JP2015226051A - Method for manufacturing flexible display device - Google Patents

Method for manufacturing flexible display device Download PDF

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JP2015226051A
JP2015226051A JP2014170351A JP2014170351A JP2015226051A JP 2015226051 A JP2015226051 A JP 2015226051A JP 2014170351 A JP2014170351 A JP 2014170351A JP 2014170351 A JP2014170351 A JP 2014170351A JP 2015226051 A JP2015226051 A JP 2015226051A
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release layer
flexible
display device
substrate
flexible substrate
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JP5932919B2 (en
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淑 ▲メイ▼ 陳
Shuwei Chen
淑 ▲メイ▼ 陳
秉 彝 施
Pingi Shih
秉 彝 施
煥 熏 謝
Huanhsun Hsieh
煥 熏 謝
成 沛 黄
Chengpei Huang
成 沛 黄
家 得 卓
Chiate Cho
家 得 卓
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EverDisplay Optronics Shanghai Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13454—Drivers integrated on the active matrix substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible display device capable of solving the problem in which a coupling region is easily damaged when a flexible substrate is removed.SOLUTION: A method for manufacturing a flexible display device includes the steps of: preparing a base substrate 6 and forming release layers 7a and 7b including a first release layer 7a and a second release layer 7b having a stronger release force than the first release layer 7a on the base substrate 6; forming a flexible substrate 2a including a coupling region 2b corresponding to the first release layer 7a and a non-coupling region corresponding to the second release layer 7b on the release layers 7a and 7b; coupling a drive integrated circuit (IC) 3 and a flexible printed circuit board (FPC) 4 to the coupling region 2b of the flexible substrate 2a; and removing the flexible substrate 2a to which the drive integrated circuit 3 and the flexible printed circuit board 4 are coupled.

Description

本発明はフレキシブル表示装置の製造方法に関するものであり、特に、フレキシブル基板の結合領域及び非結合領域に対しそれぞれ異なる離型層を用いるフレキシブル表示装置の製造方法に関するものである。   The present invention relates to a method for manufacturing a flexible display device, and more particularly, to a method for manufacturing a flexible display device using different release layers for the bonding region and the non-bonding region of a flexible substrate.

フレキシブル表示装置は、新世代の表示装置として、薄くて軽量で、高いコントラスト、快速な応答、広い画角、高い輝度、フルカラーなどの利点を備えており、携帯電話、パーソナルデジタルアシスタント（ＰＤＡ）、デジタルカメラ、車載表示装置、ノートパソコン、壁掛けタイプテレビ及び軍事分野などにおける広い応用が予想される。   As a new generation display device, the flexible display device has advantages such as thin and light, high contrast, quick response, wide angle of view, high brightness, full color, mobile phone, personal digital assistant (PDA), Wide applications are expected in the fields of digital cameras, in-vehicle display devices, notebook computers, wall-mounted televisions, and military fields.

図１に示すように、従来のフレキシブル表示装置１は表示パネル２を備える。当該表示パネル２のフレキシブル基板２ａは結合領域２ｂを備え、フレキシブル基板２ａの結合領域２ｂには駆動集積回路（ＩＣ）３が電気的に接続される。フレキシブル印刷回路基板（Ｆｌｅｘｉｂｌｅ Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ，ＦＰＣ）４は、その一端がフレキシブル基板２ａの結合領域２ｂに電気的に接続されるとともに駆動集積回路（ＩＣ）３にも電気的に接続され、もう一端が印刷回路基板（Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ，ＰＣＢ）５に電気的に接続される。   As shown in FIG. 1, the conventional flexible display device 1 includes a display panel 2. The flexible substrate 2a of the display panel 2 includes a coupling region 2b, and a driving integrated circuit (IC) 3 is electrically connected to the coupling region 2b of the flexible substrate 2a. One end of a flexible printed circuit board (Flexible Printed Circuit, FPC) 4 is electrically connected to the coupling region 2b of the flexible board 2a and is also electrically connected to the driving integrated circuit (IC) 3, and the other end It is electrically connected to a printed circuit board (PCB) 5.

