TWI574813B - Forming mold - Google Patents

Description

Forming mold

The present invention relates to a molding die which is used in molding a molded article.

In the patent document 1 (JP-A-2011-79261), a molding die in which a release layer (4) is formed on a surface (8) of a base material (5) made of ceramics is disclosed.

[First technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-79261

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-185095

The release layer (4) described in Patent Document 1 is excellent in release property and antifouling property. Further, in Patent Document 1, although a base material made of ceramic is used, in this case, mechanical processing of the base material is difficult, and there is a problem that the base material is difficult to handle (it is easy to cause cracks or notches). .

The present invention has been made in view of the above problems, and an object of the present invention is to provide a molding die which is excellent in release property and antifouling property and which does not cause cracks or chipping.

The molding die of the present invention is a molding die that is used in molding a molded article.

In one aspect of the invention, a molding die includes: a substrate made of a metal; and a ceramic layer provided on the substrate and containing cerium oxide, nitrogen, and a cation of a Group 4A element in contact with the molded article.

In one embodiment, the forming mold further includes an adhesive layer interposed between the substrate and the ceramic layer. The layer may be formed in a single layer or in a plurality of layers.

In another aspect of the invention, the forming mold comprises: a substrate made of a metal; a ceramic layer comprising cerium oxide, nitrogen and a cation of a Group 4A element in contact with the molded article; and an intermediate layer interposed in the base Between the material and the ceramic layer. The intermediate layer may be formed in a single layer or in a plurality of layers.

In one embodiment, the forming die further includes an adhesive layer interposed between the substrate and the intermediate layer.

In one embodiment, the forming mold further includes an adhesive layer interposed between the intermediate layer and the ceramic layer.

In one embodiment, the intermediate layer is formed by a plurality of layers, and between the at least two intermediate layers of the plurality of intermediate layers, an interlayer is interposed.

In one embodiment, the intermediate layer comprises a portion having a higher hardness than the substrate and having a higher toughness than the ceramic layer.

In one embodiment, the intermediate layer is in the surface portion of at least the ceramic layer side and has a higher hardness than the substrate.

In one embodiment, the intermediate layer comprises a buffer layer whose hardness gradually changes to a high hardness from the side of the substrate to the side of the ceramic layer. And, here, the so-called "change The system consists of continuous changes and stepwise changes, as well as any combination of continuity and step.

In one embodiment, the intermediate layer comprises a buffer layer that changes the hardness continuity by varying the composition of the intermediate layer.

In one embodiment, the intermediate layer comprises a portion of a nitride, carbide, or oxide of MA (M-based titanium, chromium, nickel, zirconium, aluminum, or hafnium, A-based nitrogen, carbon, or oxygen). .

In one embodiment, the subsequent layer comprises a metal monomer of titanium, chromium, nickel, zirconium, hafnium, aluminum, lanthanum or a mixture thereof, or an oxide of the foregoing metal monomer or a plurality of the aforementioned metal monomers The part of the oxide.

In addition, the "hardness" in the patent specification of the present application means that the "dynamic micro hardness tester" (model: DUH-211S) manufactured by Shimadzu Corporation is used, and the measurement condition is "press: triangular cone pressure". Sub (Berkovich type, 115 degrees in the mausoleum), the depth of penetration from the surface: 0.1 μm, load speed: set value 80 (0.8758 mN/sec), load holding time: 15 seconds", and the measurement was performed.

According to the present invention, it is possible to provide a molding die which is excellent in release property and antifouling property and which is less likely to cause cracks or chipping.

10‧‧‧Metal substrate

20‧‧‧Ceramic layer

30‧‧‧Intermediate

31, 31A, 31B‧‧‧ buffer layer

32A, 32B, 32C, 32D‧‧‧Next layer

Fig. 1 is a cross-sectional view showing a molding die according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing a molding die according to another embodiment of the present invention.

Fig. 3 is a cross-sectional view showing an example of the structure of the intermediate layer in more detail.

Fig. 4 is a cross-sectional view showing another example of the structure of the intermediate layer in more detail.

Fig. 5 is a cross-sectional view showing another example of the structure of the intermediate layer in more detail.

Fig. 6 is a view showing the results of an experiment for evaluating the release property of a molding die according to an embodiment of the present invention and a molding die of a comparative example.

Fig. 7 is a photograph showing the bottom surface of the molding die after a predetermined number of molding operations using a molding die according to an embodiment of the present invention.

