JP2016021523A - Mounting structure using heat conduction member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure of heat dissipation component, capable of attaining both of excellent cooling performance and convenience in maintenance work.SOLUTION: The mounting structure includes a cooling target component 10, a heat dissipation component 30 and a heat conduction component 20. The heat conduction member 20 is arranged between the cooling target component 10 and the heat dissipation component 30 to transmit heat between them. The heat conduction member 20 includes a resin film 21 and a heat conduction sheet 22. The resin film 21 is arranged on the cooling target component 10 side. The heat conduction sheet 22 is arranged on the heat dissipation component 30 side and can be plasticized by heat. The heat dissipation member 30 has a contact part 37 brought into contact with the heat conduction sheet 22 and recesses 51, 61 are formed on the contact part 37. When the heat conduction member 20 is heated in a state where the heat conduction member 20 covers at least a part of the recesses 51, 61 and a part of the plasticized heat conduction sheet 22 is entered into the recesses 51, 61, contact between the heat conduction sheet 22 and the cooling target component 10 is prevented.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a mounting structure using a heat conducting member.

  Electrical circuit components such as power modules that handle large currents in equipment generate heat during use and reach a high temperature. In order to prevent damage due to excessive temperature rise, such heat-generating components are often used in combination with heat-dissipating components such as heat sinks and refrigerant jackets. The heat generated by the heat generating component is transmitted to the heat radiating component that is in direct or indirect contact with the heat generating component, and then released to a relatively low temperature region such as the atmosphere or fluid refrigerant.

  In order to efficiently cool the heat generating component, a thermal interface member that improves heat conduction between the cooling target component including the heat generating component and the heat radiating component is used. Among various thermal interface members, the heat conducting sheet with phase change is easy to handle. This thermal conductive sheet has good thermal conductivity and maintains a flexible sheet form at room temperature, while being plasticized at high temperature. Usually, a heat conductive sheet is arrange | positioned between components to be cooled and heat radiating components, and then heat is applied. As a result, the plasticized heat conductive sheet obtains fluidity and spreads so as to fill in the fine irregularities on the surfaces of the parts to be cooled and the heat radiating parts. Then, when temperature falls, a heat conductive sheet maintains the shape which contacted the cooling object component and the heat radiating component via the wide surface area.

  Equipment maintenance work often involves removal and replacement of components to be cooled and heat dissipation components. If the component to be cooled and the heat radiating component are fixed to each other due to the use of the heat conductive sheet, the maintenance work may be hindered. In order to cope with this problem, a resin film for preventing mutual fixation between the cooling target component and the heat dissipation component is provided on one side of the heat conductive sheet disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 2002-176126). However, if the plasticized heat conductive sheet spreads beyond the outer edge of the resin film, the inconvenience that the parts to be cooled, the heat radiating parts, and other members are fixed to each other is avoided. I can't.

  The subject of this invention is providing the mounting structure of the thermal radiation component which can make the outstanding cooling performance and the convenience on maintenance work compatible.

  A mounting structure for a heat dissipation component according to a first aspect of the present invention includes a first component, a second component, and a heat conduction member. The first component is one of a cooling target component to be cooled and a heat dissipation component having a function of cooling the cooling target component. The second component is one of the cooling target component and the heat dissipation component, and is different from the first component. The heat conducting member is disposed between the first component and the second component, and transfers heat between the first component and the second component. The heat conducting member includes a heat conducting sheet and a resin film. The heat conductive sheet is disposed on the first component side. The resin film is laminated on the heat conductive sheet and disposed on the second component side. The heat conductive sheet is plasticized by heating. The first component has a contact portion that contacts the heat conductive sheet. The contact portion is provided with at least one recess. The heat conduction member is heated with the heat conduction member covering at least a part of the recess, and a part of the plasticized heat conduction sheet enters the recess to prevent contact between the heat conduction sheet and the second component. Is done.

  According to this mounting structure, the heat conductive sheet that has been plasticized to obtain fluidity does not come into contact with the second component. Therefore, even if the heat conductive sheet is subsequently cooled and solidified, the first component and the second component are not fixed to each other.

  As a result, it is possible to remove or replace the first component or the second component without causing damage to the heat conductive sheet or the resin film in the maintenance work of the device.

