WO2023090002A1 - Semiconductor device, electronic apparatus, and manufacturing method for semiconductor device - Google Patents

Abstract

This semiconductor device simplifies the configuration of a lid body bonded to a package body to simplify and reduce the cost of the manufacturing process, and also reduces the influence of thermal stress associated with the bonding of the lid body to the package body.　The semiconductor device comprises: a semiconductor element; a housing that has a peripheral wall part surrounding the periphery of the semiconductor element and is electrically connected to the semiconductor element; a transparent member that is provided so as to face the semiconductor element; and a frame member that has a flange part bonded to the peripheral wall part, and a support surface part positioned further to the semiconductor element side than the flange part and supporting the transparent member, the frame member creating an airtight space in the periphery of the semiconductor element together with the housing and the transparent member.

Description

Semiconductor device, electronic device, and method for manufacturing semiconductor device

The present disclosure relates to semiconductor devices, electronic devices, and methods of manufacturing semiconductor devices.

Conventionally, the package structure of a semiconductor device equipped with a semiconductor element such as an imaging element such as a CMOS image sensor or a light emitting element such as a semiconductor laser has the following configuration. That is, it is a configuration in which a lid body in which a transparent member such as glass is supported by a frame-shaped member is joined to a housing that forms a package main body in which a semiconductor element is mounted, and the arrangement space of the semiconductor element is hermetically sealed ( For example, see Patent Document 1.).

Patent Literature 1 discloses a configuration including a frame member made of a metal plate, a frame member made of ceramics or the like, and a translucent member made of a glass material, as a configuration of the lid of the package structure. In such a configuration, in order to reduce the size of the device and improve the airtightness reliability, the outer edge of the frame member is projected from the frame, and the stepped portion formed on the inner peripheral side of the frame is translucent. It has a structure in which elastic members are joined together. The frame member and the translucent member are bonded to the frame by a bonding material so as to sandwich the frame from above and below.

JP 2019-145762 A

According to the configuration disclosed in Patent Document 1, there are the following problems. The joining of the frame member and the frame and the joining of the frame and the translucent member are performed at different timings. For this reason, bonding materials having different melting points are used in both bonding so that the bonding material used for the previous bonding does not melt during the subsequent bonding. Therefore, there is a problem that the manufacturing process of the lid is lengthened and the material cost is increased.

In addition, in the lid disclosed in Patent Document 1, the outer edge of the frame member projecting in a flange shape from the outer edge of the frame serves as the joint to the package body. The outer edge of the frame member is joined to the upper surface of the peripheral wall-like portion surrounding the semiconductor element in the package body by welding such as seam welding. In such a joint structure, in order to reduce the influence of thermal stress generated by welding such as seam welding on the joint portion of the translucent member to the frame, for example, the joint portion of the frame member to the frame is It needs to be positioned outside the joint portion of the translucent member with respect to the frame. Therefore, there is a problem that the process control in the manufacturing process of the lid becomes complicated.

The present technology can simplify the configuration of the lid bonded to the package body, simplify the manufacturing process, and reduce costs. An object of the present invention is to provide a semiconductor device, an electronic device, and a method of manufacturing a semiconductor device that can reduce the influence of stress.

A semiconductor device according to an embodiment of the present technology includes: a semiconductor element; a housing having a peripheral wall portion surrounding the semiconductor element; a transparent member, a flange portion joined to the peripheral wall portion, and a supporting surface portion located closer to the semiconductor element than the flange portion and supporting the transparent member, and a frame member forming an airtight space around the element.

According to another aspect of the semiconductor device according to the present technology, in the semiconductor device, the flange portion of the frame member is welded to the peripheral wall portion.

In another aspect of the semiconductor device according to the present technology, in the semiconductor device, the frame member has a side surface portion that connects the flange portion and the support surface portion, and the support surface portion and the side surface portion connect the flange portion with the side surface portion. and the transparent member is positioned entirely within the recess.

In another aspect of the semiconductor device according to the present technology, in the semiconductor device, the housing has a housing main body portion to which the semiconductor element is connected, and the peripheral wall portion is provided with respect to the housing main body portion. It is configured by a provided frame-shaped member.

In another aspect of the semiconductor device according to the present technology, in the semiconductor device, the supporting surface portion of the frame member is provided on a side opposite to the transparent member side, and supports the supporting surface portion with respect to the housing side. It further comprises a support member.

According to another aspect of the semiconductor device according to the present technology, in the semiconductor device, the support member is provided so as to support the support surface portion with respect to the semiconductor element.

Another aspect of the semiconductor device according to the present technology is the semiconductor device, wherein the frame member includes a frame member main body made of an alloy containing iron, nickel, and cobalt, and at least the peripheral wall of the surface of the frame member main body. and a metal film portion formed to cover a joint surface for the portion.

According to another aspect of the semiconductor device according to the present technology, in the semiconductor device, the side portion of the frame member is formed to have a zigzag shape when viewed in vertical cross section.

According to another aspect of the semiconductor device according to the present technology, in the semiconductor device, the semiconductor element is provided in a state of being supported by a cooling element with respect to the housing.

An electronic device according to an embodiment of the present technology includes: a semiconductor element; a transparent member, a flange portion joined to the peripheral wall portion, and a supporting surface portion located closer to the semiconductor element than the flange portion and supporting the transparent member, and a frame member forming an airtight space around the element.

A method for manufacturing a semiconductor device according to an embodiment of the present technology includes steps of preparing a housing having a peripheral wall portion surrounding a semiconductor element and electrically connected to the semiconductor element; a step of providing the semiconductor element in a state of being electrically connected to the housing; a step of forming a frame shape as a whole, having a flange portion on a peripheral edge portion, forming a concave portion corresponding to the flange portion; preparing a frame member having an opening in the bottom surface of the recess; attaching the frame member to the housing by welding the flange portion to the peripheral wall portion; providing a transparent member on the bottom surface so as to cover the opening.

It is a side sectional view showing the composition of the imaging device concerning a 1st embodiment of this art. It is a perspective view showing composition of a case concerning a 1st embodiment of this art. It is a perspective view showing composition of a lid concerning a 1st embodiment of this art. It is a side sectional view showing composition of a lid concerning a 1st embodiment of this art. It is an exploded perspective view showing composition of a lid concerning a 1st embodiment of this art. It is a partial side sectional view showing composition of a frame member concerning a 1st embodiment of this art. It is an explanatory view about a manufacturing method of an imaging device concerning a 1st embodiment of this art. It is an explanatory view about a manufacturing method of an imaging device concerning a 1st embodiment of this art. It is a side sectional view showing the composition of the modification of the imaging device concerning a 1st embodiment of this art. It is explanatory drawing about the modification of the manufacturing method of the imaging device which concerns on 1st Embodiment of this technique. It is a side sectional view showing composition of an imaging device concerning a 2nd embodiment of this art. It is a perspective view showing a support frame body concerning a 2nd embodiment of this art. It is a side sectional view showing composition of an imaging device concerning a 3rd embodiment of this art. It is a perspective view showing a support frame body concerning a 3rd embodiment of this art. It is a side sectional view showing composition of an imaging device concerning a 4th embodiment of this art. 1 is a block diagram showing a configuration example of an electronic device including an imaging device according to an embodiment of the present technology; FIG.

In the package structure of a semiconductor device, the present technology simplifies the structure of the device, simplifies the manufacturing process, and reduces the cost by devising the structure of the lid bonded to the main body of the package. An object of the present invention is to reduce the influence of thermal stress associated with joining a lid to a package body.

EMBODIMENT OF THE INVENTION Hereinafter, with reference to drawings, the form (henceforth "embodiment" is called.) for implementing this technique is demonstrated. In the embodiments described below, an imaging device (solid-state imaging device) including a solid-state imaging element, which is an example of a semiconductor element, will be described as an example of a semiconductor device. In addition, description of embodiment is performed in the following order.
1. Configuration example of imaging device according to first embodiment2. 2. Manufacturing method of imaging device according to first embodiment; Modified example according to the first embodiment 4. Configuration example of imaging device according to second embodiment5. Configuration example of imaging device according to third embodiment6. Configuration example of imaging device according to fourth embodiment7. Configuration example of electronic equipment

<1. Configuration Example of Imaging Apparatus According to First Embodiment>
A configuration example of an imaging device according to a first embodiment of the present technology will be described with reference to FIGS. 1 to 6. FIG. For the sake of convenience, the up-down direction in FIG.

As shown in FIG. 1, the imaging device 1 includes an image sensor 2 as a solid-state imaging device, a housing 3, glass 4, and a frame member 5. The imaging device 1 includes a package main body 6 having a configuration in which the image sensor 2 is mounted on the housing 3, and a lid 7 having a configuration in which the glass 4 is attached to the frame member 5. The lid 7 is attached to the package main body 6. By bonding, a cavity 8 as an airtight space is formed, and an integral package structure in which the image sensor 2 is airtightly sealed is provided. Assuming that the left-right direction in FIG. 1 is the left-right direction of the imaging device 1, the imaging device 1 is configured symmetrically or substantially symmetrically with respect to each of the left-right direction and the direction orthogonal to the left-right direction in plan view.

