface portion 1t and the entire through hole. 6 may be formed.
The internal wirings 3a and 3b are formed by applying a nano metal, for example, a silver nano metal, which is a high conductivity material that does not limit the current capacity of the electronic component element, onto the electrical insulating film 6 by inkjet.
The external electrodes 5a and 5b are formed by screen-printing a metal material on the electrical insulating film 6. However, as with the internal wirings 3a and 3b, the external electrodes 5a and 5b are formed on the electrical insulating film 6 by applying a nano metal by inkjet. It may be.

  Note that any one of the through electrodes 4 a and 4 b can be integrally formed with the base 1. In this case, the base 1 has polarity, but the internal wiring, the through hole, the through electrode, the external electrode, and the electrical insulating film 6 are only used as one electrode (the electrode on the opposite side of the side where the base 1 is also used). Therefore, the electrical insulating film 6 and the electrical wiring can be easily formed at low cost.

  As shown in FIG. 1, the base 1 has a fitting convex portion 11 that functions as an annular first fitting portion on the entire open end portion (on the side opposite to the bottom surface portion 1 t) of the side surface portion 1 s that forms the housing concave portion. Is formed. That is, in the side surface portion 1 s, the fitting convex portion 11 is formed by the open end portion being bent in an L-shaped cross section in the center direction of the housing concave portion.

On the other hand, the lid body 2 is formed to have an outer dimension in a plan view of the electronic component device, and a fitting recess 21 that fits over the entire circumference with the fitting protrusion 11 of the base 1 is annular on the outer periphery thereof. Is formed.
The material thickness of the lid body 2 is preferably 0.05 mm to 0.2 mm, more preferably 0.05 mm to 0.1 mm, similarly to the bottom surface portion 1 t of the base 1.
The lid body 2 of the present embodiment is made of metal like the base portion 1, but it is sufficient that at least the joint portion of the fitting recess 21 with the fitting projection 11 is made of metal.

The lid body 2 is formed in a flat plate at the center, and a cross-sectional L-shaped portion is formed inward from a position at a predetermined distance from the outer peripheral edge, and the cross-sectional L-shaped portion and the outer peripheral edge A fitting recess 21 is formed. The fitting recess 21 functions as a second fitting portion.
The fitting concave portion 21 of the lid 2 and the fitting convex portion 11 of the base portion 1 are formed by a metal material pressing process or a drawing process such as a spatula drawing process.

FIG. 3 shows details of the fitting recess 21 in the lid 2.
As shown in FIGS. 3A to 3C, a part of the L-shaped section of the lid body 2 is doubled by the processing method, so that the double part is thicker than the other parts. However, the thickness of the double portion is adjusted so that the thickness is as close as possible.

The lid 2 formed in this way is fitted to the base 1 containing the crystal resonator 8 inside in an inert gas or vacuum environment.
That is, the fitting concave portion 21 of the lid body 2 and the fitting convex portion 11 of the base portion 1 are arranged in the thickness direction in the same manner as when a spring of a so-called jumper hook (jumper dot button) and a genko (dowel) are fitted. After being fitted using plastic deformation of the fitting concave portion 21 and the fitting convex portion 11 by applying pressure to the fitting, the metal is sealed with the sealing material 9.

The metal sealing is performed as follows, for example.
That is, the Ni layer is plated on the surface of the base 1, and further, a plated layer of Ag, Pd, Au, Al, or the like is formed as a brazing material. The surface of the lid 2 is Ni as a brazing material. , Au, Ag, Pd, Al, etc. are formed on the plating layer.
The plating layer may be formed on the entire surface, but since it functions as the sealing material 9 (brazing material) in seam welding, it is formed on the surfaces of the fitting convex portion 11 and the fitting concave portion 21 that face each other. It only has to be.

Then, in a state where the fitting convex portion 11 of the base portion 1 and the fitting concave portion 21 of the lid body 2 are in contact with each other by fitting, an electrode is applied to two points of the lid body 2 to cause a pulse current to flow. 11 and seam welding are continuously performed using Joule heat generated at the joint between the fitting recess 21 and the fitting recess 21. By this seam welding, the plating layer formed on the fitting convex portion 11 and the fitting concave portion 21 is welded, and the base portion 1 and the lid body 2 are hermetically sealed as the sealing material 9.
In addition, joining of the fitting convex part 11 and the fitting recessed part 21 can also use metal joining other than seam welding, for example, brazing, diffusion joining, other welding, dissimilar metal joining, etc.

