JP2016039234A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of achieving size reduction, pressure loss reduction, and improvement in degree of freedom of internal layout, improvement in degree of freedom of mountability, and suppression of a counter flow.SOLUTION: An electronic apparatus 1 is mounted with an electronic component 7 and comprises a cooling air duct 11, and the electronic component is fitted on one surface side of a base wall 2b. The cooling air duct is formed on the other surface side of the base wall, provided with a fan 6, and bent backward at the fan, and also includes a suction-side air duct 11a and an exhaustion-side air duct 11c separated by a partition plate 8. A suction-side header 11b right before a fan suction port 6a of the suction-side air duct and an exhaustion-side header 11d right behind a fan exhaustion port 6b of the exhaustion-side air duct 11b are shifted in an air duct height direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device.

  As a conventional cooling structure, there is a structure disclosed in Patent Document 1. In this structure, a heat generating component such as an electronic component, a housing having a cooling air passage for mounting the heat generating component, a fan, a heat radiating block having a plurality of fins, a cover covering the heat radiating block, and a heat generating portion are provided. It has been. The heat dissipating block is provided with a fan in a plane in the middle of the air path, and the air path has a partition separating the inlet side and the outlet side, thereby forming a U-shaped air path.

  Patent Document 2 discloses a fan, a motor for driving the fan, a bottom plate on which a plurality of protrusions and a support protrusion outside the fan are installed, a partition plate having a hole slightly larger than the diameter of the fan, a lid, A structure with is disclosed. In such a structure, air is sucked from the four directions by the fan, flows from the inflow path to the outflow path through a slightly larger hole than the fan provided in the partition plate, and is exhausted in the four directions.

  Further, in Patent Document 3, a contact portion that is in thermal contact is provided between a heat generating component mounted on a substrate and a heat spreader disposed on the upper portion of the substrate, and the heat spreader has a downward shielding wall and a cooling fin. A structure in which is provided integrally is disclosed. The heat spreader is provided with an air inlet, and a fan is installed above it. A ventilation path is formed between the upper surface of the substrate and the lower surface of the heat spreader, and cooling air is blown by a fan. Moreover, in this structure, it is a linear air path structure from intake to exhaust.

Japanese Patent No. 3142114 Japanese Patent No. 3225342 Japanese Patent No. 4735528

  In the configuration of Patent Document 1, a fan is attached in a planar arrangement in the middle of a U-shaped air passage. In this configuration, the fan intake side (airway inlet side) and the fan exhaust side (airway outlet side) are not closed by the fan, fan case, and airway, so the fan exhaust side airway to the fan intake side Backflow to the wind path can be considered.

  In the configuration as in Patent Document 2, air flows from the inflow path to the outflow path only through a hole provided in the partition plate, which is slightly larger than the diameter of the fan. Also, no air flows on the projection surface of the fan drive motor. Therefore, the pressure loss of the air passage is high.

  Further, in the configuration as disclosed in Patent Document 3, air flows on the component mounting surface, but since the air path is configured linearly, the entire apparatus becomes longer, resulting in an increase in size, deterioration in in-vehicle performance, and internal component layout. Cause an increase in constraints. Further, if the air passage is bent halfway to avoid long sides, pressure loss increases. As another form, even when a cooler such as a heat sink is configured on the back side of the board, that is, on the opposite side of the component mounting surface, and a structure is used to flow air there, the longer side is similarly caused, If the air path is bent to avoid longer sides, pressure loss will increase.

  The present invention has been made in order to solve the above-described problems, and is an electronic device having a cooling air passage on which electronic components are mounted and a fan is provided. It is an object of the present invention to provide an electronic device capable of improving the degree of freedom of internal layout, improving the degree of freedom of mounting, and suppressing backflow.

  In order to achieve the above-described object, the present invention is an electronic device including an electronic component, a cooler, and a cooling air passage, and the electronic component is attached to one surface side of a base wall of the cooler. The cooling air passage is formed on the other surface side of the base wall, a fan is provided in the cooling air passage, and the cooling air passage is bent so as to be folded back in the fan. The cooling air path includes an intake side air path and an exhaust side air path separated by a partition plate, an intake side header immediately before a fan air inlet of the intake side air path, and the exhaust side wind path The exhaust side header immediately after the fan exhaust port of the road is shifted in the air path height direction.