Fig. 8 is a photograph showing the bottom surface of the molding die after a predetermined number of molding operations using a molding die of a comparative example.

Hereinafter, embodiments of the present invention will be described. In addition, the same or corresponding parts are given the same reference numerals, and the description thereof will not be repeated.

Further, in the embodiments described below, the scope of the present invention is not necessarily limited to the number and the amount, unless otherwise specified. Further, in the following embodiments, each component is not essential to the present invention except for the case where it is specifically described.

First, an embodiment of the present invention will be briefly described.

An embodiment of the present invention is a molding die which is used in a molded article, characterized in that it comprises: a substrate made of a metal; and a ceramic layer provided on the substrate, comprising ruthenium oxide, The cation of nitrogen and a Group 4A element is in contact with the aforementioned molded article. An adhesive layer may be provided between the substrate and the ceramic layer.

Moreover, an embodiment of the present invention is a molding die which is used in a molded article, and is characterized in that it comprises a base material made of a metal; And a ceramic layer comprising a cation of cerium oxide, nitrogen and a Group 4A element in contact with the molded article; and an intermediate layer interposed between the substrate and the ceramic layer. Further, an adhesive layer may be interposed between the substrate and the intermediate layer. Further, an adhesive layer may be interposed between the intermediate layer and the ceramic layer.

Further, when the intermediate layer is formed in a plurality of layers, an adhesive layer may be interposed between at least two intermediate layers of the plurality of intermediate layers.

Further, the above-mentioned adhesive layer may be formed in a single layer or a plurality of layers.

Further, in the molding die, the intermediate layer includes a portion having a higher hardness than the substrate and a higher toughness than the ceramic layer. Further, the intermediate layer is at least a surface portion of the ceramic layer side having a hardness higher than that of the substrate.

Further, in the molding die, the intermediate layer may include a buffer layer, for example, the buffer layer, and the hardness gradually changes from the substrate side to the ceramic layer side to a high hardness.

Further, in the above molding die, the intermediate layer may include an adhesive layer.

Further, the buffer layer may be provided as a plurality of layers, and between the at least two buffer layers, a single layer or an additional layer of a plurality of layers may be interposed.

Moreover, sometimes the aforementioned layer displays the function of the buffer layer.

Further, for example, it is sometimes difficult to bond the intermediate layer (buffer layer) and the ceramic layer with a single layer of the subsequent layer. In this case, the intermediate layer (buffer layer) and the ceramic layer may be interposed with a plurality of layers (for example, in the case of three layers, the first subsequent layer, the second subsequent layer, and the third subsequent layer are sequentially provided from the ceramic layer side. ), joined in a stepwise manner.

That is, the first subsequent layer in contact with the ceramic layer is made of a substance which is easily adhered to the ceramic layer, and is brought into contact with the intermediate layer (buffer layer). The other subsequent layer (corresponding to the third subsequent layer) is composed of a substance which is easily attached to the intermediate layer (buffer layer). That is, the adhesive layer can be made into a multilayer structure as needed.

Further, when the plurality of adhesive layers of the plurality of layers are three layers, the first adhesive layer and the third adhesive layer can be formed by the second adhesive layer and the third adhesive layer. Layer bonding.

Further, in summary, the intermediate layer is a substantial buffer layer, and the intermediate layer (buffer layer) may be bonded to the subsequent layer via another layer (addition to the exterior layer of the intermediate layer).

Further, as shown in the example, the intermediate layer may be composed of a buffer layer and an adhesive layer, and the intermediate layer may be an intermediate layer including the adhesive layer (addition of the inside of the intermediate layer in the intermediate layer).

Therefore, in the intermediate layer of the present invention, the adhesive layer can be attached to the outside or the inside with respect to the buffer layer which becomes the substantial intermediate layer.

Further, the intermediate layer of the present invention may be a buffer layer only, or may be a laminate layer only.

Moreover, the buffer layer may also be used for connection, and the subsequent layer may also have a buffering effect.

Also, the buffering effect of the aforementioned intermediate layer (buffer layer or subsequent layer) is mentioned. The ceramic layer-based thin layer has a hardness and a low toughness with respect to a metal substrate. The intermediate layer is provided as a layer for buffering the difference in hardness and toughness between the two.

Hereinafter, the details will be described using the drawings.

