JP7185123B2 - Optical member and light emitting device - Google Patents

Description

The present disclosure relates to optical members and light emitting devices.

2. Description of the Related Art Conventionally, a light emitting device using a laser element is known. In such a light-emitting device, by forming a conductive thin wire or an electric path on the back surface of the phosphor plate where the laser beam hits, damage or the like of the phosphor plate can be detected and leakage of the laser beam can be prevented (for example, , see Patent Documents 1 to 4).

JP 2015-60159 A JP 2014-165450 A JP 2016-122715 A International Publication No. 2017/012763

In the conventional light-emitting device described above, damage to the phosphor plate is detected by disconnection of the conductive thin wire or interruption of the current path due to damage such as falling off of the phosphor plate. However, in such a light-emitting device, minor damage such as cracking or breakage of the phosphor plate does not cause breakage of the conductive fine wires or interrupting of the current-carrying circuit, so damage to the phosphor plate cannot be detected. Therefore, there is a problem that the leakage prevention of laser light is insufficient.

Accordingly, an object of the embodiments of the present disclosure is to provide an optical member and a light-emitting device using the optical member that can more accurately detect an abnormality leading to leakage of laser light.

In order to solve the above problems, an optical member according to an embodiment of the present disclosure includes a conversion member capable of converting laser light, which is excitation light, into light of a different wavelength, and a light irradiation surface and a light extraction surface of the conversion member. Alternatively, a conductive thin wire disposed so as to intersect in plan view on at least one of the light irradiation surface and the light extraction surface, and a pattern connection electrode electrically connected to the conductive thin wire and an optical member.

Further, a light-emitting device according to an embodiment of the present disclosure includes the optical member and a laser element arranged to irradiate the light irradiation surface of the conversion member with laser light.

According to the optical member and the light emitting device according to the embodiments of the present disclosure, it is possible to more accurately detect an abnormality leading to leakage of laser light.

2 is a plan view showing the configuration of the optical member according to the first embodiment; FIG. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1; 1 is a plan view showing the configuration of a light-emitting device using an optical member according to a first embodiment; FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3; FIG. FIG. 5 is a cross-sectional view showing the configuration of an optical member according to a second embodiment; FIG. 10 is a plan view showing the configuration of a light-emitting device using an optical member according to a second embodiment; FIG. 7 is a cross-sectional view taken along line VII-VII of FIG. 6; FIG. 4 is a plan view showing a configuration of a modified example of the shape of the conductive fine wire of the optical member according to the first embodiment; FIG. 4 is a plan view showing a configuration of a modified example of the shape of the conductive fine wire of the optical member according to the first embodiment; FIG. 4 is a plan view showing a configuration of a modified example of the shape of the conductive fine wire of the optical member according to the first embodiment; FIG. 5 is a cross-sectional view showing a configuration of a modified example of arrangement positions of conductive thin wires of the optical member according to the first embodiment; FIG. 5 is a cross-sectional view showing a configuration of a modified example of arrangement positions of conductive thin wires of the optical member according to the first embodiment; FIG. 5 is a plan view showing a configuration of a modification of the arrangement position of the conductive thin wires of the optical member according to the first embodiment; FIG. 11B is a cross-sectional view taken along line XIB-XIB of FIG. 11A; FIG. 5 is a plan view showing a configuration of a modification of the arrangement position of the conductive thin wires of the optical member according to the first embodiment; FIG. 12B is a cross-sectional view taken along line XIIB-XIIB of FIG. 12A; FIG. 10 is a cross-sectional view showing a configuration of a modified example of the arrangement position of the conductive thin wires of the optical member according to the second embodiment; FIG. 10 is a cross-sectional view showing a configuration of a modified example of the arrangement position of the conductive thin wires of the optical member according to the second embodiment; FIG. 10 is a cross-sectional view showing a configuration of a modified example of the arrangement position of the conductive thin wires of the optical member according to the second embodiment;

Embodiments of the present disclosure are described below with reference to the drawings. However, the forms shown below are examples of the optical member and the light-emitting device for embodying the technical idea of the present embodiment, and are not limited to the following. In addition, unless there is a specific description, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention, but are merely illustrative examples. It's nothing more than Note that the sizes, positional relationships, etc. of members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same names and symbols indicate the same or homogeneous members, and detailed description thereof will be omitted as appropriate.

[First embodiment]
An optical member and a light-emitting device optical member according to the first embodiment will be described.
As shown in FIGS. 1 to 4, the optical member 100A includes a conversion member 2, conductive thin wires 4A arranged on the light extraction surface 2a of the conversion member 2, and pattern connection electrodes 5. FIG. Moreover, it is preferable that the optical member 100</b>A includes a conductor portion 11 . Also, the optical member 100A may include a heat dissipation member 9 .
The light emitting device 200A preferably includes an optical member 100A, a laser element 25, and a package 21. As shown in FIG. Note that the light emitting device 200A can include a detection circuit.
Each component of the optical member 100A and the light emitting device 200A will be described below.

<Optical member>
(conversion member)
As an example, the conversion member 2 is formed in a rectangular parallelepiped shape, and has a surface that serves as the light extraction surface 2a on one side of the rectangular parallelepiped shape. The conversion member 2 is a member capable of converting laser light, which is excitation light, into light of a different wavelength. Laser light is emitted from the laser element 25 . The conversion member 2 has a back surface opposite to the light extraction surface 2a as a light irradiation surface 2b on which laser light from the laser element 25 is incident.