  According to the present invention, in an electronic device having a cooling air passage mounted with electronic components and provided with a fan, downsizing, low-pressure loss, improvement in internal layout freedom, improvement in freedom of mounting, and suppression of backflow Can be realized.

It is a perspective view which shows the electronic device of Embodiment 1 and Embodiment 2 of this invention. It is a top view of the electronic device of FIG. It is sectional drawing by the AA line of FIG. It is a top view which shows the electronic device of Embodiment 3 of this invention. It is a figure of the same aspect as FIG. 2 regarding the modified form of this invention. It is a figure which shows an L-shaped cooling air path as another modification of this invention. It is a figure which shows a cross-shaped cooling air path as another modification of this invention. It is a figure which shows an offset type fin shape as another modification of this invention. It is a figure which shows a pin-shaped fin shape as another modification of this invention. It is a figure which shows a corrugated fin shape as another modification of this invention.

  Embodiments of an electronic device according to the present invention will be described below with reference to the accompanying drawings. A plurality of embodiments shown below relate to an air passage structure of a cooler and an attachment structure of a fan in an in-vehicle electronic device having a cooling air passage and mounting an electronic component. In the drawings, the same reference numerals indicate the same or corresponding parts.

Embodiment 1 FIG.
1 is a perspective view showing an electronic apparatus according to the first embodiment, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a cross-sectional view taken along line AA in FIG.

  The electronic device 1 includes an electronic component, a cooler, and a cooling air passage. The electronic component is attached to one surface side of the base wall, and the cooling air passage is disposed on the other surface side of the base wall. Is formed. As a specific configuration, the electronic device 1 includes a housing 3 including a cooler 2, a lid 4, and a cover 5, an electronic component 7 housed in the housing 3, and a substrate 7 a.

  In the first embodiment, the electronic component 7 is connected to the cooler 2 having the cooling air passage 11 formed by closing one side with the lid 4 on the side different from the lid 4 of the cooler 2 directly or via the substrate 7a. It is attached to the surface. A cover 5 is attached to the side of the cooler 2 on which the electronic component 7 and the substrate 7 a are attached. The electronic component 7 and the substrate 7 a are accommodated by being surrounded by the cover 5 and the cooler 2. In other words, the electronic component 7 is attached to one surface side in the front and back direction of the base wall 2b of the cooler 2, and the cooling air passage 11 is formed on the other surface side.

  A fan 6 is attached to the cooling air passage 11 in the middle, and the cooling air passage 11 is separated into an intake air passage 11a and an exhaust air passage 11c by the fan 6 attached in the middle.

  Further, the cooling air passage 11 is bent so as to be folded back at the fan 6. The air inlet 6a of the fan 6 is provided with the side where the electronic component 7 is attached, that is, toward the cover 5 side.

  The heat generated by the electronic component 7 is transferred to the structural portion of the substrate 7 a and the cooler 2 by heat conduction, and further transferred to the cooling air passage 11. Heat generated by the electronic component 7 is cooled in the cooling air passage 11 by forced convection by the air blown by the fan 6. Further, a part of the heat generated by the electronic component 7 is transferred to the side wall 2a of the cooler 2 by heat conduction through the structural portion of the substrate 7a and the cooler 2, and is also cooled by convection and radiation from the side wall 2a.

  The intake side air passage 11a and the exhaust side air passage 11c in the cooling air passage 11 are arranged in a plane. The intake-side header 11b immediately before the fan intake port 6a of the intake-side air passage 11a and the exhaust-side header 11d immediately after the fan exhaust port 6b of the exhaust-side air passage 11c are in the direction of the air passage height (see FIG. 2). The front and back directions of the paper surface, the vertical direction of the paper surface of FIG. At this time, the intake-side header 11b and the exhaust-side header 11d are, for example, arranged so that the exhaust-side header 11d does not overlap with the upper side of the intake-side header 11b in the air path height direction, or part or all of them overlap. Can take various arrangements.

