JP2016012678A5 - - Google Patents

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Publication number
JP2016012678A5
JP2016012678A5 JP2014133924A JP2014133924A JP2016012678A5 JP 2016012678 A5 JP2016012678 A5 JP 2016012678A5 JP 2014133924 A JP2014133924 A JP 2014133924A JP 2014133924 A JP2014133924 A JP 2014133924A JP 2016012678 A5 JP2016012678 A5 JP 2016012678A5
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JP
Japan
Prior art keywords
processing
processing gas
gas
light transmission
ultraviolet rays
Prior art date
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Application number
JP2014133924A
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English (en)
Japanese (ja)
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JP6102842B2 (ja
JP2016012678A (ja
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Publication date
Application filed filed Critical
Priority to JP2014133924A priority Critical patent/JP6102842B2/ja
Priority claimed from JP2014133924A external-priority patent/JP6102842B2/ja
Priority to US15/321,163 priority patent/US20170156217A1/en
Priority to PCT/JP2015/058190 priority patent/WO2016002266A1/ja
Publication of JP2016012678A publication Critical patent/JP2016012678A/ja
Publication of JP2016012678A5 publication Critical patent/JP2016012678A5/ja
Application granted granted Critical
Publication of JP6102842B2 publication Critical patent/JP6102842B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014133924A 2014-06-30 2014-06-30 デスミア処理方法およびデスミア処理装置 Active JP6102842B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014133924A JP6102842B2 (ja) 2014-06-30 2014-06-30 デスミア処理方法およびデスミア処理装置
US15/321,163 US20170156217A1 (en) 2014-06-30 2015-03-19 Desmear treatment device and desmear treatment method
PCT/JP2015/058190 WO2016002266A1 (ja) 2014-06-30 2015-03-19 デスミア処理装置およびデスミア処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014133924A JP6102842B2 (ja) 2014-06-30 2014-06-30 デスミア処理方法およびデスミア処理装置

Publications (3)

Publication Number Publication Date
JP2016012678A JP2016012678A (ja) 2016-01-21
JP2016012678A5 true JP2016012678A5 (cg-RX-API-DMAC7.html) 2016-12-08
JP6102842B2 JP6102842B2 (ja) 2017-03-29

Family

ID=55018826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014133924A Active JP6102842B2 (ja) 2014-06-30 2014-06-30 デスミア処理方法およびデスミア処理装置

Country Status (3)

Country Link
US (1) US20170156217A1 (cg-RX-API-DMAC7.html)
JP (1) JP6102842B2 (cg-RX-API-DMAC7.html)
WO (1) WO2016002266A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113518510B (zh) * 2020-04-10 2022-10-11 南通深南电路有限公司 一种pcb板除胶装置和方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328081A (en) * 1980-02-25 1982-05-04 Micro-Plate, Inc. Plasma desmearing apparatus and method
JPS6320833A (ja) * 1986-07-14 1988-01-28 Toshiba Corp アツシング装置
JPH05109674A (ja) * 1991-10-18 1993-04-30 Ushio Inc レジスト膜の灰化方法と灰化装置
JPH08180757A (ja) * 1994-12-21 1996-07-12 Nitto Denko Corp 接点部の形成方法
JPH10280151A (ja) * 1997-04-08 1998-10-20 Fujitsu Ltd Cvd装置のクリーニング方法
US7566664B2 (en) * 2006-08-02 2009-07-28 Qualcomm Mems Technologies, Inc. Selective etching of MEMS using gaseous halides and reactive co-etchants
JP2010027702A (ja) * 2008-07-16 2010-02-04 Hitachi Kokusai Electric Inc 基板処理装置及び薄膜生成方法

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