JP2016012523A - Lamp device and lighting device - Google Patents

Lamp device and lighting device Download PDF

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Publication number
JP2016012523A
JP2016012523A JP2014134630A JP2014134630A JP2016012523A JP 2016012523 A JP2016012523 A JP 2016012523A JP 2014134630 A JP2014134630 A JP 2014134630A JP 2014134630 A JP2014134630 A JP 2014134630A JP 2016012523 A JP2016012523 A JP 2016012523A
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Prior art keywords
power supply
supply circuit
end side
housing
casing
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JP2014134630A
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Japanese (ja)
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JP6269951B2 (en
Inventor
武志 久安
Takeshi Hisayasu
武志 久安
山田　太一
Taichi Yamada
太一 山田
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Priority to JP2014134630A priority Critical patent/JP6269951B2/en
Priority to EP15150929.6A priority patent/EP2963332A1/en
Priority to CN201520045415.0U priority patent/CN204611393U/en
Publication of JP2016012523A publication Critical patent/JP2016012523A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

PROBLEM TO BE SOLVED: To provide a lamp device ensuring insulation properties and also improved in radiation performance.SOLUTION: A lamp device 10 includes a housing 11, a radiation plate 12, a light-emitting module 13, a power supply circuit 16 and a cap 17. The housing 11 is provided with a resin housing 20 and a metal housing 21. The resin housing 20 is set in a hollow state with one end side open and includes a pair of power supply circuit holding parts 35 set from one end side to the other end side inside it. The metal housing 21 includes a pair of metal housing members 39 formed by being separated into two parts while setting the pair of power supply circuit holding parts 35 as a boundary. The pair of metal housing members 39 are set on both sides of the pair of power supply circuit holding parts 35 each along the inside of the resin housing 20. The radiation plate 12 is set to one end side of the housing 11, and comes in contact to the metal housing 21. The light-emitting module 13 is set to one end side of the radiation plate 12. The power supply circuit 16 is set inside the housing 11 while being held by the pair of power supply circuit holding parts 35. The cap 17 is set to the other end side of the resin housing 20.

Description

本発明の実施形態は、発光モジュールを用いたランプ装置、およびこのランプ装置を用いた照明装置に関する。   Embodiments described herein relate generally to a lamp device using a light emitting module and an illumination device using the lamp device.

従来、発光モジュールを用いたランプ装置は、放熱性を確保するために、外郭が金属筐体で構成され、この金属筐体の一端側に発光モジュールが配置されている。また、絶縁性を確保するために、金属筐体の内部に樹脂ケースが配置され、樹脂ケースの内部に電源回路が収容されている。   2. Description of the Related Art Conventionally, in a lamp device using a light emitting module, an outer shell is configured with a metal casing in order to ensure heat dissipation, and the light emitting module is disposed on one end side of the metal casing. Moreover, in order to ensure insulation, the resin case is arrange | positioned inside the metal housing | casing, and the power supply circuit is accommodated in the inside of the resin case.

ランプ装置の外郭が金属筐体で構成されているが、ランプ装置の絶縁性の確保のために、外郭が樹脂筐体で構成され、そのうえで放熱性も向上できることが望まれている。   Although the outer shell of the lamp device is configured with a metal casing, it is desired that the outer casing is configured with a resin casing and heat dissipation can be improved in order to ensure insulation of the lamp device.

特許第５２５７６２７号公報Japanese Patent No. 5257627

本発明が解決しようとする課題は、絶縁性を確保し、放熱性も向上できるランプ装置、およびこのランプ装置を用いた照明装置を提供することである。   The problem to be solved by the present invention is to provide a lamp device capable of ensuring insulation and improving heat dissipation, and a lighting device using the lamp device.

実施形態のランプ装置は、筐体、放熱板、発光モジュール、電源回路および給電部を備える。筐体は、樹脂筐体および金属筐体を備える。樹脂筐体は、一端側が開口する中空状に設けるとともに内側に一端側から他端側に沿って設けた一対の電源回路保持部を有する。金属筐体は、一対の電源回路保持部を境として２分割した一対の金属筐体部材を有する。一対の金属筐体部材は、一対の電源回路保持部の両側にそれぞれ樹脂筐体の内側に沿って配置する。放熱板は、筐体の一端側に配設し、金属筐体に接触する。発光モジュールは、放熱板の一端側に配設する。電源回路は、一対の電源回路保持部に保持して筐体の内部に配置する。給電部は、樹脂筐体の他端側に設ける。   The lamp device of the embodiment includes a housing, a heat sink, a light emitting module, a power supply circuit, and a power feeding unit. The housing includes a resin housing and a metal housing. The resin casing is provided in a hollow shape with one end opened, and has a pair of power circuit holding portions provided on the inner side from one end to the other end. The metal casing has a pair of metal casing members divided into two with the pair of power supply circuit holding portions as a boundary. The pair of metal housing members are arranged along the inside of the resin housing on both sides of the pair of power supply circuit holding portions. The heat radiating plate is disposed on one end side of the casing and contacts the metal casing. The light emitting module is disposed on one end side of the heat sink. The power supply circuit is held in a pair of power supply circuit holding portions and disposed inside the housing. The power feeding unit is provided on the other end side of the resin casing.

本発明によれば、絶縁性を確保し、放熱性も向上することが期待できる。   According to the present invention, it can be expected to ensure insulation and improve heat dissipation.

第１の実施形態を示すランプ装置の断面図である。It is sectional drawing of the lamp device which shows 1st Embodiment. 同上ランプ装置の筐体の内側を示す斜視図である。It is a perspective view which shows the inner side of the housing | casing of a lamp device same as the above. 同上ランプ装置の分解状態の斜視図である。It is a perspective view of the decomposition | disassembly state of a lamp device same as the above. 同上ランプ装置の組立状態の斜視図である。It is a perspective view of the assembly state of a lamp device same as the above. 同上ランプ装置を用いた照明装置の斜視図である。It is a perspective view of the illuminating device using a lamp device same as the above. 第２の実施形態を示すランプ装置の断面図である。It is sectional drawing of the lamp device which shows 2nd Embodiment. 第３の実施形態を示すランプ装置の断面図である。It is sectional drawing of the lamp device which shows 3rd Embodiment. 第４の実施形態を示すランプ装置の断面図である。It is sectional drawing of the lamp device which shows 4th Embodiment.

以下、第１の実施形態を、図１ないし図５を参照して説明する。   Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 5.