Next, the material of the base 1 and the lid 2 will be described.
The coefficient of thermal expansion of the base 1 and the through electrodes 4a and 4b is preferably in the range of 0.05 × 10 −4 / deg to 0.20 × 10 −4 / deg.
The coefficient of thermal expansion of the base 1 is preferably a value similar to or greater than the coefficient of thermal expansion of the electrical insulating film 6.
When the coefficient of thermal expansion is a similar value, the members can be brought into thermal contact with each other without being damaged.
On the other hand, when the thermal expansion coefficient of the base 1 is large, if the difference between these thermal expansion coefficients is 0.01 × 10 −4 / deg or less, the difference in thermal expansion coefficient can be obtained by increasing the contact area as much as possible. The base portion 1 is moderately contracted in the inner direction of the through hole due to the effect of the difference in thermal expansion coefficient while avoiding the damage due to the thermal expansion coefficient. The electrical insulating film 6 in the through hole can be brought into close contact. Thus, an electronic component device with a simplified work process and good productivity can be obtained.

  Moreover, it is preferable that the base material of the base 1 has a strong strength, whereby a thin package can be formed with high reliability. Examples of a preferable base material for the metal package include kovar and iron. Kovar is an Fe—Ni—Co alloy and has a thermal expansion coefficient close to that of the low-melting glass used for the electrical insulating film 6, so that it can be hermetically sealed.

On the other hand, it is preferable that the base material of the lid body 2 is similar in thermal expansion coefficient to the base 1 main body. Moreover, it is preferable that the surface of the material of the cover body 2 has a plating layer of Ni, Au or the like as a protective film for the base material.
Further, an opening is formed in the center of the lid body 2 and a tablet-like glass is disposed, and the transparent glass (not shown) and the lid body 2 are sealed in an airtight insulating manner by passing through the furnace. it can.
The glass shape (lens shape may be sufficient) of the center part of the lid body 2 is not particularly limited as long as it has a smooth flat surface that can be in close contact with the base 1 and the base 1 can be hermetically sealed. What has the glass shape of the center part of the lid | cover 2 main body as mentioned above can be used as an electronic component apparatus for light emission and a light receiving sensor.

FIG. 4 shows a cross-sectional perspective state in two intersecting directions with respect to the deformation state of the fitting portion with respect to the pressure in the thickness direction of the electronic component device in the present embodiment. In FIG. 4, the display of the electronic component elements housed in the housing recess is omitted.
FIG. 4A shows a state before pressurizing the electronic component device.
On the other hand, FIG. 4B shows a state (simulation result) in which pressure is applied to the center point 100 of the electronic component device from the vertical direction (thickness direction).
According to the electronic component device of the present embodiment, the base 1 and the lid body 2 are joined on the four surfaces by fitting the fitting convex portion 11 and the fitting concave portion 21, so that stress is generated in the fitting portion. This suppresses the peeling of the joint surface and enables a highly airtight seal.
Specifically, as shown in FIG. 4B, the peeling on the inner side of the housing recess is observed in the region contacting on the four surfaces, but the peeling on the outer peripheral side of the electronic component device does not occur.
This is because four joint surfaces orthogonal to each other are less affected by the pressure in the thickness direction applied, and are less affected by pressure at different positions and directions, and the bonding area is reduced. This is considered to be secured widely by fitting.

  Moreover, in this embodiment, by plating the outermost surfaces of the fitting convex portion 11 of the base portion 1 and the fitting concave portion 21 of the lid body 2, the plating layer becomes a welding brazing material (sealing material 9), and crystal It is possible to improve the adhesion between the vibrator 8, the conductive adhesive 7, the lid 2, and the base 1 main body.

Further, in the electronic component device of the present embodiment, since the base 1 and the lid 2 are made of metal, sufficient strength against pressure can be obtained even with a thickness of 0.2 mm or less.
Further, by configuring the electronic component device with a thin metal, it is possible to increase the volume in the housing recess, and it is possible to reduce the size of the same internal volume.

  In the present embodiment, as shown in FIG. 4B, the fitting structure of the fitting convex portion 11 and the fitting concave portion 21 enables high-density sealing, so that a material other than metal, for example, The base 1 and the lid 2 are made of carbon fiber composite material, ceramic fiber composite material, silica fiber composite material, glass fiber composite material, alumina fiber composite material, special acrylic fiber composite material, metal fiber composite material, etc. May be.