The conversion member 2 is preferably made of an inorganic material so as not to be easily decomposed by laser light irradiation. Examples of the conversion member 2 made of an inorganic material include ceramics or glass containing a phosphor capable of wavelength-converting laser light, and a single crystal of the phosphor. Moreover, the conversion member 2 is preferably made of a material having a high melting point, and preferably has a melting point of 1300 to 2500.degree. Since the conversion member 2 is formed of such a material with good light resistance and heat resistance, it is held by the holding member 3 without being deteriorated even when it is irradiated with high-density light such as laser light. Deformation, discoloration, etc., are less likely to occur due to heat at the time. Therefore, the conversion member 2 is preferably made of a material having good light resistance and heat resistance.

When a phosphor is used as the conversion member 2, cerium-activated yttrium aluminum garnet (YAG), cerium-activated lutetium aluminum garnet (LAG), europium and/or chromium-activated nitrogen-containing Calcium aluminosilicate (CaO—Al ₂ O ₃ —SiO ₂ ), europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ), α-sialon phosphor, β-sialon phosphor, and the like. As the phosphor, it is preferable to use YAG, which is a phosphor with good heat resistance.

When ceramics are used as the conversion member 2, a material obtained by sintering a phosphor and a translucent material such as aluminum oxide (Al ₂ O ₃ , melting point: about 1900° C. to 2100° C.) may be used. In this case, the content of the phosphor is preferably 0.05 to 50% by volume, more preferably 1 to 30% by volume, relative to the total volume of the ceramics. Alternatively, the conversion member 2 may be made of ceramics substantially composed of only the phosphor, which is formed by sintering the powder of the phosphor without using such a translucent material.

(Conductive fine wire, electrode for pattern connection)
The conductive thin wires 4A are linear bodies arranged so as to abut on the light extraction surface 2a of the conversion member 2 and cross each other in plan view. Specifically, the conductive thin wires 4A are provided in a grid shape in which a plurality of straight thin wires 4a intersect in a grid pattern. Further, the thin conductive wires 4A are connected at both ends thereof to pattern connection electrodes 5 for conducting electricity. As a result, the conductive thin wire 4A is electrically connected to the pattern connection electrode 5. As shown in FIG.

Since the conductive fine wires 4A crossing each other in a plan view are arranged on the light extraction surface 2a of the conversion member 2, not only overall damage such as falling off of the conversion member 2 but also minor cracks and breakage of the conversion member 2 can occur. Such partial damage can be detected by breaking the conductive thin wire 4A. Here, the breakage of the thin conductive wire 4A includes not only disconnection of the thin conductive wire 4A but also chipping, thinning, and the like. That is, the conductive fine wire 4A changes its resistance value due to chipping, thinning, etc., and changes its voltage value. In the present embodiment, partial breakage of the conversion member 2 can be detected, so an abnormality leading to leakage of laser light can be detected with higher accuracy. It is preferable that the thin conductive wire 4A is provided up to a portion close to the periphery of the light extraction surface 2a. As a result, it is possible to detect an abnormality leading to leakage of laser light with higher accuracy.

The lattice-shaped conductive thin wires 4A are arranged at positions where the laser light from the laser element 25 is irradiated. The rectangular opening S surrounded by the four intersections P preferably has an area smaller than the area of the laser beam irradiation region. The area of the opening S is preferably 5 to 90% of the area of the laser beam irradiation region. When the aperture S is 5% or more, it is possible to reduce uneven brightness. If the opening S is 90% or less, the breakage of the conversion member 2 can be detected with higher accuracy. For more accurate detection, the area of the opening S is preferably 25% or less of the area of the laser beam irradiation area. The area of the opening S can be, for example, 0.02-0.36 mm ² . In this specification, the irradiation region of the laser light refers to the region irradiated with the main part of the laser light when it is assumed that the conversion member 2 does not cause scattering. Further, the main portion of the laser beam refers to the portion of the intensity range from the peak intensity value of the laser beam to when the intensity drops to an arbitrary intensity such as 1/e ₂ .

The conductive thin wire 4A is made of a conductive material generally used as a wiring material for the light emitting device 200A, and preferably made of a metal material such as tungsten, molybdenum, silver, or aluminum. 4 A of electroconductive thin wires are suitably selected according to the structural material of the conversion member 2 arrange|positioned. Specifically, when high-temperature-fired ceramics are used for the conversion member 2, tungsten, molybdenum, etc., which are high-melting-point metals, are used as the thin conductive wires 4A. When low-temperature-fired ceramics, glass, or resin is used for the conversion member 2, a low-melting-point metal such as silver or aluminum is used as the conductive fine wire 4A. Also, the pattern connection electrodes 5 electrically connected at both ends of the conductive thin wire 4A can be selected from the same conductive material as the conductive thin wire 4A.

The width of the conductive thin wire 4A is preferably 0.2 to 5.0 μm. When the width of the conductive thin wire 4A is 0.2 μm or more, it is possible to prevent the conductive thin wire 4A from being damaged such as disconnection due to an unintentional external force. As a result, erroneous detection of breakage of the conversion member 2 can be prevented. When the width of the conductive thin wire 4A is 5.0 μm or less, uneven brightness of light extracted from the conversion member 2 can be suppressed.
The conductive thin wire 4A is applied over the entire light extraction surface 2a of the conversion member 2 so that not only overall damage such as detachment of the conversion member 2 but also partial damage such as minor cracks and breaks can be detected. preferably in contact.

