JP2015522715A5 - - Google Patents

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Publication number
JP2015522715A5
JP2015522715A5 JP2015518864A JP2015518864A JP2015522715A5 JP 2015522715 A5 JP2015522715 A5 JP 2015522715A5 JP 2015518864 A JP2015518864 A JP 2015518864A JP 2015518864 A JP2015518864 A JP 2015518864A JP 2015522715 A5 JP2015522715 A5 JP 2015522715A5
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JP
Japan
Prior art keywords
magnet
adjacent
polarity
assemblies
cathode
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JP2015518864A
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English (en)
Japanese (ja)
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JP6113841B2 (ja
JP2015522715A (ja
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Priority claimed from PCT/EP2012/062836 external-priority patent/WO2014005617A1/en
Publication of JP2015522715A publication Critical patent/JP2015522715A/ja
Publication of JP2015522715A5 publication Critical patent/JP2015522715A5/ja
Application granted granted Critical
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JP2015518864A 2012-07-02 2012-07-02 基板上にスパッタリングされた材料の層をコーティングするための装置及び堆積システム Active JP6113841B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/062836 WO2014005617A1 (en) 2012-07-02 2012-07-02 Apparatus for coating a layer of sputtered material on a substrate and deposition system

Publications (3)

Publication Number Publication Date
JP2015522715A JP2015522715A (ja) 2015-08-06
JP2015522715A5 true JP2015522715A5 (zh) 2015-09-17
JP6113841B2 JP6113841B2 (ja) 2017-04-12

Family

ID=46395630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015518864A Active JP6113841B2 (ja) 2012-07-02 2012-07-02 基板上にスパッタリングされた材料の層をコーティングするための装置及び堆積システム

Country Status (6)

Country Link
EP (1) EP2867916A1 (zh)
JP (1) JP6113841B2 (zh)
KR (1) KR101920840B1 (zh)
CN (1) CN104704603B (zh)
TW (1) TWI627297B (zh)
WO (1) WO2014005617A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103993273B (zh) * 2014-05-09 2016-01-27 浙江上方电子装备有限公司 一种动静混合镀膜系统及利用其进行动静混合镀膜的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
GB9006073D0 (en) * 1990-03-17 1990-05-16 D G Teer Coating Services Limi Magnetron sputter ion plating
DE4038497C1 (zh) 1990-12-03 1992-02-20 Leybold Ag, 6450 Hanau, De
KR950000906B1 (ko) * 1991-08-02 1995-02-03 니찌덴 아넬바 가부시기가이샤 스퍼터링장치
ES2202439T3 (es) * 1995-04-25 2004-04-01 Von Ardenne Anlagentechnik Gmbh Sistema de pulverizacion que utiliza un magnetron cilindrico rotativo alimentado electricamente utilizando corriente alterna.
WO1998013532A1 (en) * 1996-09-24 1998-04-02 Deposition Sciences, Inc. A multiple target arrangement for decreasing the intensity and severity of arcing in dc sputtering
GB0503401D0 (en) * 2005-02-18 2005-03-30 Applied Multilayers Ltd Apparatus and method for the application of material layer to display devices
CN201614406U (zh) * 2008-08-27 2010-10-27 梯尔涂层有限公司 沉积材料形成镀层的设备

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