JP5283765B2 - Lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination device in which heat emitted by a power supply circuit part can be dissipated sufficiently. <P>SOLUTION: In the illumination device which is equipped with a light source module 1, a power supply circuit part 6 which supplies electric power to the light source module 1, a heat dissipating part 3 which houses the power supply circuit part 6 inside and dissipates the heat emitted by the power supply circuit part 6, a base 5 connected to an external power supply and an insulating ring 4 which electrically insulates between the heat dissipating part 3 and the base 5, the insulating ring 4 is a heat conductive body and has a retaining part 44 which retains a part of the power supply circuit part 6 so as to be close to the insulating ring 4. Heat radiated by the power supply circuit part 6 can be transferred to the heat dissipating part 3 and the base 5 via the insulating ring 4 and can be dissipated outside sufficiently from the heat dissipating part 3 and the base 5. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention includes a light source, a power supply circuit unit that supplies power to the light source, a heat dissipation unit that houses the power supply circuit unit and dissipates heat generated by the power supply circuit unit, and a connection connected to an external power supply The present invention relates to an illuminating device including a portion and an insulator that electrically insulates the heat radiating portion and the connecting portion.

  In general, a lighting device contains a heat source such as a light source and a power supply circuit unit that supplies power to the light source. When the temperature of the heat generating component rises due to the heat generation of the heat generating component, there is a possibility that the performance of the heat generating component such as a light source such as a light emitting diode (hereinafter referred to as LED) and a circuit component constituting the power supply circuit unit cannot be secured. Moreover, the temperature of the outer surface of the lighting device increases, which is not preferable from the viewpoint of safety. Thus, conventionally, a lighting device configured to be able to dissipate heat from the heat-generating component to the air outside the lighting device has been proposed (see, for example, Patent Document 1).

  The illumination device disclosed in Patent Document 1 includes a light source unit 510 having a light source 511, a power source unit (power circuit unit) 530 that lights the light source 511, a power terminal block 540 that supplies power to the power unit 530, and a light source. Unit 510, a power source unit 530, and a power source terminal block 540 provided with an instrument body 520, and a light source unit 510 side is placed on the installation hole side by a support 550 made of a spring material provided on the outer periphery of the instrument body 520. Thus, it is installed on the ceiling and used as a so-called downlight (see FIG. 5).

  The instrument main body 520 is made of aluminum die-casting, and is configured as a cylindrical case member. The instrument main body 520 also serves as a heat radiating unit that dissipates heat generated by the light source 511 and the power source unit 530. The instrument main body 520 includes a partition plate 521 that partitions the interior of the instrument main body 520, and the partition plate 521 also serves as a support portion for disposing the light source unit 510. The power source unit 530 is held by the instrument main body 520 with a predetermined interval between the wiring board 531 of the power source unit 530 and the partition plate 521 of the instrument main body 520 so as to ensure an electrical insulation distance.

JP 2008-186776 A

  In the lighting apparatus according to Patent Document 1, heat generated by the power supply unit 530 is transmitted to the apparatus main body 520 and is dissipated from the apparatus main body 520 to the outside. However, the wiring board 531 of the power supply unit 530 is only brought into contact with the instrument main body 520 at the peripheral portion, and a sufficient heat transfer area for transferring heat from the power supply unit 530 cannot be ensured. For this reason, the heat generated by the power supply unit 530 cannot be sufficiently conducted to the instrument body 520, and there is a possibility that heat cannot be sufficiently radiated.

  This invention is made | formed in view of such a situation, and it aims at providing the illuminating device which can fully dissipate the heat which a power supply circuit part emits.

An illumination device according to the present invention includes a light source, a power supply circuit unit that supplies power to the light source, a heat dissipation unit that houses the power supply circuit unit and dissipates heat generated by the power supply circuit unit, and an external power source. In a lighting device including a base as a connection part to be connected and an insulator that electrically insulates between the heat dissipation part and the base , the power supply circuit part includes a substrate and a plurality of circuits mounted on both sides of the substrate. has a component, said insulator from heat conductor der, Propelled by one holding part of the power supply circuit unit, the holding unit, the power supply circuit unit, compared to other surface heating the amount is on the side of the inner surface of the side is the insulator of more circuit components are mounted one surface of the substrate, a portion of the one face is the holding be characterized and Turkey, as close to the holding portion of the ferrule .

