JP2015218382A - Part accommodation tool and part holding tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve more efficient attachment/detachment work of a magnet provided in a part accommodation tool and a part holding tool.SOLUTION: A part accommodation tool includes a first base plate and a second base plate, which are superimposed in the plane view and between which a part is provided. A space for accommodating a magnet is formed between the first base plate and the second base plate. The space includes a bottom face of a first concavity provided on a surface of the second base plate opposite to the first base plate, and a magnet mounting face provided on a surface of the first base plate opposite to the bottom face of the first concavity. At least the bottom face of the first concavity and the magnet mounting face have magnetism. The bottom face of the first concavity and the magnet face opposite to the bottom face of the first concavity are separated away.

Description

  The present invention relates to a component storage tool and a component holder.

  When an electrode film is formed on a piezoelectric material to form a piezoelectric element, an electrode material such as gold or aluminum is generally formed into a desired shape by sputtering for electrode film formation. In order to form a metal film as an electrode in a desired shape by sputtering, a work (film formation object) made of a piezoelectric material is held by a work holding jig including a mask jig opened in an electrode shape, A workpiece holding jig holding a workpiece is mounted in the sputtering apparatus, and sputtering is performed.

  As such a workpiece holding jig, the one disclosed in Patent Document 1 is known. In the film forming jig disclosed in Patent Document 1, the mask for masking the workpiece held at the film forming position is generated by the magnetic force of the magnet housed and fixed in the magnet housing portion provided in the film forming jig. It is configured to be sucked and fixed to a film forming jig. Furthermore, since a protective film insoluble in the cleaning solution for the film forming jig is formed on the surface of the magnet, it is possible to prevent the magnet from being eroded by cleaning the film forming jig. It is not necessary to attach or detach the magnet each time the tool is washed, and productivity can be improved.

  Further, the magnet housing part of the film forming jig is formed deeper than the height of the magnet to be housed, and thereby the surface of the magnet is not protruded from the surface of the film forming jig so that the contact between the magnet and the mask is prevented. It avoids and prevents damage to the magnet.

JP 2002-241936 A

  However, in the film-forming jig disclosed in Patent Document 1, in sputtering, which is a film-forming method on a workpiece, the inside of the sputtering apparatus is maintained in a high-temperature environment. The magnets are also exposed to high temperatures and the coercive force is reduced. The reduction in coercive force reduces the coercive force of the mask, which may cause mask displacement or mask disengagement. Therefore, even if the protective film of the magnet is not damaged, the magnet must have a desired holding force at a predetermined frequency. However, the magnet that is housed and fixed in the magnet housing portion of the film forming jig may be used. It takes a lot of man-hours to attach and detach.

  Further, the magnet housing portion of the film forming jig is formed deeper than the height of the magnet to be housed, so that the magnet surface does not protrude from the surface of the film forming jig, in other words, the magnet is a magnet. It becomes difficult to obtain a high coercive force because it is formed thinner than the depth of the housing portion and becomes a small magnet. Therefore, there is a possibility that mask displacement or mask disengagement may occur due to the low mask holding power.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A component storage device of this application example includes a first substrate and a second substrate, and the first substrate and the second substrate are arranged to overlap each other in a plan view, and A component storage device in which components are arranged between the first substrate and the second substrate, and a space in which a magnet can be stored is formed between the first substrate and the second substrate. The space includes a bottom surface of a first recess provided on a surface of the second substrate facing the first substrate, a magnet placement surface provided on a surface of the first substrate facing the bottom surface of the first recess, At least the bottom surface of the first recess and the magnet mounting surface have magnetism, and the bottom surface of the first recess and the surface of the magnet facing the bottom surface of the first recess are separated from each other It is characterized by making it.

  The component storage device of this application example is configured such that the first substrate and the second substrate are stacked on each other by the magnet's attractive force, and the component is stored in a space formed by the first substrate and the second substrate. It is. Therefore, according to the component storage device of this application example, the second substrate and the first substrate can be easily attached and detached by using the assembling means based on the magnet's attractive force. In addition, since the first recess is formed in the second substrate, the second substrate can be reduced in weight, and the second substrate can be easily detached even if it is attracted and fixed by a magnet without using screwing or the like. This can be suppressed.

Application Example 2 In the application example described above, when the arithmetic average roughness of the bottom surface of the first recess is Ra1, and the arithmetic average roughness of the magnet placement surface is Ra2,
Ra1> Ra2
It is characterized by being.

  The attracting force of the magnet decreases as the finish of the attracted surface of the attracted object becomes rougher. Therefore, according to the application example described above, the finishing degree of the magnet mounting surface included in the first substrate is made better than the finishing degree of the bottom surface of the first recess of the second substrate, that is, the arithmetic average roughness is fine (small). By doing so, when the second substrate is separated (disassembled) from the component housing, the magnet can remain on the first substrate. Therefore, in attaching / detaching the component to / from the component storage tool, workability for attaching / detaching the second substrate is improved, and productivity can be improved.

  Application Example 3 In the application example described above, the second substrate has a second recess having the magnet mounting surface as a bottom surface on a surface of the second substrate facing the first substrate, and an edge of the opening of the second recess. Is an inner region of the edge of the opening of the first recess.

  In other words, the edge of the opening of the first recess is located outside the edge of the opening of the second recess. Accordingly, the distance from the side wall of each recess to the magnet is shorter from the side wall of the second recess than the distance from the side wall of the first recess, that is, the adsorption between the side wall of the first recess and the magnet. The power is weakening. Therefore, according to the application example described above, the attractive force between the magnet and the first substrate in the second concave portion of the first substrate is larger than the attractive force of the magnet and the second substrate in the first concave portion of the second substrate. When the second substrate is separated (disassembled) from the storage tool, the magnet can be easily left on the first substrate.

  Application Example 4 In the application example described above, the second substrate includes a substrate portion including the magnet placement surface, a spacer portion disposed between the substrate portion and the first substrate. And the magnetism of the spacer portion is lower than the magnetism of the magnet mounting surface.

