JP2016000628A - Substrate holding frame body and substrate package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate holding frame body or the like capable of safely store and transport a substrate with a large size of about 2 m square.SOLUTION: A resin layer 17 with rigidity and a uniform thickness, which contains a filler, is formed on a top surface of a metallic frame body for being loaded with a substrate A1, which is formed of the same continuous flat and curved surfaces, not being associated with a groove, a step part and a ridgeline between top surfaces of respective parts of the metallic frame body. The upper and lower metallic frame bodies are not brought into contact with each other.

Description

In the present invention, a rigid rectangular (rectangular) substrate is placed one by one on a substrate support provided on the inner periphery of a rectangular substrate holding frame, and the substrate is held in a state where the substrate is placed. The present invention relates to a substrate holding frame for stacking and storing and transporting frames in multiple stages, and a package of substrates using the same.
It is necessary to prevent the stacked substrates from coming into contact with each other, to accumulate them at a high density, and to prevent breakage, dust contamination and contamination during transportation and storage.
An example of such a substrate is a thin glass substrate, and in particular, color filters and touch panels for plasma displays, organic EL displays, liquid crystal displays, and their intermediate products, and other various substrates. .

In such a storage / transfer apparatus, the substrate holding frame, the substrate holding member that is inserted into the tip of the substrate support portion and directly placing the substrate, and the lower surface of the entire substrate holding frame stacked in multiple stages are provided. An inner pallet to be received and an anti-vibration pallet to be used at the bottom are required, and further, an upper lid and a cover for protecting the upper surface and the periphery of the substrate holding frame are required.
The present invention relates to a substrate holding frame and a substrate packaging body using the same, among these transport / storage devices.

It is important to transport and store liquid crystal display panels, plasma display panels, and substrates such as color filters without damaging or contaminating the substrates. When conveying such a plate-shaped object, in order to protect the functional layer of the plate-shaped object, it is necessary to store in parallel at a predetermined interval so that the plate-shaped object does not contact.
However, these substrates such as color filters and intermediate products are large in size, and are manufactured in a multi-faceted state even if they are small in size. If the two or four opposing sides are supported even by a 0.7 mm thick glass substrate, it is inevitable that the intermediate portion is curved in the direction of gravity by about 100 mm or more. Substrates are required to have a size of 2 square meters or more, and it is necessary to store and handle such substrates with high density and safety due to problems of storage space and handling equipment.

  There exists patent document 1 which tries to convey a thin plate-shaped board | substrate, using a frame, preventing the damage | wound by an impact, etc. However, according to the document, the upper surface for holding the substrate is not the same continuous plane and curved surface without the grooves and the twill lines, but the handle portion 5 and the frame body side surface 1a or the upper surface of the mounting portion 3. The inner peripheral surface 3c or the inner peripheral surface 3c and the upper surface of the support frame 2 are all connected at a right angle. Since the corners are connected in this way, it is not easy to clean when foreign matter adheres. In addition, since foreign matters remain on the substrate holding surface, the foreign matters may be transferred to the substrate when the substrate is loaded on the substrate holding frame and transported. In Patent Document 2, in the same manner as described in Patent Document 1, the flange portion 42f, the frame portion 42, and the portion 42 where the support member is fitted are all connected at a right angle, so that foreign matters are easily attached to them. It is difficult to remove foreign matter. Another problem is to use a cushioning material between the upper and lower surfaces of the glass transport frame to prevent vibrations and shocks. For the cushioning material, foamed resin or rubber is used (paragraph [0023]). When such a material is used, it is considered that the cushioning material itself becomes a source of dust and dust. In addition, it is essential to use the contact material 6 that holds the glass substrate, and the same material is used.

Patent Document 3 discloses a thin plate-like substrate that is stacked and conveyed in multiple stages in a curved state using a frame. However, this also requires the use of the cushioning material 7 and the contact material 6, and since foamed resin, rubber or the like is used for this (paragraph [0020]), generation of dust or the like is inevitable.
In addition, since the alignment between the upper and lower frames is performed by the engaging convex portion 9a and the engaging concave portion 9b, dust easily collects in such a portion, and it is considered that there is a problem in cleaning this portion. . Also in patent document 2, since the structure of the mounting part 3 and the engagement convex part 9a exists in the same surface similarly to patent document 1, there exists a problem of a deformation | transformation or damage of an engagement part.
In addition, although there exist patent documents 4 and 5 regarding the film for metal laminates, all the compositions are different from the thing used by this application.

JP 2006-168748 A JP 2004-359343 A JP 2006-168749 A JP-A-11-35911 JP 11-291431 A

Under such circumstances, in recent years, particularly in the flat panel for liquid crystal display, it is required to manufacture a larger color filter forming substrate, and further to the transport and storage device for the color filter substrate and its intermediate process substrate. There is a need for further reductions in transportation costs by improving transportation efficiency, saving storage space, and safe handling of intermediate products.
By the way, the substrate referred to as the sixth generation has a size of 1500 mm × 1850 mm, the eighth generation has a size of 2200 mm × 2500 mm, and the ninth generation has a size of 2400 mm × 2800 mm.

