JP2016029671A - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
JP2016029671A
JP2016029671A JP2015235277A JP2015235277A JP2016029671A JP 2016029671 A JP2016029671 A JP 2016029671A JP 2015235277 A JP2015235277 A JP 2015235277A JP 2015235277 A JP2015235277 A JP 2015235277A JP 2016029671 A JP2016029671 A JP 2016029671A
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housing
substrate
power supply
supply device
decorative frame
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JP2015235277A
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JP6137576B2 (en
Inventor
一斎 樋口
Kazunari Higuchi
一斎 樋口
祐輔 一条
Yusuke Ichijo
祐輔 一条
海老原 徹
Toru Ebihara
徹 海老原
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Abstract

PROBLEM TO BE SOLVED: To store a power supply device in a housing body and prevent the power supply device from being heated to high temperature.SOLUTION: A lighting device according to one embodiment includes: a substrate; a housing; and a power supply device. In the substrate, light emitting elements are mounted on one surface. The housing includes: an installation surface on which the other surface of the substrate is installed; and a storage part which is formed so that its longitudinal direction is arranged substantially parallel to the installation surface and at least part thereof is formed at a position that does not overlap with the substrate. The power supply device is disposed in the storage part of the housing and supplies electric power to the substrate installed on the installation surface of the housing.SELECTED DRAWING: Figure 3

Description

本発明の実施形態は、照明装置に関する。   Embodiments described herein relate generally to a lighting device.

従来、LED(Light Emitting Diode)等の半導体発光素子を光源とする照明器具として、天井等に埋め込み設置されるダウンライトが用いられている。このような照明器具は、筺体本体にLEDが実装された光源基板を具備し、LEDへの点灯電流を制御する電源装置が取り付けられる。また、近年では、筺体本体に電源装置が収納される照明器具も知られている。例えば、筺体本体の底壁の下面に光源基板が設置され、かかる底壁の上面に形成された収納部に電源装置を収納する照明器具が知られている。   2. Description of the Related Art Conventionally, downlights embedded in a ceiling or the like have been used as lighting fixtures that use semiconductor light emitting elements such as LEDs (Light Emitting Diodes) as light sources. Such a lighting fixture includes a light source board on which an LED is mounted on a housing body, and a power supply device that controls a lighting current to the LED is attached. In recent years, lighting fixtures in which a power supply device is housed in a housing body are also known. For example, a lighting fixture is known in which a light source substrate is installed on the lower surface of the bottom wall of the housing body, and the power supply device is stored in a storage portion formed on the upper surface of the bottom wall.

しかし、上記の電源装置を収納する照明器具においては、光源基板の上部に収納部が位置するので、光源基板から発生する熱によって収納部内が高温化し、特に高温な空気ほど上昇するという性質から収納部の上部が高温化することが考えられる。このことは、収納部に収納される電源装置の性能劣化を招くとも考えられる。   However, in the lighting fixture that houses the power supply device described above, since the housing portion is located above the light source substrate, the housing portion is heated by the heat generated from the light source substrate, and is stored because of the property that the higher the temperature, the higher the air. It is conceivable that the upper part of the part is heated. This is considered to cause the performance deterioration of the power supply device stored in the storage unit.

特開2010−16003号公報JP 2010-16003 A 特開2011−187245号公報JP 2011-187245 A

本発明が解決しようとする課題は、筐体本体に電源装置を収納するとともに電源装置の高温化を防止することができる照明装置を提供することである。   The problem to be solved by the present invention is to provide an illuminating device that can accommodate a power supply device in a housing body and prevent the power supply device from becoming hot.

実施形態に係る照明装置は、一方の面に発光素子が実装された基板と、前記基板の他方の面が設置される設置面と、長手方向が前記設置面と略平行かつ少なくとも一部が当該基板と重ならない位置に形成される底壁を底面とし、前記底壁の周縁部から延伸した側壁を側面とする内部空間に該当する収容部を一体に形成された筺体と、前記筺体の収納部に配設され、前記設置面に設置された基板に電力を供給する電源装置と、前記収容部底壁の裏側には、筐体の外面から一定間隔で互いに平行に一体に突設され放熱フィンと、を有する。 The lighting device according to the embodiment includes a substrate having a light emitting element mounted on one surface, an installation surface on which the other surface of the substrate is installed, a longitudinal direction substantially parallel to the installation surface, and at least a part of the installation surface. A housing formed integrally with a housing portion corresponding to an internal space having a bottom wall formed at a position not overlapping the substrate as a bottom surface and a side wall extending from a peripheral edge of the bottom wall as a side surface, and a housing portion for the housing And a power supply device that supplies power to a substrate installed on the installation surface, and a heat dissipation projecting integrally on the back side of the bottom wall of the housing portion from the outer surface of the housing in parallel with each other at regular intervals And fins.

図1は、実施形態に係る照明装置の外観例を示す斜視図である。FIG. 1 is a perspective view illustrating an appearance example of a lighting apparatus according to the embodiment. 図2は、実施形態に係る照明装置の外観例を示す斜視図である。FIG. 2 is a perspective view illustrating an appearance example of the illumination device according to the embodiment. 図3は、実施形態に係る照明装置の分解例を示す斜視図である。FIG. 3 is a perspective view showing an exploded example of the lighting device according to the embodiment. 図4は、実施形態に係る照明装置の分解例を示す斜視図である。FIG. 4 is a perspective view showing an exploded example of the lighting device according to the embodiment. 図5は、実施形態に係る化粧枠の外観例を示す斜視図である。FIG. 5 is a perspective view showing an example of the appearance of a decorative frame according to the embodiment. 図6は、実施形態に係る化粧枠及び配光調整部材の外観例を示す斜視図である。FIG. 6 is a perspective view illustrating an appearance example of the decorative frame and the light distribution adjusting member according to the embodiment. 図7は、図1に示したI−I線における断面を模式的に示す図である。FIG. 7 is a diagram schematically showing a cross section taken along line II shown in FIG. 図8は、実施形態に係る押圧部によって押圧される基板を説明する説明図である。FIG. 8 is an explanatory diagram illustrating a substrate pressed by the pressing unit according to the embodiment. 図9は、実施形態に係る照明装置の組み立て例を説明する図である。FIG. 9 is a diagram illustrating an assembly example of the lighting device according to the embodiment. 図10は、実施形態に係る照明装置の組み立て例を説明する図である。FIG. 10 is a diagram illustrating an assembly example of the lighting device according to the embodiment. 図11は、実施形態に係る照明装置の組み立て例を説明する図である。FIG. 11 is a diagram illustrating an assembly example of the lighting device according to the embodiment. 図12は、実施形態に係る照明装置の組み立て例を説明する図である。FIG. 12 is a diagram illustrating an assembly example of the lighting device according to the embodiment.

以下で説明する実施形態では、照明装置1において、基板50は、一方の第1面51aに発光素子52が実装される。また、筺体10は、基板50の他方の第2面51bが設置される設置面13と、長手方向が設置面13と略平行かつ少なくとも一部が基板50と重ならない位置に形成される収納部14とを有する。また、電源装置40は、筺体10の収納部14に配設され、設置面13に設置された基板50に電力を供給する。   In the embodiment described below, in the lighting device 1, the light emitting element 52 is mounted on the first surface 51 a of the substrate 50. In addition, the housing 10 is provided with an installation surface 13 on which the other second surface 51b of the substrate 50 is installed, and a storage portion that is formed at a position where the longitudinal direction is substantially parallel to the installation surface 13 and at least a portion does not overlap the substrate 50 14. Further, the power supply device 40 is disposed in the housing portion 14 of the housing 10 and supplies power to the substrate 50 installed on the installation surface 13.

