JP2016018928A - Electronic component-embedded module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component-embedded module hardly causing an electric short circuit and conduction failure due to gas generated from a liquid component contained in a sealing resin at the inside of the module, even when the module is heated in mounting the module on a substrate or the like of an electronic apparatus.SOLUTION: An electronic component-embedded module includes a substrate 1, a land electrode 2, an electronic component 3 including at least a pair of terminal electrodes 3a, and a sealing resin 7. In the electronic component-embedded module, a space Sis provided between the substrate 1 and the electronic component 3, and a gap 5s is formed in solder (brazing material) 5 at at least one fixing section between the land electrode 2 and the terminal electrodes 3a of the electronic component 3, the fixing section being formed by the solder 5.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component built-in module, and more specifically, a gas (such as water vapor) generated from a liquid component (water or the like) contained in a sealing resin inside even when heated when soldering to a substrate or the like of an electronic device. This is related to a module with a built-in electronic component that is less likely to cause an electrical short circuit or poor conduction due to ().

  An electronic component built-in module having a structure in which a plurality of electronic components are mounted on a substrate and these electronic components are covered with a sealing resin is used as a high-functional module in an electronic device or the like.

  In such an electronic component built-in module, when mounting the electronic component built-in module on a substrate of an electronic device or the like, it is important to prevent flashing of the brazing material (for example, solder flash) from occurring inside. It has become.

  Solder flash is the solder used to join the land electrode on the board and the terminal electrode of the electronic component in the electronic component built-in module by heating when the electronic component built-in module is soldered to the board of the electronic device. It refers to the phenomenon of remelting and leaching into fine gaps, or further leaching of the solder to electrically short-circuit the terminal electrodes of the electronic component.

  If the terminal electrodes of electronic parts built in by solder flash are electrically short-circuited, the module with built-in electronic parts will break down, and even the mounted electronic equipment will break down. Loss.

  In order to prevent the occurrence of this solder flash, various devices have been conventionally made in electronic component built-in modules.

  For example, in the electronic component built-in module (circuit board) disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 2011-165695), by devising the shape of the land electrode (electrode pad) formed on the board, for example, By dividing the land electrode or the like, it is easy to fill the sealing resin between the substrate and the mounted electronic component, thereby preventing the occurrence of solder flash. That is, in the electronic component built-in module disclosed in Patent Document 1, the electronic component built-in module is mounted on a substrate of an electronic device or the like by densely filling a sealing resin around the mounted electronic component and generating no gap. Even if the solder is remelted by heating at the time of soldering, the terminal electrodes of the electronic component are not electrically short-circuited.

  As another method, in the electronic component built-in module (semiconductor device) disclosed in Patent Document 2 (Japanese Patent Laid-Open No. 2005-302835), conversely, a sealing resin is provided between the substrate and the mounted electronic component. The solder flash is prevented by making the space without filling.

  FIG. 10 shows an electronic component built-in module 600 disclosed in Patent Document 2.

  The electronic component built-in module 600 includes a substrate 101.

  A land electrode 102 is formed on the main surface of the substrate 101.

  An electronic component 103 in which terminal electrodes 103a are formed on both ends of a component main body using a land electrode 102, and an electronic component in which a plurality of flip chip electrodes (not shown) are formed on the bottom surface of the component main body. 104 is implemented. Specifically, the terminal electrode 103 a of the electronic component 103 and the flip chip electrode of the electronic component 104 are fixed to the land electrode 102 by a brazing material, for example, solder 105.

  Examples of the electronic component 103 in which the terminal electrodes 103a are formed at both ends of the component main body include a capacitor element, a coil element, and a resistance element. Examples of the electronic component 104 having a plurality of flip chip electrodes formed on the bottom surface of the component body include a surface acoustic wave device, a semiconductor device, and an integrated circuit device.

  A resin film 106 is formed so as to cover the electronic components 103 and 104 mounted on the substrate 101.

  Further, a sealing resin 107 is formed on the resin film 106.

The sealing resin 107 is solidified or cured after being disposed on the film 106 in a semi-molten state. Sealing resin 107, because the film 106 is present, not flow into the gap between the substrate 101 and the electronic components 103 and 104, the gap between the substrate 101 and the electronic components 103 and 104, respectively the space S ₁ is formed ing.

