JP2010016003A - Illumination device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination device in which heat dissipation performance is improved without enlarging a plane shape of the device body, which is suitable for installation utilizing an embedded hole already opened in a ceiling, and in which the number of components is reduced. <P>SOLUTION: A downlight 1 includes the device body 5, a light source 21 in which an LED 23 is implemented on a light source substrate 22, and a power supply device 41. The body 5 includes a bottom wall 8, a pair of plane sidewall parts 10a, 10b partitioning a substrate housing part 5a erected upward from this bottom wall 8 with the upper end open together with this bottom wall 8 and opposing to each other, and wall parts 10c, 10c mutually connecting both ends in the width direction of this pair of sidewall parts 10a, 10b, and equipped with a plurality of heat dissipation fins 15, 16 protrudingly installed on an approximately rectangular-shaped annular sidewall 10 with the sidewall parts 10a, 10b in the longitudinal direction when seen from above and all of the external surface of at least the pair of sidewall parts 10a, 10b of the annular sidewall 10 and extending in the longitudinal direction. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an illumination device such as a downlight that includes a light source having a semiconductor light emitting element such as an LED (light emitting diode) and is used by being embedded in a ceiling or the like.

  Conventionally, an LED mounting substrate, a heat transfer means, and a DC power supply circuit are accommodated in a substantially bottomed cylindrical resin or metal cover having an opening on the upper side, and a lens is attached to the opening surface of the cover. There is known an LED lighting device in which a power terminal block for receiving a commercial power source is provided below the bottom surface (see, for example, Patent Document 1).

  In this LED lighting device, the LED mounting board disposed horizontally in the cover has a plurality of LED elements on the surface facing the lens of the disk-shaped printed board on which the aluminum plate is integrally attached on the back surface, It is formed by mounting a plurality of electronic components that control this. The heat transfer means is in the shape of a disk processed from a metal material such as aluminum, and the surrounding rising wall is screwed to the cover so that heat can be dissipated, and the bottom surface of the LED mounting board is attached to the bottom of the heat transfer means. An aluminum plate is installed. The DC power supply circuit is formed by mounting circuit components on a printed wiring board having a disk shape substantially equivalent to the LED mounting board, and this DC power supply circuit is disposed in the cover substantially parallel to the LED mounting board. Yes.

JP 2004-55800 A (paragraphs 0019-0027, FIGS. 1 to 5)

  The LED lighting device of Patent Document 1 is not used as a downlight embedded in a ceiling. However, when such use is considered, it is replaced with an existing downlight and is already embedded in the ceiling. Consideration that can be installed and used in the hole is required.

  By the way, in an illuminating device such as a downlight provided with a light source having an LED, an increase in output of the LED used for the illumination device is being promoted. The higher the output of the LED, the higher the heat generated by the LED, so that a heat dissipation characteristic commensurate with that is required.

  However, in the LED lighting device of Patent Document 1 in which the LED mounting substrate and the DC power supply circuit are arranged in parallel and substantially horizontally in the cover, the outer peripheral surface of the bottomed cylindrical cover is used as a heat dissipation surface. Therefore, although the heat radiation area can be increased by increasing the diameter of the cover, this may not satisfy the above consideration.

  Moreover, since the LED lighting device of Patent Document 1 uses heat transfer means that guides the heat generated by the LED to the cover, the number of parts and the number of assembly steps are increased and the cost is high.

  The object of the present invention is to improve the heat dissipation performance without enlarging the planar shape of the main body of the apparatus, and is suitable for installation using the embedded hole already opened in the ceiling, and reduces the number of parts. It is to provide a lighting device that can be reduced.

  The lighting device according to the first aspect of the present invention includes a bottom wall, a pair of flat wall portions that stand up upward from the bottom wall and have an upper end open, and that define the substrate wall together with the bottom wall and face each other. An annular side wall having a substantially rectangular shape with the side wall portion as a longitudinal direction when viewed from above, and at least an outer surface of the pair of side wall portions of the annular side wall. An apparatus main body provided with a plurality of heat dissipating fins protruding integrally and extending in the vertical direction; a light source substrate disposed on a lower surface of the bottom wall; and a light source having a semiconductor light emitting element mounted on the light source substrate; And a power supply device that is formed by mounting a plurality of electrical components for controlling the lighting current of the element on a power supply board and disposed in the board housing portion.

