JP2015218187A - White curable composition for optical semiconductor device and molding for optical semiconductor device and optical semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a white curable composition for optical semiconductor devices which is low in light transmissivity even when the frame part of a molding is thinned, thereby allows increase of the reflectance and suppresses occurrence of cracks owing to high strength.SOLUTION: A white curable composition for optical semiconductor devices is used to obtain a molding which is to be arranged laterally relative to an optical semiconductor element in an optical semiconductor device and is white. When the white curable composition for optical semiconductor devices is molded into a sheet of the thickness of 50 μm, the sheet has a transmissivity at the wavelength of 450 nm of 10% or lower.

Description

  The present invention relates to a white curable composition for an optical semiconductor device used for obtaining a molded body having a frame portion disposed on the side of an optical semiconductor element in an optical semiconductor device. Moreover, this invention relates to the molded object for optical semiconductor devices and optical semiconductor device which used the said white curable composition for optical semiconductor devices.

  An optical semiconductor device such as a light emitting diode (LED) device has low power consumption and long life. Moreover, the optical semiconductor device can be used even in a harsh environment. Accordingly, optical semiconductor devices are used in a wide range of applications such as mobile phone backlights, liquid crystal television backlights, automobile lamps, lighting fixtures, and signboards.

  When an optical semiconductor element (for example, an LED), which is a light emitting element used in an optical semiconductor device, is in direct contact with the atmosphere, the light emission characteristics of the optical semiconductor element rapidly deteriorate due to moisture in the atmosphere or floating dust. For this reason, the said optical semiconductor element is normally sealed with the sealing compound for optical semiconductor devices. In order to fill the sealant, a molded body having a frame portion is disposed on a lead frame on which the optical semiconductor element is mounted. The sealing agent is filled inside the molded body having the frame portion. The molded body may be called a reflector, a case material, or a housing.

  As an example of a molding material for obtaining the molded body, the following Patent Document 1 discloses a curable composition containing an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a white pigment, and a coupling agent. Has been.

  Patent Document 2 below discloses a curable composition containing an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a white pigment.

JP 2010-74124 A JP2011-009519A

  In recent years, with the miniaturization of optical semiconductor devices, the frame portion of the molded body has been made thinner. When the frame portion is thinned, in the conventional molding materials as described in Patent Documents 1 and 2, light emitted from the optical semiconductor device is easily transmitted through the frame portion, and the luminance of the optical semiconductor device is lowered. In addition, when the frame portion is thinned, the strength of the frame portion is lowered, and cracks may occur during transfer molding.

  An object of the present invention is to provide an optical semiconductor capable of suppressing the occurrence of cracks because the light transmittance is low even when the frame portion of the molded body is thin, and thus the reflectance can be increased and the strength is high. It is to provide a white curable composition for a device.

  Another object of the present invention is to provide a molded body for an optical semiconductor device and an optical semiconductor device using the white curable composition for an optical semiconductor device.

  According to a wide aspect of the present invention, there is provided a white curable composition for an optical semiconductor device, which is used for obtaining a molded body having a frame portion disposed on a side of an optical semiconductor element in an optical semiconductor device and is white. When the white curable composition for optical semiconductor devices is molded into a sheet having a thickness of 50 μm, a white curable composition for optical semiconductor devices is provided in which the transmittance of the sheet at a wavelength of 450 nm is 10% or less. The

  In a specific aspect of the white curable composition for optical semiconductor devices according to the present invention, the curable composition comprises an epoxy compound, an acid anhydride curing agent, a white pigment, and a filler other than the white pigment, And a filler other than the white pigment does not include a filler having a particle size of 50 μm or more, or a filler having a particle size of 50 μm or more is preferably less than 1.5% by weight. , More preferably less than 1% by weight.

  The average particle diameter of the filler other than the white pigment is preferably 1 μm or more and 40 μm or less.

  In a specific aspect of the white curable composition for an optical semiconductor device according to the present invention, when the white curable composition for an optical semiconductor device is molded into a sheet having a thickness of 50 μm, the tensile strength of the sheet is 65 MPa or more. .

  The white pigment is preferably titanium oxide, zinc oxide or zirconium oxide. The filler other than the white pigment is preferably silica.

  In a specific aspect of the white curable composition for an optical semiconductor device according to the present invention, the curable composition is used for obtaining a molded body disposed on a lead frame on which an optical semiconductor element is mounted in the optical semiconductor device. Used for.

  According to a wide aspect of the present invention, a molded body having a frame portion disposed on the side of an optical semiconductor element in an optical semiconductor device, which is obtained by curing the above-described white curable composition for an optical semiconductor device. An optical semiconductor device molded body is provided.

  According to a wide aspect of the present invention, a lead frame, an optical semiconductor element mounted on the lead frame, and a frame disposed on the lead frame and disposed on a side of the optical semiconductor element. There is provided an optical semiconductor device that is obtained by curing the white curable composition for optical semiconductor devices described above.

  The white curable composition for optical semiconductor devices according to the present invention has a transmittance of 10% or less at a wavelength of 450 nm when the white curable composition for optical semiconductor devices is molded into a sheet having a thickness of 50 μm. Even if the frame portion of the molded body is thinned, the light transmittance is low, so that the reflectance can be increased and the strength is high, so that the occurrence of cracks can be suppressed.

1A and 1B are a cross-sectional view and a perspective view schematically showing an example of an optical semiconductor device including a molded body using a white curable composition for an optical semiconductor device according to an embodiment of the present invention. It is. FIG. 2 is a cross-sectional view schematically showing a modification of the optical semiconductor device shown in FIG. FIG. 3 is a cross-sectional view schematically showing a modification of the optical semiconductor device shown in FIG. FIG. 4 schematically illustrates an example of a pre-division optical semiconductor device component including a pre-division molded body in which a plurality of molded bodies using a white curable composition for an optical semiconductor device according to an embodiment of the present invention is connected. It is sectional drawing shown. FIG. 5 is a cross-sectional view schematically showing an example of a pre-division optical semiconductor device including a pre-division molded body in which a plurality of molded bodies using a white curable composition for an optical semiconductor device according to an embodiment of the present invention are connected. FIG.

  Hereinafter, the present invention will be described in detail.

