JP2016009820A - Cooling device and electronic equipment having the same mounted therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device on which maintenance can be easily performed.SOLUTION: A cooling device has a heat receiving part 3, a heat radiating part 4, a heat radiating route 5 and a feedback route 6. The feedback route 6 is provided with a check valve 8, and the heat radiating part 4 has a refrigerant discharge part 14 at an upper stage, a refrigerant condensing part 15 at an intermediate stage and a refrigerant flow-in part 16 at a lower stage. The refrigerant discharge part 14 has a heat radiating route connection port 10, the refrigerant flow-in portion 16 has a feedback route connection port 11, the heat radiation route 5 is connected to the heat radiation connection port 10, and the feedback route 6 is connected to the feedback route connection port 11. At the refrigerant condensing part 15, plural plate-like fins are provided in parallel to the vertical direction to be spaced from one another, and the heat radiating part 4 has a contact face 20 which is brought into contact with a water cooling heat sink 7.

Description

  The present invention relates to a cooling device for an electronic device in which electronic components such as a central processing unit (CPU), a large scale integrated circuit (LSI), and an insulated gate bipolar transistor (IGBT) are mounted, and an electronic device in which the electronic device is mounted. .

  Conventionally, this type of cooling device is a cooling device using a loop heat pipe as in Patent Document 1, for example, a central processing unit (CPU), a large-scale integrated circuit (LSI), and an insulated gate bipolar transistor (IGBT). The electronic parts such as were cooled.

  Hereinafter, the loop heat pipe shown in Patent Document 1 will be described with reference to FIG.

  As shown in FIG. 6, the loop heat pipe includes a loop circuit 103 that includes an ascending pipe 101 and a descending pipe 102 separately, a heat medium 112 that is a refrigerant sealed in the loop circuit 103 under vacuum, A cooler 105 that constitutes a part and is located above the loop circuit 103, a heating unit 113 that is located below the riser 101, and a heat medium in the loop circuit 103 that is interposed in the lower part of the loop circuit 103. 112 is provided with a check valve 107 that limits the circulation direction of 112.

  Here, when heat is generated in the semiconductor switching element brought into contact with the heating unit 113, the generated heat is transmitted to the heating unit 113, and the heat is applied to the heat medium 112 circulating through the heating unit 113 and vaporizes. The circulation direction is restricted by the check valve 107, and the vaporized heat medium 112 rises up the ascending pipe 101 and is led to the cooler 105 to be cooled. Here, the heat applied by the heating unit 113 is released. The heat medium 112 that has released heat from the cooler 105 descends the downcomer 102 and circulates again to the heating unit 113 via the check valve 107.

JP 61-038396 A

  The problem in the conventional example is that maintenance of the cooling device becomes complicated.

  That is, in the cooling device of the conventional example, the heating unit 113 to be cooled is an electronic component such as a central processing unit (CPU), a large scale integrated circuit (LSI), an insulated gate bipolar transistor (IGBT), These electronic components can frequently fail.

  When a defect occurs in the electronic component, the defective electronic component is replaced. Since the electronic component and the cooling device are arranged in close contact with each other to exchange heat, when the electronic component is replaced, the cooling device is once removed together with the electronic component. At this time, since the cooling liquid pipeline 111 enters the inside of the cooler 105, it is necessary to take out the cooling liquid pipeline 111 from the inside of the cooler 105 and remove the loop circuit 103. The loop circuit 103 is normally sealed because the internal pressure is adjusted to a vacuum. When the cooling liquid conduit 111 is taken out from the inside of the cooler 105, this sealed state must be opened, and the vacuum state of the loop circuit 103 cannot be maintained. In addition, although the heat medium 112 is enclosed in the loop circuit 103, the heat medium 112 evaporates or overflows from the loop circuit 103 when the hermetic state of the loop circuit 103 is opened. May be partially or completely lost. Therefore, after replacing the electronic components, the cooling liquid conduit 111 is disposed inside the cooler 105, and the heat medium 112 that has evaporated or overflowed and disappeared is replenished, and the internal pressure of the loop circuit 103 is further increased. Must be returned to a vacuum state. As described above, there is a problem that maintenance of the cooling device becomes complicated.

  Then, an object of this invention is to provide the cooling device which can be maintained easily.

  In order to achieve this object, the present invention includes a heat receiving portion, a heat radiating portion, a heat radiating path connecting the heat receiving portion and the heat radiating portion, and a feedback path. And a check valve that opens due to a balance between the water head pressure of the retained refrigerant and the pressure in the return path, and the heat dissipating part is a box, the refrigerant discharge part in the upper stage, the refrigerant condensing part in the middle stage, An inflow part, the refrigerant discharge part has a heat dissipation path connection port, the refrigerant inflow part has a return path connection port, the heat dissipation path is connected to the heat dissipation path connection port, and the return path Is connected to the return path connection port, the refrigerant condensing part is provided with a plurality of plate-like fins in parallel in the vertical direction at intervals, and the heat radiating part has a contact surface in contact with the heat sink, The fin is in contact with at least the back surface of the contact surface. A retirement unit, thereby is to achieve the intended purpose.