  According to the application example described above, the magnet mounting surface serving as the bottom of the space in which the magnet can be accommodated is the first substrate, and the side wall is configured by the spacer. Since the spacer has magnetism lower than that of the magnet mounting surface, when the magnet is placed on the magnet mounting surface, the magnet is not attracted to the side wall of the magnet storage space formed by the spacer, and the magnet is placed on the magnet mounting surface. A magnet can be arrange | positioned and workability | operativity can be improved. In addition, by rearranging the spacers according to the shape and dimensions of the components to be stored, the component storage space can be easily formed, so that the first substrate and the second substrate can be used in common, so-called standardization, and the cost can be reduced. Is planned.

  Application Example 5 In the application example described above, a part of the second substrate is in contact with the first substrate in the stacking direction.

  According to the application example described above, the bottom surface of the first recess and the magnet can be reliably separated, and the storage space formed by the component to be stored and the first substrate and the second substrate The desired dimensional relationship in the stacking direction can be maintained, and damage to the components can be prevented.

  Application Example 6 In the component holder of this application example, the first substrate, the second substrate, the first substrate, and the second substrate are arranged so as to overlap in a plan view, A magnet disposed between the second substrate and a space in which the magnet can be accommodated between the first substrate and the second substrate. A bottom surface of the first recess provided on the surface of the second substrate facing the first substrate, and a magnet placement surface provided on the surface of the first substrate facing the bottom surface of the first recess, at least the The bottom surface of the first recess and the magnet mounting surface have magnetism, and the bottom surface of the first recess and the surface of the magnet facing the bottom surface of the first recess are separated from each other. And

  In the component holder of this application example, the first substrate and the second substrate are stacked on each other by the magnet's attractive force, and the component is stored and held in the space formed by the first substrate and the second substrate. For example, it is used as a jig for placing components on a processing apparatus such as sputtering. Therefore, according to the component holder of this application example, it is possible to easily attach and detach the second substrate and the first substrate by using the assembling means based on the magnet attracting force. In addition, since the first recess is formed in the second substrate, the second substrate can be reduced in weight, and the second substrate can be easily detached even if it is attracted and fixed by a magnet without using screwing or the like. This can be suppressed.

Application Example 7 In the application example described above, when the arithmetic average roughness of the bottom surface of the first recess is Ra1, and the arithmetic average roughness of the magnet placement surface is Ra2,
Ra1> Ra2
It is characterized by being.

  The attracting force of the magnet decreases as the finish of the attracted surface of the attracted object becomes rougher. Therefore, according to the application example described above, the finishing degree of the magnet mounting surface included in the first substrate is made better than the finishing degree of the bottom surface of the first recess of the second substrate, that is, the arithmetic average roughness is fine (small). Thus, when the second substrate is separated (disassembled) from the component holder, the magnet can remain on the first substrate. As a result, when the component holder of this application example is used as a fixture for a sputtering apparatus, the component holder is used in the separation cleaning of the treatment film substance of the second substrate that becomes a mask substrate required after a predetermined repeated use. Since the magnets that must be excluded in attaching / detaching the second substrate remain on the first substrate side, workability for attaching / detaching the second substrate is improved, and productivity can be increased.

  Application Example 8 In the application example described above, the second substrate has a second recess having the magnet mounting surface as a bottom surface on a surface facing the first substrate, and an edge of the opening of the second recess. Is an inner region of the edge of the opening of the first recess.

  According to the application example described above, in other words, the edge of the opening of the first recess is in the outer region than the edge of the opening of the second recess. Accordingly, the distance from the side wall of each recess to the magnet is shorter from the side wall of the second recess than the distance from the side wall of the first recess, that is, the adsorption between the side wall of the first recess and the magnet. The power is weakening. Therefore, according to the application example described above, the attractive force between the magnet and the first substrate in the second concave portion of the first substrate is larger than the attractive force of the magnet and the second substrate in the first concave portion of the second substrate. When the second substrate is separated (disassembled) from the storage tool, the magnet can be easily left on the first substrate.

  Application Example 9 In the application example described above, the second substrate includes a substrate portion including the magnet mounting surface, a spacer portion disposed between the substrate portion and the first substrate. And the magnetism of the spacer portion is lower than the magnetism of the magnet mounting surface.

  According to the above-described application example, according to the above-described application example, the magnet mounting surface serving as the bottom of the space in which the magnet can be accommodated becomes the first substrate, and the side wall is configured by the spacer. Since the spacer has magnetism lower than that of the magnet mounting surface, when the magnet is placed on the magnet mounting surface, the magnet is not attracted to the side wall of the magnet storage space formed by the spacer, and the magnet is placed on the magnet mounting surface. A magnet can be arrange | positioned and workability | operativity can be improved. In addition, by rearranging the spacers according to the shape and dimensions of the components to be stored, the component storage space can be easily formed, so that the first substrate and the second substrate can be used in common, so-called standardization, and the cost can be reduced. Is planned.

  Application Example 10 In the application example described above, a part of the second substrate is in contact with the first substrate in the stacking direction.

  According to the application example described above, the bottom surface of the first recess and the magnet can be reliably separated, and the holding space and the storage space formed by the first substrate and the second substrate The desired dimensional relationship in the stacking direction can be maintained, and damage to the components can be prevented.