(White curable composition for optical semiconductor devices)
A white curable composition for an optical semiconductor device according to the present invention (hereinafter sometimes referred to as a curable composition) is a molded body having a frame portion disposed on the side of an optical semiconductor element in an optical semiconductor device. Used to get. The curable composition according to the present invention is a white curable composition for an optical semiconductor device.

  When the curable composition according to the present invention is molded into a sheet having a thickness of 50 μm, the transmittance of the sheet at a wavelength of 450 nm is 10% or less.

  By adopting the above-described configuration of the curable composition according to the present invention, the transmittance of light emitted from the optical semiconductor device is reduced even if the frame portion obtained by molding the curable composition is thin. And the reflectance can be increased. Furthermore, the strength of the frame portion can be increased, and the occurrence of cracks during transfer molding can be suppressed.

  The transmittance of the sheet is 10% or less, preferably 9% or less, more preferably 7% or less. The reflectance of a molded object can be raised because the transmittance | permeability is 10% or less. The lower the transmittance, the better, and the lower the transmittance, the higher the reflectance of the molded body.

  The transmittance can be measured as follows. A white curable composition for optical semiconductors is heated and pressed at 170 ° C. for 5 minutes to produce a sheet having a thickness of 50 μm. About the produced sheet | seat, the transmittance | permeability in wavelength 450nm is measured using a spectrophotometer.

  Examples of the method of setting the transmittance to 10% or less include a method of adjusting the ratio of the specific particle size of the filler other than the white pigment described later.

  When the curable composition according to the present invention is molded into a sheet having a thickness of 50 μm, the tensile strength of the sheet is preferably 65 MPa or more, more preferably 70 MPa or more, still more preferably 80 MPa or more, and particularly preferably 90 MPa or more. . When the tensile strength is 65 MPa or more, generation of cracks and chips can be suppressed when the molded body is taken out from the mold during transfer molding. The higher the tensile strength, the better. The higher the tensile strength, the more the generation of cracks and chips can be further suppressed.

  The curable composition according to the present invention preferably includes an epoxy compound (A), preferably includes a curing agent (B), preferably includes a white pigment (C), and a filler other than the white pigment ( D) is preferably included, and a curing accelerator (E) is preferably included.

  Hereinafter, the detail of each component which can be used for the curable composition which concerns on this invention is demonstrated.

[Epoxy compound (A)]
It is preferable that the said curable composition contains the said epoxy compound (A) so that it can harden | cure by provision of a heat | fever. The epoxy compound (A) has an epoxy group. By using the said epoxy compound (A) as a thermosetting compound, the heat resistance and insulation reliability of a molded object become high. As for the said epoxy compound (A), only 1 type may be used and 2 or more types may be used together.

  Specific examples of the epoxy compound (A) include a bisphenol type epoxy compound, a novolac type epoxy compound, a glycidyl ester type epoxy compound obtained by reacting a polychloric acid compound and epichlorohydrin, a polyamine compound and epichlorohydride. Glycidylamine type epoxy compounds, glycidyl ether type epoxy compounds, aliphatic epoxy compounds, hydrogenated aromatic epoxy compounds, epoxy compounds having an alicyclic skeleton, and heterocyclic epoxy compounds obtained by reacting with phosphorus Can be mentioned. Examples of the polychloric acid compound include phthalic acid and dimer acid. Examples of the polyamine compound include diaminodiphenylmethane and isocyanuric acid.

  Examples of the bisphenol type epoxy compound include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, and diglycidyl ethers such as alkyl-substituted bisphenols. As said novolak-type epoxy compound, a phenol novolak-type epoxy compound, an ortho cresol novolak-type epoxy compound, etc. are mentioned. Examples of the heterocyclic epoxy compound include diglycidyl isocyanurate and triglycidyl isocyanurate.

  The epoxy compound (A) is preferably colorless or has a color close to colorless. Therefore, the epoxy compound (A) is preferably a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a bisphenol S type epoxy compound, diglycidyl isocyanurate or triglycidyl isocyanurate.

  From the viewpoint of further reducing the brightness of light emitted from the optical semiconductor device, it is preferable to use an epoxy compound having excellent heat resistance as the epoxy compound (A). For this reason, an alicyclic epoxy compound or triglycidyl isocyanurate is preferable, and triglycidyl isocyanurate is more preferable.

  From the viewpoint of further suppressing the deterioration of the quality of the optical semiconductor device due to use in a harsh environment, the epoxy compound (A) preferably contains an epoxy compound having no aromatic skeleton, It is preferable that it is an epoxy compound which does not have.

  The epoxy equivalent of the epoxy compound (A) is preferably 50 or more, more preferably 100 or more, preferably 500 or less, more preferably 300 or less. The epoxy equivalent of the epoxy compound (A) is particularly preferably 300 or less. When the epoxy equivalent is not less than the above lower limit and not more than the above upper limit, the continuous moldability of the curable composition and the adhesion of the molded body to the adhesion target are further enhanced.

  The compounding quantity of the said epoxy compound (A) is suitably adjusted so that it may harden | cure moderately by provision of heat, and is not specifically limited. The content of the epoxy compound (A) in 100% by weight of the curable composition is preferably 1% by weight or more, more preferably 3% by weight or more, still more preferably 5% by weight or more, preferably 99% by weight or less. More preferably, it is 95 weight% or less, More preferably, it is 80 weight% or less. When the content of the epoxy compound (A) is not less than the above lower limit, the curable composition is more effectively cured by heating. When the content of the epoxy compound (A) is not more than the above upper limit, the heat resistance of the molded body is further increased.

[Curing agent (B)]
The curable composition preferably contains the curing agent (B) so that it can be efficiently cured by application of heat. The curing agent (B) cures the epoxy compound (A). The curing agent (B) is preferably an acid anhydride curing agent. By using the acid anhydride curing agent, adhesion with a member such as a sealant or a lead frame that is in contact with the molded body is increased. In addition, by using the acid anhydride curing agent, the curability can be kept high and the molding unevenness of the molded body can be further suppressed. As the acid anhydride curing agent, a known acid anhydride curing agent used as a curing agent for the epoxy compound (A) can be used. As for the said hardening | curing agent (B), only 1 type may be used and 2 or more types may be used together.

