JP2016009727A5

JP2016009727A5 -

Info

Publication number: JP2016009727A5
Application number: JP2014128586A
Authority: JP
Filing date: 2014-06-23
Publication date: 2016-09-01
Anticipated expiration: 2034-06-23

Description

本発明のさらに他の好適な一実施形態によれば、バッチ式の基板処理装置であって、複数の基板を、起立姿勢で、予め決められた配列ピッチで、隣接する基板間に隙間を形成した状態で水平方向に配列する基板配列装置と、前記基板配列部により配列された基板の配列状態を維持したまま、前記複数の基板にまとめて予め決められた乾燥処理を施す乾燥処理部と、前記基板配列部により配列された基板配列状態を維持したままで基板を保持することができる基板保持部材を有し、前記基板配列装置及び前記乾燥処理部との間で、前記複数の基板の基板をまとめて搬送する基板搬送装置と、前記基板処理装置の動作を制御する制御部と、を備え、前記基板配列装置は、少なくとも、第１配列パターンで基板が配列された第１基板配列と、第２配列パターンで基板が配列された第２基板配列とを形成することができ、前記第１基板配列では、当該第１基板配列の一方の端から奇数番目の基板の表面が第１方向を向くとともに裏面が前記第１方向と逆方向の第２方向を向き、前記一方の端から偶数番目の基板の表面が前記第２方向を向くとともに裏面が前記第１方向を向き、かつ当該第１基板配列の他方の端の基板の表面が前記第２方向を向くとともに裏面が前記第１方向を向いており、前記第２基板配列では、当該第２基板配列の一方の端から奇数番目の基板の表面が前記第２方向を向くとともに裏面が前記第１方向を向き、前記一方の端から偶数番目の基板の表面が前記第１方向を向くとともに裏面が前記第２方向を向き、かつ当該第２基板配列の他方の端の基板の表面が前記第１方向を向くとともに裏面が前記第２方向を向いており、前記乾燥処理部は、乾燥チャンバと、前記乾燥チャンバ内で、前記基板配列装置により配列された基板の配列状態を維持したまま、前記複数の基板をまとめて保持する基板保持具であって、前記基板搬送装置との間で、前記基板配列部により配列された基板の配列状態を維持したまま、前記複数の基板をまとめて受け渡しすることが可能な基板保持具と、前記基板配列装置による基板の配列ピッチの２倍の配列ピッチで水平方向に配列された複数の吐出口を有し、各吐出口から乾燥チャンバ内に乾燥促進ガスを吐出する少なくとも１つのノズルと、を有しており、前記基板処理装置はさらに、前記基板保持具により保持された基板と前記乾燥促進ガスを吐出する前記ノズルの吐出口との間における基板の配列方向に関する相対的位置関係を調整する調整手段をさらに備え、前記制御部は、前記基板保持具により保持されている基板が前記第１配列パターンで配列されているか前記第２配列パターンで配列されているかに応じて前記調整手段を制御し、これにより、前記ノズルから前記乾燥促進ガスが吐出されているときに前記乾燥促進ガスを吐出している吐出口が基板の裏面間の隙間に対応する位置に位置しているようにする、基板処理装置が提供される。 According to still another preferred embodiment of the present invention, there is provided a batch type substrate processing apparatus, wherein a plurality of substrates are formed in a standing posture at a predetermined arrangement pitch, and a gap is formed between adjacent substrates. A substrate arranging device arranged in a horizontal direction in a state in which the substrate is arranged, a drying processing unit that performs a predetermined drying process collectively on the plurality of substrates while maintaining the arrangement state of the substrates arranged by the substrate arranging unit, A substrate holding member capable of holding a substrate while maintaining the substrate arrangement state arranged by the substrate arrangement unit, and the plurality of substrates between the substrate arrangement apparatus and the drying processing unit A substrate transport apparatus that collectively transports the substrate processing apparatus, and a control unit that controls the operation of the substrate processing apparatus, wherein the substrate array apparatus includes at least a first substrate array in which substrates are arrayed in a first array pattern; Second distribution A second substrate arrangement in which substrates are arranged in a pattern, wherein the surface of the odd-numbered substrate from the one end of the first substrate arrangement faces the first direction and the back surface. Facing the second direction opposite to the first direction, the surface of the even-numbered substrate from the one end facing the second direction and the back surface facing the first direction, and the first substrate array The surface of the substrate at the other end faces the second direction and the back surface faces the first direction. In the second substrate arrangement, the surface of the odd-numbered substrate from one end of the second substrate arrangement is The second substrate array is directed to the second direction and the back surface is directed to the first direction, the surface of the even-numbered substrate from the one end is directed to the first direction and the back surface is directed to the second direction. The surface of the substrate at the other end of the first side is the first side And the back surface faces the second direction, and the drying processing unit maintains the arrangement state of the drying chamber and the substrates arranged by the substrate arranging device in the drying chamber. A substrate holder for collectively holding substrates, wherein the plurality of substrates can be transferred together with the substrate transfer device while maintaining the arrangement state of the substrates arranged by the substrate arrangement unit. A plurality of discharge ports arranged in a horizontal direction at an arrangement pitch that is twice the arrangement pitch of the substrates by the substrate arrangement device, and discharges a drying accelerating gas into the drying chamber from each discharge port At least one nozzle, and the substrate processing apparatus further includes a substrate held by the substrate holder and a discharge port of the nozzle that discharges the drying accelerating gas. And adjusting means for adjusting a relative positional relationship with respect to the arrangement direction of the substrates, wherein the control unit determines whether the substrates held by the substrate holder are arranged in the first arrangement pattern. The adjustment means is controlled in accordance with whether the drying promoting gas is discharged from the nozzle, and the discharge port that discharges the drying promoting gas is a gap between the back surfaces of the substrate. The substrate processing apparatus is provided so as to be located at a position corresponding to.