また、以下で説明する実施形態では、配光調整部材70は、発光素子52によって発光される光の配光を調整する。また、化粧枠30は、配光調整部材70が挿入可能な挿入孔の内面に内側方向へ突出した突出部35を有し、配光調整部材70が載置された突出部35と筺体10の設置面13との間で配光調整部材70を挟んだ状態で筺体10に固設される。   In the embodiment described below, the light distribution adjusting member 70 adjusts the light distribution of the light emitted by the light emitting element 52. Further, the decorative frame 30 has a protruding portion 35 protruding inward on the inner surface of the insertion hole into which the light distribution adjusting member 70 can be inserted, and the protruding portion 35 on which the light distribution adjusting member 70 is placed and the housing 10. The light distribution adjustment member 70 is sandwiched between the installation surface 13 and the housing 10.

また、以下で説明する実施形態では、配光調整部材70は、化粧枠30が筺体10に固設されている場合に、基板50を筺体10の設置面13に押圧する押圧部93を有する。   In the embodiment described below, the light distribution adjusting member 70 includes a pressing portion 93 that presses the substrate 50 against the installation surface 13 of the housing 10 when the decorative frame 30 is fixed to the housing 10.

また、以下で説明する実施形態では、配光調整部材70は、発光素子52によって発光される光を透過させる下面カバー80と、発光素子52によって発光される光を反射させる反射体90とを有する。また、化粧枠30は、配光調整部材70が挿入可能な挿入孔の縁に切欠部37a〜37dが形成される。また、反射体90は、突出部35に載置された下面カバー80と反射体90とを離間した状態で切欠部37a〜37dに係止する係止部91a〜91dを有する。   In the embodiment described below, the light distribution adjusting member 70 includes a lower surface cover 80 that transmits light emitted from the light emitting element 52 and a reflector 90 that reflects light emitted from the light emitting element 52. . In addition, the decorative frame 30 has notches 37 a to 37 d formed at the edge of the insertion hole into which the light distribution adjusting member 70 can be inserted. In addition, the reflector 90 includes locking portions 91a to 91d that lock the lower surface cover 80 placed on the protruding portion 35 and the reflector 90 with the notches 37a to 37d in a separated state.

また、以下で説明する実施形態では、化粧枠30は、筺体10が載置される挿入孔の縁に、筺体10を固定するためのねじ穴38a〜38cが形成される。また、筺体10は、ねじ穴38a〜38cに固定される固定ねじを貫通させるためのねじ通孔19a〜19cが形成されるとともに、収納部14の底壁14aに電源装置40を固定するためのねじ穴15a及び15bが形成される。また、電源装置40は、ねじ穴15a及び15bに固定される固定ねじを貫通させるねじ通孔41a及び41bが形成される。   In the embodiment described below, the decorative frame 30 is formed with screw holes 38a to 38c for fixing the casing 10 at the edge of the insertion hole on which the casing 10 is placed. Further, the housing 10 is formed with screw through holes 19a to 19c for passing through fixing screws fixed to the screw holes 38a to 38c, and for fixing the power supply device 40 to the bottom wall 14a of the storage unit 14. Screw holes 15a and 15b are formed. Further, the power supply device 40 is formed with screw through holes 41a and 41b through which fixing screws fixed to the screw holes 15a and 15b are passed.

以下、図面を参照して、実施形態に係る照明装置を説明する。実施形態において同一の部位には同一の符号を付し、重複する説明は省略される。   Hereinafter, an illumination device according to an embodiment will be described with reference to the drawings. In the embodiment, the same parts are denoted by the same reference numerals, and redundant description is omitted.

[照明装置の外観例] [External appearance of lighting device]

図1及び図2は、実施形態に係る照明装置1の外観例を示す斜視図である。図1では、照明装置1を斜め上方向から見た例を示し、図2では、照明装置1を斜め下方向から見た例を示す。   FIG.1 and FIG.2 is a perspective view which shows the example of an external appearance of the illuminating device 1 which concerns on embodiment. In FIG. 1, the example which looked at the illuminating device 1 from diagonally upward direction is shown, and in FIG. 2, the example which looked at the illuminating device 1 from diagonally downward direction is shown.

図1及び図2に示した照明装置1は、例えば、屋内の天井に埋め込み設置されるダウンライト形の照明器具であり、内部に実装されたLED等の発光素子を発光させることにより、図1及び図2に示した下方向に位置する室内等を照明する。かかる照明装置1は、筺体10と天板20と化粧枠30とを具備する。   The lighting device 1 shown in FIGS. 1 and 2 is, for example, a downlight-type lighting fixture embedded in an indoor ceiling, and emits light from a light-emitting element such as an LED mounted therein, thereby allowing the lighting device 1 shown in FIG. And the room etc. which are located in the downward direction shown in FIG. 2 are illuminated. The lighting device 1 includes a housing 10, a top plate 20, and a decorative frame 30.

筺体10は、熱伝導性の高い金属であり、例えばアルミダイカストにより成型される。   The casing 10 is a metal having high thermal conductivity, and is molded by, for example, aluminum die casting.

また、筺体10は、外面11に一定間隔で複数の放熱フィン12が突設される。放熱フィン12は、筺体10の内部に実装された発光素子から発生する熱を筺体10の外部に放出させる。なお、図1に示した例では、一部の放熱フィンに符号12を付したが、外面11から外側方向に突設される部材は放熱フィン12に該当する。 The housing 10 has a plurality of heat radiation fins 12 protruding from the outer surface 11 at regular intervals. The heat radiating fins 12 release heat generated from the light emitting elements mounted inside the housing 10 to the outside of the housing 10. In addition, in the example shown in FIG. 1, although the code | symbol 12 was attached | subjected to some heat radiation fins, the member protruding in the outward direction from the outer surface 11 corresponds to the heat radiation fin 12. FIG.

天板20は、例えば金属製であり、筺体10の上部に固設されることにより筺体10の内部空間を閉塞する。なお、筺体10の内部空間とは、後述する電源装置40が収納される収納部14に該当する。   The top plate 20 is made of metal, for example, and closes the internal space of the housing 10 by being fixed to the upper portion of the housing 10. Note that the internal space of the housing 10 corresponds to a storage portion 14 in which a power supply device 40 described later is stored.

化粧枠30は、例えばABS樹脂等の合成樹脂製であり、筺体10に固設されることにより、照明装置1の発光面を外部から直視しづらくし眩しさを低減するための枠部材である。例として合成樹脂製としたが、アルミダイカストなどの金属製であってもよい。また、化粧枠30は、下端部に外向き突出された環状フランジ31を有し、外面32にばね取付け部33a〜33cが形成される(後述する図5や図9を参照)。これらのばね取付け部33a〜33cには、それぞれ取付けばね34a〜34cが取り付けられる。   The decorative frame 30 is made of a synthetic resin such as ABS resin, for example, and is a frame member for reducing glare by making the light emitting surface of the lighting device 1 difficult to see from the outside by being fixed to the housing 10. . Although it is made of synthetic resin as an example, it may be made of metal such as aluminum die casting. Further, the decorative frame 30 has an annular flange 31 protruding outward at the lower end portion, and spring mounting portions 33a to 33c are formed on the outer surface 32 (see FIGS. 5 and 9 described later). Attachment springs 34a to 34c are attached to these spring attachment portions 33a to 33c, respectively.

