JP2016001738A5 - - Google Patents

Download PDF

Info

Publication number
JP2016001738A5
JP2016001738A5 JP2015126714A JP2015126714A JP2016001738A5 JP 2016001738 A5 JP2016001738 A5 JP 2016001738A5 JP 2015126714 A JP2015126714 A JP 2015126714A JP 2015126714 A JP2015126714 A JP 2015126714A JP 2016001738 A5 JP2016001738 A5 JP 2016001738A5
Authority
JP
Japan
Prior art keywords
gallium nitride
standing substrate
free
single crystal
nitride free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015126714A
Other languages
Japanese (ja)
Other versions
JP2016001738A (en
Filing date
Publication date
Priority claimed from PCT/JP2014/064388 external-priority patent/WO2014192911A1/en
Application filed filed Critical
Priority to JP2015126714A priority Critical patent/JP2016001738A/en
Priority claimed from JP2015126714A external-priority patent/JP2016001738A/en
Publication of JP2016001738A publication Critical patent/JP2016001738A/en
Publication of JP2016001738A5 publication Critical patent/JP2016001738A5/ja
Pending legal-status Critical Current

Links

Claims (24)

略法線方向に単結晶構造を有する複数の窒化ガリウム系単結晶粒子で構成される板からなる窒化ガリウム自立基板であって、前記窒化ガリウム自立基板の表面に露出している前記窒化ガリウム系単結晶粒子の最表面における断面平均径Dに対する、前記窒化ガリウム自立基板の厚さTの比として規定されるアスペクト比T/Dが0.7以上である、窒化ガリウム自立基板。 A gallium nitride free-standing substrate comprising a plate composed of a plurality of gallium nitride-based single crystal particles having a single crystal structure in a substantially normal direction, the gallium nitride-based single substrate exposed on a surface of the gallium nitride free-standing substrate. for sectional average diameter D T of the outermost surface of the crystal grains, the thickness aspect ratio T / D T, which is defined as the ratio of T of the gallium nitride free-standing substrate is 0.7 or more, gallium freestanding substrate nitride. 前記基板の最表面における前記窒化ガリウム系単結晶粒子の断面平均径が0.3μm以上である、請求項1に記載の窒化ガリウム自立基板。   2. The gallium nitride free-standing substrate according to claim 1, wherein an average cross-sectional diameter of the gallium nitride-based single crystal particles on the outermost surface of the substrate is 0.3 μm or more. 前記断面平均径が3μm以上である、請求項2に記載の窒化ガリウム自立基板。   The gallium nitride free-standing substrate according to claim 2, wherein the average cross-sectional diameter is 3 μm or more. 前記断面平均径が20μm以上である、請求項2に記載の窒化ガリウム自立基板。   The gallium nitride free-standing substrate according to claim 2, wherein the cross-sectional average diameter is 20 µm or more. 20μm以上の厚さを有する、請求項1〜4のいずれか一項に記載の窒化ガリウム自立基板。   The gallium nitride free-standing substrate according to any one of claims 1 to 4, having a thickness of 20 µm or more. 直径100mm以上の大きさを有する、請求項1〜5のいずれか一項に記載の窒化ガリウム自立基板。   The gallium nitride free-standing substrate according to any one of claims 1 to 5, having a diameter of 100 mm or more. 前記窒化ガリウム系単結晶粒子が、略法線方向に概ね揃った結晶方位を有する、請求項1〜6のいずれか一項に記載の窒化ガリウム自立基板。   The gallium nitride free-standing substrate according to any one of claims 1 to 6, wherein the gallium nitride-based single crystal particles have a crystal orientation substantially aligned in a substantially normal direction. 前記窒化ガリウム系単結晶粒子がn型ドーパント又はp型ドーパントでドープされている、請求項1〜7のいずれか一項に記載の窒化ガリウム自立基板。   The gallium nitride free-standing substrate according to any one of claims 1 to 7, wherein the gallium nitride single crystal particles are doped with an n-type dopant or a p-type dopant. 前記窒化ガリウム系単結晶粒子がドーパントを含まない、請求項1〜7のいずれか一項に記載の窒化ガリウム自立基板。   The gallium nitride free-standing substrate according to any one of claims 1 to 7, wherein the gallium nitride-based single crystal particles do not contain a dopant. 前記窒化ガリウム系単結晶粒子が混晶化されている、請求項1〜9のいずれか一項に記載の窒化ガリウム自立基板。   The gallium nitride self-supporting substrate according to any one of claims 1 to 9, wherein the gallium nitride single crystal particles are mixed. 前記窒化ガリウム自立基板の表面に露出している前記窒化ガリウム系単結晶粒子が、該窒化ガリウム自立基板の裏面に粒界を介さずに連通してなる、請求項1〜10のいずれか一項に記載の窒化ガリウム自立基板。   The gallium nitride-based single crystal particles exposed on the surface of the gallium nitride free-standing substrate are communicated with the back surface of the gallium nitride free-standing substrate without a grain boundary. 2. A gallium nitride free-standing substrate according to 1. 前記アスペクト比T/Dが1.0以上である、請求項1〜11のいずれか一項に記載の窒化ガリウム自立基板。 The gallium nitride free-standing substrate according to any one of claims 1 to 11 , wherein the aspect ratio T / DT is 1.0 or more. 請求項1〜12のいずれか一項に記載の窒化ガリウム自立基板と、
該基板上に形成され、略法線方向に単結晶構造を有する複数の半導体単結晶粒子で構成される層を一以上有する発光機能層と、
を備えた、発光素子。
A gallium nitride free-standing substrate according to any one of claims 1 to 12 ,
A light emitting functional layer formed on the substrate and having at least one layer composed of a plurality of semiconductor single crystal particles having a single crystal structure in a substantially normal direction;