Fig. 1 is a plan view showing a cross section of a molding die of the embodiment. Real The molding die of the embodiment is formed by a user when molding a resin molded article or the like, as shown in Fig. 1, comprising: a metal substrate 10; and a ceramic layer 20 which is provided on the metal substrate 10 and formed Product contact.

The metal substrate 10 may be composed of an iron-based material (for example, stainless steel, carbon steel, alloy steel, alloy tool steel, high-speed steel, and pre-hardened steel), or may be made of a non-ferrous material (copper, aluminum, super hard). Alloy steel system, etc.). Thereby, the metal substrate 10 which is excellent in workability and which does not generate cracks or notches can be obtained.

The ceramic layer 20 is a cation containing cerium oxide, nitrogen, and a Group 4A element. Thereby, a molding die excellent in release property and antifouling property is provided. The metal base material 10 and the ceramic layer 20 may be joined by an adhesive layer (not shown).

The metal substrate 10 can be formed by a prior metal working method such as cutting or electric discharge machining. The ceramic layer 20 can be formed, for example, by physical vapor deposition (PVD) such as sputtering or ion plating.

In the example of Fig. 1, the thickness of the ceramic layer 20 is about 0.1 μm to 5 μm. The thickness of the adhesion layer between the metal substrate 10 and the ceramic layer 20 is about 0.01 μm to 1 μm.

Fig. 2 is a plan view showing a cross section of a molding die according to another embodiment. In the embodiment shown in Fig. 2, the forming mold further includes an intermediate layer 30 interposed between the metal substrate 10 and the ceramic layer 20. The intermediate layer 30 includes a portion having a higher hardness than the metal substrate 10 and having a higher toughness than the ceramic layer 20. Thereby, the ceramic layer 20 can be suppressed from being cracked or the metal base material 10 can be peeled off.

In the example of Fig. 2, the thickness of the intermediate layer 30 is about 0.2 μm to 5 μm. The thickness of the ceramic layer 20 is about 0.1 μm to 5 μm as in the example of Fig. 1 .

Next, the intermediate layer 30 will be described in detail using FIGS. 3 to 5 . Construction. In the example of FIG. 3, the intermediate layer 30 includes buffer layers 31A, 31B and subsequent layers 32A, 32B. In the example of FIG. 4, the intermediate layer 30 includes a buffer layer 31 and an adhesive layer 32A, 32B. In the example of Fig. 5, the intermediate layer 30 includes buffer layers 31A, 31B and subsequent layers 32A to 32D.

That is, as shown in Figs. 3 and 5, the buffer layer may be composed of a plurality of layers, or may be composed of a single layer as shown in Fig. 4. As shown in FIGS. 3 and 4, the adhesive layer may be composed of a single layer on both sides of the buffer layer, or may be composed of a plurality of layers on one side of the buffer layer and on the other side as shown in FIG. It is composed of a single layer, and may be composed of a plurality of layers on both sides of the buffer layer.

Further, in the intermediate layer 30 of Fig. 5, an adhesive layer composed of a single layer or a plurality of layers may be provided between the buffer layers 31A and 31B which are substantially intermediate layers. Further, when the buffer layer (substantial intermediate layer) is provided with an adhesion layer to another layer, the intermediate layer is a layer including the subsequent layer.

Further, in Fig. 4, the buffer layer 31 and the metal substrate 10 can be directly bonded. Moreover, in FIG. 4, the buffer layer 31 and the ceramic layer 20 can be directly bonded.

Both the buffer layer and the adhesive layer can be formed, for example, by physical vapor deposition (PVD) such as sputtering or ion plating.

The buffer layer is preferably changed from a side of the metal substrate 10 having a lower hardness to a side of the ceramic layer 20 having a higher hardness to a high hardness. For example, as shown in FIGS. 3 and 5, when the buffer layers 31A and 31B are laminated, the hardness of the buffer layer 31A on the metal substrate 10 side is lower than that of the buffer layer 31B on the ceramic layer 20 side. Hardness can change the hardness stepwise. Further, as shown in Fig. 4, when the buffer layer 31 is formed in a single layer, the composition is changed in the thickness direction of the buffer layer (for example, the nitrogen concentration is decreased as it approaches the metal substrate 10), and the hardness can be continuously changed.

The buffer layer is made of, for example, a nitride, a carbide, or an oxide of M-A (M-based titanium, chromium, nickel, zirconium, aluminum, or antimony, A-based nitrogen, carbon, or oxygen).