When large size glass is stored in a flat state and vibrations are applied during transportation, the substrate undulates and jumps up and down about several hundred mm, and contact damage occurs between the substrates unless the storage interval is very large. Alternatively, the glass itself jumps up and down by several hundred mm due to vibration and breaks down while it is deformed.
Accumulating and transporting and storing such glass substrates at a high density not only saves storage space, but also prevents the handling equipment and transport equipment from becoming large, thus saving resources. This will contribute to the reduction of manufacturing costs.
Conventionally, in the substrate holding frame that has been used, there has been a problem that the alignment portion between the frames is likely to be deformed during stacking and taking-out operations, and the glass substrate is easily damaged due to impact during stacking or transportation. . In addition, some cushioning materials are used between the substrate holding frames to absorb such impacts, but there is a problem of deformation due to long-term use or generation of dust from the cushioning materials. Strict countermeasures are required as it increases pollution.
In particular, generation of fine metal powder due to contact between laminated metal frames is an important problem that leads to breakage of the glass substrate.
The glass substrate of the sixth generation (G6) is generally 0.7 mmt, 1500 mm × 1850 mm, the weight of one sheet is 5 kg, and the deflection amount is about 350 mm when both ends are supported.
In addition to this, the thickness of the sixth generation (G6) glass substrate includes a thin plate such as 0.4 mmt and 0.5 mmt and a thick plate of 1.1 mm and 1.6 mmt. There is also 1500 mm × 1800 mm in the outer size.
In order to increase transport efficiency, a space-saving substrate storage device and transport device for storing and transporting such a large glass substrate in large quantities are required. On the other hand, if even one large glass substrate breaks during transportation or handling, glass fragments adhere to other glass substrates, or other glass breaks due to glass substrates with glass fragments adhering to the equipment. Damage to the device, damage to expensive masks and jigs used in the process, and secondary loss occur.
In addition, in order to prevent secondary damage due to the breakage of one glass substrate, if the glass substrate breaks, the production is interrupted and thorough cleaning such as equipment and jigs is necessary. Loss due to breakage is enormous.
Even if the glass substrate is not damaged, even if the periphery of the glass substrate is scratched, damage may occur due to stress on the glass substrate such as contact in the subsequent process or heat treatment, so a large glass substrate Strict measures are necessary for handling such that even one sheet is not damaged.
The present invention has been completed through intensive research to solve such problems.

The first of the gist of the present invention for solving the above problems is that one of the rectangular substrates is stored in a substrate holding frame having a rectangular metal frame portion in plan view, and the frame is in a state where the substrate is stored. A substrate holding frame for use in transportation or storage in a state where the bodies are aligned and stacked in multiple stages, (1) a metal frame having a square or rectangular cross-sectional shape, and (2) the metal A first fitting portion which is provided on the upper surface side of the inner peripheral surface of the frame portion and has a form inclined to the lower side of the inner periphery; and a substrate support portion which is formed to extend further forward; and (3) the metal A second fitting portion provided on the lower surface side of the inner peripheral surface of the frame portion and having a configuration inclined to the lower side of the inner periphery; and (4) formed to extend from the left and right sides of the metal frame portion to the outer peripheral side. An upper surface of the metal frame portion, an upper surface of the first fitting portion, and an upper surface of the substrate support portion. And the upper surface of the handle portion are formed of the same continuous plane and curved surface without grooves, stepped portions and ridge lines between the upper surfaces of the respective portions, and the upper surface of the metal frame portion, the first fitting portion A resin layer having a uniform thickness and containing filler is formed on a part or the entire surface of either the upper surface of the portion that comes into contact with the lower surface of the second fitting portion or the upper surface of the handle portion. A substrate holding frame, characterized in that no metal foreign matter is generated by any contact between the metal frame surface, the surface of the fitting portion, and the surface of any part of the handle portion between the upper and lower metal frames. is there.
The above (same continuous plane and curved surface without a ridge line) is a smooth surface without a corner. The ridge line means a corner when the surface is in contact with the surface.

In the following description, the substrate holding frame may be simply referred to as “frame” in the specification.
The term “metal frame” includes a fitting portion made of a metal material, a substrate support portion, and a handle portion in addition to the metal frame portion.

  The second of the gist of the present invention for solving the above-mentioned problems is that the substrate is sealed with the above-mentioned substrate holding frame by fitting a close fitting portion of the metal frame portion surface between the frames smooth. Are stacked in multiple stages, and the upper lid fitting part is fitted to the fitting part of the uppermost board holding frame to seal the space between the faces, and the upper lid is not in contact with the board. The fitting part of the inner pallet is fitted to the fitting part of the frame body, the space between the surfaces is sealed, and the upper surface of the inner pallet is prevented from coming into contact with the substrate, and is mounted on the anti-vibration pallet and transported. It is in the packaging body of the substrate.

  The substrate holding frame of the present invention includes (1) a metal frame portion having a square or rectangular cross-sectional shape, and (2) an upper surface side of the inner peripheral surface of the metal frame portion, and is inclined downward on the inner periphery. A first fitting portion having the above configuration, a substrate support portion formed to extend further forward, and (3) provided on the lower surface side of the inner peripheral surface of the metal frame portion, and inclined downward on the inner periphery And (4) a handle portion formed by extending from the left and right sides of the metal frame portion to the outer peripheral side. Since it is formed on the inner circumference side of the metal frame part that does not directly receive the substrate holding frame itself or the load of the board instead of itself, deformation of the metal frame part is prevented and a sealed state is secured. In addition, it is possible to prevent mixing of dust and the like.

  Further, the upper surface of the metal frame portion, the upper surface of the first fitting portion, the upper surface of the substrate support portion, and the upper surface of the handle portion are the same continuous plane and curved surface without grooves, step portions, and ridge lines between the upper surfaces of the respective portions. Because it has a formed structure, it is a structure that does not collect adhering foreign matter easily, and it can easily wipe and clean the surface of the frame against dirt and foreign matter adhering due to transportation, desorption of the substrate, handling of the frame, etc. .

  Furthermore, since the upper surface is configured as a continuous surface as described above, a thin uniform resin layer can be easily formed on the upper surface. By forming a resin layer having a uniform thickness containing a filler on the surface of the metal frame, it is possible to prevent the occurrence of metal foreign matter due to contact between the metal frames.

  The resin layer has a spacer function, the rigid first resin functional layer prevents the metal frames adjacent to each other in the vertical direction from contacting each other, and the second resin functional layer having an uneven surface is attached between the frames. Has a function to prevent sticking. By having these two different functions, it is possible to prevent the generation of metallic foreign objects due to contact between the frames, and at the same time, it is possible to prevent problems due to sticking between the frames even if a plurality of heavy objects are stacked for a long period of time.