In the electronic component built-in module 600, without filling the sealing resin 107 between the electronic components 103 and 104 which are mounted to the substrate 101, because it forms a space S _1, the electronic component built-in module 600 of the electronic device Even if the solder 105 is remelted by heating when soldering to a substrate (not shown) or the like and the volume expands, the expansion of the volume can be absorbed in the space S _1. Is less likely to occur.

JP2011-165695A JP 2005-302835 A

  As described above, the electronic component built-in module 600 disclosed in Patent Document 2 is less likely to cause solder flash when the electronic component built-in module 600 is soldered to a substrate of an electronic device or the like.

  However, even in the electronic component built-in module 600, when the sealing resin 107 contains a liquid component (water or the like), an electrical short circuit may occur between the two terminal electrodes 103a of the electronic component 103, or an electronic In some cases, a conduction failure may occur between the terminal electrode 3a of the component 103 and the land electrode 102. The reason will be described below.

  11A and 11B are cross-sectional views of the electronic component built-in module 600 in which the land electrode 102, the electronic components 103 and 104, the solder 105, and the film 106 are omitted. Therefore, only the substrate 101 and the sealing resin 107 are shown in FIG. 11A, and only the sealing resin 107 is shown in FIG. Note that FIG. 11B illustrates a cross section of a portion XX in FIG.

  As described above, in the manufacturing process of the electronic component built-in module 600, the sealing resin 107 is solidified or cured after being placed on the film 106 in a semi-molten state. In this step, since the liquid component contained in the sealing resin 107 is sequentially dried from the outer surface side of the sealing resin 107, the liquid resin contained in the sealing resin 107 near the center portion or on the substrate 101 of the sealing resin 107. The liquid component tends to remain on the side in contact.

11A and 11B, M ₁ , M ₂ , and M ₃ indicate portions where the liquid component remains in the sealing resin 107, and the liquid components in the order of M ₁ , M ₂ , and M _3. The residual concentration of is high.

When the electronic component built-in module 600 in which the liquid component remains in this way is heated to be soldered to a substrate (not shown) of an electronic device or the like, M ₁ , M ₂ , M _{3 of the} sealing resin 107 are heated. The liquid component contained in the portion becomes gas (water vapor or the like) and expands in the direction indicated by the black arrow in FIGS. That is, the gas expands in a direction perpendicular to the main surface of the substrate 101, but also expands in the direction parallel to the main surface of the substrate 101 from the vicinity of the central portion of the substrate 101 toward the outer edge of the substrate 101. . The expansion of the gas may cause an electrical short circuit between the terminal electrodes 103a of the electronic component 103 or may cause a conduction failure between the terminal electrode 103a of the electronic component 103 and the land electrode 102. This will be described in more detail with reference to FIGS.

  FIGS. 12A and 12B are cross-sectional views of the main part of the electronic component built-in module 600. However, FIG. 12A shows a state before the electronic component built-in module 600 is soldered to a substrate (not shown) of an electronic device. FIG. 12B shows a state in which the electronic component built-in module 600 is heated for soldering.

As shown in FIG. 12A, an electronic component 103 in which terminal electrodes 103a are formed on both ends of a component main body is mounted on a substrate 101 using land electrodes 102. Specifically, the terminal electrode 103 a of the electronic component 103 is fixed to the land electrode 102 with the solder 105. A resin film 106 is formed so as to cover the electronic component 103 mounted on the substrate 101. Further, a sealing resin 107 is formed on the resin film 106. Since the sealing resin 107 has the film 106, the sealing resin 107 does not flow into the gap between the substrate 101 and the electronic component 103, and a space S ₁ is formed in the gap between the substrate 101 and the electronic component 103.

When the electronic component built-in module 600 is heated to be soldered to a substrate of an electronic device or the like, the solder 105 is re-melted, and as shown in FIG. It becomes gas and expands in a direction parallel to the main surface of the substrate 101 indicated by the black arrow. Since the film 106 is to transmit gas, that gas enters between the terminal electrodes 103a and the film 106 of the electronic component 103, forming a space S ₂ by extruding a molten solder 105 (right side of the solder 105 in FIG. 1) there were.