  In the first aspect of the present invention, the annular side wall and the bottom wall of the apparatus main body are preferably integrally formed in order to reduce the number of parts and reduce the resistance of heat conduction. The structure with which the bottom wall was assembled may be sufficient. According to the first aspect of the present invention, at least the bottom wall and the annular side wall of the apparatus main body may be formed of a metal, for example, a metal excellent in thermal conductivity, specifically aluminum or an alloy thereof, In the case of manufacturing, this top plate is preferable in that a heat radiation area can be secured.

  In the invention of claim 1, the light source substrate can be suitably used a metal-based substrate whose back surface is made of metal, in addition to a substrate made of an insulating material, and when using this metal-based substrate, The metal back surface may be disposed in close contact with the bottom wall bottom surface of the apparatus main body. In the invention of claim 1, a chip-like LED, an organic EL element, or the like can be used as the semiconductor light emitting element.

  According to the first aspect of the present invention, the electric component of the power supply device is mounted on one side or both sides of the power supply board. In the invention of claim 1, the power supply board is preferably arranged vertically so as to be perpendicular to the bottom wall of the apparatus main body in order not to increase the planar shape of the apparatus main body. Instead, it may be arranged horizontally so as to be parallel to the bottom wall. In the latter case, if necessary, a plurality of power supply boards can be prepared, and these can be arranged in multiple stages in the upper and lower sides and arranged in the origin accommodating portion.

  The lighting device according to the first aspect of the present invention is used by being installed in an embedded state in which the device main body is inserted into an existing or new embedded hole provided in an installation portion such as a ceiling. For example, in the case where a pair of mounting springs are provided as in the invention of the second aspect, the installation state may be held by these springs. When the mounting spring is not provided, the lower end portion of the lighting device is mounted. What is necessary is just to hold | maintain with the attachment screw screwed into the to-be-installed part through upward.

  In the first aspect of the present invention, since the pair of flat side wall portions opposed to each other are formed on the annular side wall of the apparatus main body, and the plurality of radiating fins project from the outer surface, the planar shape of the apparatus main body can be enlarged. In addition, the heat radiation performance can be improved as the heat radiation area of the apparatus main body can be increased. Therefore, when the lighting device of the invention of claim 1 is replaced with, for example, an existing lighting device such as an existing downlight that is embedded in a ceiling, the lighting device of the invention of claim 1 It can be installed by being inserted into a hole embedded in the ceiling.

  According to the first aspect of the present invention, the light source substrate of the light source may be brought into close contact with the lower surface of the bottom wall of the apparatus main body. In this case, the heat generated by the semiconductor light emitting element can be directly transmitted from the light source to the apparatus main body, and no relay member is required for this heat conduction, so the number of parts can be reduced.

  According to a second aspect of the present invention, in the first aspect of the present invention, the pair of attachment springs can be moved over a free position disposed obliquely with respect to the apparatus main body and a position disposed upright along the side portion of the apparatus main body. These mounting springs are arranged on both sides of the annular side wall so that the annular side wall is sandwiched from the width direction of the flat side wall part when arranged so as to be along the side part of the apparatus main body. It is characterized by that.

  In the invention of claim 2, the width direction of the flat side wall portion is a direction perpendicular to the vertical direction of the side wall portion, and more precisely, refers to a direction in which the side wall portion extends when the lighting device is viewed from above. Yes.

  According to the second aspect of the present invention, when the lighting device is embedded and installed, when the pair of mounting springs are erected along the side of the device body, the mounting springs project against the flat side wall portion of the annular side wall. Do not hit the heat dissipating fins. Thereby, it is not necessary to shorten the heat radiation fin projecting from the flat side wall portion of the apparatus main body in relation to the pair of attachment springs, and the heat radiation area of the apparatus main body can be sufficiently secured.

  According to a third aspect of the present invention, in the first or second aspect, the apparatus main body includes a top plate that is fixed to the annular side wall by closing an open upper end of the substrate housing portion, and a substrate is attached to a lower surface of the top plate. A member is fixed, and an upper end portion of the power supply board is connected to the board mounting member to support the power supply apparatus, and the power supply board of the power supply apparatus has one surface thereof opposed to the flat side wall portion and the bottom wall. It is characterized by being provided so as to be perpendicular to.

  In the invention of claim 3, the power supply board is disposed with one surface thereof facing the flat side wall portion of the annular side wall. In this arrangement, the power supply substrate and the flat side wall portion are preferably parallel to each other. It does n’t have to be.

  In the invention of claim 3, since the power supply board is supported on the lower side of the top plate, there is no trouble of fixing the power supply board with a long screw penetrating the annular side wall of the apparatus body in the lateral direction, and the power supply apparatus is assembled from above. The assembly workability is good. Further, since the power supply substrate is supported on the top plate via the substrate mounting member, it is not necessary to provide the top plate with a cut-and-raised portion corresponding to the substrate mounting member. Can prevent dust from entering.

