JP2015523742A5 - - Google Patents
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- Publication number
- JP2015523742A5 JP2015523742A5 JP2015525599A JP2015525599A JP2015523742A5 JP 2015523742 A5 JP2015523742 A5 JP 2015523742A5 JP 2015525599 A JP2015525599 A JP 2015525599A JP 2015525599 A JP2015525599 A JP 2015525599A JP 2015523742 A5 JP2015523742 A5 JP 2015523742A5
- Authority
- JP
- Japan
- Prior art keywords
- microelectronic
- opening
- dielectric
- terminal
- front surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004377 microelectronic Methods 0.000 claims description 237
- 230000002093 peripheral Effects 0.000 claims description 95
- 239000000758 substrate Substances 0.000 claims description 41
- 230000001568 sexual Effects 0.000 claims 1
- 230000000712 assembly Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201213565613A | 2012-08-02 | 2012-08-02 | |
US13/565,613 | 2012-08-02 | ||
US13/741,890 US9013033B2 (en) | 2011-04-21 | 2013-01-15 | Multiple die face-down stacking for two or more die |
US13/741,890 | 2013-01-15 | ||
PCT/US2013/053240 WO2014022675A1 (en) | 2012-08-02 | 2013-08-01 | Multiple die face-down stacking for two or more die |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015523742A JP2015523742A (ja) | 2015-08-13 |
JP2015523742A5 true JP2015523742A5 (zh) | 2016-09-15 |
Family
ID=50028532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015525599A Pending JP2015523742A (ja) | 2012-08-02 | 2013-08-01 | 2以上のダイにおける複数ダイ・フェースダウン・スタッキング |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2880685A1 (zh) |
JP (1) | JP2015523742A (zh) |
KR (1) | KR20150040998A (zh) |
CN (1) | CN104718619A (zh) |
WO (1) | WO2014022675A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114040579B (zh) * | 2021-11-08 | 2023-12-22 | 艾科微电子(深圳)有限公司 | 电子器件及其制造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02174255A (ja) | 1988-12-27 | 1990-07-05 | Mitsubishi Electric Corp | 半導体集積回路装置 |
US5679977A (en) | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US5861666A (en) | 1995-08-30 | 1999-01-19 | Tessera, Inc. | Stacked chip assembly |
JP2004063767A (ja) * | 2002-07-29 | 2004-02-26 | Renesas Technology Corp | 半導体装置 |
US7462936B2 (en) | 2003-10-06 | 2008-12-09 | Tessera, Inc. | Formation of circuitry with modification of feature height |
US7061121B2 (en) * | 2003-11-12 | 2006-06-13 | Tessera, Inc. | Stacked microelectronic assemblies with central contacts |
JP4579258B2 (ja) * | 2007-01-18 | 2010-11-10 | 力成科技股▲分▼有限公司 | Bga型パッケージ |
JP2008277660A (ja) * | 2007-05-02 | 2008-11-13 | Powertech Technology Inc | Lga半導体実装構造 |
KR101479461B1 (ko) * | 2008-10-14 | 2015-01-06 | 삼성전자주식회사 | 적층 패키지 및 이의 제조 방법 |
US8553420B2 (en) * | 2010-10-19 | 2013-10-08 | Tessera, Inc. | Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics |
KR101061531B1 (ko) * | 2010-12-17 | 2011-09-01 | 테세라 리써치 엘엘씨 | 중앙 콘택을 구비하며 접지 또는 배전을 개선한 적층형 마이크로전자 조립체 |
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2013
- 2013-08-01 CN CN201380051357.6A patent/CN104718619A/zh active Pending
- 2013-08-01 KR KR1020157005424A patent/KR20150040998A/ko not_active Application Discontinuation
- 2013-08-01 WO PCT/US2013/053240 patent/WO2014022675A1/en active Application Filing
- 2013-08-01 EP EP13750213.4A patent/EP2880685A1/en not_active Withdrawn
- 2013-08-01 JP JP2015525599A patent/JP2015523742A/ja active Pending