従来のフレキシブル表示装置１の製造方法は、図２に示すように、ベース基板６上に離型層（未図示）を形成するステップと、離型層上にフレキシブル基板２ａを形成するステップと、フレキシブル基板２ａ上に駆動集積回路３及びフレキシブル印刷回路基板４を結合させるステップと、フレキシブル基板２ａを取り外すステップを含む。当該方法によれば、前記結合の前にフレキシブル基板２ａを取り外すことにより結合領域２ｂが変形し、結合のための位置合わせが難しくなってしまう問題を回避することができる。しかしながら、ＩＣ３／ＦＰＣ４を結合させてからフレキシブル基板２ａを取り外す方法の場合、フレキシブル基板２ａを取り外すとき、フレキシブル基板２ａがＩＣ３及びＦＰＣ４中の固体部品により破損されてしまい、表示パネル２の不良率が非常に高くなるとともに、不良表示パネル２は、その復原が不可であり、直接廃棄処分するしかない。   As shown in FIG. 2, the conventional manufacturing method of the flexible display device 1 includes a step of forming a release layer (not shown) on the base substrate 6, a step of forming the flexible substrate 2a on the release layer, The step includes coupling the driving integrated circuit 3 and the flexible printed circuit board 4 on the flexible board 2a, and removing the flexible board 2a. According to this method, it is possible to avoid the problem that the coupling region 2b is deformed by removing the flexible substrate 2a before the coupling and the alignment for the coupling becomes difficult. However, in the method of removing the flexible substrate 2a after combining the IC3 / FPC4, when removing the flexible substrate 2a, the flexible substrate 2a is damaged by solid components in the IC3 and the FPC4, and the defect rate of the display panel 2 is increased. As it becomes very high, the defective display panel 2 cannot be restored and must be disposed of directly.

本発明は、フレキシブル基板を取り外すときその結合領域が破損されやすい問題を解決するためのフレキシブル表示装置の製造方法を提供する。   The present invention provides a method for manufacturing a flexible display device for solving the problem that a bonding region is easily damaged when a flexible substrate is removed.

本発明のほかの局面及び利点は、以下の説明において部分的に言及され、以下の説明により明らかになるか、または本発明の実践により理解されるだろう。   Other aspects and advantages of the invention will be set forth in part in the description which follows, and will be apparent from the description, or will be understood by practice of the invention.

本発明の一局面に係るフレキシブル表示装置の製造方法は、ベース基板を用意して、前記ベース基板上に、第１の離型層と離型力が前記第１の離型層の離型力より強い第２の離型層とを含む離型層を形成するステップと、前記離型層上に、前記第１の離型層に対応する結合領域と前記第２の離型層に対応する非結合領域とを含むフレキシブル基板を形成するステップと、前記フレキシブル基板の前記結合領域上に、駆動集積回路ＩＣ及びフレキシブル印刷回路基板ＦＰＣを結合させるステップと、前記駆動集積回路ＩＣ及び前記フレキシブル印刷回路基板ＦＰＣが結合されている前記フレキシブル基板を取り外すステップとを含む。   According to another aspect of the present invention, there is provided a method for manufacturing a flexible display device, comprising: preparing a base substrate; and a first release layer and a release force on the base substrate, the release force of the first release layer. Forming a release layer including a stronger second release layer, and corresponding to the bonding region corresponding to the first release layer and the second release layer on the release layer; Forming a flexible substrate including a non-bonded region; bonding a driving integrated circuit IC and a flexible printed circuit board FPC on the bonding region of the flexible substrate; and the driving integrated circuit IC and the flexible printed circuit. Removing the flexible substrate to which the substrate FPC is bonded.

例えば、前記第１の離型層は適宜の無機材料または有機材料により形成され、前記無機材料は非晶質シリコンであってもよく、前記有機材料は、ポリパラキシリレン及びその誘導体、ポリテトラフルオロエチレン及びその誘導体、Ｚｅｏｎｏｒからなる群から選択された一つまたは複数であってもよい。   For example, the first release layer may be formed of an appropriate inorganic material or organic material, and the inorganic material may be amorphous silicon, and the organic material may be polyparaxylylene and its derivatives, polytetraxyl. It may be one or more selected from the group consisting of fluoroethylene and its derivatives, Zeonor.