The second resin functional layer whose surface of the resin layer has an uneven shape has a function of preventing lateral displacement between metal frames. By having this function, it is possible to prevent the metal frames from being displaced laterally against vibrations and shocks when transported in a multi-layered state, thereby enabling stable transport and substrate transfer.
The second resin functional layer having a concavo-convex shape on the surface of the resin layer has a function of preventing generation of static electricity in the metal frame. By having this function, it is possible to reduce the generation of static electricity at the time of peeling when removing the metal frames stacked in multiple stages, and it is possible to prevent adhesion of minute foreign substances and damage to the substrate due to charging.
Since the resin layer is a resin tape in which the first resin functional layer and the second resin functional layer are laminated and integrated, it is uniform on a metal frame formed by the same continuous plane or curved surface without a ridgeline. It can be easily formed with a small thickness.

  The thickness of the resin layer is a necessary condition that the metal frames adjacent to each other in the vertical direction do not come into contact with each other, and the height of the package when stacked in multiple stages is increased by the thickness. Since it is 70 μm or more and 400 μm or less, it can be laminated safely and used without any problem.

Since the metal frame is made of aluminum or an aluminum alloy, the strength of the multi-stage and heavy frame can be maintained and the weight can be reduced. An oxide film can be easily formed on the surface of aluminum, and a resin tape can be firmly and easily formed thereon by hot-pressure fusion. This eliminates the use of a sticky adhesive, thereby allowing the substrate to be held free from contamination by impurities.
As described in Patent Document 4 (paragraph [0006]), the ethylene-propylene copolymer on aluminum has heat-fusibility. In liquid crystal parts and semiconductor products, impurity contamination, particularly ionic contamination, has a very bad influence on the performance of the product. In the present invention, heat-sealing is performed with aluminum and a resin without using a sticky adhesive that becomes a contamination.

  In the resin tape, the first resin functional layer is made of a resin having a heat pressure fusion property to the metal frame, and the resin tape is fused to the metal frame to form a rigid resin layer. . The second resin functional layer in the previous period is formed of a resin that does not have heat pressure fusion to the metal frame, so that a heavy metal frame is loaded on the resin layer, but the storage time is long. In this case, the resin layer and the metal frame loaded thereon do not cause pressure fusion. As described above, the heat pressure fusion property is different between the first resin functional layer and the second resin functional layer, so that the resin layer can be easily formed as the spacer functional layer, and the metal frame surface on which the resin layer surface is loaded. As a result, it can be attached to the metal frame and not peeled off.

  The resin of the first resin functional layer is made of an ethylene-propylene copolymer resin and has a layer thickness of 60 μm or more and 400 μm or less. In the filler in the resin layer, titanium oxide having a particle size of 50 nm or more and 400 nm or less is dispersed in the first resin functional layer in an amount of 3% by mass to 5% by mass. The ethylene-propylene copolymer resin is a resin that is easily fused to a metal frame, and has rigidity by dispersing fine titanium oxide particles. The measurement is mass% by EDX (energy dispersive X-ray fluorescence) analysis.

  The resin layer has a function as a spacer, and forms the first resin functional layer in which fine particles of titanium oxide hardly soluble in water or a solvent are dispersed in the resin. In the prior art, cushioning materials such as foam and rubber are used to reduce the impact of vibration between metal frames, but the present invention provides stable loading of heavy objects with a large stack of large substrates. In order to prevent dust and dust generation, it is necessary to have a property that does not have buffering properties and conversely has rigidity. Since the first functional layer has this low cushioning rigidity, the metal frame can be stably prevented from coming into contact, and even after being stored for a long time in a laminated state, there is little deformation, improving the stability of conveyance. it can.

  The resin of the second resin functional layer is an acrylic resin, and the layer thickness is 2 μm or more and 4 μm or less. The filler in the resin layer is composed of a barium sulfate agglomerate having a particle size of 0.1 μm or more and 3 μm or less and silicon oxide particles of 0.1 μm or less in the second resin functional layer of 70% by mass or more and 90% by mass or less. The second resin functional layer has an uneven shape on the surface, prevents the sticking to the loaded metal frame, prevents the lateral displacement due to vibration during transportation, and uses the robot to unify the stacked metal frames. It has the effect of preventing the generation of static electricity when taking out one sheet at a time.

  The concavo-convex shape is an acrylic resin that is difficult to fuse with the metal frame, covers the surface of a barium sulfate agglomerate that is chemically inert and sparingly soluble in water, and contains a large amount of sulfuric acid with fine silicon oxide. By filling the gap between the barium agglomerates and forming the resin capacity as small as possible, it has the effect of forming unevenness on the surface and further preventing the resin from fusing with the metal frame.

With these actions, it is possible to prevent the generation of metal foreign objects in the metal frame by handling the large substrate safely by robot such as laminating and taking out.
It is necessary to handle the frame for holding the substrate with a robot etc. with a large and heavy glass such as G6 size, and if there is deformation of the substrate holding frame or deformation of the spacer between the substrate holding frames, it is stacked in multiple stages In such a state, handling failure occurs. When the spacer material is rubber or foaming cushioning material, handling failure due to deformation occurred, but the present invention loads large substrates at high density and fits the upper lid to the fitting portion of the uppermost substrate holding frame The upper pallet is fitted and sealed so that the upper lid does not come into contact with the substrate, and the fitting portion of the inner pallet is fitted and sealed to the fitting portion of the lowermost substrate holding frame, and a binding belt is used between the upper lid and the inner pallet. As a result of bundling, placing on an anti-vibration pallet, and transporting trucks, there is no dust generation from the resin layer of the spacer function due to vibration and impact, and there is no creep deformation of the resin layer during long-term storage in the loaded state. It was confirmed that there were no handling defects and no metal foreign matter.
Also, since the surface of the frame body and wiping and cleaning were continuous surfaces, the work was easy and good quality could be maintained.

