JP2016009690A - Mounting substrate and method for manufacturing mounting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a mounting substrate having reflection characteristics while suppressing damage to a resin substrate.SOLUTION: The method for manufacturing a mounting substrate comprises the steps of: preparing a wiring board including the resin substrate having flexibility and an electrode unit for mounting provided on the resin substrate; and mounting a light-emitting component on the electrode unit for mounting of the wiring board. The method further includes a reflection characteristic imparting step of providing a reflective member reflecting light on a surface on the side on which the light-emitting component is mounted among surfaces of the wiring board before or after the mounting step. The reflection characteristic imparting step is performed by sticking a reflective member including an opening formed in the position corresponding to the light-emitting component to the wiring board via an adhesive layer.

Description

  The present invention relates to a mounting substrate on which a light emitting component is mounted and a method for manufacturing the mounting substrate.

  In recent years, it has been proposed to configure a light-emitting device such as a lighting fixture using a light-emitting component including a light-emitting element that functions as a point light source, such as a light-emitting diode. For example, in Patent Document 1, a light emitting device is configured by preparing a substrate on which terminals and wirings for driving a light emitting component are formed and mounting the light emitting component on this substrate.

  Incidentally, the directivity of light emitted from a light emitting element such as a light emitting diode is generally higher than the directivity of light emitted from a conventional fluorescent lamp. For this reason, for example, when using a light-emitting diode in a lighting fixture, in order to suppress the shape and arrangement of the light-emitting diode from being visually recognized by the user and to reduce straight light from the light-emitting diode, in general, as a light diffusing agent A functional lighting cover is provided to cover the light emitting diode. In addition, a reflective layer capable of reflecting light with high reflectivity is formed on the surface of the substrate on which the light emitting component is mounted in order to increase the light use efficiency.

  For example, Patent Document 1 proposes forming a reflective layer on a substrate using a white ceramic material capable of realizing a high reflectance such as titanium oxide, calcium oxide, and zinc oxide. Such a reflective layer, for example, by first performing an application process of applying a paste containing a powder of a ceramic material on a substrate, and then performing a baking process of heating the substrate and baking the paste, It is formed.

JP 2006-147999 A

  In recent years, flexible printed boards tend to be used as printed wiring boards instead of rigid boards such as glass epoxy boards. The flexible substrate has various advantages such as being lightweight and capable of supporting a three-dimensional shape such as a cylindrical shape or a mountain shape. A general flexible substrate is composed of a resin substrate made of a flexible resin material such as polyethylene terephthalate, and a metal mounting electrode part and wiring formed on the surface of the resin substrate. ing.

  By the way, the glass transition temperature and melting point of resin materials such as polyethylene terephthalate for constituting the resin substrate of the flexible substrate are generally lower than the glass transition temperature and melting point of resin materials used in conventional rigid substrates. That is, the heat resistance of the flexible substrate is lower than the heat resistance of the conventional rigid substrate. For this reason, when the above-mentioned reflective layer is formed by baking a paste containing a ceramic material powder, the flexible substrate is exposed to a high temperature for a long period of time, for example, 30 minutes or 1 hour, in the firing process. It is possible that some damage will be done. For example, when the firing temperature is higher than the glass transition temperature of the resin material constituting the flexible substrate, the flexible substrate may be deformed. In addition, when the thermal expansion coefficient of the material constituting the reflective layer and the thermal expansion coefficient of the material constituting the flexible substrate are greatly different, a large stress is applied to the flexible substrate due to the curing shrinkage of the material constituting the reflective layer. It may occur that the flexible substrate is deformed due to this. Further, when the flexible substrate is deformed, the reflective layer may be peeled off from the flexible substrate or a crack may be formed in the reflective layer.

  The present invention has been made in consideration of such points, and provides a mounting substrate manufacturing method capable of realizing high reflectance while suppressing damage to a flexible substrate. With the goal.

  The present invention is a mounting substrate on which a light emitting component is mounted, and includes a flexible resin substrate, a mounting electrode portion provided on the resin substrate, and a wiring connected to the mounting electrode portion. , A light emitting component mounted on the mounting electrode section, a reflective member that is provided on a surface of the wiring substrate on which the light emitting component is mounted and reflects light, And the reflective member includes an opening formed at a position corresponding to the light emitting component, and an adhesive layer is interposed between the wiring substrate and the reflective member. .

  In the mounting substrate according to the present invention, the adhesive layer may be provided so as to at least partially cover the wiring.

