JP2015214070A - Molding tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding tool which has excellent releasability and antifouling properties and hardly causes breaking or cracking.SOLUTION: There is provided a molding tool which is used in molding a molded article and comprises a metal base material 10 and a ceramic layer 20 which is provided on the base material 10 and contains yttrium oxide, nitrogen and a cation of a 4A group element and is in contact with the molded article. The molding tool may further comprise an intermediate layer 30 interposed between the base material 10 and the ceramic layer 20. The intermediate layer 30 has higher hardness than the base material 10 and has a part having higher toughness than the ceramic layer 20.

Description

  The present invention relates to a mold used when molding a molded product.

  Patent Document 1 (Japanese Patent Laid-Open No. 2011-79261) discloses a mold in which a release layer (4) is formed on a surface (8) of a base material (5) made of ceramics.

JP 2011-79261 A JP 2010-185095 A

  The release layer (4) described in Patent Document 1 is said to be excellent in release properties and antifouling properties. On the other hand, in Patent Document 1, a base material made of ceramics is used. However, in this case, there are problems that the base material is difficult to machine and the base material is difficult to handle (prone to cracking and chipping). .

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a mold that is excellent in releasability and antifouling properties and is less prone to cracking and chipping. .

The shaping | molding die concerning this invention is a shaping | molding die used when shape | molding a molded article.
In one aspect of the present invention, a forming die includes a metal base material, and a ceramic layer that is provided on the base material and includes yttrium oxide, nitrogen, and a cation of a group 4A element and is in contact with the molded product.

  In one embodiment, the mold further comprises an adhesive layer interposed between the substrate and the ceramic layer. The adhesive layer may be formed of a single layer or a plurality of layers.

  In another aspect of the present invention, the mold includes a metal base, a yttrium oxide, nitrogen, and a cation of a group 4A element, and a ceramic layer in contact with the molded article, and between the base and the ceramic layer. And an intermediate layer interposed. The intermediate layer may be formed of a single layer or a plurality of layers.

  In one embodiment, the mold further comprises an adhesive layer interposed between the substrate and the intermediate layer.

  In one embodiment, the mold further includes an adhesive layer interposed between the intermediate layer and the ceramic layer.

  In one embodiment, the intermediate layer is formed of a plurality of layers, and an adhesive layer is interposed between at least two intermediate layers of the plurality of intermediate layers.

  In one embodiment, the intermediate layer has a portion that is harder than the substrate and tougher than the ceramic layer.

  In one embodiment, the intermediate layer has a hardness higher than that of the substrate at least on the surface portion on the ceramic layer side.

  In one embodiment, the intermediate layer includes a buffer layer whose hardness changes so as to increase in hardness from the substrate side toward the ceramic layer side. Note that “change” here includes both continuous change and stepwise change, and combinations of continuous and stepwise.

  In one embodiment, the intermediate layer includes a buffer layer whose hardness is continuously changed by changing the composition of the intermediate layer.

  In one embodiment, the intermediate layer is an M-A based nitride, where M is titanium, chromium, nickel, zirconium, aluminum, or silicon and A is nitrogen, carbon, or oxygen. Includes parts made of carbides and oxides.

  In one embodiment, the adhesive layer includes a portion made of a single metal of titanium, chromium, nickel, zirconium, yttrium, aluminum, silicon or a mixture thereof, or an oxide of a single metal or an oxide including a plurality of single metals. Including.

  In the present specification, “hardness” means “dynamic micro hardness tester” (model number: DUH-211S) manufactured by Shimadzu Corporation, and measurement conditions are “indenter: triangular pyramid indenter (Belkovic type, Ling). Mean angle 115 °), indentation depth from the surface: 0.1 μm, load speed: set value 80 (0.8758 mN / sec), load holding time: 15 sec ”.

  ADVANTAGE OF THE INVENTION According to this invention, the mold which is excellent in mold release property and antifouling property, and is hard to produce a crack and a chip | tip can be provided.

It is a figure which shows the cross section of the shaping | molding die which concerns on one embodiment of this invention. It is a figure which shows the cross section of the shaping | molding die which concerns on other embodiment of this invention. It is sectional drawing which shows an example of the structure of an intermediate | middle layer in detail. It is sectional drawing which shows the other example of the structure of an intermediate | middle layer in detail. It is sectional drawing which shows the other example of the structure of an intermediate | middle layer in detail. It is a figure which shows the experimental result which evaluated the mold release property about the shaping | molding die concerning one Example of this invention, and the shaping | molding die concerning a comparative example. It is a photograph which shows the bottom face of the said shaping | molding die after performing shaping | molding operation | movement of the predetermined number of times using the shaping | molding die concerning one Example of this invention. It is a photograph which shows the bottom face of the said shaping | molding die after performing shaping | molding operation | movement of the predetermined number of times using the shaping | molding die concerning a comparative example.