  The cooling air passage 11 has a partition plate 8 that separates the intake side air passage 11a and the exhaust side air passage 11c, and the intake side air passage 11a and the exhaust side air passage 11c are separated by the fan 6 and the partition plate 8. Has been. A part of the partition plate 8 is in contact with the case of the fan 6.

  The cooling air passage 11 is defined by the base wall 2 b and the side wall 2 a of the cooler 2, the lid 4, the partition plate 8, and the case of the fan 6.

  The fan 6 is located between the lid 4 and the base wall 2b of the cooler 2, and the fan intake port 6a is opened toward the base wall 2b as shown in FIG. An interval (height Ht between the fan inlet 6 a and the cooler 2) is opened between the fan 6 and the cooler 2. That is, the fan intake port 6a is separated from the base wall 2b. In addition, in order to prevent the volume expansion due to the increase in the height of the electronic device 1 as a whole, the height Ht between the fan inlet 6a of the fan 6 and the cooler 2 should be low, and is preferably 20 mm or less. is there.

  According to the electronic device of the first embodiment configured as described above, the cooling air passage 11 bends in the middle, so that the entire electronic device 1 can be prevented from being long and downsized. Further, by bending the fan 6 as a starting point, in other words, by providing the fan 6 at the bent portion of the air passage, an increase in pressure loss due to the bending of the cooling air passage 11 that normally occurs can be eliminated. Since the flow of the cooling air 21 can be bent depending on the direction of the exhaust port 6b, low pressure loss can be achieved. Further, by separating the intake-side air passage 11a and the exhaust-side air passage 11c by the fan 6 and the partition plate 8, backflow between the intake-side air passage 11a and the exhaust-side air passage 11c can be prevented. Further, by mounting the fan 6 so that there is a gap between the fan 6 and the cooler 2, the surface on which the fan 6 is projected in the cooler 2 also becomes a cooling surface. The area that can be increased. Therefore, coupled with the fact that the overall length of the electronic device 1 can be prevented and the size can be reduced as described above, the effect of improving the degree of freedom of the internal layout and the degree of freedom of mounting is obtained.

  In addition, when the fan is mounted so as to be close to the surface on which the electronic component is mounted, the fan becomes hot and the life of the fan is shortened. In Embodiment 1, there is a gap between the fan 6 and the cooler 2. By attaching the fan 6 in this manner, the surface of the cooler 2 on which the fan 6 is projected also becomes a cooling surface, so that the life of the fan 6 can be extended. Although the electronic component 7 and the substrate 7a are housed by being surrounded by the cover 5 and the cooler 2, a sealing material such as an O-ring is used between the cover 5 and the cooler 2 (not shown). In addition, a waterproof structure can be taken for the electronic component 7 and the substrate 7a.

Embodiment 2. FIG.
Next, a second embodiment of the present invention will be described. Since the second embodiment is a mode in which conditions are further added to the first embodiment with respect to the cooling air passage, the description will be given based on FIGS. 1 to 3. In addition, the second embodiment is assumed to be the same as the first embodiment except for the parts described below.

  In the second embodiment, in the cooling air passage 11, the width Wi of the intake air passage 11 a that is the inlet side of the cooling air passage 11 relative to the fan 6 is the exhaust side that is the outlet side of the cooling air passage 11 relative to the fan 6. The air passage 11c is configured to be larger than the width Wo.

  In general, on the intake side and exhaust side of the fan, there is no uneven flow on the intake side, and a uniform flow flows, and on the exhaust side, it is affected by the shape of the fan blades and the shape of the fan casing, etc. Or a flow rate distribution at the exhaust port of the fan. Due to this drift, there is a possibility that a hot spot or the like in which the temperature locally rises on the cooling surface of the electronic component. However, according to the structure as in the second embodiment, the drift Wi can be suppressed by making the width Wi of the intake side air passage 11a of the fan 6 larger than the width Wo of the exhaust side air passage 11c of the fan 6. In addition, since the cooling surface on the suction side where uneven flow hardly occurs can be increased, the occurrence of hot spots can be suppressed.