取付けばね34a〜34cは、金属板の弾性部材であり、ばね取付け部33a〜33cに取り付けられた状態で外部から上方向に押圧されることにより、化粧枠30の外面32と略平行となる位置まで折れ曲がることが可能である。照明装置1は、天井に埋め込み設置される場合に、取付けばね34a〜34cが外面32と略平行となる位置まで折り曲げられた状態で天井壁の埋め込み孔に挿入され、環状フランジ31が天井に接触するまで押し上げられる。そして、取付けばね34a〜34cが、外部から押圧されなくなることで図1及び図2に示した状態に復元し、環状フランジ31との間で天井壁を挟持する。これにより、照明装置1は、天井に埋め込み設置される。   The attachment springs 34a to 34c are elastic members made of metal plates, and are positioned substantially parallel to the outer surface 32 of the decorative frame 30 by being pressed upward from the outside while being attached to the spring attachment portions 33a to 33c. It is possible to bend up to. When the illuminating device 1 is embedded in a ceiling, the lighting springs 1 are inserted into the embedded holes in the ceiling wall in a state where the mounting springs 34a to 34c are bent to a position substantially parallel to the outer surface 32, and the annular flange 31 contacts the ceiling. It is pushed up until it does. Then, the mounting springs 34 a to 34 c are restored from the state shown in FIGS. 1 and 2 by being not pressed from the outside, and the ceiling wall is sandwiched between the annular flange 31. Thereby, the illuminating device 1 is embedded and installed in the ceiling.

[照明装置の分解例] [Disassembly example of lighting device]

次に、実施形態に係る照明装置1の分解例について説明する。図3及び図4は、実施形態に係る照明装置1の分解例を示す斜視図である。図3では、照明装置1を斜め上方向から見た例を示し、図4では、照明装置1を斜め下方向から見た例を示す。   Next, a disassembled example of the lighting device 1 according to the embodiment will be described. FIG.3 and FIG.4 is a perspective view which shows the decomposition example of the illuminating device 1 which concerns on embodiment. In FIG. 3, the example which looked at the illuminating device 1 from diagonally upward direction is shown, and in FIG. 4, the example which looked at the illuminating device 1 from diagonally downward direction is shown.

図3及び図4に示すように、実施形態に係る照明装置1は、図1及び図2を用いて説明した筺体10、天板20及び化粧枠30の他に、電源装置40と、基板50と、シート60と、配光調整部材70とを具備する。   As shown in FIGS. 3 and 4, the lighting device 1 according to the embodiment includes a power supply device 40 and a substrate 50 in addition to the casing 10, the top plate 20, and the decorative frame 30 described with reference to FIGS. 1 and 2. And a sheet 60 and a light distribution adjusting member 70.

まず、筺体10、天板20、電源装置40、基板50及びシート60について説明する。筺体10は、図4に示すように、シート60を介して基板50が設置される略円形状の設置面13を有する。また、筺体10は、設置面13の周縁部から下向きに延伸した環状壁13aが形成される。   First, the casing 10, the top plate 20, the power supply device 40, the substrate 50, and the sheet 60 will be described. As shown in FIG. 4, the housing 10 has a substantially circular installation surface 13 on which the substrate 50 is installed via a sheet 60. In addition, the housing 10 is formed with an annular wall 13 a extending downward from the peripheral edge of the installation surface 13.

また、筺体10は、図3に示すように、電源装置40が収納される収納部14が内部に形成される。収納部14は、長手方向が設置面13と略平行であり、かつ、少なくとも一部が基板50と重ならない位置に形成される。具体的には、筺体10は、図3に示すように、設置面13の裏側に略矩形状の底壁14aを有する。かかる底壁14aは、長手方向が設置面13と略平行であり、少なくとも一部が基板50と重ならない位置に形成される。また、筺体10は、底壁14aの周縁部から上向きに延伸した側壁14bを有する。収納部14は、このような底壁14aを底面とし側壁14bを側面とする上端が開放された空間により形成される。   Moreover, as shown in FIG. 3, the housing 10 has a housing portion 14 in which the power supply device 40 is housed. The storage portion 14 is formed at a position where the longitudinal direction is substantially parallel to the installation surface 13 and at least a portion does not overlap the substrate 50. Specifically, as shown in FIG. 3, the housing 10 has a substantially rectangular bottom wall 14 a on the back side of the installation surface 13. The bottom wall 14 a is formed at a position where the longitudinal direction is substantially parallel to the installation surface 13 and at least a portion does not overlap the substrate 50. Moreover, the housing 10 has the side wall 14b extended upwards from the peripheral part of the bottom wall 14a. The storage portion 14 is formed by a space having an open upper end with the bottom wall 14a as a bottom surface and the side wall 14b as a side surface.

また、筺体10は、収納部14から設置面13へ連通する貫通孔14cが形成される。かかる貫通孔14cは、設置面13に設置される基板50と収納部14に収納される電源装置40とを接続するための通線孔となる。   In addition, the housing 10 is formed with a through hole 14 c that communicates from the storage portion 14 to the installation surface 13. The through hole 14 c is a through hole for connecting the substrate 50 installed on the installation surface 13 and the power supply device 40 stored in the storage unit 14.

また、図4に示すように、筺体10は、底壁14aの裏側に放熱フィン12aが突設される。かかる放熱フィン12aは、発光素子から発生する熱を収納部14から外部に放出させる。なお、図4に示した例では、一部の放熱フィンに符号12aを付したが、筺体10の下面から下方向に突設される部材は放熱フィン12aに該当する。   Moreover, as shown in FIG. 4, the housing 10 is provided with heat radiating fins 12a on the back side of the bottom wall 14a. The heat radiating fins 12a release the heat generated from the light emitting elements to the outside from the storage unit. In addition, in the example shown in FIG. 4, although the code | symbol 12a was attached | subjected to some heat radiation fins, the member protruding below from the lower surface of the housing 10 corresponds to the heat radiation fin 12a.

また、筺体10は、図3に示すように、底壁14aに電源装置40を固定するためのねじ穴15a及び15bが形成される(後述する図11を参照)。具体的には、底壁14aには、側壁14bの高さよりも小さい高さを有するねじ台15c及び15dが形成され(後述する図11を参照)、かかるねじ台15cの上面にねじ穴15aが形成され、ねじ台15dの上面にねじ穴15bが形成される。   Moreover, as shown in FIG. 3, the housing 10 is formed with screw holes 15a and 15b for fixing the power supply device 40 to the bottom wall 14a (see FIG. 11 described later). Specifically, screw bases 15c and 15d having a height smaller than that of the side wall 14b are formed on the bottom wall 14a (see FIG. 11 described later), and screw holes 15a are formed on the upper surface of the screw base 15c. The screw hole 15b is formed on the upper surface of the screw base 15d.

また、筺体10は、筺体10の上端面に天板20を固定するためのねじ穴16a〜16cが形成される。図3の例では、筺体10は、収納部14の縁にねじ穴16a及び16bが形成され、収納部14の縁以外にもねじ穴16cが形成される。   The housing 10 is formed with screw holes 16 a to 16 c for fixing the top plate 20 to the upper end surface of the housing 10. In the example of FIG. 3, the housing 10 has screw holes 16 a and 16 b formed at the edge of the storage portion 14, and a screw hole 16 c other than the edge of the storage portion 14.