  Furthermore, when the annular side wall has a pair of flat side walls facing each other as described above, the cross-sectional area of the substrate housing portion along the direction orthogonal to the height direction of the apparatus main body is a circular cross section. Smaller. Nevertheless, in the invention of claim 3, since the power supply device is accommodated vertically in the substrate housing portion, when the power supply substrate of the power supply device is one, the size of the power supply substrate is, for example, that of the light source. The power supply device having this power supply substrate can be accommodated in the substrate accommodating portion without enlarging the planar shape of the device main body even if the size becomes necessary for high output as the output increases. .

  According to the invention of claim 1, the heat dissipation performance can be improved without enlarging the planar shape of the apparatus main body, and it is suitable for installation using the embedded hole already opened in the ceiling, There is an effect that the number of parts can be reduced.

  According to the invention of claim 2, in the invention of claim 1, there is no need to shorten the heat dissipating fins protruding from the flat side wall portion of the annular side wall in relation to the pair of mounting springs. There is an effect that a sufficient heat radiation area can be secured.

  According to the invention of claim 3, in the invention of claim 1 or 2, the power supply device can be assembled from above, and the assembly workability is good, and external dust enters the board housing portion in which the power supply device is housed. In addition, there is an effect that a power supply device having a required size can be accommodated in the apparatus main body without enlarging the planar shape of the apparatus main body.

The perspective view which shows the downlight which concerns on one Embodiment of this invention seeing from diagonally upward. The top view which shows the downlight of FIG. The expanded sectional view of the downlight shown along F3-F3 line in FIG. The bottom view which shows the downlight of FIG. The side view which shows the downlight of FIG. The perspective view which decomposes | disassembles and shows the downlight of FIG. The top view which shows the downlight of FIG. 1 in the state except the top plate. The perspective view which shows the power supply device with which the downlight of FIG. 1 is provided. The perspective view which shows the downlight of FIG. 1 seeing from diagonally downward in the state which notched some components.

  An embodiment of the present invention will be described with reference to FIGS.

  Reference numeral 1 in the drawing denotes an illumination device of this embodiment, for example, a downlight. The downlight 1 is installed in the installation portion shown in FIG. 3, for example, the indoor ceiling 2, and reference numeral 3 in FIG. 3 indicates an embedded hole in the ceiling 2. The embedding hole 3 is a hole that has been removed from an existing downlight or a hole that has been newly opened.

  The downlight 1 includes an apparatus main body 5, a light source 21, a first light distribution control member such as a reflector 25, a second light distribution control member such as a baffle 31, a translucent plate 37, a power supply device 41, A terminal block 51 and a pair of mounting springs 55 are provided.

  The apparatus main body 5 includes a main body main part 6 and a top plate 7. The main body main part 6 is an integrally molded product of metal such as aluminum, and the top plate 7 is made of metal such as iron plate.

  As shown in FIGS. 1, 3, 5, 9, and the like, the main body 6 includes a bottom wall 8, a lower annular side wall 9, an upper annular side wall 10, and a plurality of radiating fins 15 and 16. I have. As seen from above, the bottom wall 8 is substantially circular as shown in FIG. The bottom wall 8 is provided horizontally so as to partition the lower annular side wall 9 and the upper annular side wall 10.

  The lower annular side wall 9 is made of a short cylinder and has a diameter smaller than that of the bottom wall 8. The lower annular side wall 9 and the bottom wall 8 define a light source accommodation portion. On the outer periphery of the lower annular side wall 9, a plurality of vertical fins 9a are provided at predetermined intervals in the circumferential direction. The lower annular side wall 9 having the fins 9 a contributes to increasing the heat radiation area of the apparatus main body 5.

  Horizontal connecting portions 9b having screw through holes are formed at a plurality of locations on the lower edge of the lower annular side wall 9 that are opened. On the upper side of these connecting portions 9b, there are provided reliefs 9c for allowing the connection screws 33 to be inserted into the screw through holes from above, and the upper ends of the reliefs 9c are open to the peripheral edge of the bottom wall 8. Has been.

  Positioning projections 9d (only one is shown in FIGS. 3 and 9) are provided at a plurality of locations on the inner peripheral surface of the lower annular side wall 9. These positioning projections 9d are formed by longitudinal ribs.