It is the top view which looked at the frame for substrate maintenance from the upper surface. It is sectional drawing of the metal frame part and fitting part of the left side which laminated | stacked the board | substrate holding frame in 3 steps | paragraphs, and a board | substrate support part. 5 is a cross-sectional view taken along the line YY of FIG. 1 which is a plan view, and is a cross-sectional view taken along the line ZZ of FIG. FIG. 3 is a cross-sectional view of a state in which a substrate holding member is mounted on the substrate support portion of FIG. 2 and a substrate is placed thereon, and then substrate holding frames are stacked in three stages. It is a perspective view which shows the external appearance of the frame for board | substrate holding | maintenance. It is an external appearance perspective view of the state which mounts a board | substrate on the frame for board | substrate holding | maintenance. It is a perspective view which shows the state which puts a board | substrate on the frame for board | substrate holding | maintenance, covers an upper cover in the state which piled up the frame body in multiple steps, and applies an inner pallet and a vibration isolating pallet to the lower side. It is a perspective view which shows the state which packed the board | substrate holding frame and the inner pallet with the binding material. It is sectional drawing of the resin layer on a metal frame, and has shown "the 1st functional layer and the 2nd functional layer."

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. For easy understanding, a substrate using a substrate holding frame will be described before describing the substrate holding frame of the present invention in detail. The whole transport / storage device, that is, the package body of the substrate will be described.

FIG. 4 is a perspective view showing the appearance of the substrate holding frame. The substrate holding frame 10 is a rectangular frame in plan view, but in the perspective view, the substrate is a frame whose center is curved in the direction of gravity. On the four sides, there are frame-shaped metal frame portions 11 (consisting of 11a, 11b, 11c, and 11d). The metal frame 11 is a structural member that supports the entire weight of the substrate holding frame 10 itself and the substrate stacked in multiple stages.
The left and right sides 11a and 11b of the metal frame 11 are flat linear metal frames, but the front and rear sides 11c and 11d are curved downward. Here, the front and rear and the left and right sides of the frame body may originally be either the front or rear or the left and right sides, but in this specification, the two sides on which the long side of the rectangular substrate is placed are easy to distinguish. The left and right sides.

On the inner peripheral side of the upper surface of the metal frame portion 11, a first fitting portion 12a and a substrate support portion 13 extending beyond the first fitting portion 12a are formed so as to extend in a continuous and same plane and curved surface without grooves and ridge lines. On the outer peripheral side of the upper surface of the frame portion 11, a handle portion 15 is formed so as to extend in a continuous and same plane and curved surface without a groove, a step portion, and a ridge line.
A resin substrate holding member 14 is attached to the substrate support portion 13 so as to cover the metal surface at regular intervals. In some cases, the substrate holding member 14 is provided with cutouts or punched holes at regular intervals in the substrate support portion 13 and attached to the cutout portion. In this case, the substrate support portion 13 including the substrate holding member 14 is provided. Extends to the inner circumference side with a constant width. However, the substrate holding member 14 may be continuously attached in a band shape without a constant interval.
A central area K surrounded by the substrate support 13 is an empty opening (space area).

FIG. 5 is an external perspective view of a state where the substrate is placed on the substrate holding frame.
When the substrate A is placed on the substrate holding frame 10, the substrate A may be lowered and placed on the substrate holding frame 10 in a stationary state, but foreign matter is prevented from being attached. For this purpose, it is preferable that the substrate A taken out from the manufacturing apparatus is temporarily stopped on the gantry and the substrate holding frame 10 is lifted from below the gantry and the substrate A is placed so as to scoop up.
The substrate A is placed in contact with the surface of the substrate holding member 14. At this time, the functional layer surface is the upper surface and is not in contact with the surface of the substrate holding member 14 of the substrate holding frame 10 placed on the upper stage.

FIG. 6 is a perspective view showing a state in which the substrate is placed on the substrate holding frame 10, the frames are stacked in multiple stages, the surface plate 21 is covered, and the inner pallet 30 and the vibration isolation pallet 40 are applied to the lower side. is there.
By sequentially stacking the substrate holding frame 10 on the other substrate holding frame 10 on which the substrate A is already placed, the multi-layer stack 100 of the frames can be obtained. The upper and lower frames are stacked such that the upper surface of the fitting portion close to the metal frame portion 11 of the substrate support portion 13 of the lower substrate holding frame 10 and the lower surface of the fitting portion of the upper substrate holding frame 10. By engaging, it is fitted and alignment is performed reliably.

  The inner pallet 30 has a surface plate made of metal or resin that is shaped to match the curved surface of the substrate so as not to contact the substrate A placed on the lowermost stage. Further, the total weight of the frame body and the substrate A stacked in multiple stages is received by the four sides of the pallet. As in the case of the frame, consideration is given not to generate dust or the like. In order to obtain a sealing structure, the lower part of the board holding frame 10 has a fitting part of the pallet itself that is fitted to the lower surface fitting part.

The anti-vibration pallet 40 is for suppressing vibrations and the like that are exerted on the substrate during conveyance. In general, vibration-proof rubber is used to cushion vibration and impact during transportation and cargo handling. A commercially available product may be used as long as it does not generate dust or foreign matter.
As the upper lid 20, one having a surface plate 21 curved downward in accordance with the bending shape of the substrate A is used. For this purpose, it is preferable to use a strong metal or resin material so as to withstand impacts from above. Moreover, in order to set it as the sealing structure, it is set as the structure which has a fitting part also in the upper cover 20 itself so that it may fit with the upper surface of the uppermost board | substrate holding frame 10. FIG. More preferably, a binding mechanism 22 and a binding belt 23 are provided.

  FIG. 7 is a perspective view showing a state in which the substrate holding frame and the inner pallet are packed with a binding material. The stacked body 100 of the substrate holding frame 10 is sandwiched between the upper lid 20 and the inner pallet 30 and is bound using the binding mechanism 22 and the binding belt 23. A package is completed by covering an outer cover (not shown). It can be stored in this state, and can also be transported as cargo or air mail.

  Since the present application relates to the substrate holding frame in the entire description of the substrate transport / storage device described above and the hermetically sealed package of the substrate using the substrate holding frame, the substrate holding frame 10 and the method of using the same will be described below. Will be described in detail.