  The mounting structure of the heat dissipating component according to the second aspect of the present invention is the mounting structure according to the first aspect, wherein the contact portion of the first component is provided with a through hole for accommodating the fixture. The at least one recess includes a fixture protecting recess for preventing contact between the fixture and the plasticized heat conducting sheet.

  According to this mounting structure, the fixture and the heat conductive sheet do not contact each other.

  As a result, it is possible to easily remove the fixture in the maintenance work of the device.

  The mounting structure of the heat dissipating component according to the third aspect of the present invention is the mounting structure according to the second aspect, wherein the through hole is separated from the concave portion for protecting the fixture.

  According to this mounting structure, the fixture protecting recess has, for example, a groove shape.

  The mounting structure of the heat dissipation component according to the fourth aspect of the present invention is the mounting structure according to the second aspect, wherein the through hole extends from the bottom surface of the fixing tool protecting recess.

  According to this mounting structure, the through hole is disposed on the bottom surface of the fixing tool protecting recess.

  A mounting structure for a heat dissipation component according to a fifth aspect of the present invention is the mounting structure according to any one of the first to fourth aspects, wherein at least one recess includes a component outer edge protection recess. The component outer edge protecting recess is for preventing contact between the outer edge of the second component and the plasticized heat conductive sheet. The outer edge of the second component overlaps the concave portion for protecting the outer edge of the component in plan view.

  According to this mounting structure, the outer edge of the second component does not contact the heat conductive sheet.

  As a result, it is possible to prevent the outer edge of the second part from being fixed to the first part.

  The mounting structure of the heat dissipation component according to the sixth aspect of the present invention is the mounting structure according to any one of the first to fourth aspects, wherein the second component is separated from the outer edge of the resin film to the inside of the resin film. ing.

  According to this mounting structure, it can suppress that the plasticized heat conductive sheet which came out from the outer edge of the resin film contacts the 2nd components arrange | positioned in the center of the resin film.

  As a result, it is possible to easily remove or replace the first component or the second component.

  A mounting structure for a heat dissipation component according to a seventh aspect of the present invention includes a first component, a second component, and a heat conduction member. The first component is one of a cooling target component to be cooled and a heat dissipation component having a function of cooling the cooling target component. The second component is one of the cooling target component and the heat dissipation component, and is different from the first component. The heat conducting member is disposed between the first component and the second component, and transfers heat between the first component and the second component. The heat conducting member includes a heat conducting sheet and a resin film. The heat conductive sheet is disposed on the first component side. The resin film is laminated on the heat conductive sheet and disposed on the second component side. The heat conductive sheet is plasticized by heating. In plan view, the resin film protrudes from the outer edge of the heat conductive sheet before plasticization and also protrudes from the outer edge of the heat conductive sheet after plasticization.

  According to this mounting structure, the projecting portion of the resin film suppresses the situation in which the plasticized heat conductive sheet spreads beyond the outer edge of the resin film.

  As a result, it is possible to remove or replace the first component or the second component without causing damage to the heat conductive sheet or the resin film in the maintenance work of the device.

  According to the mounting structure of the heat dissipation component according to the first aspect of the present invention, the first component or the second component can be removed or replaced without causing damage to the heat conductive sheet or the resin film in the maintenance work of the device. Can do.

  According to the mounting structure of the heat dissipating component according to the second aspect of the present invention, it is possible to easily remove the fixture in the maintenance work of the device.

  According to the mounting structure of the heat dissipation component according to the third aspect or the fourth aspect of the present invention, it is possible to prevent the first component, the second component, and the fixture from sticking to each other.

  According to the mounting structure of the heat radiating component according to the fifth aspect of the present invention, it is possible to prevent the outer edge of the second component from being fixed to the first component.

  According to the mounting structure of the heat dissipation component according to the sixth aspect of the present invention, it is possible to easily remove or replace the first component or the second component.

  According to the mounting structure of the heat dissipation component according to the seventh aspect of the present invention, the first component or the second component can be removed or replaced without causing damage to the heat conductive sheet or the resin film in the maintenance work of the device. Can do.