また、筺体10は、端子台17を取り付けられる端子台取り付け板10aを有する。かかる端子台取り付け板10aには、端子台17が固設される際に金属等の固定ねじが貫通するためのねじ通孔18が形成される。   Moreover, the housing 10 has a terminal block mounting plate 10a to which the terminal block 17 can be mounted. The terminal block mounting plate 10a is formed with a screw through hole 18 through which a fixing screw made of metal or the like passes when the terminal block 17 is fixed.

端子台17は、図示しない商用交流電源からの電力供給を電源装置40に中継する。かかる端子台17は、ねじ穴17aが形成されており、固定ねじが上方から筺体10のねじ通孔18を貫通してねじ穴17aにねじ込まれることにより筺体10に固設される。   The terminal block 17 relays power supply from a commercial AC power supply (not shown) to the power supply device 40. The terminal block 17 is formed with a screw hole 17a, and the fixing screw is fixed to the housing 10 by passing through the screw through hole 18 of the housing 10 from above and being screwed into the screw hole 17a.

電源装置40は、収納部14に格納可能なように、底壁14aよりも小さい大きさの平面形状に形成される。かかる電源装置40は、収納部14に配設され、端子台17から中継される電力を設置面13に設置された基板50に電源線54を介して供給する。なお、図3及び図4では図示することを省略したが、電源装置40は、電界コンデンサ等の複数の電気部品を実装する。かかる電源装置40は、筺体10のねじ穴15a及び15bと対向する位置に、ねじ通孔41a及び41bが形成される。そして、電源装置40は、固定ねじが上方からねじ通孔41a及び41bを貫通して筺体10のねじ穴15a及び15bにねじ込まれることにより筺体10に固設される。これにより、電源装置40は、筺体10の収納部14に収納される。   The power supply device 40 is formed in a planar shape having a size smaller than the bottom wall 14 a so that the power supply device 40 can be stored in the storage unit 14. The power supply device 40 is disposed in the storage unit 14 and supplies the power relayed from the terminal block 17 to the substrate 50 installed on the installation surface 13 via the power line 54. Although not shown in FIGS. 3 and 4, the power supply device 40 mounts a plurality of electrical components such as an electric field capacitor. In the power supply device 40, screw through holes 41 a and 41 b are formed at positions facing the screw holes 15 a and 15 b of the housing 10. The power supply device 40 is fixed to the housing 10 by fixing screws being passed through the screw through holes 41a and 41b from above and screwed into the screw holes 15a and 15b of the housing 10. As a result, the power supply device 40 is stored in the storage unit 14 of the housing 10.

天板20は、上面にねじ通孔21a〜21cが形成されており、固定ねじがねじ通孔21a〜21cを貫通して筺体10のねじ穴16a〜16cにねじ込まれることにより筺体10に固設される。これにより、天板20は、筺体10に形成された収納部14を閉塞する。   The top plate 20 has screw through holes 21a to 21c formed on the upper surface, and the fixing screws are fixed to the housing 10 by passing through the screw through holes 21a to 21c and screwed into the screw holes 16a to 16c of the housing 10. Is done. Thereby, the top plate 20 closes the storage part 14 formed in the housing 10.

基板50は、筺体10の環状壁13aに囲まれた設置面13に設置可能な大きさの平面形状に形成される。かかる基板50は、発光素子52が実装される第1面51aと、シート60を介して筺体10の設置面13に設置される第2面51bとを有する。実施形態に係る基板50は、SMD(Surface Mount Device)形で構成されているものとし、複数の発光素子52が第2面51bに実装される。ただし、基板50は、SMD形に限られず、マトリックス状や千鳥状や放射状など規則的に一定の順序をもって第2面51bの一部又は全体に複数の発光素子52が配列されて実装されたCOB(Chip on Board)形であってもよい。   The board | substrate 50 is formed in the planar shape of the magnitude | size which can be installed in the installation surface 13 enclosed by the annular wall 13a of the housing 10. As shown in FIG. The substrate 50 has a first surface 51 a on which the light emitting element 52 is mounted, and a second surface 51 b installed on the installation surface 13 of the housing 10 via the sheet 60. The board | substrate 50 which concerns on embodiment shall be comprised by SMD (Surface Mount Device) form, and the some light emitting element 52 is mounted in the 2nd surface 51b. However, the substrate 50 is not limited to the SMD type, and is a COB in which a plurality of light emitting elements 52 are arranged and mounted on a part or the whole of the second surface 51b in a regular order such as a matrix shape, a staggered shape or a radial shape. (Chip on Board) type may be sufficient.

また、図4に示すように、基板50の第1面51aには、コネクタ53が設けられる。   Further, as shown in FIG. 4, a connector 53 is provided on the first surface 51 a of the substrate 50.

かかるコネクタ53には、電源線54の一端が接続される。また、電源線54の他端は、貫通孔14cを介して、筺体10の収納部14に収納されている電源装置40と接続される。 One end of a power line 54 is connected to the connector 53. Further, the other end of the power supply line 54 is connected to the power supply device 40 housed in the housing portion 14 of the housing 10 through the through hole 14c.

このような基板50は、電源装置40から供給される電力によって発光素子52を発光させることで室内等に光を提供する。一方で、基板50は、点灯時の発光素子52が発熱するので、収納部14等の温度を上昇させる可能性がある。   Such a board | substrate 50 provides light indoors by making the light emitting element 52 light-emit with the electric power supplied from the power supply device 40. FIG. On the other hand, since the light emitting element 52 generates heat when the substrate 50 is turned on, there is a possibility that the temperature of the storage portion 14 and the like is increased.

シート60は、熱伝導性の高い合成樹脂製であり、かかるシート60は、環状壁13aに囲まれた設置面13に設置可能な大きさの平面形状に形成され、基板50の第2面51b及び筺体10の設置面13の双方と密に面接触することで、基板50を筺体10の設置面13に密着させる。設置面13に密着させられた基板50は、筺体10の貫通孔14cを介して、収納部14に収納される電源装置40と接続される。   The sheet 60 is made of a synthetic resin having high thermal conductivity. The sheet 60 is formed in a planar shape having a size that can be installed on the installation surface 13 surrounded by the annular wall 13a, and the second surface 51b of the substrate 50. And the board | substrate 50 is closely_contact | adhered to the installation surface 13 of the housing 10 by carrying out close surface contact with both of the installation surface 13 of the housing 10 and. The substrate 50 brought into close contact with the installation surface 13 is connected to the power supply device 40 stored in the storage unit 14 through the through hole 14 c of the housing 10.

ここで、基板50から発生する熱は、シート60を介して熱伝導性の高い金属である筺体10に伝導させられ、筺体10から放熱フィン12を介して大気中に放出される。これにより、照明装置1では、基板50や収納部14の温度上昇を抑制することができる。   Here, the heat generated from the substrate 50 is conducted through the sheet 60 to the housing 10 that is a metal having high thermal conductivity, and is released from the housing 10 into the atmosphere through the radiation fins 12. Thereby, in the illuminating device 1, the temperature rise of the board | substrate 50 and the accommodating part 14 can be suppressed.