(conductor part)
The conductor part 11 is for conducting electricity to the conductive fine wire 4A, is formed through the conversion member 2, and faces the one pattern connection electrode 5 and the other pattern connection electrode 5. It is formed in a position where One end of the conductor portion 11 is connected to the bump 12, and the other end is connected to the pattern connection electrodes 5 connected to both ends of the conductive thin wire 4A. The conductor portion 11 can be made of a conductive material such as tungsten, molybdenum, gold, silver, tin, aluminum, or the like. Moreover, the shape of the conductor part 11 can be made into rod shape, for example. Also, the bumps 12 are made of an electrode material such as gold, silver, or copper. The shape of the bump 12 can be, for example, hemispherical.

(Heat dissipation member)
The heat dissipation member 9 is arranged on the side facing the light irradiation surface 2b of the conversion member 2 and is a translucent member that transmits the laser light from the laser element 25 . The heat dissipation member 9 is formed to have an area larger than that of the conversion member 2 in plan view, and is preferably made of sapphire. By providing the heat radiation member 9, the heat from the conversion member 2 can be efficiently radiated. The thickness of the heat radiating member 9 is, for example, 0.2 to 1 mm, preferably 0.4 to 0.6 mm.

(substrate pattern)
In the optical member 100</b>A, the substrate pattern 6 formed on the surface of the heat dissipation member 9 is used for joining the heat dissipation member 9 and the conversion member 2 . The substrate pattern 6 is connected to the bumps 12 formed on the conversion member 2 to connect the heat dissipation member 9 and the conversion member 2, and is connected to an external power source to provide conductivity through the bumps 12 and the conductor portion 11. It has a role of energizing the thin wire 4A. The substrate pattern 6 is preferably made of an electrode material such as gold, silver, copper, or the like. The thickness of the substrate pattern 6 can be, for example, 0.1 to 5 μm.
Since the optical member 100A having the configuration described above has the conductive thin wires 4A, it is possible to more accurately detect an abnormality leading to leakage of laser light.

<Light emitting device>
200 A of light-emitting devices install the optical member 100A provided with the above-mentioned structure in the package 21, convert the laser beam from the laser element 25 provided in the package 21, and irradiate light. The light emitting device 200A mainly includes a laser element 25 for irradiating the optical member 100A with laser light, a package 21 having a recess 27 for housing the laser element 25, and a lid 24 for the recess 27 of the package 21. FIG. Note that the light emitting device 200A will be described here by including a detection circuit.

(laser element)
The laser element 25 is an element arranged to irradiate the conversion member 2 with laser light. The shorter the wavelength of the emitted laser light, the higher the energy of the laser element 25, and the more detection of leakage of the laser light is required. . As such a laser element, there is a semiconductor laser element made of a nitride semiconductor. The laser element 25 can also include a configuration for irradiating the conversion member 2 with laser light in the optical path, such as a reflecting member 26 .
Here, as the reflecting member 26, a member in which a reflecting film is provided on an inclined surface of a body portion made of glass or the like having a shape such as a triangular prism or a truncated quadrangular pyramid can be used. The angle of the slope with respect to the bottom surface of the main body is preferably approximately 45 degrees in order to guide the laser light in the orthogonal direction.

(package)
Package 21 surrounds laser element 25 . The package 21 is a storage body that has storage portions such as recesses 27 and stores the laser element 25 and the reflecting member 26 in the storage portions. The package 21 mainly includes a housing main body 22 made of ceramics such as aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, or a metal such as Cu, and a lid 24 joined to the housing main body 22 by welding or the like. I have. The storage main body 22 can have a recess 27 with an open upper surface. A frame-shaped welding portion 23 containing iron as a main component may be provided on the periphery of the opening of the recess to be welded to the lid portion 24 . The storage main body 22 is formed such that at least one of the four upper surfaces that are continuous with the opening of the recess 27 is wider than the other surfaces, and the electrode section 28 is arranged. The electrode section 28 may have an anode and a cathode arranged at positions sandwiching the optical member 1A in plan view. Moreover, when the housing main body part 22 is made of metal, for example, a lead terminal is used as the electrode part 28 .

The lid portion 24 hermetically seals the laser element 25 by being joined to the storage body portion 22 by welding or the like. As a result, adhesion of dust such as organic matter to the laser element 25 can be suppressed. The lid portion 24 may have a support portion 24a that is welded to the storage body portion 22, a light transmitting portion 24b that transmits laser light, and a bonding material 24c that joins the support portion 24a and the light transmitting portion 24b. can. A material containing iron as a main component can be used for the support portion 24a. Glass, sapphire, or the like can be used for the transparent portion 24b. Low-melting glass, gold-tin solder, or the like can be used as the bonding material 24c. The laser light emitted from the laser element 25 is reflected by the reflecting member 26, passes through the translucent portion 24b and the heat radiating member 9, and is irradiated onto the light irradiation surface 2b of the conversion member 2. FIG.

By providing the electrode portion 28 electrically connected to the outside on a surface other than the lower surface of the housing body portion 22, the package 21 can use the entire lower surface of the package 21 as a surface to be mounted on another member such as a heat sink. can. Therefore, the package 21 easily dissipates the heat generated by the light emitting device 200A to the heat sink.

(detection circuit)
The detection circuit is a circuit that detects a change in resistance value caused by breakage of the conductive thin wire 4A. In the light-emitting device 200A, it is a circuit connected to the conducting circuit of the conductive thin wire 4A and the laser element 25. FIG. By providing such a detection circuit, breakage of the conversion member 2 can be detected by a change in resistance value caused by the breakage of the thin conductive wire 4A. Then, when a change in the resistance value of the conductive thin wire 4A is detected, it is determined that the conversion member 2 has been damaged, and the drive of the laser element 25 is stopped, thereby preventing leakage of laser light. .