A light emitting device comprising:
前記発光機能層の最表面における前記半導体単結晶粒子の断面平均径が0.3μm以上である、請求項13に記載の自立した発光素子。 The self-supporting light-emitting element according to claim 13 , wherein an average cross-sectional diameter of the semiconductor single crystal particles on the outermost surface of the light-emitting functional layer is 0.3 μm or more. 前記断面平均径が3μm以上である、請求項14に記載の発光素子。 The light emitting device according to claim 14 , wherein the cross-sectional average diameter is 3 μm or more. 前記半導体単結晶粒子が、前記窒化ガリウム自立基板の結晶方位に概ね倣って成長した構造を有する、請求項13〜15のいずれか一項に記載の発光素子。 The light emitting device according to any one of claims 13 to 15 , wherein the semiconductor single crystal particles have a structure grown substantially following a crystal orientation of the gallium nitride free-standing substrate. 前記発光機能層が窒化ガリウム系材料で構成される、請求項13〜16のいずれか一項に記載の発光素子。 The light emitting element according to any one of claims 13 to 16 , wherein the light emitting functional layer is made of a gallium nitride-based material. 配向多結晶焼結体を用意する工程と、
前記配向多結晶焼結体上に、窒化ガリウムからなる種結晶層を、前記配向多結晶焼結体の結晶方位に概ね倣った結晶方位を有するように形成する工程と、
前記種結晶層上に、厚さ20μm以上の窒化ガリウム系結晶から構成される層を、前記種結晶層の結晶方位に概ね倣った結晶方位を有するように形成する工程と、
前記配向多結晶焼結体を除去して、窒化ガリウム自立基板を得る工程であって、前記窒化ガリウム自立基板の表面に露出している窒化ガリウム系単結晶粒子の最表面における断面平均径Dに対する、前記窒化ガリウム自立基板の厚さTの比として規定されるアスペクト比T/Dが0.7以上である工程と、
を含む、窒化ガリウム自立基板の製造方法。
Preparing an oriented polycrystalline sintered body;
Forming a seed crystal layer made of gallium nitride on the oriented polycrystalline sintered body so as to have a crystal orientation substantially following the crystal orientation of the oriented polycrystalline sintered body;
Forming a layer composed of a gallium nitride-based crystal having a thickness of 20 μm or more on the seed crystal layer so as to have a crystal orientation substantially following the crystal orientation of the seed crystal layer;
The step of removing the oriented polycrystalline sintered body to obtain a gallium nitride free-standing substrate, wherein the cross-sectional average diameter D T at the outermost surface of the gallium nitride-based single crystal particles exposed on the surface of the gallium nitride free-standing substrate for the steps aspect ratio T / D T, which is defined as the ratio of the thickness T of the GaN free-standing substrate is 0.7 or more,
A method for manufacturing a gallium nitride free-standing substrate.
前記配向多結晶焼結体が配向多結晶アルミナ焼結体である、請求項18に記載の方法。 The method according to claim 18 , wherein the oriented polycrystalline sintered body is an oriented polycrystalline alumina sintered body. 前記配向多結晶焼結体を構成する粒子の板面における平均粒径が0.3〜1000μmである、請求項18又は19に記載の方法。 The method according to claim 18 or 19 , wherein an average particle diameter on a plate surface of particles constituting the oriented polycrystalline sintered body is 0.3 to 1000 µm. 前記窒化ガリウム系結晶から構成される層の形成がNaフラックス法により行われる、請求項18〜20のいずれか一項に記載の方法。 21. The method according to any one of claims 18 to 20 , wherein the layer composed of the gallium nitride-based crystal is formed by a Na flux method. 前記配向多結晶焼結体が透光性を有する、請求項18〜21のいずれか一項に記載の方法。 The method according to any one of claims 18 to 21 , wherein the oriented polycrystalline sintered body has translucency. 請求項1〜12のいずれか一項に記載の窒化ガリウム自立基板を用意する、又は請求項18〜22のいずれか一項に記載の方法により前記窒化ガリウム自立基板を用意する工程と、
前記窒化ガリウム自立基板に、前記窒化ガリウム基板の結晶方位に概ね倣った結晶方位を有するように、略法線方向に単結晶構造を有する複数の半導体単結晶粒子で構成される層を一つ以上形成して発光機能層を設ける工程と、
を含む、発光素子の製造方法。
Preparing the gallium nitride free-standing substrate according to any one of claims 1 to 12 , or preparing the gallium nitride free-standing substrate by the method according to any one of claims 18 to 22 ;
The gallium nitride free-standing substrate includes at least one layer composed of a plurality of semiconductor single crystal particles having a single crystal structure in a substantially normal direction so as to have a crystal orientation that substantially follows the crystal orientation of the gallium nitride substrate. Forming and providing a light emitting functional layer;
A method for manufacturing a light emitting device, comprising:
前記発光機能層が窒化ガリウム系材料で構成される、請求項23に記載の方法。 The method according to claim 23 , wherein the light emitting functional layer is made of a gallium nitride-based material.
JP2015126714A 2013-12-18 2015-06-24 Gallium nitride self-supporting substrate, light-emitting element and manufacturing method therefor Pending JP2016001738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015126714A JP2016001738A (en) 2013-12-18 2015-06-24 Gallium nitride self-supporting substrate, light-emitting element and manufacturing method therefor

