CN105082414A - Forming mold - Google Patents

Forming mold Download PDF

Info

Publication number
CN105082414A
CN105082414A CN201510199771.2A CN201510199771A CN105082414A CN 105082414 A CN105082414 A CN 105082414A CN 201510199771 A CN201510199771 A CN 201510199771A CN 105082414 A CN105082414 A CN 105082414A
Authority
CN
China
Prior art keywords
intermediate layer
finishing die
layer
base material
adhesive linkage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510199771.2A
Other languages
Chinese (zh)
Inventor
坂东和彦
藤原邦彦
东大助
岸本智子
野口欣纪
白井健士郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN105082414A publication Critical patent/CN105082414A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/56Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/37Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/37Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C2045/378Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings built by a stack of modular elements

Abstract

The invention provides a forming mole having excellent demoulding property and stain resistance and uneasy to produce cracks and deficiencies. The forming mold is used during product formation. The forming mold comprises metal base material (10) and a ceramic layer (20) arranged on the base material (10) and having positive ions containing ythria, nitrogen and 4A clan elements and having a contact with the forming product. The forming mold further comprises an intermediate layer (30) arranged between the base material (10) and the ceramic layer (20); and the intermediate layer (30) has a part having hardness higher than the base material (10) and tenacity higher than the ceramic layer (20).