FIG. 1 is a plan view of the substrate holding frame as viewed from above.
As shown in FIG. 1, the substrate holding frame 10 has a rectangular shape whose shape when viewed in a planar state is a shape obtained by enlarging the shape of the substrate A substantially in proportion. However, in the metal frame portion 11, the left and right frame portions 11a and 11b are linear parallel frames, whereas the front and rear frame portions 11c and 11d are curved.
A handle 15 is formed outside the left and right metal frame portions 11a and 11b. The handle portion 15 is a portion that is gripped by a robot arm or the like, and does not have to be provided along the entire length of the side, and may have a partial length.

The substrate holding frame 10 uses a metal material having structural strength for the frame member. This is because it is necessary to withstand the total load of the substrate holding frame 10 itself and the substrate A. For example, in the case of the sixth generation (0.7 mmt 1500 mm × 1850 mm), one glass substrate is 5 kg and the substrate holding frame is 5.5 kg. Become. As described above in paragraph [0009], the glass that is said to be the sixth generation has slightly different sizes and thicknesses. As a matter of course, the weight of the glass substrate and the weight of the substrate holding frame 10 are also included. Slightly different, total weight will also change.
From the upper surface of the metal frame part 11, the board | substrate support part 13 of a fixed width is extended and formed toward the inner peripheral side. A portion along the metal frame portion 11 of the substrate support portion 13 is an upper first fitting portion 12a, and is an inclined surface that can be fitted into the lower second fitting portion 12b. In addition, the 1st fitting part means what the board | substrate support part 13 extended ahead, and the 2nd fitting part shall mean what consists only of the protrusion piece for a fitting. A fitting portion is formed on the lower surface of the metal frame portion 11 along the inclined surface, but is not shown in FIG. 1 (see FIG. 2 or FIG. 3).
The fitting portion is preferably provided on all four sides or at least three sides. This is because the front, rear, left and right of the frame 10 are aligned.

A resin substrate holding member 14 is attached to the substrate support portion 13 so as to cover the metal surface of the substrate support portion 13 at regular intervals. This is because a substrate representing glass is less likely to be damaged when subjected to an impact if it is in contact with a resin material that is an elastic body rather than a metal surface.
About 5 to 20 substrate holding members 14 are mounted on one side, depending on their dimensions. In the case of FIG. 1, six on each of the left and right sides and six on each of the front and rear sides are mounted. Accordingly, the single substrate holding member 14 has a width of about 5 to 10 cm and a length of about 10 to 25 cm. However, as described above, the substrate holding member 14 may not be mounted at intervals.
A region K surrounded by the substrate support 13 and the substrate holding member 14 is an opening region. The substrate A is placed over the entire region and the substrate holding member surface 14.

FIG. 2 is a cross-sectional view of the metal frame portion and the fitting portion on the left side in which the substrate holding frame bodies are stacked in three stages, and the substrate support portion. Although the right side has a symmetric cross-sectional shape, it is not shown. The three stages are examples, and the number of stages is actually increased.
A material such as aluminum or an aluminum alloy is used for the metal frame portion 11 for the purpose of weight reduction. As shown in the figure, the cross section is rectangular or square, and a hollow structure can be suitably employed.
A handle portion 15 serving as a handle portion of a robot arm or the like extends outward with a constant width as a smooth surface parallel to the upper surface of the metal frame portion 11. Between the upper surface of the upper surface of the metal frame portion 11 and the upper surface of the first fitting portion 12a, the upper surface of the substrate support portion 13 and the upper surface of the handle portion 15, the same flat surface and curved surface without grooves, step portions, and ridge lines. This is because dust is easily prevented and cleaned.
At least either a part or the whole of the upper surface of the metal frame part and a part or the whole of a part of the upper surface of the first fitting part that contacts the lower surface of the second fitting part and a part or the whole of the upper surface of the handle part. The resin layer 17 is formed on the surface, and the upper and lower metal frame surfaces, the surface of the fitting portion, and the surface of any portion of the handle portion are formed with resin spacers between the upper and lower sides. This is because no metallic foreign matter is generated.

  In order to smoothly and seamlessly bond a heat-sealable tape as a resin spacer to the aluminum frame, the upper surface of the metal frame portion 11, the upper surface of the first fitting portion 12a, the upper surface of the substrate support portion 13, and a handle. It is necessary to form the same upper surface and curved surface of the upper surface of the portion 15 without any grooves, stepped portions, and ridge lines. The surface of the first fitting portion 12a has an oblique angle with respect to the horizontal plane for fitting, but is formed as a continuous curved surface without a ridgeline.

In the case of FIG. 2, the substrate support portion 13 is provided extending from the upper surface of the metal frame 11, but may be extended from the lower surface side to serve as the substrate support portion 13. A portion along the metal frame of the substrate support portion 13 is a first fitting portion 12a. The second fitting portion 12 b is provided as a protruding piece that extends short from the lower surface of the metal frame 11. When the substrate support portion 13 is on the lower side, the protruding piece protrudes from the upper surface side.
In either case, the effect on the fitting does not change, but it is considered that the case where the substrate support portion 13 is the upper surface can reduce the fall of dust onto the substrate.

  The substrate support portion 13 is provided with a constant width H1. H1 is about 6 to 15 cm. The substrate support portions 13a and 13b provided on the left and right metal frame portions 11a and 11b are bent downward at an angle α. In the case of glass of the sixth generation size and a thickness of 0.7 mmt, it is preferable that the amount of bending from both ends is about 100 mm to 120 mm at the deepest bent central portion. In this case, the angle α is in the range of about 5 degrees to 25 degrees. Substrate support portions 13c and 13d are also provided on the front and rear metal frame portions 11c and 11d. However, since the metal frame portions 11c and 11d themselves are curved, the length direction follows the bending shape, A slight bending is sufficient.