図１ないし図４において、ランプ装置10は、筐体11、筐体11の一端側に配置される放熱板12、放熱板12の一端側の面に取り付けられる発光モジュール13、発光モジュール13の中央に配置されるカバー14、筐体11の一端側に取り付けられるグローブ15、筐体11の内部に配置される電源回路（点灯回路）16、および筐体11の他端側に取り付けられる給電部としての口金17を備えている。なお、本実施形態では、グローブ15から口金17に亘ってランプ装置10の中心を通る仮想のランプ中心軸を有し、このランプ中心軸において、口金17から見てグローブ15が位置している方向を一端側、一端側とは反対側であってグローブ15から見て口金17が位置している方向を他端側と称して説明する。   1 to 4, a lamp device 10 includes a housing 11, a heat sink 12 disposed on one end of the housing 11, a light emitting module 13 attached to a surface on one end of the heat sink 12, and the center of the light emitting module 13. As a cover 14, a globe 15 attached to one end of the housing 11, a power circuit (lighting circuit) 16 placed inside the housing 11, and a power supply unit attached to the other end of the housing 11 The base 17 is provided. In the present embodiment, there is a virtual lamp central axis that passes through the center of the lamp device 10 from the globe 15 to the base 17, and the direction in which the globe 15 is located when viewed from the base 17 in this lamp central axis. The one end side, the direction opposite to the one end side, and the direction in which the cap 17 is located when viewed from the globe 15 will be referred to as the other end side.

そして、筐体11は、中空状の樹脂筐体20、および樹脂筐体20の内側に配置される金属筐体21を備えている。   The casing 11 includes a hollow resin casing 20 and a metal casing 21 disposed inside the resin casing 20.

樹脂筐体20は、絶縁性を有する樹脂材料によって形成されている。樹脂筐体20は、一端側および他端側がそれぞれ開口するとともに一端側から他端側に向けて縮径する円筒状に形成されている。本実施形態では、樹脂筐体20は、一端側に位置する一端筒部23a、一端筒部23aから他端側へ向けて縮径する傾斜筒部23b、傾斜筒部23bの他端側に位置する中間筒部23c、中間筒部23cから他端側へ向けて縮径する傾斜筒部23d、および傾斜筒部23dの他端側に位置する他端筒部23eを備えている。樹脂筐体20の内部には、一端側および他端側にそれぞれ開口する空洞部24が形成されている。樹脂筐体20の厚みは、２〜４ｍｍ程度が好ましい。２ｍｍより薄いと、強度や絶縁性の確保が難しくなり、一方、４ｍｍより厚いと、熱が逃げにくく、放熱性が低下する。   The resin casing 20 is made of an insulating resin material. The resin casing 20 is formed in a cylindrical shape that opens at one end side and the other end side and has a diameter reduced from the one end side toward the other end side. In the present embodiment, the resin casing 20 is positioned on the other end side of the one end cylindrical portion 23a located on one end side, the inclined cylindrical portion 23b that decreases in diameter from the one end cylindrical portion 23a toward the other end side, and the inclined cylindrical portion 23b. An intermediate cylinder part 23c, an inclined cylinder part 23d whose diameter decreases from the intermediate cylinder part 23c toward the other end side, and an other end cylinder part 23e located on the other end side of the inclined cylinder part 23d. Inside the resin casing 20, a cavity 24 is formed that opens to one end side and the other end side. The thickness of the resin casing 20 is preferably about 2 to 4 mm. If it is thinner than 2 mm, it is difficult to ensure strength and insulation, while if it is thicker than 4 mm, it is difficult for heat to escape and heat dissipation is reduced.

樹脂筐体20の一端側には、平坦状の基板取付部25が形成されているとともに、基板取付部25の周囲から一端側に突出する周壁部26が形成されている。   A flat substrate mounting portion 25 is formed on one end side of the resin casing 20, and a peripheral wall portion 26 protruding from the periphery of the substrate mounting portion 25 to one end side is formed.

基板取付部25には、放熱板12および金属筐体21を樹脂筐体20に共締め固定する複数のねじとしての第１のねじ27が螺合する複数の取付孔28が形成されている。さらに、基板取付部25には、発光モジュール13を放熱板12に締め付け固定する複数の第２のねじ29が侵入する複数の逃げ孔30が形成されている。さらに、基板取付部25には、樹脂筐体20に組み込まれる金属筐体21、放熱板12および発光モジュール13をそれぞれ位置決めするための位置決め突起31が突設されている。   The board mounting portion 25 is formed with a plurality of mounting holes 28 into which first screws 27 as a plurality of screws for fastening the heat sink 12 and the metal casing 21 together with the resin casing 20 are screwed together. Furthermore, a plurality of escape holes 30 into which a plurality of second screws 29 for fastening and fixing the light emitting module 13 to the heat radiating plate 12 enter are formed in the board mounting portion 25. Further, a positioning protrusion 31 for positioning the metal casing 21, the heat sink 12 and the light emitting module 13 incorporated in the resin casing 20 is provided on the board mounting portion 25.

周壁部26の内周には、グローブ15を回動装着する複数のグローブ取付溝32が形成されている。周壁部26の一端側の面には、グローブ15との間を防水構造とする環状のパッキング33が配置されている。周壁部26は樹脂筐体20の外径方向に突出しており、周壁部26と樹脂筐体20の外周面との間に複数のフィン部34が形成されている。   On the inner periphery of the peripheral wall portion 26, a plurality of glove attachment grooves 32 for turning and mounting the globe 15 are formed. On the surface on one end side of the peripheral wall portion 26, an annular packing 33 having a waterproof structure with the globe 15 is disposed. The peripheral wall portion 26 protrudes in the outer diameter direction of the resin casing 20, and a plurality of fin portions 34 are formed between the peripheral wall portion 26 and the outer peripheral surface of the resin casing 20.

樹脂筐体20の内側には、ランプ中心軸に対して対称位置に、樹脂筐体20の一端側から他端側に沿って一対の電源回路保持部35が形成されている。一対の電源回路保持部35は、樹脂筐体20の内面から突出する一対の保持壁36、およびこれら一対の保持壁36間に形成された保持溝37を有している。すなわち、一対の保持壁36および保持溝37が、樹脂筐体20の内側に一端側から他端側に沿って形成されている。本実施形態では、電源回路保持部35は、樹脂筐体20の一端筒部23aから傾斜筒部23bおよび中間筒部23cの途中位置までの第１の形成領域と、他端筒部23eの第２の形成領域とに分割して形成されている。第１の形成領域は、樹脂筐体20の内側に配置される金属筐体21の配置領域に対応した領域となっている。なお、電源回路保持部35は、第１の形成領域と第２の形成領域とに亘って連続して形成されていてもよい。また、一対の保持壁36が並ぶ方向における保持壁36の幅寸法は、電源回路16と金属筐体21との絶縁と保持壁36の強度とを考慮して１ｍｍ以上であることが好ましい。   Inside the resin casing 20, a pair of power supply circuit holding portions 35 are formed along the other end side from one end side of the resin casing 20 at a symmetrical position with respect to the lamp central axis. The pair of power circuit holding portions 35 includes a pair of holding walls 36 protruding from the inner surface of the resin casing 20 and a holding groove 37 formed between the pair of holding walls 36. That is, a pair of holding walls 36 and holding grooves 37 are formed inside the resin casing 20 from one end side to the other end side. In the present embodiment, the power circuit holding unit 35 includes the first forming region from the one end cylindrical portion 23a of the resin casing 20 to the middle position of the inclined cylindrical portion 23b and the intermediate cylindrical portion 23c, and the second end cylindrical portion 23e. It is divided into two formation regions. The first formation area is an area corresponding to the arrangement area of the metal casing 21 arranged inside the resin casing 20. The power supply circuit holding unit 35 may be formed continuously over the first formation region and the second formation region. Further, the width dimension of the holding wall 36 in the direction in which the pair of holding walls 36 are arranged is preferably 1 mm or more in consideration of the insulation between the power supply circuit 16 and the metal casing 21 and the strength of the holding wall 36.