  As described above, the present invention includes a heat receiving portion, a heat radiating portion, a heat radiating path connecting the heat receiving portion and the heat radiating portion, and a return path, and the return path has a water head pressure of the condensed and retained refrigerant. And a check valve that opens due to pressure balance in the return path, the heat dissipating part is a box, and includes a refrigerant discharge part in the upper stage, a refrigerant condensing part in the middle stage, and a refrigerant inflow part in the lower stage, The refrigerant discharge portion has a heat dissipation path connection port, the refrigerant inflow portion has a return path connection port, the heat dissipation path is connected to the heat dissipation path connection port, and the return path is connected to the feedback path connection port. A plurality of plate-like fins provided in parallel to each other in the vertical direction at intervals, and the heat dissipating part having a contact surface in contact with a heat sink, wherein the fins are at least the contact Cooling device in contact with the back of the surface It is capable of providing a cooling device capable of Maintenance.

  In other words, the heat dissipation part has a contact surface in contact with the heat sink, so when the maintenance is required, such as when an electronic component to be cooled breaks down, the contact surface of the heat dissipation part of the cooling device is in surface contact with the heat sink. However, the contact surface of the cooling device and the heat sink can be easily separated. That is, as in the conventional example, when performing maintenance, it is not necessary to remove the cooling liquid conduit that has entered the heat radiating portion from the heat radiating portion, and the contact surface of the cooling device and the heat sink can be easily separated. Therefore, the cooling device can be easily maintained.

1 is a schematic perspective view of an electronic device equipped with a cooling device according to Embodiment 1 of the present invention. The figure which shows the external appearance of the thermal radiation part of the cooling device (A) The figure which shows AA 'cross section of the thermal radiation part of the cooling device, (b) The figure which shows AA' cross section of the thermal radiation part of the cooling device The figure which shows the gas-liquid separation part of the cooling device (A) Side view showing a gas-liquid separation plate of the cooling device, (b) Perspective view showing a gas-liquid separation plate of the cooling device Schematic showing a conventional cooling device

  A cooling device according to an embodiment of the present invention includes a heat receiving portion, a heat radiating portion, a heat radiating path connecting the heat receiving portion and the heat radiating portion, and a return path, and the feedback path is condensed and stopped. And a check valve that opens according to a pressure balance in the return path and a pressure balance in the return path. The refrigerant discharge part has a heat dissipation path connection port, the refrigerant inflow part has a return path connection port, the heat dissipation path is connected to the heat dissipation path connection port, and the return path is Connected to the return path connection port, the refrigerant condensing part is provided with a plurality of plate-like fins in parallel in the vertical direction at intervals, the heat dissipating part has a contact surface in contact with the heat sink, And at least the back surface of the contact surface. By, in which it is possible to provide a cooling apparatus which can be easily maintained.

  In other words, the heat dissipation part has a contact surface in contact with the heat sink, so when the maintenance is required, such as when an electronic component to be cooled breaks down, the contact surface of the heat dissipation part of the cooling device is in surface contact with the heat sink. However, the contact surface of the cooling device and the heat sink can be easily separated. That is, as in the conventional example, when performing maintenance, it is not necessary to remove the cooling liquid conduit that has entered the heat radiating portion from the heat radiating portion, and the contact surface of the cooling device and the heat sink can be easily separated. Therefore, the cooling device can be easily maintained.

  Moreover, you may make it the structure provided with the gas-liquid separation part in the vicinity of the said thermal radiation path connection port of the said refrigerant | coolant discharge | release part. Thereby, by separating the two-phase refrigerant mixed with the gas phase and the liquid phase flowing into the refrigerant discharge part of the heat dissipation part from the heat dissipation path through the heat dissipation path connection port into the gas phase refrigerant and the liquid phase refrigerant, The separated liquid-phase refrigerant falls to the lower refrigerant inflow portion due to gravity. As a result, the liquid-phase refrigerant diffuses into the refrigerant discharge portion and does not adhere to the fins provided in the refrigerant condensing portion below the refrigerant discharge portion. Therefore, the liquid phase refrigerant attached to the fin covers the surface of the fin and does not hinder heat exchange between the gas phase refrigerant and the fin, and heat is transferred from the gas phase refrigerant to the fin. Condenses efficiently and becomes a liquid phase refrigerant. As a result, since the fins can efficiently receive the latent heat of the gas-phase refrigerant, the heat radiation performance of the heat radiating section is enhanced, thereby improving the cooling performance of the cooling device.