The layer is then comprised of, for example, a metal monomer of titanium, chromium, nickel, zirconium, hafnium, aluminum, lanthanum or a mixture thereof, or an oxide of the foregoing metal monomer or an oxide comprising a plurality of the aforementioned metal monomers. .

The material constituting the buffer layer and the material constituting the subsequent layer can be appropriately selected and combined. Further, the thickness (total) of the buffer layer is about 0.2 μm to 5 μm.

Next, the improvement of the release property by the embodiment of the present invention will be described using Fig. 6. Fig. 6 is a view showing a molding die according to an embodiment of the present invention, and a molding die of a comparative example (when a hard chrome plate is applied to a metal substrate), a molding operation is performed for a predetermined number of times, and at this time, by measuring the release force, A picture of the experimental results of the evaluation of the release property.

Referring to Fig. 6, in the case of the molding die according to the embodiment of the present invention, it is understood that the releasing force is reduced as compared with the molding die of the comparative example, and the ceramic layer 20 is used as a molding die having excellent release property.

Next, the improvement of the antifouling property by the embodiment of the present invention will be described using Figs. 7 and 8. 7 and 8 are views showing a molding die according to an embodiment of the present invention and a molding die of a comparative example, which are formed for a predetermined number of times (Fig. 7: 1000 times, Fig. 8: 300 times). A photograph of the bottom surface of the forming mold.

Referring to Fig. 7 and Fig. 8, in the molding die (Fig. 7) of the embodiment of the present invention, after 1000 molding operations, no significant staining was observed, and in the comparative example, In the molding die (Fig. 8), after 300 molding operations, it is considered that resin is fixed in the A portion, and In Part B, it is considered that there is excess material accumulated. Moreover, it is considered to have discoloration in the entire bottom surface of the cavity. From the above results, it is understood that the ceramic layer 20 can be used as a molding die having excellent antifouling properties.

In the case of the molding die according to the present embodiment, by using the ceramic layer 20, a molding die excellent in release property and antifouling property can be obtained, and by using the metal substrate 10, cracking of the molding die can be suppressed. Or gap. Further, the intermediate layer 30 can improve the joint structure of the metal base material 10 and the ceramic layer 20, and can suppress cracking of the ceramic layer 20 or peeling from the metal base material 10.

Moreover, the aforementioned molding die can be used, for example, in injection molding, transfer molding, or compression molding.

When transfer molding (or compression molding), a resin material may be used, and a sealing layer is formed in a cavity (a molded article) corresponding to a cavity shape in a cavity in which a ceramic layer is provided on a semiconductor wafer assembled on a substrate. (or compression forming).

Although the embodiments of the present invention have been described above, the embodiments of the present invention must be considered, and are not intended to be exhaustive or to limit the invention. The scope of the present invention is defined by the scope of the patent application, and the scope of the invention is intended to be equivalent to the scope of the patent application.

10‧‧‧Metal substrate

20‧‧‧ceramic layer

30‧‧‧Intermediate

Claims (15)