In the present invention, an insulator made of a heat conductor is provided between a heat dissipating part that dissipates heat generated by the power supply circuit part and a base for connection to an external power source , and the heat dissipating is performed by the insulator. The part and the base are thermally connected. The power circuit unit includes a substrate and a plurality of circuit components mounted on both sides of the substrate. The insulator includes a holding unit that holds the power circuit unit. The holding unit is a circuit component that generates a large amount of heat. The power circuit portion is held so that one surface side of the substrate on which the substrate is mounted is the inner surface side of the insulator and a part of the one surface of the substrate is close to the insulator. Therefore, the heat power supply circuit section is emitted reliably transmitted to the heat radiating portion and the mouthpiece through an insulator, it can be sufficiently dissipated to the outside from the heat radiation part and the mouthpiece.

  The lighting device according to the present invention is characterized in that a heat conductive material is filled between the power supply circuit portion and the insulator.

  In the present invention, a heat conductive material is filled between the power supply circuit portion and the insulator, and no gas such as air is interposed between the power supply circuit portion and the insulator. Can be efficiently transmitted to the insulator and diffused to the outside through the heat radiating portion.

  Furthermore, the illumination device according to the present invention is characterized in that the light source is an LED.

  According to the present invention, the heat generated by the power supply circuit unit can be sufficiently dissipated.

It is a typical external view of the illuminating device which concerns on embodiment of this invention. It is a typical longitudinal cross-sectional view of the illuminating device which concerns on this Embodiment. It is a typical cross-sectional view by the III-III line of FIG. It is a typical longitudinal cross-sectional view of the power supply circuit part vicinity of the illuminating device which concerns on other embodiment of this invention. It is a typical longitudinal cross-sectional view of the illuminating device which concerns on a prior art.

  Hereinafter, the present invention will be described in detail with reference to the drawings showing embodiments thereof, taking a light bulb type illumination device as an example. FIG. 1 is a schematic external view of a lighting device according to an embodiment of the present invention. FIG. 2 is a schematic longitudinal sectional view of the illumination device according to the present embodiment. FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG.

  In the figure, reference numeral 1 denotes a light source module as a light source. The light source module 1 includes a disk-shaped LED substrate 11 and a plurality of LEDs 12 mounted on one surface of the LED substrate 11. The LED substrate 11 also serves as a heat conductor that conducts heat from the LED 12 to the heat radiating plate 2 to which the light source module 1 is attached. For example, the LED substrate 11 is made of metal such as iron or aluminum. The LED 12 is, for example, a surface mount type LED that includes an LED element, a sealing resin that seals the LED element, and an input terminal and an output terminal.

  The LED substrate 11 on which the LED 12 is mounted on one surface is fixed to the heat sink 2 on the other surface (the surface opposite to the surface on which the LED 12 is mounted). The heat radiating plate 2 is made of metal such as aluminum and has a disk-shaped light source holding part 21 and a flat peripheral wall part 22 standing on the outer peripheral edge of the light source holding part 21. The LED substrate 11 is fixed to one surface 21 a of the light source holding part 21 of the heat sink 2. The peripheral wall portion 22 is erected on the one surface 21 a side of the light source holding portion 21, and has a diameter that gradually increases from the light source holding portion 21 side toward the protruding end side. The heat radiating plate 2 to which the light source module 1 is attached is attached to the heat radiating part 3 so that the other surface 21 b side of the light source holding part 21 is on the heat radiating part 3 side.

  The heat radiating part 3 is made of metal such as aluminum and has a cylindrical shape. The heat radiating part 3 has a frustoconical outer shape that is gradually expanded in diameter from one end side to the other end side in the longitudinal direction. A mounting seat 31 to which the heat radiating plate 2 is attached is provided inside the other end side (the diameter-expanded side) of the heat radiating portion 3. For example, the mounting seat 31 is annularly provided inside the heat radiating portion 3. In addition, the shape of the attachment seat 31 is not limited to this, What is necessary is just a shape which can attach the heat sink 2. FIG.