例えば、前記第２の離型層は適宜の無機材料または有機材料により形成され、前記無機材料は非晶質シリコンであってもよく、前記有機材料は、ポリパラキシリレン及びその誘導体、ポリテトラフルオロエチレン及びその誘導体、Ｚｅｏｎｏｒからなる群から選択された一つまたは複数であってもよい。   For example, the second release layer may be formed of an appropriate inorganic material or organic material, and the inorganic material may be amorphous silicon, and the organic material may be polyparaxylylene and its derivatives, polytetraxyl. It may be one or more selected from the group consisting of fluoroethylene and its derivatives, Zeonor.

例えば、前記第１の離型層の離型力は１平方センチメートル当たり１００グラムより小さく、前記第２の離型層の離型力は１平方センチメートル当たり１００グラムより小さい。   For example, the release force of the first release layer is less than 100 grams per square centimeter, and the release force of the second release layer is less than 100 grams per square centimeter.

例えば、前記第１の離型層と第２の離型層の厚さは等しい。
例えば、前記ベース基板は、ガラス基板、金属基板、石英基板または有機物基板である。 For example, the first release layer and the second release layer have the same thickness.
For example, the base substrate is a glass substrate, a metal substrate, a quartz substrate, or an organic substrate.

例えば、前記フレキシブル基板はポリイミドにより形成される。
例えば、前記フレキシブル基板を取り外すステップにおいて、機械的力またはレーザー光により前記フレキシブル基板を取り外す。 For example, the flexible substrate is made of polyimide.
For example, in the step of removing the flexible substrate, the flexible substrate is removed by mechanical force or laser light.

本発明に係るフレキシブル表示装置の製造方法によれば、結合領域及び非結合領域の下方に互いに異なる離型材料を用いることにより、非結合領域の離型層の補強効果を確保するとともに結合領域の取り外しの容易さを確保することができ、フレキシブル基板の破損を回避し、表示パネルの不良率を減少させることができる。   According to the method for manufacturing a flexible display device of the present invention, by using different release materials below the bonding region and the non-bonding region, the reinforcing effect of the release layer in the non-bonding region is ensured and the bonding region Ease of removal can be ensured, breakage of the flexible substrate can be avoided, and the defect rate of the display panel can be reduced.

図面を参照しながら例示の実施例を詳細に説明することにより、本発明の上記の特徴及び利点、ならびに他の特徴及び利点はさらに明らかになるだろう。   The above features and advantages of the present invention, as well as other features and advantages, will become more apparent from the detailed description of exemplary embodiments with reference to the drawings.

図１は従来のフレキシブル表示装置を模式的に示す図である。FIG. 1 is a diagram schematically showing a conventional flexible display device. 図２は従来のフレキシブル表示装置の製造過程を模式的に示す図である。FIG. 2 is a diagram schematically showing a manufacturing process of a conventional flexible display device. 図３は本発明に係るフレキシブル表示装置の製造過程を模式的に示すフローチャートである。FIG. 3 is a flowchart schematically showing a manufacturing process of the flexible display device according to the present invention. 図４は本発明に係るフレキシブル基板を取り外す前の断面を模式的に示す図である。FIG. 4 is a view schematically showing a cross section before removing the flexible substrate according to the present invention.

１ フレキシブル表示装置
２ 表示パネル
２ａ フレキシブル基板
２ｂ 結合領域
３ 駆動集積回路
４ フレキシブル印刷回路基板
５ 印刷回路基板
６ ベース基板
７ａ 第１の離型層
７ｂ 第２の離型層 DESCRIPTION OF SYMBOLS 1 Flexible display apparatus 2 Display panel 2a Flexible board 2b Coupling area | region 3 Drive integrated circuit 4 Flexible printed circuit board 5 Printed circuit board 6 Base board 7a 1st mold release layer 7b 2nd mold release layer