  In addition, the gas-liquid separation unit may be configured to be one or a plurality of plate-shaped gas-liquid separation plates provided to face the heat radiation path connection port. Thus, a gas-liquid separation plate provided with a two-phase refrigerant mixed with a gas phase and a liquid phase flowing from the heat radiation path through the heat radiation path connection port to the refrigerant discharge part of the heat radiation unit facing the heat radiation path connection port. Collide with. The liquid-phase refrigerant that collides with the gas-liquid separation plate adheres to the gas-liquid separation plate, travels along the surface of the gas-liquid separation plate by gravity, and falls to the lower refrigerant inflow portion. As a result, the liquid-phase refrigerant diffuses into the refrigerant discharge portion and does not adhere to the fins provided in the refrigerant condensing portion below the refrigerant discharge portion. Therefore, the liquid phase refrigerant attached to the fin covers the surface of the fin and does not hinder heat exchange between the gas phase refrigerant and the fin, and heat is transferred from the gas phase refrigerant to the fin. Condenses efficiently and becomes a liquid phase refrigerant. As a result, since the fins can efficiently receive the latent heat of the gas-phase refrigerant, the heat radiation performance of the heat radiating section is enhanced, thereby improving the cooling performance of the cooling device.

  Further, the gas-liquid separation plate 17 may be configured to have one or a plurality of vapor passage ports 18 penetrating from the front surface to the back surface. Thereby, the gas-liquid separation plate in which the two-phase refrigerant mixed with the gas phase and the liquid phase flowing from the heat radiation path through the heat radiation path connection port to the refrigerant discharge portion of the heat radiation unit is opposed to the heat radiation path connection port. The gas-phase refrigerant that collided with the gas-liquid separation plate and the liquid phase that did not adhere to the gas-liquid separation plate at one or more vapor passage ports penetrating from the front surface to the back surface of the gas-liquid separation plate Refrigerant flows in and passes through the gas-liquid separator. Thereby, it can suppress that it collides with a gas-liquid separation plate and the flow of a gaseous-phase refrigerant | coolant is prevented. As a result, the gas-phase refrigerant diffuses into the refrigerant discharge section and comes into contact with the fins provided in the refrigerant condensing section below the refrigerant discharge section without waste. As a result, since the fins can efficiently receive the latent heat of the gas-phase refrigerant, the heat radiation performance of the heat radiating section is enhanced, thereby improving the cooling performance of the cooling device.

  Further, the vapor passage port of the gas-liquid separation plate may be provided at a position different from the projection plane of the vapor passage port of the gas-liquid separation plate provided next to the gas-liquid separation plate. Thereby, the gas-liquid separation plate in which the two-phase refrigerant mixed with the gas phase and the liquid phase flowing from the heat radiation path through the heat radiation path connection port to the refrigerant discharge portion of the heat radiation unit is opposed to the heat radiation path connection port. The gas-phase refrigerant that collided with the gas-liquid separation plate and the liquid phase that did not adhere to the gas-liquid separation plate at one or more vapor passage ports penetrating from the front surface to the back surface of the gas-liquid separation plate Refrigerant flows in and passes through the gas-liquid separator. Since the vapor passage port of the gas-liquid separation plate is provided at a position different from the projection surface of the vapor passage port of the gas-liquid separation plate provided next, the liquid-phase refrigerant that has passed through the vapor passage port of the gas-liquid separation plate And it can suppress passing the vapor | steam passage port of the gas-liquid separation board provided next to the side far from a heat radiation path | route connection port. As a result, it is possible to suppress the liquid-phase refrigerant from diffusing into the refrigerant discharge part and further adhering to the fins provided in the refrigerant condensing part below the refrigerant discharge part. Therefore, the liquid phase refrigerant attached to the fin covers the surface of the fin and does not hinder heat exchange between the gas phase refrigerant and the fin, and heat is transferred from the gas phase refrigerant to the fin. Condenses efficiently and becomes a liquid phase refrigerant. As a result, since the fins can efficiently receive the latent heat of the gas-phase refrigerant, the heat radiation performance of the heat radiating section is enhanced, thereby improving the cooling performance of the cooling device.

  Further, the fin may not be provided immediately below the gas-liquid separation plate. As a result, the liquid-phase refrigerant that collides with the gas-liquid separation plate adheres to the gas-liquid separation plate, travels along the surface of the gas-liquid separation plate by gravity, and falls to the lower refrigerant inflow portion. Since fins are not provided directly below the plate, the liquid phase refrigerant falling from the gas-liquid separation plate falls into the lower refrigerant inflow portion without contacting the fins, so the liquid phase adhering to the fins The refrigerant covers the surface of the fin and does not hinder heat exchange between the gas-phase refrigerant and the fin, and heat is transferred from the gas-phase refrigerant to the fin, so that the gas-phase refrigerant is efficiently condensed and liquid-phase refrigerant. It becomes. As a result, since the fins can efficiently receive the latent heat of the gas-phase refrigerant, the heat radiation performance of the heat radiating section is enhanced, thereby improving the cooling performance of the cooling device.

