JP2015216226A - Housing member, electronic component, imaging device and method for removing condensation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a housing member for housing an electronic device, advantageous for removing condensation occurring on an internal electrode.SOLUTION: In a housing member 3 having a recess in which an electronic device 1 is arranged, the housing member has an internal electrode 31 provided in the recess and connected electrically with the electrode of an electronic device, a heating part 7 for heating the internal electrode, and an external terminal provided on the outside of the recess in the housing member. In the plan view, the heating part is arranged in a region including a portion overlapping the internal electrode at least partially, and a region including a portion overlapping at least a portion between the internal electrode and an internal electrode adjacent thereto.

Description

  The present invention relates to a storage member, an electronic component, an imaging device, and a method for removing condensation.

  An electronic device such as a solid-state image sensor is housed in a housing member, formed as an electronic component, and used by being incorporated in an electronic device such as a camera. The container for storing the electronic component is a sealing member for sealing the storage member after the storage member having a storage portion for arranging the electronic device and the electronic device is arranged and the electrodes of the electronic device are wired. A member. The storage member includes an internal electrode inside the storage member connected to the electrode of the stored electronic device, and an external electrode provided outside the storage member and connected to the internal electrode. The internal electrode and the external electrode are connected by wiring provided inside the storage member. An electronic device is disposed inside the storage member, and after the electrode of the electronic device and the internal electrode of the storage member are connected by a bonding wire, the storage member is sealed with a sealing member to form an electronic component. The container containing the electronic device by sealing is kept airtight. However, if the sealing is insufficient, for example, when a camera in which an electronic component is incorporated is used in a hot and humid environment, moisture may enter the electronic component from the outside.

JP 2012-49308 A

  It has been found that one of the causes of breakage of the electronic device sealed so as to be kept airtight in the container is dew condensation that occurs around the internal electrode of the housing member due to moisture that has entered the interior of the electronic component. Due to condensation, a short circuit occurs in the internal electrode, and as a result, the electronic device electrically connected to the internal electrode is broken. If the camera is suddenly transported from a high temperature environment to a low temperature environment with moisture inside the electronic component, the temperature of the environment is transmitted to the electronic component, causing a sudden temperature change in the electronic component. At this time, heat from the outside is easily transmitted to the peripheral portion of the internal electrode electrically connected to the external electrode through a wiring formed of a metal material or the like inside the storage member, and moisture is condensed. It turned out to be easy to condense.

  Patent Document 1 discloses that a low thermal conduction portion is provided around the area where electronic components are mounted so that external heat is not easily transmitted in order to make the temperature of the mounting area uniform. Furthermore, it is described that the bridge portion having a small width between the low heat conduction portions is heated so that heat of the electronic component is not transmitted to the outside through the bridge portion. However, it has not been considered to remove the condensation generated on the electrode. SUMMARY OF THE INVENTION An object of the present invention is to provide a storage member having a structure that is advantageous for removing dew condensation generated on an electrode inside a storage member that stores an electronic device.

  The storage member for storing the electronic device of the present invention is a storage member having a recess, and the electronic device is disposed in the recess, wherein the storage member is provided in the recess and is an electrode of the electronic device. An internal electrode to which the internal electrode is electrically connected, a heating part that heats the internal electrode, and an external terminal that is provided outside the concave portion of the housing member. It is arranged in a region including a portion overlapping with at least a part of an electrode and a region including a portion overlapping with at least a part between the internal electrode and the internal electrode adjacent to the internal electrode, To do.

  In addition, the electronic component of the present invention includes a storage member, an electronic device, and a sealing member that seals the storage member. The electronic device is disposed in a recess of the storage member, and the sealing member It is sealed.

  In the imaging apparatus of the present invention, the electronic device is a solid-state imaging element.

  Furthermore, the method for removing dew condensation according to the present invention provides for dew condensation on the internal electrode of the image pickup apparatus including a solid-state image sensor, an internal electrode to which the electrode of the solid-state image sensor is connected, and a heating unit that heats the internal electrode. The method of removing, characterized in that when supplying power to the imaging device, the supply of power to the heating unit is started before the supply of power to the solid-state imaging device is started.