金属筐体21は、一対の電源回路保持部35を境として２分割されていて一対の電源回路保持部35の両側にそれぞれ樹脂筐体20の内側に沿って配置される一対の金属筐体部材39を有している。一対の金属筐体部材39は、例えば、アルミニウム等の金属材料で、プレス成形によって形成されている。一対の金属筐体部材39は、同一形状に形成されている。   The metal casing 21 is divided into two parts with the pair of power supply circuit holding sections 35 as a boundary, and a pair of metal casing members disposed along the inside of the resin casing 20 on both sides of the pair of power supply circuit holding sections 35, respectively. 39. The pair of metal housing members 39 are made of a metal material such as aluminum and formed by press molding, for example. The pair of metal housing members 39 are formed in the same shape.

金属筐体部材39の板厚は、ある程度の厚みがないと十分な熱伝導性が得られず、一方、ある程度の厚みよりも厚くなっても質量が増加するばかりで熱伝導性の向上が少なくなるため、１〜３．５ｍｍ程度が好ましい。そして、より好ましい金属筐体部材39の板厚は２ｍｍである。   If the thickness of the metal casing member 39 is not a certain level, sufficient thermal conductivity cannot be obtained. On the other hand, even if the thickness is larger than a certain level, the mass only increases and the improvement in thermal conductivity is small. Therefore, about 1 to 3.5 mm is preferable. A more preferable thickness of the metal housing member 39 is 2 mm.

金属筐体部材39は、一端側から他端側に向けて縮径する半円筒状に形成されている。本実施形態では、樹脂筐体20の一端筒部23aの内側に沿って配置される一端半円筒部40a、傾斜筒部23bの内側に沿って配置される傾斜半円筒部40b、および中間筒部23cの内側に沿って配置される他端半円筒部40cを備えている。他端半円筒部40cの他端は中間筒部23cの途中位置までの長さに形成されている。   The metal housing member 39 is formed in a semi-cylindrical shape whose diameter is reduced from one end side toward the other end side. In the present embodiment, the one-end semi-cylindrical portion 40a disposed along the inner side of the one-end cylindrical portion 23a of the resin casing 20, the inclined semi-cylindrical portion 40b disposed along the inner side of the inclined cylindrical portion 23b, and the intermediate cylindrical portion The other end semi-cylindrical part 40c arrange | positioned along the inner side of 23c is provided. The other end of the other end semi-cylindrical portion 40c is formed to have a length up to an intermediate position of the intermediate cylindrical portion 23c.

金属筐体部材39の一端側には、基板取付部25に配置されるフランジ部41が形成されている。フランジ部41には、基板取付部25の位置決め突起31に嵌り込む位置決め溝42が形成されている。さらに、フランジ部41には、第１のねじ27が挿通する複数の挿通孔43が形成されているとともに、第２のねじ29が螺合する複数のねじ孔44が形成されている。   On one end side of the metal housing member 39, a flange portion 41 disposed on the board mounting portion 25 is formed. The flange portion 41 is formed with a positioning groove 42 that fits into the positioning protrusion 31 of the board mounting portion 25. Further, the flange portion 41 is formed with a plurality of insertion holes 43 through which the first screw 27 is inserted, and a plurality of screw holes 44 into which the second screw 29 is screwed.

また、放熱板12は、例えばアルミニウム等の金属材料で、平板状に形成されている。放熱板12の中央には貫通孔47が形成されている。放熱板12の外周部は、金属筐体部材39のフランジ部41に重なるように基板取付部25に配置される。放熱板12の外周部には、基板取付部25の位置決め突起31に嵌り込む位置決め溝48が形成されている。さらに、放熱板12の外周部には、複数の第１のねじ27が挿通する複数の挿通孔49、および複数の第２のねじ29が螺着する複数のねじ孔50aおよび複数の第２のねじ29が挿通する複数の挿通孔50bが形成されている。また、放熱板12の内周部には、複数の第３のねじ51が螺合する複数のねじ孔52が形成されている。第３のねじ51は、カバー14と発光モジュール13と放熱板12とを共締め固定するように構成されている。   Further, the heat radiating plate 12 is made of a metal material such as aluminum and is formed in a flat plate shape. A through hole 47 is formed in the center of the heat sink 12. The outer peripheral portion of the heat radiating plate 12 is disposed on the board mounting portion 25 so as to overlap the flange portion 41 of the metal casing member 39. A positioning groove 48 that fits into the positioning protrusion 31 of the board mounting portion 25 is formed on the outer peripheral portion of the heat radiating plate 12. Furthermore, a plurality of insertion holes 49 through which a plurality of first screws 27 are inserted, a plurality of screw holes 50a into which a plurality of second screws 29 are screwed, and a plurality of second holes are formed in the outer peripheral portion of the heat radiating plate 12. A plurality of insertion holes 50b through which the screws 29 are inserted are formed. A plurality of screw holes 52 into which a plurality of third screws 51 are screwed are formed in the inner peripheral portion of the heat radiating plate 12. The third screw 51 is configured to fasten and fix the cover 14, the light emitting module 13, and the heat sink 12 together.

また、発光モジュール13は、基板55、および基板55の一端側の面に実装された複数の発光素子56を備えている。   The light emitting module 13 includes a substrate 55 and a plurality of light emitting elements 56 mounted on a surface on one end side of the substrate 55.

基板55は、熱伝導性に優れた材料、例えばアルミニウムやセラミック等で平板状に形成されている。基板55の中央には、貫通孔57が形成されている。基板55の一端側の面には、発光素子56を実装する配線パターンが形成されている。   The substrate 55 is formed in a flat plate shape from a material having excellent thermal conductivity, such as aluminum or ceramic. A through hole 57 is formed in the center of the substrate 55. A wiring pattern for mounting the light emitting element 56 is formed on the surface on one end side of the substrate 55.

基板55の外周部には、基板取付部25の位置決め突起31に嵌り込む位置決め溝58が形成されている。さらに、基板55の外周部には、複数の第１のねじ27が挿通する複数の挿通孔59、複数の第２のねじ29が挿通する複数の挿通孔60が形成されている。基板55の内周部には、複数の第３のねじ51が挿通する複数の挿通孔61が形成されている。 A positioning groove 58 that fits into the positioning protrusion 31 of the substrate mounting portion 25 is formed on the outer peripheral portion of the substrate 55. Further, a plurality of insertion holes 59 through which the plurality of first screws 27 are inserted and a plurality of insertion holes 60 through which the plurality of second screws 29 are inserted are formed in the outer peripheral portion of the substrate 55. A plurality of insertion holes 61 through which the plurality of third screws 51 are inserted are formed in the inner peripheral portion of the substrate 55.