  Moreover, you may make it the structure which provided the rising part in the periphery of the side into which the said refrigerant | coolant flows in of the said vapor | steam passage opening. As a result, the liquid-phase refrigerant colliding with the gas-liquid separation plate adheres to the gas-liquid separation plate, travels along the surface of the gas-liquid separation plate due to gravity, and falls to the lower refrigerant inflow portion. The refrigerant flows along the periphery of the vapor passage port and falls along the rising portion provided at the periphery of the vapor passage port, so that the liquid phase refrigerant flows into the vapor passage port and passes through the vapor together with the vapor phase refrigerant. It can suppress adhering to the fin which passed the opening | mouth and was provided in the refrigerant | coolant condensing part below the refrigerant | coolant discharge | release part. Therefore, the liquid phase refrigerant attached to the fin covers the surface of the fin and does not hinder heat exchange between the gas phase refrigerant and the fin, and heat is transferred from the gas phase refrigerant to the fin. Condenses efficiently and becomes a liquid phase refrigerant. As a result, since the fins can efficiently receive the latent heat of the gas-phase refrigerant, the cooling performance of the cooling device is improved.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic perspective view of an electronic device equipped with the cooling device according to the first embodiment of the present invention.

  As shown in FIG. 1, the electronic device 50 includes a power semiconductor element that serves as a heating element 2 and a cooling device 1 in a case 51.

  The cooling device 1 includes a heat receiving part 3 for cooling the heating element 2 and a heat radiating part 4, and the heat receiving part 3 and the heat radiating part 4 are connected by a heat radiating path 5 and a return path 6. With this configuration, the inside of the cooling device 1 becomes a sealed space, and although not shown in FIG. 1, the inside of the cooling device 1 is decompressed and filled with a refrigerant. As the refrigerant, pure water, ethanol, chlorofluorocarbons, fluorinated solvents and the like are used, but are not limited thereto. As the material of the heat radiation part 4 and the fins 12 described later, copper is suitable when the refrigerant is pure water or ethanol, and aluminum is suitable when the refrigerant is chlorofluorocarbons or fluorinated solvents. It is not limited to these.

  The return path 6 is provided with a check valve 8 that opens due to the water head pressure of the refrigerant that has condensed and stopped and the pressure balance in the return path 6.

  The cooling device 1 also includes a water-cooled heat sink 7 as a heat sink for radiating heat transported by the refrigerant to the heat radiating section 4. In the present embodiment, a water-cooled heat sink is used, but an air-cooled type or other system may be used as long as it can be cooled.

  The heat radiating unit 4 includes a contact surface 20 that contacts the water-cooled heat sink 7.

  Next, a basic mechanism of the cooling device 1 having the above configuration will be described.

  The cooling device 1 is a device in which the inside is decompressed and then a refrigerant is enclosed, and the inside of the cooling device 1 becomes a saturation pressure of the refrigerant according to the external temperature by the action of the refrigerant. The heat of the heating element 2 is transmitted to the refrigerant through the heat receiving portion 3, and the refrigerant changes from the liquid phase to the gas phase, whereby the heating element 2 is cooled. The refrigerant vaporized in the heat receiving part 3 becomes a gas-liquid two-phase mixed flow with the non-boiling liquid phase refrigerant, moves from the heat receiving part 3 to the heat radiating part 4 through the heat radiating path 5, and is a water-cooled heat sink. 7 is cooled and liquefied again to become a liquid-phase refrigerant, and accumulates in the return path 6 located upstream of the check valve 8.

  The check valve 8 is closed when the internal pressure of the heat receiving unit 3 becomes larger than the head pressure of the liquid refrigerant accumulated in the return path 6, so that the refrigerant vaporized in the heat receiving unit 3 is returned to the return path. 6 is prevented from flowing backward. Further, the check valve 8 is opened when the head pressure of the refrigerant in the liquid phase accumulated in the return path 6 becomes larger than the internal pressure of the heat receiving part 3, so that the liquid phase is transferred from the return path 6 to the heat receiving part 3. The refrigerant is supplied. That is, the liquid-phase refrigerant is automatically supplied into the heat-receiving unit 3 by the balance between the internal pressure of the heat-receiving unit 3 and the head pressure of the liquid-phase refrigerant accumulated in the return path 6.

  Therefore, the refrigerant is vaporized in the heat receiving part 3, the vaporized refrigerant passes through the heat radiation path 5 and is liquefied in the heat radiation part 4, and the liquefied refrigerant passes through the return path 6 and is supplied again into the heat receiving part 3. The heating element 2 is cooled by repeating the cycle.

  Next, a characteristic configuration in the present embodiment will be described.