1 is an exploded perspective view of a mounting structure according to a first embodiment of the present invention. It is sectional drawing of the mounting structure before the heating which concerns on 1st Embodiment of this invention. It is sectional drawing of the mounting structure after the heating which concerns on 1st Embodiment of this invention. It is a disassembled perspective view of the mounting structure which concerns on the modification 1A of 1st Embodiment of this invention. It is sectional drawing of the mounting structure before the heating which concerns on the modification 1A of 1st Embodiment of this invention. It is sectional drawing of the mounting structure after the heating which concerns on the modification 1A of 1st Embodiment of this invention. It is a disassembled perspective view of the mounting structure which concerns on 2nd Embodiment of this invention. It is sectional drawing of the mounting structure before the heating which concerns on 2nd Embodiment of this invention. It is sectional drawing of the mounting structure after the heating which concerns on 2nd Embodiment of this invention. It is a disassembled perspective view of the mounting structure which concerns on 3rd Embodiment of this invention. It is sectional drawing of the mounting structure before the heating which concerns on 3rd Embodiment of this invention. It is sectional drawing of the mounting structure after the heating which concerns on 3rd Embodiment of this invention. It is a disassembled perspective view of the mounting structure which concerns on the modification 3A of 3rd Embodiment of this invention. It is sectional drawing of the mounting structure before the heating which concerns on the modification 3A of 3rd Embodiment of this invention. It is sectional drawing of the mounting structure after the heating which concerns on the modification 3A of 3rd Embodiment of this invention. It is a disassembled perspective view of the mounting structure which concerns on 4th Embodiment of this invention. It is sectional drawing of the mounting structure before the heating which concerns on 4th Embodiment of this invention. It is sectional drawing of the mounting structure after the heating which concerns on 4th Embodiment of this invention. It is a disassembled perspective view of the mounting structure which concerns on the modification 4A of 4th Embodiment of this invention. It is sectional drawing of the mounting structure before the heating which concerns on the modification 4A of 4th Embodiment of this invention. It is sectional drawing of the mounting structure after the heating which concerns on the modification 4A of 4th Embodiment of this invention.

<First Embodiment>
1 to 3 show a mounting structure according to the first embodiment of the present invention.

(1) Overall Configuration FIG. 1 is an exploded perspective view of a mounting structure according to the first embodiment. This mounting structure includes a cooling target component 10, a heat conduction member 20, a heat dissipation component 30, and a fixture 40.

(2) Detailed Configuration Each component of the mounting structure will be described with reference to FIG.

(2-1) Parts 10 to be cooled
The component 10 to be cooled is a component that needs to be cooled in order to avoid damage due to excessive temperature rise. The cooling target component 10 includes a heat generating component 11, a heat transfer plate 13, and heat radiation grease 12 existing therebetween. Alternatively, the cooling target component 10 may lack one or both of the heat radiation grease 12 and the heat transfer plate 13.

  The cooling target component 10 is provided with a through hole 15. The through hole 15 penetrates the heat generating component 11, the heat radiation grease 12, and the heat transfer plate 13.

  The cooling target component 10 has a contact portion 17 that contacts the heat conducting member 20.

(2-1-1) Heat-generating component 11
The heat generating component 11 is an electric circuit component that generates heat during use, and is, for example, a semiconductor power module, a driver IC, a power transistor, or the like.

(2-1-2) Heat dissipation grease 12
The heat dissipating grease 12 is a thermal interface member that improves heat conduction between the heat-generating component 11 and the heat transfer plate 13, and has high heat conductivity. The heat dissipating grease 12 is preferably applied to the heat generating component 11 and the heat transfer plate 13 so as to fill in the fine irregularities present on the surfaces.

(2-1-3) Heat transfer plate 13
The heat transfer plate 13 transfers heat received from the heat generating component 11 via the heat dissipation grease 12 to the heat conducting member 20, and is, for example, a metal plate. In the present embodiment, the aforementioned contact portion 17 exists on one surface of the heat transfer plate 13.

(2-2) Thermal conduction member 20
In the present embodiment, the heat conducting member 20 has substantially the same size as the heat transfer plate 13. The heat conductive member 20 includes a laminate of a resin film 21 and a heat conductive sheet 22. The heat conduction member 20 is provided with a through hole 25. The through hole 25 penetrates the resin film 21 and the heat conductive sheet 22.

