JP2015502988A5 - - Google Patents
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- Publication number
- JP2015502988A5 JP2015502988A5 JP2014538842A JP2014538842A JP2015502988A5 JP 2015502988 A5 JP2015502988 A5 JP 2015502988A5 JP 2014538842 A JP2014538842 A JP 2014538842A JP 2014538842 A JP2014538842 A JP 2014538842A JP 2015502988 A5 JP2015502988 A5 JP 2015502988A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- adhesive material
- nonwoven fabric
- fabric substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 14
- 239000004745 nonwoven fabric Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive Effects 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 8
- 229910052759 nickel Inorganic materials 0.000 claims 4
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 230000000149 penetrating Effects 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- GSJVCJPEZMDJIW-UHFFFAOYSA-N copper;silver Chemical compound [Cu+2].[Ag+] GSJVCJPEZMDJIW-UHFFFAOYSA-N 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- ONVGIJBNBDUBCM-UHFFFAOYSA-N silver;silver Chemical compound [Ag].[Ag+] ONVGIJBNBDUBCM-UHFFFAOYSA-N 0.000 claims 1
- 239000004744 fabric Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
Description
導電性不織布接着剤層１２は、孔又は通路２２を有する非導電性不織布多孔質基材１６、第１の表面２４、及び第２の反対面２６を含む。不織布基材１６の通路２２は、導電性粒子２０が、不織布基材１６の第１の表面２４から第２の表面２６まで貫通することができるような大きさである。本明細書を通して「通路」という用語の使用は、孔又は通路を指す。好適な不織布基材材料の例としては、ポリエチレンテレフタレート（ＰＥＴ）布、ナイロン、ポリエステル、アクリル繊維、レーヨン、及びセルロースが挙げられるが、これらに限定されない。導電性不織布接着剤層１２は、不織基材布を含むものとして論じられるが、織布、メッシュ、多孔質膜、及び発泡体を含む、通路を有する任意の多孔質基材も使用してよい。金属又は炭素繊維系織布又は不織布もまた、用いられ得る。
Claims (3)
- 接着性材料と、
複数の通路を有する非導電性不織布基材であって、前記接着性材料中に埋め込まれている、非導電性不織布基材と、
前記非導電性不織布基材及び前記接着性材料を貫通する複数の導電性粒子であって、前記非導電性不織布基材の厚さと少なくとも同一又はそれよりも大きいＤ９９粒径を有する、導電性粒子と、を備える、導電性不織布接着剤層を含む、導電性両面テープ。 - 前記導電性粒子が、ニッケル、銅、錫、若しくはアルミニウム；銀コーティングされた銅、ニッケル、アルミニウム、錫、若しくは金；ニッケルコーティングされた銅若しくは銀；銀コーティング若しくはニッケルコーティングされたグラファイト、ガラス、セラミック、プラスチック、シリカ、エラストマー、若しくは雲母、又はこれらの組み合わせのうちの少なくとも１つを含む、請求項１に記載の導電性両面テープ。
- 接着性材料と、
前記接着性材料内に埋め込まれた不織布基材と、
前記接着性材料及び前記不織布基材を貫通する複数の導電性粒子であって、前記不織布基材の厚さと少なくとも同一又はそれよりも大きいＤ９９粒径を有する、導電性粒子と、
前記不織布基材に隣接して配置された金属層と、を含む、導電性片面テープ。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161551199P | 2011-10-25 | 2011-10-25 | |
| US61/551,199 | 2011-10-25 | ||
| PCT/US2012/060703 WO2013062836A1 (en) | 2011-10-25 | 2012-10-18 | Nonwoven adhesive tapes and articles therefrom |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015502988A JP2015502988A (ja) | 2015-01-29 |
| JP2015502988A5 true JP2015502988A5 (ja) | 2017-02-09 |
| JP6124905B2 JP6124905B2 (ja) | 2017-05-10 |
Family
ID=48168343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014538842A Active JP6124905B2 (ja) | 2011-10-25 | 2012-10-18 | 不織布接着剤テープ及びそれから作製される物品 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9426878B2 (ja) |
| JP (1) | JP6124905B2 (ja) |
| KR (1) | KR20140091456A (ja) |
| CN (1) | CN103201352B (ja) |
| TW (1) | TWI555815B (ja) |
| WO (1) | WO2013062836A1 (ja) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10568233B2 (en) | 2012-06-28 | 2020-02-18 | 3M Innovative Properties Company | Thermally conductive substrate article |
| JP6044822B2 (ja) * | 2012-08-09 | 2016-12-14 | Dic株式会社 | 熱伝導性粘着テープ |