  The cooling device 1 includes a water-cooled heat sink 7 for radiating heat transported by the refrigerant to the heat radiating unit 4, and the heat radiating unit 4 includes a contact surface 20 that contacts the water-cooled heat sink 7. The contact surface 20 of the heat radiating portion 4 and the water-cooled heat sink 7 are in surface contact with each other on the surface coated with heat radiating grease and are thermally connected. Although not shown, the contact surface 20 of the heat radiating unit 4 and the water-cooled heat sink 7 are fixed by screws.

  Thus, when maintenance is required, such as when an electronic component such as a power semiconductor element that is the heating element 2 to be cooled fails, the contact surface 20 of the heat radiating unit 4 of the cooling device 1 is in surface contact with the water-cooled heat sink 7. The contact surface 20 of the cooling device 1 and the water-cooled heat sink 7 can be easily separated. That is, unlike the conventional example, when performing maintenance, it is not necessary to remove the cooling liquid conduit that has entered the heat radiating unit 4 from the heat radiating unit 4, and the contact surface 20 of the cooling device 1 and the water-cooled heat sink 7 are screwed. Since it is fixed with a stopper, it can be easily separated by removing the screw, so that the cooling device 1 can be easily maintained.

  A cooling water path 9 is connected to the water cooling heat sink 7 so as to flow in and out, and the cooling water path 9 is connected to a chiller (not shown).

  The return path 6 is provided with a check valve 8 that opens due to a pressure balance between the water head pressure of the refrigerant that has condensed and stopped and the inside of the return path 6.

  Next, description will be made with reference to FIGS. 2, 3A, and 3B. FIG. 2 is a diagram showing an external appearance of the heat radiating portion of the cooling device, FIG. 3A is a diagram showing an AA ′ cross section of the heat radiating portion of the cooling device, and FIG. It is a figure which shows the AA 'cross section of a thermal radiation part.

  As shown in FIG. 2, the heat radiating part 4 is installed in a state in which a thin box body is set to be horizontally long. The heat radiation path 5 is connected to a heat radiation path connection port 10 provided at the upper part of the thin side surface. The return path connection port 11 is provided at the lower part of the same side surface of the heat radiation part 4 provided with the heat radiation path connection port. The return path 6 is connected to the return path connection port 11. One of the wide side surfaces of the heat dissipating part 4 is brought into surface contact with the water-cooled heat sink 7 to form a contact surface 20 for heat exchange.

As shown in FIG. 3 (a), the inside of the heat radiating section 4 is referred to for convenience by dividing the area into an upper section as a refrigerant discharge section 14, an intermediate section as a refrigerant condensing section 15, and a lower section as a refrigerant inflow section 16. The refrigerant discharge part 14, the refrigerant condensing part 15, and the refrigerant inflow part 16 are not partitioned, and the inside of the heat radiating part 4 is a single communicating space.
The refrigerant discharge part 14 is provided with a heat radiation path connection port 10, and the refrigerant inflow part 16 is provided with a return path connection port 11.
The heat dissipation path 5 is connected to the heat dissipation path connection port 10, and the return path 6 is connected to the return path connection port 11.

  A plurality of plate-like fins 12 are provided in the middle refrigerant condensing unit 15 in parallel to each other at intervals. The fins 12 are provided so as to pass between the upper refrigerant discharge part 14 and the lower refrigerant inflow part 16. As for the fin 12, the edge part contacts the contact surface 20 of the thermal radiation part 4 at least, and the fin 12 and the contact surface 20 are thermally connected. The fins 12 may be brought into contact with other side surfaces such as the side surface facing the contact surface 20 of the heat radiating unit 4.

  The operation and effect of the characteristic configuration in the present embodiment will be described.

  The refrigerant received by the heat receiving unit 3 becomes a mixed-phase flow of a two-phase refrigerant in which a gas phase and a liquid phase are mixed, and passes from the heat radiation path 5 to the refrigerant discharge part 14 of the heat radiation part 4 through the heat radiation path connection port 10. Inflow. The liquid-phase and gas-phase refrigerant that has flowed in diffuses into the upper refrigerant discharge section 14 of the heat receiving section 3 and flows into the lower refrigerant condensing section 15 by gravity. The liquid-phase and gas-phase refrigerants dissipate heat to the fins 12 by coming into contact with the plurality of fins 12 provided in the refrigerant condensing unit 15. The temperature of the liquid phase refrigerant that dissipates heat in contact with the fins 12 decreases, and the gas phase refrigerant condenses and liquefies on the fins 12. Then, the liquid-phase refrigerant flows through the fins 12 and flows into the refrigerant inflow part 16 below the refrigerant condensing part 15, passes through the return path connection port 11 and the return path 6, and is supplied again into the heat receiving part 3. The On the other hand, since the fins 12 that have received the heat of the refrigerant are in contact with and thermally connected to the contact surface 20 with the water-cooled heat sink 7, the received heat is radiated to the water-cooled heat sink 7 via the contact surface 20.