  ADVANTAGE OF THE INVENTION According to this invention, the storage member of a structure advantageous in removing the dew condensation which generate | occur | produces in the electrode inside the storage member which accommodates an electronic device can be provided.

It is the plane schematic diagram of Embodiment 1 which concerns on this invention, and a cross-sectional schematic diagram. It is a disassembled perspective schematic diagram of Embodiment 1 concerning the present invention. It is a disassembled perspective schematic diagram of Embodiment 2 which concerns on this invention.

[Embodiment 1]
A first embodiment will be described with reference to FIGS. 1 and 2. In the present embodiment, the electronic component 100 will be described by taking a solid-state imaging device including a photoelectric conversion element as an example of the electronic device 1. First, the electronic device 1 of this embodiment will be described. The electronic device 1 has a semiconductor substrate 10. A wiring 12, a protective layer 14, a color filter layer 15, and a microlens layer 16 are stacked in this order in the light incident direction on the light incident surface of the semiconductor substrate. In this example, the microlens layer 16 is formed on the surface 110 of the electronic device 1. The back surface 120 of the semiconductor substrate 10 opposite to the surface on which the microlens layer is formed is bonded to the storage member 3 by the bonding member 5. The wiring 12 is generally formed of a plurality of wiring layers (not shown) mainly made of aluminum or copper and a plurality of interlayer insulating layers (not shown) mainly made of silicon oxide or silicon nitride.

  The semiconductor substrate 10 is formed with a photoelectric conversion unit 11 in which a plurality of photoelectric conversion elements are arranged. When the photoelectric conversion element of this embodiment is a solid-state image sensor, the photoelectric conversion unit 11 includes a pixel including a photodiode as a photoelectric conversion element. The region where the photoelectric conversion unit 11 is formed is a photoelectric conversion region. The photoelectric conversion region can include a peripheral circuit for generating and reading an electrical signal from signal charges generated in the photodiode. In the present embodiment, the photoelectric conversion region includes a light receiving region 101 and a light shielding region 102. In the light receiving region 101, light enters the photoelectric conversion unit 11 through the microlens layer 16, the color filter layer 15, the protective layer 14, and the interlayer insulating layer. The photodiode in the light receiving region 101 functions as an effective pixel. In the light shielding region 102, since the photodiode is shielded by a light shielding layer (not shown), the photodiode in the light shielding region 102 functions as optical black (OB). The signal obtained from the optical black is used for correction of the signal obtained from the effective pixel.

  A peripheral circuit (not shown) included in the photoelectric conversion region is provided with a drive circuit for driving the photoelectric conversion unit 11, a signal processing circuit for processing an electric signal obtained by the photoelectric conversion unit 11, and the like. An electrode 13 is provided around the electronic device 1 as a terminal for inputting / outputting a timing signal input to the driving circuit and an imaging signal output from the signal processing circuit to / from the outside of the electronic device. In the present embodiment, an example is shown in which the wiring 12 is disposed on the light incident side of the semiconductor substrate 10. However, a structure in which the wiring 12 is disposed on the back surface 120 side of the semiconductor substrate 10 may be employed. In this case, the microlens layer 16 can be formed on the front surface 110 side of the electronic device 1, and a support substrate different from the semiconductor substrate 10 bonded to the wiring 12 can be provided on the back surface 120 side. Alternatively, a substantially entire surface 110 may be configured by a photoelectric conversion region, and a peripheral circuit region may be disposed on another semiconductor substrate disposed on the back surface 120 side of the semiconductor substrate 10.

  Next, the electronic component 100 of this embodiment will be described. The electronic component 100 includes an electronic device 1, a sealing member 2, and a storage member 3 having a recess. The housing member 3 is laminated in a plurality of layers by a plurality of ceramic layers 8, a plurality of wiring layers 9 provided between the ceramic layers, and a plurality of internal electrodes 31. A laminated ceramic substrate is formed. In the example shown in FIGS. 1 and 2, the ceramic layer 8 is composed of 6 layers and the wiring layer 9 is composed of 5 layers, but any number of layers may be provided. Further, the storage member 3 shown in the present embodiment has a structure having a concave portion provided with a step inside, and the internal electrode 31 is disposed in the middle stage 130 in the concave portion of the storage member 3. The internal electrode 31 may be disposed on the lower stage 131 in the recess of the storage member 3. As a material of the ceramic layer 8, for example, a ceramic sintered body such as aluminum oxide or aluminum nitride can be used.