  Screw holes (not shown) provided on the LED substrate 11 of the heat radiating part 3, screw holes (not shown) provided on the heat radiating plate 2, and the other end side (the diameter-expanded side) of the heat radiating part 3 The light source module 1 and the heat radiating plate 2 are placed on the mounting seat 31 of the heat radiating portion 3 so that the screw holes (not shown) provided in the mounting seat 31 are aligned, and the screws are screwed into the screw holes. By combining, the light source module 1 and the heat radiating plate 2 are fixed to the heat radiating portion 3.

  Since the LED substrate 11 and the heat radiating plate 2, and the heat radiating plate 2 and the heat radiating portion 3 are in contact with each other over substantially the entire surface, they have a sufficient heat transfer area. Therefore, the heat from the LED 12 is efficiently conducted to the heat radiating plate 2 through the LED substrate 11, and a part of the heat is radiated as it is from the peripheral portion of the heat radiating plate 2 to the air outside the lighting device 100, and the remaining heat is The heat is efficiently conducted from the heat radiating plate 2 to the heat radiating portion 3, and is radiated from the heat radiating portion 3 to the air outside the lighting device 100. Since the heat is dissipated by the heat radiating plate 2 and the heat radiating portion 3, the LED 12 is cooled to a temperature necessary for ensuring predetermined performance and life. In addition, it is desirable that a heat conductive sheet or a thermally conductive grease is interposed between the LED substrate 11 and the heat radiating plate 2 and between the heat radiating plate 2 and the heat radiating portion 3. The heat radiating plate 2 and the heat radiating portion 3 function as a radiator that dissipates heat from the light source module 1 and also function as an exterior body of the lighting device.

  One end side of the heat radiating portion 3 (the side opposite to the side on which the mounting seat 31 is provided) is connected as a connecting portion via an insulating ring 4 as an insulator that electrically insulates between the base 5 and the heat radiating portion 3. A base 5 is provided. The insulating ring 4 has a cylindrical shape, and includes a base holding part 41 that holds the base 5, and a connecting part 42 that is connected to the base holding part 41 and connected to the heat radiating part 3.

  As shown in FIG. 3, the connecting portion 42 is a plate portion provided inside the base holding portion 41 and parallel to a plane passing through the center of the base holding portion 41. An engaging claw 43 that engages with an engaging portion (not shown) formed on the inner surface of the heat radiating portion 3 is provided on the outer surface 42 a of the connecting portion 42. A holding portion 44 that holds a power supply substrate of a power supply circuit portion, which will be described later, is provided in parallel to the end portion on the opposite side of the connecting portion 42 of the base holding portion 41 with an appropriate distance from the connecting portion 42. Further, the base holding part 41 is provided with an engaging concave part 45 that engages with the power supply board in parallel with the connecting part 42 at a suitable distance.

  In the present embodiment, the insulating ring 4 is made of a resin excellent in heat dissipation and electrical insulation, so-called heat dissipation resin. The heat radiating resin is a resin having electrical insulation. The thermal conductivity of the heat radiation resin is, for example, about 1 to 70 (W / m · K). This heat radiation resin is made of, for example, a synthetic resin containing a polyamide (so-called nylon) and / or a liquid crystal polymer as a base. The heat-dissipating resin is not limited to a synthetic resin including polyamide and / or liquid crystal polymer as long as it has electrical insulation.

  The insulating ring 4 may be made of a material having excellent heat dissipation and electrical insulation, and may be made of ceramic. As the ceramic material, for example, an electrically insulating material having a high infrared emissivity (thermal emissivity in the infrared wavelength region) such as a metal oxide such as aluminum oxide or boron nitride can be used.

  The base 5 has a bottomed cylindrical shape, and includes a one-pole terminal 51 having a threaded portion for screwing into a socket for a light bulb, and a projection provided on the bottom surface of the base 5. The electrode terminal 52 is provided. These one-pole terminals 51 and other-pole terminals 52 are electrically insulated. The outer shape of the cylindrical portion of the base 5 is formed in the same shape as the screw-type base of E17 or E26, for example.