  In the mounting substrate according to the present invention, the reflective member may include a base material in which white pigments or bubbles are dispersed.

  In the mounting substrate according to the present invention, the reflective member may include a base material and a reflective layer provided on the base material.

  In the mounting substrate according to the present invention, a heat conductive filler may be dispersed in the base material of the reflective member.

  In the mounting substrate according to the present invention, the adhesive layer may include an anisotropic conductive adhesive having conductivity in the thickness direction of the adhesive layer.

  The present invention is a method of manufacturing a mounting substrate on which a light emitting component is mounted, and is connected to a flexible resin substrate, a mounting electrode portion provided on the resin substrate, and the mounting electrode portion. And a mounting step of mounting a light emitting component on the mounting electrode portion of the wiring substrate, and before the mounting step or of the mounting step The method further includes a reflective property imparting step of providing a reflective member that reflects light on a surface of the wiring board on which the light emitting component is mounted, and the reflective property imparting step corresponds to the light emitting component. The mounting board manufacturing method is implemented by attaching a reflective member including an opening formed at a position to be attached to the wiring board via an adhesive layer.

  In the mounting substrate manufacturing method according to the present invention, the adhesive layer may be provided so as to at least partially cover the wiring.

  In the method for manufacturing a mounting substrate according to the present invention, the reflective member may include a base material in which white pigments or bubbles are dispersed.

  In the method for manufacturing a mounting board according to the present invention, the reflective member may include a base material and a reflective layer provided on the base material.

  In the method for manufacturing a mounting substrate according to the present invention, the resin substrate may include a polyester resin, an epoxy resin, or a polyimide resin, and the thickness of the resin substrate may be in a range of 10 μm to 300 μm.

  In the method for manufacturing a mounting board according to the present invention, in the reflection characteristic imparting step, the long wiring board and the long reflective member may be laminated together in a roll-to-roll manner.

  In the mounting board manufacturing method according to the present invention, the light emitting component may include a light emitting diode element.

  According to the present invention, it is possible to provide a mounting substrate having a high reflectance while suppressing damage to the resin substrate.

FIG. 1 is a plan view showing a mounting board according to an embodiment of the present invention. FIG. 2 is a longitudinal sectional view of the mounting substrate of FIG. 1 as viewed from the II-II direction. FIG. 3 is a diagram illustrating a method for manufacturing a mounting substrate. FIG. 4 is a diagram illustrating a process of preparing a wiring board including a resin substrate and a mounting electrode unit in the mounting board manufacturing method according to the embodiment of the present invention. FIG. 5 is a diagram showing a process of placing a light emitting component on a mounting electrode portion of a wiring board in the mounting board manufacturing method according to the embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating a lighting device including a mounting substrate and a diffusion plate. 7A to 7C are views showing a method for manufacturing a reflective member according to a modification. 8A to 8C are views showing a method for manufacturing a reflective member according to another modification. FIG. 9 is a view showing a modification of the method for manufacturing the mounting substrate.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 6. First, the mounting substrate 40 obtained by the manufacturing method according to the present embodiment will be described with reference to FIGS. As will be described later, the mounting substrate 40 can be combined with an illumination cover configured as a diffusion plate to constitute an illumination device.

As shown in FIG. 1, the mounting board 40 includes a wiring board 20 that is flexible and functions as a so-called flexible board, and a plurality of light emitting components 41 mounted on the wiring board 20. Yes. As long as a light emitting element that can function as a point light source is provided, the configuration of the light emitting component 41 is not particularly limited. For example, a light-emitting diode can be used as the light-emitting element, and a surface-mounted component including a light-emitting diode housed in a surface-mounted package can be used as the light-emitting component 41.

  As shown in FIG. 1, the wiring board 20 may include an extraction electrode portion 24 that is electrically connected to the light emitting component 41 via a wiring 23 described later. As shown in FIG. 1, the extraction electrode portion 24 may be formed on the same surface as the surface on which the light emitting component 41 is mounted, among the surfaces of the wiring board 20, or although not shown, the light emitting component 41. May be formed on the surface opposite to the surface on which is mounted.

  As shown in FIG. 1, the mounting substrate 40 further includes a reflective member 30 that is provided on the surface of the wiring substrate 20 on the side where the light emitting component 41 is mounted and reflects light. By providing such a reflective member 30, the light that is radiated from the light emitting component 41 and then reflected by a diffuser plate, which will be described later, and returned to the mounting substrate 40 is reflected by the reflective member 30, and the illumination device Can be emitted to the outside. Thereby, the utilization efficiency of the light in an illuminating device can be improved. The configuration of the reflective member 30 will be described later. As shown in FIG. 1, an opening 32 is formed at a position corresponding to the light emitting component 41 and the extraction electrode portion 24 in the reflective member 30.

