JP2016029748A5 - - Google Patents

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Publication number
JP2016029748A5
JP2016029748A5 JP2015235803A JP2015235803A JP2016029748A5 JP 2016029748 A5 JP2016029748 A5 JP 2016029748A5 JP 2015235803 A JP2015235803 A JP 2015235803A JP 2015235803 A JP2015235803 A JP 2015235803A JP 2016029748 A5 JP2016029748 A5 JP 2016029748A5
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JP
Japan
Prior art keywords
shield
insulating layer
shield film
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015235803A
Other languages
English (en)
Japanese (ja)
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JP2016029748A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015235803A priority Critical patent/JP2016029748A/ja
Priority claimed from JP2015235803A external-priority patent/JP2016029748A/ja
Publication of JP2016029748A publication Critical patent/JP2016029748A/ja
Publication of JP2016029748A5 publication Critical patent/JP2016029748A5/ja
Pending legal-status Critical Current

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JP2015235803A 2015-12-02 2015-12-02 シールドプリント配線板の製造方法 Pending JP2016029748A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015235803A JP2016029748A (ja) 2015-12-02 2015-12-02 シールドプリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015235803A JP2016029748A (ja) 2015-12-02 2015-12-02 シールドプリント配線板の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012278551A Division JP2014123630A (ja) 2012-12-20 2012-12-20 シールドプリント配線板の製造方法、シールドフィルム、及び、シールドプリント配線板

Publications (2)

Publication Number Publication Date
JP2016029748A JP2016029748A (ja) 2016-03-03
JP2016029748A5 true JP2016029748A5 (enrdf_load_stackoverflow) 2016-11-10

Family

ID=55435491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015235803A Pending JP2016029748A (ja) 2015-12-02 2015-12-02 シールドプリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JP2016029748A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7228330B2 (ja) * 2017-02-10 2023-02-24 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
KR102467723B1 (ko) * 2017-02-13 2022-11-16 타츠타 전선 주식회사 그라운드 부재, 차폐 프린트 배선판 및 차폐 프린트 배선판의 제조 방법
WO2018147423A1 (ja) * 2017-02-13 2018-08-16 タツタ電線株式会社 グランド部材、シールドプリント配線板及びシールドプリント配線板の製造方法
WO2018147426A1 (ja) * 2017-02-13 2018-08-16 タツタ電線株式会社 シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法
CN115243477B (zh) * 2022-07-27 2024-07-26 北京八度阳光科技有限公司 一种基于分层叠加生产电子线路板的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3498386B2 (ja) * 1994-10-19 2004-02-16 住友電気工業株式会社 シールド付きフレキシブル配線板及びその製造方法
JP2005056906A (ja) * 2003-08-05 2005-03-03 Reiko Co Ltd 電磁波遮蔽性転写フイルム
JP4914262B2 (ja) * 2006-03-29 2012-04-11 タツタ電線株式会社 シールドフィルム及びシールドプリント配線板
JP2011171523A (ja) * 2010-02-19 2011-09-01 Toyo Ink Sc Holdings Co Ltd 硬化性電磁波シールド性接着性フィルムおよびその製造方法

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