Then, the extruded solder 105 flows into the space S ₁ between the substrate 101 and the electronic component 103, and the opposite land electrode 102 (left land electrode 102 in the figure) or solder 105 (left solder 105 in the figure). ) May have been reached. That is, there is a case where the terminal electrodes 103a of the electronic component 103 are electrically short-circuited.

Further, since the space S ₂ is formed, the melted solder 105 is pushed out, and there is a case where the terminal electrode 103a of the electronic component 103 and the land electrode 102 are poorly connected.

As described above, the electronic component built-in module 600 disclosed in Patent Document 2 is provided with the space S ₁ between the substrate 101 and the electronic component 103, so that the solder flash when soldering to the substrate or the like of the electronic device is performed. However, when the sealing resin 107 contains a liquid component, there is a possibility that an electrical short circuit or poor conduction may occur inside.

  The present invention has been made to solve the above-described conventional problems, and as its means, the electronic component built-in module of the present invention includes a substrate, a land electrode formed on at least one main surface of the substrate, An electronic component having at least one pair of terminal electrodes, the terminal electrode being fixed to the land electrode by a brazing material, and an electronic component mounted on the main surface of the substrate and covering the electronic component on the main surface of the substrate A space between the substrate and the electronic component, and at least one gap between the land electrode made of the brazing material and the terminal electrode of the electronic component that penetrates the brazing material. Or it consists of what formed the space | gap closed by the wall in the middle. In the electronic component built-in module of the present invention having such a structure, the expanded gas can pass through the gap, so that the molten brazing material (solder or the like) is pushed out into the space between the substrate and the electronic component. There is no occurrence of electrical short circuit or conduction failure. In addition, when the space | gap formed in the brazing material is what was obstruct | occluded by the wall in the middle, the expanded gas penetrates a wall and passes through a wall or is absorbed in a space | gap.

  The terminal electrode of an electronic component consists of a cap-shaped terminal electrode formed at both ends of the electronic component main body, for example. In the case of a cap-shaped terminal electrode, there is no gap to allow gas to pass in the vicinity of the fixed portion between the land electrode and the terminal electrode by the brazing material, and when soldering the electronic component built-in module to the substrate of the electronic device, Since the brazing material is easily affected by the expanded gas and the brazing material is pushed out and an electrical short circuit or conduction failure is likely to occur inside, the effect of applying the present invention is great.

  An electronic component and a substrate can be covered with a film, and the film can be covered with a sealing resin. By covering the electronic component and the substrate with a film, a space can be easily provided between the substrate and the electronic component.

  The void of the brazing material is formed by providing a slit in the land electrode, a method of attaching a resist to the brazing material on the land electrode, a method of attaching a resist to the brazing material on the terminal electrode of the electronic component, and an electrode on the terminal electrode of the electronic component. It can form by the method of providing a non-formation part.

  The void of the brazing material can be formed, for example, in a direction connecting the central portion of the substrate and the electronic component. In this case, since the direction in which the gas in the sealing resin expands can coincide with the direction in which the voids are formed, the gas can easily pass through the voids.

  In the electronic component built-in module of the present invention, another electronic component having a plurality of flip chip electrodes formed on the bottom surface may be further flip-chip mounted on the main surface of the substrate. Examples of such electronic components include a surface acoustic wave device, a semiconductor device, an integrated circuit device, and the like. In this case, the electronic component built-in module can be made more sophisticated.

  Since the electronic component built-in module of the present invention allows gas (such as water vapor) to pass through the voids formed in the brazing material, a sealing resin is used when soldering the electronic component built-in module to a substrate of an electronic device or the like. Due to the gas generated from the liquid component (water or the like) contained in the liquid crystal, the occurrence of an electrical short circuit or poor conduction inside is suppressed.