  As the acid anhydride curing agent, any of an acid anhydride having an aromatic skeleton and an acid anhydride having an alicyclic skeleton can be used.

  Preferred examples of the acid anhydride curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, glutaric anhydride. And methylhexahydrophthalic anhydride and methyltetrahydrophthalic anhydride.

  The acid anhydride curing agent preferably does not have a double bond. Preferable acid anhydride curing agents having no double bond include hexahydrophthalic anhydride and methylhexahydrophthalic anhydride.

  The mixing ratio of the epoxy compound (A) and the curing agent (B) is not particularly limited. The content of the curing agent (B) (acid anhydride curing agent) with respect to 100 parts by weight of the epoxy compound (A) is preferably 0.5 parts by weight or more, more preferably 1 part by weight or more, and still more preferably. Is 2 parts by weight or more, particularly preferably 3 parts by weight or more, preferably 500 parts by weight or less, more preferably 300 parts by weight or less, still more preferably 200 parts by weight or less, particularly preferably 100 parts by weight or less. A curable composition can be hardened | cured favorably as the said hardening | curing agent (B) is more than the said minimum and below the said upper limit.

  In the curable composition, the equivalent ratio (epoxy equivalent: hardener equivalent) of the epoxy equivalent of the entire epoxy compound (A) and the hardener equivalent of the entire hardener (B) is 0.3: 1 to 3: 1 is preferable, and 1.3: 1 to 2: 1 is more preferable. When the equivalent ratio (epoxy equivalent: acid anhydride curing agent equivalent) satisfies the above range, the heat resistance and weather resistance of the molded article are further enhanced.

[White pigment (C)]
The curable composition preferably contains the white pigment (C). By using the white pigment (C), a molded article having high light reflectance can be obtained. Further, by using the white pigment (C), a molded article having a high light reflectance can be obtained as compared with the case where only the filler other than the white pigment (C) is used. The white pigment (C) is not particularly limited. A conventionally known white pigment can be used as the white pigment (C). As for the said white pigment (C), only 1 type may be used and 2 or more types may be used together.

  Examples of the white pigment (C) include alumina, titanium oxide, zinc oxide, zirconium oxide, antimony oxide and magnesium oxide.

  From the viewpoint of further increasing the light reflectance of the molded product, the white pigment (C) is preferably titanium oxide, zinc oxide or zirconium oxide. When this preferred white pigment is used, one or more white pigments can be used among titanium oxide, zinc oxide and zirconium oxide. The white pigment (C) is preferably titanium oxide or zinc oxide, preferably titanium oxide, and preferably zinc oxide. The white pigment (C) may be zirconium oxide.

  The titanium oxide is preferably rutile titanium oxide. By using rutile type titanium oxide, the heat resistance of the molded body is further increased, and even if the optical semiconductor device is used in a harsh environment, the quality is hardly lowered.

  The titanium oxide is preferably rutile type titanium oxide surface-treated with aluminum oxide. In 100% by weight of the white pigment (C), the content of rutile titanium oxide surface-treated with the aluminum oxide is preferably 10% by weight or more, more preferably 30% by weight or more and 100% by weight or less. The total amount of the white pigment (C) may be rutile titanium oxide surface-treated with the aluminum oxide. The use of rutile titanium oxide surface-treated with the aluminum oxide further increases the heat resistance of the molded body.

  Examples of the rutile-type titanium oxide surface-treated with the aluminum oxide include, for example, “CR-90-2” manufactured by Ishihara Sangyo Co., Ltd., which is rutile chlorine method titanium oxide, and “CR, manufactured by Ishihara Sangyo Co., Ltd., which is rutile chlorine method titanium oxide. -58 "," R-900 "manufactured by DuPont which is rutile chlorine method titanium oxide, and" R-630 "manufactured by Ishihara Sangyo Co., Ltd. which is rutile sulfuric acid method titanium oxide.

  The zinc oxide is preferably surface-treated zinc oxide. From the viewpoint of further improving the workability of the molded body and the light reflectivity of the molded body, the zinc oxide is preferably surface-treated with a material containing silicon, aluminum or zirconia, and the surface is made of a material containing silicon. More preferably, it has been treated. The material containing silicon is preferably a silicone compound.

  The zirconium oxide is preferably surface-treated zirconium oxide. From the viewpoint of further improving the workability of the molded body and the light reflectivity of the molded body, the zirconium oxide is preferably surface-treated with a material containing silicon, aluminum or zirconia, and the surface is treated with a material containing silicon. More preferably, it has been treated. The material containing silicon is preferably a silicone compound.

  The surface treatment method is not particularly limited. As a surface treatment method, a dry method, a wet method, an integral blend method, and other known and commonly used surface treatment methods can be used.

  The average particle diameter of the white pigment (C) is preferably 0.1 μm or more, and preferably 40 μm or less. When the average particle size is not less than the above lower limit, the light reflectance of the molded body can be further increased, and when it is not more than the above upper limit, the light reflectance of the molded body can be further increased.

  In 100% by weight of the curable composition, the content of the white pigment (C) and the content of the titanium oxide are each preferably 3% by weight or more, more preferably 5% by weight or more, and further preferably 7% by weight. Above, particularly preferably 10% by weight or more, preferably 95% by weight or less, more preferably 90% by weight or less, still more preferably 85% by weight or less. When the content of the white pigment (C) is not less than the above lower limit and not more than the above upper limit, the light reflectance of the molded body is further increased, and the moldability of the curable composition is further enhanced.

[Filler (D)]
The filler (D) is a filler other than the white pigment. The filler (D) is different from the white pigment (C). As for the said filler (D), only 1 type may be used and 2 or more types may be used together.

  Any of an inorganic filler and an organic filler can be used as the filler (D). Specific examples of the filler (D) include silica, mica, beryllia, potassium titanate, barium titanate, strontium titanate, calcium titanate, antimony oxide, aluminum borate, aluminum hydroxide, magnesium oxide, calcium carbonate. , Magnesium carbonate, aluminum carbonate, calcium silicate, aluminum silicate, magnesium silicate, calcium phosphate, calcium sulfate, barium sulfate, silicon nitride, boron nitride, calcined clay clay, talc, silicon carbide, crosslinked acrylic resin particles and Examples thereof include silicone particles. The filler (D) is preferably an inorganic filler. The filler (D) is not titanium oxide, which is a white pigment, is not zinc oxide, which is a white pigment, and is not zirconium oxide, which is a white pigment.

