JP2015508234A5 - - Google Patents

Download PDF

Info

Publication number
JP2015508234A5
JP2015508234A5 JP2014556596A JP2014556596A JP2015508234A5 JP 2015508234 A5 JP2015508234 A5 JP 2015508234A5 JP 2014556596 A JP2014556596 A JP 2014556596A JP 2014556596 A JP2014556596 A JP 2014556596A JP 2015508234 A5 JP2015508234 A5 JP 2015508234A5
Authority
JP
Japan
Prior art keywords
flake
thickness
lamina
donor body
via hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014556596A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015508234A (ja
Filing date
Publication date
Priority claimed from US13/490,460 external-priority patent/US8629061B2/en
Application filed filed Critical
Publication of JP2015508234A publication Critical patent/JP2015508234A/ja
Publication of JP2015508234A5 publication Critical patent/JP2015508234A5/ja
Pending legal-status Critical Current

Links

JP2014556596A 2012-02-08 2013-02-05 電子デバイスの三次元実装のための方法 Pending JP2015508234A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261596696P 2012-02-08 2012-02-08
US61/596,696 2012-02-08
US13/490,460 2012-06-07
US13/490,460 US8629061B2 (en) 2012-02-08 2012-06-07 Method for three-dimensional packaging of electronic devices
PCT/US2013/024685 WO2013119514A1 (en) 2012-02-08 2013-02-05 Method for three-dimensional packaging of electronic devices

Publications (2)

Publication Number Publication Date
JP2015508234A JP2015508234A (ja) 2015-03-16
JP2015508234A5 true JP2015508234A5 (enExample) 2016-03-10

Family

ID=48903255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014556596A Pending JP2015508234A (ja) 2012-02-08 2013-02-05 電子デバイスの三次元実装のための方法

Country Status (6)

Country Link
US (1) US8629061B2 (enExample)
EP (1) EP2812918A4 (enExample)
JP (1) JP2015508234A (enExample)
KR (1) KR20140123575A (enExample)
TW (1) TW201336041A (enExample)
WO (1) WO2013119514A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9576868B2 (en) * 2012-07-30 2017-02-21 General Electric Company Semiconductor device and method for reduced bias temperature instability (BTI) in silicon carbide devices
US8916038B2 (en) * 2013-03-13 2014-12-23 Gtat Corporation Free-standing metallic article for semiconductors
US8936709B2 (en) 2013-03-13 2015-01-20 Gtat Corporation Adaptable free-standing metallic article for semiconductors
TWI594380B (zh) 2015-05-21 2017-08-01 穩懋半導體股份有限公司 封裝結構及三維封裝結構
WO2019185846A1 (en) * 2018-03-29 2019-10-03 Koninklijke Philips N.V. X-ray radiation detector with a porous silicon interposer

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236862A (en) 1992-12-03 1993-08-17 Motorola, Inc. Method of forming oxide isolation
US6544862B1 (en) 2000-01-14 2003-04-08 Silicon Genesis Corporation Particle distribution method and resulting structure for a layer transfer process
JP3904484B2 (ja) * 2002-06-19 2007-04-11 新光電気工業株式会社 シリコン基板のスルーホールプラギング方法
JP2006351935A (ja) * 2005-06-17 2006-12-28 Shinko Electric Ind Co Ltd 半導体チップ実装基板及びそれを用いた半導体装置
US7713835B2 (en) 2006-10-06 2010-05-11 Brewer Science Inc. Thermally decomposable spin-on bonding compositions for temporary wafer bonding
US20080284037A1 (en) * 2007-05-15 2008-11-20 Andry Paul S Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers
US7825517B2 (en) 2007-07-16 2010-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method for packaging semiconductor dies having through-silicon vias
US8143511B2 (en) 2007-09-13 2012-03-27 Silicon China (Hk) Limited Texture process and structure for manufacture of composite photovoltaic device substrates
US8338209B2 (en) 2008-08-10 2012-12-25 Twin Creeks Technologies, Inc. Photovoltaic cell comprising a thin lamina having a rear junction and method of making
US8097525B2 (en) 2008-08-29 2012-01-17 International Business Machines Corporation Vertical through-silicon via for a semiconductor structure
GB0817831D0 (en) 2008-09-30 2008-11-05 Cambridge Silicon Radio Ltd Improved packaging technology
US8049327B2 (en) 2009-01-05 2011-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Through-silicon via with scalloped sidewalls
US7964431B2 (en) 2009-03-19 2011-06-21 Twin Creeks Technologies, Inc. Method to make electrical contact to a bonded face of a photovoltaic cell
US8395191B2 (en) * 2009-10-12 2013-03-12 Monolithic 3D Inc. Semiconductor device and structure
KR101604607B1 (ko) 2009-10-26 2016-03-18 삼성전자주식회사 반도체 장치 및 반도체 장치의 제조 방법
US9099526B2 (en) 2010-02-16 2015-08-04 Monolithic 3D Inc. Integrated circuit device and structure
WO2012061304A1 (en) 2010-11-02 2012-05-10 Georgia Tech Research Corporation Ultra-thin interposer assemblies with through vias

Similar Documents

Publication Publication Date Title
USD724243S1 (en) Exterior surface configuration for a vehicle taillight
USD736704S1 (en) USB charger for electronic cigarette device
USD694652S1 (en) Alarm clock
USD737930S1 (en) Handshower
USD743827S1 (en) Watch face
USD704274S1 (en) Game machine
USD754584S1 (en) Hublock
USD719245S1 (en) Toilet
USD789197S1 (en) Package with surface ornamentation
USD751705S1 (en) Syringe
USD718029S1 (en) Footwear with grid pattern
USD765010S1 (en) Aircraft with applied surface pattern
USD708083S1 (en) PH meter with surface ornamentation
USD719922S1 (en) Electrical connector
BR112016006536A2 (pt) pinos perfuradores, soquetes associados, e métodos de formação de soquetes mediante o uso de pinos perfuradores
JP2015508234A5 (enExample)
USD701965S1 (en) Ultrasound probe
MY185793A (en) Absorbent article and wearable article including absorbent article
USD741810S1 (en) Electrical connector
USD751005S1 (en) Automobile exterior
USD746822S1 (en) Connector embedded in clothing
TWD171504S (zh) 電連接器外殼
TWD171516S (zh) 電連接器外殼
USD776402S1 (en) Shirt
USD709456S1 (en) Electrical connector