The component storage device which concerns on 1st Embodiment is shown, (a) is a top view, (b) is sectional drawing of the AA 'part shown to (a), (c) is BB' shown to (a). Sectional drawing of a part, (d) is sectional drawing of the C1-C2-C3 part shown to (a). The partial expanded view of the components storage device which concerns on 1st Embodiment is shown, (a) is an enlarged plan view of the H section shown in FIG.1 (c), (b) is the expanded cross section of the H section shown in FIG.1 (c). Figure. (A) is the relationship between the surface roughness of the surface to which the magnet is attracted and the attracting force, (b) is the distance (gap) between the magnet and the surface to which the magnet is attracted, and the attracting force. Shows the relationship between forces. The component storage device which concerns on 2nd Embodiment is shown, (a) is a top view, (b) is sectional drawing of the JJ 'part shown to (a), (c) is KK' shown to (a). Sectional drawing of a part, (d) is an enlarged view of the L part shown in (c). The component holder which concerns on 3rd Embodiment is shown, (a) is a top view, (b) is an expanded sectional view of the NN 'part shown to (a), (c) is PP shown to (a). The expanded sectional view of a part. The partial enlarged view of the component holder which concerns on 3rd Embodiment is shown, (a) is an enlarged plan view of the S part shown in FIG.5 (b), (b) is the expanded cross section of the S part shown in FIG.5 (b). Figure. The component holder which concerns on 4th Embodiment is shown, (a) is a top view, (b) is sectional drawing of the TT 'part shown to (a), (c) is UU' shown to (a). Sectional drawing of a part, (d) is an enlarged view of the V part shown in (c).

  Embodiments according to the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1: shows the components storage device which concerns on 1st Embodiment, (a) is a top view, (b) is sectional drawing of the AA 'part shown to (a), (c) shows to (a). sectional view of B-B'unit, (d) is, C ₁ -C ₂ -C ₃ parts of a cross-sectional view shown in (a).

  As shown in FIGS. 1A and 1B, the component storage device 100 according to the first embodiment includes a first substrate 10 that can hold a component to be stored 40 (hereinafter referred to as a component 40), and a second substrate 10. Between the substrate 20 and the first substrate 10 and the second substrate 20, a spacer 30 having a thickness capable of accommodating the component 40 is provided. In the present embodiment, the spacer 30 is composed of a plurality of spacer bodies, and in the present embodiment, the three spacer bodies 31, 32, 33. However, the present invention is not limited to this, and is appropriately set depending on the thickness of the component 40. can do.

  Two guide pins 11 are fixed to the first substrate 10 by welding, for example. Spacer body guide holes 31 a, 32 a, 33 a of spacer bodies 31, 32, 33 are formed so as to be guided by and inserted through the guide pins 11, and the second substrate 20 is provided with the second substrate 20. Two substrate guide holes 20a are formed. By inserting the spacer body guide holes 31 a, 32 a, 33 a through the guide pin 11 and further through the second substrate guide hole 20 a of the second substrate 20, the spacer 30 and the second substrate are inserted into the first substrate 10. 20 can be stacked while maintaining a predetermined positional relationship.

  In order to confirm whether or not the component 40 is stored in the component storage device 100, the first substrate 10 includes a first substrate opening 10a, and the second substrate 20 includes a second substrate opening 20b. The relationship between the first substrate opening 10a and the second substrate opening 20b and the component 40 is that the corner portion 40a of the component 40 is located outside the openings 10a and 20b as shown in the enlarged view of portion D in FIG. In other words, an overlap in a plan view of the shaded F portion shown in the figure is formed. In this way, as shown in FIG. 1D, an overlap F is formed at the D portion of the corner portion of the component 40, whereby the first substrate opening 10a of the first substrate 10 and the second substrate are formed. The component 40 is prevented from being detached from the second substrate opening 20b. In other words, the component 40 is sandwiched between overlapping portions F of the first substrate 10 and the second substrate 20 and is held in the component storage device 100.

  In the spacer 30, spacer body openings 31b, 32b, and 33b are formed in the spacer bodies 31, 32, and 33 so that appropriate gaps for positioning the components 40 are formed. To position and fix the component 40.

  The component storage device 100 according to the present embodiment includes the magnet 50, so that the first substrate 10 and the second substrate 20 are attracted in the stacking direction by magnetic force so as to sandwich the spacer 30. As shown in FIG. 1C, the magnet 50 is a space in which a magnet configured by a magnet storage portion 30 c provided in a plurality of locations on the spacer 30, the first substrate 10, and the second substrate 20 can be stored. Placed in. The magnet storage portion 30c is configured by magnet storage openings 31c, 32c, and 33c provided in the spacer bodies 31, 32, and 33, respectively.

  Accordingly, the first substrate 10 and the second substrate 20 are formed of the magnet 50 and a magnetic material having excellent adsorptivity, and it is preferable to use an iron-based or nickel-based alloy, for example, a precipitation hardening stainless steel SUS631. Thus, the first substrate 10 and the second substrate 20 having strength and corrosion resistance can be obtained.

  The spacer bodies 31, 32 and 33 constituting the spacer 30 are preferably formed of a nonmagnetic material. When the magnets 50 are arranged by forming the spacer bodies 31, 32, 33 from a non-magnetic material, the magnets 50 are the inner peripheral surfaces of the magnet housing openings 31 c, 32 c, 33 c of the spacer bodies 31, 32, 33. Therefore, the assembling property of the magnet 50 is not hindered. As the spacer bodies 31, 32, 33, for example, austenitic stainless steel is preferably used, and SUS304-CSP or the like is used.

  The magnet placement surface area G (the hatched area in the figure) on which the magnet 50 is placed on the first substrate 10 shown in FIG. 1A is the first in the component storage device 100 according to the present embodiment. Since the substrate 10 has a flat plate shape, it is included in a surface 10b (hereinafter referred to as a first substrate main surface 10b) of the first substrate 10 facing the second substrate 20 as shown in FIG. As for the force that the first substrate 10 is attracted by the magnetic force of the magnet 50, that is, the attracting force, a higher attracting force can be obtained as the surface finish of the first substrate main surface 10b is good, in other words, as the surface roughness becomes smaller.

In the finishing of the first substrate main surface 10b of the first substrate 10, the arithmetic average roughness Ra2 ₁ is a surface grinding finish performed to adjust the thickness of the first substrate 10.
Ra2 ₁ ≦ 0.2 (μm)
Surface finish can be obtained, and a high attractive force with the magnet 50 can be secured.

