JP6332631B2 - Lamp device and lighting device - Google Patents

Description

  Embodiments described herein relate generally to a lamp device using a light emitting module and an illumination device using the lamp device.

  2. Description of the Related Art Conventionally, some lamp devices using a light emitting module include a metallic casing. In this lamp device, a resin cover is inserted inside the housing, the cover is fixed to the housing with a fixture, a lighting circuit is inserted into the cover, and the light emitting module is in contact with the housing. A light emitting module is installed.

  However, since the number of parts constituting the housing is large and the number of assembling steps is also required, improvement in assemblability is desired.

  In addition, the lighting circuit may be affected by heat when the light emitting module is lit, so that the lighting circuit may be affected by heat, or the lighting circuit may be affected by heat because the heat dissipation performance of the lighting circuit is low.

JP 2012-74145 A

  The problem to be solved by the present invention is to provide a lamp device that is easy to assemble and that can reduce the thermal effect of the lighting circuit, and an illumination device that uses this lamp device.

The lamp device of the embodiment includes a cylindrical housing, a light emitting module, a power feeding unit, and a lighting circuit. The housing includes a first housing portion, a second housing portion located inside the first housing portion, and a third housing portion located inside the second housing portion. The first casing unit, the second casing unit, and the third casing unit have different thermal conductivities, and the second casing unit, the third casing unit, and the first casing unit have different thermal conductivities . The heat conductivity is higher in order . The first housing part, the second housing part, and the third housing part are integrally formed. A hollow portion that opens to one end side and the other end side is provided inside the housing. The light emitting module is disposed on one end side of the housing. The power feeding unit is disposed on the other end side of the housing. The lighting circuit is disposed in the housing.

  According to the present invention, it is possible to expect good assembly and reduce the thermal influence of the lighting circuit.

It is sectional drawing of the housing | casing of the lamp device which shows one Embodiment. It is a perspective view of the decomposition | disassembly state of a lamp device same as the above. It is a perspective view of a lamp device same as the above. It is sectional drawing of the illuminating device using a lamp device same as the above.

  Hereinafter, an embodiment will be described with reference to FIGS. 1 to 4.

  2 and 3 show the lamp device 10. The lamp device 10 is a light bulb shaped lamp that can be used by being mounted on a socket for an incandescent light bulb for general illumination.

  The lamp device 10 includes a housing 11, a heat radiating plate 12 disposed on one end of the housing 11, a light emitting module 13 disposed on a surface on one end of the heat radiating plate 12, and a lighting circuit disposed in the housing 11. 14, a globe 15 attached to one end side of the casing 11, and a power feeding unit 16 attached to the other end side of the casing 11. The lamp device 10 has an imaginary central axis extending from the globe 15 to the power feeding unit 16, and the globe 15 side of the central axis is referred to as one end side, and the power feeding unit 16 side is referred to as the other end side.

  As shown in FIGS. 1 to 3, the housing 11 is formed in a cylindrical shape having a large diameter on one end side, a small diameter on the other end side, and a diameter decreasing from the one end side toward the other end side. Inside the housing 11, a cavity 20 is formed that opens to one end side and the other end side.

  The casing 11 includes a first casing section 21, a second casing section 22 located inside the first casing section 21, and a third section positioned inside the second casing section 22. The housing portion 23 is provided.

  The 1st housing | casing part 21 is formed with the resin material which has insulation. The second housing portion 22 is made of a metal material such as aluminum and is formed into a cylindrical shape by press molding. The third housing part 23 is made of an insulating resin material.

  The first casing portion 21, the second casing portion 22, and the third casing portion 23 are integrally formed by insert molding. In order to form the casing 11, first, the third casing portion 23 is integrally formed inside the second casing portion 22 that has been press-molded by insert molding, and then the second casing is formed. The first housing portion 21 is integrally formed on the outside of the portion 22 by insert molding.

  The inner side surface and the outer side surface of the second casing portion 22 are subjected to, for example, anodizing or blasting so as to improve the bonding strength and adhesion between the third casing portion 23 and the first casing portion 21. It may be.

  The first casing portion 21, the second casing portion 22, and the third casing portion 23 have different thermal conductivities, and the second casing portion 22 has the highest thermal conductivity. doing.

  The thermal conductivity relationship is higher in the order of the second casing portion 22, the first casing portion 21 and the third casing portion 23, or the second casing portion 22 and the third casing portion. 23 and the first casing portion 21 are higher in this order.