The package main body 6 will be explained. The package main body 6 has a housing 3 and an image sensor 2 .

The housing 3 has a peripheral wall portion 10 surrounding the image sensor 2 and is electrically connected to the image sensor 2 . The housing 3 has a housing body portion 11 to which the image sensor 2 is connected, and the peripheral wall portion 10 is composed of a seal frame 12 which is a frame-shaped member provided for the housing body portion 11. ing. That is, in the housing 3 , the peripheral wall portion 10 is configured by the seal frame 12 which is separate from the housing main body 11 , and the housing 3 fixes the seal frame 12 to the housing main body 11 . Thus, it is configured as an integral member provided with the peripheral wall portion 10 .

The housing body 11 is a ceramic package made of ceramic such as alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), or the like. The housing main body 11 has a thick plate-like outer shape that is rectangular in plan view.

The housing main body 11 has a top surface 11a as one plate surface and a back surface 11b as a bottom surface opposite to the surface 11a as the other plate surface. Both the front surface 11a and the back surface 11b are horizontal surfaces. The rear surface 11 b is the lower surface (back surface) of the housing 3 . Further, the housing main body 11 has four side surfaces 11c. Wiring layers, electrodes, predetermined circuits, and the like are provided in the housing main body 11 .

The housing main body 11 has a concave portion 13 that opens toward the surface 11a as a portion for arranging the image sensor 2 . The concave portion 13 is formed in the central portion of the housing main body portion 11 on the side of the surface 11a. The concave portion 13 has a rectangular opening shape corresponding to the outer shape of the image sensor 2 and is formed in a range that occupies most of the surface 11a side of the housing main body portion 11 .

The concave portion 13 is a rectangular hole in a plan view and is formed by a surface portion including four side surface portions 13a formed perpendicular to the plate surface of the housing main body portion 11 and a horizontal bottom surface portion 13b. be. In the housing main body 11, the portion where the recess 13 is formed is a bottom plate portion 11d that is thinner than the peripheral portion where the recess 13 is not formed by the depth of the recess 13. As shown in FIG. The recessed portion 13 has an opening dimension larger than the external dimension of the image sensor 2 and is formed so that the entire image sensor 2 can be accommodated within the recessed portion 13 in plan view.

The material of the housing main body 11 is not limited, and may be made of other materials. The housing main body 11 may be, for example, an organic package or the like made of an organic material such as glass epoxy resin, which is a type of fiber-reinforced plastic.

The peripheral wall portion 10 has four wall portions 10a so as to form a rectangular shape in plan view corresponding to the rectangular shape in plan view of the housing main body portion 11, and these wall portions 10a form a frame shape. ing. The wall portion 10a is a portion that follows a rectangular outer shape whose longitudinal direction is the vertical direction in a side cross-sectional view. The wall portion 10a has an inner wall surface 10b, which is a wall surface on the image sensor 2 side, and an outer wall surface 10c, which is an outer wall surface on the opposite side.

The peripheral wall portion 10 positions the outer wall surface 10c of each wall portion 10a slightly inside the side surface 11c of the housing main body portion 11 . However, the peripheral wall portion 10 may be provided so that the outer wall surface 10c of each wall portion 10a is flush with the side surface 11c of the housing main body portion 11 .

The peripheral wall portion 10 has an upper surface 10d having a rectangular frame shape in plan view. The upper surface 10d is formed as a plane located on a predetermined imaginary plane perpendicular to the vertical direction. An upper surface 10d of the peripheral wall portion 10 serves as a surface to which the frame member 5 is joined.　

The seal frame 12 is a portion of the housing 3 that forms the peripheral wall portion 10 to which the frame member 5 is joined. In this embodiment, the seal frame 12 is a metal member, and the frame member 5 is welded to the seal frame 12 (peripheral wall portion 10).

The seal frame 12 has a configuration in which the surface of a seal frame main body 14 made of a metal material is covered with a metal coating portion 15 (see FIG. 1). The covering portion 15 forms an inner wall surface 10b, an outer wall surface 10c, and an upper surface 10d of the peripheral wall portion 10 .

Examples of the metal material forming the seal frame main body 14 include Kovar, which is an alloy containing iron (Fe), nickel (Ni), and cobalt, copper (Cu), a copper alloy, tungsten (W), and aluminum (Al). , stainless steel (SUS), 42 alloy, and the like. The covering portion 15 is a thin-film plated layer formed by plating with nickel (Ni), gold (Au), or the like, for example.

The seal frame 12 has a lower surface opposite to the upper surface 10d, which is bonded to the surface 11a of the housing main body 11 by metal brazing material using, for example, a silver-copper (Ag—Cu) alloy. It is joined to the housing body portion 11 .

In this embodiment, the seal frame 12 has a configuration in which the covering portion 15 is formed on the surface of the seal frame main body 14, but the configuration is not limited to this. The seal frame 12 may be configured with only the seal frame main body 14 , that is, with a configuration in which the covering portion 15 is omitted. Further, the seal frame main body 14 may be a portion formed as a part of the housing main body portion 11 using ceramics or the like as a material, for example.

The image sensor 2 is electrically connected to the housing body 11 . The image sensor 2 is a semiconductor element including a semiconductor substrate made of silicon (Si), which is an example of a semiconductor. The image sensor 2 is a rectangular plate-shaped chip, and the front surface 2a, which is the upper plate surface, is the light receiving surface side, and the opposite plate surface is the back surface 2b. The image sensor 2 also has four side portions 2c formed perpendicular to the plate surface.

A plurality of light receiving elements (photoelectric conversion elements) are formed on the surface 2a side of the image sensor 2 . The image sensor 2 according to this embodiment is a CMOS (Complementary Metal Oxide Semiconductor) type image sensor. However, the image sensor 2 may be a CCD (Charge Coupled Device) type image sensor or other imaging device such as a short wavelength infrared (SWIR: Short Wavelength Infra-Red) image sensor.

The image sensor 2 has, on the surface 2a side, a pixel region 16, which is a light receiving region in which a large number of pixels are formed, and a peripheral region 17, which is a region surrounding the pixel region 16. In the pixel region 16 , a large number of pixels are arranged in a predetermined arrangement such as a Bayer arrangement, and constitute a light receiving section of the image sensor 2 . A predetermined peripheral circuit is formed in the peripheral region 17 . The pixel region 16 includes an effective pixel region for generating, amplifying, and reading out signal charges by photoelectric conversion in each pixel. A pixel in the pixel region 16 has a photodiode as a photoelectric conversion unit having a photoelectric conversion function and a plurality of pixel transistors. In addition, in FIG. 1, the pixel area 16 is indicated by a light black portion.

On the front surface 2a side of the image sensor 2, a color filter and an on-chip lens are attached to each pixel through an antireflection film made of an oxide film or the like, a planarizing film made of an organic material, or the like, with respect to the semiconductor substrate. correspondingly formed. Light incident on the on-chip lens is received by a photodiode through a color filter, a planarization film, or the like.

The image sensor 2 is provided in the housing 3 while being supported by a Peltier element 18, which is a cooling element. The Peltier element 18 is a semiconductor thermoelectric element that uses the Peltier effect, is electrically connected to a power supply (not shown), and generates a temperature difference by passing current supplied from the power supply.

The Peltier element 18 has a substantially rectangular plate-like outer shape, and has an upper surface 18a and a lower surface 18b, which are both horizontal surfaces, as upper and lower plate surfaces. The Peltier element 18 is provided in a state of being accommodated within the recess 13 of the housing main body 11 . The Peltier element 18 has an upper surface 18a positioned below the surface 11a of the housing main body 11 in the vertical direction.

The Peltier element 18 is fixed on the bottom plate portion 11d with the lower surface 18b as a joint surface for the bottom surface portion 13b. The Peltier element 18 is made of a thermally conductive adhesive such as a die-bonding material, which is a resin-based adhesive with relatively high thermal conductivity, or a TIM (Thermal Interface Material) material to which a filler is added to increase thermal conductivity. It is fixed to the bottom plate portion 11d by bonding, soldering, or the like.

An image sensor 2 is provided on the upper surface 18 a of the Peltier element 18 . The image sensor 2 is fixed on the Peltier element 18 by bonding with a thermally conductive adhesive, soldering, or the like, using the rear surface 2b as a joint surface to the upper surface 18a. The image sensor 2 has the surface 2a located at substantially the same height as the surface 11a of the housing body 11 in the vertical direction. In addition, the image sensor 2 has four side portions 2c opposed to the four side portions 13a of the recess 13, respectively, and a gap exists between the image sensor 2 and the opening end of the recess 13. As shown in FIG.

In the Peltier element 18, by passing a direct current in a predetermined direction, the upper surface 18a side becomes a heat absorption side (cooling side) surface, and the lower surface 18b side becomes a heat radiation side surface. As a result, the image sensor 2 bonded to the upper surface 18 a of the Peltier element 18 is cooled by the Peltier element 18 .