Description

Finishing die
Technical field
The present invention relates to a kind of finishing die used when shaping formed products.
Background technology
The surface 8 disclosing a kind of base material 5 being made up of pottery in patent document 1 (Japanese Unexamined Patent Publication 2011-79261 publication) is formed with the finishing die of release layer 4.
prior art document
patent document
Patent document 1: Japanese Unexamined Patent Publication 2011-79261 publication
Patent document 2: Japanese Unexamined Patent Publication 2010-185095 publication
Summary of the invention
the problem that invention will solve
The release property of the release layer 4 described in patent document 1 and soil resistance excellence.On the other hand, in patent document 1, use the base material be made up of pottery, but in such a case, there is the such problem of difficult treatment (be easy to crack, defect) of the machining difficulty of base material, base material.
The present invention makes in view of above-mentioned such problem, the object of the present invention is to provide a kind of release property and soil resistance excellent and be difficult to crack, the finishing die of defect.
for the scheme of dealing with problems
Finishing die of the present invention is the finishing die used when shaping formed products.
In a technical scheme of the present invention, finishing die comprises: metal base material; And ceramic layer, it is located on base material, comprises the cation of yittrium oxide, nitrogen and 4A race element, and contacts with formed products.
In one embodiment, finishing die also comprises the adhesive linkage between base material and ceramic layer.Adhesive linkage can be formed as individual layer, also can be formed as multilayer.
In another technical scheme of the present invention, finishing die comprises: metal base material; Ceramic layer, it comprises the cation of yittrium oxide, nitrogen and 4A race element, and contacts with formed products; And intermediate layer, it is between base material and ceramic layer.Intermediate layer can be formed as individual layer, also can be formed as multilayer.
In one embodiment, finishing die also comprises the adhesive linkage between base material and intermediate layer.
In one embodiment, finishing die also comprises the adhesive linkage between layer and ceramic layer.
In one embodiment, intermediate layer is formed as multilayer, is provided with adhesive linkage between at least two-layer intermediate layer in multiple layers in interbed.
In one embodiment, intermediate layer has the high and part that toughness that is Toughness Ratio ceramic layer is high of the hardness of hardness ratio base material.
In one embodiment, intermediate layer is at least high in the hardness of the hardness ratio base material of the surface element office of ceramic layer side.
In one embodiment, intermediate layer comprises cushion, and the mode that the hardness of this cushion uprises to go to ceramic layer side from substrate side changes.In addition, said " change " comprises continuous print change, interim change and any one continuously and in the combined change of stage herein.
In one embodiment, intermediate layer comprises cushion, and it makes the hardness of this cushion change continuously by making the composition in this intermediate layer change.
In one embodiment, the part comprising M-A based nitride, carbide, oxide is contained in intermediate layer, and M is titanium, chromium, nickel, zirconium, aluminium or silicon, and A is nitrogen, carbon or oxygen.。
In one embodiment, adhesive linkage comprises the part of the oxide with titanium, chromium, nickel, zirconium, yttrium, aluminium, the metallic monomer of silicon, the mixture of these metallic monomer or metallic monomer or the oxide containing various metals monomer.
In addition, being meant to of " hardness " in present specification: " dynamic micro hardometer " (model: DUH-211S) using Shimadzu Scisakusho Ltd, is set to " pressure head: triangular pyramid pressure head (Berkovich type, drift angle 115 °), compression distance from surface: 0.1 μm, loading speed: setting value 80 (0.8758mN/ second), load retention time: 15 seconds " and carries out measuring the value obtained by measuring condition.
the effect of invention
Adopt the present invention, a kind of release property and soil resistance can be provided excellent and be difficult to crack, the finishing die of defect.
Accompanying drawing explanation
Fig. 1 is the figure in the cross section of the finishing die representing one embodiment of the present invention.
Fig. 2 is the figure in the cross section of the finishing die representing another embodiment of the present invention.
Fig. 3 is the sectional view of an example of the structure representing intermediate layer in more detail.
Fig. 4 is the sectional view of another example of the structure representing intermediate layer in more detail.
Fig. 5 is the sectional view of another example of the structure representing intermediate layer in more detail.
Fig. 6 represents the figure finishing die of one embodiment of the invention and the finishing die of comparative example being carried out to the experimental result that release property evaluation obtains.
Fig. 7 represents the photo using the finishing die of one embodiment of the invention to carry out the bottom surface of this finishing die after the shaping actions of pre-determined number.
Fig. 8 represents the photo using the finishing die of comparative example to carry out the bottom surface of this finishing die after the shaping actions of pre-determined number.
description of reference numerals
10, metal base; 20, ceramic layer; 30, intermediate layer; 31,31A, 31B, cushion; 32A, 32B, 32C, 32D, adhesive linkage.
Detailed description of the invention
Below, embodiments of the present invention are described.In addition, exist and identical Reference numeral is marked to identical or corresponding part, and the situation of not repeat specification.
In addition, in the embodiment of following explanation, when mentioning number, amount etc., outside special situation about recording, scope of the present invention not necessarily limits its number, amount etc.In addition, in the following embodiments, various inscape except there is special situation about recording, inscape not necessarily necessary for the present invention.