  Next, the wiring board 20 will be described in detail with reference to FIG. The wiring substrate 20 includes a flexible resin substrate 21, a mounting electrode portion 22 provided on the resin substrate 21, and a wiring 23 connected to the mounting electrode portion. The mounting electrode portion 22 is a portion for mounting the light emitting component 41 and is also referred to as a pad or a land. In the following description, of the surfaces of the resin substrate 21, the surface on which the mounting electrode portion 22 is provided is referred to as a first surface 21a, and the surface on the opposite side of the first surface 21a is referred to as a second surface 21b. The wiring 23 described above is provided on the first surface 21 a of the resin substrate 21 so as to electrically connect the mounting electrode portion 22 and the extraction electrode portion 24.

  FIG. 2 shows an example in which the wiring 23 is provided only on the first surface 21a side of the resin substrate 21, but the present invention is not limited to this. For example, when the extraction electrode portion 24 is provided on the side opposite to the side on which the light emitting component 41 is mounted as described above, that is, on the second surface 21b side of the resin substrate 21, the wiring 23 is formed on the resin substrate. 21 may be provided on the second surface 21b side. In this case, the mounting electrode portion 22 and the wiring 23 are electrically connected through, for example, a through hole formed in the resin substrate 21.

  In the present embodiment, “flexibility” refers to the degree that a fold does not occur in the wiring board 20 when the wiring board 20 is wound into a roll shape having a diameter of 30 cm in an environment of room temperature, for example, 25 ° C. Means flexibility. A “fold” is a deformation that appears in the wiring board 20 in a direction that intersects the direction in which the wiring board 20 is wound, and even if the wiring board 20 is wound in the reverse direction so that the deformation is restored. Means deformation that does not return. In addition, as long as the wiring board 20 has flexibility as a whole, the degree of flexibility in each of the resin substrate 21, the mounting electrode portion 22, and the wiring 23 is not particularly limited.

(Resin substrate)
The resin substrate 21 is a flexible substrate made of an insulating resin material. The material constituting the resin substrate 21 and the thickness of the resin substrate 21 are appropriately determined according to characteristics such as flexibility and strength required for the wiring substrate 20. For example, the resin substrate 21 may include a polyester resin, an epoxy resin, or a polyimide resin. Moreover, the thickness of the resin substrate 21 is set within a range of 10 μm to 300 μm, for example.

(Mounting electrode, wiring, and extraction electrode)
As a material constituting the mounting electrode part 22, the wiring 23, and the extraction electrode part 24, a conductive material is used, and for example, a metal material such as copper or silver is used. The materials constituting the mounting electrode portion 22, the wiring 23, and the extraction electrode portion extraction electrode portion 24 may be the same or different. For example, the mounting electrode part 22, the wiring 23, and the extraction electrode part 24 may be formed simultaneously and continuously by patterning the same material. As long as the mounting substrate 40 is flexible in a desired direction, dimensions such as thickness and width of the mounting electrode portion 22, the wiring 23, and the extraction electrode portion 24 are not particularly limited.

(Middle layer)
In FIG. 2, reference numeral 42 denotes between the light emitting component 41 and the mounting electrode portion 22 in order to couple the light emitting component 41 to the mounting electrode portion 22 and electrically connect the light emitting component 41 to the mounting electrode portion 22. Represents an intermediate layer interposed between the two. Examples of the material constituting the intermediate layer 42 include cream solder applied on the mounting electrode portion 22 in a reflow process described later. Cream solder includes a binder material such as flux, and metal powder that is dispersed in the binder material and melts during the reflow process. The composition of the metal powder contained in the cream solder is appropriately determined according to the temperature of the reflow process, the resistance of the wiring board 20 to the temperature, and the like. Although FIG. 2 shows an example in which the intermediate layer 42 is clearly interposed between the light emitting component 41 and the mounting electrode portion 22, the present invention is not limited to this. The shape and arrangement of the intermediate layer 42 are not particularly limited as long as the light emitting component 41 can be coupled to the mounting electrode portion 22 to electrically connect the light emitting component 41 to the mounting electrode portion 22.