In the light emitting device 200A, the optical member 100A is preferably fixed to the package 21 so that the laser light that has passed through the light transmitting portion 24b and the heat dissipation member 9 from the concave portion 27 reaches the conversion member 2. Specifically, grid-like conductive thin wires 4A are arranged on the light extraction surface 2a of the conversion member 2 so as to cross each other in plan view. With such an arrangement, damage to the conversion member 2 caused by the thin conductive wires 4A can be detected with high accuracy.
In the light emitting device 200A, a bonding layer made of a metal material such as gold, tin, or silver can be used to fix the optical member 100A to the package 21, for example.

100 A of optical members and 200 A of light-emitting devices can be manufactured with the following manufacturing methods, for example.
(1) Converting member manufacturing process The converting member 2 is manufactured by sintering the powder material to be the converting member 2 . As the sintering method, for example, a discharge plasma sintering method (SPS method: spark plasma sintering method) or a hot press sintering method (HP method: hot pressing method) can be used.

(2) Step of Forming Conductor Portion After manufacturing the conversion member 2, a through-hole is formed to extend from the light extraction surface 2a of the conversion member 2 to the light irradiation surface 2b. Next, the through hole is filled with the conductor portion 11, and the bump 12 is formed at the end portion of the filled conductor portion 11 on the light irradiation surface side.

(3) Arrangement process of conductive thin wires After forming the bumps 12, the conductive thin wires 4A and the pattern connection electrodes 5 connected to both ends thereof are formed on the light extraction surface 2a of the conversion member 2 to form the optical member. 100A.
Here, the conductive thin wire 4A and the pattern connection electrode 5 are formed at positions where the pattern connection electrode 5 and the end of the conductor portion 11 are electrically connected. As a method for forming the conductive fine wires 4A and the pattern connection electrodes 5, a sputtering method, a vacuum deposition method, an ion plating method, a chemical vapor deposition method, a coating method, a printing method, or the like can be used. As a method for forming the conductive thin wire 4A, the method described in Japanese Patent Application Laid-Open No. 2016-004544 can be used.

(4) Heat Dissipating Member Bonding Process In the optical member 100A, after forming the conductive thin wires 4A and the pattern connection electrodes 5, the heat dissipating member 9 having the substrate pattern 6 formed on the surface thereof by photolithography, etching, or the like is prepared. , the heat dissipation member 9 is joined to the conversion member 2 via the substrate pattern 6 and the bumps 12 .

(5) The light emitting device 200A includes a package 21 having a heat dissipation member 9 provided with a substrate pattern 6, a laser element 25 and a reflecting member 26 for guiding laser light in a predetermined direction in a concave portion 27, and a lid portion 24 attached. , and the optical member 100A described above are respectively prepared and joined.
200 A of light-emitting devices are formed by joining the heat dissipation member 9 which 100 A of optical members were previously joined to the support part 24a of the cover part 24 attached to the package 21. FIG.
For example, the package 21 has the laser element 25 and the reflecting member 26 installed in the recess 27 , and then the support portion 24 a of the lid portion 24 is joined to the welding portion 23 provided around the opening of the recess 27 . Then, the light emitting device 200A is formed by joining the heat dissipation member 9 to which the optical member 100A is joined to the supporting portion 24a.

[Second embodiment]
Next, an optical member and a light emitting device according to the second embodiment will be described.
As shown in FIGS. 5 to 7, the optical member 150A includes the conversion member 2, the holding member 3, and the conductive thin wires 4A arranged on the light extraction surface 2a of the conversion member 2. FIG. In addition, the optical member 150A can include the pattern connection electrodes 5 and a heat dissipation member.
The light emitting device 200B includes an optical member 150A and a laser element 25. As shown in FIG. The light emitting device 200B can further include a package 21. As shown in FIG. Note that the light emitting device 200B preferably includes a detection circuit.
Each component of the optical member 150A and the light emitting device 200B will be described below. Except that the optical member 150A is provided via the holding member 3, it is the same as the optical member 100A and the light emitting device 200A shown in FIGS.

<Optical member>
150 A of optical members are provided with the holding member 3 which hold|maintains the conversion member 2. FIG. Further, since the optical member 150A includes the holding member 3, the pattern connection electrodes 5 for energizing the thin conductive wires 4A can be arranged on the surface 3a of the holding member 3 on the light extraction surface side. Therefore, in 150 A of optical members, it is not necessary to provide the conductor part 11 (refer FIG. 2) for electricity supply to the conversion member 2. FIG. Furthermore, in the optical member 150A, since the substrate pattern 6 can be connected to the pattern connection electrode 5 arranged on the light extraction surface side for energization, energization of the conductive fine wires 4A is facilitated. The pattern connection electrode 5 and the substrate pattern 6 are connected by lamination or by bonding wires. Alternatively, the thin conductive wire 4A may be directly connected to the substrate pattern 6. FIG.

(Holding member)
The holding member 3 is a member that holds the conversion member 2 and has a front surface 3a and a back surface 3c that are continuous on the same plane as the light extraction surface 2a and the light irradiation surface 2b of the conversion member 2 . The conversion member 2 is held so that the light extraction surface 2 a and the light irradiation surface 2 b are exposed from the holding member 3 . The holding member 3 has a through hole 3b penetrating in the thickness direction thereof, and holds the converting member 2 by being connected together with the converting member 2 while being inserted into the through hole 3b. The shape of the through-hole 3b preferably corresponds to the shape of the conversion member 2. For example, it can be a columnar shape, a conical shape, a truncated cone, a truncated pyramid, or a combination thereof. In addition to polygonal shapes such as squares, circular or elliptical shapes are also possible.