フード部１３９の頂部には貫通穴１３９ａが設けられており、この貫通穴１３９ａをウエハガイド１２４を第２の昇降機構１４５に連結するロッド１２４ａが貫通している。貫通穴１３９ａには、加圧ガスを供給することより膨張して、貫通穴１３９ａの内周面とロッド１２４ａの外周面との間の隙間をシールするインフレートシール１５２が設けられている。 A through hole 139 a is provided at the top of the hood portion 139, and a rod 124 a that connects the wafer guide 124 to the second lifting mechanism 145 passes through the through hole 139 a. The through hole 139a is provided with an inflation seal 152 that expands by supplying a pressurized gas and seals a gap between the inner peripheral surface of the through hole 139a and the outer peripheral surface of the rod 124a.

次に、チャックロッド２２ａが乾燥室１２３から退出した後、シャッタ１３６が開状態となっている洗浄槽１２２の開口部１２２ｃを通って、ウエハＷを保持したウエハガイド１２４が下降し、リンス液としての純水が既に貯留されている洗浄槽１２２内にウエハＷを搬入する。その後、乾燥室１２３のフード部１３９が下降し、ベース部１３７と密着する。その後、リンスノズル１２５から純水を吐出しながらウエハＷの最終リンス処理を行う。 Then, the chuck rod 22a has exited from the drying chamber 1 23, through the opening 122c of the cleaning tank 122 in which the shutter 136 is in the open state, the wafer guide 124 which holds the wafer W is lowered, the rinse liquid As a result, the wafer W is loaded into the cleaning tank 122 in which pure water is already stored. Thereafter, the hood part 139 of the drying chamber 123 descends and comes into close contact with the base part 137. Thereafter, the final rinse process of the wafer W is performed while discharging pure water from the rinse nozzle 125.

ウエハＷの乾燥が終了し、乾燥室１２３内からＩＰＡが十分に排気された後、乾燥室１２３のフード部１３９が上昇する。次いで、ウエハガイド１２４が上昇し、搬送装置２２のチャックロッド２２ａがウエハガイド１２４の下方に位置し、その後、ウエハガイド１２４が下降してウエハＷをチャックロッド２２ａに渡す。その後、チャックロッド２２ａは洗浄槽１２２の上方から退出し、保持しているウエハＷを第２配列機構２１ｂに渡す。 After the drying of the wafer W is completed and the IPA is sufficiently exhausted from the drying chamber 123, the hood portion 139 of the drying chamber 123 is raised. Then, the wafer guide 124 is raised, the chuck rod 22a of the feeder 22 is positioned below the wafer guide 124, then, the wafer guide 124 is lowered to pass the wafer W on the chuck rod 22a. Thereafter, the chuck rod 22a is retracted from above the cleaning tank 1 22, and passes the wafer W held by the second array mechanism 21b.