Next, a method for manufacturing the electronic component device in the present embodiment will be described.
The processing method of the base 1 is constituted by, for example, drawing a metal flat plate. In the present embodiment, the recess is formed by continuously drawing with a press from the main surface direction of the long (lead frame) metal flat plate to flow the metal in the back surface direction. By configuring the metal flowing in the back direction to be a part of the recess bottom surface portion 1t, the area of the mounting surface can be increased, and the material thickness of the side surface portion 1s on the bottom surface portion 1t side can be accurately set. It can be adjusted to the target value. Simultaneously with the formation of the housing recess, through holes for the through electrodes 4a and 4b are formed at two predetermined positions on the bottom surface portion 1t.
Then, the fitting convex part 11 is formed by bending the edge part of the open side (opposite side of the bottom face part 1t) of the side part 1s which comprises the formed accommodation recessed part inside.

Next, an electrical insulating film 6 is applied to a predetermined region of the base portion 1 (inside the bottom surface portion 1t, the inner peripheral surface of the through hole, and outside the bottom surface portion) by inkjet, and then a nano metal paste is applied to the electrical insulating film 6 with a predetermined amount. The internal wirings 3a and 3b are formed by applying an ink jet to the position and baking.
In addition, after the through electrodes 4a and 4b are formed in the through holes, the external electrodes 5a and 5b are formed.

On the other hand, similarly, the lid 2 is continuously drawn with a press from the main surface direction of a long (lead frame shape) metal flat plate, and the outer peripheral edge thereof is fitted as shown in FIGS. 3 (a) to 3 (c). A concavity 21 is formed.
Next, a plating layer serving as a sealing material 9 (brazing material) is applied to predetermined regions of the base 1 and the lid 2.

Thereafter, a conductive adhesive 7 is applied onto the internal wirings 3a and 3b of the base 1 with a dispenser, and the crystal resonator 8 is placed at a predetermined position and cured.
Thereafter, the long (lead frame shape) lid 2 and the long (lead frame shape) base 1 on which the crystal resonator 8 is mounted are sequentially fitted in an inert gas or vacuum environment, and the fitting portion Is hermetically sealed by seam welding to complete the electronic component device.

Next, the 1st modification regarding the fitting structure part of the base 1 and the cover body 2 is demonstrated.
FIG. 5 illustrates a side cross section of an electronic component device according to a first modification. In addition, the same code | symbol is attached | subjected about the part similar to embodiment of FIG. 1, and the description is abbreviate | omitted suitably.
In the described embodiment, the fitting convex portion 11 of the base portion 1 is protruded inward (accommodating concave portion side), while the opening portion of the fitting concave portion 22 of the lid 2 is formed to face outward.
On the other hand, in this 1st modification, as shown in FIG. 5, the fitting convex part 12 of the base 1 forms the open end part of the side part 1s in the shape of a flange over the perimeter.
On the other hand, the fitting recess 22 of the lid 2 is formed so that the opening of the recess faces inward. Specifically, as shown in FIG. 5, the L-shaped section is formed so that the L-shaped section faces downward on the outer peripheral end of the lid body 2 and the L-shaped bending faces inward.

As described above, in the first modification, the base 1 and the lid 2 are fitted by the fitting convex portion 12 and the fitting concave portion 22 and the four surfaces of the fitting portion are metal-bonded, as in the embodiment. It is possible to ensure high airtightness.
Further, in the embodiment, the fitting structure portion is formed in the housing recess, whereas in the first modification, as shown in FIG. 5, the fitting structure portion is formed outside the housing recess. A large internal space volume can be secured.
Further, unlike the embodiment, the fitting recess 22 can be formed without overlapping metal plates, so that a more uniform thickness can be secured and the forming process can be simplified.

FIG. 6 shows a side cross section of an electronic component device according to another modification.
In FIG. 6, only the cross section of the fitting structure portion is shown, but the other portions are the same as in the embodiment.
In the described embodiment and the first modification, the fitting convex portions 11 and 12 are formed as the first fitting portion of the base portion 1, and the fitting concave portions 21 and 22 are formed as the second fitting portion of the lid body 2. Explained the case.
On the other hand, in the 2nd-4th modification, the fitting recessed parts 13-15 are formed as a 1st fitting part of a base, and the fitting convex parts 23-25 are formed as a 2nd fitting part of the cover body 2. As shown in FIG. To do.

In the second modification and the third modification shown in FIGS. 6A and 6B, the fitting structure is formed in the housing recess, as in the embodiment.
In the 2nd modification of Fig.6 (a), the fitting convex part 23 which consists of an L-shaped cross section is formed in the outer peripheral end of the cover body 2 by making it bend | fold inside the accommodation recessed part over the perimeter. Yes.
On the other hand, the base 1 is formed with a fitting recess 13 that opens in the thickness direction on the open end side of the side surface 1s. The height of the side wall forming the concave portion of the fitting concave portion 13 is formed such that the outer side is higher than the inner side by the thickness of the fitting convex portion 23.
Also in this modification, a highly airtight seal is possible by adopting a fitting structure that joins in four planes orthogonal to each other.