  On the other hand, the second substrate 20 is shown in FIG. 2B, which is an enlarged cross-sectional view of the H portion in FIG. 1C, and in FIG. 2A, which is a plan external view of FIG. A first recess 20d opened to the second substrate main surface 20c side is formed on a surface 20c (hereinafter referred to as a second substrate main surface 20c) facing the first substrate 10 of the second substrate 20 corresponding to the storage area of the magnet 50. Is formed.

The first recess 20d is formed, for example, by partially etching the second substrate main surface 20c, and is separated from the end 50a on the second substrate 20 side of the magnet 50 when the component 40 is stored as the component storage device 100. The depth m of the first recess 20d is set so that the bottom 20e of the first recess 20d is disposed at the position. The depth m of the first recess 20d is set so that the bottom 20e and the end 50a of the magnet 50 do not come into contact with each other even when variation of each component is taken into account when assembled as the component storage device 100. It is preferable. That is, when the distance (gap) between the end 50a of the magnet 50 and the bottom 20e is δ,
δ ≧ 0
It is preferable that

  Furthermore, the bottom 20e of the first recess 20d is made rougher than the arithmetic average roughness Ra2 of the finish of the magnet placement surface region G (see FIG. 1) of the first substrate 10, that is, the finish of the first substrate main surface 10b. preferable.

  The attracting force between the magnet 50 and the first substrate 10 and between the magnet 50 and the second substrate 20 varies depending on the roughness of the attracting surfaces of the substrates 10 and 20 and the separation distance from the magnet 50. For example, the relationship is generally shown in FIG. FIG. 3A shows the relationship between the surface roughness of the surface on which the magnet is attracted and the attracting force of the magnet. As shown in Fig. 3 (a), when the attractive force between the finished surface and the magnet is 100, the attractive force on the finished surface is reduced to about 80%, and further up to about 60% on the finished surface. It will weaken.

  Also, as can be seen in FIG. 3B showing the relationship between the distance between the magnet and the surface on which the magnet is attracted and the attracting force, the attracting force with the magnet in close contact is assumed to be 100%. When the gap is as small as 0.1 mm, the attractive force is weakened to about 30%. That is, the attracting force is generated in proportion to the square of the magnetic flux density, but the magnetic flux density of the magnetic flux passing through the attracting surface decreases in inverse proportion to the distance from the magnet. Therefore, the attractive force decreases in inverse proportion to the square of the distance from the magnet.

As described with reference to FIG. 3 described above, the finish of the bottom 20e of the first recess 20d is rougher than the finish of the first substrate main surface 10b including the magnet placement region G of the first substrate 10, that is, the first recess 20d. If the surface roughness of the bottom 20e and the arithmetic mean roughness Ra1 _1,
Ra1 ₁ > Ra2 ₁
It is preferable that the relationship is

The magnet 50 placed on the first substrate 10 and having the end 50b of the magnet 50 on the first substrate 10 side in close contact with and attracted to the first substrate 10 is δ = 0, that is, the first in the second substrate 20. Assume that the bottom 20e of the recess 20d is in close contact with the bottom 20e. From this configuration, when the first substrate 10 and the second substrate 20 are separated and disassembled, the attractive force between the first substrate 10 and the magnet 50 is P1 ₁ , and the attractive force between the second substrate 20 and the magnet 50 is P2. ₁ , the above arithmetic average roughness Ra1 ₁ , Ra2 ₁
P1 ₁ > P2 ₁
Thus, the magnet 50 can separate the second substrate 20 while being attracted to the first substrate 10 side (see FIG. 3A). Further, as shown in FIG. 2B, by providing a gap δ between the bottom 20e of the first recess 20d and the end 50a of the magnet 50, the attractive force between the first substrate 10 and the magnet 50 is ensured. P1 ₁ can maintain a relationship in which the attractive force between the second substrate 20 and the magnet 50 is greater than P2 ₁ .

Further, the relationship between the first recess 20d region in plan view and the magnet storage portion 30c region in the spacer 30 is as follows. As shown in FIG. 2A, the first recess 20d region is the magnet storage portion 30c in the spacer 30. It is formed wider than the area. By being formed in this manner, the distance between the side wall of the first recess 20d and the magnet 50 can be increased, and the attractive force between the side wall of the first recess 20d and the magnet 50 can be reduced. the suction force by the suction force P2 ₁ between the substrate 20 and the magnet 50 are added is suppressed.

(Second Embodiment)
FIG. 4 shows a component storage device according to the second embodiment, in which (a) is a plan view, (b) is a cross-sectional view of the JJ ′ portion shown in (a), and (c) is K shown in (a). Sectional drawing of sectional drawing of -K 'part, (d) is an enlarged view of the L part shown in (c). The component storage device 110 according to the second embodiment is different in that the first substrate 10 and the spacer 30 (spacer bodies 31, 32, 33) in the component storage device 100 according to the first embodiment are integrated. It is. Therefore, in the description of the component storage device 110 according to the second embodiment, the same components as those of the component storage device 100 according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIGS. 4A and 4B, the component storage device 110 can commonly use the second substrate 20 provided in the component storage device 100 according to the first embodiment. Two guide pins 61 are fixed to the first substrate 60 on a surface 60a facing the second substrate 20 (hereinafter referred to as a first substrate main surface 60a) by, for example, welding. The guide pins 61 are inserted into the second substrate guide holes 20a of the second substrate 20, and the first substrate 60 and the second substrate 20 are positioned.

  Further, the first substrate 60 is provided with a second recess 60 b in which a magnet 50 having an opening on the first substrate main surface 60 a facing the second substrate 20 can be accommodated. A component housing recess 60c having an opening is provided in the first substrate main surface 60a in which the component 40 can be stored. A second opening 60e having a through hole is formed in the bottom 60d of the component storage recess 60c. The presence or absence can be confirmed.