  Embodiments of the present invention will be described below. Note that the same or corresponding portions are denoted by the same reference numerals, and the description thereof may not be repeated.

  Note that in the embodiments described below, when referring to the number, amount, and the like, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. In the following embodiments, each component is not necessarily essential for the present invention unless otherwise specified.

First, an embodiment of the present invention will be schematically described.
One embodiment of the present invention is a mold used for molding a molded article, which is provided on a metal base material and the base material, and contains yttrium oxide, nitrogen, and a group 4A element. It is a shaping | molding die provided with the ceramic layer which contains a cation and contacts the said molded article. An adhesive layer may be provided between the substrate and the ceramic layer.

  One embodiment of the present invention is a mold used for molding a molded article, which includes a metal base material, yttrium oxide, nitrogen, and a cation of a group 4A element, And a ceramic layer that is in contact, and further includes an intermediate layer interposed between the substrate and the ceramic layer. An adhesive layer may be interposed between the base material and the intermediate layer. Furthermore, an adhesive layer may be interposed between the intermediate layer and the ceramic layer.

  When the intermediate layer is formed of a plurality of layers, an adhesive layer may be interposed between at least two intermediate layers in the plurality of intermediate layers.

Furthermore, the adhesive layer may be formed of a single layer or a plurality of layers.
In the molding die, the intermediate layer has a portion having a higher hardness than the base material and a higher toughness than the ceramic layer. The intermediate layer has a hardness higher than that of the base material at least on the surface portion on the ceramic layer side.

  In the molding die, the intermediate layer may include a buffer layer. For example, the buffer layer may change in hardness so as to increase in hardness from the base material side toward the ceramic layer side. It is configured.

Moreover, the said shaping | molding die can be set as the structure which contains an adhesion layer in the said intermediate | middle layer.
Further, a plurality of buffer layers can be provided, and a single layer or a plurality of adhesive layers can be interposed between at least two buffer layers.

In addition, the said adhesive layer may show the function of a buffer layer.
In addition, for example, it may be difficult to join the intermediate layer (buffer layer) and the ceramic layer with a single adhesive layer. In this case, the intermediate layer (buffer layer) and the ceramic layer are interposed with a multilayer adhesive layer (for example, in the case of three layers, the first adhesive layer, the second adhesive layer, and the third adhesive layer from the ceramic layer side). You may join in steps (refer FIG. 5).

That is, the first adhesive layer in contact with the ceramic layer is made of a material that easily adheres to the ceramic layer, and another adhesive layer (corresponding to the third adhesive layer) in contact with the intermediate layer (buffer layer) is used as the intermediate layer ( It can be formed of a substance that easily adheres to the buffer layer. That is, the adhesive layer can have a multilayer structure as necessary.

  When the multilayer adhesive layer is three layers, the first adhesive layer and the third adhesive layer are joined with a second adhesive layer formed of a material that is easily bonded to the first and third adhesive layers. can do.

  In general, the intermediate layer is substantially a buffer layer, and the intermediate layer (buffer layer) can be bonded to another layer through an adhesive layer (external addition of the adhesive layer to the intermediate layer). ).

  Further, as shown in the figure, the intermediate layer can be composed of a buffer layer and an adhesive layer, and the intermediate layer is an intermediate layer including the adhesive layer (inner layer of the adhesive layer in the intermediate layer). Add).

  Therefore, in the intermediate layer according to the present invention, an adhesive layer can be externally or internally added to the buffer layer that is a substantial intermediate layer.

  The intermediate layer according to the present invention may be only the buffer layer or only the adhesive layer.

In addition, the buffer layer may have an adhesive action, and the adhesive layer may have a buffer action.
Reference is also made to the buffering action of the intermediate layer (buffer layer or adhesive layer) described above. The ceramic layer is a thin layer and has a high hardness and low toughness with respect to the metal base material. An intermediate layer is provided as a layer for buffering the difference in hardness and toughness between the two.

Hereinafter, it demonstrates more concretely using drawing.
FIG. 1 is a view showing a cross section of a mold according to the present embodiment. The molding die according to the present embodiment is used when molding a resin molded product or the like, and is provided on the metal base material 10 and the metal base material 10 as shown in FIG. A ceramic layer 20 in contact with the product.