  When the relationship of the thermal conductivity is higher in the order of the second casing unit 22, the first casing unit 21, and the third casing unit 23, the thermal conductivity of the first casing unit 21 is 0.3 to 0.3. A range of 3.0 W / (m · K) is preferred. However, in consideration of moldability, it is desirable up to 1.0 W / (m · K). The thermal conductivity of the third casing 23 is preferably in the range of 0.15 to 0.3 W / (m · K).

  When the relationship of thermal conductivity is higher in the order of the second casing unit 22, the third casing unit 23, and the first casing unit 21, the thermal conductivity of the first casing unit 21 is 0.15. A range of ˜0.3 W / (m · K) is preferable. The thermal conductivity of the third casing 23 is preferably in the range of 0.3 to 3.0 W / (m · K). However, in consideration of moldability, it is desirable up to 1.0 W / (m · K).

  The first casing portion 21 and the third casing portion 23 are each formed by mixing a filler in a resin material, and are set to a predetermined thermal conductivity depending on the density of the filler.

  On one end side of the housing 11, the first housing portion 21 and the second housing portion 22 protrude from the third housing portion 23, and one end side of the second housing portion 22 is exposed. . On one end side of the second housing part 22, an arrangement part 25 for arranging the heat sink 12 is formed.

  In the third housing portion 23, a heat radiating body 12 and a boss 26 for screwing the globe 15 arranged on one end side of the housing 11 and a lighting circuit 14 inserted from one end side of the housing 11 will be described later. A circuit board holding part 27 for holding the circuit board 40 is formed.

  An attachment part 28 for attaching the power feeding part 16 is formed at the other end of the housing 11.

  Further, the heat radiating plate 12 is formed in a disc shape from a metal material such as aluminum. In the heat radiating plate 12, the light emitting module 13 is arranged on the surface on one end side, and the periphery of the surface on the other end side is arranged in the arrangement portion 25 of the housing 11. The heat radiating plate 12 is formed with a groove 31 into which the boss 26 is inserted.

  The light emitting module 13 includes a plurality of light emitting elements 34 and a substrate 35 on which the light emitting elements 34 are mounted. As the light emitting element 34, for example, an LED of an SMD (Surface Mount Device) package is used. As the light emitting element 34, a COB (Chip On Board) module may be used, or another light emitting element other than an LED, such as an organic EL, may be used. The substrate 35 is fastened and fixed to the heat sink 12 by a plurality of screws 36 and is thermally coupled to the heat sink 12.

  In addition, the lighting circuit 14 converts AC power input from the power supply unit 16 into predetermined DC power and supplies the converted DC power to the light emitting element 34 of the light emitting module 13. The lighting circuit 14 includes a plurality of electronic components 39 constituting the lighting circuit 14 and a circuit board 40 on which the electronic components 39 are mounted. The circuit board 40 is inserted into the pair of circuit board holding portions 27 of the housing 11 from one end side of the housing 11. A connection line 41 is led out from the circuit board 40. The connection line 41 is electrically connected to the substrate 35 of the light emitting module 13. The input part for AC power of the lighting circuit 14 is electrically connected to the power feeding part 16, and the connection line 41 is electrically connected to the output part for DC power.

  Further, the globe 15 has light transmittance and light diffusibility, and is formed in white by mixing a diffusing material in a synthetic resin such as polycarbonate. The globe 15 has a first globe portion 44 attached to one end side of the housing 11 and a second globe portion 45 attached to the first globe portion 44.

  The globe 15 is formed in a shape similar to a sphere, and the first globe portion 44 and the second globe portion 45 are divided at one end side and the other end side of the globe 15 where the diameter of the globe 15 is maximum. Has been.

  The first glove part 44 is formed in a cylindrical shape opened to one end side and the other end side, and the other end side is attached to one end side of the casing 11 so as to be continuous with the shape of the outer portion of the casing 11. It is configured. On the other end side of the first globe portion 44, an attachment portion 47 attached to one end side of the housing 11 with a screw 46 is formed in an annular shape. The screw 46 is screwed to the boss 26 of the housing 11 through the mounting portion 47 and the groove portion 31 of the heat radiating plate 12, and fastens and fixes the first glove portion 44, the heat radiating plate 12, and the housing 11 together. Thereby, the peripheral part of the heat sink 12 press-contacts with the 2nd housing | casing part 22 of the housing | casing 11, and the heat sink 12 and the 2nd housing | casing part 22 are thermally couple | bonded.