As shown in FIG. 4D, the magnet 50 is accommodated in the second recess 60b and placed on the bottom 60f of the second recess 60b. Similarly to the component storage device 100 according to the first embodiment, the bottom portion 60f serving as the placement surface of the magnet 50 has an arithmetic average roughness Ra2 ₂ as the surface roughness of the bottom portion 60f.
Ra1 ₁ > Ra2 ₂
It is preferable that the relationship is Incidentally, Ra1 ₁ is the arithmetic average roughness of the bottom portion 20e face of the first concave portion 20d formed in the second substrate 20. Furthermore, the distance (gap) δ between the end 50a of the magnet 50 and the bottom 20e is:
δ ≧ 0
It is preferable that

By realizing the above-mentioned arithmetic average surface roughness and the relationship between the first recess 20d of the second substrate 20 and the gap δ between the magnets, the magnet 50 placed on the bottom 60f of the second recess 60b Even if the bottom 20e of the first recess 20d and the end 50a of the magnet 50 are in close contact with each other, the attractive force between the bottom 60f of the second recess 60b of the first substrate 60 and the magnet 50 is P1 ₂ , the second. When the adsorption force between the substrate 20 and the magnet 50 is P2 ₁ , at least
P1 ₂ > P2 ₁
Thus, the magnet 50 can separate the second substrate 20 while being attracted to the first substrate 60 side.

Furthermore, since the magnet 50 has an attractive force P1 ₂ ′ generated by the magnetic force even between the side wall of the second recess 60b of the first substrate 60,
(P1 ₂ + P1 ₂ ′)> P2 ₁
Furthermore, the attracting force between the magnet 50 and the first substrate 60 is larger than the attracting force between the magnet 50 and the second substrate 20, and the magnet 50 is reliably attracted to the first substrate 60 side. The second substrate 20 can be separated.

Further, the relationship between the region of the first recess 20d in plan view and the region of the second recess 60b in which the magnet in the first substrate 60 is accommodated is as shown in the enlarged view of the M part in FIG. The first recess 20 d region is formed wider than the second recess 60 b region of the first substrate 60. By being formed in this way, the distance between the side wall of the first recess 20d and the magnet 50 can be increased, and the attractive force between the side wall of the first recess 20d and the magnet 50 can be reduced. The addition of the adsorption force to the adsorption force P2 ₁ between the substrate 20 and the magnet 50 is suppressed.

  In the component storage devices 100 and 110 described above, the first substrate 10 or the first substrate 60 and the second substrate 20 are laminated together by the attractive force of the magnet 50, and the first substrate 10 or the first substrate 60, The component 40 is accommodated in a space formed by the two substrates 20. By the assembling means using the attractive force of the magnet 50, the second substrate 20 and the first substrate 10 or the first substrate 60 can be easily attached and detached. In addition, since the first recess 20 d is formed in the second substrate 20, the second substrate 20 can be reduced in weight, and the second substrate 20 can be easily detached even if it is attracted and fixed by the magnet 50. Can be suppressed.

  In addition, since the second substrate 20 includes the first recess 20d, the magnet 50 can protrude toward the second substrate 20 side of the spacer 30 or the second substrate 20 side of the first substrate 60, and thus a larger magnet. 50 can be used. Therefore, the attractive force between the magnet 50, the first substrate 10, 60, and the second substrate 20 can be increased. Furthermore, in the component storage device 110 according to the second embodiment, when the second substrate 20 is separated, the magnet 50 remaining on the first substrate 60 protrudes toward the second substrate 20 side of the first substrate 60. Therefore, when replacing the magnet 50, the magnet 50 can be easily secured and the magnet 50 can be discharged from the second recess 60b.

  The component storage devices 100 and 110 can easily attach and detach the second substrate 20 when the component 40 is stored and discharged. Further, by storing the component 40 in the component storage devices 100 and 110, it becomes possible to handle the component 40 without directly touching the component 40, and damage and contamination of the component 40 can be prevented.

(Third embodiment)
FIG. 5 shows a component holder according to the third embodiment, (a) is a plan view, (b) is an enlarged cross-sectional view of the NN ′ portion shown in (a), and (c) is shown in (a). It is an expanded sectional view of PP 'part.

  A component holder 1000 according to the third embodiment shown in FIGS. 5A and 5B includes a first substrate 1010 that holds and holds an object to be held 1040, a second substrate 1020, and a first substrate 1010. A spacer 1030 having a thickness that allows the object to be held 1040 to be accommodated between the second substrate 1020 and a magnet 1050 for attracting the first substrate 1010 and the second substrate 1020 are provided. In this embodiment, the spacer 1030 is composed of a plurality of spacer bodies, in this embodiment, three spacer bodies 1031, 1032, and 1033. However, the present invention is not limited to this, and the spacer 1030 is appropriately selected depending on the thickness of the object to be held 1040. Can be set.

  In this embodiment, the component holder 1000 is used as a mounting jig for a sputtering apparatus when a thin film is formed by sputtering through an opening of a second substrate 1020 described later on the surface of an object to be held 1040. Therefore, since the second substrate 1020 has a function as a sputtering masking member, the second substrate 1020 is hereinafter referred to as a mask substrate 1020. Further, since the object to be held 1040 is a workpiece to be sputtered, the object to be held 1040 is hereinafter referred to as a workpiece 1040.

  Two guide pins 1011 are fixed to the first substrate 1010 by welding or the like, for example. Spacer body guide holes 1031a, 1032a, and 1033a of the spacer bodies 1031, 1032, and 1033 are formed so as to be guided and inserted through the guide pins 1011, and the mask substrate 1020 is mask substrate. A guide hole 1020a is formed. By inserting the spacer body guide holes 1031a, 1032a, 1033a through the guide pins 1011 and further through the mask substrate guide holes 1020a of the mask substrate 1020, the spacer 1030, the mask substrate 1020, Can be stacked while maintaining a predetermined positional relationship. Spacer body openings 1031b, 1032b, and 1033b for guiding the outer shape of the workpiece 1040 are formed in the spacer bodies 1031, 1032, and 1033, respectively, and assembled into the component holder 1000 to form the spacer opening 1030b.

