JP2016025097A5 - - Google Patents

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Publication number
JP2016025097A5
JP2016025097A5 JP2014145775A JP2014145775A JP2016025097A5 JP 2016025097 A5 JP2016025097 A5 JP 2016025097A5 JP 2014145775 A JP2014145775 A JP 2014145775A JP 2014145775 A JP2014145775 A JP 2014145775A JP 2016025097 A5 JP2016025097 A5 JP 2016025097A5
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JP
Japan
Prior art keywords
main body
liquid cooling
face material
flow paths
heating element
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Application number
JP2014145775A
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English (en)
Japanese (ja)
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JP6248841B2 (ja
JP2016025097A (ja
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Priority to JP2014145775A priority Critical patent/JP6248841B2/ja
Priority claimed from JP2014145775A external-priority patent/JP6248841B2/ja
Priority to PCT/JP2015/065522 priority patent/WO2016009727A1/ja
Priority to CN201580038149.1A priority patent/CN106537585B/zh
Priority to TW104118708A priority patent/TWI605236B/zh
Publication of JP2016025097A publication Critical patent/JP2016025097A/ja
Publication of JP2016025097A5 publication Critical patent/JP2016025097A5/ja
Application granted granted Critical
Publication of JP6248841B2 publication Critical patent/JP6248841B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014145775A 2014-07-16 2014-07-16 液冷ジャケット及び液冷ジャケットの製造方法 Expired - Fee Related JP6248841B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014145775A JP6248841B2 (ja) 2014-07-16 2014-07-16 液冷ジャケット及び液冷ジャケットの製造方法
PCT/JP2015/065522 WO2016009727A1 (ja) 2014-07-16 2015-05-29 液冷ジャケット及び液冷ジャケットの製造方法
CN201580038149.1A CN106537585B (zh) 2014-07-16 2015-05-29 液体套及液冷套的制造方法
TW104118708A TWI605236B (zh) 2014-07-16 2015-06-10 Liquid cooling jacket and manufacturing method of liquid cooling jacket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014145775A JP6248841B2 (ja) 2014-07-16 2014-07-16 液冷ジャケット及び液冷ジャケットの製造方法

Publications (3)

Publication Number Publication Date
JP2016025097A JP2016025097A (ja) 2016-02-08
JP2016025097A5 true JP2016025097A5 (enrdf_load_stackoverflow) 2017-06-22
JP6248841B2 JP6248841B2 (ja) 2017-12-20

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ID=55271661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014145775A Expired - Fee Related JP6248841B2 (ja) 2014-07-16 2014-07-16 液冷ジャケット及び液冷ジャケットの製造方法

Country Status (1)

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JP (1) JP6248841B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596870B (zh) * 2016-07-18 2017-08-21 大銀微系統股份有限公司 馬達二次側之傳熱機構
JP6616264B2 (ja) * 2016-08-30 2019-12-04 本田技研工業株式会社 冷却器及びそれを備えた冷却装置
CN110771025A (zh) * 2017-05-08 2020-02-07 日产自动车株式会社 电力变换装置的冷却构造
CN114361122B (zh) * 2021-08-11 2025-03-11 华为技术有限公司 功率模块的封装结构及封装方法
CN113941751A (zh) * 2021-10-13 2022-01-18 安徽新富新能源科技有限公司 一种新能源汽车电池包微通道水冷板氮气保护焊接工装
TWI830611B (zh) 2023-03-01 2024-01-21 薩摩亞商塔普林克科技有限公司 整合式散熱模組結構

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0414960Y2 (enrdf_load_stackoverflow) * 1987-02-12 1992-04-03
JP4314738B2 (ja) * 2000-11-24 2009-08-19 株式会社デンソー 積層冷却器
JP5344994B2 (ja) * 2009-05-29 2013-11-20 三菱電機株式会社 ヒートシンク装置
JP2011017516A (ja) * 2009-07-10 2011-01-27 Mitsubishi Electric Corp プレート積層型冷却装置及びその製造方法
EP2525637B1 (en) * 2010-01-12 2020-10-28 Nippon Light Metal Co., Ltd. Liquid-cooled integrated substrate and method for manufacturing liquid-cooled integrated substrate
DE102010007086B4 (de) * 2010-02-06 2013-04-11 Semikron Elektronik Gmbh & Co. Kg Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung
JP5573973B2 (ja) * 2013-01-17 2014-08-20 日本軽金属株式会社 液冷ジャケットの製造方法

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