The image sensor 2 is electrically connected to the housing main body 11 by a plurality of bonding wires (not shown) as connection members, which are fine metal wires made of Au (gold) or Cu (copper), for example. One end of the bonding wire is connected to the pad electrode formed in the peripheral area 17 on the surface 2a of the image sensor 2, and the other end is connected to the inner side of the peripheral wall 10 on the surface 11a of the housing main body 11. is connected to the lead electrode formed in the inner lead stage. These electrodes are terminals for transmitting/receiving signals to/from the outside in each of the image sensor 2 and the housing main body 11. For example, Al (aluminum), Au (gold), Ag (silver), Cu (copper), etc. is formed as a metal film made of a metal material of

A plurality of connectors 19 are provided as terminals for external connection on the rear surface 11b side of the housing main body 11 . The connector 19 is a plug for electrically connecting the imaging device 1 to a circuit board or the like of an external device. The connectors 19 are provided at two locations on the left and right sides on the rear surface 11 b side of the housing main body 11 . The two connectors 19 are provided extending along the left and right edges of the housing main body 11, and form ridges protruding from the rear surface 11b.

The connector 19 has a configuration in which a wiring portion 19b such as a metal lead portion is provided at a predetermined portion on a resin main body portion 19a forming the outer shape of the connector. The connector 19 has a predetermined fitting shape corresponding to a fitted portion to which the connector 19 is fitted. The connector 19 is mounted on the rear surface 11 b of the housing main body 11 by soldering or the like so as to electrically connect the wiring portion to the wiring portion formed on the housing main body 11 .

In this way, the imaging device 1 is configured as an image sensor connector package having the connector 19. The external connection terminal of the imaging device 1 is not limited to the connector 19, and may be, for example, a PGA (Pin Grid Array) in which a plurality of pins are arranged in a grid pattern.

The lid body 7 will be explained. Lid 7 has glass 4 and frame member 5 .

The glass 4 is an example of a transparent member provided so as to face the semiconductor element, and is made of a glass material such as borosilicate glass or soda glass, for example. The glass 4 has a rectangular plate-like outer shape, and has substantially the same outer dimensions as the image sensor 2 in plan view. It has a lower surface 4b, which is a plate surface on the side facing the image sensor 2, and an upper surface 4a, which is a surface on the opposite side.

The glass 4 is provided on the light-receiving side of the image sensor 2 so as to substantially match the outer shape of the image sensor 2 in a plan view and to be parallel to the image sensor 2 at a predetermined interval. The glass 4 is fixedly supported by the peripheral wall portion 10 via the frame member 5 .

The glass 4 constitutes an optical window and allows various kinds of light entering from an optical system such as a lens positioned above the imaging device 1 to pass therethrough. Light transmitted through the glass 4 enters the light receiving surface of the image sensor 2 via the cavity 8 . The glass 4 has a function of protecting the light receiving surface side of the image sensor 2 . As the transparent member according to the present technology, instead of the glass 4, for example, a plastic plate or a silicon plate that transmits only infrared light can be used.

The frame member 5 is a metal member formed by molding a metal plate into a predetermined shape. The frame member 5 has a rectangular outer shape in a plan view, and has a flat, substantially inverted hat shape in a side cross-sectional view. The frame member 5 includes a support surface portion 21 which is a bottom surface portion of the frame member 5 and has a rectangular shape in a plan view, and side portions formed along the four sides of the support surface portion 21 as a surface portion having an approximately inverted hat shape in a side sectional view. 22 and a flange portion 23 formed along the upper outer edge of the frame member 5 .

The support surface portion 21 is a horizontal surface portion that supports the glass 4 . The side surface portion 22 is a vertical surface portion bent upward from the four edges of the support surface portion 21 so as to form a right angle with the support surface portion 21 . The flange portion 23 is a frame-shaped horizontal surface portion formed by bending outward from the upper edges of the four side surface portions 22 so as to form a right angle with the side surface portions 22 .

An opening 24 is formed in the central portion of the support surface portion 21 to secure a passage of light received by the image sensor 2 . The opening 24 is a hole penetrating through the support surface 21 in the plate thickness direction, and has a rectangular opening shape corresponding to the outer shape of the image sensor 2 . The opening 24 is formed so that the entire pixel region 16 of the image sensor 2 is included in the opening area in plan view, and the periphery of the image sensor 2 is positioned outside the opening area. The opening 24 makes the support surface 21 a frame-shaped surface in a plan view.

In the frame member 5 , the four side surface portions 22 are portions that connect the flange portion 23 and the support surface portion 21 . The frame member 5 forms a recess 25 with respect to the flange portion 23 by the support surface portion 21 and the side surface portion 22 . In other words, a box-shaped portion with an open top is formed by the support surface portion 21 and the four side portions 22, and the flange portion 23 is formed on the outer side of the opening edge portion on the upper side of the box-shaped portion. .

The outer dimensions of the frame member 5 in plan view are the same or substantially the same as the outer dimensions of the seal frame 12 in plan view. In the frame member 5 , the flange portion 23 forming the outer shape in plan view is the portion that is joined to the upper surface 10 d of the peripheral wall portion 10 . The frame member 5 has the flange portion 23 placed on the peripheral wall portion 10, and the box-shaped portion composed of the support surface portion 21 and the side surface portion 22 is positioned below the upper surface 10d of the peripheral wall portion 10 inside the peripheral wall portion 10. It is installed in the Therefore, in the imaging device 1 , the support surface portion 21 of the frame member 5 is positioned closer to the image sensor 2 than the flange portion 23 by the vertical height of the side surface portion 22 .

As shown in FIG. 6, the frame member 5 has a structure in which the surface of a frame member main body 26 made of a metal material is covered with a metal film portion 27 that is a metal film. That is, the frame member 5 has a frame member main body 26 made of a metal material and a metal film portion 27 covering the surface of the frame member main body 26 . 1 and 4, the frame member 5 is shown in a simplified manner.

The frame member main body 26 has portions corresponding to the support surface portion 21, the side surface portion 22, and the flange portion 23 as the main body portion of the frame member 5. The frame member main body 26 is obtained by processing a plate material made of a predetermined metal material by press forming such as drawing. Examples of the metal material forming the frame member main body 26 include Kovar, which is an alloy containing iron (Fe), nickel (Ni), and cobalt, copper (Cu), a copper alloy, tungsten (W), aluminum (Al), Examples include stainless steel (SUS), 42 alloy, and the like.

The metal film portion 27 is formed so as to cover the entire frame member main body 26 . The metal film portion 27 is, for example, a thin-film plated layer formed by plating with nickel (Ni), gold (Au), or the like.

In this embodiment, the metal film portion 27 is formed so as to cover the entire surface of the frame member main body 26, but may be formed on a part of the surface of the frame member main body 26. The metal film portion 27 may be formed so as to cover at least the joint surface with respect to the peripheral wall portion 10 among the surfaces of the frame member main body 26 . That is, in the frame member 5, the lower surface 23b of the flange portion 23 serves as a joint surface with respect to the peripheral wall portion 10, so the metal film portion 27 corresponds to at least the lower surface 23b of the flange portion 23 among the surfaces of the frame member main body 26. It is sufficient that it is formed so as to cover the lower flange surface 26b.

In addition, the frame member 5 has a structure in which the frame member main body 26 is covered with the metal film portion 27, but may have a structure in which the metal film portion 27 is omitted. In other words, the frame member 5 may be the frame member body 26 itself, which is formed by processing a predetermined metal plate into a concave shape by press molding or the like.

In the lid 7 , the glass 4 is positioned in the recess 25 of the frame member 5 and is provided so as to block the opening 24 with respect to the support surface 21 from above. The glass 4 has a plan view outer shape larger than the opening size of the opening 24 , and is fixed to the support surface 21 in a state where the peripheral portion is placed on the support surface 21 .

The glass 4 is fixed on the upper surface 21a of the support surface portion 21 by a glass bonding portion 28 formed of a predetermined bonding material, with the lower surface 4b serving as a bonding surface for the support surface portion 21. The glass bonding portion 28 is interposed between the glass 4 and the support surface portion 21 over the entire or substantially the entire range in which the glass 4 covers the support surface portion 21 .

The glass bonding portion 28 is formed in the width direction inner side (opening 24 side) of each side of the supporting surface 21 having a rectangular frame shape with four sides formed by the opening 24 . there is Therefore, the portions of the support surface portion 21 on the outside in the width direction of each side portion are portions on the outside of the outer shape of the glass 4 in plan view, and are exposed surface portions. The glass joint 28 is formed along the entire periphery of the opening 24 so as to follow the opening shape of the opening 24 , and hermetically seals the opening 24 with the glass 4 .

The bonding material forming the glass bonding portion 28 is, for example, a low-melting-point glass that melts at a predetermined temperature (eg, a temperature of about 300° C.), a metal brazing material using, for example, a silver-copper (Ag—Cu) alloy, solder, or the like. is.