  The upper annular side wall 10 is erected upward from the bottom wall 8 and defines the substrate housing portion 5a whose upper end is opened together with the bottom wall 8 (see FIG. 6). As shown in FIGS. 6 and 7, the annular side wall 10 has, for example, a pair of flat side wall portions 10a and 10b in a part thereof. These side wall portions 10a and 10b are provided on both sides of an arbitrary straight line (not shown) passing through the center of the bottom wall 8 so as to be parallel to the straight line. Both ends in the width direction of the side walls 10a, 10b are connected to one end by the walls 10c. Therefore, the board | substrate accommodating part 5a has comprised the substantially rectangular shape when the annular side wall 10 is seen from upper direction, as shown in FIG. The board | substrate accommodating part 5a and the said light source accommodating part are connected by the through-hole 8a (refer FIG.3 and FIG.9) formed in the bottom wall 8. FIG.

  As shown in FIGS. 6 and 7, the annular side wall 10 is provided with a through groove 11 and a plurality of screw holes 12. The through groove 11 is provided in the side wall 10b so as to open to the upper end surface of the wall. The screw hole 12 is provided in a pair of wall portions 10c connecting the side wall portions 10a and 10b of the annular side wall 10 so as to open to the upper end of the wall portion 10c.

  Grooves 13 that extend in the vertical direction and open at the upper end of the wall 10c are formed on the inner surfaces of the annular side walls 10 facing each other. As shown in FIGS. 3 and 6, the lower end of each groove 13 is gradually narrowed to form a substantially Y-shaped substrate holding end 13a. Support ribs 14 positioned between these grooves 13 and extending in the up-down direction project from the inner surface of the side wall portion 10a of the annular side wall 10 as shown in FIGS.

  A plurality of heat radiating fins 15 project from the outer surface of the annular side wall 10, specifically, the outer surface of the side wall portion 10 a at regular intervals over the entire length in the width direction. Similarly, a plurality of heat radiating fins 16 project from the outer surface of the side wall 10b except for the central portion in the width direction. These radiating fins 15 and 16 protrude from the side wall portions 10a and 10b so as not to protrude from the peripheral edge of the bottom wall 8 when the apparatus main body 5 is viewed from above as shown in FIGS. Each radiation fin 15, 16 extends in the vertical direction, and the lower end thereof is integrally connected to the bottom wall 8.

  The shape drawn through the projecting ends of the radiating fins 15 and 16 and the outer surface of the wall portion 10c is substantially circular, and the size of the planar shape when the apparatus main body 5 is viewed from above is determined by the diameter of the virtual circle. Is stipulated. The diameter of the virtual circle is smaller than the embedded hole 3 in the ceiling 2.

  As shown in FIG. 6, the top plate 7 of the apparatus main body 5 includes a horizontal closing plate portion 7a and a cover plate portion 7b bent substantially vertically from the central portion of one side edge of the closing plate portion 7a. . The closing plate portion 7 a is formed to have a size that covers the substrate housing portion 5 a, and the cover plate portion 7 b is formed to have a size sufficient to cover the passage groove 11.

  The top plate 7 is fixed to the annular side wall 10 by a metal fixing screw 17 screwed into the screw hole 12 from above with the peripheral portion thereof being in contact with the upper end surface of the annular side wall 10 to open the substrate housing portion 5a. The upper end is closed. The cover plate portion 7b of the top plate 7 attached in this way is disposed between the radiation fins 16 so as to cover the upper outer surface of the side wall portion 10b as shown in FIG. Therefore, the wiring groove 11 is covered and covered by the cover plate portion 7b, and the cover plate portion 7b does not contact the side wall portion 10b, and a gap g communicating with the wiring groove 11 is formed therebetween. Has been.

  As shown in FIG. 3, the light source 21 includes a light source substrate 22 and a plurality of semiconductor light emitting elements such as LEDs 23 mounted on the light source substrate 22.

  The light source substrate 22 has a circular shape, and is disposed in the light source accommodating portion with the back surface on which the LED 23 is not mounted being in close surface contact with the lower surface of the bottom wall 8. In this arrangement, the light source substrate 22 is positioned by engaging with the positioning protrusions 9d.

  As shown in FIG. 4, the plurality of LEDs 23 are provided at regular intervals around the center of the light source substrate 22. These LEDs include, for example, an LED chip that emits blue light, a reflector that surrounds the chip, and a translucent sealing resin containing a phosphor that is filled in the reflector and seals the LED chip. Has been. The phosphor mixed in the sealing resin is a yellow phosphor that is excited by the blue light emitted from the LED chip and mainly emits yellow light that is complementary to the blue light. ing. Therefore, each LED 23 projects white light.