  The storage member 3 has a plurality of external terminals 33 on the outside thereof, and each external terminal 33 is electrically connected to the internal electrode 31 and the like via the internal wiring 32. The internal wiring 32 is formed as a part of the wiring layer 9. The electronic device 1 has a plurality of electrodes 13 for inputting or outputting electrical signals, and the electrodes 13 and the internal electrodes 31 are electrically connected via the connection member 6. In this example, the connection member 6 is a bonding wire. Although the example in which the connection method between the electrode 13 and the internal electrode 31 is wire bonding is given, the connection between the electrode 13 and the internal electrode 31 may be flip-chip bonding. The electronic device 1 can be driven by power supply from an external power source (not shown) connected to the external terminal 33. As the material of the internal wiring 32, a metal wiring material such as tungsten, molybdenum, manganese, or copper can be used.

  In the present embodiment, a heating unit 7 for heating the internal electrode 31 is formed in a part 9 b of the wiring layer 9. The heating unit 7 is disposed so as to pass under the internal electrode 31. In order to efficiently heat the internal electrode 31 in a short time, the heating unit 7 is disposed at a close position below the internal electrode 31. The heating unit 7 is electrically connected to an external terminal 33a disposed on the bottom surface of the storage member 3 opposite to the surface on which the electronic device 1 is disposed, via the internal wiring 32a. The internal wiring 32 a and the external terminal 33 a are provided for the heating unit 7. The internal wiring in which the heating unit 7 is formed is supplied with electric power from the external power source (not shown) connected to the external terminal 33a through the internal wiring 32a. Then, when a current flows through the heating unit 7, the surroundings of the internal electrode 31 and the internal electrode 31 are warmed by the generated heat, and dew condensation generated around the internal electrode 31 can be heated and removed. The external terminal 33 a that is electrically connected to the heating unit 7 is provided in the storage member 3 as one of the external terminals 33 that are electrically connected to the electronic device 1. For this reason, when the electronic component 1 and an external board (not shown) are electrically connected via solder etc., the electronic device 1 and the heating part 7 are simultaneously connected to an external board (not shown). There is.

  The heating unit 7 itself should not be wired to the internal electrode 31, and the wiring from the external terminal 33 a to the heating unit 7 should be separated from the wiring system to the internal electrode 31. By directly electrically connecting the heating unit 7 to the external terminal 33a, it is possible to avoid the influence of dew condensation that occurs in the internal electrode 31. Further, when power is supplied to the heating unit 7 and the electronic device 1 from an external power source (not shown), the power is set to be supplied only to the heating unit 7 first, and after a predetermined time has passed, The heating sequence can be configured to start supplying power to the electronic device 1. By forming a heating sequence having a priority, even when condensation occurs around the internal electrode 31, power is supplied to the heating unit 7 in advance to generate heat. Since the dew condensation around the internal electrode 31 can be heated and removed before the electronic device 1 is driven, a short circuit due to the dew condensation on the internal electrode 31 can be prevented in advance. Moreover, only the power supply of the heating unit 7 can be stopped after a predetermined time. During normal use or after condensation has been removed, power consumption can be reduced by stopping power consumption in the heating unit 7. Even if the moisture evaporated by heating stays inside the storage member 3, the operation of the solid-state imaging device is not affected as long as the moisture does not cause a problem during normal imaging. The sealing member 2 is usually formed of glass or the like in order to transmit light. Since glass or the like has a lower thermal conductivity than metal, it is less susceptible to temperature changes, and therefore, condensation is less likely to occur than the internal electrode 31.

  The external terminals 33 and 33a of this embodiment are each planar and have a so-called LGA (Land Grid Array) structure. The external terminals 33 and 33a may have a pin-shaped PGA (Pin Grid Array) structure. Alternatively, an LCC (Leadless Chip Carrier) structure in which external terminals 33 and 33a are arranged on the outer peripheral side surface of the ceramic layer 8 may be used.