以下、図面を参照して、例示の実施例をさらに具体的に説明する。但し、ここに例示の実施例は、様々な形態にて実施可能であり、以下において説明する実施例のみに限定されると理解してはいけない。逆に、これらの実施例は、本発明を完全且つ全面的に説明するためのものであり、当業者に例示の実施例の思想を全面的に理解させるためのものである。図面にては、説明の便宜上、領域及び層の厚さを拡大して示している。なお、図面中の同一の符号は同一または類似の構造を指しているので、それらに関する詳細の説明は省略するようにする。   Hereinafter, exemplary embodiments will be described in more detail with reference to the drawings. However, it should not be understood that the embodiments illustrated here can be implemented in various forms and are limited to only the embodiments described below. On the contrary, these embodiments are for the purpose of completely and completely explaining the present invention, and are intended to allow those skilled in the art to fully understand the idea of the embodiments. In the drawing, for convenience of explanation, the thickness of the region and the layer is shown enlarged. In addition, since the same code | symbol in drawing points out the same or similar structure, the detailed description regarding them is abbreviate | omitted.

以下に説明する特徴、構成または特性は、適宜の任意形態にて一つまたは複数の実施例と組み合わせられてもよい。以下の説明において、複数の具体的な構成を例示することにより、本発明の実施例を十分理解するようにしている。しかしながら、当業者であれば、上記の複数の構成のうち、一つまたは幾つかの特定の具体的構成を無くしたとしても、または、他の方法、組合せ、材料などを用いたとしても、本発明の技術案を実践することができる、ことを理解すべきである。他の場合には、本発明の各局面が不明確になることを避けるために、公知の構成、材料または操作について詳細に説明または示さないようにする。   Features, configurations, or characteristics described below may be combined with one or more examples in any appropriate form. In the following description, examples of the present invention are fully understood by illustrating a plurality of specific configurations. However, those skilled in the art will be aware that even if one or several specific specific configurations are eliminated from the above-described plurality of configurations, or even if other methods, combinations, materials, etc. are used. It should be understood that the technical solution of the invention can be practiced. In other instances, well-known structures, materials, or operations are not described or shown in detail to avoid obscuring aspects of the invention.

以下、図面を参照して本発明の実施例を説明することにより、本発明をさらに説明する。   Hereinafter, the present invention will be further described by describing embodiments of the present invention with reference to the drawings.

図３に示すように、本実施例に係るフレキシブル表示装置の製造方法は、以下のステップを含む。   As shown in FIG. 3, the manufacturing method of the flexible display device according to the present embodiment includes the following steps.

ステップ１０１：ベース基板６を用意して、ベース基板６上に離型層を形成する。ベース基板６は、例えばガラス基板、金属基板、石英基板または有機物基板などの、高い剛性、低い膨張率及び高いヤング率の特性を有する基板であってもよい。   Step 101: A base substrate 6 is prepared, and a release layer is formed on the base substrate 6. The base substrate 6 may be a substrate having characteristics of high rigidity, low expansion coefficient, and high Young's modulus, such as a glass substrate, a metal substrate, a quartz substrate, or an organic substrate.

離型層は、第１の離型層７ａ及び第２の離型層７ｂを含む。離型層は、適宜の無機材料または有機材料により形成されてもよく、無機材料は非晶質シリコンであってもよく、有機材料は、ポリパラキシリレン及びその誘導体、ポリテトラフルオロエチレン及びその誘導体、Ｚｅｏｎｏｒからなる群から選択される一つまたは複数であってもよい。離型層は、例えば化学気相堆積（ＣＶＤ）法またはその他の適宜の方法により形成することができる。離型層の形成温度は、選択して用いる材料により異なり、例えば２００℃であってもよい。第１の離型層７ａの厚さは、第２の離型層７ｂと同一の厚さを有し、１００Å乃至４０００Åの範囲内に形成されるが、２０００Åぐらいに形成されるのが好ましい。   The release layer includes a first release layer 7a and a second release layer 7b. The release layer may be formed of an appropriate inorganic material or organic material, the inorganic material may be amorphous silicon, and the organic material may be polyparaxylylene and its derivatives, polytetrafluoroethylene and its It may be one or more selected from the group consisting of a derivative and Zeonor. The release layer can be formed by, for example, a chemical vapor deposition (CVD) method or other appropriate method. The formation temperature of the release layer varies depending on the material selected and used, and may be 200 ° C., for example. The thickness of the first release layer 7a is the same as that of the second release layer 7b, and is formed within a range of 100 mm to 4000 mm, preferably about 2000 mm.