  The reflector 25 that controls the light distribution of the light emitted from the LED 23 is disposed below the light source 21 in the light source housing as shown in FIG. In this arrangement, the reflector 25 is positioned by engaging with the positioning protrusions 9d. As shown in FIGS. 3 and 4, the reflector 25 has the same number of reflecting mirror portions 26 whose lower ends are opened as the LEDs 23, and has a screw receiving boss 27 on the back surface of the central portion as shown in FIG. ing. The reflector 25 is fixed to the light source housing portion by a mounting screw 28 screwed into a screw receiving boss 27 through the bottom wall 8 and the center portion of the light source substrate 22. Further, along with this fixing, the peripheral portion of the reflector 25 sandwiches the peripheral portion of the light source substrate 22 with the bottom wall 8. Thereby, the light source 21 is fixed to the light source accommodating portion in a state where the back surface of the light source substrate 22 is in surface contact with the lower surface of the bottom wall 8.

  The baffle 31 is made of, for example, a white synthetic resin and has upper and lower ends opened as shown in FIG. The shape of the baffle 31 when viewed in the vertical direction is circular. The diameter of the upper end of the baffle 31 is substantially the same as the diameter of the lower annular side wall 9, and the baffle 31 is formed so as to gradually increase in diameter toward the lower end opening. The baffle 31 has an annular flange 32 (see FIG. 3) protruding outward at the lower end thereof. The annular flange 32 has a larger diameter than the embedded hole 3 in the ceiling 2, and is hooked from below around the embedded hole 3 in a state where the downlight 1 is embedded in the ceiling 2.

  As shown in FIG. 3, the baffle 31 is disposed below the lower annular side wall 9 and is connected to the lower end of the apparatus main body 5 by a connecting screw 33 screwed into the upper end of the baffle 31 through the connecting portion 9b. Has been. A ring-shaped elastic packing 34 is bonded to the upper end of the baffle 31. The elastic packing 34 is sandwiched between the upper end portion of the baffle 31, the lower surface of the lower annular side wall 9, and the lower portion of the peripheral portion of the reflector 25 as the baffle 31 is screwed to the apparatus main body 5. The elastic packing 34 can be omitted.

  A translucent plate 37 is supported on the baffle 31 so as to be located inside the baffle 31. The translucent plate 37 is sandwiched between the upper end portion of the baffle 31 and the lower surface of the peripheral portion of the reflector 25 as the baffle 31 is screwed to the apparatus main body 5. The translucent plate 37 is made of a transparent acrylic resin plate or the like, and electrically insulates the light source 21 from below. 3 indicates an annular step formed on the inner periphery of the upper end of the baffle 31, and a diffusion plate (not shown) for covering the light transmitting plate 37 from below is fitted to the step 31a as necessary. It is supported together. The diffusion plate is made of a diffusion-permeable resin material that forms milky white or the like.

  As shown in FIGS. 3 and 7, the power supply device 41 is accommodated in the substrate accommodating portion 5a. The power supply device 41 is formed by mounting a plurality of electrical components 43 on a power supply substrate 42. The power supply board 42 has a quadrangular shape (see FIG. 8), and its height dimension is slightly shorter than the height dimension of the annular side wall 10 as shown in FIG. 3, and the width dimension is flat as shown in FIG. It is a little longer than the width dimension of the side wall part 10a (in other words, the dimension between the inner surfaces of the opposing wall part 10c). Each electrical component 43 controls the lighting current of the LED 23, and is mainly mounted on one surface of the power supply board 42, but partially mounted on the other surface of the power supply board 42 as shown in FIG. ing

  The power supply device 41 is supported on the back surface of the top plate 7. That is, as shown in FIGS. 3 and 6, a board mounting member, for example, an L-shaped metal fitting 45 having a thickness smaller than that of the top plate 7 and capable of elastic deformation is fixed by a screw 46, and a vertical plate portion of the L-shaped metal fitting 45 is fixed. The upper edge portion of the power supply substrate 42 is connected to the screw 45 a by a screw 47. For this reason, the power supply device 41 is supported so as to be suspended under the top plate 7 via the L-shaped bracket 45.

  Therefore, as described above, when the top plate 7 is attached to the main body main portion 6 with the fixing screw 17, the power supply device 41 is accommodated in the substrate accommodating portion 5a. In this case, both end edges in the width direction of the power supply board 42 are inserted into the groove 13 of the main body 6 and are fitted into the substrate holding end portion 13a of the groove 13 just before the end of the insertion. It is arranged vertically so as to be perpendicular to the wall 8. The power supply device 41 and the light source 21 are electrically connected to each other by an insulation-coated electric wire (not shown) that extends over them and is wired through the through-hole 8a.

