JP6113841B2 - 基板上にスパッタリングされた材料の層をコーティングするための装置及び堆積システム - Google Patents

基板上にスパッタリングされた材料の層をコーティングするための装置及び堆積システム Download PDF

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Publication number
JP6113841B2
JP6113841B2 JP2015518864A JP2015518864A JP6113841B2 JP 6113841 B2 JP6113841 B2 JP 6113841B2 JP 2015518864 A JP2015518864 A JP 2015518864A JP 2015518864 A JP2015518864 A JP 2015518864A JP 6113841 B2 JP6113841 B2 JP 6113841B2
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Japan
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magnet
polarity
cathode
adjacent
assemblies
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JP2015518864A
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English (en)
Japanese (ja)
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JP2015522715A (ja
JP2015522715A5 (zh
Inventor
アンドレアス クルッペル，
アンドレアス クルッペル，
マルクス ハニカ，
マルクス ハニカ，
エヴリン シェア，
エヴリン シェア，
コンラート シュワニッツ，
コンラート シュワニッツ，
ファビオ ピエラリージ，
ファビオ ピエラリージ，
チエン リュー，
チエン リュー，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2015522715A publication Critical patent/JP2015522715A/ja
Publication of JP2015522715A5 publication Critical patent/JP2015522715A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2015518864A 2012-07-02 2012-07-02 基板上にスパッタリングされた材料の層をコーティングするための装置及び堆積システム Active JP6113841B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/062836 WO2014005617A1 (en) 2012-07-02 2012-07-02 Apparatus for coating a layer of sputtered material on a substrate and deposition system

Publications (3)

Publication Number Publication Date
JP2015522715A JP2015522715A (ja) 2015-08-06
JP2015522715A5 JP2015522715A5 (zh) 2015-09-17
JP6113841B2 true JP6113841B2 (ja) 2017-04-12

Family

ID=46395630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015518864A Active JP6113841B2 (ja) 2012-07-02 2012-07-02 基板上にスパッタリングされた材料の層をコーティングするための装置及び堆積システム

Country Status (6)

Country Link
EP (1) EP2867916A1 (zh)
JP (1) JP6113841B2 (zh)
KR (1) KR101920840B1 (zh)
CN (1) CN104704603B (zh)
TW (1) TWI627297B (zh)
WO (1) WO2014005617A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103993273B (zh) * 2014-05-09 2016-01-27 浙江上方电子装备有限公司 一种动静混合镀膜系统及利用其进行动静混合镀膜的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
GB9006073D0 (en) * 1990-03-17 1990-05-16 D G Teer Coating Services Limi Magnetron sputter ion plating
DE4038497C1 (zh) * 1990-12-03 1992-02-20 Leybold Ag, 6450 Hanau, De
KR950000906B1 (ko) * 1991-08-02 1995-02-03 니찌덴 아넬바 가부시기가이샤 스퍼터링장치
WO1996034124A1 (en) * 1995-04-25 1996-10-31 The Boc Group, Inc. Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
WO1998013532A1 (en) * 1996-09-24 1998-04-02 Deposition Sciences, Inc. A multiple target arrangement for decreasing the intensity and severity of arcing in dc sputtering
GB0503401D0 (en) * 2005-02-18 2005-03-30 Applied Multilayers Ltd Apparatus and method for the application of material layer to display devices
CN201614406U (zh) * 2008-08-27 2010-10-27 梯尔涂层有限公司 沉积材料形成镀层的设备

Also Published As

Publication number Publication date
KR20150037963A (ko) 2015-04-08
JP2015522715A (ja) 2015-08-06
TW201408804A (zh) 2014-03-01
KR101920840B1 (ko) 2018-11-21
CN104704603A (zh) 2015-06-10
WO2014005617A1 (en) 2014-01-09
EP2867916A1 (en) 2015-05-06
CN104704603B (zh) 2017-07-28
TWI627297B (zh) 2018-06-21

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