Considering strength, the thickness of the holding member 3 is preferably 0.2 mm or more. Moreover, the thickness of the holding member 3 may be a thickness that can hold the conversion member 2, and is preferably 2.0 mm or less in order to suppress an increase in cost and an increase in the height of the optical member 150A.

The holding member 3 may be made of a material that reflects the laser light and the fluorescence emitted by the phosphor with high reflectance, and that is made of a material with a high thermal conductivity that exhausts the heat of the conversion member 2 held in the through hole 3b. preferable. High reflectance and high thermal conductivity materials include light reflective ceramics, metals, or composites of ceramics and metals. It is preferable to use a light-reflective ceramic that can easily obtain a high reflectance. Alumina (Al ₂ O ₃ ) ceramics are preferably used as the light-reflective ceramics. By using a material with a high reflectance for the holding member 3, the light in the conversion member 2 can be extracted mainly from the light extraction surface 2a, so that the brightness can be increased. In addition, it is possible to prevent the laser beam irradiated to other than the conversion member 2 from leaking to the outside.

In the optical member 150A, for example, a bonding layer made of a metal material such as gold, tin, or silver can be used for bonding the holding member 3 and the heat radiating member.
In the optical member 150A, since the grid-like conductive thin wires 4A are formed on the light extraction surface 2a of the conversion member 2, the breakage of the conversion member 2 can be detected by the breakage of the conductive thin wires 4A. As a result, it is possible to more accurately detect an abnormality leading to leakage of laser light.

<Light emitting device>
As shown in FIGS. 6 and 7, the light emitting device 200B is the same as the light emitting device 200A of the first embodiment (see FIGS. 3 and 4) except that an optical member 150A is used instead of the optical member 100A. Similar to device 200A. The light-emitting device 200B having such a configuration can easily connect the conductive fine wires 4A to external electrodes or circuits by using the optical member 150A.

150 A of optical members and the light-emitting device 200B can be manufactured with the following manufacturing methods, for example.
(1) Converting member manufacturing process The converting member 2 is manufactured by sintering the powder material to be the converting member 2 using the SPS method or the HP method.
(2) Step of arranging holding member After manufacturing the converting member 2, a molded body to be the holding member 3 is produced on the outside of the converting member 2 by using a slip casting method or the like.
(3) Step of Sintering Converting Member and Holding Member After producing the compact, a composite of the sintered converting member 2 and the compact to be the holding member 3 is sintered using the SPS method or the HP method.
(4) Conductive Thin Wire Arranging Step After sintering the composite, the conductive thin wire 4A is arranged on the light extraction surface 2a of the conversion member 2 . At the same time, the pattern connection electrodes 5 connected to both ends of the thin conductive wires 4A are arranged on the holding member side surface 3a in the vicinity of the boundary between the converting member 2 and the holding member 3 to form an optical member 150A.

(5) The optical member 150A is prepared by joining the holding member 3 to the heat dissipation member, and by joining the lid portion 24 to the package 21 in which the laser element 25 and the reflecting member 26 are provided in the concave portion 27 already described. . Then, the light emitting device 200B is formed by joining the heat dissipation member to the lid portion 24 . Further, the light emitting device 200B may be one in which the holding member 3 of the optical member 150A is joined to the lid portion 24 without using a heat dissipation member.

[Modified example of each embodiment]
Next, modified examples of the configuration according to each embodiment will be described with reference to FIGS. 8A to 14B.
<Optical member according to the first embodiment>
(Modified example of shape of conductive fine wire)
As shown in FIG. 8A, an optical member 100B, which is a modification of the optical member 100A according to the first embodiment, is the same as the optical member 100A except that conductive thin wires 4B are arranged instead of the conductive thin wires 4A. be. The conductive thin wires 4B have a lattice shape in which the straight thin wires 4a intersect in a grid shape in a plan view. The thin conductive wire 4B has a diamond-shaped opening S surrounded by four intersections P. As shown in FIG. It is preferable that the area of the opening S is 5 to 90% of the area of the irradiated image of the laser beam irradiated to the conductive fine wire 4B.
Although the opening S is surrounded by four intersections P, a triangular opening surrounded by three intersections and a polygonal opening surrounded by five or more intersections are used. There may be. Even in that case, the area of the opening is preferably in the same range as described above.

In the optical member 100B, the conductive thin wires 4B, like the conductive thin wires 4A, uniformly cover the entire light extraction surface 2a of the conversion member 2 with the linear thin wires 4a. Well detectable.

Next, as shown in FIG. 8B, an optical member 100C, which is a modification of the optical member 100A according to the first embodiment, has the optical member 100A except that the conductive thin wires 4C are arranged instead of the conductive thin wires 4A. is similar to The conductive thin wire 4C includes a large-diameter first circumferential thin wire 4b, a second circumferential thin wire 4c having a smaller diameter than the first circumferential thin wire 4b, a first circumferential thin wire 4b and a second circular thin wire 4b. and connecting thin wires 4 d for electrically connecting each of the circumferential thin wires 4 c to the pattern connecting electrode 5 . In the conductive thin wire 4C, the first circular thin wire 4b and the connecting thin wire 4d intersect at an intersection point P in a plan view, and the second circumferential thin wire 4c and the connecting thin wire 4d arranged in the same circle form an intersection point. crossed at P.
It is preferable that the second circumferential thin wire 4c of the conductive thin wire 4C is not arranged in the irradiation area irradiated with the laser light from the laser element 25 (see FIG. 3) in plan view. Specifically, it is preferable that the contact position of the second circumferential thin wire 4c on the conversion member 2 is arranged outside the irradiation area of the laser light.
By arranging the conductive thin wires 4C, the optical member 100C can detect the breakage of the conversion member 2 with higher accuracy. Increased light output.