  From the viewpoint of further improving the moldability of the curable composition and the adhesion between the molded body and the adhesion target, the filler (D) preferably contains silica, more preferably silica. preferable.

  The filler (D) other than the white pigment preferably does not contain a filler having a particle size of 50 μm or more, or contains less than 1.5% by weight of a filler having a particle size of 50 μm or more. That is, the smaller the content of the filler having a particle size of 50 μm or more, the better. When the content of the filler having a particle size of 50 μm or more is less than 1.5% by weight, the transmittance of the molded body can be reduced and the light reflectance can be further increased. The content of the filler having a particle size of 50 μm or more in the filler (D) other than the white pigment is more preferably less than 1% by weight. As the content of the filler having a particle size of 50 μm or more is small, the inventors of the present invention have a considerably low light transmittance even when the frame portion of the molded body is thinned, thereby further increasing the reflectance. It has been found that not only can the strength be increased, but the strength can be considerably increased to suppress the occurrence of cracks.

  The proportion of the filler having a particle size of 50 μm or more can be measured as follows.

  50 g of filler (D) other than the white pigment is dispersed in 150 g of acetone while applying ultrasonic waves. Next, the mixture is filtered through a mesh having a mesh size of 50 μm, and the portion not passing through the mesh is air-dried, and then the weight is measured.

  As the filler (D) having a particle size of 50 μm or more and less than 1% by weight, “MSR-3512-SC4” manufactured by Tatsumori Co., Ltd. (the ratio of the particle size of 50 μm or more is 0.1% by weight) ), “MSR-3512-SC3” (the ratio of the particle diameter of 50 μm or more is 0.8% by weight), and the like. Further, the ratio of the particle diameter of 50 μm or more may be controlled by sieving the filler.

  The average particle diameter of the filler (D) is preferably 1 μm or more, and preferably 40 μm or less. When the average particle size is equal to or more than the lower limit, the strength of the molded body is further increased, and cracks during transfer molding can be further suppressed.

  The average particle size in the filler (D) is a particle size value when the integrated value is 50% in the volume-based particle size distribution curve. The average particle size can be measured using, for example, a laser beam type particle size distribution meter. As a commercial product of the laser beam type particle size distribution analyzer, “LS 13 320” manufactured by Beckman Coulter, Inc. can be cited.

  In 100% by weight of the curable composition, the content of the filler (D) and the content of the silica are each preferably 5% by weight or more, more preferably 10% by weight or more, and further preferably 20% by weight or more. Preferably, it is 95 weight% or less, More preferably, it is 90 weight% or less, More preferably, it is 85 weight% or less. When the content of the filler (D) and the content of the silica are not less than the above lower limit and not more than the above upper limit, the moldability of the curable composition is further enhanced. When the content of the filler (D) and the content of the silica are not more than the upper limit, the light reflectance of the molded body is further increased.

  In 100% by weight of the curable composition, the total content of the white pigment (C) and the filler (D) is preferably 20% by weight or more, more preferably 50% by weight or more, and still more preferably 60%. % By weight or more, preferably 95% by weight or less, more preferably 90% by weight or less, and still more preferably 85% by weight or less. When the total content of the white pigment (C) and the filler (D) is not less than the above lower limit and not more than the above upper limit, the moldability of the curable composition and the light reflectance of the molded body are even higher. Thus, the fluidity of the curable composition becomes even more appropriate. Moreover, when the total content of the white pigment (C) and the filler (D) is 50% by weight or more, the strength of the molded body is further increased, and the fluidity of the curable composition is further increased. Become moderate.

  In 100% by weight of the curable composition, the content of the filler having a particle size of 50 μm or more contained in the filler (D) is preferably 1% by weight or less, more preferably 0.5% by weight or less, particularly Preferably, it is 0% by weight (not contained).

[Curing accelerator (E)]
It is preferable that the said curable composition contains a hardening accelerator (E). By using the curing accelerator (E), the curability of the curable composition can be increased, and the heat resistance of the molded body can be further increased. As for the said hardening accelerator (E), only 1 type may be used and 2 or more types may be used together.

  Examples of the curing accelerator (E) include urea compounds, onium salt compounds, imidazole compounds, phosphorus compounds, amine compounds, and organometallic compounds.

  Examples of the urea compound include urea, aliphatic urea compounds, and aromatic urea compounds. Specific examples of the urea compound include urea, methylurea, 1,1-dimethylurea, 1,3-dimethylurea, 1,1,3,3-tetramethylurea, 1,3-diphenylurea, and tri-n-. Examples include butylthiourea. Urea compounds other than these may be used.

  Examples of the onium salt compounds include ammonium salts, phosphonium salts, and sulfonium salt compounds.

  Examples of the imidazole compound include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-un Decylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 ′ -Methyl Midazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 [2′-Ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine Isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-dihydroxymethylimidazole Can be mentioned.

  The phosphorus compound contains phosphorus and is a phosphorus-containing compound. Examples of the phosphorus compound include triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetra-n-butylphosphonium-o, o-diethylphosphorodithioate, tetra-n-butylphosphonium-tetrafluoroborate, and tetra-n-. Examples thereof include butylphosphonium-tetraphenylborate. Phosphorus compounds other than these may be used.

  Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine, 4,4-dimethylaminopyridine, diazabicycloalkane, diazabicycloalkene, quaternary ammonium salt, triethylenediamine, and tri-2,4. , 6-dimethylaminomethylphenol. You may use the salt of these compounds.

  Examples of the organometallic compound include alkali metal compounds and alkaline earth metal compounds. Specific examples of the organometallic compound include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), and trisacetylacetonate cobalt (III).

  From the viewpoint of further enhancing the curability of the curable composition and further enhancing the heat resistance of the molded body, the curing accelerator (E) is preferably a urea compound, an onium salt compound, or a phosphorus compound. . The curing accelerator (E) is preferably a urea compound, preferably an onium salt compound, and preferably a phosphorus compound.