In the case of FIG. 2, the second fitting portion 12 b is formed by being inclined and bent from the lower side of the metal frame portion 11. Thus, the fitting part 12b is formed not on the metal frame part 11 itself but on the inner peripheral part of the frame part 11 that does not directly receive the load of the frame itself or the substrate.
A first fitting portion 12 a is formed at a portion along the metal frame portion 11. This portion is similarly inclined downward so as to match the shape of the second fitting portion 12b. By the fitting of the lower surface of the second fitting portion 12b and the upper surface of the first fitting portion 12a, the upper and lower substrate holding frames 10 are aligned with each other. Thus, it is preferable to form the fitting parts 12a and 12b in the inner peripheral part which does not receive the load of the metal frame part 11 itself, when a frame body is stacked in multiple stages.

The angle β of the inclined surface of the fitting portion with respect to the horizontal plane of the metal frame is about 5 degrees to 45 degrees, more preferably 10 degrees to 20 degrees. Further, the width h of the hypotenuse is about 5 mm to 20 mm.
By providing an appropriate inclination, even if a slight misalignment occurs, a function of fitting with the load and adjusting the position (self-alignment) occurs.
The upper and lower surfaces of the metal frame portion 11 are made smooth surface finish, and the fitting portions 12a and 12b and the upper and lower surfaces of the substrate support portion along the metal frame 11 are correctly aligned and stacked, so that the interval d between the frames is increased. In addition, the inside can be made substantially sealed.

FIG. 3 is a left-end cross-sectional view of a state in which the substrate holding member is mounted on the substrate support portion of FIG. 2 and the substrate is placed, and then the substrate holding frames are stacked in three stages.
A substrate holding member 14 is mounted on the surface of the substrate support portion 13. In order to stack the frames holding the substrates in multiple stages, the distance d between the frames is made as small as possible. However, when the upper surface of the substrate and the tip of the substrate holding member 14 (side facing the opening K) are in contact, Scratches and foreign matter may be generated in the functional layer formed on the upper surface. In order to prevent this, it is preferable that at least the tip end side (side facing the opening K) of the substrate holding member 14 is formed thin or does not protrude from the substrate support portion 13. This is because if it is thick, the gap between the upper and lower substrate holding frames is narrowed. However, it is preferable that the rear end 14a of the substrate holding member 14 is made as thick as close to the gap width between the substrate support portions so as to perform the function of suppressing the displacement due to the swinging of the substrate A in the front-rear and left-right directions.

  Various methods can be used for mounting the substrate holding member 14 to the substrate support portion 13. The structure is such that the vicinity of the front end (side facing the opening K) of the substrate holding member 14 can be opened and closed in a hinge-like manner, and at the rear end (metal frame side), the front and back pieces are passed through several small holes provided in the substrate support section. They may be fitted together. Alternatively, as described above, the substrate support portion 13 is provided with notches and punched holes having a shape smaller and proportional to the substrate holding member 14, and the slide grooves formed on the rear end and the left and right side surfaces of the thin substrate holding member 14 It can also be inserted into a notch or punch hole. In any case, it is necessary to have a structure that does not easily fall off and does not generate dust or the like.

In the case of FIG. 3, the substrate holding member 14 is fitted and fixed to the substrate support portion 13, but the detailed structure is not shown in the drawing. Further, the substrate holding member 14 has a thickness of the rearmost end portion 14f to provide a stopper function for stopping the substrate A from swinging. Such a structure of the substrate holding member 14 can suppress the swing of the substrate A within a certain range. In FIG. 3, the upper substrate A1 is in contact with the rearmost end portion 14f, and the lower substrate A2 is on the right side.
When the swing range of the substrate A is ± 5 mm, the distance between the left and right stoppers 14f along the bending curve can be set to the width of the substrate A + 10 mm.

  In the case of FIG. 2, the step pitch interval d can be set to 5 mm to 20 mm with a glass substrate (thickness, 0.7 mm) having a size of 1500 mm × 1850 mm. If the size of the substrate is further increased or the plate thickness is reduced, the amount of bending increases, but if the degree of bending is constant (there is no variation within the same product type), the amount of bending is uniform and the same. The step pitch interval can be adopted. However, as the size and thickness of the plate are increased, the swinging and vertical splashing when subjected to an impact, vibration, and the like increase, so the interval needs to be considered in that case.

As shown in FIG. 1, the four corners of the metal frame portion 11 can be connected by fitting a corner piece 16 made of resin or the like into the end portion, but may be joined by welding or the like if possible. In the case of a corner piece, care is taken so that the connecting portion with the metal frame portion 11 is connected smoothly.
The metal frame portion 11 inserted into the corner piece 16 is cut or pressed to be thinned so that no step is generated between the surface of the corner piece 16 and the surface of the metal frame portion 11.
The corner pieces 16 themselves are also formed with front and back fitting grooves, and the frame pieces positioned vertically at the corner pieces 16 at the four corners are reliably aligned and joined. The metal frame 11 and the corner piece 16 are firmly fixed with bolts and nuts so that the angles of the two sides are maintained at right angles.
By fitting the upper and lower frame bodies with the corner pieces at the four corners of each frame body, the substrate can be safely transported without causing a displacement with respect to vibration or impact even in a multi-layered state.
In the claims, the substrate to be stored is a rectangular substrate, but typically a thin glass substrate such as a color filter substrate or a touch panel substrate used for a display device, or a thin plastic substrate. Obviously, various substrates and intermediate products provided with a functional layer for a display device are targeted.

(Embodiments related to materials and manufacturing method)
As the material used for the metal frame 11, a metal material that is lightweight and does not cause corrosion can be used. Specifically, aluminum alloys such as pure aluminum, duralumin (aluminum, copper (3.5 to 5.5%), magnesium), and aluminum-manganese can be used. These materials can be hollow extruded to produce a frame shape.