第１の離型層７ａの離型力は、第２の離型層７ｂの離型力より弱い。これらに用いられる材料は、異なる材料であってもよく、パラメータの異なる同一の材料であってもよい。   The release force of the first release layer 7a is weaker than the release force of the second release layer 7b. The materials used for these may be different materials or the same material with different parameters.

ステップ１０２：第１の離型層７ａ及び第２の離型層７ｂ上にフレキシブル基板２ａを形成する。但し、フレキシブル基板２ａは、結合領域２ｂ及び非結合領域を含む。   Step 102: A flexible substrate 2a is formed on the first release layer 7a and the second release layer 7b. However, the flexible substrate 2a includes a bonding region 2b and a non-bonding region.

本実施例では、ポリイミドによりなるフレキシブル基板２ａについて説明する。全体の離型層７ａ及び７ｂ上に液体のポリイミドを塗布する。その後、低圧乾燥、プリベーク、高温硬化などの一連の工程を通じて、５〜１５０ｕｍの厚さのポリイミド薄膜を形成する。その後、半導体加工プロセスにより、ポリイミド薄膜上に半導体層及び各種の半導体構造を形成することができる。フレキシブル基板２ａ上において、ＩＣ３及びＦＰＢ４を結合させるための領域は結合領域２ｂであり、その他の領域は非結合領域である。結合領域２ｂは、ＩＣ／ＦＰＣを電気的に結合させるための領域であり、結合領域以外の領域は非結合領域である。   In this embodiment, a flexible substrate 2a made of polyimide will be described. Liquid polyimide is applied on the entire release layers 7a and 7b. Thereafter, a polyimide thin film having a thickness of 5 to 150 μm is formed through a series of processes such as low-pressure drying, pre-baking, and high-temperature curing. Thereafter, a semiconductor layer and various semiconductor structures can be formed on the polyimide thin film by a semiconductor processing process. On the flexible substrate 2a, a region for coupling the IC 3 and the FPB 4 is a coupling region 2b, and the other regions are non-coupling regions. The coupling region 2b is a region for electrically coupling the IC / FPC, and a region other than the coupling region is a non-coupling region.

ステップ１０３：フレキシブル基板２ａの結合領域２ｂ上にＩＣ３及びＦＰＢ４を結合させる。   Step 103: IC3 and FPB4 are bonded on the bonding region 2b of the flexible substrate 2a.

図４に示すように、フレキシブル基板２ａの結合領域２ｂの真下は第１の離型層７ａに対応し、非結合領域の真下は第２の離型層７ｂに対応する。   As shown in FIG. 4, the area immediately below the bonding area 2b of the flexible substrate 2a corresponds to the first release layer 7a, and the area immediately below the non-bonding area corresponds to the second release layer 7b.

ステップ１０４：ＦＰＢ４及びＩＣ３が結合されているフレキシブル基板２ａを取り外す。   Step 104: Remove the flexible substrate 2a to which the FPB 4 and the IC 3 are coupled.