Next, as shown in FIG. 8C, an optical member 100D, which is a modification of the optical member 100A according to the first embodiment, has the optical member 100A except that the conductive thin wires 4D are arranged instead of the conductive thin wires 4A. is similar to The conductive thin wire 4D uses a rectangular thin wire 4e instead of the first circumferential thin wire 4b of the conductive thin wire 4C. In the conductive thin wire 4D, the rectangular thin wire 4e and the connecting thin wire 4d intersect at the intersection P, and the second circular thin wire 4c and the connecting thin wire 4d intersect at the intersection P in plan view.
In the optical member 100D, by arranging the conductive thin wires 4D having the second circumferential thin wires 4c and the rectangular thin wires 4e of different shapes, even if the damage of the conversion member 2, which is difficult to detect with one of the thin wire shapes, , and the other thin wire shape, so that the breakage of the conversion member 2 can be detected with higher accuracy. In addition, since the optical member 100D does not have the conductive fine wires 4D arranged in the laser beam irradiation area, the output of the light extracted from the conversion member 2 is improved.
The method of manufacturing the optical members 100B, 100C, and 100D is the same as the method of manufacturing the optical member 100A described above.

(Modified example of arrangement position of conductive fine wire)
Next, as shown in FIG. 9, an optical member 100E, which is a modification of the optical member 100A according to the first embodiment, has the following features, except that the conductive thin wires 4A are arranged on the light irradiation surface 2b of the conversion member 2. It is the same as that of the optical member 100A. The optical member 100E does not need to be provided with the conductor portion 11 (see FIG. 2) for conducting electricity to the thin conductive wires 4A, and only the bumps 12 electrically connected to the substrate pattern 6 (see FIG. 3) connected to the external power source. should be provided.

In the optical member 100E, the conductive thin wire 4A covers the entire light irradiation surface 2b of the conversion member 2, and it is possible to detect the breakage of the conversion member 2 with higher accuracy.

The method of manufacturing the optical member 100E is the same as the method of manufacturing the optical member 100A described above, except that the thin conductive wires 4A are arranged on the light irradiation surface 2b and that only the bumps 12 are formed without providing the conductor portions 11.

Next, as shown in FIG. 10, in an optical member 100F that is a modification of the optical member 100A according to the first embodiment, the conductive thin wires 4A are arranged between the light extraction surface 2a and the light irradiation surface 2b of the conversion member 2. It is the same as the optical member 100A except that the conductor portion 11 is formed up to the position of the conductive thin wire 4A.

In the optical member 100</b>F, the conductive fine wire 4</b>A is sandwiched between two conversion members 2 and arranged between the conversion members 2 . That is, the thin conductive wires 4A are arranged inside the conversion member 2 . Therefore, it is possible to detect damage occurring inside the conversion member 2, and to detect damage to the conversion member 2 with higher accuracy. The conductive thin wire 4A may be a wire. Moreover, the light irradiation surface and/or the light extraction surface of the conversion member 2 may be further provided with a conductive fine wire 4A.

The optical member 100F can be manufactured by, for example, the following manufacturing method.
(1) Converting member manufacturing process Two converting members 2 are manufactured by sintering the powder material to be the converting member 2 using the SPS method, the HP method, or the like.
(2) Arrangement process of conductor part After manufacturing the conversion member 2, the through-hole which penetrates to the one conversion member 2 in the thickness direction is produced. Next, the through hole is filled with the conductor portion 11 and the bump 12 is formed on the lower end portion of the filled conductor portion 11 .
(3) Arrangement process of conductive thin wire After forming the bump 12, the conductive thin wire 4A and the pattern connection electrodes 5 connected to both ends thereof are placed on the upper surface of the conversion member 2 on which the conductor part 11 and the bump 12 are formed. Deploy. The arrangement method is the same as that of the optical member 100A.

(4) Sintering Step The conversion member 2 in which the conductive fine wires 4A are arranged and another conversion member 2 are laminated, pressed, and sintered to form an optical member 100F.

Next, as shown in FIGS. 11A and 11B, an optical member 100G, which is a modification of the optical member 100A according to the first embodiment, includes conductive thin wires 4E arranged on the light extraction surface 2a and light extraction surface 2a. and the light irradiation surface 2b intersect with each other in a plan view to form a rectangular lattice similar to the conductive thin wires 4A (see FIG. 1), except that the optical member Similar to 100A. Thus, intersecting in a plan view includes a case where other members such as the conversion member 2 are seen through and intersect. Further, in the optical member 100G, the conductive fine wires 4E and the conductive fine wires 4F are provided with conductor portions 11 and bumps 12 electrically connected to each of the conductive fine wires 4E and 4F via the pattern connection electrodes 5 for conducting electricity. is preferred.

The conductive fine wires 4E are composed of a plurality of straight fine wires 4a connected to a pair of pattern connection electrodes 5 for energization. . The thin conductive wires 4F are composed of a plurality of straight thin wires 4a connected to a pair of pattern connection electrodes 5 for energization. It is arranged laterally of the conversion member 2 . In a plan view, the conductive thin wires 4E and the conductive thin wires 4F intersect three-dimensionally to form a square lattice shape similar to the conductive thin wires 4A, and the area of the opening S formed by the intersection is also optical. It is preferably similar to member 100A.