  The power supply device 41 accommodated in the substrate accommodating portion 5a is provided with the power supply substrate 42 brought close to the flat side wall portion 10a. Moreover, the main component mounting surface (the one surface) of the power supply substrate 42 is opposed to the flat side wall portion 10a with a necessary insulation distance between the electrical component 43 mounted on this surface, and similarly, The other surface of the power supply substrate 42 is opposed to the flat side wall portion 10b with a necessary insulating distance from the electrical component 43 mounted on this surface. Each electrical component 43 is also separated from the bottom wall 8 and wall portion 10c of the main body 6 by the necessary insulation distance from the top plate 7 and the L-shaped bracket 45.

  As shown in FIG. 7, the support rib 14 of the main body 6 is slightly in contact with the other surface of the power supply substrate 42 in the substrate housing 5a. Due to this and the fitting of the power supply substrate 42 to the substrate holding end portion 13a, the power supply substrate 42 is prevented from being inadvertently shaken by vibration or the like. Note that there is no circuit pattern in the electrical components at and around the portion where the support rib 14 is in contact, thereby providing necessary electrical insulation. Since the L-shaped bracket 45 can be elastically deformed as described above, if the power supply substrate 42 is deformed during lighting, the L-shaped bracket 45 is elastically deformed following the deformation. ing.

  Since the power supply board 42 is supported on the lower side of the top plate 7 as described above, when assembling the downlight 1, the power supply board 42 is fixed with a long screw penetrating the annular side wall 10 of the apparatus body 5 in the lateral direction. Since the power supply device 41 can be assembled from above without the hassle of making it, assembly workability is good. Further, since the power supply substrate 42 is supported on the top plate 7 via the L-shaped bracket 45, it is not necessary to provide the top plate 7 with a cut-and-raised portion corresponding to the L-shaped bracket 45, and the sealing property of the substrate housing 5a. Can be secured. Therefore, as in the case where a cut-and-raised portion is provided, it is possible to prevent external dust from entering the substrate housing portion 5a in which the power-supply device 41 is housed through the cut-and-raised trace. .

  Among the electrical components 43 mounted on the power supply substrate 42 that is vertically disposed so as to be perpendicular to the bottom wall 8, as shown in FIG. 8, a leaded component 43 a such as a metal oxide film resistor, the LED 23. In order to adapt to higher output, an electrolytic capacitor 43b that is large and heavy, a transformer 43c that is heavy, and the like are used.

  The leaded component 43 a is mounted on the central portion of the power supply substrate 42. Therefore, even if the lead of the lead-equipped component 43a is deformed so as to tilt obliquely with respect to the power supply substrate 42 due to vibration or the like, at least the lead of the lead-equipped component 43a is a metal device body 5 main body. It is possible to eliminate the risk of a ground fault coming into contact with the inner surface of the main portion 6.

  Furthermore, the weight of the electrolytic capacitor 43 b and the transformer 43 c is heavier than that of the other electrical components 43. Among these, in this embodiment, the electrolytic capacitor 43b is mounted on the upper part of the power supply substrate 42 arranged vertically. Here, the upper part of the power supply board 42 indicates a part above the half of the height dimension of the power supply board 42.

  As a result, the electrolytic capacitor 43b, which is a heavy electrical component, is brought closer to the suspension source side of the power supply substrate 42 suspended from the top plate 7 via the L-shaped bracket 45. Therefore, when the substrate holding end 13a is omitted and the power supply substrate 42 is suspended so that the lower end portion of the power supply substrate 42 becomes a free end, or when the end of the power supply substrate 42 is fitted to the substrate holding end 13a. When the gap is large, when vibration is applied, the moment with respect to the L-shaped metal fitting 45 that functions as the suspending source of the power supply substrate 42 is reduced, so that the stress on the suspending portion of the power supply substrate 42 can be reduced. For this reason, it is preferable to mount the transformer 43c on the upper part of the power supply board 42 arranged vertically.

  It is known that the electrolytic capacitor 43b is an electrical component that easily deteriorates in performance due to its temperature rise and is weak against heat, and the lifetime of the downlight 1 may be defined by the lifetime of the electrolytic capacitor 43b. As described above, the electrolytic capacitor 43b is mounted on the upper part of the power supply substrate 42 arranged vertically, and is separated from the light source 21 which is a heat generation source. Thereby, it is possible to prevent the electrolytic capacitor 43b from being deteriorated by the heat of the LED 23, and to prevent the durability of the power supply device 41 from being lowered accordingly.