発光素子56は、例えば複数のＬＥＤが用いられ、基板55の一端側の面に周方向に沿って所定の間隔で実装されている。ＬＥＤの場合には、青色発光のＬＥＤチップを黄色蛍光体層で被覆したＳＭＤパッケージが用いられる。なお、発光モジュール13には、基板55に複数のＬＥＤを実装して黄色蛍光体層で被覆したＣＯＢモジュールを用いてもよく、あるいは、ＬＥＤ以外の例えば有機ＥＬ等の他の発光素子を用いてもよい。   For example, a plurality of LEDs are used as the light emitting element 56, and are mounted on a surface on one end side of the substrate 55 at a predetermined interval along the circumferential direction. In the case of an LED, an SMD package in which a blue light emitting LED chip is covered with a yellow phosphor layer is used. The light emitting module 13 may be a COB module in which a plurality of LEDs are mounted on a substrate 55 and covered with a yellow phosphor layer, or other light emitting elements such as an organic EL other than LEDs are used. Also good.

なお、基板55には、基板55の配線パターンに電気的に接続される図示しないコネクタが実装されている。   Note that a connector (not shown) that is electrically connected to the wiring pattern of the substrate 55 is mounted on the substrate 55.

また、カバー14は、放熱板12および基板55よりも熱伝導性が低い、例えば熱伝導率が０．５Ｗ／ｍｋ以下の樹脂材料で形成されている。カバー14の中央には、基板55の貫通孔57および放熱板12の貫通孔47を挿通して放熱板12の他端側の面よりも突出する突出部64が形成されている。突出部64には、発光モジュール13のコネクタと電気的に接続するために電源回路16から導出されるコネクタ付配線を通す配線孔65が形成されている。突出部64の他端側の面には樹脂筐体20に配置された電源回路16を押える押え部64aが形成されている。また、カバー14の外周部には、基板55の一端側の面に配置されるフランジ部66が形成されている。フランジ部66には、複数の第３のねじ51が挿通する複数の挿通孔67が形成されている。なお、カバー14の少なくとも一端側の面は、例えば白色面等に形成されていて高反射特性を有している。   The cover 14 is formed of a resin material having lower thermal conductivity than the heat radiating plate 12 and the substrate 55, for example, having a thermal conductivity of 0.5 W / mk or less. At the center of the cover 14, a protruding portion 64 is formed that protrudes from the surface on the other end side of the heat radiating plate 12 through the through hole 57 of the substrate 55 and the through hole 47 of the heat radiating plate 12. In the projecting portion 64, a wiring hole 65 is formed through which the connector-attached wiring led out from the power supply circuit 16 is electrically connected to the connector of the light emitting module 13. A pressing portion 64 a that presses the power supply circuit 16 disposed in the resin casing 20 is formed on the other end surface of the protruding portion 64. Further, a flange portion 66 is formed on the outer peripheral portion of the cover 14 so as to be disposed on the surface on one end side of the substrate 55. The flange portion 66 has a plurality of insertion holes 67 through which the plurality of third screws 51 are inserted. Note that at least one surface of the cover 14 is formed on, for example, a white surface and has high reflection characteristics.

また、グローブ15は、光透過性および光拡散性を有している。グローブ15は、例えばポリカーボネート等の合成樹脂中に拡散材を混入して乳白色に形成されている。グローブ15は、外周側よりも中央側が一端側に膨らむドーム状に形成されている。グローブ15の外周部には樹脂筐体20の複数のグローブ取付溝32に回動装着される複数の取付部69が形成されている。グローブ15の外周部は樹脂筐体20の周壁部26にパッキング33を介して取り付けられ、防水構造とされている。   In addition, the globe 15 has light transmittance and light diffusibility. The globe 15 is formed milky white by mixing a diffusing material in a synthetic resin such as polycarbonate. The globe 15 is formed in a dome shape in which the center side swells to one end side rather than the outer peripheral side. A plurality of attachment portions 69 that are rotationally attached to the plurality of globe attachment grooves 32 of the resin casing 20 are formed on the outer periphery of the globe 15. The outer peripheral portion of the globe 15 is attached to the peripheral wall portion 26 of the resin casing 20 via a packing 33, and has a waterproof structure.

また、電源回路16は、口金17から入力する交流電力を整流するとともに所定の直流電力に変換して発光モジュール13の発光素子56に供給し、発光素子56を発光させる。   The power supply circuit 16 rectifies the AC power input from the base 17 and converts the AC power into predetermined DC power and supplies it to the light emitting element 56 of the light emitting module 13 to cause the light emitting element 56 to emit light.

電源回路16は、回路基板72、および回路基板72に実装された複数の電子部品73を備えている。回路基板72の一方の面に配線パターンが形成され、回路基板72に実装される電子部品73が配線パターンに電気的に接続されている。   The power supply circuit 16 includes a circuit board 72 and a plurality of electronic components 73 mounted on the circuit board 72. A wiring pattern is formed on one surface of the circuit board 72, and an electronic component 73 mounted on the circuit board 72 is electrically connected to the wiring pattern.

回路基板72は、樹脂筐体20の一端側から空洞部24に挿入されるとともに、回路基板72の両側縁が一対の電源回路保持部35に挿入されて保持される。電源回路保持部35に挿入される回路基板72の側縁は、一対の保持壁36間の保持壁37に挿入される。   The circuit board 72 is inserted into the cavity portion 24 from one end side of the resin casing 20, and both side edges of the circuit board 72 are inserted and held in the pair of power supply circuit holding portions 35. The side edge of the circuit board 72 inserted into the power supply circuit holding unit 35 is inserted into the holding wall 37 between the pair of holding walls 36.

回路基板72の両側縁は、樹脂筐体20の内側の形状に対応した形状に形成されている。すなわち、樹脂筐体20の一端筒部23aの内側に沿って配置される一端縁部74a、傾斜筒部23bの内側に沿って配置される傾斜縁部74b、中間筒部23cの内側に沿って配置される中間縁部74c、傾斜筒部23dの内側に沿って配置される傾斜縁部74d、および他端筒部23eの内側に沿って配置される他端縁部74eを備えている。そして、回路基板72を樹脂筐体20の一端側から空洞部24に挿入した際に、傾斜縁部74bおよび傾斜縁部74dが傾斜筒部23bおよび傾斜筒部23dに当接し、樹脂筐体20に対して回路基板72の他端方向への位置決めがなされる。   Both side edges of the circuit board 72 are formed in a shape corresponding to the inner shape of the resin casing 20. That is, the one end edge portion 74a disposed along the inner side of the one end cylindrical portion 23a of the resin casing 20, the inclined edge portion 74b disposed along the inner side of the inclined cylindrical portion 23b, and the inner side of the intermediate cylindrical portion 23c. The intermediate edge portion 74c is disposed, the inclined edge portion 74d is disposed along the inner side of the inclined cylindrical portion 23d, and the other end edge portion 74e is disposed along the inner side of the other end cylindrical portion 23e. Then, when the circuit board 72 is inserted into the cavity portion 24 from one end side of the resin casing 20, the inclined edge portion 74b and the inclined edge portion 74d abut against the inclined cylindrical portion 23b and the inclined cylindrical portion 23d, and the resin casing 20 On the other hand, the circuit board 72 is positioned in the other end direction.