  The second globe portion 45 is formed in a dome shape having an opening at the other end and protruding toward the one end. The other end side of the second globe part 45 is fixed to one end side of the first globe part 44 by, for example, vibration welding.

  In addition, the power supply unit 16 uses a base 50 that can be connected to a socket for a general lighting bulb such as E17 or E26. The power feeding unit 16 is not limited to the base 50, and may be a pair of pins depending on the lamp type.

  Next, FIG. 4 shows an illumination device 60 that uses the lamp device 10. The illumination device 60 is a downlight, for example. The lighting device 60 has an instrument body 61, and a socket 62 and a reflector 63 are disposed in the instrument body 61. The socket 62 is electrically connected to the base 50 of the lamp device 10 and supplies AC power to the lamp device 10.

  Then, when the lamp device 10 is mounted on the socket 62 of the lighting device 60 and AC power is supplied to the lamp device 10, the lighting circuit 14 converts the AC power into predetermined DC power and supplies it to the light emitting module 13, and the light emitting element 34 emits light. Light from the light emitting element 34 passes through the globe 15 and is emitted in a predetermined light distribution direction.

  The heat generated when the light emitting element 34 emits light is mainly transmitted in the order of the heat radiating plate 12, the second casing portion 22, and the first casing portion 21, and enters the outside air from the surface of the first casing portion 21. Heat is dissipated.

  At this time, in the case 11, the first case portion 21, the second case portion 22, and the third case portion 23 have different thermal conductivities, and the heat of the second case portion 22 is different. It has the highest conductivity relationship.

  When the relationship of the thermal conductivity is higher in the order of the second casing portion 22, the first casing portion 21, and the third casing portion 23, the light is transmitted from the light emitting module 13 to the second casing portion 22. Heat can be efficiently transferred to the first casing portion 21, and the heat dissipation of the heat generated by the light emitting module 13 can be improved. Furthermore, the third housing part 23 can insulate the second housing part 22 and the lighting circuit 14 from which heat is transmitted from the light emitting module 13. As a result, the temperature of the lighting circuit 14 is substantially affected only by its own temperature, so that the current and the like can be easily controlled.

  When the relationship of the thermal conductivity is higher in the order of the second casing portion 22, the third casing portion 23, and the first casing portion 21, the heat generated by the lighting circuit 14 is transferred to the third casing. Therefore, the heat generated from the lighting circuit 14 can be efficiently radiated, and the thermal influence of the lighting circuit 14 can be reduced. That is, this is a particularly effective configuration in a circuit configuration in which temperature conditions are severe, such as a dimming power source.

  In the case where the relationship of the thermal conductivity is increased in the order of the second casing portion 22, the third casing portion 23, and the first casing portion 21, the second casing portion 23 to the second casing portion 2 In order to efficiently transfer heat to the casing 22, the inner surface of the second casing 22 is subjected to, for example, anodizing or blasting, and the second casing 22, the third casing 23, It is preferable to improve the adhesiveness of.

  In the lamp device 10 of the present embodiment, the first casing portion 21, the second casing portion 22, and the third casing portion 23 are integrally formed by insert molding to constitute the casing 11. Therefore, when the lamp device 10 is assembled, the number of parts is small, the number of assembling steps can be reduced, and the assembling property can be improved. In addition, the thermal effect of the lighting circuit 14 can be reduced as described above.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10 Lamp device
11 Enclosure
13 Light emitting module
14 Lighting circuit
16 Power supply unit
20 Cavity
21 First housing
22 Second housing
23 Third housing
60 Lighting equipment
62 socket

Claims (2)

A first housing portion, a second housing portion located inside the first housing portion, and a third housing portion located inside the second housing portion, The first casing unit, the second casing unit, and the third casing unit have different thermal conductivities, and the second casing unit, the third casing unit, and the first casing unit are different from each other . The first housing portion, the second housing portion, and the third housing portion are integrally formed, and are arranged at one end side and the other end side. A cylindrical housing provided with an open cavity;
A light emitting module disposed on one end of the housing;
A power feeding unit disposed on the other end of the housing;
A lighting circuit disposed in the housing;
Lamp apparatus characterized by comprising a. With sockets;
1 SL and mounting of the lamp device according to claim wherein the power supply unit to the socket is mounted;
An illumination device comprising:

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