(Reflective member)
The reflective member 30 is a member that is provided on the first surface 21 a side of the resin substrate 21 in order to provide the wiring substrate 20 with reflective characteristics. As will be described later, the reflective member 30 is provided by attaching the reflective member 30 to the wiring board 20 via the adhesive layer 35. For this reason, as shown in FIG. 2, an adhesive layer 35 is interposed between the wiring board 20 and the reflective member 30.

  The specific configuration of the reflective member 30 is not particularly limited as long as it can be attached to the wiring board 20 and has high reflection characteristics. For example, in the present embodiment, the reflective member 30 includes a base material in which white pigments, bubbles, and the like are dispersed. As a material constituting the substrate, a flexible resin material such as polyethylene terephthalate can be used. As the white pigment, white ceramic materials such as titanium oxide, calcium oxide, and zinc oxide can be used. A method for manufacturing such a reflective member 30 is not particularly limited, and a known method can be appropriately used. For example, pellets that are the raw materials for resin materials and white pigment are mixed and melted, and these mixed materials are molded by extrusion molding or the like, and fired as necessary to provide flexibility and reflectivity. Thus, the reflective member 30 can be obtained.

  The thickness of the reflective member 30 is determined so that the mounting substrate 40 has appropriate flexibility and reflection characteristics. For example, the thickness of the reflective member 30 is in the range of 10 μm to 300 μm. Preferably, the reflective member 30 is configured such that the total light reflectance in the light wavelength range of 380 nm to 780 nm is in the range of 60% to 99%. Here, the “total light reflectance” is the sum of regular reflectance and diffuse reflectance. The total light reflectance can be obtained in accordance with the total light reflectance measurement method of JIS K7375. Specifically, the total light reflectivity is the reflectivity when light is incident on the reflective member 30 at an angle from the surface of the reflective member 30 that is exposed on the surface of the mounting substrate 40. It can be obtained by measuring at an interval of 10 nm at a light wavelength of 380 nm to 780 nm using a spectrophotometer and an integrating sphere test stand and calculating an average value thereof. The total light reflectance is obtained as a relative value with the reflectance of a standard white plate containing barium sulfate as 100%.

  A heat conductive filler having high heat conductivity may be further dispersed in the base material constituting the reflective member 30. As a result, of the heat generated in the light emitting component 41 during the operation of the mounting substrate 40 or during the reflow process, the heat conducted to the reflective member 30 via the mounting electrode portion 22, the wiring 23, and the adhesive layer 35. Can be emitted with high efficiency in the reflective member 30. As a result, the temperature of the light emitting component 41 can be lowered, and therefore the reliability of the light emitting component 41 can be improved. Moreover, since the amount of heat conducted to the resin substrate 21 can be reduced, it is possible to suppress the resin substrate 21 from being deformed. As the thermally conductive filler, oxide particles such as alumina particles and silica particles, metal powder, and the like can be used.

  Note that the resin substrate 21 of the wiring substrate 20 may include the above-described thermally conductive filler. Thereby, the heat from the light emitting component 41 generated on the first surface 21a side of the resin substrate 21 can be transmitted to the second surface 21b side with high conductivity. Also by this, it is possible to improve the reliability of the light emitting component 41 and to prevent the resin substrate 21 from being deformed.

(Adhesive layer)
The adhesive layer 35 is a layer for attaching the reflective member 30 to the wiring board 20. The material constituting the adhesive layer 35 is not particularly limited as long as it has an appropriate adhesive force. For example, epoxy-based, silicone-based, acrylic-based, urethane-based, rubber-based thermosetting adhesives, UV-curable types Adhesives, pressure sensitive adhesives, hot melt adhesives, and the like can be used. When a thermosetting adhesive is used, a thermosetting adhesive whose curing temperature is lower than the temperature for firing the conventional white layer, for example, the temperature at which the paste containing the ceramic material powder is baked and hardened is used. Used. For example, a thermosetting adhesive having a curing temperature in the range of 80 ° C to 120 ° C is used. This can prevent the resin substrate 21 from being damaged when the reflective member 30 is bonded to the wiring substrate 20.

  In addition to the adhesive resin material, the adhesive layer 35 may further include conductive particles dispersed in the resin material and having electrical conductivity. For example, an anisotropic conductive adhesive may be used as the adhesive layer 35. An anisotropic conductive adhesive is an adhesive in which conductive particles coated with insulation are mixed with a base material having adhesiveness mainly composed of a thermosetting resin, and is pressed while being heated. The adhesive has conductivity in the thickness direction of the pressure-sensitive adhesive layer 35 and has insulation in a direction orthogonal to the thickness direction of the pressure-sensitive adhesive layer 35. By further including the conductive particles in the adhesive layer 35, the thermal conductivity from the resin substrate 21 to the reflective member 30 can be further increased, thereby further improving the reliability of the light emitting component 41, It is possible to further suppress the resin substrate 21 from being deformed.