  The mixing ratio of the epoxy compound (A) and the curing accelerator (E) is not particularly limited. The content of the curing accelerator (E) with respect to 100 parts by weight of the epoxy compound (A) is preferably 0.01 parts by weight or more, more preferably 0.1 parts by weight or more, preferably 100 parts by weight or less. More preferably, it is 10 parts by weight or less, and still more preferably 5 parts by weight or less.

[Release agent (F)]
The curable composition does not contain or contains the release agent (F). From the viewpoint of further improving the continuous moldability, the curable composition may contain the release agent (F). As for the said mold release agent (F), only 1 type may be used and 2 or more types may be used together.

  The release agent (F) is not particularly limited. As the release agent (F), a conventionally known release agent can be used. Examples of the release agent (F) include fatty acid ester waxes, oxidized or non-oxidized polyolefin waxes, paraffin waxes, ester waxes, carnauba waxes, and silicone compounds. Examples of the silicone compound include silicone oil and modified silicone oil.

  In 100% by weight of the curable composition, the content of the release agent (F) is 0% by weight (not contained) or more, preferably 0.01% by weight or more, more preferably 0.05% by weight or more, preferably Is 5% by weight or less, more preferably 3% by weight or less. The said curable composition does not need to contain the said mold release agent (F). When the content of the release agent (F) is not less than the above lower limit, the continuous moldability is further enhanced. When the content of the release agent (F) is not more than the above upper limit, the adhesion between the adhesion target and the molded body is further enhanced.

  From the viewpoint of further improving the adhesion between the object to be adhered and the molded body, the curable composition does not contain the release agent (F) or the mold release in 100% by weight of the curable composition. It is particularly preferable that the agent (F) is contained at 2% by weight or less.

[Other ingredients]
The above curable composition is, as necessary, an adhesion aid, an antioxidant, a resin modifier, a colorant, a diluent, a surface treatment agent, a flame retardant, a viscosity modifier, a dispersant, a dispersion aid, a surface. It may contain a modifier, a plasticizer, an antibacterial agent, an antifungal agent, a leveling agent, a stabilizer, an anti-sagging agent or a phosphor. The diluent may be a reactive diluent or a non-reactive diluent.

  The adhesion aid is not particularly limited, and examples thereof include a compound having a nitrogen atom such as a coupling agent, melamine, and an isocyanate compound, and a compound having a sulfur atom. It does not specifically limit as said coupling agent, A silane coupling agent, a titanate coupling agent, etc. are mentioned.

  It does not specifically limit as said antioxidant, A phenolic antioxidant, phosphorus antioxidant, an amine antioxidant, etc. are mentioned.

  The colorant is not particularly limited, and various organic materials such as phthalocyanine, azo compound, disazo compound, quinacridone, anthraquinone, flavantron, perinone, perylene, dioxazine, condensed azo compound, azomethine compound, infrared absorber and ultraviolet absorber. And inorganic pigments such as lead sulfate, chromium yellow, zinc yellow, chromium vermillion, valve shell, cobalt purple, bitumen, ultramarine, carbon black, chromium green, chromium oxide and cobalt green.

(Other details of white curable composition for optical semiconductor device and molded body for optical semiconductor device)
The glass transition point of the color curable composition determined by differential scanning calorimetry is preferably −20 ° C. or higher, more preferably 0 ° C. or higher, preferably 50 ° C. or lower, more preferably 40 ° C. or lower. When the glass transition point is not less than the above lower limit, the strength of the tablet is further increased, and the tablet is more difficult to be chipped. When the glass transition point is less than or equal to the above upper limit, molding defects are less likely to occur, and in particular, molding defects during transfer molding are even less likely to occur.

  In the differential scanning calorimetry, the measurement is performed under the condition of cooling from 23 ° C. to −100 ° C. at a temperature decrease rate of 10 ° C./min and then heating to 200 ° C. at a temperature increase rate of 10 ° C./min. In the differential scanning calorimetry, for example, “EXSTAR DSC7020” manufactured by AI Nano Technology, etc. is used.

  The said curable composition is used in order to obtain the molded object which has a frame part arrange | positioned at the side of an optical semiconductor element in an optical semiconductor device. It is preferable that the said curable composition is used in order to obtain a molded object using a metal mold | die. The curable composition has a frame portion disposed on the side of the optical semiconductor element in the optical semiconductor device, and seals the optical semiconductor element in a region surrounded by the inner surface of the frame portion. It is preferably used for obtaining a molded body used by being filled with a sealant. The curable composition is preferably used to obtain a molded body having an opening through which light emitted from the optical semiconductor element is extracted.

  In the optical semiconductor device, the curable composition is preferably a curable composition used for obtaining a molded body disposed on a lead frame on which an optical semiconductor element is mounted. The lead frame is, for example, a component for supporting and fixing the optical semiconductor element and achieving electrical connection between the electrode of the optical semiconductor element and external wiring. The molded body is an optical semiconductor device molded body, and is preferably an optical semiconductor element mounting substrate.

  Since a molded body having a high light reflectance is obtained, the curable composition is disposed on the lead frame on which the optical semiconductor element is mounted and on the side of the optical semiconductor element in the optical semiconductor device. It is preferable that it is a curable composition used in order to obtain the molded object which has the light reflection part which reflects the light emitted from the semiconductor element.

  Since a molded body having high light reflectance is obtained, the curable composition is disposed on a lead frame on which an optical semiconductor element is mounted and surrounding the optical semiconductor element in a semiconductor device, and the optical semiconductor It is preferably a curable composition used for obtaining a molded body having a light reflecting portion on the inner surface for reflecting light emitted from the element. The molded body preferably has a frame portion surrounding the optical semiconductor element, and is preferably an outer wall member surrounding the optical semiconductor element. The molded body is preferably a frame-shaped member. In addition, it is preferable that the said molded object differs from the die-bonding material for joining an optical semiconductor element (die bonding) in an optical semiconductor device. It is preferable that the molded body does not include the die bond material.

  The curable composition is preferably used for obtaining individual molded bodies by dividing the molded body before division after obtaining the molded body before division in which a plurality of molded bodies are continuous. In the curable composition, after obtaining a pre-division molded body in which a plurality of molded bodies are connected via a lead frame, the lead frame is cut to divide the pre-division molded body to obtain individual molded bodies. Is preferably used for this purpose.