In the lid 7 , the glass 4 is entirely positioned within the recess 25 of the frame member 5 . The dimensions of the outer shape of the glass 4 in plan view are smaller than the outer dimensions of the concave portion 25 in plan view. It is opposed to the portion 22 with a gap therebetween. Further, the glass 4 has a plate thickness smaller than the vertical dimension of the side surface portion 22 , and in a state of being fixed to the frame member 5 , the upper surface 4 a is vertically aligned with the flange portion 23 of the frame member 5 . is located below the upper surface 23a of the . The upper surface 4a of the glass 4 is located below the upper surface 10d of the peripheral wall portion 10. As shown in FIG.

According to the cover body 7 configured such that the entire glass 4 is positioned within the recess 25 of the frame member 5 , the upper surface 23 a of the flange portion 23 of the frame member 5 serves as the upper surface of the imaging device 1 . An upper surface 23a of the flange portion 23 is a plane positioned on a predetermined imaginary plane perpendicular to the vertical direction.

In the image capturing apparatus 1, the frame member 5 is joined to the peripheral wall portion 10 to form an airtight space around the image sensor 2 together with the housing 3 and the glass 4. That is, the lid 7 having a configuration in which the opening 24 of the frame member 5 is airtightly sealed with the glass 4 is joined to the peripheral wall 10 so as to airtightly seal the flange 23 of the frame member 5 over the entire circumference. A cavity 8 around the image sensor 2 is an airtight space that does not allow gas to enter or leave the outside.

The flange portion 23 of the frame member 5 is welded to the upper surface 10d of the peripheral wall portion 10 . The frame member 5 is welded to the peripheral wall portion 10 at the outer edge side portion in the width direction of the flange portion 23 .

Specifically, the position of the outer edge of the flange portion 23 of the frame member 5 matches or substantially matches the position of the outer edge of the upper surface 10 d of the peripheral wall portion 10 . Further, the dimension of the upper surface 10d of the peripheral wall portion 10 in the width direction (horizontal direction in FIG. 1), that is, the wall thickness of the wall portion 10a is approximately half the dimension of the flange portion 23 in the width direction (horizontal direction in FIG. 1). ing.

Therefore, substantially half of the outer edge side of the flange portion 23 in the width direction is a portion that covers the upper surface 10 d of the peripheral wall portion 10 and is a welded portion to the peripheral wall portion 10 . In this embodiment, of the flange portion 23 , the outer edge portion having a dimension smaller than half of the overall width dimension of the flange portion 23 in the width direction is a welded portion to the peripheral wall portion 10 . In other words, the wall thickness of the wall portion 10 a is smaller than half of the widthwise dimension of the flange portion 23 , and the peripheral wall portion 10 is provided so as to match the outer edge of the flange portion 23 . Note that the outer edge of the flange portion 23 may protrude further outward than the peripheral wall portion 10 .

For the welding of the frame member 5, seam welding, which is a type of resistance welding that is welded by resistance heat generated by applying an electric current to the target portion, is used.

By seam welding, each side portion of the flange portion 23 of the frame member 5 is welded to the upper surface 10d formed by the four wall portions 10a forming the peripheral wall portion 10. As a result, the flange portion 23 is continuously welded to the peripheral wall portion 10 over the entire circumference, and the package is hermetically sealed. As for joining the frame member 5 to the housing 3, as long as the package can be airtightly sealed, for example, joining using other welding methods such as laser welding, metal brazing material, or soldering can be used. It may be a joining using a method other than welding, such as joining.

<2. Method for Manufacturing Imaging Device According to First Embodiment>
An example of a method for manufacturing the imaging device 1 according to this embodiment will be described with reference to FIGS. 7 and 8. FIG.

In the manufacturing method of the imaging device 1, after the process of manufacturing the package body 6 and the process of manufacturing the lid 7, the process of bonding the lid 7 to the package body 6 is performed. .

In the process of manufacturing the package body 6, first, as shown in FIG. 7A, a housing 3 having a peripheral wall 10 surrounding the image sensor 2 and electrically connected to the image sensor 2 is prepared. process is performed. The housing 3 is obtained by joining the sealing frame 12 to the housing main body 11 having the concave portion 13 with metal brazing material or the like.

As shown in FIG. 7A, a Peltier element 18 to which the image sensor 2 is attached is provided inside the concave portion 13 of the housing 3 . A connector 19 is mounted on the rear surface 11 b of the housing main body 11 .

Next, as shown in FIG. 7B, a step of providing the image sensor 2 electrically connected to the housing 3 inside the peripheral wall 10 of the housing main body 11 is performed. The image sensor 2 is fixed to the upper surface 18a of the Peltier element 18 by bonding with a thermally conductive adhesive, soldering, or the like. The image sensor 2 is electrically connected to the housing 3 by bonding wires (not shown) that connect electrodes formed on the surface side of the housing body 11 of the housing 3 and the image sensor 2 . The package main body 6 is obtained through the steps described above.

On the other hand, in the process of manufacturing the lid body 7, first, as shown in FIG. 8A, the process of preparing the frame member 5 is performed. The frame member 5 has a frame shape as a whole, has a flange portion 23 on the peripheral edge, forms a recess 25 for the flange portion 23 , and has an opening 24 in the support surface portion 21 that is the bottom portion of the recess 25 .

In the process of preparing the frame member 5, first, a metal plate is processed into a concave shape by press forming such as drawing, and a frame member main body 26 having portions to be the support surface portion 21, the side surface portion 22, and the flange portion 23 is formed. (see Figure 6). Kovar, for example, is used as the material of the frame member main body 26 . Then, the frame member main body 26 is plated with a material such as nickel (Ni) or gold (Au) by a known method such as electrolytic plating, so that the surface of the frame member main body 26 is entirely covered. A covering metal film portion 27 is formed. Thereby, the frame member 5 is obtained.

Next, as shown in FIG. 8B, a step of providing the glass 4 on the support surface portion 21 of the frame member 5 so as to close the opening 24 is performed. The glass 4 is bonded onto the support surface portion 21 by low-melting-point glass that serves as the glass bonding portion 28 .

For example, the low-melting-point glass is applied in a paste state to the support surface portion 21 or the glass 4 by a dispenser or a screen printing method, and after heating to evaporate the solvent, the glass 4 is mounted on the support surface portion 21. It is heated to a predetermined temperature and melted to weld the members together. However, the glass 4 may be joined by a metal brazing material using a silver-copper (Ag—Cu) alloy, solder, or the like.

Then, as shown in FIG. 8C, a step of attaching the frame member 5 to the housing 3 by joining the flange portion 23 to the upper surface 10d of the peripheral wall portion 10 by seam welding is performed.

That is, first, the lid body 7, which is a lid, is mounted on the package main body 6, which is a ceramic package. Here, the lid body 7 is in a state in which the concave portion 25 containing the glass 4 is positioned inside the peripheral wall portion 10 and the flange portion 23 is superimposed on the peripheral wall portion 10 . After the lid 7 is mounted on the package body 6, the flange 23 is seam-welded to the peripheral wall 10 over the entire periphery, thereby hermetically sealing the package.

Specifically, as shown in FIG. 8C, a pair of electrode rollers 30 are used as seam welding rollers in seam welding. The electrode roller 30 has a truncated cone-shaped roller main body 31 and a shaft 32 extending from the bottom side of the roller main body 31. The central axis of the roller main body 31 and the shaft 32 is the rotation axis R1. It is a rotating body that rotates. The pair of electrode rollers 30 are arranged coaxially with the roller main body 31 side facing each other, and are provided so as to rotate in the same direction in synchronization with each other (coaxial rotation). In FIG. 8C , the left-right direction is the rotation axis direction of the pair of electrode rollers 30 .

The electrode roller 30 contacts the flange portion 23 located on the peripheral wall portion 10 from above by using the outer peripheral surface 31a of the roller main body portion 31 as a contact surface with respect to the flange portion 23 . Electricity is applied to the peripheral wall portion 10 and the frame member 5 through the pair of electrode rollers 30 . When the pair of electrode rollers 30 are energized, the resistance of the contact portion of the electrode rollers 30 increases and heat is generated.

In the seam welding process, first, of the four sides of the flange portion 23 along the rectangular shape in plan view, a pair of sides facing each other are simultaneously welded by the pair of electrode rollers 30 . That is, the pair of electrode rollers 30 are rotated from one end to the other end in the extending direction of the side portions along the pair of side portions that face each other among the four side portions of the flange portion 23 while being pressurized and energized. While moving in the X direction (first direction), linear continuous welding is performed.

In this way, when the four side portions of the rectangular flange portion 23 are the first side portion 23c, the second side portion 23d, the third side portion 23e and the fourth side portion 23f in order in the circumferential direction (Fig. 5), first, the first side portion 23 c and the third side portion 23 e facing each other are welded to the peripheral wall portion 10 by the pair of electrode rollers 30 . Here, of the pair of electrode rollers 30, one electrode roller 30 welds the first side portion 23c, and the other electrode roller 30 welds the third side portion 23e.