  As shown in FIG. 2, the adhesive layer 35 is provided so as to at least partially cover the wiring 23. Thereby, for example, light incident on the wiring board 20 such as light L <b> 2 returning from the diffusing plate 50 described later can be suppressed from being reflected by the wiring 23. Thereby, it is possible to suppress the influence of the color of the wiring 23 from appearing on the light emitted from the lighting device 55. For example, when the wiring 23 is made of copper, it is possible to suppress reddish light caused by copper from being emitted from the lighting device 55. Further, by covering the wiring 23 with the adhesive layer 35, it is possible to suppress the wiring 23 from being deteriorated such as rust.

  Next, the operation and effect of the present embodiment having such a configuration will be described. First, the manufacturing apparatus 10 for manufacturing the mounting substrate 40 will be described with reference to FIG.

(manufacturing device)
In FIG. 3, the code | symbol 11a represents the 1st unwinding part 11a which unwinds the wiring board 20, while hold | maintaining the elongate wiring board 20 in the roll shape. Reference numeral 11b denotes a second unwinding portion 11b that holds the long reflective member 30 bonded to the wiring board 20 in a rolled state. Reference numeral 19 denotes a winding unit 19 that winds up the laminated body in which the wiring substrate 20 and the reflective member 30 are bonded together.

  The manufacturing apparatus 10 includes a coating unit 13 for applying cream solder for forming the intermediate layer 42 on the mounting electrode unit 22 of the wiring substrate 20 unwound from the first unwinding unit 11a, and an intermediate layer 42. The mounting unit 14 for mounting the light emitting component 41 on the mounting electrode unit 22 provided, and the processing unit 16 for coupling the light emitting component 41 to the mounting electrode unit 22 through the intermediate layer 42 are provided. ing. The processing unit 16 is for coupling the light emitting component 41 to the mounting electrode unit 22 by heating the wiring board 20. In order to stabilize the temperature atmosphere around the processing unit 16, a chamber 17 surrounding the wiring substrate 20 around the processing unit 16 may be provided as shown in FIG.

  In addition, the manufacturing apparatus 10 further includes a laminated portion 12 that attaches the reflective member 30 unwound from the second unwinding portion 11 b to the wiring board 20. For example, the laminated portion 12 is configured as a laminated roll that presses the reflective member 30 toward the wiring substrate 20.

(Manufacturing method of mounting substrate)
Next, a method for manufacturing the mounting substrate 40 using the manufacturing apparatus 10 will be described. First, a method for mounting the light emitting component 41 on the wiring board 20 using the manufacturing apparatus 10, a so-called reflow process will be described with reference to FIGS. 4 and 5. 4 and 5 are longitudinal sectional views showing the case where the wiring board 20 is cut before and after the reflow process.

  First, as shown in FIG. 4, the wiring substrate 20 including the resin substrate 21 and the mounting electrode portion 22 described above is prepared in a roll form wound around the first unwinding portion 11 a. A method for forming the wiring substrate 20, for example, a method for forming the mounting electrode portion 22 on the resin substrate 21 is not particularly limited, and various known methods can be used. For example, the mounting electrode part 22 can be formed by printing a paste containing fine particles of metal such as copper or silver in a pattern corresponding to the mounting electrode part 22. The mounting electrode part 22 can also be formed by etching a metal film formed on the first surface 21a of the resin substrate 21 by adhesion or vapor deposition. In addition, first, by forming a seed film on the first surface 21a of the resin substrate 21 with a pattern corresponding to the mounting electrode portion 22, and then forming a metal film on the seed film by plating, The mounting electrode part 22 can be formed.

  Next, the wiring board 20 is transported from the first unwinding part 11 a toward the winding part 19 by pulling the wiring board 20 with a predetermined tension. The tension applied to the wiring board 20 is appropriately set so that the accuracy of the mounting position of the light emitting component 41 does not decrease due to the slack generated in the wiring board 20.

  Next, as shown in FIG. 5, an application step of applying cream solder for forming the intermediate layer 42 onto the mounting electrode portion 22 is performed using the application portion 13. As the application unit 13, for example, a screen printer that applies cream solder using a metal mask having an opening formed at a position corresponding to the mounting electrode unit 22 can be used. After that, as shown in FIG. 5, using the mounting portion 14, a mounting step of mounting the light emitting component 41 on the mounting electrode portion 22 provided with the intermediate layer 42 is performed.