  The curable composition is blended with an epoxy compound (A), a curing agent (B), a white pigment (C), a filler (D) other than the white pigment, a curing accelerator (E), and the like as necessary. It can be obtained by mixing other components with a conventionally known method. A general method for producing the curable composition includes a method in which each component is kneaded by an extruder, a kneader, a roll, an extruder, etc., and then the kneaded product is cooled, pulverized, and tableted. From the viewpoint of improving dispersibility, the kneading of each component is preferably performed in a molten state. The kneading conditions are appropriately determined depending on the type and amount of each component. Kneading is preferably performed at 15 to 150 ° C for 5 to 100 minutes, more preferably 15 to 150 ° C for 5 to 60 minutes, further preferably 5 to 150 ° C for 5 to 40 minutes, and further preferably 20 to 100. It is particularly preferable to knead at 10 ° C. for 10 to 30 minutes.

  From the viewpoint of further improving the appearance of the molded body, when the curable composition is obtained, the mixture is heated and kneaded at 50 ° C. to 90 ° C. for 10 minutes to 60 minutes, and then exceeds 30 ° C. and less than 50 ° C. It is preferable that aging is performed for a period of time to 240 hours. When the temperature in the aging exceeds 30 ° C., the reaction due to aging proceeds appropriately, the tablet strength is further increased, and chipping of the tablet is further less likely to occur. When the temperature in the aging is less than 50 ° C., the compatibility between the epoxy compound and the acid anhydride curing agent is further improved.

  The molded object for optical semiconductor devices which concerns on this invention is obtained by hardening the curable composition mentioned above. The curable composition is molded into a predetermined shape. The molded body obtained by curing the curable composition is suitably used for reflecting light emitted from an optical semiconductor element in an optical semiconductor device.

  Examples of the method for obtaining the molded body for an optical semiconductor device using the curable composition include a compression molding method, a transfer molding method, a lamination molding method, an injection molding method, an extrusion molding method, and a blow molding method. Of these, transfer molding is preferred.

  The curable composition is preferably a tablet for transfer molding because it makes it easy to produce a molded body and a tablet with high compressive strength can be obtained.

  In the transfer molding method, for example, a molded body is obtained by transfer molding the curable composition under the conditions of a molding temperature of 100 to 200 ° C., a molding pressure of 5 to 20 MPa, and a molding time of 60 to 300 seconds.

(Details of optical semiconductor device and embodiment of optical semiconductor device)
An optical semiconductor device according to the present invention includes a lead frame, an optical semiconductor element mounted on the lead frame, and a frame disposed on the lead frame and disposed on a side of the optical semiconductor element. A molded body having a portion. The molded body in the optical semiconductor device is obtained by molding and curing the white tablet for an optical semiconductor device. The white tablet for optical semiconductor devices is formed using the white curable composition.

  In the optical semiconductor device according to the present invention, it is preferable that the inner surface of the molded body is a light reflecting portion that reflects light emitted from the optical semiconductor element.

  1A and 1B schematically show an example of an optical semiconductor device according to an embodiment of the present invention in a cross-sectional view and a perspective view.

  The optical semiconductor device 1 of the present embodiment includes a lead frame 2, an optical semiconductor element 3, a first molded body 4, and a second molded body 5. The optical semiconductor element 3 is preferably a light emitting diode (LED). The first molded body 4 and the second molded body 5 are not formed integrally, but are two other members. The first molded body 4 and the second molded body 5 may be formed integrally. The first molded body 4 is a frame part. The second molded body 5 is the bottom. In the optical semiconductor device 1, the molded body has a frame (first molded body 4) and a bottom (second molded body 5). The frame portion that is the first molded body 4 is an outer wall portion. The frame part which is the 1st molded object 4 is cyclic | annular.

  Note that the molded body may be a molded body having no bottom. You may use combining the molded object which has a frame part obtained by hardening the said curable composition, and another bottom member. The molded body may be a frame-shaped molded body having only a frame portion. The bottom member may be a molded body.

  An optical semiconductor element 3 is mounted and arranged on the lead frame 2. A first molded body 4 (frame portion) is disposed on the lead frame 2. Further, a second molded body 5 (bottom portion) is disposed between the plurality of lead frames 2 and below the lead frames 2. Note that the molded body or the bottom member may not be disposed below the lead frame, and the lead frame may be exposed. The optical semiconductor element 3 is disposed inside the first molded body 4. A first molded body 4 is disposed on the side of the optical semiconductor element 3, and the first molded body 4 is disposed so as to surround the optical semiconductor element 3. The first and second molded bodies 4 and 5 (molded bodies having a frame part and a bottom part) are cured products of the above-described curable composition, and are obtained by curing the above-described curable composition. Therefore, the 1st molded object 4 has light reflectivity, and has a light reflection part in the inner surface 4a. That is, the inner surface 4a of the first molded body 4 is a light reflecting portion. Therefore, the periphery of the optical semiconductor element 3 is surrounded by the inner surface 4 a having the light reflectivity of the first molded body 4. Only the 1st molded object 4 may be the hardened | cured material of the curable composition mentioned above.

  The first molded body 4 (frame portion) has an opening through which light emitted from the optical semiconductor element 3 is extracted. The first and second molded bodies 4 and 5 are white. The inner surface 4a of the first molded body 4 is formed such that the diameter of the inner surface 4a increases as it goes toward the opening end. Therefore, of the light emitted from the optical semiconductor element 3, the light indicated by the arrow B reaching the inner surface 4 a is reflected by the inner surface 4 a and travels forward of the optical semiconductor element 3.

  The optical semiconductor element 3 is connected to the lead frame 2 using a die bond material 6. The die bond material 6 has conductivity. A bonding pad (not shown) provided on the optical semiconductor element 3 and the lead frame 2 are electrically connected by a bonding wire 7. A sealing agent 8 is filled in a region surrounded by the inner surface 4 a of the first molded body 4 so as to seal the optical semiconductor element 3 and the bonding wire 7.

  In the optical semiconductor device 1, when the optical semiconductor element 3 is driven, light is emitted as indicated by a broken line A. In the optical semiconductor device 1, not only light irradiated from the optical semiconductor element 3 to the side opposite to the upper surface of the lead frame 2, that is, upward, but also light reaching the inner surface 4 a of the first molded body 4 is indicated by an arrow B. There is also light that is reflected by the light. Therefore, the light extracted from the optical semiconductor device 1 is bright.