In the optical member 100G, the conductive thin wires 4E are arranged on the light extraction surface 2a and the conductive thin wires 4F are arranged on the light irradiation surface 2b, and the conductive thin wires 4F are arranged between the light extraction surface 2a and the light irradiation surface 2b. It may be in the form of Further, the optical member 100G has a configuration in which the conductive thin wires 4E are arranged on the light extraction surface 2a, the conductive thin wires 4F are arranged between the light extraction surface 2a and the light irradiation surface 2b, and the conductive thin wires 4E are arranged on the light irradiation surface 2b. may
In the optical member 100G, in the conductive fine wires 4E and 4F, one pair of pattern connection electrodes 5 is connected to one linear fine wire 4a, and a plurality of pairs of pattern connection electrodes 5 are arranged. may

In the optical member 100G, since the conductive thin wires 4E and the conductive thin wires 4F are arranged at different positions above and below the conversion member 2 in the orthogonal direction, not only the surface of the conversion member 2 but also damage occurring inside the conversion member 2 can be detected. Damage to the member 2 can be detected with higher accuracy. Further, in the optical member 100G, the conductive thin wires 4E and the conductive thin wires 4F are arranged at different positions above and below the conversion member 2, and the conductive thin wires 4E and the conductive thin wires 4F form a pseudo lattice in plan view. there is For this reason, similarly to the grid-like conductive thin wires 4A, the effect of being able to accurately detect damage occurring in the conversion member 2 can be obtained. In addition, since each of the conductive thin wires 4E and the conductive thin wires 4F does not have a lattice shape, the rate of increase in the resistance value in the event of disconnection or the like is determined by the grid shape in which the conductive thin wires 4E and the conductive thin wires 4F are superimposed. of conductive wires. In this way, by arranging the conductive thin wires arranged at different locations so as to intersect with each other in a plan view, damage occurring in the conversion member 2 can be detected with higher accuracy.
In the optical member 100G, the crossing shape of the conductive thin wires 4E and the conductive thin wires 4F is not only the rectangular lattice shape of the conductive thin wires 4A, but also the diamond-shaped lattice shape of the conductive thin wires 4B (see FIG. 8A). It may be in shape.

The method for manufacturing the optical member 100G is the same as the method for manufacturing the optical member 100F described above.
However, in the step (3) of arranging the conductive fine wires, the conductive fine wires 4F and the pattern connection electrodes 5 are arranged on the upper surface of one of the conversion members 2 . On the upper surface of the other conversion member 2, a conductive fine wire 4E and a pattern connection electrode 5 are arranged. A through hole penetrating from the upper surface to the lower surface is formed in each of the two conversion members 2 , and the through hole is filled with the conductor portion 11 .
In the (4) sintering step, the two conversion members 2 are laminated, pressed, and then sintered. Then, a bump 12 is formed on the lower end portion of the filled conductor portion 11 to form an optical member 100G.

As shown in FIGS. 12A and 12B, an optical member 100H, which is a modification of the optical member 100A according to the first embodiment, includes a conductive thin wire 4G arranged on the light extraction surface 2a, a light extraction surface 2a and a light irradiation surface 2a. It is the same as the optical member 100A except that it intersects with the conductive thin wire 4H arranged between the surface 2b in plan view. Further, in the optical member 100H, the conductive fine wires 4G and the conductive fine wires 4H are each provided with conductor portions 11 and bumps 12 electrically connected to each other through the pattern connection electrodes 5 for conducting electricity. is preferred.

The conductive thin wire 4</b>G is composed of a large-diameter first circular thin wire 4 b and a connecting thin wire 4 d that connects the first circumferential thin wire 4 b and the pattern connecting electrode 5 . The conductive thin wire 4H is composed of a second circumferential thin wire 4c having a diameter smaller than that of the first circumferential thin wire 4b and a connecting thin wire 4d connecting the second circumferential thin wire 4c and the pattern connecting electrode 5. . When the conductive thin wires 4G and the conductive thin wires 4H three-dimensionally intersect at the intersection point P in plan view, an intersection shape similar to that of the conductive thin wires 4C (see FIG. 8B) is formed.

In addition, in the optical member 100H, the arrangement positions of the conductive thin wires 4G and the conductive thin wires 4H are not limited to those shown in the drawings, and the light extraction surface 2a, the light irradiation surface 2b, and the light extraction surface 2a and the light It suffices if they are arranged in at least two or more positions intermediate to the irradiation surface 2b.
In the optical member 100H, since the conductive thin wires 4G and the conductive thin wires 4H are arranged at different positions on the conversion member 2, not only the damage on the surface of the conversion member 2 but also damage occurring inside the conversion member 2 can be detected. can be detected more accurately. The optical member 100H can obtain the same effect as the optical member 100G. In other words, it is possible to accurately detect damage occurring in the conversion member 2 in the same manner as the shape in which the conductive thin wires 4G and the conductive thin wires 4H are superimposed in a plan view, and to reduce the resistance value when disconnection or the like occurs. Since the rate of increase is greater than that of the conductive thin wires in the overlapping shape, it is possible to accurately detect damage occurring in the conversion member 2 . In addition, unlike the optical member 100G, the optical member 100H does not have fine lines arranged in the irradiation area of the laser element 25, so the output of light extracted from the conversion member 2 is improved.
The method for manufacturing the optical member 100H is the same as the method for manufacturing the optical member 100G described above.
A modification of the shape of the conductive thin wire and a modification of the arrangement position of the conductive thin wire may be combined.

<Optical member according to the second embodiment>
(Modified example of shape of conductive thin wire)
Next, the optical member 150A according to the second embodiment may use conductive thin wires 4B to 4D shown in FIGS. 8A to 8C instead of the conductive thin wire 4A.