  In the mask substrate 1020, a mask opening 1020b for allowing a coating material by sputtering to pass through a surface 1040a of the workpiece 1040 on the mask substrate 1020 side (hereinafter referred to as a processing surface 1040a) is formed. In the example of the component holder 1000 of the present embodiment, the mask opening 1020b is formed so as to cover almost the entire processing surface 1040a of the workpiece 1040. However, the present invention is not limited to this, and the shape of the mask opening 1020b of the mask substrate 1020 is set in accordance with a desired film shape. A first substrate opening 1010a is formed in the first substrate 1010. The first substrate opening 1010a is a surface of the workpiece 1040 due to contact between a surface 1010b of the first substrate 1010 on which the workpiece 1040 is placed on the mask substrate 1020 side (hereinafter referred to as a first substrate main surface 1010b) and the workpiece 1040. In order to prevent scratches, the workpiece 1040 is formed larger than the plan view shape. However, in order to hold the workpiece 1040, the first substrate opening 1010a is formed as follows.

  As shown in FIG. 5C, which shows a cross-section of the first substrate opening 1010a, the mask opening 1020b, and the workpiece 1040, taken along the line P-P 'in FIG. 5A, the corner 1040b of the workpiece 1040 has an opening 1010a. , 1020b, that is, overlaps Q1 and Q2 in plan view with the substrates 1010 and 1020 are provided. In this way, by holding the work 1040 between the first substrate 1010 and the mask substrate 1020 in the corner 1040b region of the work 1040, the work 1040 is held on the component holder 1000 without damaging the surface of the work 1040. be able to.

  The component holder 1000 according to the present embodiment includes the magnet 1050, thereby attracting the first substrate 1010 and the mask substrate 1020 so as to sandwich the spacer 1030 by attracting them in the stacking direction by magnetic force. As shown in FIG. 5B, the magnet 1050 is disposed in a magnet storage portion 1030 c provided in a plurality of locations on the spacer 1030. The magnet storage portion 1030c is configured by magnet storage openings 1031c, 1032c, and 1033c provided in the spacer bodies 1031, 1032, and 1033.

  Therefore, the first substrate 1010 and the mask substrate 1020 are formed of a magnet 1050 and a magnetic material having excellent adsorptivity, and it is preferable to use an iron-based or nickel-based alloy, for example, by using SUS631 of precipitation hardening stainless steel. The first substrate 1010 and the mask substrate 1020 having strength and corrosion resistance can be obtained. The spacer bodies 1031, 1032 and 1033 constituting the spacer 1030 are preferably formed of a nonmagnetic material. When the magnet 1050 is arranged by forming the spacer bodies 1031, 1032, and 1033 from a non-magnetic material, the magnet 1050 is an inner peripheral surface of the magnet housing openings 1031 c, 1032 c, and 1033 c of the spacer bodies 1031, 1032, and 1033 c Therefore, the incorporation of the magnet 1050 is not hindered. As the spacer bodies 1031, 1032, 1033, for example, austenitic stainless steel is preferably used, and SUS304-CSP or the like is used.

  The magnet placement surface region R (the hatched region in the drawing) on which the magnet 1050 is placed on the first substrate 1010 shown in FIG. 5A is the first in the component holder 1000 according to the present embodiment. Since the substrate 1010 has a flat plate shape, it is included in the plane of the first substrate main surface 1010b facing the second substrate 1020 of the first substrate 1010 as shown in FIG. The force with which the first substrate 1010 is attracted by the magnetic force of the magnet 1050, that is, the attracting force, can obtain a higher attracting force as the surface finish of the first substrate main surface 1010b is good, in other words, the smaller the surface roughness is (see FIG. 3 (a)).

In the finishing of the first substrate main surface 1010b of the first substrate 1010, the arithmetic average roughness Ra2 ₃ is Ra2 ₃ ≦ 0.2 (μm) in the surface grinding finishing performed to adjust the thickness of the first substrate 1010.
Surface finish can be obtained, and a high attractive force with the magnet 1050 can be ensured.

  On the other hand, the mask substrate 1020 includes a magnet as shown in FIG. 6B, which is an enlarged cross-sectional view of the S portion of FIG. 5B, and FIG. 6A, which is a plan external view of FIG. A mask recess 1020d as a first recess opening on the mask substrate main surface 1020c side is provided on a surface 1020c (hereinafter referred to as a mask substrate main surface 1020c) of the mask substrate 1020 corresponding to the storage area 1050 facing the first substrate 1010. Is formed.

The mask recess 1020d is formed, for example, by partially etching the mask substrate main surface 1020c. When the workpiece 1040 is held as the component holder 1000, the mask recess 1020d is masked at a position separated from the end portion 1050a of the magnet 1050 on the mask substrate 1020 side. The depth t of the mask recess 1020d is set so that the bottom 1020e of the recess 1020d is disposed. The depth t of the mask recess 1020d is set so that the bottom portion 1020e and the end portion 1050a of the magnet 1050 do not come into contact with each other in consideration of the variation of each component in the assembled state as the component holder 1000. Is preferred. That is, when the distance (gap) between the end portion 1050a and the bottom portion 1020e of the magnet 1050 is ε,
ε ≧ 0
It is preferable that

Furthermore, the bottom 1020e of the mask recess 1020d is rougher than the arithmetic average roughness Ra2 ₃ of the finish of the magnet placement surface region R (see FIG. 5A) of the first substrate 1010, that is, the finish of the first substrate main surface 1010b. it is preferable to, when the arithmetic mean roughness Ra1 ₃ surface roughness of the bottom 1020e of the mask recess 1020d,
Ra1 ₃ > Ra2 ₃
It is preferable that the relationship is

As described with reference to FIG. 3, the relationship between ε, Ra1 ₃ , and Ra2 ₃ described above indicates that the first substrate 1010 and the mask substrate 1020 are separated from each other and disassembled, so that the first substrate 1010 and the magnet 1050 are attracted to each other. Is P1 ₃ , and the attractive force between the mask substrate 1020 and the magnet 1050 is P2 ₃ ,
P1 ₃ > P2 ₃
Thus, the mask substrate 1020 can be separated while the magnet 1050 is attracted to the first substrate 1010 side.