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2013260868 2013-12-18
JP2013260868 2013-12-18
JP2014071342 2014-03-31
JP2014071342 2014-03-31
WOPCT/JP2014/064388 2014-05-30
PCT/JP2014/064388 WO2014192911A1 (en) 2013-05-31 2014-05-30 Free-standing gallium nitride substrate, light emitting element, method for producing free-standing gallium nitride substrate, and method for manufacturing light emitting element
JP2015126714A JP2016001738A (en) 2013-12-18 2015-06-24 Gallium nitride self-supporting substrate, light-emitting element and manufacturing method therefor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2014199217A Division JP5770905B1 (en) 2013-12-18 2014-09-29 Gallium nitride free-standing substrate, light emitting device, and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JP2016001738A JP2016001738A (en) 2016-01-07
JP2016001738A5 true JP2016001738A5 (en) 2017-10-26

Family

ID=54187194

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014199217A Active JP5770905B1 (en) 2013-12-18 2014-09-29 Gallium nitride free-standing substrate, light emitting device, and manufacturing method thereof
JP2015126714A Pending JP2016001738A (en) 2013-12-18 2015-06-24 Gallium nitride self-supporting substrate, light-emitting element and manufacturing method therefor

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2014199217A Active JP5770905B1 (en) 2013-12-18 2014-09-29 Gallium nitride free-standing substrate, light emitting device, and manufacturing method thereof

Country Status (2)