After that, the direction of the rotation axis of the pair of electrode rollers 30 is rotated relative to the package side by 90° in plan view, and the remaining pair of side portions of the flange portion 23 facing each other, that is, the second side portion 23d and the fourth side portion 23d, are rotated. Welding is performed on the side portion 23f with the moving direction of the pair of electrode rollers 30 being the Y direction (second direction). Note that the Y direction is a direction perpendicular to the X direction in plan view.

As a result, the entire periphery of the flange portion 23 consisting of four sides is welded to the peripheral wall portion 10, and the package is hermetically sealed. In the seam welding step, one electrode roller 30 may be used to weld the four sides of the flange portion 23 one by one. Through the steps described above, the imaging apparatus 1 as shown in FIG. 1 is obtained.

According to the imaging device 1 according to the present embodiment as described above, the configuration of the lid body 7 joined to the package main body 6 can be simplified, and the manufacturing process can be simplified and the cost can be reduced. In addition, it is possible to reduce the influence of the thermal stress that accompanies the bonding of the lid 7 to the package main body 6 .

In the imaging device 1 , the constituent members of the lid 7 are two members, the glass 4 and the frame member 5 , and the glass 4 is joined to the frame member 5 by a predetermined glass joint 28 . As a result, the number of constituent members of the lid body 7 can be reduced, the construction of the lid body 7 can be simplified, and only one type of joining material is required for joining the constituent members of the lid body 7 together. becomes possible. Thereby, the manufacturing process of the lid body 7 including the bonding process of the members can be simplified, and the material cost can be reduced.

In addition, according to the lid 7, the welded portion of the frame member 5 to the peripheral wall portion 10 serving as a heat source (hereinafter referred to as the “lid welded portion”) is extended to the joint portion of the glass 4 to the frame member 5 (hereinafter referred to as the “glass jointed portion”). ) can be lengthened. Specifically, in the frame member 5 , the lid welded portion is the outer edge of the flange portion 23 , and the glass bonded portion is the opening edge of the support surface portion 21 on the opening 24 side. Therefore, in the frame member 5, the widthwise inner portion of the flange portion 23, the side surface portion 22, and the widthwise outer portion of the support surface portion 21 are interposed between the cover welded portion and the glass welded portion. are doing. Moreover, these surface portions are bent to form a crank shape when viewed in cross section from the side.

Thus, according to the lid body 7, the heat transfer path from the lid welding portion to the glass bonding portion in the frame member 5 can be easily secured. As a result, regarding the thermal stress caused by the heat generated at the welded portion when the frame member 5 is welded by seam welding, the thermal stress acting on the portion supporting the glass 4 in the frame member 5, particularly the glass joint portion, can be reduced. . Therefore, breakage such as cracking of the glass 4 due to residual stress in the frame member 5 can be suppressed. In particular, according to the configuration in which the outer edge side portion of the flange portion 23 is welded to the peripheral wall portion 10 as in the present embodiment, it is possible to increase the distance from the cover welded portion to the glass joint portion. can effectively reduce the effect of thermal stress on

In addition, according to the bent surface shape of the frame member 5 which has a substantially inverted hat shape when viewed in cross section from the side, a certain degree of flexibility can be obtained due to the elasticity of the frame member 5 . As a result, the thermal stress applied to the glass joint portion during seam welding can be relaxed, and the influence of the thermal stress can be reduced.

Further, in the imaging device 1, the upper surface 10d of the peripheral wall portion 10 can be set as an optical reference. This makes it possible to prevent the optical reference used for setting the height position of the image sensor 2 in the imaging device 1 from being affected by the parallelism of the glass 4 or the like. Therefore, without considering the parallelism between the glass 4 and the image sensor 2, it is possible to easily and accurately perform optical settings and adjustments in the imaging device 1. FIG. The imaging device 1 is positioned in the external device such that the surface 2a of the image sensor 2 is perpendicular to the optical axis.

Further, in the imaging device 1 , the frame member 5 has a concave portion 25 protruding toward the image sensor 2 side, and the glass 4 is provided in the concave portion 25 . According to such a configuration, the glass 4 can be arranged close to the image sensor 2 due to the depth of the concave portion 25 with respect to the lid welding portion. As a result, it is possible to secure a wide range of incident angles of light that can be captured by the image sensor 2 with respect to the light that is transmitted through the glass 4 . Here, the incident angle is the angle of inclination of the incident light with respect to the image sensor 2 and the angle of inclination with respect to a line perpendicular to the light receiving surface of the image sensor 2 .

Further, in the imaging device 1, the lid body 7 is welded to the peripheral wall portion 10. As shown in FIG. With such a configuration, the package can be hermetically sealed easily and reliably without using a bonding material.

Further, the frame member 5 constituting the lid 7 is formed in a concave shape by the supporting surface portion 21 and the side surface portion 22 so as to form a concave portion 25 , and supports the glass 4 so that the entire glass 4 is contained within the concave portion 25 . are doing. According to such a configuration, the glass 4 can be protected by the frame member 5, and the upper surface 23a of the flange portion 23 of the frame member 5 or the upper surface 10d of the peripheral wall portion 10 serving as the lid weld portion can be used as an optical reference. can be set to

In addition, in the housing 3 , the peripheral wall portion 10 is composed of a seal frame 12 that is separate from the housing body portion 11 to which the image sensor 2 is connected. With such a configuration, it is possible to improve the degree of freedom regarding the configuration, material, etc. of the peripheral wall portion 10 to which the frame member 5 is joined. As a result, for example, the peripheral wall portion 10 can be configured and made of a suitable material as a portion to be welded to the frame member 5, so that good bondability can be obtained at the joint portion between the frame member 5 and the peripheral wall portion 10. .

In addition, by configuring the peripheral wall portion 10 with the seal frame 12 that is separate from the housing main body portion 11, the members constituting the housing main body portion 11 and the peripheral wall portion 10 can be manufactured separately. This makes it possible to easily manufacture the housing 3 .

Further, the frame member 5 has a structure in which the surface of the frame member main body 26 made of a metal material such as Kovar is covered with a metal film portion 27 that is a plated layer of gold or the like. According to such a configuration, it is possible to obtain good weldability in welding the frame member 5 to the peripheral wall portion 10 by seam welding or the like.

Also, in the imaging device 1 , the image sensor 2 is provided in a state of being supported by the Peltier element 18 with respect to the housing 3 . According to such a configuration, the image sensor 2 can be cooled by the Peltier element 18 while preventing dew condensation in the cavity 8 due to the temperature difference caused by the Peltier element 18 due to the airtight sealing structure of the package. Therefore, a good operating state of the imaging device 1 can be ensured.

<3. Modified example according to the first embodiment>
A modification of the first embodiment will be described.

(First modification)
A first modified example is a modified example of the configuration of the package body portion 6 . As shown in FIG. 9 , in the first modification, the package main body 6 does not include the Peltier element 18 and the image sensor 2 is directly supported by the housing main body 11 .

In the example shown in FIG. 9, the housing main body 11 has a relatively shallow concave portion 33 formed on the surface 11a side as a portion for arranging the image sensor 2 . The concave portion 33 is formed in the central portion of the housing main body portion 11 on the surface 11a side. The concave portion 33 has a rectangular opening shape corresponding to the outer shape of the image sensor 2 and is formed in a range that occupies most of the surface 11a side of the housing main body portion 11 .

The concave portion 33 is a rectangular hole in a plan view and is formed by a surface portion including four side surface portions 33a formed perpendicular to the plate surface of the housing main body portion 11 and a horizontal bottom surface portion 33b. be. The recessed portion 33 has an opening dimension larger than the external dimension of the image sensor 2 and is formed so that the entire image sensor 2 can be accommodated within the recessed portion 33 in plan view. A portion of the surface 11a of the housing main body 11 that is inside the peripheral wall 10 and outside the recess 33 serves as an inner lead step on which lead electrodes and the like for receiving connection of bonding wires are formed.

The image sensor 2 is provided on the bottom surface portion 33b of the recessed portion 33. The image sensor 2 is fixed on the housing main body 11 by bonding with a thermally conductive adhesive or the like using the rear surface 2b as a bonding surface to the bottom surface portion 33b. The image sensor 2 has four side portions 2c facing the four side portions 33a of the recess 33, respectively, and a gap exists between the image sensor 2 and the opening end of the recess 33. As shown in FIG.

Thus, the support surface to which the image sensor 2 is fixed may be formed as part of the housing main body 11. With such a configuration, the configuration of the imaging device 1 can be simplified. Note that the configuration of this modification may be a configuration in which the image sensor 2 is mounted on the flat surface 11a without forming the concave portion 33 on the surface 11a side of the housing body portion 11 .