回路基板72の一端にはカバー14が当接する当接部75が突設されている。   At one end of the circuit board 72, a contact portion 75 with which the cover 14 contacts is projected.

電源回路16は、回路基板72の他端側を口金17に電気的に接続する入力側とし、回路基板72の一端側を発光モジュール13に接続する出力側としている。それに対応して、電源回路16を構成する各種の電子部品73が回路基板72に実装されている。電源回路16の出力側には発光モジュール13に電気的に接続するためのコネクタ付配線が導出されている。   In the power supply circuit 16, the other end side of the circuit board 72 is an input side that is electrically connected to the base 17, and one end side of the circuit board 72 is an output side that is connected to the light emitting module 13. Correspondingly, various electronic components 73 constituting the power supply circuit 16 are mounted on the circuit board 72. On the output side of the power supply circuit 16, a wiring with a connector for electrical connection to the light emitting module 13 is led out.

また、口金17は、例えばＥ２６形口金が用いられている。口金17は、樹脂筐体20の他端筒部23eの外周に取り付けられる金属製のシェル78、シェル78の他端側に設けられる絶縁部79、および絶縁部79の頂部に設けられる金属製のアイレット80を有している。なお、図面では省略しているが、シェル78の周囲には螺旋状のねじが形成されている。そして、シェル78およびアイレット80が電源回路16の入力側に電気的に接続されている。   Further, as the base 17, for example, an E26 type base is used. The base 17 is made of a metal shell 78 attached to the outer periphery of the other end cylindrical portion 23e of the resin housing 20, an insulating portion 79 provided on the other end side of the shell 78, and a metal provided on the top of the insulating portion 79. It has an eyelet 80. Although not shown in the drawing, a spiral screw is formed around the shell 78. The shell 78 and the eyelet 80 are electrically connected to the input side of the power supply circuit 16.

また、図５にランプ装置10を用いた照明装置83を示す。照明装置83は、器具本体84、器具本体84内に配置されたソケット85を有している。ランプ装置10は、器具本体84に挿入されるとともに、口金17がソケット85に装着されている。そして、ソケット85を通じてランプ装置10に交流電力を供給する。   FIG. 5 shows an illumination device 83 using the lamp device 10. The lighting device 83 includes an instrument main body 84 and a socket 85 arranged in the instrument main body 84. The lamp device 10 is inserted into the instrument body 84 and the base 17 is attached to the socket 85. Then, AC power is supplied to the lamp device 10 through the socket 85.

次に、本実施形態の作用を説明する。   Next, the operation of this embodiment will be described.

ランプ装置10を組み立てるには、樹脂筐体20の内側に一対の金属筐体部材39および電源回路16を順に挿入する。   In order to assemble the lamp device 10, a pair of metal casing members 39 and the power supply circuit 16 are sequentially inserted inside the resin casing 20.

一対の金属筐体部材39は、一対の電源回路保持部35の両側に、それぞれ樹脂筐体20の内側に沿って挿入配置する。このとき、金属筐体部材39の位置決め溝42を樹脂筐体20の位置決め突起31に合わせて嵌め込むことにより、金属筐体部材39と樹脂筐体20との周方向における位置が位置決めされる。なお、樹脂筐体20の内側と金属筐体部材39の外側との間には、それらの間の隙間を埋めて密着させるために、例えば熱伝導グリスや熱伝導シート等の熱伝導部材を介在させることが好ましい。   The pair of metal casing members 39 are inserted and arranged along the inside of the resin casing 20 on both sides of the pair of power supply circuit holding portions 35, respectively. At this time, by positioning the positioning groove 42 of the metal casing member 39 in accordance with the positioning projection 31 of the resin casing 20, the positions of the metal casing member 39 and the resin casing 20 in the circumferential direction are positioned. In addition, between the inner side of the resin casing 20 and the outer side of the metal casing member 39, for example, a thermal conductive member such as thermal conductive grease or a thermal conductive sheet is interposed in order to close and close the gap between them. It is preferable to make it.

電源回路16は、回路基板72の両側縁を一対の電源回路保持部35に挿入する。このとき、回路基板72の側縁を一対の保持壁36間の保持溝37に挿入する。そして、回路基板72の傾斜縁部74bおよび傾斜縁部74dが樹脂筐体20の傾斜筒部23bおよび傾斜筒部23dに当接し、回路基板72の挿入が規制される。   The power supply circuit 16 inserts both side edges of the circuit board 72 into the pair of power supply circuit holding portions 35. At this time, the side edge of the circuit board 72 is inserted into the holding groove 37 between the pair of holding walls 36. Then, the inclined edge portion 74b and the inclined edge portion 74d of the circuit board 72 come into contact with the inclined cylinder portion 23b and the inclined cylinder portion 23d of the resin casing 20, and insertion of the circuit board 72 is restricted.

さらに、樹脂筐体20の基板取付部25に放熱板12を配置し、第１のねじ27で放熱板12の外周部および金属筐体部材39のフランジ部41を樹脂筐体20に共締め固定する。このときも、放熱板12の位置決め溝48を樹脂筐体20の位置決め突起31に合わせて嵌め込むことにより、放熱板12と金属筐体部材39と樹脂筐体20との周方向における位置が位置決めされる。   Further, the heat radiating plate 12 is disposed on the board mounting portion 25 of the resin housing 20, and the outer peripheral portion of the heat radiating plate 12 and the flange portion 41 of the metal housing member 39 are fastened and fixed to the resin housing 20 with the first screw 27. To do. Also at this time, the positioning groove 48 of the heat sink 12 is fitted to the positioning protrusion 31 of the resin casing 20 so that the positions of the heat sink 12, the metal casing member 39, and the resin casing 20 in the circumferential direction are positioned. Is done.

放熱板12上に発光モジュール13を配置し、第２のねじ29で基板55の外周部を放熱板12または金属筐体部材39に締め付け固定する。このときも、基板55の位置決め溝58を樹脂筐体20の位置決め突起31に合わせて嵌め込むことにより、基板55と放熱板12と金属筐体部材39と樹脂筐体20との周方向における位置が位置決めされる。   The light emitting module 13 is disposed on the heat sink 12, and the outer periphery of the substrate 55 is fastened and fixed to the heat sink 12 or the metal housing member 39 with the second screw 29. Also at this time, by positioning the positioning groove 58 of the substrate 55 in alignment with the positioning projection 31 of the resin casing 20, the positions of the substrate 55, the heat sink 12, the metal casing member 39, and the resin casing 20 in the circumferential direction Is positioned.