At least one of the upper surface of the metal frame and the upper surface of the first fitting portion, the upper surface of the first fitting portion, the lower surface of the second fitting portion, the partial or entire surface, and the upper surface of the handle portion. A resin layer 17 having a spacer function is formed on this surface.
The spacer function here simply means a function that does not allow direct contact between metals, and the purpose of this function is fulfilled if it has an appropriate film strength and resin layer thickness. For this purpose, the resin layer 17 does not generate metal foreign matter due to contact or rubbing with the metal frame portion, the resin layer itself does not generate foreign matter due to contact or rubbing, and is not easily deformed due to high load or impact. A material is desirable. In known literature, when holding and stacking such a thin large substrate with a frame, a rubber material or a foam material is inserted between the frames as a cushioning material to absorb vibrations and shocks. The resin layer 17 is formed on the metal frame so as not to absorb vibrations and shocks, but to have a film strength and wear resistance that are not deformed even when stored for a long period of time because the metals in the upper and lower metal frames are not in contact with each other.
The resin layer 17 has a first resin functional layer as a rigid spacer that does not deform even when a high load is applied for a long time, and a function for preventing sticking between metal frames stacked for a long time with a high load. It consists of a second resin functional layer having a function of suppressing lateral displacement with respect to an impact caused by vibration during transportation and a function of preventing generation of static electricity due to peeling when removing the laminated frame.

FIG. 8 is a cross-sectional view of the resin layer on the metal frame.
As shown in FIG. 8, the resin layer 17 includes a film having a two-layer structure having a first resin functional layer 171 and a second resin functional layer 172 on the surface of the metal frame portion, and the first resin functional layer on the surface of the metal frame body. It is formed by heat fusing to M.
The first resin functional layer 171 is a layer in which titanium oxide fine particles are dispersed in an ethylene-propylene copolymer resin, and the second resin functional layer 172 is a layer in which barium sulfate particles and silicon oxide fine particles are dispersed in an acrylic resin. is there.
Since the first resin functional layer 171 is formed on the surface M of the aluminum metal frame by heat fusion, an ethylene-propylene copolymer resin that is easy to fuse to aluminum is used, and the particle size in the resin is 50 nm to 400 nm. These titanium oxide particles are dispersed at 3% to 6% by mass% of titanium, and the film thickness is 60 μm to 400 μm.
The first resin functional layer 171 has a spacer function between upper and lower adjacent metal frames and disperses fine particles of titanium oxide in the resin to give rigidity and creep even when a heavy load is applied for a long time. Deformation is less likely to occur. The film thickness is a necessary condition that the metal frames are not in contact with each other, and if the thickness is increased, the packaging body laminated in multiple layers becomes bulky. Therefore, the film thickness should be as thin as possible as long as the metal frames do not contact each other. Is the best.

The second resin functional layer 172 is formed on the first resin functional layer 171 with a thickness of 2 μm to 4 μm by dispersing an agglomerate of barium sulfate of 0.1 μm or more and 3 μm or less in an acrylic resin. The second resin functional layer 172 has an effect of preventing sticking between the laminated metal frames, an effect of suppressing lateral displacement against an impact caused by vibration, and an effect of preventing the generation of static electricity. The barium sulfate particles B are in the form of agglomerates, thinly covered with resin, and filled with 0.1 μm or less silicon oxide fine particles S dispersed in the same acrylic resin to fill the gaps of the barium sulfate agglomerates. Reduce the volume as much as possible. The surface of the layer is unevenly formed with a barium sulfate agglomerate coated with acrylic resin. Barium sulfate has extremely low solubility in water, and is stable in repeated use of metal frames and water washing.
The second resin functional layer 172 may be loaded with a metal frame and stored for a long time. The second resin functional layer 172 may be pressure-bonded to the metal frame and fused to the back surface of the metal frame to partially peel off. It is necessary to prevent this. In order to prevent this, an acrylic resin that is difficult to be pressure-bonded is used, the filler filling rate is increased, and the resin volume is reduced as much as possible.

  The unevenness of about 1 μm on the surface formed by the barium sulfate agglomerates coated with acrylic resin has the effect of suppressing lateral displacement by suppressing the sliding of the aluminum metal frame to be loaded.

  Furthermore, since such surface irregularities are formed with a minute gap in the gap with the metal frame to be loaded, and are not in a completely close contact state, the handle of the loaded metal frame is grasped with the robot hand and suddenly When the metal frame is separated and taken out, there is an effect that static electricity due to peeling is hardly generated.

  The resin tape is heat-sealed at 100 ° C. to 170 ° C. with the first resin functional layer pressed against the upper surface of the aluminum metal frame to form a spacer layer. At this time, since the second resin functional layer that has an uneven shape and is difficult to pressure-bond is the top surface, it can prevent sticking to the pressing plate from the top, and the aluminum frame placed on the top even in the stacked state The resin tape can be prevented from peeling off.

The substrate holding member 14 includes a polyolefin resin material such as polyethylene and polypropylene, a polyamide resin such as ultra high molecular weight polyethylene (UHMW-PE), nylon 66 and nylon 610, polyethylene terephthalate (PET), polyimide, polyetheretherketone ( Materials such as PEEK) can be used. These materials can be manufactured by injection molding using a mold.
The corner piece 16 can be manufactured by processing the same material as the substrate holding member 14 in the same manner.

A substrate holding frame 10 having a size of 1500 mm × 1850 mm was manufactured using an aluminum alloy material. First, a metal frame having a cross-sectional shape shown in FIG. 2 was manufactured by hollow extrusion.
The left and right metal frame portions 11a and 11b were used as they were, but the front and rear metal frame portions 11c and 11d were subjected to bending after being extruded. The bending amount D (see FIGS. 4 and 5) was set to 100 mm to 150 mm. The thickness (step pitch) d of the metal frame portion 11 was 10 mm, the metal frame width W1 was 30 mm, and the width W2 of the second fitting portion 12b was 20 mm. The thickness of each part was changed from 3 mm to 5 mm.

Resin tape with spacer function is bonded to the smooth flat or curved surfaces, the metal frame upper surface, the first fitting upper surface, the substrate support upper surface, and the handle upper surface of the left and right metal frames by heat-sealing. It was.
The resin tape 17 is composed of a first resin functional layer 171 and a second resin functional layer 172 on the first resin functional layer 171. The first resin functional layer comprises titanium oxide fine particles having a particle size of 50 nm to 400 nm in ethylene-propylene. The layer was dispersed in the copolymer resin, and the film thickness was 150 μm.