| US20140196943A1 (en) * | 2013-01-11 | 2014-07-17 | Molex Incorporated | Resilient Adherent EMI Shielding Member |
| WO2014139126A1 (en) | 2013-03-14 | 2014-09-18 | Laird Technologies, Inc. | Flame-retardant electrically-conductive adhesive material and method of making the same |
| KR101557890B1 (ko) * | 2013-11-11 | 2015-10-12 | 주식회사 이에스디웍 | 열전도성 테이프 및 열전도성 테이프 제조 방법 |
| WO2015094780A1 (en) * | 2013-12-19 | 2015-06-25 | 3M Innovative Properties Company | Electrically conductive adhesive tapes and articles therefrom |
| KR20160099594A (ko) * | 2013-12-19 | 2016-08-22 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전기 전도성 접착제 테이프 및 그로부터의 물품 |
| US20160333232A1 (en) * | 2014-01-24 | 2016-11-17 | 3M Innovative Properties Company | Electrically conductive adhesive tapes and articles therefrom |
| JP2016092193A (ja) * | 2014-11-04 | 2016-05-23 | 日東電工株式会社 | 貼着型導電性緩衝材 |
| JP2016108438A (ja) * | 2014-12-05 | 2016-06-20 | Dic株式会社 | 熱伝導性粘着テープ及び物品 |
| TWI608789B (zh) * | 2015-03-27 | 2017-12-11 | 台虹科技股份有限公司 | 電磁波遮蔽膜及具電磁波遮蔽功能的電路板 |
| DE102015107743A1 (de) | 2015-05-18 | 2016-11-24 | Bsn Medical Gmbh | Silikongelbeschichtete adhäsive Schichtstruktur |
| US9418959B1 (en) * | 2015-07-08 | 2016-08-16 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems of bonded substrates |
| CN105419674B (zh) * | 2016-01-18 | 2017-12-05 | 杨宜丰 | 一种漂浮式全方位导电胶膜 |
| KR20190016113A (ko) * | 2016-06-21 | 2019-02-15 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 자가 지지형 안테나 |
| JP6778549B2 (ja) * | 2016-08-25 | 2020-11-04 | セーレン株式会社 | 接続方法および導電性布帛 |
| WO2018096389A1 (en) * | 2016-11-25 | 2018-05-31 | Draudins Kristaps | An electrically conductive multi-layer material for leak detection application |
| MY194354A (en) * | 2016-12-21 | 2022-11-29 | Furukawa Electric Co Ltd | Joining film and tape for wafer processing |
| JP2018104251A (ja) * | 2016-12-28 | 2018-07-05 | パナソニックＩｐマネジメント株式会社 | 炭素・金属複合材とそれが添加されたゴム組成物および樹脂組成物 |
| CN108913057B (zh) | 2017-03-27 | 2023-11-10 | 昆山雅森电子材料科技有限公司 | 一种多层异向型导电布胶及其制作方法 |
| KR102346866B1 (ko) * | 2017-05-09 | 2022-01-04 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전기 전도성 접착제 |
| CN111647362A (zh) * | 2020-07-10 | 2020-09-11 | 东莞捷邦实业有限公司 | 一种用于电子线路板的导电双面胶组件及其生产工艺 |
Family Cites Families (33)
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| US2808352A (en) | 1951-03-22 | 1957-10-01 | Burgess Battery Co | Electrically conductive adhesive tape |
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| CN101323759B (zh) * | 2007-06-15 | 2014-10-08 | 清华大学 | 导电胶带及其制造方法 |
| JP5280034B2 (ja) * | 2007-10-10 | 2013-09-04 | 日東電工株式会社 | 配線回路基板用両面粘着テープ又はシートおよび配線回路基板 |
| KR20090067964A (ko) * | 2007-12-21 | 2009-06-25 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 점착 테이프 및 그 제조방법 |
-
2012
- 2012-10-18 WO PCT/US2012/060703 patent/WO2013062836A1/en active Application Filing
- 2012-10-18 KR KR1020137004116A patent/KR20140091456A/ko not_active Application Discontinuation
- 2012-10-18 CN CN201280002356.8A patent/CN103201352B/zh active Active
- 2012-10-18 JP JP2014538842A patent/JP6124905B2/ja active Active
- 2012-10-18 US US13/811,681 patent/US9426878B2/en active Active
- 2012-10-24 TW TW101139340A patent/TWI555815B/zh not_active IP Right Cessation
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