Further, the relationship between the mask recess 1020d region in plan view and the magnet storage portion 1030c region in the spacer 1030 is as follows. As shown in FIG. 6A, the mask recess 1020d region is more than the magnet storage portion 1030c region in the spacer 1030. Widely formed. By forming in this way, the distance between the side wall of the mask recess 1020d and the magnet 1050 can be increased, and the attractive force between the side wall of the mask recess 1020d and the magnet 1050 can be reduced, and the mask substrate 1020 and the magnet 1050 can be reduced. it is possible to reduce the suction force P2 ₃ with.

  When a film is formed on the workpiece 1040 by sputtering using the component holder 1000, the coating material to be processed on the workpiece 1040 is attached to the mask substrate 1020 as well. Then, by repeatedly performing sputtering using the component holder 1000, the coating material attached to the mask substrate 1020 is laminated in layers, and the coating material is partially peeled off during the sputtering process, and attached to the workpiece 1040. It will cause defective products. Therefore, the mask substrate 1020 is peeled and washed after the predetermined number of repeated uses.

  The coating material is mainly a metal material, and the peeling cleaning is performed by immersing in a metal solution such as nitric acid. However, the magnet 1050 is a material that is easily eroded by a metal solution, and the mask substrate 1020 must be peeled and cleaned after the magnet 1050 is reliably removed from the mask substrate 1020. Therefore, by using the component holder 1000 according to the present embodiment, as described above, the magnet 1050 can be attracted to the first substrate 1010 and separated from the mask substrate 1020, that is, the mask 1050 does not remain on the mask substrate 1020. Since the substrate 1020 can be separated, workability is improved and productivity can be improved.

  In addition, the component holder 1000 is used in a sputtering apparatus in a high temperature environment, but the magnet 1050 causes a decrease in magnetic force in a high temperature environment. Therefore, it is necessary to replace the magnet 1050 with one having a predetermined magnetic force every predetermined number of repeated uses. At this time, since the first substrate 1010 and the magnet 1050 are combined only by an attractive force due to magnetic force, the magnet 1050 can be easily removed from the first substrate 1010, and productivity can be improved. .

(Fourth embodiment)
FIG. 7 shows a component holder according to the fourth embodiment, wherein (a) is a plan view, (b) is a cross-sectional view of the TT ′ portion shown in (a), and (c) is a U shown in (a). -D 'is a cross-sectional view of the cross-sectional view of the U' part, and (d) is an enlarged view of the V part shown in (c). The component holder 1100 according to the fourth embodiment is different in that the first substrate 1010 and the spacer 1030 (spacer bodies 1031, 1032, 1033) in the component holder 1000 according to the third embodiment are integrated. It is. Therefore, in description of the component holder 1100 which concerns on 4th Embodiment, the same code | symbol is attached | subjected to the same component as the component holder 1000 which concerns on 3rd Embodiment, and description is abbreviate | omitted.

  As shown in FIGS. 7A and 7B, the component holder 1100 can commonly use the mask substrate 1020 provided in the component holder 1000 according to the third embodiment. Two guide pins 1061 are fixed to the first substrate 1060 on a surface 1060a (hereinafter referred to as a first substrate main surface 1060a) facing the mask substrate 1020 by, for example, welding. The guide pins 1061 are inserted into the mask substrate guide holes 1020a of the mask substrate 1020, and the first substrate 1060 and the mask substrate 1020 are positioned.

  The first substrate 1060 is provided with a first substrate recess 1060b as a second recess capable of accommodating a magnet 1050 having an opening on the first substrate main surface 1060a facing the mask substrate 1020. The first substrate main surface 1060a that can store the workpiece 1040 is provided with a component storage recess 1060c having an opening. A second opening 1060e of a through hole is formed in the bottom 1060d of the component storage recess 1060c. The presence or absence can be confirmed.

As shown in FIG. 7D, the magnet 1050 is housed in the first substrate recess 1060b, and is placed on the bottom 1060f of the first substrate recess 1060b. Similarly to the component holder 1000 according to the third embodiment, the bottom portion 1060f serving as the placement surface of the magnet 1050 has an arithmetic average roughness Ra2 ₄ as the surface roughness of the bottom portion 1060f.
Ra1 ₃ > Ra2 ₄
It is preferable that the relationship is Incidentally, Ra1 ₃ is the arithmetic mean roughness of the bottom 1020e surface of the mask recess 1020d formed on a mask substrate 1020. Furthermore, the distance (gap) ε between the end 1050a and the bottom 1020e of the magnet 1050 is
ε ≧ 0
It is preferable that

By realizing the arithmetic average surface roughness and the relationship between the mask recess 1020d of the mask substrate 1020 and the gap ε between the magnets, the mask recess with respect to the magnet 1050 placed on the bottom 1060f of the first substrate recess 1060b. and the end portion 1050a of the bottom 1020e and the magnet 1050 1020d, even if the close contact, when the bottom 1060f of the first substrate recess 1060b of the first substrate 1060, the suction force of the magnet 1050 was P1 _4, The attractive force between the mask substrate 1020 and the magnet 1050 is P2 ₃ described above,
P1 ₄ > P2 ₃
Thus, the mask substrate 1020 can be separated while the magnet 1050 is attracted to the first substrate 1060 side.

Further, since the magnet 1050 has an attractive force P1 ₄ ′ due to the magnetic force between the first substrate 1060 and the side wall of the first substrate recess 1060b,
(P1 ₄ + P1 ₄ ′)> P2 ₃
Furthermore, the attractive force between the magnet 1050 and the first substrate 1060 is larger than the attractive force between the magnet 1050 and the mask substrate 1020, and the mask is securely attached to the first substrate 1060 side. The substrate 1020 can be separated.