(2-2-1) Resin film 21
The resin film 21 is for preventing the heat conductive sheet 22 provided on one surface from adhering to a member in contact with the other surface. In this embodiment, the resin film 21 is provided in order to prevent the heat conductive sheet 22 and the cooling target component 10 from sticking to each other.

(2-2-2) Thermal conductive sheet 22
The heat conductive sheet 22 is a thermal interface member that improves heat conduction between the component to be cooled 10 and the heat radiating component 30, and has high heat conductivity and flexibility. In addition, the heat conductive sheet 22 undergoes a phase change due to a temperature change. That is, the heat conductive sheet 22 maintains a flexible sheet form at room temperature, and is plasticized when heated to reach a temperature equal to or higher than its melting point. The plasticized heat conductive sheet 22 can obtain fluidity and can fill fine irregularities and gaps existing on the surface of the member in contact with the heat conductive sheet 22. Thereafter, the plasticized heat conductive sheet 22 hardens when its temperature decreases. In this way, the heat conductive sheet 22 can be in contact with an adjacent member via a large surface area.

(2-3) Heat dissipation component 30
The heat radiating component 30 is for releasing the heat transmitted from the heat conducting member 20 to another region having a relatively low temperature, and is, for example, a refrigerant jacket that releases heat to a fluid refrigerant.

  The heat dissipation component 30 is provided with a through hole 35. The through hole 35 is threaded, for example. Alternatively, the through hole 35 may be unthreaded.

  One surface of the heat dissipating component 30 is a contact portion 37 that contacts the heat conducting member 20.

  A refrigerant pipe 39 passes through the heat dissipating component 30, and a low-temperature fluid refrigerant can flow therethrough.

  The heat dissipation component 30 may be a heat sink that releases heat to the atmosphere instead of the refrigerant jacket.

(2-4) Fixture 40
The fixing tool 40 is for fixing the component 10 to be cooled, the heat conducting member 20, and the heat radiating component 30 to each other, and is, for example, a screw. Alternatively, the fixture 40 may be a bolt and a nut.

  The fixture 40 passes through the through hole 15 of the cooling target component 10, the through hole 25 of the heat conducting member 20, and the through hole 35 of the heat radiating component 30, and then the cooling target component 10, the heat conducting member 20, and the heat radiating component 30. Fix each other.

  When the fixing tool 40 is a screw, the through hole 35 of the heat dissipation component 30 is preferably threaded. Alternatively, when the fixture 40 is a bolt and a nut, the through hole 35 of the heat dissipation component 30 is preferably not threaded.

(3) Overall operation (3-1) Assembly of mounting structure The fixture 40 tightens the component 10 to be cooled, the heat conducting member 20 and the heat radiating component 30, whereby the component 10 to be cooled, the heat conducting member 20 and the heat radiation The components 30 are in close contact, and the mounting structure shown in FIG. 2 is assembled.

(3-2) Mechanism of Cooling Function The basic operation of the mounting structure will be described with reference to FIG.

  In the cooling target component 10, the heat generated by the heat generating component 11 is transmitted to the heat transfer plate 13 through the heat dissipation grease 12.

  In the heat conductive member 20, the heat generated by the heat transfer plate 13 is sequentially received by the resin film 21 and the heat conductive sheet 22 and then transmitted to the heat dissipation component 30.

  The heat radiating component 30 releases the heat received from the heat conductive sheet 22 to a relatively low temperature region such as the atmosphere or fluid refrigerant.

  The cooling target component 10 is cooled by this series of heat conduction.

(3-3) Pre-processing for improving cooling performance In order to efficiently cool the cooling target component 10, it is necessary to improve the thermal conductivity from the heat conductive sheet 22 to the heat radiating component 30. For that purpose, pre-processing is performed in advance, including a step in which the heat conductive sheet 22 is plasticized once heated, and a step in which the heat conductive sheet 22 is solidified by lowering the temperature of the heat conductive sheet 22 thereafter. It is preferable. By this pretreatment, the heat conductive sheet 22 fills the irregularities and gaps on the surface of the heat dissipation component 30 and can contact the heat dissipation component 30 through a large surface area.

  This pre-processing can be performed not only in the device manufacturing process but also in the use of the device by the user after shipment.