  Next, a processing step of heating the wiring board 20 with tension applied to the wiring board 20 is performed. In the processing step, the metal powder contained in the cream solder of the intermediate layer 42 is melted, whereby the light emitting component 41 is coupled to the mounting electrode portion 22. The heating temperature and the heating time during the treatment process are appropriately determined according to conditions recommended by the manufacturer of the light emitting component 41. For example, in the processing step, first, preliminary heating is performed for about 2 minutes at a temperature of less than two hundred degrees, and then heating is performed for about one minute at a temperature of two hundred and ten degrees.

  Next, a reflection characteristic imparting step is performed in which the above-described reflective member 30 that reflects light is provided on the surface of the wiring board 20 on the side where the light emitting component 41 is mounted. First, a long reflective member 30 including an opening 32 formed at a position corresponding to the light emitting component 41 and the extraction electrode portion 24 is prepared. The opening 32 may be formed in the reflective member 30 between the time when the reflective member 30 is unwound from the second unwinding portion 11b and the time when the reflective member 30 is attached to the wiring substrate 20, or the second unwinding is performed. The reflective member 30 wound around the part 11b may be formed in advance. Next, the reflective member 30 is attached to the wiring board 20 via the adhesive layer 35. The adhesive layer 35 may be provided on the surface of the reflective member 30 by coating or the like between the time when the reflective member 30 is unwound from the second unwinding portion 11b and the time when it is attached to the wiring board 20, Or you may provide beforehand on the surface of the reflective member 30 wound around the 2nd unwinding part 11b. Further, the adhesive layer 35 may be provided not on the reflective member 30 side but on the wiring substrate 20 side.

  In the case where the adhesive layer 35 is made of a thermosetting adhesive as described above, after the reflective member 30 is bonded to the wiring substrate 20 via the adhesive layer 35, a process of heating them is performed. Thereby, the reflective member 30 is firmly bonded to the wiring board 20.

  According to the present embodiment, as described above, the reflective member 30 including the opening 32 formed at a position corresponding to the mounting electrode portion 22 and the light emitting component 41 is connected to the wiring substrate 20 via the adhesive layer 35. By attaching to the resin substrate 21, the mounting substrate 40 can be provided with reflection characteristics. For this reason, the baking process for baking and solidifying the reflective member 30 to realize the reflective characteristics of the reflective member 30 is performed independently of the resin substrate 21 of the wiring substrate 20 without affecting the resin substrate 21. be able to. Therefore, in the present embodiment, the resin substrate 21 is not exposed to a high temperature for a long time. For this reason, it is possible to obtain the mounting substrate 40 having the reflection characteristics while suppressing the resin substrate 21 from being damaged. For example, the resin substrate 21 can be prevented from being deformed by heat.

  Moreover, in this Embodiment, since the reflective member 30 after passing through a baking process is affixed on the wiring board 20, when the thermal expansion coefficient of the resin substrate 21 and the thermal expansion coefficient of the reflective member 30 differ greatly, Even if it exists, a big stress does not generate | occur | produce in the resin substrate 21 resulting from the hardening shrinkage | contraction and heat shrink of the reflective member 30. FIG. For this reason, it can suppress that the resin substrate 21 deform | transforms, the reflective member 30 peels from the resin substrate 21, and a crack is formed in the reflective member 30.

  Also in the present embodiment, the resin substrate 21 of the wiring board 20 is heated to a high temperature in the above-described processing step for mounting the light emitting component 41 on the wiring board 20. On the other hand, the heating time in the treatment process is generally extremely short compared to the heating time in the firing process performed to form a conventional reflective layer. For example, as described above, the heating time in the treatment process is less than a few minutes, while the heating time in the firing process performed to form the conventional reflective layer is 30 minutes or 1 hour. Therefore, as in the present embodiment, the firing process for realizing the reflection characteristics of the reflective member 30 is performed independently of the resin substrate 21 of the wiring substrate 20, thereby causing thermal damage to the resin substrate 21. Mitigating is very effective.