また、上記の通り、実施形態に係る照明装置1において、収納部14は、長手方向が設置面13と略平行であり、かつ、少なくとも一部が基板50と重ならない位置に形成される。このため、実施形態に係る照明装置1では、基板50から発生する熱によって高温化した空気が上昇した場合に、基板50と重なっている収納部14の一部分が高温化することがあっても、収納部14全体が高温化することを防止することができる。この結果、実施形態に係る照明装置1は、収納部14に収納される電源装置40の高温化を防止できるので、電源装置40の性能劣化を防止することができる。また、実施形態に係る照明装置1では、収納部14を形成する底壁14aと略平行となるように板状の電源装置40を配設することとしたので、収納部14の短手方向(高さ方向)の寸法を短くすることができる。すなわち、実施形態に係る照明装置1では、照明装置1自体の大型化を伴うことなく、電源装置40の高温化を防止することができる。   Further, as described above, in the lighting device 1 according to the embodiment, the storage unit 14 is formed at a position where the longitudinal direction is substantially parallel to the installation surface 13 and at least a portion does not overlap the substrate 50. For this reason, in the lighting device 1 according to the embodiment, even when a portion of the storage unit 14 that overlaps the substrate 50 is heated when the temperature of the heated air rises due to the heat generated from the substrate 50, It can prevent that the storage part 14 whole heats up. As a result, the lighting device 1 according to the embodiment can prevent the power supply device 40 housed in the housing unit 14 from being heated to a high temperature, and thus can prevent performance deterioration of the power supply device 40. Moreover, in the illuminating device 1 which concerns on embodiment, since it decided to arrange | position the plate-shaped power supply device 40 so that it might become substantially parallel to the bottom wall 14a which forms the accommodating part 14, the transversal direction of the accommodating part 14 ( The dimension in the height direction can be shortened. That is, in the illuminating device 1 according to the embodiment, the power supply device 40 can be prevented from being heated at a high temperature without increasing the size of the illuminating device 1 itself.

続いて、筺体10、化粧枠30及び配光調整部材70について説明する。筺体10には、化粧枠30が固設される際に固定ねじが貫通するためのねじ通孔19a〜19cが形成される。図3及び図4に示した例では、ねじ通孔19a〜19cは、設置面13の周縁部に形成される。また、ねじ通孔19aの上側には、固定ねじを上方から貫通させることを可能とするための逃げ19dが形成され、同様に、ねじ通孔19bの上側には逃げ19eが形成される(後述する図11を参照)。   Next, the casing 10, the decorative frame 30, and the light distribution adjusting member 70 will be described. The casing 10 is formed with screw through holes 19a to 19c through which fixing screws pass when the decorative frame 30 is fixed. In the example shown in FIGS. 3 and 4, the screw through holes 19 a to 19 c are formed in the peripheral edge portion of the installation surface 13. Further, an escape 19d is formed above the screw through hole 19a to allow the fixing screw to penetrate from above, and similarly an escape 19e is formed above the screw through hole 19b (described later). See FIG.

化粧枠30は、図3及び図4に示すように、上下両端がそれぞれ略円形に開口され、化粧枠30の下端縁には、下端縁から外向きに突出された環状フランジ31が形成される。   As shown in FIGS. 3 and 4, the upper and lower ends of the decorative frame 30 are opened in a substantially circular shape, and an annular flange 31 protruding outward from the lower end edge is formed on the lower end edge of the decorative frame 30. .

化粧枠30の上端縁の直径は、環状壁13aの直径と略同一である。また、化粧枠30の内面のうち所定の高さに位置する内面には、内側方向(開口円の中心方向)へ突出した円形状の突出部35が形成される。さらに、化粧枠30の内面には、内側方向(開口円の中心方向)へ突出するとともに突出部35と上端縁とを結ぶ位置決め部36が形成される。 The diameter of the upper edge of the decorative frame 30 is substantially the same as the diameter of the annular wall 13a. In addition, a circular protruding portion 35 that protrudes inward (center direction of the opening circle) is formed on the inner surface of the decorative frame 30 that is positioned at a predetermined height. Further, on the inner surface of the decorative frame 30, a positioning portion 36 that protrudes in the inner direction (center direction of the opening circle) and connects the protruding portion 35 and the upper end edge is formed.

また、化粧枠30の上端開口部の縁には、切欠部37a〜37dが形成されるとともに、筺体10に固定されるためのねじ穴38a〜38cが形成される(後述する図5及び図9を参照)。なお、図3の例において、化粧枠30の内径は、上端開口部から突出部35に向かうまで略同一であり、突出部35から下端開口部に向かうほど次第に大きく形成される。   Further, notches 37a to 37d are formed at the edge of the upper end opening of the decorative frame 30, and screw holes 38a to 38c for fixing to the housing 10 are formed (FIGS. 5 and 9 to be described later). See). In the example of FIG. 3, the inner diameter of the decorative frame 30 is substantially the same from the upper end opening toward the projecting portion 35, and is gradually increased from the projecting portion 35 toward the lower end opening.

配光調整部材70は、発光素子52によって発光される光の配光を調整する部材であり、下面カバー80及び反射体90を含む。下面カバー80は、例えば、アクリル樹脂やポリカーボネート等の透光性のカバーであり、化粧枠30の突出部35に載置可能なように、化粧枠30の上端開口部の内径よりも小さく、かつ、突出部35の内径よりも大きい略平面円形状に形成される。また、下面カバー80には、化粧枠30の位置決め部36よりも少し大きく領域が切り欠けた切欠部81が形成される。   The light distribution adjusting member 70 is a member that adjusts the light distribution of the light emitted by the light emitting element 52, and includes a lower surface cover 80 and a reflector 90. The lower surface cover 80 is a light-transmitting cover such as acrylic resin or polycarbonate, and is smaller than the inner diameter of the upper end opening of the decorative frame 30 so as to be placed on the protruding portion 35 of the decorative frame 30. Further, it is formed in a substantially planar circular shape larger than the inner diameter of the protruding portion 35. Further, the lower surface cover 80 is formed with a notch 81 having a slightly larger area than the positioning part 36 of the decorative frame 30.

下面カバー80は配光調整機能の他に、外部から導電部を保護する役割をしている。このような下面カバー80は、化粧枠30の上端開口部から挿入され、突出部35に載置される。このとき、切欠部81は、位置決め部36に係止することで、突出部35に載置された下面カバー80が回転することを防止する。   In addition to the light distribution adjustment function, the lower surface cover 80 serves to protect the conductive portion from the outside. Such a lower surface cover 80 is inserted from the upper end opening of the decorative frame 30 and placed on the protruding portion 35. At this time, the notch portion 81 is locked to the positioning portion 36 to prevent the lower surface cover 80 placed on the protruding portion 35 from rotating.

反射体90は、例えば、耐光性、耐熱性及び電気絶縁性を有する白色の合成樹脂性であり、発光素子52によって発光される光の配光を調整する。かかる反射体90は、化粧枠30の上端開口部から挿入可能なように、化粧枠30の上端開口部の内径よりも小さい略円形状に形成される。また、反射体90は、発光素子52によって発光される光が通過可能なように、上下両端がそれぞれ略円形に開口される。この反射体90の内径は、上端開口部から下端開口部に向かうほど次第に大きく形成される。   The reflector 90 is, for example, a white synthetic resin having light resistance, heat resistance, and electrical insulation, and adjusts the light distribution of light emitted by the light emitting element 52. The reflector 90 is formed in a substantially circular shape smaller than the inner diameter of the upper end opening of the decorative frame 30 so that it can be inserted from the upper end opening of the decorative frame 30. In addition, the reflector 90 has both upper and lower ends opened in a substantially circular shape so that light emitted by the light emitting element 52 can pass therethrough. The inner diameter of the reflector 90 is gradually increased from the upper end opening toward the lower end opening.