  Since the heat radiating unit 4 includes the contact surface 20 that contacts the water-cooled heat sink 7, the contact surface of the heat radiating unit 4 of the cooling device 1 is required when maintenance is required, such as when an electronic component that is the heating element 2 to be cooled breaks down. 20 is only in surface contact with the water-cooled heat sink 7, and the contact surface 20 of the cooling device 1 and the water-cooled heat sink 7 can be easily separated. That is, since the cooling water path 9 does not enter the heat radiating part 4 as in the conventional example, there is no need to remove the cooling water path 9 from the heat radiating part 4, and the contact surface 20 of the cooling device 1 and the water cooling heat sink 7 are Since it can isolate | separate easily, the cooling device 1 can be maintained easily.

  Moreover, as shown in FIG.3 (b), you may make it the structure provided with the gas-liquid separation part 13 in the vicinity of the thermal radiation path connection port 10 of the refrigerant | coolant discharge | release part 14. FIG. Thereby, the two-phase refrigerant mixed with the gas phase and the liquid phase flowing into the refrigerant discharge portion 14 of the heat radiating section 4 from the heat radiation path 5 through the heat radiation path connection port 10 is separated into the gas phase refrigerant and the liquid phase refrigerant. As a result, the separated liquid-phase refrigerant falls into the lower refrigerant inflow portion 16 due to gravity. Thus, the liquid-phase refrigerant is prevented from diffusing into the refrigerant discharge portion 14 and further adhering to the fins 12 provided in the refrigerant condensing portion 15 below the refrigerant discharge portion 14. Therefore, the liquid-phase refrigerant attached to the fin 12 covers the surface of the fin 12 and does not hinder heat exchange between the gas-phase refrigerant and the fin 12, and heat is transferred from the gas-phase refrigerant to the fins 12. The phase refrigerant efficiently condenses to become a liquid phase refrigerant. As a result, since the fins 12 can efficiently receive the latent heat of the gas-phase refrigerant, the heat dissipation performance of the heat radiating section 4 is enhanced, thereby improving the cooling performance of the cooling device.

  Here, the cooling performance improvement effect by separating the liquid phase refrigerant that has passed through the heat radiation path 5 from the gas phase refrigerant will be described in detail.

  In the refrigerant condensing unit 15, the gas phase refrigerant that has passed through the heat radiation path 5 and diffused through the refrigerant discharging unit 14 is condensed in the fins 12, but the surface of the fins 12 is liquid by condensing the gas phase refrigerant. A layer of phase refrigerant will be formed. The layer of the liquid-phase refrigerant that covers the surface of the fin 12 serves as a heat insulating layer, which causes a decrease in the heat transfer coefficient between the fin 12 and the refrigerant. The thicker the liquid-phase refrigerant layer, the higher the heat insulation effect. Therefore, the thinner the liquid-phase refrigerant layer covering the surfaces of the fins 12, the higher the cooling performance. That is, the liquid phase refrigerant that has passed through the heat dissipation path 5 diffuses into the refrigerant condensing unit 15 and adheres to the surface of most of the fins 12, thereby causing the liquid phase refrigerant layer to be thick and reducing the cooling performance. Become. Therefore, by separating the liquid-phase refrigerant that has passed through the heat radiation path 5 from the gas-phase refrigerant in the gas-liquid separation unit 13 and suppressing the diffusion into the heat radiation unit 4, the heat radiation performance of the heat radiation unit 4 is improved. Will be.

  Moreover, FIG. 4 is a figure which shows the gas-liquid separation part of the cooling device. As shown in FIG. 4, the gas-liquid separator 13 may be configured as one or a plurality of plate-like gas-liquid separators 17 provided to face the heat radiation path connection port 10. A wide surface of the gas-liquid separation plate 17 is provided so as to face the heat radiation path connection port 10. The size of the gas-liquid separation plate 17 is made larger than the area of the heat radiation path connection port 10. When a plurality of gas-liquid separation plates 17 are used, the first gas-liquid separation plate 17 is provided facing the heat radiation path connection port 10, and the second gas-liquid separation plate 17 is provided as the first gas-liquid separation. The separation plate 17 is provided so as to be arranged substantially parallel to the wide surface with a space.