(4) Features (4-1) Recesses 51 and 61 of the heat dissipation component 30
The structure of the heat dissipation component 30 will be described with reference to FIG.

  Two concave portions are formed in the contact portion 37 of the heat dissipation component 30. One is an annular recess 51 provided around the through hole 35. The other is a rectangular recess 61 provided at a portion corresponding to the outer edge 26 of the heat conducting member 20 so as to surround the recess 51. Of course, the shape of the recess is not limited to these, and can be arbitrarily changed to suit the shapes of various components.

(4-2) Change in Mounting Structure With reference to FIGS. 2 and 3, the change in the mounting structure caused by the above-described pre-processing will be described.

  FIG. 2 shows the mounting structure before heating. The through hole 25 and the outer edge 26 of the heat conducting member 20 overlap with the recess 51 and the recess 61, respectively.

  FIG. 3 shows the mounting structure after heating. The portions of the heat conductive sheet 22 located in the vicinity of the through hole 25 and in the vicinity of the outer edge 26 obtain fluidity and flow into the recess 51 and the recess 61, respectively. Thereafter, the heat conductive sheet 22 hardens as the temperature decreases.

(4-3) Action The plasticized heat conductive sheet 22 fills minute irregularities and gaps on the surface of the heat dissipation component 30 and comes into contact with the heat dissipation component 30 through a large surface area. Thereby, the thermal conductivity between the heat conductive sheet 22 and the heat dissipation component 30 is improved.

  On the other hand, mutual fixation of the component 10 to be cooled and the heat conductive sheet 22 has not occurred. This is due to the following reason. First, most of the heat conductive sheet 22 is prevented from contacting the heat transfer plate 13 by the resin film 21. Second, also in the vicinity of the through-hole 25 and the outer edge 26 of the heat conducting member 20, the heat conducting sheet 22 is accommodated in the recess 51 or the recess 61, so that it is not in contact with the heat transfer plate 13. Therefore, the cooling target component 10 can be easily detached from the heat conducting member 20 in the maintenance work.

(5) Modification 1A
4 to 6 show a mounting structure according to Modification 1A of the first embodiment of the present invention.

  As shown in FIG. 4, the mounting structure according to the modified example 1A employs a recess 52 having a shape in which the entire circle is recessed instead of the recess 51 (see FIG. 1) having a shape in which the circumference is recessed. This is different from the first embodiment shown in FIGS. 1 to 3.

  FIG. 5 shows a mounting structure according to Modification 1A before heating. The through hole 25 of the heat conducting member 20 overlaps with the circular recess 52.

  FIG. 6 shows a mounting structure according to Modification 1A after heating. A portion of the heat conductive sheet 22 located in the vicinity of the through hole 25 obtains fluidity and flows into the recess 52. Since the recess 52 has a relatively large volume, the heat conductive sheet 22 that has flowed into the recess 52 does not come into contact with the fixture 40 as well as the heat transfer plate 13.

Second Embodiment
7 to 9 show a mounting structure according to the second embodiment of the present invention.

(1) Overall Configuration As shown in FIG. 7, the present embodiment is different from the first embodiment in the following points.

  First, the heat conducting member 20 has a size larger than that of the heat transfer plate 13. Specifically, the resin film 21 has an extending portion 217 that extends outward from the outer edge 136 of the heat transfer plate 13. The heat conductive sheet 22 also has the same size as the resin film 21 including the extending part 217.

  Secondly, the recess 61 (see FIG. 1) provided in the heat dissipation component 30 of the first embodiment is not provided in the heat dissipation component 30 of the present embodiment.

(2) Features (2-1) Changes in Mounting Structure With reference to FIG. 8 and FIG. 9, changes in the mounting structure caused by the pre-processing will be described.

  FIG. 8 shows the mounting structure before heating. The outer edge 216 of the resin film 21 of the heat conducting member 20 is spaced outward from the outer edge 136 of the heat transfer plate 13 by the dimension of the extending portion 217.

  FIG. 9 shows the mounting structure after heating. The plasticized heat conductive sheet 22 extends from the outer edge 216 of the resin film 21 and forms a raised portion 229. Since the protruding portion 229 is separated from the outer edge 136 of the heat transfer plate 13 due to the presence of the extending portion 217, it does not contact the heat transfer plate 13.