(Second modification)
A second modification is a modification of the method for manufacturing the imaging device 1 . The method of the second modification is a method of joining the frame member 5 alone to the package main body 6 side before joining the glass 4 to the frame member 5 .

First, after the step of manufacturing the package main body 6 (see FIGS. 7A and 7B) and the step of preparing the frame member 5 (FIG. 8A) are performed, the frame member 5 is first attached to the package main body 6. A joining step is performed.

That is, as shown in FIG. 10A, a step of attaching the frame member 5 to the housing 3 by seam-welding the flange portion 23 to the upper surface 10d of the peripheral wall portion 10 is performed. Here, after the frame member 5 is mounted on the package main body 6, a pair of electrode rollers 30 are used, and the flange portion 23 is seam-welded to the peripheral wall portion 10 in the same manner as in the seam welding process described above. Welded all around to hermetically seal the package.

After that, as shown in FIG. 10B , a step of bonding the glass 4 to the support surface portion 21 of the frame member 5 with the low-melting-point glass serving as the glass bonding portion 28 so as to close the opening 24 is performed (see arrow A1). ).

In this way, a method of first bonding only the frame member 5 to the package body 6 and then bonding the glass 4 to the frame member 5 may be used without manufacturing the lid 7 in advance. According to such a manufacturing method, the package can be hermetically sealed without generating residual stress itself due to welding in the frame member 5 .

That is, when the frame member 5 is joined to the peripheral wall portion 10 by welding, the glass 4 is not joined. As a result, the glass 4 is joined to the frame member 5 in a stress-free state with respect to the thermal stress that accompanies the welding of the frame member 5 . Therefore, the generation of residual stress in the frame member 5 can be suppressed or prevented, and the influence of thermal stress on the glass joint can be effectively reduced.

<4. Configuration Example of Imaging Apparatus According to Second Embodiment>
A configuration example of an imaging device 41 according to a second embodiment of the present technology will be described with reference to FIGS. 11 and 12. FIG. In each embodiment described below, the same reference numerals are given to the configurations common to those of the first embodiment, and the description of overlapping contents is omitted as appropriate.

As shown in FIG. 11, the imaging device 41 according to this embodiment further includes a support frame 50 as a support member in the configuration according to the first embodiment. The support frame 50 is provided on the opposite side (lower side) of the support surface portion 21 of the frame member 5 to the glass 4 side, and is a member that supports the support surface portion 21 on the housing 3 side.

As shown in FIGS. 11 and 12, the support frame 50 is a substantially plate-like member having a rectangular outer shape in plan view, and includes a horizontal plate-like body plate portion 51 and an outer edge of the body plate portion 51. and an outer edge support portion 52 that is a portion that is formed along and protrudes downward. The support frame body 50 has a substantially “L”-shaped cross-sectional shape at each side portion forming a frame shape by the main body plate portion 51 and the outer edge support portion 52 . The support frame 50 has external dimensions to fit inside the peripheral wall portion 10 . Note that FIG. 12 shows a part of the support frame 50 cut away for the sake of convenience.

An opening 53 is formed in the central portion of the body plate portion 51 to secure a passage of light received by the image sensor 2 . The opening 53 is a hole penetrating through the main body plate 51 in the plate thickness direction, and has a rectangular opening shape corresponding to the outer shape of the image sensor 2 . The opening 53 has substantially the same opening dimensions as the opening 24 of the frame member 5 , and includes the entire pixel region 16 of the image sensor 2 in its opening area in a plan view, and the peripheral edge of the image sensor 2 as the opening area. is formed so as to be positioned outside the The opening 53 makes the support frame 50 a frame-shaped member.

The body plate portion 51 is a horizontal surface portion that supports the support surface portion 21 of the frame member 5 from below. The outer edge support portion 52 is formed in a frame shape along the rectangular outer shape of the main body plate portion 51 on the lower side of the main body plate portion 51, and has a protruding shape along the rectangular shape in a side sectional view.

The support frame 50 has the upper surface of the main body plate portion 51 as an upper surface 51a that is a horizontal plane. Further, the support frame 50 has a lower surface 52a formed as a plane positioned on a predetermined imaginary plane perpendicular to the vertical direction as the surface on the lower side of the outer edge support portion 52. As shown in FIG. Further, the support frame 50 has four side surfaces 50a formed perpendicular to the upper surface 51a and the lower surface 52a.

The material of the support frame 50 is not particularly limited as long as the support frame 50 can obtain a predetermined support strength. The support frame 50 is a solid member with relatively high rigidity made of, for example, a material such as ceramics, metal, or resin material. The material of the support frame 50 is preferably a material that is not easily affected by heat, light, or the like, and is not easily deteriorated or deformed over time.

The support frame 50 is provided in a fixed state by being joined to the housing main body 11 with a predetermined joint material such as brazing material or adhesive, with the lower surface 52a serving as a joint surface for the surface 11a of the housing main body 11. there is The support frame 50 is fitted into the peripheral wall portion 10 by matching the outer dimensions to the opening size of the peripheral wall portion 10, and the four side surfaces 50a are in contact with the inner wall surface 10b of the peripheral wall portion 10. , and may be provided without being joined to the housing main body 11 .

The support frame 50 extends the body plate portion 51 from the outer edge support portion 52 toward the center of the imaging device 1 , and the peripheral area 17 of the image sensor 2 is held upward by the portion of the body plate portion 51 on the side of the opening 53 . covered from Between the body plate portion 51 and the surface 2 a of the image sensor 2 , there is a gap corresponding to the protrusion height of the outer edge support portion 52 from the bottom surface 51 b of the body plate portion 51 .

The support frame 50 has the upper surface 51a as a joint surface or a contact surface with respect to the lower surface 21b of the support surface portion 21, and the support surface portion 21 of the frame member 5 is placed on the main body plate portion 51. It supports the member 5. The body plate portion 51 may be provided in a state of being joined to the support surface portion 21 with a joining material such as a brazing material or an adhesive, or may be provided in a state of surface contact without a joining material.

The support frame 50 is provided to the housing 3 in the manufacturing process of the imaging device 41, before the process of welding the frame member 5 to the peripheral wall portion 10. The step of providing the support frame 50 to the housing main body 11 may be a step preceding the step of providing the peripheral wall 10 by joining the seal frame 12 to the housing main body 11. It may be a later step. By joining the frame member 5 to the peripheral wall portion 10 by welding while the support frame 50 is arranged on the housing main body 11 , the concave portion 25 of the frame member 5 is grounded on the support frame 50 .

According to the imaging device 41 according to this embodiment, the following effects can be obtained in addition to the effects obtained by the imaging device 1 of the first embodiment. That is, by interposing the support frame 50 between the housing main body 11 and the frame member 5 inside the peripheral wall portion 10, the recessed portion 25 of the frame member 5 including the support surface portion 21 that supports the glass 4 is formed. , can be supported by the support frame 50 with respect to the housing main body 11 . As a result, the frame member 5, to which the flange portion 23 is fixed at the lid welded portion, can be supported from below and fixed, thereby suppressing elastic deformation of the frame member 5, which is relatively prone to elastic deformation. The glass 4 can be stably supported, and the parallelism between the glass 4 supported by the frame member 5 and the surface 2a, which is the sensor surface of the image sensor 2, can be ensured. Moreover, since deformation of the frame member 5 can be suppressed, the influence of thermal stress acting on the glass joint portion during welding of the frame member 5 can be effectively reduced.

In the present embodiment, the support frame 50 is a frame-shaped member that supports the entire circumference of the frame member 5 in plan view. A support that partially supports the outer shape in the circumferential direction may be used, or a plurality of supports may be provided. Further, the support member according to the present embodiment may be any member as long as it supports the support surface portion 21 of the frame member 5 with respect to the housing main body portion 11 without blocking incident light to the image sensor 2. The shape is not particularly limited.

<5. Configuration Example of Imaging Apparatus According to Third Embodiment>
A configuration example of an imaging device 61 according to a third embodiment of the present technology will be described with reference to FIGS. 13 and 14. FIG. This embodiment differs from the second embodiment in the configuration of the support member.

As shown in FIG. 13, an imaging device 61 according to this embodiment further includes a support frame 70 as a support member in the configuration according to the first embodiment. The support frame 70 is provided on the side opposite to the glass 4 side with respect to the support surface portion 21 of the frame member 5 and is a member that supports the support surface portion 21 with respect to the housing 3 side. In this embodiment, the support frame 70 is provided so as to support the support surface portion 21 of the frame member 5 with respect to the image sensor 2 .

As shown in FIGS. 13 and 14, the support frame 70 is a frame-shaped member having a rectangular outer shape in a plan view and four linear side portions 71 . Side portion 71 has a rectangular cross-sectional shape. The support frame 70 has external dimensions to fit inside the peripheral wall portion 10 . Note that FIG. 14 shows a part of the support frame 70 cut away for the sake of convenience.