さらに、電源回路16のコネクタ付配線をカバー14の配線孔65から引き出し、カバー14の突出部64を基板55の貫通孔57および放熱板12の貫通孔47に挿入する。第３のねじ51でカバー14のフランジ部66および基板55の内周部を放熱板12の内周部に共締め固定する。カバー14を基板55および放熱板12に取り付けると、カバー14の押え部64aが回路基板72の当接部75に当接し、カバー14と樹脂筐体20との間で回路基板72の一端側および他端側から挟み込んで位置決め保持する。   Further, the wiring with connector of the power supply circuit 16 is pulled out from the wiring hole 65 of the cover 14, and the protruding portion 64 of the cover 14 is inserted into the through hole 57 of the substrate 55 and the through hole 47 of the heat sink 12. The third screw 51 fastens the flange portion 66 of the cover 14 and the inner peripheral portion of the substrate 55 to the inner peripheral portion of the heat sink 12 together. When the cover 14 is attached to the substrate 55 and the heat sink 12, the holding portion 64a of the cover 14 contacts the contact portion 75 of the circuit board 72, and one end side of the circuit board 72 and between the cover 14 and the resin housing 20 and Position and hold by sandwiching from the other end side.

カバー14の配線孔65から引き出しておいたコネクタ付配線を基板55上のコネクタに接続する。グローブ15を、パッキング33を介して樹脂筐体20の一端に取り付ける。   The wiring with a connector drawn out from the wiring hole 65 of the cover 14 is connected to the connector on the substrate 55. The globe 15 is attached to one end of the resin casing 20 via the packing 33.

口金17を、電源回路16との電気的な接続を図りながら、樹脂筐体20の他端筒部23eに取り付ける。   The base 17 is attached to the other end cylindrical portion 23 e of the resin casing 20 while being electrically connected to the power supply circuit 16.

なお、ランプ装置10の組み立て順序は、このような順序に限られるものではない。   The assembly order of the lamp device 10 is not limited to such an order.

そして、照明装置83に装着されたランプ装置10の口金17に交流電力が供給されると、電源回路16で交流電力を整流するとともに所定の直流電力に変換し、直流電力を発光モジュール13の発光素子56に供給する。これによって、複数の発光素子56が発光し、光がグローブ15を透過して外部に放出される。   When AC power is supplied to the cap 17 of the lamp device 10 mounted on the lighting device 83, the AC power is rectified and converted into predetermined DC power by the power supply circuit 16, and the DC power is emitted from the light emitting module 13. Supply to element 56. As a result, the plurality of light emitting elements 56 emit light, and light passes through the globe 15 and is emitted to the outside.

ランプ装置10の点灯時には、発光素子56および電源回路16の電子部品73が発熱する。   When the lamp device 10 is turned on, the light emitting element 56 and the electronic component 73 of the power supply circuit 16 generate heat.

発光素子56が発生する熱は、主として、基板55および放熱板12を通じて金属筐体21に伝わり、さらに、金属筐体21から樹脂筐体20に伝わり、樹脂筐体20の表面から外気中に放熱される。   The heat generated by the light emitting element 56 is mainly transmitted to the metal casing 21 through the substrate 55 and the heat radiating plate 12, and further transferred from the metal casing 21 to the resin casing 20, and radiated from the surface of the resin casing 20 to the outside air. Is done.

電源回路16の電子部品73が発生する熱は、主として、回路基板72から樹脂筐体20に伝わり、樹脂筐体20の表面から外気中に放熱される。   The heat generated by the electronic component 73 of the power supply circuit 16 is mainly transmitted from the circuit board 72 to the resin casing 20, and is radiated from the surface of the resin casing 20 to the outside air.

ところで、発光素子56の熱が伝わる金属筐体21は温度が高くなるため、金属筐体21と電源回路16との距離が近いと、金属筐体21からの熱で電源回路16の温度が高くなってしまう。本実施形態では、電源回路16を保持する一対の電源回路保持部35を境として金属筐体21を一対の金属筐体部材39に２分割し、金属筐体部材39と電源回路16との距離を離しているため、金属筐体21からの熱で電源回路16の温度が高くなるのを低減することができる。   By the way, since the temperature of the metal casing 21 through which the heat of the light emitting element 56 is transmitted becomes high, if the distance between the metal casing 21 and the power supply circuit 16 is short, the temperature of the power supply circuit 16 increases due to the heat from the metal casing 21. turn into. In the present embodiment, the metal casing 21 is divided into a pair of metal casing members 39 with a pair of power supply circuit holding sections 35 holding the power supply circuit 16 as a boundary, and the distance between the metal casing member 39 and the power supply circuit 16 is divided. Therefore, the increase in the temperature of the power supply circuit 16 due to the heat from the metal casing 21 can be reduced.

そして、本実施形態のランプ装置10は、口金17をソケット85に装着した状態で指等が触れる可能性のある筐体11の外郭を樹脂筐体20で構成しているため、絶縁性を確保することができる。   In addition, the lamp device 10 of the present embodiment has a resin casing 20 that forms an outer shell of the casing 11 that may be touched by a finger or the like with the base 17 mounted on the socket 85, thus ensuring insulation. can do.

樹脂筐体20の内側に金属筐体21を配置し、金属筐体21に放熱板12を介して発光モジュール13の熱を伝え、金属筐体21から樹脂筐体20を通じて放熱できるため、放熱性を確保することができる。   Since the metal casing 21 is arranged inside the resin casing 20, the heat of the light emitting module 13 is transmitted to the metal casing 21 through the heat sink 12, and the heat can be dissipated from the metal casing 21 through the resin casing 20, Can be secured.

樹脂筐体20の内側に一対の電源回路保持部35を設け、金属筐体21は一対の電源回路保持部35を境として２分割された一対の金属筐体部材39で構成するとともに、一対の金属筐体部材39を一対の電源回路保持部35の両側にそれぞれ樹脂筐体20の内側に沿って配置するため、樹脂筐体20の内側に金属筐体21および電源回路16を一緒に配置する場合でも、金属筐体21と電源回路16との絶縁性を確保することができる。   A pair of power supply circuit holding parts 35 are provided inside the resin case 20, and the metal case 21 is composed of a pair of metal case members 39 divided into two with the pair of power supply circuit holding parts 35 as a boundary. Since the metal casing member 39 is disposed along the inside of the resin casing 20 on both sides of the pair of power supply circuit holding portions 35, the metal casing 21 and the power supply circuit 16 are disposed together inside the resin casing 20. Even in this case, the insulation between the metal casing 21 and the power supply circuit 16 can be ensured.

一対の金属筐体部材39は、同一形状に形成されているため、金属筐体部材39の製造性がよいとともに、金属筐体部材39を樹脂筐体20に組み込む際の組立性もよくできる。   Since the pair of metal casing members 39 are formed in the same shape, the metal casing member 39 is excellent in manufacturability and can be easily assembled when the metal casing member 39 is incorporated into the resin casing 20.