  Thus, a two-phase refrigerant in which a gas phase and a liquid phase mixed from the heat radiation path 5 through the heat radiation path connection port 10 to the refrigerant discharge portion 14 of the heat radiation unit 4 are mixed is provided facing the heat radiation path connection port 10. The gas-liquid separation plate 17 is caused to collide. The liquid-phase refrigerant that has collided with the gas-liquid separation plate 17 adheres to the gas-liquid separation plate 17, travels along the surface of the gas-liquid separation plate 17 by gravity, and falls to the lower refrigerant inflow portion 16. As a result, the liquid-phase refrigerant diffuses into the refrigerant discharge portion 14 and does not adhere to the fins 12 provided in the refrigerant condensing portion 15 below the refrigerant discharge portion 14. Therefore, the liquid-phase refrigerant attached to the fin 12 covers the surface of the fin 12 and does not hinder heat exchange between the gas-phase refrigerant and the fin 12, and heat is transferred from the gas-phase refrigerant to the fin. This refrigerant is efficiently condensed and becomes a liquid phase refrigerant. As a result, since the fins 12 can efficiently receive the latent heat of the gas-phase refrigerant, the heat radiation performance of the heat radiating section 4 is enhanced, thereby improving the cooling performance of the cooling device 1.

  Further, the gas-liquid separation plate 17 may be configured to have one or a plurality of vapor passage ports 18 penetrating from the front surface to the back surface. In this embodiment, as shown in FIG. 4, four vapor passage openings 18 are provided in one gas-liquid separation plate 17. Thereby, the two-phase refrigerant mixed with the gas phase and the liquid phase flowing from the heat radiation path 5 through the heat radiation path connection port 10 to the refrigerant discharge portion 14 of the heat radiation section 4 is provided facing the heat radiation path connection port 10. When the gas-liquid separation plate 17 collides with the gas-liquid separation plate 17, the vapor-phase refrigerant and the gas-liquid collided with the gas-liquid separation plate 17 enter one or more vapor passage ports 18 penetrating from the front surface to the back surface of the gas-liquid separation plate 17. Liquid phase refrigerant that has not adhered to the separation plate 17 flows in and passes through the gas-liquid separation plate 17. Thereby, it can suppress that it collides with the gas-liquid separation plate 17, and the flow of a gaseous-phase refrigerant | coolant is prevented. As a result, the gas-phase refrigerant diffuses into the refrigerant discharge part 14 and comes into contact with the fins 12 provided in the refrigerant condensing part 15 below the refrigerant discharge part 14 without waste. As a result, since the fins 12 can efficiently receive the latent heat of the gas-phase refrigerant, the heat radiation performance of the heat radiating section 4 is enhanced, thereby improving the cooling performance of the cooling device 1.

  Further, the vapor passage port 18 of the gas-liquid separation plate 17 may be provided at a position different from the projection plane of the vapor passage port 18 of the gas-liquid separation plate 17 provided adjacently. When the gas-liquid separation plate 17 and the gas-liquid separation plate 17 provided next to each other are overlapped, the vapor passage ports 18 are arranged so that the respective vapor passage ports 18 do not overlap. Thereby, the two-phase refrigerant mixed with the gas phase and the liquid phase flowing from the heat radiation path 5 through the heat radiation path connection port 10 to the refrigerant discharge portion 14 of the heat radiation section 4 is provided facing the heat radiation path connection port 10. When the gas-liquid separation plate 17 collides with the gas-liquid separation plate 17, the vapor-phase refrigerant and the gas-liquid collided with the gas-liquid separation plate 17 enter one or more vapor passage ports 18 penetrating from the front surface to the back surface of the gas-liquid separation plate 17. Liquid phase refrigerant that has not adhered to the separation plate 17 flows in and passes through the gas-liquid separation plate 17. Since the vapor passage port 18 of the gas-liquid separation plate 17 is provided at a position different from the projection plane of the vapor passage port 18 of the gas-liquid separation plate 17 provided next to the vapor-liquid separation plate 17, it passes through the vapor passage port 18 of the gas-liquid separation plate 17. It is possible to suppress the liquid phase refrigerant that has passed through the vapor passage port 18 of the gas-liquid separation plate 17 provided next to the side far from the heat radiation path connection port 10. As a result, it is possible to suppress the liquid-phase refrigerant from diffusing into the refrigerant discharge portion 14 and further adhering to the fins 12 provided in the refrigerant condensing portion 15 below the refrigerant discharge portion 14. Therefore, the liquid-phase refrigerant attached to the fin 12 covers the surface of the fin 12 and does not hinder heat exchange between the gas-phase refrigerant and the fin 12, and heat is transferred from the gas-phase refrigerant to the fins 12. The phase refrigerant efficiently condenses to become a liquid phase refrigerant. As a result, since the fins 12 can efficiently receive the latent heat of the gas-phase refrigerant, the heat radiation performance of the heat radiating section 4 is enhanced, thereby improving the cooling performance of the cooling device 1.