In the third modified example of FIG. 6B, the fitting convex portion 24 is formed in the inner side of the housing concave portion on the center side by the thickness of the fitting concave portion 14 from the outer peripheral end of the lid body 2.
On the other hand, the base 1 is formed with a fitting recess 14 that opens in the thickness direction on the open end side of the side surface 1s. In the third modification, the side walls that form the recesses of the fitting recesses 14 are formed at the same height.
In the third modified example, since the fitting structure is joined at five planes orthogonal to each other, higher airtightness can be obtained.

On the other hand, the 4th modification shown in Drawing 6 (c) forms a fitting structure part on the outside of an accommodation crevice like the 1st modification.
As shown in FIG. 6 (c), the fitting convex portion 25 having an L-shaped cross section is formed by bending the outer periphery of the lid body 2 once over the entire circumference to the outside of the accommodating concave portion. Yes.
The base portion 1 is formed by bending a fitting recess 15 that opens in the thickness direction toward the bottom surface portion 1t on the open end side of the side surface portion 1s, and is bent inward twice.
Also in this modification, a highly airtight seal is possible by adopting a fitting structure that joins in four planes orthogonal to each other.

In the embodiment and the modification described above, the case has been described in which the housing recess is formed in the base 1 and an electronic component element such as a crystal resonator is disposed on the bottom surface 1t and the electrical wiring is formed in the base 1.
On the other hand, an electronic component element is arranged at the center of the base 1 formed in a flat plate shape, and an electrical insulating film 6 and an electrical system (conductive adhesive, internal wiring, through electrode, external electrode) are formed, and the lid 2 A housing recess may be formed on the base 1 and the housing recess may be covered with the base 1 for sealing.
Also in this case, the base 1 is formed by forming the first fitting portion on the outer peripheral end of the base 1 and forming the second fitting on the open end of the side surface of the housing recess of the lid 2. And the lid 2 are fitted. Moreover, the fitting surface joined by 4 surfaces is metal-joined with a sealing material similarly to embodiment.
About the concrete fitting structure of a fitting recessed part and a fitting convex part, it can comprise similarly to embodiment described and the 1st-4th modification.
That is, in the drawings of the embodiment and the modified examples described above, the electronic component element 8, the electrical insulating film 6, the conductive adhesives 7a and 7b, and the internal wirings 3a and 3b disposed upside down on the bottom surface portion 1t of the housing recess. The through electrodes 4a and 4b and the external electrodes 5a and 5b are formed in the base (the lid 2 in the drawing).

DESCRIPTION OF SYMBOLS 1 Base part 11-15 Fitting convex part 2 Lid | cover body 21-25 Fitting recessed part 3a, 3b Internal wiring 4a, 4b Through-electrode 5a, 5b External electrode 6 Electrical insulation film 7a, 7b Conductive adhesive material 8 Crystal oscillator 9 Sealing Stop material

Claims (7)

An electronic component element;
A base portion in which a housing recess for housing the electronic component element is formed, and an annular first fitting portion is formed at a release side end portion of a side wall of the housing recess,
A lid that hermetically seals the housing recess, in which a second fitting portion that fits over the entire circumference of the first fitting portion is formed;
An external electrode disposed outside the housing recess;
Wiring for electrically connecting the electronic component element and the external electrode;
An electronic component device comprising:
The first fitting portion and the second fitting portion are formed with a fitting concave portion on one side and a fitting convex portion on the other side,
An electronic component device characterized by that. The fitting concave portion and the fitting convex portion are formed with a concave portion and a convex portion in a horizontal direction or a vertical direction with respect to the inner bottom surface of the accommodating concave portion,
The electronic component device according to claim 1. The fitting protrusion is formed with a protrusion in a direction orthogonal to the surface on which the fitting protrusion is formed.
The electronic component device according to claim 2. The base and the lid are made of metal,
The external electrode and the wiring are disposed via an insulating material,
The electronic component device according to claim 1, claim 2, or claim 3. The base and the lid have a thickness of 0.05 mm to 0.2 mm.
The electronic component device according to claim 4. The base and the lid have a thickness of 0.05 mm to 0.1 mm.
The electronic component device according to claim 4. The first fitting portion and the second fitting portion are metal bonded to the entire portion facing each other by fitting.
The electronic component device according to claim 4, claim 5, or claim 6.

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