機械的力またはレーザー光によりフレキシブル基板２ａを取り外すことができる。
本発明に係る方法によれば、フレキシブル基板２ａの結合領域２ｂの真下に形成される第１の離型層７ａの離型力が比較的弱いため、フレキシブル基板２ａを取り外すとき、フレキシブル基板２ａの結合領域２ｂがＩＣ３及びＦＰＣ４中の固体部品により破損されることはなく、また、フレキシブル基板２ａの非結合領域の真下に形成される第２の離型層７ｂの離型力が比較的強いため、フレキシブル基板に対する離型層の補強効果を発揮することができる。したがって、本発明に係るフレキシブル表示装置の製造方法によれば、フレキシブル基板の異なる領域に対し、異なる離型力を有する離型層を形成することにより、フレキシブル基板に対する離型層の補強効果を確保するとともにフレキシブル基板が破損しないように確保することができ、フレキシブル表示装置の生産不良率を減少することができる。 The flexible substrate 2a can be removed by mechanical force or laser light.
According to the method of the present invention, since the release force of the first release layer 7a formed immediately below the bonding region 2b of the flexible substrate 2a is relatively weak, when removing the flexible substrate 2a, The bonding region 2b is not damaged by the solid parts in the IC 3 and the FPC 4, and the release force of the second release layer 7b formed immediately below the non-bonding region of the flexible substrate 2a is relatively strong. The reinforcing effect of the release layer on the flexible substrate can be exhibited. Therefore, according to the method for manufacturing a flexible display device according to the present invention, the reinforcing effect of the release layer on the flexible substrate is ensured by forming release layers having different release forces in different regions of the flexible substrate. In addition, it is possible to ensure that the flexible substrate is not damaged, and to reduce the production failure rate of the flexible display device.

以上、本発明の例示的性実施例を具体的に説明した。但し、本発明は、ここに開示の実施例に限定されず、逆に、添付の特許請求の範囲の思想及び範囲内にある様々な変更及び均等の配置を含むことを意図する。   The exemplary embodiments of the present invention have been specifically described above. However, the present invention is not limited to the embodiments disclosed herein, and conversely is intended to include various modifications and equivalent arrangements that are within the spirit and scope of the appended claims.

Claims (4)

ベース基板を用意して、前記ベース基板上に、第１の離型層と離型力が前記第１の離型層の離型力より強い第２の離型層とを含む離型層を形成するステップと、
前記離型層上に、前記第１の離型層に対応する結合領域と前記第２の離型層に対応する非結合領域とを含むフレキシブル基板を形成するステップと、
前記フレキシブル基板の前記結合領域上に、駆動集積回路ＩＣ及びフレキシブル印刷回路基板ＦＰＣを結合させるステップと、
前記駆動集積回路ＩＣ及び前記フレキシブル印刷回路基板ＦＰＣが結合されている前記フレキシブル基板を取り外すステップと
を含むことを特徴とするフレキシブル表示装置の製造方法。 A base substrate is prepared, and a release layer including a first release layer and a second release layer having a release force stronger than the release force of the first release layer on the base substrate. Forming step;
Forming on the release layer a flexible substrate including a bonding region corresponding to the first release layer and a non-bonding region corresponding to the second release layer;
Coupling a driving integrated circuit IC and a flexible printed circuit board FPC onto the coupling region of the flexible board;
Removing the flexible substrate to which the driving integrated circuit IC and the flexible printed circuit board FPC are coupled. A method for manufacturing a flexible display device, comprising: 前記第１の離型層は無機材料または有機材料により形成され、
前記第２の離型層は無機材料または有機材料により形成され、
前記無機材料は非晶質シリコンであり、
前記有機材料は、ポリパラキシリレン及びその誘導体、ポリテトラフルオロエチレン及びその誘導体、Ｚｅｏｎｏｒからなる群から選択された一つまたは複数である
ことを特徴とする請求項１に記載のフレキシブル表示装置の製造方法。 The first release layer is formed of an inorganic material or an organic material,
The second release layer is formed of an inorganic material or an organic material,
The inorganic material is amorphous silicon;
2. The flexible display device according to claim 1, wherein the organic material is one or more selected from the group consisting of polyparaxylylene and derivatives thereof, polytetrafluoroethylene and derivatives thereof, and Zeonor. Production method. 前記第１の離型層と第２の離型層の厚さは等しい
ことを特徴とする請求項１または２に記載のフレキシブル表示装置の製造方法。 The thickness of the said 1st mold release layer and the 2nd mold release layer is equal. The manufacturing method of the flexible display apparatus of Claim 1 or 2 characterized by the above-mentioned. 前記フレキシブル基板を取り外すステップにおいて、機械的力またはレーザー光により前記フレキシブル基板を取り外す
ことを特徴とする請求項１に記載のフレキシブル表示装置の製造方法。 The method for manufacturing a flexible display device according to claim 1, wherein in the step of removing the flexible substrate, the flexible substrate is removed by a mechanical force or laser light.
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