(Lighting device)
Next, the lighting device 55 in which the mounting substrate 40 is incorporated will be described. As shown in FIG. 6, the lighting device 55 includes a mounting substrate 40 and a diffusion plate 50 arranged at a predetermined interval on the side of the mounting substrate 40 on which the light emitting component 41 is mounted. . The diffusion plate 50 is a member configured to function as a light diffusing agent. In this case, a part of the light emitted from the light emitting component 41 passes through the diffusion plate 50 to reach the user side, and the other is reflected by the diffusion plate 50 and returns to the mounting substrate 40. For example, as shown in FIG. 6, among the light emitted from the light emitting component 41, the light L <b> 1 incident on the diffusion plate 50 substantially along the normal direction of the diffusion plate 50 passes through the diffusion plate 50 and is on the user side. To. On the other hand, of the light emitted from the light emitting component 41, the light L2 incident on the diffusion plate 50 along the direction inclined from the normal direction of the diffusion plate 50 is reflected by the diffusion plate 50 and returned to the mounting substrate 40. Thereafter, the light is reflected by the reflective member 30 and travels toward the diffusion plate 50 again, and passes through the diffusion plate 50 to reach the user side. As described above, according to the present embodiment, it is possible to use the light emitted from the light emitting component 41 along the direction inclined from the normal line direction of the diffusion plate 50, so that the light use efficiency can be improved. Moreover, it can suppress that the shape and arrangement | positioning of the light emitting component 41 are visually recognized by the user.

  Note that various modifications can be made to the above-described embodiment. Hereinafter, modified examples will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted. In addition, when it is clear that the operational effects obtained in the above-described embodiment can be obtained in the modified example, the description thereof may be omitted.

(First Modification of Reflective Member)
In the above-described embodiment, an example in which a substrate in which white pigments, bubbles, and the like are dispersed is used as the reflective member 30 has been described. However, the specific configuration of the reflective member 30 and the manufacturing method of the reflective member 30 are not particularly limited as long as they have flexibility and reflective characteristics. For example, as shown in FIG. 7A, first, a base material 31 having flexibility is prepared, and then, as shown in FIG. The reflective member 30 may be obtained by forming the opening 32 at a position corresponding to the portion 24 and then forming the reflective layer 33 on the surface of the substrate 31 as shown in FIG. . As the base material 31, a flexible resin material such as polyethylene terephthalate can be used as in the case of the present embodiment described above. As a method of forming the reflective layer 33, first, a paste containing a reflective material such as a white ceramic material or metal powder is provided on the surface of the base material 31, and then a baking step is performed in which the paste is baked and hardened. The method can be considered. The method for providing the paste on the surface of the substrate 31 is not particularly limited, and a spin coating method, a dip coating method, or the like can be used. In addition, the reflective layer 33 including a metal thin film can be formed on the surface of the substrate 31 by vapor deposition or the like.

(Second Modification of Reflective Member)
In the first modified example of the reflective member 30 described above, the example in which the reflective layer 33 is formed on the surface of the base material 31 after the opening 32 is formed in the base material 31 is shown. However, the present invention is not limited to this. As shown in FIGS. 8A to 8C, first, the reflective layer 33 is formed on the surface of the base material 31, and then the base material 31 and the reflective layer 33 are included. You may form the opening part 32 in a laminated body. As a method for forming the reflective layer 33, a method similar to that in the case of the first modified example described above can be used.

  In any of the first and second modifications described above, the firing step for baking the reflective layer 33 affects the resin substrate 21 independently of the resin substrate 21 of the wiring board 20. Implemented without. For this reason, it is possible to obtain the mounting substrate 40 having the reflection characteristics while suppressing the resin substrate 21 from being damaged.

  In the first modification and the second modification described above, the example in which the reflective layer 33 is formed on both surfaces of the base material 31 is shown. However, although not shown, the reflective layer 33 may be formed only on one side of the base material 31. When the reflective layers 33 are formed on both surfaces of the base material 31, the curing shrinkage of the reflective layer 33 that occurs on one surface of the base material 31 and the curing shrinkage of the reflective layer 33 that occurs on the other surface of the base material 31. Therefore, it is possible to suppress the base material 31 from being along. Accordingly, it can be said that the reflective layer 33 is preferably formed on both surfaces of the base material 31 in terms of preventing warpage.

(Modified example of manufacturing method of mounting substrate)
In the above-described embodiment, the example in which the reflective member 30 is attached to the wiring board 20 after the mounting process of mounting the light emitting component 41 on the wiring board 20 has been described, but the present invention is not limited thereto. As shown in FIG. 9, you may implement the reflective provision process which affixes the reflective member 30 to the wiring board 20 before a mounting process. Also in this case, the firing step when manufacturing the reflective member 30 can be performed independently of the resin substrate 21 of the wiring substrate 20 without affecting the resin substrate 21.