FIG. 1 is a plan view showing an electronic component built-in module 100 according to the first embodiment. However, in FIG. 1, the film 6 and the sealing resin 7 are omitted. 2A and 2B are cross-sectional views of the main part of the electronic component built-in module 100, respectively. FIG. 2A shows the YY portion of FIG. 1, and FIG. The ZZ part of is shown. FIGS. 3A and 3B are perspective views illustrating steps performed in an example of a method for manufacturing the electronic component built-in module 100. FIG. 4C is a continuation of FIG. 3B, and FIG. 4C is a perspective view showing a process performed in an example of a method for manufacturing the electronic component built-in module 100. FIGS. 5A to 5F are principal part plan views showing modifications of the electronic component built-in module 100 according to the first embodiment. FIG. 6 is a cross-sectional view of a principal part showing an electronic component built-in module 200 according to the second embodiment. FIG. 7 is a cross-sectional view of a principal part showing an electronic component built-in module 300 according to the third embodiment. FIG. 8 is an essential part cross-sectional view showing an electronic component built-in module 400 according to the fourth embodiment. FIG. 9 is a cross-sectional view of an essential part showing an electronic component built-in module 500 according to the fifth embodiment. FIG. 10 is a cross-sectional view showing a conventional electronic component built-in module 600 disclosed in Patent Document 2. As shown in FIG. 11A and 11B are cross-sectional views showing a conventional electronic component built-in module 600, and FIG. 11B shows an XX portion of FIG. 11A. FIGS. 12A and 12B are cross-sectional views of main parts of a conventional electronic component built-in module 600, respectively. FIG. 12A shows the electronic component built-in module 600 as a substrate of an electronic device (not shown). FIG. 12B shows a state in which the electronic component built-in module 600 is heated for soldering.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
(First embodiment)
FIGS. 1, 2 </ b> A, and 2 </ b> B each show an electronic component built-in module 100 according to the first embodiment. 1 is a plan view, FIG. 2A is a cross-sectional view of the YY portion of FIG. 1, and FIG. 2B is a cross-sectional view of the ZZ portion of FIG. In FIG. 1, the sealing resin 7 shown in FIGS. 2A and 2B is omitted. Further, in FIG. 1, for ease of viewing, only the land electrode 2 and the electronic component 3 in the upper left in the drawing are denoted in detail, and the reference numerals are omitted in other portions.

  The electronic component built-in module 100 includes a substrate 1. The substrate 1 is made of, for example, resin or ceramic. The substrate 1 may be formed in a multilayer structure. Moreover, the board | substrate 1 may incorporate the electronic component inside.

  A land electrode 2 is formed on the main surface of the substrate 1. The material of the land electrode 2 is arbitrary, but, for example, copper, aluminum or the like is used. Although not shown, wiring electrodes for connecting the land electrodes 2 and the like may be formed on the main surface of the substrate 1.

  An electronic component 3 in which terminal electrodes 3a are formed on both ends of a component body using a land electrode 2, and an electronic component in which a plurality of flip chip electrodes (not shown) are formed on the bottom surface of the component body. 4 is implemented. Specifically, the terminal electrode 3 a of the electronic component 3 and the flip chip electrode of the electronic component 4 are fixed to the land electrode 2 by a brazing material, for example, solder 5.

  A slit 2s is formed in at least one of the land electrodes 2 for mounting the electronic component 3 having the terminal electrodes 3a formed on both ends of the component body. The land electrode 2 in which the slit 2s is formed is composed of two parts, land electrode pieces 2a and 2b. In the present embodiment, as shown in FIG. 1, a total of eight electronic parts 3 having two sizes, large and small, are mounted. However, all of the eight pairs of land electrodes 2 on which these are mounted are mounted. A slit 2s is formed. In addition, it is not necessary to form the slit 2s in the land electrode 2 for fixing the flip chip electrode of the electronic component 4.

  In the fixed portion between the land electrode 2 where the slit 2 s is formed and the terminal electrode 3 a of the electronic component 3, no solder is attached on the slit 2 s, so that a gap 5 s is formed in the solder 5.

  A sealing resin 7 is formed so as to cover the electronic components 3 and 4 mounted on the substrate 1. Although the material of the sealing resin 7 is arbitrary, for example, a curable resin such as an epoxy resin or a polyimide resin can be used.

The sealing resin 7 is solidified or cured after being placed on the electronic components 3 and 4 in a semi-molten state. Spaces S ₁ are formed in the gaps between the substrate 1 and the electronic components 3 and 4, respectively.