第１のねじ27で放熱板12および金属筐体部材39を樹脂筐体20に共締め固定するため、組立工数を削減できるとともに、放熱板12から金属筐体部材39への熱伝導性を向上できる。   Since the heat sink 12 and the metal housing member 39 are fastened and fixed to the resin housing 20 with the first screw 27, the number of assembly steps can be reduced and the thermal conductivity from the heat sink 12 to the metal housing member 39 is improved. it can.

第２のねじ29で基板55の外周部を放熱板12の外周部に締め付け固定し、第３のねじ51でカバー14および基板55の内周部を放熱板12の内周部に共締め固定するため、発光モジュール13の基板55および放熱板12の外周部および内周部を密着させることができ、基板55および放熱板12の全域での密着性が保たれ、基板55から放熱板12への熱伝導性を向上できる。   The outer periphery of the substrate 55 is fastened and fixed to the outer periphery of the heat sink 12 with the second screw 29, and the cover 14 and the inner periphery of the substrate 55 are fixed to the inner periphery of the heat sink 12 with the third screw 51. Therefore, the substrate 55 of the light emitting module 13 and the outer peripheral portion and the inner peripheral portion of the heat sink 12 can be brought into close contact with each other, and the adhesion of the entire area of the substrate 55 and the heat sink 12 is maintained. The thermal conductivity of can be improved.

カバー14を基板55および放熱板12に取り付けることにより、カバー14と樹脂筐体20との間で回路基板72の一端側および他端側から挟み込んで位置決め保持できる。   By attaching the cover 14 to the substrate 55 and the heat radiating plate 12, the cover 14 and the resin casing 20 can be sandwiched from one end side and the other end side of the circuit board 72 to be positioned and held.

次に、図６に第２の実施形態を示す。なお、第１の実施形態と同じ構成には同じ符号を用い、その構成および作用効果についての説明を省略する。   Next, FIG. 6 shows a second embodiment. In addition, the same code | symbol is used for the same structure as 1st Embodiment, and the description about the structure and effect is abbreviate | omitted.

電源回路16は、電子部品73の中でも最も発熱しやすい部類に属する発熱部品73aを有している。発熱部品73aとしては、例えば、電源回路16の入力側に配置される整流器等がある。この場合、発熱部品73aは、回路基板72の他端側に実装されていて、金属筐体21の他端側よりも外れた樹脂筐体20の内側、すなわち金属筐体21に囲まれない位置に配置されている。   The power supply circuit 16 includes a heat generating component 73a that belongs to a category that easily generates heat among the electronic components 73. Examples of the heat generating component 73a include a rectifier disposed on the input side of the power supply circuit 16. In this case, the heat generating component 73a is mounted on the other end side of the circuit board 72, and is located inside the resin casing 20 outside the other end side of the metal casing 21, that is, not surrounded by the metal casing 21. Is arranged.

樹脂筐体20には、金属筐体21よりも他端側にて、発熱部品73aを配置する配置部88が形成されている。本実施形態では、回路基板72に対向するように壁部89が立設され、回路基板72との間に発熱部品73aを配置する配置部88が形成されている。配置部88には、例えばシリコーン樹脂等の充填材90が充填され、発熱部品73aが樹脂筐体20に熱的に接続さている。   The resin casing 20 is provided with an arrangement portion 88 for arranging the heat generating component 73a on the other end side of the metal casing 21. In the present embodiment, a wall portion 89 is erected so as to face the circuit board 72, and an arrangement portion 88 is provided between the circuit board 72 and the heat generating component 73a. The arrangement portion 88 is filled with a filler 90 such as a silicone resin, and the heat generating component 73a is thermally connected to the resin casing 20.

そして、発熱部品73aを配置する配置部88を樹脂筐体20に形成することにより、金属筐体21からの熱的に影響を受けずに、発熱部品73aが発生する熱を樹脂筐体20の表面から効率よく放熱でき、発熱部品73aの温度を低減することができる。   Then, by forming the placement portion 88 in which the heat generating component 73a is disposed in the resin casing 20, the heat generated by the heat generating component 73a is not affected by the heat from the metal casing 21, but the resin casing 20 Heat can be efficiently radiated from the surface, and the temperature of the heat generating component 73a can be reduced.

配置部88に充填材90を充填することにより、発熱部品73aから樹脂筐体20への放熱性を向上できる。樹脂筐体20の内部全体に充填材90を充填してもよいが、ランプ装置10の質量が増加するため、放熱が必要な発熱部品73aの部分のみに充填材90を充填することにより、放熱性を確保しながら、ランプ装置10を軽量化できる。   By filling the placement portion 88 with the filler 90, the heat dissipation from the heat generating component 73a to the resin casing 20 can be improved. Filling material 90 may be filled in the entire interior of resin housing 20, but since the mass of lamp device 10 increases, heat is dissipated by filling filling material 90 only in the portion of heat-generating component 73a that requires heat radiation. Thus, it is possible to reduce the weight of the lamp device 10 while ensuring the performance.

次に、図７に第３の実施形態を示す。なお、各実施形態と同じ構成には同じ符号を用い、その構成および作用効果についての説明を省略する。   Next, FIG. 7 shows a third embodiment. In addition, the same code | symbol is used for the same structure as each embodiment, and the description about the structure and effect is abbreviate | omitted.

発熱部品73aは、例えば、電源回路16の出力側に配置されるスイッチング素子等がある。この場合、発熱部品73aは、回路基板72の一端側に実装されていて、金属筐体21の内側に配置される。   The heat generating component 73a includes, for example, a switching element disposed on the output side of the power supply circuit 16. In this case, the heat generating component 73a is mounted on one end side of the circuit board 72 and is disposed inside the metal casing 21.

放熱板12の内周部から電源回路16へ向けて突出部93を突設し、突出部93の先端が発熱部品73a自体や発熱部品73aが実装されている回路基板72の近傍位置に接触または近接するようにする。   A protrusion 93 protrudes from the inner peripheral portion of the heat sink 12 toward the power supply circuit 16, and the tip of the protrusion 93 contacts the heat generating component 73a itself or a position near the circuit board 72 on which the heat generating component 73a is mounted. Keep close.

なお、突出部93と発熱部品73aまたは回路基板72との間には、熱伝導性および絶縁性を向上させるために絶縁性を有する熱伝導シート等の熱伝導部材を挟み込んでもよい。熱伝導部材は、熱伝導率０．２〜１０Ｗ／ｍｋ、厚み０．５〜３ｍｍ程度が好ましい。   It should be noted that a heat conductive member such as a heat conductive sheet having an insulating property may be sandwiched between the protruding portion 93 and the heat generating component 73a or the circuit board 72 in order to improve the heat conductivity and the insulating property. The heat conductive member preferably has a thermal conductivity of 0.2 to 10 W / mk and a thickness of about 0.5 to 3 mm.