A molding die, which is used in forming a molded article, comprising: a substrate made of a metal; a ceramic layer containing cerium oxide, nitrogen, and a cation of a Group 4A element, in contact with the molded article; and an intermediate layer interposed in the foregoing Between the substrate and the ceramic layer, the intermediate layer includes a portion having a higher hardness than the substrate and having a higher toughness than the ceramic layer, and the intermediate layer comprises a MA system (M system titanium, chromium, nickel, Zirconium, aluminum or hafnium, part of the nitride, carbide or oxide of A, nitrogen, carbon or oxygen. A molding die, which is used in forming a molded article, comprising: a substrate made of a metal; a ceramic layer containing cerium oxide, nitrogen, and a cation of a Group 4A element, in contact with the molded article; and an intermediate layer interposed in the foregoing Between the substrate and the ceramic layer, the intermediate layer has a hardness higher than that of the substrate at least on the surface portion of the ceramic layer side, and the intermediate layer contains MA-based (M-based titanium, chromium, nickel, zirconium) A part of a nitride, a carbide, or an oxide of aluminum, aluminum or tantalum, A-based nitrogen, carbon or oxygen. A molding die, which is used in forming a molded article, comprising: a substrate made of a metal; a ceramic layer containing cerium oxide, nitrogen, and a cation of a Group 4A element, in contact with the molded article; and an intermediate layer interposed in the foregoing Between the substrate and the ceramic layer, the intermediate layer The buffer layer includes a MA layer (M-based titanium, chromium, nickel, zirconium, aluminum or lanthanum, A-based nitrogen, and a buffer layer from the side of the substrate to the ceramic layer side, and the hardness gradually becomes high hardness. A part of a nitride, a carbide, or an oxide of carbon or oxygen. A molding die, which is used in forming a molded article, comprising: a substrate made of a metal; a ceramic layer containing cerium oxide, nitrogen, and a cation of a Group 4A element, in contact with the molded article; and an intermediate layer interposed in the foregoing Between the substrate and the ceramic layer, the intermediate layer includes a buffer layer that changes the hardness continuity by changing the composition of the intermediate layer, and the intermediate layer comprises a MA system (M system titanium, chromium, nickel, zirconium) A part of a nitride, a carbide, or an oxide of aluminum, aluminum or tantalum, A-based nitrogen, carbon or oxygen. The forming mold according to any one of claims 1 to 4, further comprising an adhesive layer interposed between the substrate and the intermediate layer, wherein the adhesive layer comprises titanium, chromium, nickel, zirconium, a metal monomer of ruthenium, aluminum or ruthenium or a mixture thereof, or an oxide of the above metal monomer or a part comprising an oxide of a plurality of the aforementioned metal monomers. The forming mold according to any one of claims 1 to 4, further comprising an adhesive layer interposed between the intermediate layer and the ceramic layer, wherein the adhesive layer comprises titanium, chromium, nickel, zirconium, a metal monomer of ruthenium, aluminum or ruthenium or a mixture thereof, or an oxide of the above metal monomer or a part comprising an oxide of a plurality of the aforementioned metal monomers. The forming mold according to any one of claims 1-4, wherein The aforementioned intermediate layer is formed in a single layer. The molding die according to any one of claims 1 to 4, wherein the intermediate layer is formed of a plurality of layers. The forming mold according to any one of claims 1 to 4, wherein the intermediate layer is formed by a plurality of layers, and between the at least two intermediate layers of the plurality of intermediate layers, an adhesive layer is interposed. The adhesive layer comprises a metal monomer of titanium, chromium, nickel, zirconium, hafnium, aluminum, lanthanum or a mixture thereof, or an oxide of the metal monomer or an oxide comprising a plurality of the foregoing metal monomers section. The molding die according to claim 5, wherein the adhesive layer is formed of a single layer, and the adhesive layer comprises a metal monomer of titanium, chromium, nickel, zirconium, hafnium, aluminum, or niobium or a mixture, or an oxide of the foregoing metal monomer or a portion comprising an oxide of a plurality of the aforementioned metal monomers. The molding die according to claim 6, wherein the adhesive layer is formed of a single layer, and the adhesive layer comprises a metal monomer of titanium, chromium, nickel, zirconium, hafnium, aluminum, or lanthanum or the like. a mixture, or an oxide of the foregoing metal monomer or a portion comprising an oxide of a plurality of the aforementioned metal monomers. The molding die according to claim 9, wherein the adhesive layer is formed of a single layer, and the adhesive layer comprises a metal monomer of titanium, chromium, nickel, zirconium, hafnium, aluminum, or niobium or a mixture, or an oxide of the foregoing metal monomer or a portion comprising an oxide of a plurality of the aforementioned metal monomers. The molding die according to claim 5, wherein the adhesive layer is formed of a plurality of layers, and the adhesive layer comprises a metal monomer of titanium, chromium, nickel, zirconium, hafnium, aluminum, or lanthanum or the like. a mixture, or an oxide of the foregoing metal monomer or a portion comprising an oxide of a plurality of the aforementioned metal monomers. The molding die according to claim 6, wherein the adhesive layer is formed of a plurality of layers, and the adhesive layer comprises a metal monomer of titanium, chromium, nickel, zirconium, hafnium, aluminum, or lanthanum or the like. a mixture, or an oxide of the foregoing metal monomer or a portion comprising an oxide of a plurality of the aforementioned metal monomers. The molding die according to claim 9, wherein the adhesive layer is formed of a plurality of layers, and the adhesive layer comprises a metal monomer of titanium, chromium, nickel, zirconium, hafnium, aluminum, or lanthanum or the like. a mixture, or an oxide of the foregoing metal monomer or a portion comprising an oxide of a plurality of the aforementioned metal monomers.