Even when the electronic component built-in module 100 is heated when soldered to a substrate (not shown) of an electronic device or the like, even if the liquid component contained in the sealing resin 7 becomes gas and expands, Gas can be passed through the gap 5 s formed in the solder 5. For this reason, the remelted solder 5 is not pushed into the space S ₁ between the substrate 1 and the electronic component 3 by the gas, and the two terminal electrodes 3a of the electronic component 3 are electrically short-circuited. There is nothing. Further, since the melted solder 5 is not pushed out, there is no conduction failure between the terminal electrode 3a and the land electrode 2 of the electronic component 3.

  In addition, before an electronic component built-in module is used, the liquid component remains in the sealing resin or the sealing resin absorbs the liquid component. is there. In the electronic component built-in module 100 according to this embodiment, even if a liquid component remains in the sealing resin at the time of manufacture, or even if the sealing resin absorbs the liquid component during storage, the electronic device When soldering to a substrate or the like, no electrical short circuit or poor conduction occurs inside.

  Also, as a method of inspecting the solder flash resistance of the electronic component built-in module, the completed electronic component built-in module is placed under high humidity for a certain period of time to absorb liquid components and then heated and soldered to the board. In addition, there is a method for inspecting whether an electrical short circuit or conduction failure has occurred inside the electronic component built-in module. The electronic component built-in module 100 according to the present embodiment does not cause an electrical short circuit or poor conduction inside even in such an inspection.

  The electronic component built-in module 100 according to the first embodiment having the above-described structure can be manufactured, for example, through the steps shown in FIGS. 3A to 4C.

  First, as shown in FIG. 3A, a land electrode 2 is formed on a substrate 1. At least one of the land electrodes 2 includes a slit 2s and land electrode pieces 2a and 2b. The land electrode 2 can be formed, for example, by attaching a copper foil to the entire main surface of the substrate 1 and etching it into a desired shape.

  Next, as shown in FIG. 3 (B), after applying cream solder 5 'on the land electrode 2, an electronic component 3 having terminal electrodes 3a formed on both ends of the component body on the land electrode 2 is formed. Temporarily fix. Although not shown, similarly, the electronic component 4 having a plurality of flip chip electrodes formed on the bottom surface of the component body is temporarily fixed on the land electrode 2 coated with cream solder 5 '.

  Next, as shown in FIG. 4C, the solder paste 5 ′ is heated to melt, and then cooled to solidify, whereby the terminal electrode 3 a of the electronic component 3 is turned to the land electrode 2 by the solder 5. Fix it. Although not shown, similarly, the flip chip electrode of the electronic component 4 is fixed to the land electrode 2 with the solder 5.

Next, the electronic components 3 and 4 are covered with the sealing resin 7 to complete the electronic component built-in module 100 according to the present embodiment. Note that the step of covering the electronic components 3 and 4 with the sealing resin 7 is performed, for example, when the sealing resin 7 is a thermosetting resin, the semi-molten sealing resin 7 is disposed on the electronic components 3 and 4. Then, the lower surface can be deformed according to the shape of the electronic components 3 and 4, and the upper surface can be flattened and then heated and cured. The space S ₁ between the electronic components 3 and 4 and the substrate 1 can be easily formed by adjusting the speed at which the semi-molten sealing resin 7 is disposed.

  The structure of the electronic component built-in module 100 according to the present embodiment and an example of the manufacturing method thereof have been described above. However, the content of the present invention is not limited to these, and various modifications can be made along the spirit of the present invention.

  For example, the shape and number of slits formed in the land electrode 2 are arbitrary, and various changes can be made. 5A to 5F show a modification of the slit.

  In the modification example shown in FIG. 5A, the width of the slit 12s is narrowed.

  In the modification shown in FIG. 5B, the width of the slit 22s is increased.

In the modification shown in FIG. 5C, the number of slits 32s is two. In this case, the land electrode 2 is composed of three portions of land electrode pieces 2a, 2b, and 2c. In the modification shown in FIG. 5D, the direction of the slit 42s is inclined. In addition, when the formation direction is slanted like the slit 42s, the direction of the gap 5a formed in the solder 5 and the direction in which the gas expands can be matched, and in this case, the effect of allowing the gas to pass is achieved. Can be improved.

  In the modification shown in FIG. 5E, the slit 52 s is bent inside the land electrode 2.