(2-2) Action The plasticized heat conductive sheet 22 fills minute irregularities and gaps on the surface of the heat dissipation component 30 and contacts the heat dissipation component 30 through a large surface area. Thereby, the thermal conductivity between the heat conductive sheet 22 and the heat dissipation component 30 is improved.

  On the other hand, mutual fixation of the component 10 to be cooled and the heat conductive sheet 22 has not occurred. This is due to the following reason. First, most of the heat conductive sheet 22 is prevented from contacting the heat transfer plate 13 by the resin film 21. Secondly, in the vicinity of the through hole 25 of the heat conducting member 20, the heat conducting sheet 22 is accommodated in the recess 51, so that it is not in contact with the heat transfer plate 13. Third, in the vicinity of the outer edge 26 of the heat conducting member 20, the raised portion 229 of the heat conducting sheet 22 is sufficiently separated from the heat transfer plate 13. Therefore, the cooling target component 10 can be easily detached from the heat conducting member 20 in the maintenance work.

<Third Embodiment>
10 to 12 show a mounting structure according to the third embodiment of the present invention.

(1) Overall Configuration This embodiment is different from the first embodiment in the following points.

  First, as shown in FIG. 10, the heat conducting member 20 has a slightly smaller size than the heat transfer plate 13.

  Secondly, in the heat conducting member 20 of the present embodiment, contrary to the first embodiment, the resin film 21 is disposed on the side close to the heat radiating component 30, while the heat conducting sheet 22 is the component to be cooled 10. It is arranged on the side close to.

  Thirdly, in the first embodiment, the concave portion 51 and the concave portion 61 (see FIG. 1) are provided in the contact portion 37 of the heat dissipation component 30, whereas in the present embodiment, as shown in FIG. The heat transfer plate 13 having the contact portion 17 of the component 10 is provided with a recess 53 and a recess 63. The recess 53 is annular and is provided around the through hole 15 of the component to be cooled 10. The recess 63 is rectangular and is provided at a portion corresponding to the outer edge 26 of the heat conducting member 20 so as to surround the recess 53. Both the recess 53 and the recess 63 are open downward.

(2) Features (2-1) Change in Mounting Structure With reference to FIGS. 11 and 12, a change in the mounting structure caused by the above-described pre-processing will be described.

  FIG. 11 shows the mounting structure before heating. The through hole 25 and the outer edge 26 of the heat conducting member 20 overlap with the recess 53 and the recess 63, respectively.

  FIG. 12 shows the mounting structure after heating. The portions of the heat conductive sheet 22 located in the vicinity of the through hole 25 and in the vicinity of the outer edge 26 obtain fluidity and flow into the concave portion 53 and the concave portion 63, respectively. Thereafter, the heat conductive sheet 22 hardens as the temperature decreases.

(2-2) Action The plasticized heat conductive sheet 22 fills minute irregularities and gaps on the surface of the heat transfer plate 13 and contacts the heat transfer plate 13 through a large surface area. Thereby, the thermal conductivity between the cooling target component 10 and the thermal conductive sheet 22 is improved.

  On the other hand, the heat conduction sheet 22 and the heat dissipation component 30 are not fixed to each other. This is due to the following reason. First, most of the heat conductive sheet 22 is prevented from contacting the heat radiating component 30 by the resin film 21. Secondly, also in the vicinity of the through-hole 25 and the outer edge 26 of the heat conducting member 20, the heat conducting sheet 22 is accommodated in the concave portion 53 or the concave portion 63, and thus is not in contact with the heat radiating component 30. Therefore, the heat dissipation component 30 can be easily detached from the heat conducting member 20 in maintenance work.

(3) Modification 3A
13 to 15 show a mounting structure according to Modification 3A of the third embodiment of the present invention.

  As shown in FIG. 14, the mounting structure according to the modified example 3A employs a recess 54 having a shape in which the entire circle is depressed instead of the recess 53 (see FIG. 11) having a shape in which the circumference is depressed. This is different from the third embodiment shown in FIGS. 10 to 12.