(Other variations)
Moreover, in the above-described embodiment, the example in which the long wiring substrate 20 and the long reflective member 30 are stacked on each other by the roll-to-roll method is shown, but the present invention is not limited to this. As long as the reflective characteristics can be imparted to the mounting substrate 40 by attaching the reflective member 30 to the wiring substrate 20 via the adhesive layer 35, there are various supply forms and storage forms of the wiring substrate 20 and the reflective member 30. Various forms can be adopted. For example, a method of attaching the reflective member 30 to the wiring substrate 20 divided in advance, a so-called single wafer method may be employed.

  In consideration of increasing the production efficiency, it is preferable to adopt a roll-to-roll method. On the other hand, in this case, when the elongated wiring board 20 is transported, tension is applied to the wiring board 20. Therefore, when the wiring board 20 is exposed to a high temperature in the baking process for a long time as in the prior art, it is considered that the wiring board 20 is likely to be deformed in combination with the tension. On the other hand, according to the above-described embodiment and modifications, the firing step is performed independently of the resin substrate 21 of the wiring substrate 20 without affecting the resin substrate 21. For this reason, even if it is a case where a roll toe roll system is employ | adopted, it can suppress that the wiring board 20 deform | transforms.

  In addition, although some modified examples with respect to the above-described embodiment have been described, naturally, a plurality of modified examples can be applied in combination as appropriate.

DESCRIPTION OF SYMBOLS 10 Manufacturing apparatus 11a 1st unwinding part 11b 2nd unwinding part 12 Lamination | stacking part 13 Application | coating part 14 Mounting part 16 Processing part 17 Chamber 19 Winding part 21 Resin substrate 22 Mounting electrode part 23 Wiring 24 Extraction electrode part 30 Reflective member 35 Adhesive layer 40 Mounting substrate 41 Light emitting component 42 Intermediate layer 50 Diffuser 55 Lighting device

Claims (13)

A mounting board on which light emitting components are mounted,
A wiring substrate including a flexible resin substrate, a mounting electrode portion provided on the resin substrate, and a wiring connected to the mounting electrode portion;
A light emitting component mounted on the mounting electrode,
A reflective member that reflects light and is provided on a surface of the wiring board on which the light emitting component is mounted;
The reflective member includes an opening formed at a position corresponding to the light emitting component,
A mounting substrate in which an adhesive layer is interposed between the wiring substrate and the reflective member.   The mounting substrate according to claim 1, wherein the adhesive layer is provided so as to at least partially cover the wiring.   The mounting board according to claim 1, wherein the reflective member includes a base material in which white pigments or bubbles are dispersed.   The mounting substrate according to claim 1, wherein the reflective member includes a base material and a reflective layer provided on the base material.   The mounting board according to claim 3, wherein a heat conductive filler is dispersed in the base material of the reflective member.   The mounting substrate according to claim 1, wherein the adhesive layer includes an anisotropic conductive adhesive having conductivity in a thickness direction of the adhesive layer. A method of manufacturing a mounting board on which a light emitting component is mounted,
Preparing a wiring board comprising: a flexible resin substrate; a mounting electrode portion provided on the resin substrate; and a wiring connected to the mounting electrode portion;
Mounting a light emitting component on the mounting electrode portion of the wiring board,
Before the mounting step, or after the mounting step, further comprising a reflection property imparting step of providing a reflective member that reflects light on the surface of the wiring board on the side where the light emitting component is mounted,
The manufacturing method of a mounting substrate, wherein the reflection property imparting step is performed by attaching a reflective member including an opening formed at a position corresponding to the light emitting component to the wiring substrate via an adhesive layer.   The method for manufacturing a mounting board according to claim 7, wherein the adhesive layer is provided so as to at least partially cover the wiring.   The method for manufacturing a mounting board according to claim 7, wherein the reflective member includes a base material in which white pigments or bubbles are dispersed.   The said reflective member is a manufacturing method of the mounting board | substrate of Claim 7 or 8 containing a base material and the reflective layer provided on the base material. The resin substrate includes a polyester resin, an epoxy resin, or a polyimide resin,
The thickness of the said resin substrate is a manufacturing method of the mounting substrate as described in any one of Claims 7 thru | or 10 which exists in the range of 10 micrometers-300 micrometers.   The mounting according to any one of claims 7 to 11, wherein, in the reflection property imparting step, the long wiring board and the long reflective member are laminated to each other by a roll-to-roll method. A method for manufacturing a substrate.   The method for manufacturing a mounting board according to claim 7, wherein the light emitting component includes a light emitting diode element.

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