また、反射体90は、下面92を下面カバー80に載置させないために、係止部91a〜91dが外面に形成される(後述する図6及び図10を参照)。これらの係止部91a〜91dは、突出部35に載置された下面カバー80と反射体90とを離間した状態で化粧枠30の切欠部37a〜37dに係止する。この点について、図5及び図6を用いて説明する。   Further, the reflector 90 has locking portions 91a to 91d formed on the outer surface so that the lower surface 92 is not placed on the lower surface cover 80 (see FIGS. 6 and 10 described later). These locking portions 91 a to 91 d are locked to the notches 37 a to 37 d of the decorative frame 30 in a state where the lower surface cover 80 placed on the protruding portion 35 and the reflector 90 are separated from each other. This point will be described with reference to FIGS.

図5及び図6は、実施形態に係る化粧枠30及び配光調整部材70の外観例を示す斜視図である。図5では、化粧枠30に下面カバー80が挿入された状態を示す。図6では、化粧枠30に下面カバー80及び反射体90の双方が挿入された状態を示す。   5 and 6 are perspective views showing an example of the appearance of the decorative frame 30 and the light distribution adjusting member 70 according to the embodiment. FIG. 5 shows a state where the lower surface cover 80 is inserted into the decorative frame 30. FIG. 6 shows a state where both the lower surface cover 80 and the reflector 90 are inserted into the decorative frame 30.

図5に示すように、下面カバー80は、化粧枠30の上端開口部から挿入された場合、化粧枠30を貫通せずに突出部35に載置される。そして、図6に示すように、反射体90は、下面カバー80が挿入されている化粧枠30に挿入された場合、係止部91a〜91dが切欠部37a〜37dに係止することで挿入される深さが決められ、下面カバー80には載置されない。すなわち、実施形態に係る照明装置1においては、下面カバー80が載置されている突出部35の載置面と、反射体90の下面92との距離が下面カバー80の厚さよりも長くなるように、反射体90の外面に係止部91a〜91dが形成される。   As shown in FIG. 5, when the lower surface cover 80 is inserted from the upper end opening of the decorative frame 30, it is placed on the protruding portion 35 without penetrating the decorative frame 30. Then, as shown in FIG. 6, when the reflector 90 is inserted into the decorative frame 30 in which the lower surface cover 80 is inserted, the reflectors 91a to 91d are inserted by being locked to the notches 37a to 37d. The depth is determined and is not placed on the lower surface cover 80. That is, in the lighting device 1 according to the embodiment, the distance between the placement surface of the protrusion 35 on which the lower surface cover 80 is placed and the lower surface 92 of the reflector 90 is longer than the thickness of the lower surface cover 80. In addition, locking portions 91 a to 91 d are formed on the outer surface of the reflector 90.

上述した化粧枠30は、下面カバー80及び反射体90の双方が挿入された状態で、固定ねじが筺体10のねじ通孔19a〜19cを上方から貫通して化粧枠30のねじ穴38a〜38cにねじ込まれることにより筺体10に固設される。すなわち、筺体10及び化粧枠30は、基板50と下面カバー80と反射体90とを挟んだ状態で固設される。このように、実施形態に係る照明装置1では、固定ねじによって、筺体10の基板50を固設したり、化粧枠30に下面カバー80を固設したり、化粧枠30に反射体90を固設したりしないので、照明装置1の組み立てを容易にすることができ、組み立てにかかる作業スピードの向上を図ることができる。   In the decorative frame 30 described above, in a state where both the lower surface cover 80 and the reflector 90 are inserted, the fixing screw penetrates the screw through holes 19a to 19c of the housing 10 from above and the screw holes 38a to 38c of the decorative frame 30. It is fixed to the housing 10 by being screwed into the housing 10. That is, the housing 10 and the decorative frame 30 are fixedly provided with the substrate 50, the lower surface cover 80, and the reflector 90 interposed therebetween. As described above, in the lighting device 1 according to the embodiment, the substrate 50 of the housing 10 is fixed by the fixing screw, the lower surface cover 80 is fixed to the decorative frame 30, or the reflector 90 is fixed to the decorative frame 30. Since it is not provided, the assembly of the lighting device 1 can be facilitated, and the working speed for the assembly can be improved.

[照明装置の断面例] [Example of cross section of lighting device]

次に、実施形態に係る照明装置1の断面について説明する。図7は、図1に示したII線における断面を模式的に示す図である。図7に示すように、下面カバー80は、化粧枠30の突出部35に載置される。また、反射体90は、係止部91a〜91dが切欠部37a〜37dに載置されることで、反射体90の下面92と下面カバー80とを離間させた状態で化粧枠30に挿入される。   Next, the cross section of the illuminating device 1 which concerns on embodiment is demonstrated. FIG. 7 is a diagram schematically showing a cross section taken along the line II shown in FIG. As shown in FIG. 7, the lower surface cover 80 is placed on the protruding portion 35 of the decorative frame 30. Further, the reflector 90 is inserted into the decorative frame 30 in a state in which the lower surface 92 and the lower surface cover 80 of the reflector 90 are separated from each other by placing the locking portions 91a to 91d in the notches 37a to 37d. The

また、収納部14の長手方向L1は、基板50の設置面13と略平行であり、かつ、収納部14の少なくとも一部は、基板50と重ならない。また、収納部14から設置面13へ貫通する貫通孔14cが形成される。   The longitudinal direction L1 of the storage portion 14 is substantially parallel to the installation surface 13 of the substrate 50, and at least a part of the storage portion 14 does not overlap the substrate 50. Further, a through hole 14 c that penetrates from the storage portion 14 to the installation surface 13 is formed.

ここで、化粧枠30が筺体10に固設された場合に、反射体90の上端開口部における縁は、基板50を筺体10の設置面13に押圧する押圧部93(図3及び図6を参照)として機能する。具体的には、図7に示した例において、化粧枠30及び筺体10は、固定ねじによって固設された場合、互いに密着する方向に力が加えられる。このとき、化粧枠30の切欠部37a〜37dが、反射体90の係止部91a〜91dを設置面13に向かう方向に押し上げる。この結果、押圧部93は、基板50を設置面13に押圧することとなる。   Here, when the decorative frame 30 is fixed to the casing 10, the edge at the upper end opening of the reflector 90 is a pressing portion 93 that presses the substrate 50 against the installation surface 13 of the casing 10 (see FIGS. 3 and 6). Reference). Specifically, in the example shown in FIG. 7, when the decorative frame 30 and the casing 10 are fixed by fixing screws, force is applied in a direction in which they are in close contact with each other. At this time, the notches 37 a to 37 d of the decorative frame 30 push up the locking portions 91 a to 91 d of the reflector 90 in the direction toward the installation surface 13. As a result, the pressing portion 93 presses the substrate 50 against the installation surface 13.