  The second resin functional layer of the resin tape is a layer in which barium sulfate particles and silicon oxide fine particles are dispersed in an acrylic resin, and a barium sulfate particle mass of 0.1 μm or more and 3 μm or less and an oxidation of 0.1 μm or less. It is a layer in which fine particles of silicon are dispersed, and is formed on the first resin functional layer with a film thickness of 3 μm.

Asperities of about 1 μm were formed on the surface formed by the barium sulfate agglomerates coated with acrylic resin.
The resin tape material was thermally fused at 120 ° C. for 30 seconds with the first resin functional layer pressed against the upper surface of the aluminum metal frame to form a spacer layer.

  The metal frame portions at the four corners were processed and connected so as to be fitted into the corner piece 16 made of polyamide resin. A substrate holding member 14 made of polypropylene resin was mounted on the surface of the substrate support portion 13. The outer shape of the completed substrate holding frame 10 was about 1670 mm × 1980 mm.

The transfer test of the substrate A (thickness 0.7 mm, 1500 mm × 1850 mm glass substrate) was performed using the completed substrate holding frame 10 and the above-mentioned transfer platform. However, the substrate was smoothly transferred and received. It was confirmed that it was possible. The amount of bending of the substrate A was set to about 120 mm.
Further, even when the package body of the substrate was stored for a long time, the frame body did not stick, and generation of dust caused by the resin layer was not observed.

DESCRIPTION OF SYMBOLS 10 Board | substrate holding frame 11 Metal frame part 12a 1st fitting part 12b 2nd fitting part 13 Board | substrate support part 14 Board | substrate holding member 15 Handle part 16 Corner piece 17 Resin layer 20 Top cover 21 Surface plate 22 Bundling mechanism 23 Bundling Belt 30 Inner pallet 40 Anti-vibration pallet 100 Multi-layer stack A of frames A Substrate D Metal frame Bending amount M Metal frame surface 171 First resin functional layer 172 Second resin functional layer B Barium sulfate particles S Silicon oxide particles T Oxidation Titanium particles

Claims (12)

One rectangular substrate is stored in a substrate holding frame having a rectangular metal frame portion in plan view, and the frame in the state where the substrate is stored is aligned and stacked in multiple stages. Or a substrate holding frame for storage purposes,
(1) a metal frame having a square or rectangular cross-sectional shape;
(2) a first fitting portion which is provided on the upper surface side of the inner peripheral surface of the metal frame portion and has a form inclined to the lower side of the inner periphery, and a substrate support portion formed to extend further ahead;
(3) a second fitting portion that is provided on the lower surface side of the inner peripheral surface of the metal frame portion and has a form inclined to the inner peripheral lower side;
(4) a handle portion that extends from the left and right sides of the metal frame portion to the outer peripheral side, and
The upper surface of the metal frame portion, the upper surface of the first fitting portion, the upper surface of the substrate support portion, and the upper surface of the handle portion are the same continuous plane without grooves, step portions, and ridge lines between the upper surfaces of the portions, and A part of any one of the upper surface of the metal frame portion, the upper surface of the portion of the first fitting portion that comes into contact with the lower surface of the second fitting portion, and the upper surface of the handle portion. Or the board | substrate holding frame which has the resin layer of the uniform thickness which has the rigidity containing a filler in the whole surface. The resin layer has a spacer function to prevent the metal frames from coming into contact with each other. The resin layer has a first resin functional layer that has rigidity and prevents deformation, and has a concavo-convex shape on the surface and is stacked. The substrate holding frame according to claim 1, comprising a second resin functional layer that prevents sticking between the frames. The second resin functional layer is a layer having a function of preventing sticking between stacked substrate holding frames and a layer having a function of preventing lateral displacement. A substrate holding frame. 4. The substrate holding frame according to claim 3, wherein the second resin functional layer is a functional layer that prevents generation of static electricity of the stacked metal frames. 5. The substrate holding frame according to claim 2, wherein the resin layer is a resin tape in which a first resin functional layer and a second resin functional layer are integrated. body. The total thickness of said 1st resin functional layer and 2nd resin functional layer is 70 micrometers or more and is 400 micrometers or less, The board | substrate in any one of Claims 1 thru | or 5 characterized by the above-mentioned. Holding frame. The frame for holding a substrate according to any one of claims 1 to 6, wherein the metal frame is made of aluminum or an aluminum alloy. In the resin tape, the first resin functional layer is made of a resin having a heat pressure fusion property to the metal frame, and the second resin functional layer is made of a resin having no heat pressure fusion property to the metal frame. The frame for holding a substrate according to any one of claims 5 to 7, wherein the frame is for holding a substrate. The resin of the first resin functional layer is made of an ethylene-propylene copolymer resin, the layer thickness is 60 μm or more and 400 μm or less, and the filler in the resin layer is titanium oxide having a particle size of 50 nm or more and 400 nm or less. The substrate holding frame according to any one of claims 2 to 8, wherein the first resin functional layer is contained in an amount of 3% by mass or more and 5% by mass or less. The resin of the second resin functional layer is an acrylic resin, the layer thickness is 2 μm or more and 4 μm or less, and the filler in the resin layer is a barium sulfate agglomerate having a particle size of 0.1 μm or more and 3 μm or less 10. The silicon oxide particles of 0.1 μm or less, and contained in the second resin functional layer in an amount of 70% by mass or more and 90% by mass or less. The substrate holding frame described in the item. A substrate holding frame in a state where a substrate is placed on the substrate holding frame described in any one of claims 1 to 10 via a resin layer on a smooth metal frame. Stacked in multiple stages by fitting the fitting parts, the upper lid fitting part is fitted and sealed to the fitting part of the uppermost substrate holding frame, and the upper lid is not in contact with the board. Packing the board characterized in that the fitting part of the inner pallet is fitted and sealed to the fitting part of the holding frame, and the upper lid and the inner pallet are bound with a binding belt and transported on a vibration-proof pallet body. The substrate packaging body according to claim 11, wherein the substrate is a glass substrate or a plastic substrate used for a display device.

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