  In the modification shown in FIG. 5 (F), the slit 62s is not a penetrating shape but a shape that is closed in the middle. In this case, the gap 5a formed in the solder 5 is also blocked by the wall in the middle. In this case, the expanded gas passes through the wall or is absorbed into the gap 5a by pushing the wall. Or

  In the electronic component built-in module 100, the slit 2 s is formed in the land electrode 2 to form the gap 5 s in the solder 5 at the fixed portion between the land electrode 2 and the terminal electrode 3 a of the electronic component 3. The formation method of 5s is not limited to this method. The gap 5s of the solder 5 is, for example, a method of attaching a resist to solder (brazing material) on the land electrode, a method of attaching a resist to solder on the terminal electrode of the electronic component, or an electrode non-forming portion on the terminal electrode of the electronic component. It can also be formed by a method of providing the like.

Further, in the electronic component built-in module 100, the solder 5 is used as the brazing material, but the kind of the brazing material is not limited to solder, and may be, for example, a conductive adhesive. In addition, as a method of forming a space | gap in the conductive adhesive which is a brazing material, the method etc. which print a conductive adhesive in the several places distant on a land electrode are employable, for example.
(Second Embodiment)
FIG. 6 shows an electronic component built-in module 200 according to the second embodiment. However, FIG. 6 is a cross-sectional view of a main part of the electronic component built-in module 200.

  In the electronic component built-in module 100 according to the first embodiment shown in FIGS. 1, 2 (A), and 2 (B), the land electrode 2 and the electronic component 3 are formed by forming slits 2 s in the land electrode 2. A gap 5s was formed in the solder 5 fixed to the terminal electrode 3a.

  In the electronic component built-in module 200 according to the second embodiment, instead of this, a land electrode 72 having a large width without slits is formed on the substrate 1, and solder (waxing) having a desired pattern is formed on the land electrode 72. Material) By forming the resist 8, a gap 5 s was formed in the solder 5 at the fixed portion between the land electrode 2 and the terminal electrode 3 a of the electronic component 3. As the solder resist 8, for example, an epoxy resin can be used.

Other configurations of the electronic component built-in module 200 according to the second embodiment are the same as those of the electronic component built-in module 100 according to the first embodiment.
(Third embodiment)
FIG. 7 shows an electronic component built-in module 300 according to the third embodiment. However, FIG. 7 is a cross-sectional view of a main part of the electronic component built-in module 300.

  In the electronic component built-in module 300 according to the third embodiment, the land electrode 72 having a large width without slits is formed on the substrate 1 and the solder resist 18 having a desired pattern is formed on the terminal electrode 3 a of the electronic component 3. As a result, a gap 5 s was formed in the solder 5 at the fixed portion between the land electrode 2 and the terminal electrode 3 a of the electronic component 3.

Other configurations of the electronic component built-in module 300 according to the third embodiment are the same as those of the electronic component built-in module 100 according to the first embodiment.
(Fourth embodiment)
FIG. 8 shows an electronic component built-in module 400 according to the fourth embodiment. However, FIG. 8 is a cross-sectional view of a main part of the electronic component built-in module 400.

  In the electronic component built-in module 400 according to the fourth embodiment, the land electrode 72 having a large width without slits is formed on the substrate 1, and the electrode non-forming portion 9 having a desired pattern is formed on the terminal electrode 3 a of the electronic component 3. As a result, a gap 5 s was formed in the solder 5 at the fixed portion between the land electrode 2 and the terminal electrode 3 a of the electronic component 3. In the electrode non-forming portion 9, the main body portion of the electronic component 3 is exposed, and solder does not adhere.

Other configurations of the electronic component built-in module 400 according to the fourth embodiment are the same as those of the electronic component built-in module 100 according to the first embodiment.
(Fifth embodiment)
FIG. 9 shows an electronic component built-in module 500 according to the fifth embodiment. However, FIG. 9 is a cross-sectional view of the main part of the electronic component built-in module 500.

  In the electronic component built-in module 500 according to the fifth embodiment, the film 6 is interposed between the electronic components 3 and 4 mounted on the substrate 1 and the sealing resin 7 according to the first embodiment. The film 6 is permeable to gas. For the film 6, for example, a curable resin such as an epoxy resin or a polyimide resin, or a thermoplastic resin such as polyphenylene sulfide can be used.