図8を用いて、押圧部93によって押圧される基板50について説明する。図8に示した例において、反射体90の押圧部93は、基板50の第1面51aうち点線で示した位置を設置面13に向かう方向に押圧する。これにより、実施形態に係る照明装置1では、設置面13、シート60及び基板50を密着させることができるので、基板50から設置面13への熱伝送性を高めることができる。この結果、実施形態に係る照明装置1では、基板50を筺体10によって効率良く冷却することができるので、基板50や収納部14の温度上昇を抑制することができる。   The board | substrate 50 pressed by the press part 93 is demonstrated using FIG. In the example shown in FIG. 8, the pressing portion 93 of the reflector 90 presses the position indicated by the dotted line in the first surface 51 a of the substrate 50 in the direction toward the installation surface 13. Thereby, in the illuminating device 1 which concerns on embodiment, since the installation surface 13, the sheet | seat 60, and the board | substrate 50 can be closely_contact | adhered, the heat transfer property from the board | substrate 50 to the installation surface 13 can be improved. As a result, in the illuminating device 1 according to the embodiment, the substrate 50 can be efficiently cooled by the housing 10, and thus the temperature rise of the substrate 50 and the storage unit 14 can be suppressed.

[照明装置の組み立て例] [Assembly example of lighting device]

次に、図9〜図12を用いて、実施形態に係る照明装置1の組み立て例について説明する。なお、図9〜図12では、照明装置1を上方向から見た例を示す。まず、図9に示すように、化粧枠30が置かれ、取付けばね34a〜34cが取り付けられる。続いて、下面カバー80が化粧枠30の突出部35に載置される。   Next, the assembly example of the illuminating device 1 which concerns on embodiment is demonstrated using FIGS. 9-12. In addition, in FIGS. 9-12, the example which looked at the illuminating device 1 from the upper direction is shown. First, as shown in FIG. 9, the decorative frame 30 is placed, and the attachment springs 34a to 34c are attached. Subsequently, the lower surface cover 80 is placed on the protruding portion 35 of the decorative frame 30.

続いて、図10に示すように、反射体90が化粧枠30に挿入される。このとき、反射体90の係止部91a〜91dが化粧枠30の切欠部37a〜37d(図9を参照)に係止することで、反射体90が挿入される位置が決められる。続いて、基板50が反射体90の上に載置され、シート60が基板50の上に載置される。   Subsequently, as shown in FIG. 10, the reflector 90 is inserted into the decorative frame 30. At this time, the engaging portions 91 a to 91 d of the reflector 90 are engaged with the cutout portions 37 a to 37 d (see FIG. 9) of the decorative frame 30, whereby the position where the reflector 90 is inserted is determined. Subsequently, the substrate 50 is placed on the reflector 90 and the sheet 60 is placed on the substrate 50.

続いて、図11に示すように、筺体10が化粧枠30上に載置される。そして、筺体10のねじ通孔19a〜19cを貫通した固定ねじが、化粧枠30のねじ穴38a〜38cにねじ込まれる。このねじ固定作業により、化粧枠30、基板50と、シート60と、下面カバー80及び反射体90が筺体10に取り付けられる。   Subsequently, as shown in FIG. 11, the housing 10 is placed on the decorative frame 30. Then, fixing screws that pass through the screw through holes 19 a to 19 c of the housing 10 are screwed into the screw holes 38 a to 38 c of the decorative frame 30. By this screw fixing operation, the decorative frame 30, the substrate 50, the sheet 60, the lower surface cover 80, and the reflector 90 are attached to the housing 10.

続いて、電源装置40が筺体10の収納部14に収納される。そして、電源装置40のねじ通孔41a及び41bを貫通した固定ねじが筺体10のねじ穴15a及び15bにねじ込まれる。これにより、電源装置40が筺体10に固設される。また、筺体10のねじ通孔18を貫通した固定ねじが端子台17のねじ穴17aにねじ込まれる。これにより、端子台17が筺体10に固設される。   Subsequently, the power supply device 40 is stored in the storage unit 14 of the housing 10. Then, fixing screws that penetrate the screw through holes 41 a and 41 b of the power supply device 40 are screwed into the screw holes 15 a and 15 b of the housing 10. Thereby, the power supply device 40 is fixed to the housing 10. Further, a fixing screw that passes through the screw through hole 18 of the housing 10 is screwed into the screw hole 17 a of the terminal block 17. Thereby, the terminal block 17 is fixed to the housing 10.

続いて、図12に示すように、天板20が筺体10の上に載置される。そして、天板20のねじ通孔21a〜21cを貫通した固定ねじが筺体10のねじ穴16a〜16c(図11を参照)にねじ込まれる。これにより、天板20が筺体10に固設される。   Subsequently, as shown in FIG. 12, the top plate 20 is placed on the housing 10. And the fixing screw which penetrated the screw through-holes 21a-21c of the top plate 20 is screwed into the screw holes 16a-16c (refer FIG. 11) of the housing 10. FIG. Thereby, the top plate 20 is fixed to the housing 10.

図9〜図12に示したように、実施形態にかかる照明装置1では、固定ねじをねじ込む方向が全て同一であるので、組み立て時に各部在の向きを変えることを要しない。例えば、実施形態にかかる照明装置1では、図9〜図12に示したように、各部在を順次載置して、載置した向きのまま固定ねじをねじ込むことで組み立てられる。このため、実施形態に係る照明装置1は、組み立てにかかる作業スピードの向上を図ることができる。   As shown in FIGS. 9-12, in the illuminating device 1 concerning embodiment, since all the directions which screw a fixing screw are the same, it is not necessary to change the direction of each part at the time of an assembly. For example, in the illuminating device 1 according to the embodiment, as shown in FIGS. 9 to 12, each part is sequentially placed and assembled by screwing a fixing screw in the placed direction. For this reason, the illuminating device 1 which concerns on embodiment can aim at the improvement of the working speed concerning an assembly.

上述してきたように、実施形態に係る照明装置1によれば、電源装置40が収納される収納部14の長手方向が基板50の設置面13と略平行であり、かつ、かかる収納部14の少なくとも一部が基板50と重ならない位置に形成される。   As described above, according to the lighting device 1 according to the embodiment, the longitudinal direction of the storage unit 14 in which the power supply device 40 is stored is substantially parallel to the installation surface 13 of the substrate 50, and At least a part of the substrate 50 is formed so as not to overlap.

これにより、実施形態に係る照明装置1によれば、基板50から発生する熱によって高温化した空気が上昇した場合であっても、収納部14全体が高温化することを防止することができるので、収納部14に収納される電源装置40の高温化を防止することができる。例えば、電源装置40に実装される電界コンデンサ等は熱に弱いことが知られているが、実施形態に係る照明装置1によれば、このような電源装置40の性能劣化を防止することができる。   Thereby, according to the illuminating device 1 which concerns on embodiment, even if it is a case where the air heated up with the heat which generate | occur | produces from the board | substrate 50 rises, it can prevent that the accommodating part 14 whole heats up. Therefore, it is possible to prevent the power supply device 40 stored in the storage unit 14 from becoming hot. For example, although it is known that the electric field capacitor etc. mounted in the power supply device 40 are weak to heat, according to the illuminating device 1 which concerns on embodiment, such performance degradation of the power supply device 40 can be prevented. .

特に、実施形態に係る照明装置1によれば、図7に示した例ように、電源装置40が収納部14の底壁14aに近い位置に収納される。すなわち、実施形態に係る照明装置1によれば、高温化した空気は上昇するので、電源装置40の収納位置の高温化を防止することができる。   In particular, according to the lighting device 1 according to the embodiment, the power supply device 40 is housed in a position near the bottom wall 14a of the housing portion 14 as in the example shown in FIG. That is, according to the illuminating device 1 which concerns on embodiment, since the air heated up rises, the high temperature of the storage position of the power supply device 40 can be prevented.