  In the present embodiment, the base 5 is formed integrally with the insulating ring 4. In this integral molding, a mold corresponding to the shape of the insulating ring 4 is fitted into the base 5 and the above-described heat-dissipating resin is poured into the mold using an injection molding machine or the like to solidify the heat-dissipating resin. Is made by The heat radiation resin is provided in close contact with the inner surface so as to cover the inner surface of the cylindrical portion of the base 5. Thus, since the base 5 is formed integrally with the insulating ring 4, the base 5 and the base holding portion 41 of the insulating ring 4 can be brought into close contact with each other without causing a gap, and air or the like is interposed. Thus, an increase in heat transfer resistance can be suppressed, and heat conduction from the insulating ring 4 to the base 5 can be favorably performed.

  The insulating ring 4 and the base 5 that are integrally formed in this way are engaged with an engaging portion (not shown) formed on the inner surface of the heat radiating portion 3, and an engaging claw provided on the connecting portion 42 of the insulating ring 4. It is attached to the heat radiating part 3 by engaging 43. An adhesive 75 is filled between the heat radiating portion 3 and the connecting portion 42 of the insulating ring 4. The adhesive 75 is desirably a high thermal conductivity adhesive based on a material such as silicone. Since the adhesive 75 is filled between the heat radiating portion 3 and the connecting portion 42 of the insulating ring 4, no gas such as air is interposed, and the heat transfer resistance between the heat radiating portion 3 and the insulating ring 4 is reduced. can do.

  Since the insulating ring 4 is a heat conductor, the heat radiating part 3 and the base 5 are thermally connected, and heat can be efficiently conducted from the insulating ring 4 to the heat radiating part 3 and the base 5. By filling the heat dissipation part 3 and the connecting part 42 of the insulating ring 4 with the adhesive 75 having high thermal conductivity, heat can be more efficiently conducted from the insulating ring 4 to the heat dissipation part 3. The insulating ring 4 functions as an insulator that electrically insulates between the base 5 and the heat radiating portion 3. The insulating ring 4 functions as a connecting body that connects the base 5 and the heat radiating portion 3.

  In the cavity formed by the heat radiating plate 2, the heat radiating portion 3, and the insulating ring 4, a power supply circuit portion 6 for supplying power of a predetermined voltage and current to the light source module 1 through the electric wire is accommodated. .

  The power supply circuit unit 6 includes a rectangular plate-shaped power supply board 61 and a plurality of circuit components mounted on the power supply board 61. On both sides of the power supply board 61, a bridge diode for full-wave rectification of an alternating current supplied from an external AC power supply, a transformer for transforming the rectified power supply voltage to a predetermined voltage, and a primary side and a secondary side of the transformer are connected. Circuit components such as diodes and ICs are distributed and mounted. As the power supply substrate 61, for example, a glass epoxy substrate, a paper phenol substrate, or the like is used.

  A plurality of circuit components 62 are mounted on one surface 61a of the power supply substrate 61 of the power supply circuit unit 6, and the other surface 61b of the power supply substrate 61 is supplied in comparison with the circuit component 62 mounted on the one surface 61a. A circuit component 63 that generates a relatively large amount of heat due to the generated current is mounted.

  The power supply circuit unit 6 insulates a part of the power supply substrate 61 so that the other surface 61b side (the side on which the circuit component 63 is mounted) of the power supply substrate 61 is on the connection portion 42 side of the insulating ring 4. By being engaged with an engagement recess 45 provided in the ring 4, it is held in a cavity formed by the heat radiating part 3 and the insulating ring 4. In this holding state, the power supply circuit unit 6 is configured such that a part of the circuit component 63 is in contact with the inner surface 42 b of the connecting unit 42. Since a part of the circuit component 63 is in contact with the insulating ring 4, a part of the heat generated by the power supply circuit unit 6 can be directly transferred to the insulating ring 4, and the heat from the power supply circuit unit 6 can be transferred. It can be efficiently transmitted to the insulating ring 4.

  Between the other surface 61b of the power supply substrate 61 of the power supply circuit portion 6 and the inner surface 42b of the connecting portion 42 of the insulating ring 4, a resin 7 as a heat conductive material is filled. The resin 7 is a highly heat conductive resin such as a silicone resin or a polyurethane resin. Since the resin 7 is filled between the power supply circuit section 6 and the insulating ring 5 body, no gas such as air is interposed between the power supply circuit section 6 and the insulating ring 4, so that heat from the power supply circuit section 6 is insulated. It is possible to efficiently transmit to the ring 4. Since the resin 7 having high thermal conductivity is filled, heat from the power supply circuit unit 6 can be efficiently transmitted to the heat radiating unit 3 and the base 5 through the insulating ring 4.