Country Link
JP (2) JP5770905B1 (en)
TW (2) TWI662163B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105830237B (en) * 2013-12-18 2019-09-06 日本碍子株式会社 Light-emitting component composite substrate and its manufacturing method
WO2016121853A1 (en) 2015-01-29 2016-08-04 日本碍子株式会社 Free-standing substrate, function element and method for producing same
WO2017057272A1 (en) * 2015-09-30 2017-04-06 日本碍子株式会社 Oriented alumina substrate for epitaxial growth
JP6684815B2 (en) 2015-09-30 2020-04-22 日本碍子株式会社 Oriented alumina substrate for epitaxial growth
WO2017086026A1 (en) 2015-11-16 2017-05-26 日本碍子株式会社 Production process for oriented sintered object
JP6648253B2 (en) * 2016-02-25 2020-02-14 日本碍子株式会社 Polycrystalline gallium nitride free-standing substrate and light emitting device using the same
JP6688109B2 (en) * 2016-02-25 2020-04-28 日本碍子株式会社 Surface emitting device, external cavity type vertical surface emitting laser, and method for manufacturing surface emitting device
JP6812413B2 (en) * 2016-03-29 2021-01-13 日本碍子株式会社 Free-standing substrate and laminate
JP6639317B2 (en) * 2016-04-21 2020-02-05 日本碍子株式会社 Method for producing group 13 element nitride crystal and seed crystal substrate
JP6846913B2 (en) * 2016-11-11 2021-03-24 日本碍子株式会社 Method for manufacturing wide-wavelength light-emitting device and wide-wavelength light-emitting device
TWI621249B (en) * 2017-03-27 2018-04-11 英屬開曼群島商錼創科技股份有限公司 Micro light emitting diode and display panel
TWI632673B (en) * 2017-07-11 2018-08-11 錼創科技股份有限公司 Micro light-emitting device and display apparatus
CN111052415B (en) 2017-08-24 2023-02-28 日本碍子株式会社 Group 13 element nitride layer, free-standing substrate, and functional element
US11309455B2 (en) 2017-08-24 2022-04-19 Ngk Insulators, Ltd. Group 13 element nitride layer, free-standing substrate and functional element
DE112017007796B4 (en) 2017-08-24 2023-09-14 Ngk Insulators, Ltd. Layers of a crystal of a nitride of a Group 13 element, self-supporting substrates, functional devices and composite substrates
JP6857247B2 (en) 2017-08-24 2021-04-14 日本碍子株式会社 Group 13 element nitride layer, self-supporting substrate and functional element
JP7185123B2 (en) * 2017-12-26 2022-12-07 日亜化学工業株式会社 Optical member and light emitting device
JP7147644B2 (en) * 2019-03-18 2022-10-05 豊田合成株式会社 Method for manufacturing group III nitride semiconductor
CN111607825A (en) * 2020-06-02 2020-09-01 无锡吴越半导体有限公司 Substrate, self-supporting GaN single crystal based on substrate and preparation method of self-supporting GaN single crystal
CN116364819B (en) * 2023-05-31 2023-12-15 江西兆驰半导体有限公司 LED epitaxial wafer, preparation method thereof and LED

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3410863B2 (en) * 1995-07-12 2003-05-26 株式会社東芝 Compound semiconductor device and compound semiconductor light emitting device
JP3864870B2 (en) * 2001-09-19 2007-01-10 住友電気工業株式会社 Single crystal gallium nitride substrate, growth method thereof, and manufacturing method thereof
US7221037B2 (en) * 2003-01-20 2007-05-22 Matsushita Electric Industrial Co., Ltd. Method of manufacturing group III nitride substrate and semiconductor device
JP2004359495A (en) * 2003-06-04 2004-12-24 Ngk Insulators Ltd Alumina substrate for epitaxial film
JP4341702B2 (en) * 2007-06-21 2009-10-07 住友電気工業株式会社 Group III nitride semiconductor light emitting device
JP4981602B2 (en) * 2007-09-25 2012-07-25 パナソニック株式会社 Method for manufacturing gallium nitride substrate
JP2009091175A (en) * 2007-10-04 2009-04-30 Sumitomo Electric Ind Ltd GaN (GALLIUM NITRIDE) EPITAXIAL SUBSTRATE, SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING GaN EPITAXIAL SUBSTRATE AND SEMICONDUCTOR DEVICE
US9012253B2 (en) * 2009-12-16 2015-04-21 Micron Technology, Inc. Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods

Similar Documents

Publication Publication Date Title
JP2016001738A5 (en)
JP5105621B2 (en) Method for forming an InGaAlN film and a light emitting device on a silicon substrate
JP2012142629A5 (en)
JP2016100593A5 (en)
WO2012059862A3 (en) Light emitting device with improved extraction efficiency
JP2016518713A5 (en)
TW201003995A (en) LEDs using single crystalline phosphor and methods of fabricating same
KR102319284B1 (en) Light-emitting element and method for manufacturing light-emitting element
JP2007273659A5 (en)
JP2007281257A5 (en)
JP2013517622A5 (en)
TWI380478B (en) Light-emitting diode with non-metallic reflector
US9972748B2 (en) Thin-film semiconductor body with electronmagnetic radiation outcoupling structures
JP2008042143A5 (en)
JP2016508294A5 (en)
JP2014189422A5 (en)
JP2015511407A5 (en)
CN106653968A (en) III-V nitride growth-used composite substrate, device structure and preparation method
CN102339798B (en) Composite substrate, gallium nitride-based element and method for manufacturing same
JP4483736B2 (en) Semiconductor light emitting element, lighting device using the same, and method for manufacturing semiconductor light emitting element
CN105762266A (en) Light-emitting diode having heat conducting layer and preparation method thereof
WO2017145802A1 (en) Polycrystalline gallium nitride self-supported substrate and light emitting element using same
CN104241476B (en) Light emitting device and its manufacturing method
US9947830B2 (en) Patterned sapphire substrate and light emitting diode
EP2492951A3 (en) Nitride based light emitting device using silicon substrate and method of manufacturing the same