また、実施形態に係る照明装置1によれば、筺体10及び化粧枠30が、基板50と下面カバー80と反射体90とを挟んだ状態で固設される。これにより、実施形態に係る照明装置1によれば、固定ねじによって基板50や下面カバー80や反射体90を固設することを要しないので、組み立てにかかる作業スピードの向上を図ることができる。   Moreover, according to the illuminating device 1 which concerns on embodiment, the housing 10 and the decorative frame 30 are fixed in the state which pinched | interposed the board | substrate 50, the lower surface cover 80, and the reflector 90. FIG. Thereby, according to the illuminating device 1 which concerns on embodiment, since it is not necessary to fix the board | substrate 50, the lower surface cover 80, and the reflector 90 with a fixing screw, the improvement of the working speed concerning an assembly can be aimed at.

また、実施形態に係る照明装置1によれば、筺体10に化粧枠30が固設された場合に、反射体90の押圧部93が基板50を設置面13に向かう方向に押圧する。これにより、実施形態に係る照明装置1によれば、基板50から設置面13への熱伝送性を高めることができるので、基板50や収納部14の温度上昇を抑制することができる。   Moreover, according to the illuminating device 1 which concerns on embodiment, when the decorative frame 30 is fixed to the housing 10, the press part 93 of the reflector 90 presses the board | substrate 50 in the direction which goes to the installation surface 13. FIG. Thereby, according to the illuminating device 1 which concerns on embodiment, since the heat transferability from the board | substrate 50 to the installation surface 13 can be improved, the temperature rise of the board | substrate 50 or the accommodating part 14 can be suppressed.

また、実施形態に係る照明装置1によれば、反射体90の係止部91a〜91dが、下面カバー80と反射体90とを離間した状態で化粧枠30の切欠部37a〜37dに係止する。これにより、実施形態に係る照明装置1によれば、筺体10及び化粧枠30が固設された場合であっても、反射体90の下面92によって下面カバー80が突出部35に向かう方向に押圧されることを防止できるので、下面カバー80の破損を防止することができる。例えば、下面カバー80は、反射体90及び突出部35によって押圧されている場合、基板50からの熱によって熱膨張すると破損したり、軋む音を発する場合がある。しかし、実施形態に係る照明装置1によれば、下面カバー80の破損を防止でき、また、下面カバー80から軋む音が発せられることを防止できる。
[他の実施形態]
Moreover, according to the illuminating device 1 which concerns on embodiment, the latching | locking part 91a-91d of the reflector 90 latches to the notch part 37a-37d of the decorative frame 30 in the state which spaced apart the lower surface cover 80 and the reflector 90. To do. Thereby, according to the illuminating device 1 which concerns on embodiment, even if it is a case where the housing 10 and the decorative frame 30 are fixed, the lower surface cover 80 presses in the direction which faces the protrusion part 35 by the lower surface 92 of the reflector 90. Therefore, the lower surface cover 80 can be prevented from being damaged. For example, when the lower surface cover 80 is pressed by the reflector 90 and the projecting portion 35, the lower surface cover 80 may be damaged or generate a creaking sound when thermally expanded by heat from the substrate 50. However, according to the illuminating device 1 which concerns on embodiment, the damage of the lower surface cover 80 can be prevented, and it can prevent that the sound which crawls from the lower surface cover 80 is emitted.
[Other Embodiments]

上記実施形態では、ダウンライトを例に挙げて説明したが、照明装置1は、天井に埋め込まれるタイプ以外の直付け照明器具等にも適用することができる。   In the above embodiment, the downlight has been described as an example. However, the lighting device 1 can be applied to a direct-mounted lighting fixture other than the type embedded in the ceiling.

また、上記実施形態では、固定ねじによって各部材を固設する例を示したが、照明装置1は、固定ねじ以外のピン等の固定部材によって各部材が固設されてもよい。   Moreover, although the example which fixes each member with a fixing screw was shown in the said embodiment, each member may be fixed with fixing members, such as pins other than a fixing screw, in the illuminating device 1. FIG.

また、上記実施形態に係る各部材の形状、原料及び材質は、実施形態や図示したものに限られない。例えば、化粧枠30や反射体90の開口部は円形でなく矩形であってもよいし、同様に、化粧枠30、基板50、シート60、下面カバー80、反射体90の外観は円形ではなく矩形であってもよい。また、収納部14の形状や電源装置40が収納される位置も上記例に限られない。例えば、図7では、電源装置40の一部が貫通孔14cの上部に位置する例を示したが、電源装置40は、貫通孔14cと重ならない位置に収納されてもよい。   Moreover, the shape, the raw material, and the material of each member which concern on the said embodiment are not restricted to embodiment or what was illustrated. For example, the opening of the decorative frame 30 and the reflector 90 may be rectangular instead of circular, and similarly, the appearance of the decorative frame 30, the substrate 50, the sheet 60, the lower surface cover 80, and the reflector 90 is not circular. It may be a rectangle. Further, the shape of the storage portion 14 and the position where the power supply device 40 is stored are not limited to the above example. For example, FIG. 7 shows an example in which a part of the power supply device 40 is located above the through hole 14c. However, the power supply device 40 may be housed in a position that does not overlap the through hole 14c.

以上説明したとおり、実施形態によれば、電源装置40を収納するとともに電源装置40の高温化を防止することができる。   As described above, according to the embodiment, the power supply device 40 can be housed and the power supply device 40 can be prevented from being heated.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれると同様に、特許請求の範囲に記載された発明とその均等の範囲に含まれるものである。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

1 照明装置、10 筺体、13 設置面、14 収納部、20 天板、30 化粧枠、40 電源装置、52 発光素子、   DESCRIPTION OF SYMBOLS 1 Illuminating device, 10 housing, 13 installation surface, 14 accommodating part, 20 top plate, 30 decorative frame, 40 power supply device, 52 light emitting element,

Claims (2)

一方の面に発光素子が実装された基板と;
前記基板の他方の面が設置される設置面と、長手方向が前記設置面と略平行かつ少なくとも一部が当該基板と重ならない位置に形成される底壁を底面とし、前記底壁の周縁部から延伸した側壁を側面とする内部空間に該当する収容部を一体に形成された筺体と;
前記筺体の収納部に配設され、前記設置面に設置された基板に電力を供給する電源装置と;
前記収容部底壁の裏側には、筐体の外面から一定間隔で互いに平行に一体に突設され放熱フィンと;
を具備する照明装置。
A substrate having a light emitting element mounted on one side;
An installation surface on which the other surface of the substrate is installed, and a bottom wall formed in a position where the longitudinal direction is substantially parallel to the installation surface and at least a portion does not overlap the substrate, and a peripheral portion of the bottom wall A housing integrally formed with an accommodating portion corresponding to an internal space having a side surface extending from the side wall;
A power supply device that is disposed in the housing portion of the housing and supplies power to a substrate installed on the installation surface;
A heat dissipating fin projecting integrally from the outer surface of the housing in parallel with each other at regular intervals on the back side of the housing bottom wall;
A lighting device comprising:
前記電源装置基板は、前記収容部の底壁に形成された側壁の高さよりも小さい高さを有する一対のねじ台に搭載され、底壁と電源基板間に間隔をあけて収容部内に配設されていることを特徴とする請求項1記載の照明装置。   The power supply substrate is mounted on a pair of screw bases having a height smaller than the height of the side wall formed on the bottom wall of the housing portion, and is disposed in the housing portion with a space between the bottom wall and the power supply substrate. The lighting device according to claim 1, wherein
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