(Modified example of arrangement position of conductive fine wire)
As shown in FIG. 13, an optical member 150B, which is a modification of the optical member 150A according to the second embodiment, has the optical member 150A except that the conductive thin wires 4A are arranged on the light irradiation surface 2b of the conversion member 2. As shown in FIG. is similar to The optical member 150B includes a conductor portion 11 for supplying electricity to the thin conductive wires 4A. The conductor portion 11 is electrically connected to the substrate pattern 6 (see FIGS. 6 and 7) in order to connect to an external power supply. The conductor portion 11 and the substrate pattern 6 are the same as those of the optical member 100A.

In the optical member 150B, the thin conductive wires 4A cover the entire light irradiation surface 2b of the conversion member 2, and damage to the conversion member 2 can be detected with higher accuracy.

The method for manufacturing the optical member 150B is the same as the method for manufacturing the optical member 150A described above. However, in the step of arranging the conductive thin wires (4), a through hole is formed through the conversion member 2 from the light extraction surface (front surface) 2a to the light irradiation surface (back surface) 2b, and the through hole is filled with the conductor portion 11. . Next, a conductive thin wire 4A is arranged on the light irradiation surface (back surface) 2b of the conversion member 2 so as to be electrically connected to the conductor portion 11, and the pattern connection electrode 5 is joined to the conductor portion 11. It is arranged so as to cover the back surface 3c of the holding member 3 .

Next, as shown in FIG. 14A, in an optical member 150C that is a modification of the optical member 150A according to the second embodiment, the conductive thin wires 4A are arranged between the light extraction surface 2a and the light irradiation surface 2b of the conversion member 2. It is the same as the optical member 150B except that it is arranged at .

In the optical member 150C, since the conductive thin wire 4A is arranged at a position sandwiched between the conversion members 2, damage occurring inside the conversion member 2 can be detected, and damage to the conversion member 2 can be detected with higher accuracy. It is possible to detect well.

The method for manufacturing the optical member 150C is the same as the method for manufacturing the optical member 150A described above. As shown in FIG. 14B, two optical members are produced by sintering. Specifically, one optical member is optical member 151 in which conductive fine wires 4A are arranged on the surface of conversion member 2 . Another optical member is an optical member 152 in which a through hole is formed in the conversion member 2 and the conductor portion 11 is arranged in the through hole. Then, the two optical members 151 and 152 may be integrated by lamination, pressing, and sintering to form an optical member 150C.
Another method of manufacturing the optical member 150C may be a method of integrating the optical member 100F (see FIG. 10) of the first embodiment and the holding member 3 by glass bonding.

In the optical member 150A according to the second embodiment, the conductive fine wires arranged in the conversion member 2 are arranged in at least two places between the light extraction surface, the light irradiation surface, and the light extraction surface and the light irradiation surface. , and conductive thin wires arranged at different positions in plan view may three-dimensionally intersect. For example, the conductive thin wires 4E and 4F shown in FIGS. 11A and 11B, or the conductive thin wires 4G and 4H shown in FIGS. 12A and 12B may be used.
A modification of the shape of the conductive thin wire and a modification of the arrangement position of the conductive thin wire may be combined.

100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H Optical members 150A, 150B, 150C Optical members 200A, 200B Light emitting device 2 Conversion member 2a Light extraction surface (surface)
2b Light irradiation surface (back surface)
3 holding member 3a front surface 3c back surface 4A, 4B, 4C, 4D, 4E, 4F, 4G, 4H conductive thin wire 5 pattern connection electrode 6 substrate pattern 9 heat dissipation member 11 conductor portion 21 package 25 laser element

Claims (12)

a conversion member capable of converting laser light, which is excitation light, into light of a different wavelength;
A conductive fine wire made of a metal material disposed so as to intersect in plan view at any one of the light irradiation surface, the light extraction surface, or between the light irradiation surface and the light extraction surface of the conversion member. When,
a pattern connection electrode electrically connected to the conductive thin wire;
An optical member comprising: a conversion member capable of converting laser light, which is excitation light, into light of a different wavelength;
of the conversion member Light irradiation surfaceorLight extraction surfaceWhen,Between the light irradiation surface and the light extraction surfaceand ofplaced in twoa conductive thin wire made of a metal material;
and a pattern connection electrode electrically connected to the conductive thin wire,
2 The conductive thin wires arranged at the place are arranged so as to cross each other in a plan view.the lightAcademic member. 3. The optical member according to claim 1, wherein the pattern connection electrode is arranged on the light irradiation surface or the light extraction surface. 4. The optical member according to any one of claims 1 to 3, wherein the conductive thin wires are made of any one of tungsten, molybdenum, silver and aluminum. 5. The optical member according to claim 4, wherein said conductive thin wire is a wire. The optical member according to any one of claims 1 to 5, wherein the conductive thin line has a width of 0.2 to 5.0 µm. 1 to 90, wherein the conductive fine lines are lattice-shaped, and the area of the openings surrounded by the intersections is 5 to 90% of the area of the irradiation image of the laser beam irradiated onto the conductive fine lines. 7. The optical member according to any one of 6. The optical member according to any one of claims 1 to 7, further comprising a holding member that holds the conversion member. 9. The optical member according to claim 8, wherein said holding member is made of light reflecting ceramics. an optical member according to any one of claims 1 to 9;
a laser element arranged to irradiate the light irradiation surface of the conversion member with laser light;
A light emitting device. further comprising a package surrounding the laser element;
11. The light emitting device according to claim 10, wherein said optical member is fixed to said package so that said laser light reaches said conversion member. 12. The light-emitting device according to claim 10, further comprising a detection circuit for detecting breakage of said conductive thin wire.

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