  FIG. 2 shows a modification of the optical semiconductor device 1 shown in FIG. The optical semiconductor device 1 shown in FIG. 1 differs from the optical semiconductor device 21 shown in FIG. 2 only in the electrical connection structure using the die bonding materials 6 and 22 and the bonding wires 7 and 23. The die bond material 6 in the optical semiconductor device 1 has conductivity. On the other hand, the optical semiconductor device 21 has a die bond material 22, and the die bond material 22 does not have conductivity. In the optical semiconductor device 1, a bonding pad (not shown) provided on the optical semiconductor element 3 and a lead frame 2 (lead frame located on the right side in FIG. 1A) are electrically connected by a bonding wire 7. Has been. The optical semiconductor device 21 has a bonding wire 23 in addition to the bonding wire 7. In the optical semiconductor device 21, a bonding pad (not shown) provided on the optical semiconductor element 3 and a lead frame 2 (a lead frame located on the right side in FIG. 2) are electrically connected by a bonding wire 7. Further, a bonding pad (not shown) provided on the optical semiconductor element 3 and the lead frame 2 (lead frame located on the left side in FIG. 2) are electrically connected by a bonding wire 23.

  FIG. 3 shows a modification of the optical semiconductor device 21 shown in FIG. The optical semiconductor device 31 shown in FIG. 3 is also a modification of the optical semiconductor device 1 shown in FIG. The optical semiconductor device 21 shown in FIG. 2 is different from the optical semiconductor device 31 shown in FIG. 3 only in the structures of the first and second molded bodies 4 and 5 and the molded body 32. In the optical semiconductor device 21, the first and second molded bodies 4 and 5 are used. The first molded body 4 is disposed on the lead frame 2, and the second molded body 5 includes a plurality of second molded bodies 5. Between the lead frames 2 and below the lead frame 2. On the other hand, in the optical semiconductor device 31, one molded body 32 is used. The molded body 32 has a frame portion 32 a disposed on the lead frame 2 and a filling portion 32 b disposed between the plurality of lead frames 2. The frame part 32a and the filling part 32b are integrally formed. As described above, the optical semiconductor device only needs to have a frame portion disposed on the side of the optical semiconductor element in the optical semiconductor device. The molded body may not be disposed below the lead frame. The molded body may not have a bottom portion disposed below the lead frame. The back surface of the lead frame may be exposed.

  The structures shown in FIGS. 1 to 3 are merely examples of the optical semiconductor device according to the present invention, and can be appropriately modified to a structure of a molded body, a mounting structure of an optical semiconductor element, and the like.

  Also, as shown in FIG. 4, a pre-division optical semiconductor device component 11 in which a plurality of optical semiconductor device components are connected is prepared, and the pre-division optical semiconductor device component 11 is cut at a portion indicated by a broken line X. Individual optical semiconductor device components may be obtained. The pre-division optical semiconductor device component 11 includes a pre-division lead frame 2A, a pre-division first molded body 4A, and a pre-division second molded body 5A. After obtaining individual components for an optical semiconductor device, the optical semiconductor device 3 may be mounted and the optical semiconductor device 3 may be sealed with a sealant 8 to obtain the optical semiconductor device 1. When the pre-division lead frame 2A is cut at a portion indicated by a broken line X, the lead frame 2 is obtained. When the first molded body 4A before division is cut at the portion indicated by the broken line X, the first molded body 4 is obtained. When the pre-division second molded body 5A is cut at the portion indicated by the broken line X, the second molded body 5 is obtained.

  Further, as shown in FIG. 5, a pre-division optical semiconductor device 12 in which a plurality of pre-division optical semiconductor devices are connected is prepared, and the pre-division optical semiconductor device 12 is cut at a portion indicated by a broken line X to obtain individual light. A semiconductor device may be obtained. The pre-division optical semiconductor device 12 includes a pre-division lead frame 2A, a pre-division first molded body 4A, and a pre-division second molded body 5A. 1 to 3, in the pre-division optical semiconductor device 12, the optical semiconductor element 3 is mounted and disposed on the pre-division lead frame 2A. 4 and 5, in the pre-division optical semiconductor device component and the pre-division optical semiconductor device, a plurality of molded bodies are connected to form a pre-division molded body, but a plurality of molded bodies are not connected to each other. The front optical semiconductor device component and the pre-division optical semiconductor device may be divided to obtain the optical semiconductor device component and the optical semiconductor device.

  Hereinafter, the present invention will be clarified by giving specific examples and comparative examples of the present invention. The present invention is not limited to the following examples. In the examples and comparative examples, the following materials were used.

(Epoxy compound (A))
1) EHPE3150 (epoxy resin having an alicyclic skeleton, manufactured by Daicel, epoxy equivalent 177)
2) TEPIC-S (triglycidyl isocyanurate, manufactured by Nissan Chemical Industries, epoxy equivalent 100)

(Curing agent (B))
1) Ricacid HH (hexahydrophthalic anhydride, manufactured by Shin Nippon Chemical Co., Ltd., melting point 33 ° C.)
2) Ricacid TH (tetrahydrophthalic anhydride, manufactured by Shin Nippon Chemical Co., Ltd., melting point 101 ° C.)

(White pigment (C))
1) CR-58 (titanium oxide, rutile type, surface-treated with Al, average particle size 0.25 μm, manufactured by Ishihara Sangyo Co., Ltd.)
2) Zinc oxide type I (zinc oxide, average particle size 1 μm, manufactured by Sakai Chemical Industry Co., Ltd.)
3) UEP (zirconium oxide, average particle size 0.6 μm, manufactured by Daiichi Rare Element Chemical Industries, Ltd.)

