JP2015522939A5 - - Google Patents

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Publication number
JP2015522939A5
JP2015522939A5 JP2015509061A JP2015509061A JP2015522939A5 JP 2015522939 A5 JP2015522939 A5 JP 2015522939A5 JP 2015509061 A JP2015509061 A JP 2015509061A JP 2015509061 A JP2015509061 A JP 2015509061A JP 2015522939 A5 JP2015522939 A5 JP 2015522939A5
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JP
Japan
Prior art keywords
lamp
reflector
lamp head
passages
monolithic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015509061A
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English (en)
Japanese (ja)
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JP2015522939A (ja
JP6637312B2 (ja
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Publication date
Priority claimed from US13/865,672 external-priority patent/US10202707B2/en
Application filed filed Critical
Publication of JP2015522939A publication Critical patent/JP2015522939A/ja
Publication of JP2015522939A5 publication Critical patent/JP2015522939A5/ja
Application granted granted Critical
Publication of JP6637312B2 publication Critical patent/JP6637312B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015509061A 2012-04-26 2013-04-22 温度管理を備えるランプヘッドを有する基板処理システム Active JP6637312B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261638619P 2012-04-26 2012-04-26
US61/638,619 2012-04-26
US201261707938P 2012-09-29 2012-09-29
US61/707,938 2012-09-29
US13/865,672 US10202707B2 (en) 2012-04-26 2013-04-18 Substrate processing system with lamphead having temperature management
US13/865,672 2013-04-18
PCT/US2013/037585 WO2013163080A1 (en) 2012-04-26 2013-04-22 Substrate processing system with lamphead having temperature management

Publications (3)

Publication Number Publication Date
JP2015522939A JP2015522939A (ja) 2015-08-06
JP2015522939A5 true JP2015522939A5 (cg-RX-API-DMAC7.html) 2016-06-30
JP6637312B2 JP6637312B2 (ja) 2020-01-29

Family

ID=49483801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015509061A Active JP6637312B2 (ja) 2012-04-26 2013-04-22 温度管理を備えるランプヘッドを有する基板処理システム

Country Status (6)

Country Link
US (1) US10202707B2 (cg-RX-API-DMAC7.html)
JP (1) JP6637312B2 (cg-RX-API-DMAC7.html)
KR (1) KR102108408B1 (cg-RX-API-DMAC7.html)
CN (1) CN104246969B (cg-RX-API-DMAC7.html)
TW (1) TWI646298B (cg-RX-API-DMAC7.html)
WO (1) WO2013163080A1 (cg-RX-API-DMAC7.html)

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
KR102228941B1 (ko) * 2013-11-22 2021-03-17 어플라이드 머티어리얼스, 인코포레이티드 접근이 용이한 램프헤드
US10053777B2 (en) 2014-03-19 2018-08-21 Applied Materials, Inc. Thermal processing chamber
CN107620893A (zh) * 2017-08-31 2018-01-23 江苏米优光电科技有限公司 一种透气散热型户外全彩led贴片灯组及其生产工艺
KR102699383B1 (ko) 2019-04-18 2024-08-26 삼성전자주식회사 웨이퍼 클리닝 장치
US11680338B2 (en) * 2019-12-19 2023-06-20 Applied Materials, Inc. Linear lamp array for improved thermal uniformity and profile control
EP4337814A4 (en) * 2021-05-11 2025-10-08 Applied Materials Inc GAS INJECTOR FOR EPITAXY AND CHEMICAL VAPOR DEPOSITION CHAMBER
US12060651B2 (en) 2021-05-11 2024-08-13 Applied Materials, Inc. Chamber architecture for epitaxial deposition and advanced epitaxial film applications
US12091749B2 (en) 2021-05-11 2024-09-17 Applied Materials, Inc. Method for epitaxially depositing a material on a substrate by flowing a process gas across the substrate from an upper gas inlet to an upper gas outlet and flowing a purge gas from a lower gas inlet to a lower gas outlet
US12018372B2 (en) 2021-05-11 2024-06-25 Applied Materials, Inc. Gas injector for epitaxy and CVD chamber
US20220367216A1 (en) * 2021-05-11 2022-11-17 Applied Materials, Inc. Multi-zone lamp heating and temperature monitoring in epitaxy process chamber
JP7667310B2 (ja) * 2021-06-09 2025-04-22 アプライド マテリアルズ インコーポレイテッド 両口金形ランプを用いた軸対称加熱アセンブリレイアウト
CN115161764B (zh) * 2022-06-23 2024-02-06 江苏天芯微半导体设备有限公司 一种控温装置及其外延设备

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US4047496A (en) * 1974-05-31 1977-09-13 Applied Materials, Inc. Epitaxial radiation heated reactor
US5156820A (en) * 1989-05-15 1992-10-20 Rapro Technology, Inc. Reaction chamber with controlled radiant energy heating and distributed reactant flow
US5002630A (en) 1989-06-06 1991-03-26 Rapro Technology Method for high temperature thermal processing with reduced convective heat loss
US5108792A (en) 1990-03-09 1992-04-28 Applied Materials, Inc. Double-dome reactor for semiconductor processing
JPH04297581A (ja) 1991-03-15 1992-10-21 Mitsubishi Electric Corp 光気相成長装置
JPH0845863A (ja) 1994-07-27 1996-02-16 Touyoko Kagaku Kk 半導体基板の枚葉式熱処理装置
JPH09237763A (ja) 1996-02-28 1997-09-09 Tokyo Electron Ltd 枚葉式の熱処理装置
US6121579A (en) * 1996-02-28 2000-09-19 Tokyo Electron Limited Heating apparatus, and processing apparatus
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US6007635A (en) * 1997-11-26 1999-12-28 Micro C Technologies, Inc. Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing
JP3438658B2 (ja) * 1999-07-22 2003-08-18 ウシオ電機株式会社 ランプユニット及び光照射式加熱装置
JP2005222962A (ja) * 2000-04-20 2005-08-18 Tokyo Electron Ltd 熱処理装置及びその方法
KR100509085B1 (ko) 2000-04-20 2005-08-18 동경 엘렉트론 주식회사 열 처리 시스템
US6476362B1 (en) * 2000-09-12 2002-11-05 Applied Materials, Inc. Lamp array for thermal processing chamber
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US7075037B2 (en) 2001-03-02 2006-07-11 Tokyo Electron Limited Heat treatment apparatus using a lamp for rapidly and uniformly heating a wafer
JP2002270533A (ja) 2001-03-14 2002-09-20 Tokyo Electron Ltd 熱処理装置及びランプ出力制御方法
JP2003022982A (ja) 2001-07-09 2003-01-24 Tokyo Electron Ltd 熱処理装置
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US7860379B2 (en) 2007-01-15 2010-12-28 Applied Materials, Inc. Temperature measurement and control of wafer support in thermal processing chamber
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US8314368B2 (en) * 2008-02-22 2012-11-20 Applied Materials, Inc. Silver reflectors for semiconductor processing chambers
KR101458001B1 (ko) 2008-06-17 2014-11-04 주성엔지니어링(주) 기판 처리 장치
US8294068B2 (en) * 2008-09-10 2012-10-23 Applied Materials, Inc. Rapid thermal processing lamphead with improved cooling
US20120145697A1 (en) 2009-08-18 2012-06-14 Tokyo Electron Limmited Heat treatment apparatus

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