JP2015507825A5 - - Google Patents

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Publication number
JP2015507825A5
JP2015507825A5 JP2014549599A JP2014549599A JP2015507825A5 JP 2015507825 A5 JP2015507825 A5 JP 2015507825A5 JP 2014549599 A JP2014549599 A JP 2014549599A JP 2014549599 A JP2014549599 A JP 2014549599A JP 2015507825 A5 JP2015507825 A5 JP 2015507825A5
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JP
Japan
Prior art keywords
emitting diode
light emitting
lighting assembly
assembly
primary thermal
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Application number
JP2014549599A
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English (en)
Japanese (ja)
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JP6038175B2 (ja
JP2015507825A (ja
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Priority claimed from PCT/IB2012/057596 external-priority patent/WO2013102823A1/en
Publication of JP2015507825A publication Critical patent/JP2015507825A/ja
Publication of JP2015507825A5 publication Critical patent/JP2015507825A5/ja
Application granted granted Critical
Publication of JP6038175B2 publication Critical patent/JP6038175B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014549599A 2012-01-03 2012-12-21 照明アセンブリ、光源、及び照明器具 Expired - Fee Related JP6038175B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261582560P 2012-01-03 2012-01-03
US61/582,560 2012-01-03
PCT/IB2012/057596 WO2013102823A1 (en) 2012-01-03 2012-12-21 A lighting assembly, a light source and a luminaire

Publications (3)

Publication Number Publication Date
JP2015507825A JP2015507825A (ja) 2015-03-12
JP2015507825A5 true JP2015507825A5 (cg-RX-API-DMAC7.html) 2016-02-12
JP6038175B2 JP6038175B2 (ja) 2016-12-07

Family

ID=47747695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014549599A Expired - Fee Related JP6038175B2 (ja) 2012-01-03 2012-12-21 照明アセンブリ、光源、及び照明器具

Country Status (5)

Country Link
US (1) US9874316B2 (cg-RX-API-DMAC7.html)
EP (1) EP2800925B1 (cg-RX-API-DMAC7.html)
JP (1) JP6038175B2 (cg-RX-API-DMAC7.html)
CN (1) CN104024722B (cg-RX-API-DMAC7.html)
WO (1) WO2013102823A1 (cg-RX-API-DMAC7.html)

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US9326338B2 (en) 2013-06-21 2016-04-26 Micron Technology, Inc. Multi-junction solid state transducer devices for direct AC power and associated systems and methods
CN105706537B (zh) 2013-11-05 2019-11-01 飞利浦照明控股有限公司 组件和制造组件的方法
US10024530B2 (en) * 2014-07-03 2018-07-17 Sansi Led Lighting Inc. Lighting device and LED luminaire
CN104302102A (zh) * 2014-09-26 2015-01-21 中国科学院长春光学精密机械与物理研究所 一种红外焦平面传感器无封装应用方法
DE102015106444A1 (de) * 2015-04-27 2016-10-27 Osram Opto Semiconductors Gmbh Optoelektronische Bauelementanordnung und Verfahren zur Herstellung einer Vielzahl von optoelektronischen Bauelementanordnungen
US10941926B2 (en) 2015-12-18 2021-03-09 Applied Electronic Materials, LLC Modular lighting system including light modules with integrated LED units
US20190120444A1 (en) * 2015-12-18 2019-04-25 Applied Electronic Materials, LLC Modular lighting system including light modules with integrated led units
CN111108818B (zh) * 2017-09-21 2022-06-28 京瓷Avx元器件公司 具有低热阻的电绝缘热连接器
RU2689301C1 (ru) * 2018-03-13 2019-05-27 Анатолий Павлович Бежко Светодиодный модуль для формирования светильника
KR102694329B1 (ko) 2018-12-10 2024-08-13 삼성전자주식회사 디스플레이 모듈, 이를 포함하는 디스플레이 장치 및 디스플레이 모듈 제조 방법
CN110690181A (zh) * 2019-10-15 2020-01-14 福建省信达光电科技有限公司 一种热电分离的led基板及其制造方法
US11293627B1 (en) * 2021-02-02 2022-04-05 Gary Lagasse Miniature LED lightbulb mounting device
WO2025183596A1 (ru) * 2024-02-26 2025-09-04 Сергей Вячеславович ОТРУБЯННИКОВ Модуль светодиодный для формирования светильника

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JP4646357B2 (ja) 2000-06-08 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
WO2004011848A2 (en) * 2002-07-25 2004-02-05 Dahm Jonathan S Method and apparatus for using light emitting diodes for curing
US20060043382A1 (en) * 2003-02-07 2006-03-02 Nobuyuki Matsui Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus
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JP4192742B2 (ja) * 2003-09-30 2008-12-10 豊田合成株式会社 発光装置
JP2006019319A (ja) * 2004-06-30 2006-01-19 C I Kasei Co Ltd 発光ダイオード組立体および発光ダイオード組立体の製造方法
US7303315B2 (en) * 2004-11-05 2007-12-04 3M Innovative Properties Company Illumination assembly using circuitized strips
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JP5146356B2 (ja) * 2009-02-24 2013-02-20 豊田合成株式会社 発光装置及びその製造方法
US8384097B2 (en) * 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
US8348460B2 (en) * 2009-05-01 2013-01-08 Abl Ip Holding Llc Lighting apparatus with several light units arranged in a heatsink
CN101929624A (zh) * 2009-06-25 2010-12-29 富士迈半导体精密工业（上海）有限公司 照明装置
CN201502903U (zh) 2009-09-29 2010-06-09 深圳市庄正电子技术有限公司 一种用于投影设备的led光源结构

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