そして、発熱部品73aが発生する熱を突出部93から放熱板12および金属筐体21に伝えて放熱することができ、発熱部品73aの温度を低減することができる。   The heat generated by the heat generating component 73a can be transmitted from the protrusion 93 to the heat radiating plate 12 and the metal casing 21 to be dissipated, and the temperature of the heat generating component 73a can be reduced.

なお、突出部93を特定の発熱部品73aに対応して設けない場合でも、突出部93により電源回路16からの放熱経路を形成し、電源回路16の温度を低減することができる。   Even if the protrusion 93 is not provided corresponding to the specific heat generating component 73a, the heat dissipation path from the power supply circuit 16 can be formed by the protrusion 93, and the temperature of the power supply circuit 16 can be reduced.

次に、図８に第４の実施形態を示す。なお、各実施形態と同じ構成には同じ符号を用い、その構成および作用効果についての説明を省略する。   Next, FIG. 8 shows a fourth embodiment. In addition, the same code | symbol is used for the same structure as each embodiment, and the description about the structure and effect is abbreviate | omitted.

発熱部品73aが、回路基板72の一端側と他端側との中間位置に実装されていて、金属筐体21の内側に配置される場合である。   This is a case where the heat generating component 73a is mounted at an intermediate position between the one end side and the other end side of the circuit board 72 and disposed inside the metal casing 21.

金属筐体21から電源回路16へ向けて突出部96を突設し、突出部96の先端が発熱部品73a自体や発熱部品73aが実装されている回路基板72の近傍位置に接触または近接するようにする。   A protruding portion 96 is projected from the metal housing 21 toward the power supply circuit 16, and the tip of the protruding portion 96 is in contact with or close to the position near the heat generating component 73a itself or the circuit board 72 on which the heat generating component 73a is mounted. To.

なお、突出部96と発熱部品73aまたは回路基板72との間には、熱伝導性および絶縁性を向上させるために絶縁性を有する熱伝導シート等の熱伝導部材を挟み込んでもよい。熱伝導部材は、熱伝導率０．２〜１０Ｗ／ｍｋ、厚み０．５〜３ｍｍ程度が好ましい。   Note that a heat conductive member such as a heat conductive sheet having insulation properties may be sandwiched between the protruding portion 96 and the heat generating component 73a or the circuit board 72 in order to improve the heat conductivity and insulation properties. The heat conductive member preferably has a thermal conductivity of 0.2 to 10 W / mk and a thickness of about 0.5 to 3 mm.

そして、発熱部品73aが発生する熱を突出部96から金属筐体21に伝えて放熱することができ、発熱部品73aの温度を低減することができる。   Then, the heat generated by the heat generating component 73a can be transmitted from the protrusion 96 to the metal casing 21 to be radiated, and the temperature of the heat generating component 73a can be reduced.

なお、突出部96を特定の発熱部品73aに対応して設けない場合でも、突出部96により電源回路16からの放熱経路を形成し、電源回路16の温度を低減することができる。   Even when the protrusion 96 is not provided corresponding to the specific heat generating component 73a, the heat dissipation path from the power supply circuit 16 can be formed by the protrusion 96, and the temperature of the power supply circuit 16 can be reduced.

なお、筐体11は、金属筐体21の金属筐体部材39を樹脂筐体20にインサート成形によって形成してもよい。   Note that the casing 11 may be formed by insert molding the metal casing member 39 of the metal casing 21 on the resin casing 20.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10 ランプ装置
11 筐体
12 放熱板
13 発光モジュール
14 カバー
16 電源回路
17 給電部としての口金
20 樹脂筐体
21 金属筐体
27 ねじとしての第１のねじ
35 電源回路保持部
39 金属筐体部材
47，57 貫通孔
73a 発熱部品
83 照明装置
85 ソケット
88 配置部 10 Lamp device
11 Enclosure
12 Heat sink
13 Light emitting module
14 Cover
16 Power supply circuit
17 Cap as power supply
20 Resin enclosure
21 Metal enclosure
27 First screw as screw
35 Power supply circuit holding section
39 Metal housing members
47, 57 Through hole
73a Heating parts
83 Lighting equipment
85 socket
88 Placement section

Claims (5)

一端側が開口する中空状に設けられているとともに内側に一端側から他端側に沿って設けられた一対の電源回路保持部を有する樹脂筐体と、前記一対の電源回路保持部を境として２分割されていて前記一対の電源回路保持部の両側にそれぞれ前記樹脂筐体の内側に沿って配置された一対の金属筐体部材を有する金属筐体と、を備えた筐体と；
前記筐体の一端側に配設され、前記金属筐体に接触された放熱板と；
前記放熱板の一端側に配設された発光モジュールと；
前記一対の電源回路保持部に保持されて前記筐体の内部に配置された電源回路と；
前記樹脂筐体の他端側に設けられた給電部と；
を具備することを特徴とするランプ装置。 A resin housing having a pair of power supply circuit holding portions provided in a hollow shape with one end side opened and extending from one end side to the other end side on the inside, and the pair of power supply circuit holding portions as a boundary 2 A housing that is divided and has a pair of metal housing members disposed along the inside of the resin housing on both sides of the pair of power supply circuit holding portions;
A heat radiating plate disposed on one end of the housing and in contact with the metal housing;
A light emitting module disposed on one end of the heat sink;
A power supply circuit held in the pair of power supply circuit holding portions and disposed inside the housing;
A power feeding portion provided on the other end side of the resin casing;
A lamp device comprising: 前記放熱板および前記発光モジュールの中央には貫通孔が設けられており、前記貫通孔には、前記給電部の方向に突出し、前記電源回路の一端側に当接するカバーが設けられている
ことを特徴とする請求項１記載のランプ装置。 A through hole is provided in the center of the heat sink and the light emitting module, and a cover that protrudes in the direction of the power feeding portion and contacts the one end side of the power supply circuit is provided in the through hole. The lamp device according to claim 1, characterized in that: 前記樹脂筐体は、前記金属筐体よりも他端側に設けられ前記電源回路が有する発熱部品が配置されて熱的に接続される配置部を有する
ことを特徴とする請求項１または２記載のランプ装置。 The said resin housing | casing has an arrangement | positioning part provided in the other end side rather than the said metal housing | casing, and the heat-emitting component which the said power supply circuit has is arrange | positioned, and is thermally connected. Lamp device. 前記金属筐体および前記放熱板は、前記樹脂筐体の一端側にねじで共締めされている
ことを特徴とする請求項１ないし３いずれか一記載のランプ装置。 The lamp device according to any one of claims 1 to 3, wherein the metal casing and the heat radiating plate are fastened together with screws to one end side of the resin casing. ソケットと；
前記ソケットに前記給電部が接続される請求項１ないし４いずれか一記載のランプ装置と；
を具備することを特徴とする照明装置。 With sockets;
The lamp device according to any one of claims 1 to 4, wherein the power feeding unit is connected to the socket.
An illumination device comprising:
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