  The metal substrate 10 may be made of an iron-based material (for example, stainless steel, carbon steel, alloy steel, alloy tool steel, high-speed steel, pre-hardened steel, etc.), or a non-ferrous material (copper-based, (Aluminum type, cemented carbide type, etc.). Thereby, while being excellent in workability, it can be set as the metal base material 10 which is hard to produce a crack and a chip.

  The ceramic layer 20 includes yttrium oxide, nitrogen, and a cation of a group 4A element. Thereby, the shaping | molding die excellent in mold release property and antifouling property is provided. The metal substrate 10 and the ceramic layer 20 may be joined via an adhesive layer (not shown).

  The metal substrate 10 can be formed by a conventional metal working method such as cutting or electric discharge machining. The ceramic layer can be formed, for example, by physical vapor deposition (PVD) such as sputtering or ion plating.

  In the example of FIG. 1, the thickness of the ceramic layer 20 is about 0.1 μm to 5 μm. The thickness of the adhesive layer between the metal substrate 10 and the ceramic layer 20 is about 0.01 μm to 1 μm.

  FIG. 2 is a view showing a cross section of a mold according to another embodiment. In the embodiment shown in FIG. 2, the mold further includes an intermediate layer 30 interposed between the base material 10 and the ceramic layer 20. The intermediate layer 30 has a portion whose hardness is higher than that of the metal substrate 10 and whose toughness is higher than that of the ceramic layer 20. Thereby, it can suppress that the ceramic layer 20 cracks or peels from the metal base material 10. FIG.

  In the example of FIG. 2, the thickness of the intermediate layer 30 is about 0.2 μm to 5 μm. The thickness of the ceramic layer 20 is about 0.1 μm to 5 μm as in the example of FIG.

  Next, the structure of the intermediate layer 30 will be described in more detail with reference to FIGS. In the example of FIG. 3, the intermediate layer 30 has buffer layers 31A and 31B and adhesive layers 32A and 32B. In the example of FIG. 4, the intermediate layer 30 has buffer layer 31 and adhesive layers 32A and 32B. In the example of FIG. 5, the intermediate layer 30 includes buffer layers 31 </ b> A and 31 </ b> B and adhesive layers 32 </ b> A to 32 </ b> D.

  That is, the buffer layer may be composed of a plurality of layers as shown in FIGS. 3 and 5, or may be composed of a single layer as shown in FIG. The adhesive layer may also be a single layer on both sides of the buffer layer as shown in FIGS. 3 and 4, or may be a plurality of layers on one side of the buffer layer and on the other side as shown in FIG. It may be composed of a single layer or may be composed of a plurality of layers on both sides of the buffer layer.

  In the intermediate layer 30 in FIG. 5, an adhesive layer composed of a single layer or a plurality of layers may be provided between the buffer layers 31A and 31B which are substantially intermediate layers. When an adhesive layer with another layer is provided on the buffer layer (substantially intermediate layer), the intermediate layer includes an adhesive layer.

  Moreover, in FIG. 4, the buffer layer 31 and the metal base material 10 can be joined directly. Furthermore, in FIG. 4, the buffer layer 31 and the ceramic layer 20 can be directly joined.

  Both the buffer layer and the adhesive layer can be formed by physical vapor deposition (PVD) such as sputtering or ion plating.

  The buffer layer preferably has a hardness that changes so that the hardness increases from the low-hardness metal substrate 10 side toward the high-hardness ceramic layer 20 side. For example, in the case of the buffer layers 31A and 31B having a laminated structure as shown in FIGS. 3 and 5, the hardness of the buffer layer 31A on the metal substrate 10 side is made lower than the hardness of the buffer layer 31B on the ceramic layer 20 side. The hardness can be changed stepwise. In the case of the single-layer structure buffer layer 31 as shown in FIG. 4, the hardness is continuously increased by changing the composition in the thickness direction of the buffer layer (for example, reducing the nitrogen concentration as the metal substrate 10 is approached). Can be changed.

  The buffer layer is, for example, an MA-based nitride (M is titanium, chromium, nickel, zirconium, aluminum, or silicon, and A is nitrogen, carbon, or oxygen), carbide, oxide. Consists of.

  The adhesive layer is made of, for example, a single metal of titanium, chromium, nickel, zirconium, yttrium, aluminum, or silicon, or a mixture thereof, or an oxide of the above metal or an oxide containing a plurality of the above metals.

  The material constituting the buffer layer and the material constituting the adhesive layer can be appropriately selected and combined. In addition, the thickness (total) of the buffer layer is about 0.2 μm to 5 μm.