Claims

In a substrate processing method for performing a drying process collectively on a plurality of substrates,
A selection step of selecting one of the first array pattern and the second array pattern as the array pattern of the substrate;
According to the arrangement pattern selected in the selection step, a plurality of substrates are arranged in a horizontal direction with a predetermined arrangement pitch in a standing posture, with a gap formed between adjacent substrates. An alignment step of forming either a first substrate arrangement in which the substrates are arranged or a second substrate arrangement in which the substrates are arranged in a second arrangement pattern;
A holding step of holding the plurality of substrates together by a substrate holder while maintaining the substrate arrangement formed in the arrangement step;
In a state where the substrate is held by the substrate holder, the drying promoting gas is discharged from at least one nozzle having a plurality of discharge ports arranged in the horizontal direction at an arrangement pitch twice the arrangement pitch of the substrates. A drying promoting gas supply step of bringing the substrate into contact with the dried drying promoting gas;
With
In the first substrate arrangement, the front surface of the odd-numbered substrate from one end of the first substrate arrangement faces the first direction and the back surface faces the second direction opposite to the first direction, and the one end The surface of the even-numbered substrate faces the second direction and the back surface faces the first direction, and the surface of the substrate at the other end of the first substrate array faces the second direction and the back surface is the first direction. Facing one direction,
In the second substrate arrangement, the surface of the odd-numbered substrates from one end of the second substrate arrangement faces the second direction and the back surface faces the first direction, and the even-numbered substrates from the one end The front surface faces the first direction, the back surface faces the second direction, and the surface of the substrate at the other end of the second substrate array faces the first direction, and the back surface faces the second direction. the substrate processing method, by performing the adjustment in response to said first sequence pattern or the second array pattern selected by the selecting step, the drying when the drying accelerating gas supply step is performed A substrate processing method, further comprising an adjustment step in which the discharge port of the nozzle discharging the promotion gas is positioned at a position corresponding to a gap between the back surfaces of the substrate.

The arranging step is performed by a substrate arranging device, and the holding step includes a substrate carrying device that has received a substrate from the substrate arranging device passing the substrate to the substrate holder, and the substrate carrying device includes the substrate A substrate holding member capable of holding the substrate while maintaining the substrate arrangement state arranged by the arrangement unit;
The substrate holder has a number of substrate holding grooves that is one or more more than the number of substrates constituting the first substrate arrangement and the second substrate arrangement, and the substrate holding grooves include the first substrate arrangement and the first substrate arrangement. Arranged at the same arrangement pitch as the arrangement pitch of the substrates constituting the second substrate arrangement,
In the adjusting step, when the substrate is transferred from the substrate holding member of the substrate transfer device to the substrate holder, the substrate is arranged in the second arrangement pattern when the substrate is arranged in the first arrangement pattern. The position of the substrate holding member when the substrate is transferred from the substrate holding member to the substrate holder is shifted by a distance corresponding to the arrangement pitch in the arrangement direction of the substrate on the substrate holder. The substrate processing method of Claim 1 including this.

The arranging step is performed by a substrate arranging device, and the holding step includes a substrate carrying device that has received a substrate from the substrate arranging device passing the substrate to the substrate holder, and the substrate carrying device includes the substrate A substrate holding member capable of holding the substrate while maintaining the substrate arrangement state arranged by the arrangement device ;
The substrate holder has a number of substrate holding grooves that is one or more more than the number of substrates constituting the first substrate arrangement and the second substrate arrangement, and the substrate holding grooves include the first substrate arrangement and the first substrate arrangement. Arranged at the same arrangement pitch as the arrangement pitch of the substrates constituting the second substrate arrangement,
In the adjusting step, when the substrate is transferred from the substrate holding member of the substrate transfer device to the substrate holder, the substrate is arranged in the second arrangement pattern when the substrate is arranged in the first arrangement pattern. The position of the substrate holder when the substrate is transferred from the substrate holding member to the substrate holder is shifted by a distance corresponding to the arrangement pitch in the arrangement direction of the substrate on the substrate holder. The substrate processing method of Claim 1 including this.

In the adjusting step, the position of the nozzle on the substrate holder is determined depending on whether the substrate is arranged in the first arrangement pattern or the substrate is arranged in the second arrangement pattern. The substrate processing method according to claim 1, further comprising shifting the distance in the arrangement direction by a distance corresponding to the arrangement pitch.

Two of the nozzles are provided, and the position of the discharge port of the first nozzle of these two nozzles corresponds to the arrangement pitch along the discharge port arrangement direction with respect to the position of the discharge port of the second nozzle. Is shifted by the distance
The adjustment step, the drying accelerating gas selects the first Roh nozzle as a nozzle for supplying the substrate, and the substrate are arranged in the second arrangement pattern when that substrate is arranged in the first arrangement pattern the drying accelerating gas as a nozzle for supplying a substrate comprising selecting a second Roh nozzle, a substrate processing method according to claim 1, wherein when there.

A storage medium for storing a program that can be executed by a control device including a computer that controls the operation of the substrate processing apparatus, and when the program is executed by the computer, the control device claims to the substrate processing apparatus. A storage medium for executing the substrate processing method according to any one of 1 to 5 .