  Further, the fins 12 may not be provided immediately below the gas-liquid separation plate 17. That is, the gas-liquid separation plate 17 is disposed and provided in the gap between the fin 12 provided below and the adjacent fin 12. As a result, the liquid-phase refrigerant colliding with the gas-liquid separation plate 17 adheres to the gas-liquid separation plate 17, travels along the surface of the gas-liquid separation plate 17 by gravity, and falls to the lower refrigerant inflow portion 16. Since the fins 12 are not provided immediately below the gas-liquid separation plate 17, the liquid-phase refrigerant falling from the gas-liquid separation plate 17 hardly contacts the fins 12 and enters the lower refrigerant inflow portion 16. The liquid phase refrigerant attached to the fin 12 covers the surface of the fin 12 and does not hinder heat exchange between the gas phase refrigerant and the fin 12, and heat is transferred from the gas phase refrigerant to the fin 12. Thus, the gas-phase refrigerant is efficiently condensed and becomes a liquid-phase refrigerant. As a result, since the fins 12 can efficiently receive the latent heat of the gas-phase refrigerant, the heat radiation performance of the heat radiating section 4 is enhanced, thereby improving the cooling performance of the cooling device 1.

  Moreover, as shown in FIG. 5, you may make it the structure which provided the standing | starting part 19 in the periphery of the side into which the refrigerant | coolant flows in the vapor | steam passage port 18. FIG. As a result, the liquid-phase refrigerant colliding with the gas-liquid separation plate 17 adheres to the gas-liquid separation plate 17, travels along the surface of the gas-liquid separation plate 17 by gravity, and falls to the lower refrigerant inflow portion 16. The liquid-phase refrigerant flows along the rising edge 19 provided at the periphery of the vapor passage port 18 and falls along the periphery of the vapor passage port 18, so that the liquid-phase refrigerant flows into the inside of the vapor passage port 18. Thus, it is possible to prevent the gas from passing through the vapor passage port 18 together with the gas phase refrigerant and adhering to the fins 12 provided in the refrigerant condensing unit 15 below the refrigerant discharging unit 14. Therefore, the liquid-phase refrigerant attached to the fin 12 covers the surface of the fin 12 and does not hinder heat exchange between the gas-phase refrigerant and the fin 12, and heat is transferred from the gas-phase refrigerant to the fins 12. The phase refrigerant efficiently condenses to become a liquid phase refrigerant. As a result, since the fins 12 can efficiently receive the latent heat of the gas-phase refrigerant, the cooling performance of the cooling device 1 is improved.

  As described above, since the cooling device according to the present invention can be easily maintained, electronic components such as a central processing unit (CPU), a large scale integrated circuit (LSI), and an insulated gate bipolar transistor (IGBT) are mounted. It is useful as a cooling device for electronic equipment.

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Heat generating body 3 Heat receiving part 4 Heat radiation part 5 Heat radiation path 6 Return path 7 Water cooling heat sink 8 Check valve 9 Cooling water path 10 Heat radiation path connection port 11 Return path connection port 12 Fin 13 Gas-liquid separation part 14 Refrigerant discharge part DESCRIPTION OF SYMBOLS 15 Refrigerant condensing part 16 Refrigerant inflow part 17 Gas-liquid separation plate 18 Steam passage 19 Standing part 20 Contact surface 50 Electronic device 51 Case

Claims (8)

A heat receiving portion, a heat radiating portion, and a heat radiating path and a feedback path connecting the heat receiving portion and the heat radiating portion;
The return path includes a check valve that opens due to a water head pressure of the refrigerant that has condensed and stopped and a pressure balance in the return path,
The heat radiating part is a box, and includes a refrigerant discharge part in the upper part, a refrigerant condensing part in the middle part, and a refrigerant inflow part in the lower part,
The refrigerant discharge part has a heat dissipation path connection port,
The refrigerant inflow portion has a return path connection port,
The heat dissipation path is connected to the heat dissipation path connection port,
The return path is connected to the return path connection port,
In the refrigerant condensing unit, a plurality of plate-like fins are provided in parallel in the vertical direction at intervals,
The heat radiating portion includes a contact surface in contact with the heat sink,
The said fin is the cooling device which is contacting the back surface of the said contact surface at least. The cooling device according to claim 1, further comprising a gas-liquid separation unit in the vicinity of the heat radiation path connection port of the refrigerant discharge unit. The cooling device according to claim 1 or 2, wherein the gas-liquid separation unit is one or a plurality of plate-shaped gas-liquid separation plates provided to face the heat radiation path connection port. The said gas-liquid separation board is a cooling device as described in any one of Claims 1-3 which has a 1 or several vapor | steam passage port penetrated from the surface to a back surface. The cooling device according to any one of claims 1 to 4, wherein the vapor passage port of the gas-liquid separation plate is provided at a position different from a projection surface of the vapor passage port of the gas-liquid separation plate provided adjacently. . The cooling device according to any one of claims 1 to 5, wherein the fin is not provided immediately below the gas-liquid separation plate. The cooling device according to any one of claims 1 to 6, wherein a rising portion is provided at a peripheral edge of the vapor passage port on a side where the refrigerant flows. The electronic device carrying the cooling device as described in any one of Claims 1-7.

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