(Filler (D))
1) MSR-3512-SC4 (spherical silica, average particle size of 30 μm, proportion of spherical silica having a particle size of 50 μm or more, 0.3% by weight, manufactured by Tatsumori)
2) MSR-3512-SC3 (spherical silica, average particle size 30 μm, proportion of spherical silica having a particle size of 50 μm or more 1.2% by weight, manufactured by Tatsumori)
3) FB-105 upper cut product (spherical silica, average particle size 12 μm, proportion of spherical silica having a particle size of 50 μm or more 0.2% by weight): FB-105 (spherical silica, manufactured by Denki Kagaku Kogyo Co., Ltd.) 4) MSR-3512 (spherical silica, average particle size of 30 μm, proportion of spherical silica having a particle size of 50 μm or more, 5.0% by weight, manufactured by Tatsumori Co., Ltd.)

(Curing accelerator (E))
1) PX-4ET (tetra-n-butylphosphonium-o, o-diethylphosphorodionate, manufactured by Nippon Chemical Industry Co., Ltd.)

(Release agent (F))
1) Seridust 3715 (polyethylene wax, manufactured by Clariant Japan)
2) M-9676 (stearyl stearate, manufactured by NOF Corporation)

(Examples 1-15 and Comparative Examples 1-5)
Each component shown in the following Table 1 is blended in the blending amount shown in the following Table 1 (the blending unit is parts by weight), and 20 at 70 ° C. with a mixer (“Labo Plast Mill R-60” manufactured by Toyo Seiki Seisakusho). After heat-kneading for 1 minute (heat-kneading step), aging is performed under the conditions of temperature and time (aging step) shown in Table 1 below, and the resulting curable composition is pulverized to form a powdery curable composition A thing (tablet) was obtained.

(Measurement and evaluation)
(1) Transmittance The obtained curable composition was heated and pressed at 170 ° C. for 5 minutes to produce a sheet having a thickness of 50 μm. About the obtained sheet | seat, the transmittance | permeability in wavelength 450nm was measured using the spectrophotometer ("U-3900" by Hitachi High-Technologies Corporation). The measurement conditions were a scan range of 300 to 800 nm and a scan speed of 600 nm / min.

(2) Tensile strength Using the sheet obtained by the transmittance evaluation described in (1) above, the tensile tester (“Tensilon RTC” manufactured by A & D Corporation) was set to a distance between chucks of 50 mm and a tensile speed of 10 mm. The tensile strength was measured as / min.

(3) Transfer moldability After forming a circuit by etching on a copper material (TAMAC 194), silver plating was performed to obtain a lead frame (silver plating surface, thickness 0.2 mm).

  As a mold, a collective mold having 150 concave portions (optical semiconductor element mounting portions) arranged in a matrix of 15 vertical × 10 horizontal was prepared. The cavity size was 4 mm × 2 mm per piece and the depth was 1 mm. Using a mold cleaning material (“Nicaret RCC” manufactured by Nippon Carbide), the mold was cleaned three times, and then a mold release recovery material (“Nicaret ECR-C KU” manufactured by Nippon Carbide) was used. The mold was given releasability.

  Using the mold provided with releasability, the obtained tablet was transfer molded to obtain a substrate for mounting an optical semiconductor device. The obtained substrate for mounting an optical semiconductor device was visually inspected, and the moldability was determined according to the following criteria.

[Transfer moldability criteria]
○: There is no appearance abnormality such as chipping and cracking due to poor filling in the molded body
Δ: Slightly abnormal appearance such as chipping and cracking due to poor filling in the molded product
X: The molded product has obvious appearance abnormalities such as chipping and cracks due to poor filling

  The composition and results are shown in Table 1 below.

DESCRIPTION OF SYMBOLS 1 ... Optical semiconductor device 2 ... Lead frame 2A ... Lead frame 3 before division | segmentation 3 ... Optical semiconductor element 4 ... 1st molded object 4A ... 1st molded object 4a ... Inner surface 5 ... 2nd molded object 5A ... Before division | segmentation 2nd molded object 6 ... Die bond material 7 ... Bonding wire 8 ... Sealant 11 ... Parts for optical semiconductor devices before division 12 ... Optical semiconductor device before division 21 ... Optical semiconductor device 22 ... Die bonding material 23 ... Bonding wire 31 ... Light Semiconductor device 32 ... molded body 32a ... frame portion 32b ... filling portion

Claims (9)

A white curable composition for an optical semiconductor device, which is used to obtain a molded body having a frame portion disposed on the side of an optical semiconductor element in an optical semiconductor device, and is white,
The white curable composition for optical semiconductor devices whose transmittance | permeability in wavelength 450nm of the said sheet | seat is 10% or less when shape | molding the white curable composition for optical semiconductor devices into a 50 micrometers thick sheet | seat. An epoxy compound, an acid anhydride curing agent, a white pigment, a filler other than the white pigment, and a curing accelerator,
2. The light according to claim 1, wherein the filler other than the white pigment does not include a filler having a particle diameter of 50 μm or more, or contains less than 1.5 wt% of a filler having a particle diameter of 50 μm or more. White curable composition for semiconductor devices.   3. The optical semiconductor device according to claim 2, wherein the filler other than the white pigment does not include a filler having a particle diameter of 50 μm or more, or contains less than 1% by weight of a filler having a particle diameter of 50 μm or more. White curable composition.   The white curable composition for optical semiconductor devices of any one of Claims 1-3 whose average particle diameters of fillers other than the said white pigment are 1 micrometer or more and 40 micrometers or less.   The white curing for optical semiconductor devices according to any one of claims 1 to 4, wherein when the white curable composition for optical semiconductor devices is molded into a sheet having a thickness of 50 µm, the tensile strength of the sheet is 65 MPa or more. Sex composition. The white pigment is titanium oxide, zinc oxide or zirconium oxide;
The white curable composition for optical semiconductor devices according to claim 1, wherein the filler other than the white pigment is silica.   The white curable composition for optical semiconductor devices of any one of Claims 1-6 used in order to obtain the molded object arrange | positioned on the lead frame in which the optical semiconductor element was mounted in an optical semiconductor device. A molded body having a frame portion disposed on the side of an optical semiconductor element in an optical semiconductor device,
The molded object for optical semiconductor devices obtained by hardening the white curable composition for optical semiconductor devices of any one of Claims 1-7. A lead frame;
An optical semiconductor element mounted on the lead frame;
A molded body disposed on the lead frame and having a frame portion disposed on a side of the optical semiconductor element;
The optical semiconductor device obtained by the said molded object hardening | curing the white curable composition for optical semiconductor devices of any one of Claims 1-7.

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