  Next, the improvement in releasability according to the embodiment of the present invention will be described with reference to FIG. FIG. 6 shows a predetermined number of molding operations for the molding die according to one embodiment of the present invention and the molding die according to the comparative example (the metal base material is subjected to hard chromium plating). The experimental result which evaluated the mold release property by measuring force is shown.

  Referring to FIG. 6, according to the mold according to the example of the present invention, the mold release force is reduced as compared with the mold according to the comparative example, and the ceramic layer 20 is excellent in the mold release property. It can be seen that this is a mold.

  Next, the improvement of the antifouling property according to the embodiment of the present invention will be described with reference to FIGS. 7 and 8 each perform a predetermined number of molding operations (FIG. 7: 1000 times, FIG. 8: 300 times) using the molding die according to the embodiment of the present invention and the molding die according to the comparative example. It is a photograph which shows the bottom face of the said shaping | molding die after a heat treatment.

  7 and 8, in the mold (FIG. 7) according to the embodiment of the present invention, no conspicuous dirt is observed after 1000 molding operations, whereas a comparative example is shown. In the molding die according to FIG. 8 (FIG. 8), after 300 molding operations, the adhesion of the resin is recognized in part A, and the accumulation of flash is recognized in part B. Further, discoloration is observed on the entire bottom surface of the cavity. From the above results, it can be seen that the ceramic layer 20 is a mold having excellent antifouling properties.

  As described above, according to the mold according to the present embodiment, by using the ceramic layer 20, the mold is excellent in releasability and antifouling property, and by using the metal substrate 10, the mold is formed. Can prevent cracking and chipping. Further, the intermediate layer 30 can improve the bonding structure between the metal substrate 10 and the ceramic layer 20, and can suppress cracking of the ceramic layer 20 and peeling from the metal substrate 10.

  In addition, the said shaping | molding die can be used for injection molding, transfer molding, and compression molding, for example.

  In the case of transfer molding (or compression molding), a resin chip is used to encapsulate a semiconductor chip mounted on a substrate in a package (molded product) corresponding to the shape of the cavity in a cavity provided with a ceramic layer ( Or compression molding).

  Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  10 metal substrate, 20 ceramic layer, 30 intermediate layer, 31, 31A, 31B buffer layer, 32A, 32B, 32C, 32D adhesive layer.

Claims (16)

A mold used when molding a molded article,
A metal substrate;
A mold comprising: a ceramic layer provided on the base material and containing a yttrium oxide, nitrogen, and a cation of a group 4A element and in contact with the molded article.   The mold according to claim 1, further comprising an adhesive layer interposed between the base material and the ceramic layer. A mold used when molding a molded article,
A metal substrate;
A ceramic layer that contains yttrium oxide, nitrogen, and a cation of a group 4A element, and is in contact with the molded article;
A mold comprising an intermediate layer interposed between the substrate and the ceramic layer.   The mold according to claim 3, further comprising an adhesive layer interposed between the base material and the intermediate layer.   The mold according to claim 3, further comprising an adhesive layer interposed between the intermediate layer and the ceramic layer.   The mold according to claim 3, wherein the intermediate layer is formed as a single layer.   The mold according to claim 3, wherein the intermediate layer is formed of a plurality of layers.   The mold according to claim 3, wherein the intermediate layer is formed of a plurality of layers, and an adhesive layer is interposed between at least two intermediate layers of the plurality of intermediate layers.   The mold according to any one of claims 2, 4, 5, and 8, wherein the adhesive layer is formed as a single layer.   The mold according to any one of claims 2, 4, 5, and 8, wherein the adhesive layer is formed of a plurality of layers.   The said intermediate | middle layer is a shaping | molding die of Claim 3 which has a part whose hardness is higher than the said base material, and whose toughness is higher than the said ceramic layer.   The mold according to claim 3, wherein the intermediate layer has a hardness higher than that of the base material at least on a surface portion on the ceramic layer side.   The said intermediate | middle layer is a shaping | molding die of Claim 3 containing the buffer layer from which hardness changes so that it may become high hardness toward the said ceramic layer side from the said base material side.   The said intermediate | middle layer is a shaping | molding die of Claim 3 containing the buffer layer which changes hardness continuously by changing the composition of the said intermediate | middle layer.   The intermediate layer is made of a nitride, carbide, or oxide of MA type (M is titanium, chromium, nickel, zirconium, aluminum, or silicon, and A is nitrogen, carbon, or oxygen). The mold according to claim 3, comprising:   The adhesive layer includes a portion made of a simple metal of titanium, chromium, nickel, zirconium, yttrium, aluminum, silicon or a mixture thereof, or an oxide of the simple metal or an oxide including a plurality of simple metals. The mold according to any one of claims 2, 4, 5, and 8 to 10.