The support frame 70 has four side portions 71 forming an opening 73 in the central portion for securing a passage of light received by the image sensor 2 . The opening 73 is a hole vertically penetrating the support frame 70 and has a rectangular opening shape corresponding to the outer shape of the image sensor 2 . The opening 73 has substantially the same opening dimensions as the opening 24 of the frame member 5 , and includes the entire pixel region 16 of the image sensor 2 in its opening area in a plan view, and also includes the peripheral edge of the image sensor 2 as the opening area. is formed so as to be positioned outside the

The support frame 70 has an upper surface 70a and a lower surface 70b which are horizontal planes formed as planes positioned on a predetermined imaginary plane perpendicular to the vertical direction. The support frame 70 also has four side surfaces 70c formed perpendicular to the upper surface 70a and the lower surface 70b.

The support frame 70 has an outer dimension in plan view that is large enough to position the whole on the peripheral region 17 formed around the pixel region 16 as a frame-shaped region in the image sensor 2 in plan view. That is, on the image sensor 2, the four inner side surfaces 73a forming the opening 73 of the support frame 70 are located outside the pixel region 16, and the four side surfaces 70c are located inside the side surface portion 2c. positioned. Thus, the support frame 70 is positioned outside the pixel region 16 and within the outline of the image sensor 2 in plan view.

The material of the support frame 70 is not particularly limited as long as the support frame 70 can obtain a predetermined support strength. The support frame 70 is a solid member with relatively high rigidity made of, for example, ceramics, metal, resin material, or the like. The material of the support frame 70 is preferably a material that is less susceptible to heat, light, and the like, and that is less likely to deteriorate or deform over time.

The support frame 70 is fixed to the image sensor 2 with a predetermined bonding material such as brazing material or adhesive, with the lower surface 70b serving as a bonding surface for the portion of the peripheral region 17 on the surface 2a of the image sensor 2. It is

The support frame 70 supports the support surface portion 21 of the frame member 5 from below and supports the frame member 5 with respect to the image sensor 2 by using the upper surface 70a as a joint surface or contact surface with respect to the lower surface 21b of the support surface portion 21 . Specifically, the width of each side portion 71 of the support frame 70 is approximately half the width of the four sides of the support surface portion 21 forming the opening 24 . is located on the opening edge side (inner peripheral side) of the opening 24 in the width direction of each side of the opening 24 . The support frame 70 may be provided in a state of being joined to the support surface portion 21 with a bonding material such as a brazing material or an adhesive, or may be provided in a state of surface contact without a bonding material.

In the present embodiment, the entire support frame 70 is positioned within the contour of the image sensor 2. However, for example, the support frame 70 has a size that protrudes from the contour of the image sensor 2 in plan view. may be In this case, the support frame 70 may have an outer edge positioned on the surface 11a of the housing body 11 and bonded to the surface 11a with a bonding material. If the support frame 70 has a size that protrudes from the image sensor 2 , the support frame 70 fits inside the peripheral wall 10 by matching the outer dimensions to the opening size of the peripheral wall 10 . and the four side surfaces 70c are in contact with the inner wall surface 10b of the peripheral wall portion 10, and may be provided without being joined to the image sensor 2. FIG.

The support frame 70 is provided for the image sensor 2 in the manufacturing process of the imaging device 61, before the process of welding the frame member 5 to the peripheral wall portion 10. The step of providing the support frame 70 for the image sensor 2 may be before or after the step of providing the peripheral wall portion 10 by joining the seal frame 12 to the housing body portion 11. It may be a process. By joining the frame member 5 to the peripheral wall portion 10 by welding while the support frame 70 is arranged on the image sensor 2 , the concave portion 25 of the frame member 5 is grounded on the support frame 70 .

According to the imaging device 61 according to the present embodiment, the following operational effects can be obtained in addition to the operational effects obtained by the imaging device 1 of the first embodiment. That is, by interposing the support frame body 70 between the image sensor 2 and the frame member 5 inside the peripheral wall portion 10, the recessed portion 25 of the frame member 5 including the support surface portion 21 for supporting the glass 4 is imaged. The sensor 2 can be supported by a support frame 70 . That is, the recessed portion 25 of the frame member 5 can be supported by the housing 3 via the image sensor 2 and the Peltier element 18 . As a result, the frame member 5, to which the flange portion 23 is fixed at the lid welded portion, can be supported from below and fixed, thereby suppressing elastic deformation of the frame member 5, which is relatively prone to elastic deformation. The glass 4 can be stably supported, and the parallelism between the glass 4 supported by the frame member 5 and the surface 2a, which is the sensor surface of the image sensor 2, can be ensured. Moreover, since deformation of the frame member 5 can be suppressed, the influence of thermal stress acting on the glass joint portion during welding of the frame member 5 can be effectively reduced.

Furthermore, according to the imaging device 61 of the present embodiment, since the support frame 70 is interposed between the frame member 5 and the image sensor 2, the support frame 70 is provided in the housing main body 11. no space is required for As a result, the housing 3 can be downsized, and the imaging device 61 can be made compact.

In the present embodiment, the support frame 70 is a frame-shaped member that supports the entire circumference of the frame member 5 in plan view. A support that partially supports the outer shape in the circumferential direction may be used, or a plurality of supports may be provided. Further, the support member according to the present embodiment may be any member as long as it supports the support surface portion 21 of the frame member 5 with respect to the housing main body portion 11 without blocking incident light to the image sensor 2. The shape is not particularly limited. For example, the support frame 70 may have a substantially "L"-shaped cross-sectional shape at each side portion 71, like the support frame 50 according to the second embodiment.

<6. Configuration Example of Imaging Apparatus According to Fourth Embodiment>
A configuration example of an imaging device 81 according to a fourth embodiment of the present technology will be described with reference to FIG. 15 . This embodiment differs from the first embodiment in the configuration of the frame member 5 .

As shown in FIG. 15, in the imaging device 81 according to this embodiment, the side surface portion 22 of the frame member 5 is formed to have a zigzag shape when viewed in longitudinal section. That is, the four side surface portions 22 forming the concave portion 25 of the frame member 5 are processed and formed to have a bellows shape as a whole.

The side surface portion 22 includes a first slope portion 22a that slopes from the outside to the inside of the frame member 5 from the top to the bottom, and a second slope portion 22b that slopes in the opposite direction to the first slope portion 22a. are arranged alternately and continuously. In a side sectional view as shown in FIG. 15, the lower edge of the first slope portion 22a and the upper edge of the second slope portion 22b form an inwardly convex corner portion 22c, forming a second slope. The lower edge of the portion 22b and the upper edge of the first slope portion 22a form an outwardly convex corner portion 22d.

In the example shown in FIG. 15 , a first slope portion 22 a is formed on the lower edge of the side surface portion 22 so as to connect the lower edge to the outer edge of the support surface portion 21 . A first slope portion 22 a is formed on the upper edge of the side surface portion 22 so as to connect the upper edge to the inner edge of the flange portion 23 . In addition, the upper edge portion and the lower edge portion of the side surface portion 22 may be formed by the second slope portion 22b. Moreover, in the side surface portion 22, the number of repetitions of the first slope portion 22a and the second slope portion 22b is not particularly limited. Also, in the side surface portion 22, the corners 22c and 22d may be acute-angled or obtuse-angled.

According to the imaging device 81 according to this embodiment, the following effects can be obtained in addition to the effects obtained by the imaging device 1 of the first embodiment. That is, by forming the side portion 22 in a zigzag shape, compared to the configuration in which the side portion 22 is a vertical flat surface portion as in the first embodiment, the heat transfer path from the lid welding portion to the glass bonding portion is reduced. can be lengthened. As a result, it is possible to make it difficult for heat generated by welding to be conducted to the glass joints, and to effectively reduce the influence of thermal stress on the glass joints.

In addition, according to the zigzag shape of the side portion 22, the side portion 22 can absorb the thermal stress caused by the heat generated in the welded portion when the frame member 5 is welded by seam welding. As a result, together with the side cross-sectional shape of the frame member 5 having a substantially inverted hat shape, the flexibility due to the elasticity of the frame member 5 can be improved. can effectively reduce the effect of thermal stress.

Further, by forming the side portions 22 in a zigzag shape, the strength of the frame member 5 can be improved, and the external stress acting on the glass 4 or the like can be absorbed by the side portions 22 . This makes it possible to obtain a package structure that is resistant to external shocks.

<7. Configuration example of electronic device>
An application example of the imaging device according to the above-described embodiment to an electronic device will be described with reference to FIG. 16 .

Imaging devices (solid-state imaging devices) according to the present technology include camera devices such as digital still cameras and video cameras, mobile terminal devices having an imaging function, and copiers that use solid-state imaging devices for image reading. The present invention can be applied to electronic devices in general that use a solid-state imaging device as a section (photoelectric conversion section). The imaging device may be formed as a single chip, or may be in the form of a module having an imaging function in which an imaging unit and a signal processing unit or an optical system are packaged together. good too.