A batch type substrate processing apparatus,
A substrate arranging device that arranges a plurality of substrates in a horizontal direction in a standing posture at a predetermined arrangement pitch with a gap formed between adjacent substrates;
While maintaining the arrangement state of the substrates arranged by the substrate arrangement apparatus, a drying processing unit that performs a predetermined drying process collectively on the plurality of substrates,
A substrate holding member capable of holding a substrate while maintaining the substrate arrangement state arranged by the substrate arrangement unit, and the plurality of substrates between the substrate arrangement apparatus and the drying processing unit A substrate transfer device for transferring
A control unit for controlling the operation of the substrate processing apparatus;
With
The substrate array device can form at least a first substrate array in which substrates are arrayed in a first array pattern and a second substrate array in which substrates are arrayed in a second array pattern,
In the first substrate arrangement, the front surface of the odd-numbered substrate from one end of the first substrate arrangement faces the first direction and the back surface faces the second direction opposite to the first direction, and the one end The surface of the even-numbered substrate faces the second direction and the back surface faces the first direction, and the surface of the substrate at the other end of the first substrate array faces the second direction and the back surface is the first direction. Facing one direction,
In the second substrate arrangement, the surface of the odd-numbered substrates from one end of the second substrate arrangement faces the second direction and the back surface faces the first direction, and the even-numbered substrates from the one end The front surface faces the first direction, the back surface faces the second direction, and the surface of the substrate at the other end of the second substrate array faces the first direction, and the back surface faces the second direction. The drying processing unit
A drying chamber;
In the drying chamber, a substrate holder that holds the plurality of substrates together while maintaining the arrangement state of the substrates arranged by the substrate arrangement device, the substrate holding device between the substrate transfer device A substrate holder capable of collectively delivering the plurality of substrates while maintaining the arrangement state of the substrates arranged by the arrangement unit;
At least one nozzle that has a plurality of discharge ports arranged in a horizontal direction at an arrangement pitch that is twice the arrangement pitch of the substrates by the substrate arrangement device, and that discharges the drying promoting gas from each discharge port into the drying chamber;
Have
The substrate processing apparatus further includes an adjusting unit that adjusts a relative positional relationship in the arrangement direction of the substrates between the substrate held by the substrate holder and the discharge port of the nozzle that discharges the drying accelerating gas. ,
The control unit controls the adjustment unit according to whether the substrates held by the substrate holder are arranged in the first arrangement pattern or the second arrangement pattern, thereby A substrate processing apparatus, wherein when the drying accelerating gas is discharged from a nozzle, the discharge port from which the drying accelerating gas is discharged is positioned at a position corresponding to a gap between the back surfaces of the substrate.

The substrate holder has a number of substrate holding grooves that is one or more more than the number of substrates constituting the first substrate arrangement and the second substrate arrangement, and the substrate holding grooves include the first substrate arrangement and the first substrate arrangement. Arranged at the same arrangement pitch as the arrangement pitch of the substrates constituting the second substrate arrangement,
The substrate transport device has a moving mechanism for moving the substrate holding member forward and backward with respect to the substrate holder along the arrangement direction of the substrates,
The control unit uses the moving mechanism of the substrate transfer device as the adjustment unit, and when the substrate is arranged in the first arrangement pattern and when the substrate is arranged in the second arrangement pattern, The substrate processing apparatus according to claim 7, wherein a position where the substrate is transferred from the substrate holding member to the substrate holder is shifted by a distance corresponding to the arrangement pitch of the substrates in the arrangement direction of the substrates on the substrate holder.

A moving mechanism for moving the substrate holder forward and backward along the arrangement direction of the substrates is provided;
The control unit uses the moving mechanism of the substrate holder as the adjustment unit, and when the substrate is arranged in the first arrangement pattern and when the substrate is arranged in the second arrangement pattern, The substrate processing apparatus according to claim 7, wherein a position where the substrate is transferred from the substrate holding member to the substrate holder is shifted by a distance corresponding to the arrangement pitch of the substrates in the arrangement direction of the substrates on the substrate holder.

A moving mechanism for moving the nozzle back and forth along the arrangement direction of the substrates is provided;
The control unit uses the moving mechanism of the nozzle as the adjusting unit, and the nozzle is arranged when the substrate is arranged in the first arrangement pattern and when the substrate is arranged in the second arrangement pattern. The substrate processing apparatus according to claim 7, wherein the position is shifted by a distance corresponding to the arrangement pitch of the substrates in the arrangement direction of the substrates on the substrate holder.

At least two nozzles are provided, and the position of the discharge port of the first nozzle of these two nozzles is in the arrangement direction of the substrate on the substrate holder with respect to the position of the discharge port of the second nozzle. It is shifted by a distance corresponding to the arrangement pitch of the substrates,
Switching device is provided for switching the discharge from the discharge and the previous SL second nozzle from the first nozzle,
Wherein the control unit uses the switching device as said adjusting means, when using the first nozzle, the substrate in the second arrangement pattern is arranged when the substrate is arranged in the first arrangement pattern The substrate processing apparatus according to claim 7, wherein the second nozzle is used.