Further, the relationship between the mask recess 1020d region in plan view and the first substrate recess 1060b in which the magnet 1050 of the first substrate 1060 is accommodated is as shown in the enlarged view of the W portion in FIG. The 1020d region is formed wider than the first substrate recess 1060b region of the first substrate 1060. By forming in this way, the distance between the side wall of the mask recess 1020d and the magnet 1050 can be increased, and the attractive force between the side wall of the mask recess 1020d and the magnet 1050 can be reduced. The addition of the attractive force to P2 ₃ that is the attractive force with the magnet 1050 is suppressed.

  In the component holders 1000 and 1100 described above, the first substrate 1010 or the first substrate 1060 and the mask substrate 1020 are stacked on each other by the attractive force of the magnet 1050, and the first substrate 1010 or the first substrate 1060 and the second substrate 1010 are stacked. The workpiece 1040 is sandwiched and held by the substrate 1020. By the assembling means using the attractive force of the magnet 1050, the mask substrate 1020 and the first substrate 1010 or the first substrate 1060 can be easily attached and detached, and the productivity of the work for replacing the workpiece 1040 can be improved. it can. Further, by forming the mask recess 1020d in the mask substrate 1020, it is possible to reduce the weight of the mask substrate 1020 and to prevent the mask substrate 1020 from being easily detached.

  Further, by providing the mask substrate 1020 with the mask recess 1020d, the magnet 1050 is protruded to the mask substrate 1020 side of the spacer 1030 in the component holder 1000 or to the mask substrate 1020 side of the first substrate 1060 in the component holder 1100. Therefore, a large magnet 1050 can be used. Therefore, the attractive force between the magnet 1050, the first substrates 1010 and 1060, and the mask substrate 1020 can be increased. Furthermore, in the component holder 1100 according to the fourth embodiment, when the mask substrate 1020 is separated, the magnet 1050 remaining on the first substrate 1060 protrudes toward the mask substrate 1020 side of the first substrate 1060. When exchanging the magnet 1050, the magnet 1050 can be easily secured, and the magnet 1050 can be discharged from the first substrate recess 1060b.

  By using the component holders 1000 and 1100, the magnet 1050 can be attracted to the first substrate 1010 and 1060 to separate the mask substrate 1020, that is, the mask substrate 1020 is separated without leaving the magnet 1050 on the mask substrate 1020. Therefore, the workability related to the cleaning of the mask substrate 1020 is good, and the productivity can be improved. In addition, in the replacement work of the magnet 1050 used in the sputtering apparatus in a high temperature environment and causing a decrease in magnetic force, the first substrate 1010, 1060 and the magnet 1050 are combined only by the attractive force due to the magnetic force. The magnet 1050 can be easily removed from the first substrate 1010, and productivity can be improved.

  DESCRIPTION OF SYMBOLS 10 ... 1st board | substrate, 20 ... 2nd board | substrate, 30 ... Spacer, 40 ... Components, 50 ... Magnet, 100 ... Components storage tool.

Claims (10)

A first substrate;
A second substrate,
The first substrate and the second substrate are arranged so as to overlap each other in a plan view, and a component storage device in which components are arranged between the first substrate and the second substrate,
A space capable of accommodating a magnet is formed between the first substrate and the second substrate,
The space includes a bottom surface of a first recess provided on a surface of the second substrate facing the first substrate, and a magnet placement surface provided on a surface of the first substrate facing the bottom surface of the first recess. Including
At least the bottom surface of the first recess and the magnet placement surface have magnetism,
Separating the bottom surface of the first recess from the surface of the magnet facing the bottom surface of the first recess,
A component storage device characterized by that. When the arithmetic average roughness of the bottom surface of the first recess is Ra1, and the arithmetic average roughness of the magnet mounting surface is Ra2,
Ra1> Ra2
The component storage device according to claim 1, wherein the component storage device is a component storage device. The second substrate has a second concave portion on the surface facing the first substrate, the bottom surface of which is the magnet mounting surface,
The edge of the opening of the second recess is an inner region of the edge of the opening of the first recess,
The component storage device according to claim 1, wherein the component storage device is a component storage device. The second substrate is
A substrate portion comprising the magnet mounting surface;
A spacer portion disposed between the substrate portion and the first substrate;
The magnetism of the spacer portion is lower than the magnetism of the magnet mounting surface,
The component storage device according to claim 1, wherein the component storage device is a component storage device. A portion of the second substrate contacts the first substrate in the stacking direction;
The component storage device according to claim 1, wherein the component storage device is a component storage device. A first substrate;
A second substrate;
The first substrate and the second substrate are arranged so as to overlap in a plan view, and include a magnet disposed between the first substrate and the second substrate,
A space capable of accommodating the magnet is formed between the first substrate and the second substrate,
The space includes a bottom surface of a first recess provided on a surface of the second substrate facing the first substrate, and a magnet placement surface provided on a surface of the first substrate facing the bottom surface of the first recess. Including
At least the bottom surface of the first recess and the magnet placement surface have magnetism,
The bottom surface of the first recess and the surface of the magnet facing the bottom surface of the first recess are spaced apart,
A component holder characterized by that. When the arithmetic average roughness of the bottom surface of the first recess is Ra1, and the arithmetic average roughness of the magnet mounting surface is Ra2,
Ra1> Ra2
The component holder according to claim 6, wherein: The second substrate has a second concave portion on the surface facing the first substrate, the bottom surface of which is the magnet mounting surface,
The edge of the opening of the second recess is an inner region of the edge of the opening of the first recess,
The component holder according to claim 6 or 7, wherein: The second substrate is
A substrate portion comprising the magnet mounting surface;
A spacer portion disposed between the substrate portion and the first substrate;
The magnetism of the spacer portion is lower than the magnetism of the magnet mounting surface,
The component holder according to any one of claims 6 to 8, wherein the component holder is provided. A portion of the second substrate contacts the first substrate in the stacking direction;
The component holder according to any one of claims 6 to 9, wherein:

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