  The film 6 is attached onto the substrate 1 and the electronic components 3 and 4 mounted on the substrate 1 by a method capable of following a complicated surface shape, for example, vacuum lamination, rubber press, hydrostatic pressure press, and the like. It can be formed by curing by a method such as thermosetting or photocuring.

Since the electronic component built-in module 500 according to the fifth embodiment includes the film 6, it is easy to form the space S ₁ between the electronic components 3 and 4 and the substrate 1. Further, when forming the sealing resin 7, the gap 5 s of the solder 5 is not filled with the sealing resin 7. Therefore, also in the fifth embodiment, there is no influence of gas due to the liquid component contained in the sealing resin 7, and an electrical short circuit or conduction failure of the electronic component does not occur.

  Other configurations of the electronic component built-in module 500 according to the fifth embodiment are the same as those of the electronic component built-in module 100 according to the first embodiment.

  The film 6 applied to the electronic component built-in module 500 according to the fifth embodiment can also be applied to the electronic component built-in modules 200 to 400 according to the second to fourth embodiments described above.

  The electronic component built-in modules 100 to 500 according to the first to fifth embodiments have been described above. In each embodiment, various configurations can be changed. For example, the gap 5s formed in the solder 5 does not have to be provided at the connection portion between the terminal electrode 3a and the land electrode 2 at both ends of the electronic component 3, and may be provided only on one terminal electrode side.

  Moreover, in each embodiment, although it has comprised so that the space | gap 5s formed in the solder 5 may be provided with respect to all the electronic components 3 mounted in the board | substrate 1, it is not necessarily applied to all the electronic components 3. FIG. The gap 5s is applied to a pattern having a small gap between land electrodes, but the gap 5s may not be applied to a pattern having a large gap between land electrodes.

1: Substrate 2, 72: Land electrodes 2a, 2b, 2c: Land electrode pieces 2s, 12s, 22s, 32s, 42s, 52s, 62s: Slit 3: Electronic components (electrons on which at least one pair of terminal electrodes 3a are formed) parts)
3a: Terminal electrode 4: Electronic component (electronic component having a plurality of flip chip electrodes formed on the bottom surface)
5: Solder 5s: Gaps 6: Film 7: Sealing resin 8, 18: Solder resist 9: Electrode non-formation part (electrode non-formation part formed in the terminal electrode 3a of the electronic component 3)
S ₁ : Space 100, 200, 300, 400, 500: Electronic component built-in module

Claims (9)

A substrate,
A land electrode formed on at least one main surface of the substrate;
An electronic component mounted on the main surface of the substrate, comprising at least one pair of terminal electrodes, and the terminal electrodes are fixed to the land electrodes by a brazing material;
An electronic component built-in module comprising: a sealing resin formed on the main surface of the substrate so as to cover the electronic component;
A space is provided between the substrate and the electronic component,
An electronic component built-in module in which at least one fixed portion between the land electrode and the terminal electrode of the electronic component formed by the brazing material is formed with a penetrating gap or a gap blocked by a wall in the middle. .   The electronic component built-in module according to claim 1, wherein the terminal electrode of the electronic component is a cap-shaped terminal electrode formed at both ends of the electronic component main body.   The electronic component built-in module according to claim 1, wherein the electronic component and the substrate are covered with a film, and the film is covered with the sealing resin.   4. The electronic component built-in module according to claim 1, wherein the gap is formed by providing a slit in the land electrode. 5.   4. The electronic component built-in module according to claim 1, wherein the air gap is formed by attaching a resist for a brazing material on the land electrode. 5.   4. The electronic component built-in module according to claim 1, wherein the gap is formed by attaching a resist for a brazing material on the terminal electrode of the electronic component. 5. 4. The electronic component built-in module according to claim 1, wherein the gap is formed by providing an electrode non-forming portion on the terminal electrode of the electronic component. 5.   The electronic component built-in module according to any one of claims 1 to 7, wherein the gap is formed in a direction connecting a central portion of the substrate and the electronic component.   9. The electronic component built-in module according to claim 1, wherein another electronic component having a plurality of flip chip electrodes formed on the bottom surface is further flip-chip mounted on the main surface of the substrate.

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