  FIG. 14 shows a mounting structure according to Modification 3A before heating. The through hole 25 of the heat conducting member 20 overlaps the circular recess 54.

  FIG. 15 shows a mounting structure according to Modification 3A after heating. A portion of the heat conductive sheet 22 located in the vicinity of the through hole 25 obtains fluidity and flows into the recess 54. Since the recess 54 has a relatively large volume, the heat conductive sheet 22 that has flowed into the recess 54 does not come into contact with not only the heat dissipating component 30 but also the fixture 40.

<Fourth embodiment>
16 to 18 show a mounting structure according to the fourth embodiment of the present invention. In FIG. 16, in order to facilitate understanding of the structure, a part of the resin film 21 is cut out and shown.

(1) Overall Configuration As shown in FIG. 16, the present embodiment is different from the first embodiment in the following points.

  First, the heat conductive member 20 includes a resin film 21 having substantially the same size as the heat transfer plate 13 and a heat conductive sheet 22 smaller than the heat transfer plate 13. As a result, the portion of the resin film 21 that protrudes outward from the outer edge 226 of the heat conductive sheet 22 forms a flange portion 218.

  Secondly, the through hole of the heat conductive member 20 is formed by the hole 215 of the resin film 21 and the hole 225 of the heat conductive sheet 22, and the diameter of the hole 215 of the resin film 21 is the hole 225 of the heat conductive sheet 22. Is smaller than the diameter.

  Third, those corresponding to the recess 51 and the recess 61 (see FIG. 1) provided in the heat dissipation component 30 of the first embodiment are provided in both the heat dissipation component 30 and the heat transfer plate 13 of the present embodiment. It is not done.

(2) Features (2-1) Changes in Mounting Structure With reference to FIGS. 17 and 18, changes in the mounting structure caused by the pre-processing will be described.

  FIG. 17 shows the mounting structure before heating. The outer edge 216 of the resin film 21 is spaced outward from the outer edge 226 of the heat conductive sheet 22 before the pretreatment by the dimension of the flange portion 218.

  FIG. 18 shows the mounting structure after heating. The plasticized heat conductive sheet 22 acquires fluidity and spreads outward to form an outer edge 228 at a new position. The new outer edge 228 of the spread thermal conductive sheet 22 is prevented from contacting the heat transfer plate 13 due to the presence of the flange 218 of the resin film 21.

(2-2) Action The plasticized heat conductive sheet 22 fills minute irregularities and gaps on the surface of the heat dissipation component 30 and contacts the heat dissipation component 30 through a large surface area. Thereby, the thermal conductivity between the heat conductive sheet 22 and the heat dissipation component 30 is improved.

  On the other hand, mutual fixation of the component 10 to be cooled and the heat conductive sheet 22 has not occurred. This is due to the following reason. First, the portion of the heat conductive sheet 22 that has been in contact with the resin film 21 before heating is prevented from contacting the heat transfer plate 13 by the resin film 21 even after heating. Secondly, the diameter of the hole 215 of the resin film 21 is smaller than the diameter of the hole 225 of the heat conductive sheet 22 at a location close to the fixture 40 of the heat conductive member 20. Therefore, even if the plasticized heat conductive sheet 22 approaches the fixture 40, the resin film 21 still prevents contact between the heat conductive sheet 22 and the heat transfer plate 13. Third, in the vicinity of the outer edge of the heat conducting member 20, the resin film 21 has a flange 218. Therefore, since the outer edge 228 of the heat conductive sheet 22 that has been plasticized and spread does not reach the outer edge 216 of the resin film 21, contact between the heat conductive sheet 22 and the heat transfer plate 13 is prevented.

(3) Modification 4A
19 to 21 show a mounting structure according to Modification 4A of the fourth embodiment of the present invention.

  As shown in FIG. 19, in the heat conducting member 20 of the modified example 4A, the resin film 21 is disposed on the side close to the heat radiating component 30, whereas the heat conducting sheet 22 is to be cooled, contrary to the fourth embodiment. It is arranged on the side close to the component 10.

  FIG. 20 shows a mounting structure according to Modification 4A before heating. The outer edge 216 of the resin film 21 is spaced outward from the outer edge 226 of the heat conductive sheet 22 before the pretreatment by the dimension of the flange portion 218.