  The power supply circuit unit 6 is electrically connected to the one-pole terminal 51 and the other-pole terminal 52 of the base 5 via electric wires (not shown). Moreover, the power supply circuit unit 6 is electrically connected to the light source module 1 by a connector via an electric wire (not shown). In addition, you may make it electrically connect not using an electric wire but using a pin plug.

  On the other hand, a light transmissive cover 8 is attached to the heat radiating plate 2 on the other end side of the heat radiating portion 3 so as to cover the light emitting direction side of the LED 12. The cover 8 is made of milky white glass having a hemispherical shell shape. It is desirable that an anti-scattering film for preventing debris from scattering when the cover 8 is broken is provided on the inner surface of the cover 8 over substantially the entire surface. The cover 8 is attached to the edge of the light source holding part 21 of the heat sink 2 with an adhesive or the like at the periphery on the opening side. The material of the cover 8 is not limited to glass, and may be made of a resin such as polycarbonate.

  The illumination device 100 configured as described above is connected to an external AC power source by screwing the base 5 into a socket for a light bulb. In this state, when the power is turned on, an alternating current is supplied to the power supply circuit unit 6 through the base 5. The power supply circuit unit 6 supplies power of a predetermined voltage and current to the light source module 1 to light the LED 12.

  As the LED 12 is turned on, the LED 12 and the power supply circuit unit 6 mainly generate heat. As described above, the heat from the LED 12 is conducted to the heat radiating plate 2 and the heat radiating portion 3, and is dissipated from the heat radiating plate 2 and the heat radiating portion 3 to the air outside the lighting device 100. On the other hand, the heat from the power supply circuit unit 6 is conducted to the insulating ring 4 directly or via the resin 7, and a part of the conducted heat is transmitted to the heat radiating unit 3, and the heat radiating unit 3 transmits the heat from the lighting device 100. Dissipated to outside air. The other part of the heat conducted to the insulating ring 4 is transmitted to the base 5, and is dissipated from the base 5 to the air outside the lighting device 100.

  In the lighting device 100 according to the present embodiment, as described above, the insulating ring 4 provided between the heat radiating unit 3 and the base 5 is used as a heat conductor. 4 can be transmitted to the heat radiating part 3 and the base 5, and can be diffused to the outside from the heat radiating part 3 and the base 5. Thus, since the base 5 can also be used as a heat radiating member, the heat radiating area can be increased, and the heat from the power supply circuit section 6 can be sufficiently dissipated.

  Since the base 5 is formed integrally with the insulating ring 4, the base 5 and the insulating ring 4 can be brought into close contact with each other without generating a gap, and the heat transfer resistance between the base 5 and the insulating ring 4. Can be reduced. As a result, since heat can be efficiently transmitted from the insulating ring 4 to the base 5, the base 5 can be effectively used as a heat radiating member, and heat from the power supply circuit unit 6 can be dissipated more sufficiently. Can do.

  Further, since the insulating ring 4 is made of a resin containing polyamide and / or liquid crystal polymer, it can be a good thermal conductor while ensuring insulation, and reduce the heat transfer resistance inside the insulating ring 4. The heat generated by the power supply circuit unit 6 can be efficiently transmitted to the heat radiating unit 3 and the base 5 via the insulating ring 4. Moreover, since it is resin, the nozzle | cap | die 5 can be easily shape | molded integrally with the insulating ring 4 using an injection molding machine etc., and a manufacturing process can be simplified.

  In addition, since a part of the circuit component 63 of the power supply circuit unit 6 is in contact with the insulating ring 4, a part of the heat generated by the power supply circuit unit 6 is transferred to the insulating ring 4 without passing through other substances. Can communicate directly. As a result, heat from the power supply circuit unit 6 can be efficiently transferred to the insulating ring 4.