  The terminal block 51 is used to relay the supply of commercial AC power (not shown) to the power supply device 41. As shown in FIG. 2 and the like, the terminal block 51 is disposed on the side surface of the apparatus main body 5 on the outer surface of the apparatus main body 5, preferably on the side opposite to the flat side wall portion 10 a with the power supply substrate 42 as a boundary. Specifically, it is mounted on the upper portion of another flat side wall portion 10b so as to be positioned between the radiation fins 16 protruding from the side wall portion 10b. The upper end of the terminal block 51 is substantially the same as or lower than the upper end of the apparatus main body 5. An insulation covered electric wire (not shown) drawn from the lower surface of the terminal block 51 is introduced into the substrate housing part 5 a through the wire groove 11 through the gap g and connected to the power supply device 41.

  According to such an arrangement of the terminal block 51, the terminal block 51 is arranged within the range of the height of the apparatus main body 5. For this reason, compared with the case where the terminal block 51 is arrange | positioned on the top plate 7, it can reduce in size so that the height of the downlight 1 may not become high with the terminal block 51. FIG. Accordingly, since the downlight 1 is a shallow instrument having a low height, even when the space on the back side of the ceiling 2 is narrow, it may cause interference with components such as pipes arranged on the back of the ceiling. The downlight 1 can be properly embedded and installed.

  Further, as described above, the flat side wall portions 10a and 10b are offset toward the center side with respect to the substantially circular virtual circle drawn through the projecting ends of the radiation fins 15 and 16 and the outer surface of the wall portion 10c. Is provided. Therefore, the protrusion of the terminal block 51 attached to the outer surface of the side wall portion 10b to the outside with respect to the virtual circle is small. Thereby, the size of the planar shape including the terminal block 51 when the apparatus main body 5 is viewed from above can be prevented from becoming larger than the ceiling-shaped embedding hole 3.

  A pair of spring mounting portions 38 are formed on the outer surface of the baffle 31 so as to be positioned directly below the two wall portions 10 c of the apparatus main body 5. The lower end portion of the attachment spring 55 made of a metal leaf spring is attached to the spring attachment portions 38. Thus, the pair of attachment springs 55 are arranged corresponding to the radial direction of the baffle 31.

  The attachment spring 55 has a bent free end 55a. These mounting springs 55 are disposed at an oblique position with respect to the apparatus main body 5 as shown by a solid line in FIG. 5, and as shown by a two-dot chain line in FIG. It is possible to move along the outer surface. When the pair of attachment springs 55 are erected, the distance A between the free end portions 55a is equal to or less than the diameter of the embedded hole 3.

  The downlight 1 is inserted into the existing embedded hole 3 of the ceiling 2, for example, with the pair of mounting springs 55 elastically deformed and positioned as indicated by the two-dot chain line in FIG. By pushing up until it hits 2, it can be embedded in the ceiling 2. In this case, as the downlight 1 is pushed up, the pair of mounting springs 55 are gradually restored obliquely, so that the root portion of the mounting spring 55 and the annular flange 32 sandwich the edge of the embedded hole 3, The embedded installation state of the downlight 1 is maintained.

  In such installation of the downlight 1, when the pair of mounting springs 55 are erected along the side of the apparatus main body 5 as described above, the free end 55 a side of the mounting spring 55 is connected to the main body 6. Since it is received by the wall 10c, the mounting spring 55 does not hit the heat radiation fins 15 and 16 projecting from the flat side walls 10a and 10b of the apparatus body 5.

  If the free end 55a side of the mounting spring 55 is received by the heat radiating fins 15 and 16, the protruding width of the free end 55a with respect to the virtual circle is increased, and the apparatus main body 5 is inserted into the embedded hole 3. At this time, it is conceivable that the free end 55 a is caught in the embedded hole 3. In this case, it is necessary to shorten the heat radiation fins 15 and 16.

  However, since the wall 10c of the main body 6 is provided at a right angle with respect to the protruding direction of the radiating fins 15 and 16, it protrudes from the flat side walls 10a and 10b in relation to the pair of mounting springs 55. There is no need to shorten the radiating fins 15 and 16. Therefore, a sufficient heat radiation area in the apparatus main body 5 can be ensured.