  The heating unit 7 is disposed in any layer, whether in the same wiring layer as the layer in which the internal electrode 31 is formed, or in the upper wiring layer or the lower wiring layer with respect to the recess in which the electronic device is disposed. Also good. The heating unit 7 is a lower layer of the wiring layer 9a in which the internal electrode 31 is disposed, and a part of the orthogonal projection region W of the internal electrode 31 when the internal electrode 31 is viewed from the sealing member 2 in a plan view. It is efficient if it is arranged so as to pass through the overlapping part. The heating unit 7 is also disposed in a portion overlapping with at least a part between the internal electrode 31 and the adjacent internal electrode 31 in a plan view. Each heating unit 7 is arranged so as to pass through a region under the wiring layer 9a including a portion overlapping at least a part of the internal electrode in plan view. It can be heated efficiently.

  In addition, it is more efficient to arrange the heating unit 7 and the internal electrode 31 as close as possible. When the heating unit 7 is provided below the internal electrode 31, the layer thickness T of the ceramic layer 8a sandwiched between the wiring layer 9a in which the internal electrode 31 is disposed and the wiring layer 9b in which the heating unit 7 is disposed is set to 0. .05 mm or more and 1.0 mm or less. When the layer thickness T is less than 0.05 mm, it becomes difficult to handle the green sheet that is the raw material of the ceramic layer 8a, the mechanical strength cannot be sufficiently secured, and the housing member may not be stably formed. On the other hand, if the layer thickness T exceeds 1.0 mm, the distance between the heating unit 7 and the internal electrode 31 increases, and the thermal resistance of the ceramic layer 8a increases to make the internal electrode 31 difficult to warm. In order to efficiently transfer the heat from the heating unit 7 to the internal electrode 31 through the ceramic layer 8a, the layer thickness T of the ceramic layer 8a is preferably 0.05 mm or more and 1.0 mm or less.

  As the material of the heating unit 7, for example, a metal wiring material such as tungsten, molybdenum, nickel, aluminum, titanium-platinum alloy or the like can be used. Further, the material of the heating unit 7 may be configured to generate heat by adjusting the width and length using the same material as the internal wiring 32. In this case, the heating unit 7 is connected to the wiring layer simultaneously with the internal wiring 32. Thus, productivity can be improved.

  The resistance value of the heating unit 7 is preferably 1Ω or more and 100Ω or less. When the resistance value of the heating unit 7 is less than 1Ω, the amount of heat generated for sufficiently heating the internal electrode 31 cannot be secured, and it becomes difficult to prevent a short circuit of the internal electrode due to condensation. Moreover, since the heating part 7 is formed of a thin wire material, if the resistance value of the material is high enough to exceed 100Ω, the wire material itself forming the heating part 7 may be burned out. For this reason, the internal electrode 31 can be heated sufficiently and stably by setting the resistance value of the heating unit 7 to 1Ω or more and 100Ω or less.

  The sealing member 2 is disposed so as to face the electronic device 1 with the adhesive 4 interposed therebetween. Since the sealing member 2 has sufficient hardness and rigidity, the electronic device 1 is protected from adhesion and damage of foreign substances by the sealing member 2. A space 21 filled with a gas such as air or an inert gas is located between the electronic device 1 and the sealing member 2. The electronic device 1 and the sealing member 2 are in contact with the space 21.

  When the electronic device 1 is a solid-state imaging device as in this embodiment, the sealing member 2 needs to transmit light. Therefore, the sealing member is formed of a transparent member having a sufficiently high light transmittance with respect to the wavelength of light to be used. The sealing member 2 can be formed of an inorganic material such as glass or quartz, or an organic material such as a transparent resin. The thickness of the sealing member 2 as a transparent member is typically 0.1 mm or more and 1 mm or less. Since the electronic device 1 of this example is a solid-state image sensor, the sealing member 2 has a sufficiently high light transmittance with respect to the wavelength of light (signal light) that can generate a signal charge with the solid-state image sensor. Adopt material. The light used in a typical solid-state imaging device has a wavelength of 0.4 μm or more and 0.8 μm or less. The electronic device 1 is joined to the storage member 3 by the joining member 5. In this example, the bonding member 5 is disposed between the electronic device 1 and the storage member 3, but may be disposed so as to cover the edge of the electronic device 1. A bonding paste, a bonding tape, or the like can be used for the bonding member 5.