Embodiment 3 FIG.
Next, a second embodiment of the present invention will be described. FIG. 4 is a plan view showing the electronic apparatus according to the third embodiment. In the third embodiment, only the configuration of the cooling air passage 11 is different from the first and second embodiments. Therefore, only different portions will be described, and description of the other portions will be omitted.

  In the third embodiment, fins 9 are provided in the intake-side air passage 11a and the exhaust-side air passage 11c. The fin 9 is provided on the other surface of the base wall 2b of the cooler 2 to which the electronic component 7 is attached on one surface. More specifically, the fin 9 is an electron in projection plane at least from the height direction on the surface opposite to the side where the electronic component 7 is provided for each of the intake side air passage 11a and the exhaust side air passage 11c. It is provided in a region overlapping with the component 7.

  According to such a structure, since the heat radiation area is expanded by the fins 9 and the flow velocity can be increased between the fins 9 compared to the case where the fins 9 are not installed, the fins 9 are not installed. Compared to the case, the electronic component 7 can be cooled more efficiently.

  Although the contents of the present invention have been specifically described with reference to the preferred embodiments, various modifications can be made by those skilled in the art based on the basic technical idea and teachings of the present invention. It is self-explanatory.

  For example, as shown in FIG. 5, the extent to which the width Wi of the intake side air passage 11a of the fan 6 is made larger than the width Wo of the exhaust side air passage 11c of the fan 6 is larger than the aspect shown in FIG. It is also possible to carry out.

  Moreover, in FIGS. 1-3, although the U shape was mentioned as an example as a shape of the cooling air path 11, the shape of the cooling air path 11 is not limited to it. Therefore, the shape of the cooling air passage 11 may be, for example, an L shape as shown in FIG. 6 or a cross shape as shown in FIG.

  In order to reduce the expansion of the cooling area and the pressure loss, it is desirable for the cooling air passage 11 to increase the width of the air passage and the height of the air passage as much as possible. Normally, the air passage inlet 11e and the air passage outlet 11f of the cooling air passage 11 are provided on the side wall 2a of the cooler 2 as illustrated in FIGS. 1 to 3, but the air passage inlet 11e or the air passage outlet is provided. Part or all of 11 f may be provided on the lid 4 or the cover 5.

  Further, the fin shape is not limited to the straight type shown in FIG. Accordingly, the fin shape may be, for example, an offset type, a pin type, or a wave type as shown in FIGS. Further, the fin 9 may be attached to the intake-side header 11b or the exhaust-side header 11d as long as the heat dissipation performance and the pressure loss specifications are compatible.

  The partition plate 8 may be formed integrally with the cooler 2 or may be provided with a separate part, and the thickness of the plate may not be uniform.

  The electronic component 7 is not only directly attached to the cooler 2 but also various structures such as a structure attached via an inclusion such as a sheet, grease, or an insulating material, a structure mounted on the substrate 7a, and the substrate 7a attached to the cooler 2. The mounting structure can be taken.

  DESCRIPTION OF SYMBOLS 1 Electronic device, 2 Cooler, 2b Base wall, 6 Fan, 6a Fan inlet, 6b Fan exhaust, 7 Electronic components, 8 Partition plate, 9 Fin, 11 Cooling air path, 11a Intake side air path, 11b Inlet side Header, 11c Exhaust side air passage, 11d Exhaust side header.

Claims (4)

An electronic device including an electronic component, a cooler, and a cooling air passage,
The electronic component is attached to one side of the base wall of the cooler,
The cooling air passage is formed on the other surface side of the base wall,
The cooling air passage is provided with a fan,
The cooling air passage is bent so as to be folded back in the fan,
The cooling air passage includes an intake side air passage and an exhaust side air passage separated by a partition plate,
The intake-side header immediately before the fan intake port of the intake-side air passage and the exhaust-side header immediately after the fan exhaust port of the exhaust-side air passage are shifted in the air passage height direction.
Electronics. The fan intake port is opened toward the base wall side, and the fan intake port is separated from the base wall.
The electronic device according to claim 1. The width Wi of the intake side air passage is larger than the width Wo of the exhaust side air passage.
The electronic device according to claim 1 or 2. The cooling air passage is provided with fins,
The electronic device according to claim 1.

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