  Further, since the resin 7 as the heat conductive material is filled between the other surface 61b of the power supply substrate 61 of the power supply circuit portion 6 and the inner surface 42b of the connecting portion 42 of the insulating ring 4, the power supply circuit portion 6 Since no gas such as air is interposed between the insulating ring 4 and the insulating ring 4, heat from the power supply circuit unit 6 can be efficiently transmitted to the insulating ring 4. By using the resin 7 having high thermal conductivity, the heat from the power supply circuit unit 6 can be efficiently transmitted to the heat radiating unit 3 and the base 5 through the insulating ring 4.

  Since the resin 7 is filled in the gap between the other surface 61b of the power supply substrate 61 of the power supply circuit unit 6 and the inner surface 42b of the connecting portion 42 of the insulating ring 4 that are close to each other, the amount of the resin 7 to be filled Can be reduced.

  In the lighting device 100 according to the above embodiment, the base 5 is formed integrally with the insulating ring 4, but the present invention is not limited to this, and the base 5 and the insulating ring 4 may be formed separately. good. FIG. 4 is a schematic longitudinal sectional view of the vicinity of the power supply circuit unit 6 of the lighting apparatus 200 according to another embodiment of the present invention.

  The insulating ring 104 has a cylindrical shape, and includes a base holding part 141 that holds the base 5, and a connecting part 42 that is connected to the base holding part 141 and connected to the heat radiating part 3. The outer peripheral surface of the base holding part 141 is threaded for screwing with the base 5. The base 5 is integrated with the insulating ring 104 by inserting and screwing the base holding portion 141 of the insulating ring 4 into the base 5. An adhesive 76 is filled between the base holding part 141 and the base 5 of the insulating ring 104. The adhesive 76 is desirably a high thermal conductivity adhesive based on a material such as silicone. Since the other configuration is the same as that of the illumination device 100 shown in FIG. 2, the same reference numerals as those in FIG. 2 are assigned to the corresponding structural members, and detailed description of the configuration is omitted.

  In the lighting device 200 according to the present embodiment, since the adhesive 76 is filled between the base holding part 141 and the base 5 of the insulating ring 104, no gas such as air is interposed, and the insulating ring 104 and The heat transfer resistance between the caps 5 can be reduced, and the same effect as the lighting device 100 described above can be obtained.

  In addition, in the above embodiment, although the power supply circuit unit 6 was described as a heat generating body accommodated in the heat radiating unit 3, the dimming function configured to be able to adjust the light quantity and / or chromaticity of the LED. In the attached lighting device, the dimming control unit also becomes a heating element. Also in this case, the configuration is the same as that of the power supply circuit unit 6 described in the above embodiment, that is, the control circuit board is installed close to the insulating ring 4, and the resin is interposed between the control circuit board and the insulating ring 4. It is possible to efficiently conduct the heat from the control unit to the heat radiating unit 3.

  Further, in the above embodiment, the surface mount type LED is used as the light source. However, the present invention is not limited to this, and other types of LEDs, EL (Electro Luminescence), and the like may be used.

  In the above embodiment, the light bulb type lighting device attached to the socket for the light bulb has been described as an example. However, the present invention is not limited to the light bulb type lighting device, and can be applied to other types of lighting devices. . Furthermore, the present invention can be applied to a device including a heating element other than the lighting device, and can be implemented in various modifications within the scope of the matters described in the claims. Needless to say.

1 Light source module (light source)
3 Heat sink 4 Insulation ring (insulator)
5 base (connection part)
6 Power circuit 62, 63 Circuit component 7 Resin (thermally conductive material)
76 Adhesive

Claims (3)

A light source;
A power supply circuit section for supplying power to the light source;
A heat radiating part that houses the power circuit part and dissipates heat generated by the power circuit part;
A base as a connection connected to an external power source;
In an illuminating device comprising an insulator that electrically insulates between the heat dissipating part and the base ,
The power supply circuit unit includes a substrate and a plurality of circuit components mounted on both sides of the substrate,
The insulator from heat conductor der, Propelled by one holding part of the power supply circuit unit,
The holding part is configured such that one side of the substrate on which the circuit component that generates a larger amount of heat than the other side is mounted is the inner side of the insulator, and a part of the one side is the lighting device comprising a benzalkonium be held as close to the holding portion of the base. The lighting device according to claim 1 , wherein a heat conductive material is filled between the power supply circuit portion and the insulator. The light source lighting device according to claim 1 or 2, characterized in that an LED.

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