  FIG. 21 shows a mounting structure according to Modification 4A after heating. The plasticized heat conductive sheet 22 acquires fluidity and spreads outward to form an outer edge 228 at a new position. The new outer edge 228 of the spread thermal conductive sheet 22 is prevented from contacting the heat radiating component 30 due to the presence of the flange 218 of the resin film 21.

  The present invention can be used for various electric devices that handle a large current, such as an air conditioner.

DESCRIPTION OF SYMBOLS 10 Cooling object part 11 Heat generating part 12 Heat radiation grease 13 Heat transfer plate 15 Through-hole 17 Contact part 20 Thermal conduction member 21 Resin film 22 Thermal conduction sheet 25 Through-hole 26 Outer edge 30 Radiation part 35 Through-hole 36 Outer edge 37 Contact part 39 Refrigerant piping 40 Fixing tool 51 Recess (For fixing tool protection)
52 Concavity (for fixing fixture protection)
53 Concavity (for protecting fixtures)
54 Concavity (for fixing fixture protection)
61 Concavity (for protecting the outer edge of parts)
63 Concavity (for protecting the outer edge of parts)
136 Outer edge 215 of heat transfer plate 13 Through hole 216 of resin film 21 Outer edge 217 of resin film 21 Extending portion 218 of resin film 21 Through hole 225 of heat conductive sheet 22 Outer edge of heat conductive sheet 22 228 The outer edge 229 of the spread thermal conductive sheet 22 The raised portion of the thermal conductive sheet 22

JP 2002-176126 A

Claims (7)

A cooling target component to be cooled (10), and a first component that is one of the heat dissipation components (30) having a function of cooling the cooling target component;
A second component that is one of the cooling target component and the heat dissipation component and is different from the first component;
A heat-conducting member (20) disposed between the first part and the second part and conducting heat between the first part and the second part;
With
The heat conductive member is a heat conductive sheet (22) disposed on the first component side, and a resin film (21) laminated on the heat conductive sheet and disposed on the second component side. With
The heat conductive sheet is plasticized by heating,
The first component has a contact portion (37, 17) that contacts the heat conductive sheet, and the contact portion is provided with at least one recess (51, 52, 53, 54, 61, 63). And
The heat conduction member is heated in a state where the heat conduction member covers at least a part of the recess, and a part of the plasticized heat conduction sheet enters the recess, whereby the heat conduction sheet and the first Mounting structure for heat-dissipating parts that prevents contact with two parts. The contact portion of the first component is provided with through holes (35, 15) for accommodating the fixture (40),
The at least one recess includes a fixture protection recess (51, 52, 53, 54) for preventing contact between the fixture and the plasticized thermal conductive sheet. Mounting structure for heat dissipation parts.   The heat dissipation component mounting structure according to claim 2, wherein the through holes (35, 15) are spaced apart from the fixture protecting recesses (51, 53).   The heat dissipation component mounting structure according to claim 2, wherein the through holes (35, 15) extend from a bottom surface of the fixture protecting recess (52, 54). The at least one recess (51, 52, 53, 54, 61, 63) is a component outer edge for preventing contact between the outer edge (36, 136) of the second component and the plasticized thermal conductive sheet Including protective recesses (61, 63),
The heat dissipation component mounting structure according to any one of claims 1 to 4, wherein the outer edge of the second component overlaps the component outer edge protecting recess in a plan view.   The heat dissipating component mounting structure according to any one of claims 1 to 4, wherein the second component is separated from an outer edge (216) of the resin film to the inside of the resin film. A cooling target component to be cooled (10), and a first component that is one of the heat dissipation components (30) having a function of cooling the cooling target component;
A second component that is one of the cooling target component and the heat dissipation component and is different from the first component;
A heat-conducting member (20) disposed between the first part and the second part and conducting heat between the first part and the second part;
With
The heat conductive member is a heat conductive sheet (22) disposed on the first component side, and a resin film (21) laminated on the heat conductive sheet and disposed on the second component side. With
The heat conductive sheet is plasticized by heating,
In the plan view, the resin film protrudes from the outer edge (226) of the heat conductive sheet before plasticization, and also protrudes from the outer edge (228) of the heat conductive sheet after plasticization. Component mounting structure.

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