As shown in FIG. 16, a camera device 200 as an electronic device includes an optical unit 202, an imaging device 201, a DSP (Digital Signal Processor) circuit 203 as a camera signal processing circuit, a frame memory 204, and a display unit 205. , a recording unit 206 , an operation unit 207 , and a power supply unit 208 . The DSP circuit 203, frame memory 204, display unit 205, recording unit 206, operation unit 207, and power supply unit 208 are appropriately connected via a connection line 209 such as a bus line. The imaging device 201 is, for example, the imaging device 1 according to the first embodiment described above.

The optical unit 202 includes a plurality of lenses, captures incident light (image light) from a subject, and forms an image on the imaging surface of the imaging device 201 . The imaging device 201 converts the amount of incident light imaged on the imaging surface by the optical unit 202 into an electric signal in units of pixels, and outputs the electric signal as a pixel signal.

The display unit 205 is, for example, a panel type display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and displays moving images or still images captured by the imaging device 201 . A recording unit 206 records a moving image or still image captured by the imaging device 201 in a recording medium such as a hard disk or a semiconductor memory.

The operation unit 207 issues operation commands for various functions of the camera device 200 under the user's operation. The power supply unit 208 appropriately supplies various power supplies as operating power supplies for the DSP circuit 203, the frame memory 204, the display unit 205, the recording unit 206, and the operation unit 207 to these supply targets.

According to the camera device 200 as described above, regarding the imaging device 201, the configuration of the lid body 7 joined to the package main body 6 can be simplified, and the manufacturing process can be simplified and the cost can be reduced. In addition, it is possible to reduce the influence of the thermal stress that accompanies the bonding of the lid 7 to the package main body 6 . As a result, the cost of the camera device 200 can be reduced, and desired characteristics can be obtained.

The above description of the embodiment is an example of the present technology, and the present technology is not limited to the above-described embodiment. Therefore, it goes without saying that various modifications other than the above-described embodiment are possible according to the design and the like as long as they do not deviate from the technical idea of the present disclosure. In addition, the effects described in the present disclosure are only examples and are not limited, and other effects may also occur. In addition, the configurations of the embodiments and the configurations of the modifications described above can be appropriately combined.

In the above-described embodiment, the semiconductor element included in the imaging device is the image sensor 2, which is a light receiving element, but the semiconductor element according to the present technology is not limited to this. The semiconductor device according to the present technology may be, for example, a light-emitting device such as a VCSEL (Vertical Cavity Surface Emitting LASER), a laser diode, or an LED (Light Emitting Diode). Further, the imaging device may have a configuration in which a plurality of semiconductor elements are provided on one chip, or a configuration in which a plurality of semiconductor elements are provided as a plurality of chips.

In addition, this technique can take the following configurations.
(1)
a semiconductor element;
a housing having a peripheral wall surrounding the semiconductor element and electrically connected to the semiconductor element;
a transparent member provided to face the semiconductor element;
a flange portion joined to the upper surface of the peripheral wall portion; and a supporting surface portion positioned closer to the semiconductor element than the flange portion and supporting the transparent member, and supporting the semiconductor element together with the casing and the transparent member. A semiconductor device comprising: a frame member having an airtight space around it.
(2)
The semiconductor device according to (1), wherein the flange portion of the frame member is welded to the upper surface of the peripheral wall portion.
(3)
The frame member has a side surface portion connecting the flange portion and the support surface portion, and the support surface portion and the side surface portion form a recess with respect to the flange portion,
The semiconductor device according to (1) or (2), wherein the transparent member is entirely positioned within the recess.
(4)
The housing has a housing main body for receiving connection of the semiconductor element,
The semiconductor device according to any one of (1) to (3), wherein the peripheral wall portion is configured by a frame-shaped member provided for the housing body portion.
(5)
Any one of (1) to (4) above, further comprising a support member provided on the side opposite to the transparent member side with respect to the support surface portion of the frame member and supporting the support surface portion with respect to the housing side. 1. The semiconductor device according to 1.
(6)
The semiconductor device according to (5), wherein the support member is provided to support the support surface portion with respect to the semiconductor element.
(7) The frame member includes a frame member main body made of an alloy containing iron, nickel, and cobalt, and a metal film formed so as to cover at least a surface of the frame member main body to be joined to the peripheral wall portion. The semiconductor device according to any one of (1) to (6) above.
(8)
The semiconductor device according to (3), wherein the side surface portion of the frame member is formed to have a zigzag shape in a vertical cross-sectional view.
(9)
The semiconductor device according to any one of (1) to (8), wherein the semiconductor element is supported by a cooling element with respect to the housing.
(10)
a semiconductor element;
a housing having a peripheral wall surrounding the semiconductor element and electrically connected to the semiconductor element;
a transparent member provided to face the semiconductor element;
a flange portion joined to the upper surface of the peripheral wall portion; and a supporting surface portion positioned closer to the semiconductor element than the flange portion and supporting the transparent member, and supporting the semiconductor element together with the casing and the transparent member. An electronic device having a semiconductor device, comprising: a frame member having an airtight space around it.
(11)
preparing a housing having a peripheral wall surrounding a semiconductor element and electrically connected to the semiconductor element;
a step of providing the semiconductor element inside the peripheral wall portion of the housing in a state of being electrically connected to the housing;
a step of preparing a frame member that is configured in a frame shape as a whole, has a flange portion on the peripheral edge portion, forms a recess for the flange portion, and has an opening on the bottom surface of the recess;
a step of attaching the frame member to the housing by welding the flange portion to the upper surface of the peripheral wall portion;
and providing a transparent member on the bottom surface of the frame member so as to block the opening.

1 Imaging device (semiconductor device)
2 Image sensor (semiconductor element)
3 housing 4 glass (transparent member)
5 frame member 8 cavity 10 peripheral wall portion 10d upper surface 11 housing body portion 12 seal frame (frame-shaped member)
13 recess 16 pixel region 17 peripheral region 18 Peltier element (cooling element)
21 support surface portion 22 side surface portion 23 flange portion 24 opening portion 25 concave portion 26 frame member main body 27 metal film portion 41 imaging device (semiconductor device)
50 support frame (support member)
61 imaging device (semiconductor device)
70 support frame (support member)
81 imaging device (semiconductor device)
200 camera device (electronic device)
201 imaging device (semiconductor device)

Claims (11)

1. a semiconductor element;
   a housing having a peripheral wall surrounding the semiconductor element and electrically connected to the semiconductor element;
   a transparent member provided to face the semiconductor element;
   a flange portion joined to the peripheral wall portion; and a supporting surface portion positioned closer to the semiconductor element than the flange portion and supporting the transparent member, and surrounding the semiconductor element together with the casing and the transparent member. A semiconductor device comprising: a frame member forming an airtight space.
2. The semiconductor device according to claim 1, wherein the flange portion of the frame member is welded to the peripheral wall portion.
3. The frame member has a side surface portion connecting the flange portion and the support surface portion, and the support surface portion and the side surface portion form a recess with respect to the flange portion,
   2. The semiconductor device according to claim 1, wherein said transparent member is positioned entirely within said recess.
4. The housing has a housing main body for receiving connection of the semiconductor element,
   2. The semiconductor device according to claim 1, wherein the peripheral wall portion is configured by a frame-shaped member provided for the housing body portion.
5. 2. The semiconductor device according to claim 1, further comprising a support member provided on a side opposite to the transparent member side with respect to the support surface portion of the frame member, the support member supporting the support surface portion to the housing side.
6. 6. The semiconductor device according to claim 5, wherein said support member is provided so as to support said support surface portion with respect to said semiconductor element.
7. The frame member includes a frame member main body made of an alloy containing iron, nickel, and cobalt; a metal film portion formed so as to cover at least a joint surface of the frame member main body with respect to the peripheral wall portion; The semiconductor device according to claim 1, comprising:
8. 4 . The semiconductor device according to claim 3 , wherein the side surface portion of the frame member is formed to have a zigzag shape when viewed in vertical cross section.
9. 2. The semiconductor device according to claim 1, wherein said semiconductor element is provided in said housing while being supported by a cooling element.
10. a semiconductor element;
    a housing having a peripheral wall surrounding the semiconductor element and electrically connected to the semiconductor element;
    a transparent member provided to face the semiconductor element;
    a flange portion joined to the peripheral wall portion; and a supporting surface portion positioned closer to the semiconductor element than the flange portion and supporting the transparent member, and surrounding the semiconductor element together with the casing and the transparent member. An electronic device having a semiconductor device, comprising: a frame member forming an airtight space.
11. preparing a housing having a peripheral wall surrounding a semiconductor element and electrically connected to the semiconductor element;
    a step of providing the semiconductor element inside the peripheral wall portion of the housing in a state of being electrically connected to the housing;
    a step of preparing a frame member that is configured in a frame shape as a whole, has a flange portion on the peripheral edge portion, forms a recess for the flange portion, and has an opening on the bottom surface of the recess;
    a step of attaching the frame member to the housing by welding the flange portion to the peripheral wall portion;
    and providing a transparent member on the bottom surface of the frame member so as to block the opening.

Images