[Embodiment 2]
Regarding the shape of the heating unit 7, in the first embodiment, the heating unit 7 is arranged so as to cross the orthogonal projection region W of the internal electrode viewed from the sealing member in a straight line. good. In the present embodiment, as shown in FIG. 3, the heating unit 7 is arranged in a zigzag shape. A degree of freedom can be given to the pattern layout of the heating unit 7 so that heating by the heating unit 7 can be performed effectively. In the example of the arrangement shown in FIG. 3, the heat generation capacity is increased by arranging the internal electrodes so as to increase the occupation ratio of the heating unit 7 with respect to the orthogonal projection region W viewed from the sealing member 2. It becomes possible to heat more effectively. Further, since the resistance value is proportional to the length, when the external size of the electronic component 100 is small, the heating unit 7 is formed in a limited space with a longer wiring length by forming the heating unit 7 in a zigzag shape. Can be arranged. By increasing the wiring length, a predetermined resistance value can be ensured and the internal electrode 7 can be heated as required. The electronic device 1 of the present embodiment has been described by taking a solid-state imaging device such as a CMOS sensor or a CCD sensor as an example, but can also be applied to other integrated circuits.

1. Electronic devices, 2. 2. sealing member; 3. storage member; Adhesive, 6. 6. connection member; Heating section, 8. Ceramic layer, 9. Wiring layer, 31. Internal electrodes, 32. Internal wiring, 33. External terminal, 100. Electronic components

Claims (14)

A storage member having a recess and in which an electronic device is disposed in the recess,
The housing member is provided in the recess and is electrically connected to an electrode of the electronic device; a heating unit that heats the internal electrode; and an exterior provided outside the recess of the storage member And a terminal,
The heating unit includes a region including a portion overlapping with at least a portion of the internal electrode and a portion overlapping with at least a portion between the internal electrode and the internal electrode adjacent to the internal electrode in plan view. And is arranged in an area,
Storage member.   The housing member includes a ceramic layer having a plurality of layers and a plurality of wiring layers sandwiched between the ceramic layers, and the internal electrode and the heating unit are formed in the wiring layer. The storage member according to claim 1.   The heating unit is arranged in a wiring layer closer to the back surface on the opposite side to the concave portion in which the electronic device of the housing member is arranged than the wiring layer in which the internal electrode is arranged. Or the storage member of 2.   The storage member according to any one of claims 1 to 3, wherein the heating unit is disposed so as to pass through a region including an orthogonal projection region of the internal electrode in a plan view.   The storage member according to any one of claims 1 to 4, wherein a distance between the internal electrode and the heating unit is 0.05 mm or more and 1.0 mm or less.   6. The storage member according to claim 1, wherein a resistance value of the heating unit is 1Ω or more and 100Ω or less.   The storage member according to any one of claims 1 to 6, wherein electric power is supplied to the heating unit from the external terminal.   The storage member according to claim 1, wherein the internal electrode is wire bonding or flip chip bonding.   The storage member according to any one of claims 1 to 8, wherein the external terminal is disposed in a planar shape on a back surface opposite to the concave portion in which the electronic device of the storage member is disposed. A storage member according to any one of claims 1 to 9, an electronic device, and a sealing member for sealing the storage member,
An electronic component, wherein the electronic device is disposed in a recess of the housing member and is sealed by the sealing member.   The imaging apparatus according to claim 10, wherein the electronic device is a solid-state imaging device. A method of removing dew condensation on the internal electrode of an imaging device comprising: a solid-state imaging device; an internal electrode to which an electrode of the solid-state imaging device is connected; and a heating unit that heats the internal electrode.
When supplying power to the imaging device, the supply of power to the heating unit is started before starting the supply of power to the solid-state imaging device,
Method.   The method according to claim 12, wherein the imaging apparatus is provided with an external terminal that supplies power to the heating unit. 14. The method according to claim 12, wherein the heating unit is stopped after a predetermined time has elapsed after the power supply is started.

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