  Each LED 23 of the light source 21 generates heat when the downlight 1 is turned on. The heat of the LED 23 is transmitted from the light source substrate 22 to the apparatus main body 5 and released from the apparatus main body 5 into the atmosphere, so that the temperature rise of each LED 23 can be suppressed. In this case, since the light source substrate 22 is in close surface contact with the lower surface of the bottom wall 8 of the apparatus main body 5 directly, the heat generated by the LED 23 can be directly transmitted from the light source 21 to the apparatus main body 5. No relay member is required. Accordingly, the downlight 1 has a small number of parts related to heat dissipation and a reduction in the number of assembly steps, so that the cost can be reduced and the structure can be simplified.

  In the downlight 1 having the above-described configuration, flat side wall portions 10a and 10b are formed on a part of the annular side wall 10 of the apparatus main body 5 made of metal, and a plurality of radiating fins 15 and 16 project from the outer surface thereof. . Therefore, compared with the case where the radiating fins are provided on the outer surface of the main body of the cylindrical body under the condition that the size of the virtual circle is limited in relation to the existing embedded holes, the radiating fins 15 and 16 are longer. The length can be secured for a long time.

  Thereby, as the heat radiation area of the device main body 5 can be increased by the plurality of heat radiation fins 15 and 16, the heat radiation performance can be improved without enlarging the planar shape of the device main body 5. In addition, since the top plate 7 is made of metal and is in contact with the upper end of the main body main portion 6, the heat of the main body portion 6 is conducted to the top plate 7. Heat dissipation performance can be improved.

  Furthermore, as described above, since the annular side wall 10 has the flat side wall portions 10a and 10b in part, the cross-sectional area of the substrate housing portion 5a along the direction orthogonal to the height direction of the apparatus body 5 is circular. It becomes smaller than the case of a cross section. Nevertheless, since the power supply device 41 is accommodated in the substrate accommodating portion 5a with the power supply substrate 42 in the vertical direction, the size of the light source 21 becomes necessary for increasing the output with the increase in the output of the light source. Even if it is the power supply device 41, while being accommodated in the board | substrate accommodating part 5a, the enlargement of the planar shape of the apparatus main body 5 is not accompanied by this accommodation. Therefore, it is suitable when the downlight 1 is replaced with, for example, an existing lighting device such as an existing downlight embedded in the ceiling, and the device body 5 of the downlight 1 is already embedded in the ceiling 2. The downlight 1 can be installed by inserting it into the unit 3.

DESCRIPTION OF SYMBOLS 1 ... Downlight (illuminating device), 5 ... Apparatus main body, 5a ... Substrate accommodating part, 7 ... Top plate, 8 ... Bottom wall, 10 ... Annular side wall, 10a, 10b ... Flat side wall part, 10c ... Annular side wall , Radiating fins, 21 ... light source, 22 ... light source substrate, 23 ... LED (semiconductor light emitting device), 41 ... power supply device, 42 ... power supply substrate, 45 ... L-shaped bracket (substrate mounting member), 55 ... Mounting spring

Claims (3)

A bottom wall, a substrate housing portion that is erected upward from the bottom wall and has an open upper end is partitioned together with the bottom wall, and a pair of flat side walls facing each other and both ends in the width direction of the pair of side walls are connected. An annular side wall having a substantially rectangular shape with the side wall portion as a longitudinal direction when viewed from above, and at least one pair of side wall portions of the annular side wall projecting integrally and extending in the vertical direction An apparatus body comprising a plurality of heat dissipating fins;
A light source substrate disposed on the lower surface of the bottom wall and a light source having a semiconductor light emitting element mounted on the light source substrate;
A power supply device formed by mounting a plurality of electrical components for controlling a lighting current of the semiconductor light emitting element on a power supply board and disposed in the board housing portion;
An illumination device comprising:   A pair of mounting springs that are movable over a free position that is obliquely disposed with respect to the apparatus main body and a position that is disposed upright along a side portion of the apparatus main body are provided. 2. The illumination according to claim 1, wherein the annular side wall is disposed on both sides of the annular side wall so as to be sandwiched from the width direction of the flat side wall portion when arranged upright along the side portion of the flat side wall portion. apparatus.   The apparatus main body includes a top plate that is fixed to the annular side wall by closing an open upper end of the substrate housing portion, a substrate mounting member is fixed to a lower surface of the top plate, and the power supply substrate is connected to the substrate mounting member. The upper end portion is connected to support the power supply device, and the power supply board of the power supply device is provided so that one surface thereof faces the flat side wall portion and is perpendicular to the bottom wall. The lighting device according to claim 1 or 2, characterized in that

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