First, embodiments of the present invention are roughly described.
One embodiment of the present invention are the finishing dies used when shaping formed products, and this finishing die comprises: metal base material; And ceramic layer, it is located on above-mentioned base material, and comprises the cation of yittrium oxide, nitrogen and 4A race element, and contacts with above-mentioned formed products.Also adhesive linkage can be provided with between above-mentioned base material and above-mentioned ceramic layer.
In addition, one embodiment of the present invention are the finishing dies used when shaping formed products, and this finishing die comprises: metal base material; And ceramic layer, it comprises the cation of yittrium oxide, nitrogen and 4A race element, and contacts with above-mentioned formed products, and this finishing die also comprises the intermediate layer between above-mentioned base material and above-mentioned ceramic layer.In addition, also adhesive linkage can be provided with between above-mentioned base material and intermediate layer.And, also can be provided with adhesive linkage between above-mentioned intermediate layer and above-mentioned ceramic layer.
In addition, when above-mentioned intermediate layer is formed as multilayer, also adhesive linkage can be provided with between at least two-layer intermediate layer in the intermediate layer of above-mentioned multilayer.
Further, above-mentioned adhesive linkage also can be formed as individual layer or multilayer.
In addition, in above-mentioned finishing die, above-mentioned intermediate layer has the high and part that toughness that the is above-mentioned ceramic layer of Toughness Ratio is high of the hardness of the above-mentioned base material of hardness ratio.In addition, above-mentioned intermediate layer is at least high in the hardness of the above-mentioned base material of surface element office hardness ratio of above-mentioned ceramic layer side.
In addition, in above-mentioned finishing die, can comprise cushion in above-mentioned intermediate layer, such as, above-mentioned cushion is configured to hardness to go the mode uprised to change from above-mentioned substrate side to above-mentioned ceramic layer side.
In addition, in above-mentioned finishing die, the structure comprising adhesive linkage in above-mentioned intermediate layer can be become.
In addition, cushion can be set as multilayer, at least can be provided with the adhesive linkage of individual layer or multilayer between two buffer layer.
In addition, there is the situation that above-mentioned adhesive linkage has the function of cushion.
In addition, such as, existence is difficult to use the adhesive linkage of individual layer by intermediate layer (cushion) and the articulate situation of ceramic layer.In this case, also can be provided with multi-layer bonded layer (such as three layers, be set to the 1st adhesive linkage, the 2nd adhesive linkage, the 3rd adhesive linkage from ceramic layer side) between intermediate layer (cushion) and ceramic layer periodically intermediate layer (cushion) and ceramic layer are joined together (with reference to Fig. 5).
Namely, can form with being easy to the material bonding with ceramic layer the 1st adhesive linkage contacted with ceramic layer, and form with being easy to the material bonding with intermediate layer (cushion) other adhesive linkages (being equivalent to above-mentioned 3rd adhesive linkage) contacted with intermediate layer (cushion).Namely adhesive linkage can be made as required to form multi-ply construction.
In addition, when above-mentioned multi-layer bonded layer is set to three layers, above-mentioned 1st adhesive linkage and above-mentioned 3rd adhesive linkage can be engaged with by being easy to the 2nd adhesive linkage that the material bonding with the above-mentioned 1st and the 3rd adhesive linkage formed.
In addition, generally speaking, above-mentioned intermediate layer is in fact cushion, and above-mentioned intermediate layer (cushion) can be undertaken engaging (to the external additional adhesion layer in intermediate layer) by adhesive linkage and other layers.
In addition, as For the illustrated example, above-mentioned intermediate layer can comprise cushion and adhesive linkage, and above-mentioned intermediate layer becomes the intermediate layer (at additional adhesion layer in intermediate layer) comprising above-mentioned adhesive linkage.
Thus, intermediate layer of the present invention can external ground or additional adhesion layer inherently relative to the cushion in the intermediate layer becoming essence.
In addition, intermediate layer of the present invention can be only cushion, may also be only adhesive linkage.
In addition, there is the situation that cushion has bonding effect, also there is the situation that adhesive linkage has cushioning effect.
In addition, the cushioning effect that aforesaid intermediate layer (cushion or adhesive linkage) plays is described.Above-mentioned ceramic layer is thinner layer, and is hard relative to above-mentioned metal base material hardness and the layer that toughness is low.Intermediate layer is set as the layer cushioned the difference of the hardness of both and the difference of toughness.
Below, accompanying drawing is utilized to further illustrate.
Fig. 1 is the figure in the cross section of the finishing die representing present embodiment.The finishing die of present embodiment is the mould used when shaping resin formed products etc., and as shown in Figure 1, this finishing die comprises: metal base 10; And ceramic layer 20, it is located on metal base 10, and contacts with formed products.
Metal base 10 can be made up of the material of iron system (such as stainless steel, carbon steel, steel alloy, alloy tool steel, high-speed steel, perhardened steel etc.), also can be made up of the material of non-ferric system (copper system, aluminium system, superhard alloy system etc.).Thereby, it is possible to formed, excellent in workability and being difficult to cracks, the metal base 10 of defect.
Ceramic layer 20 comprises the cation of yittrium oxide, nitrogen and 4A race element.Thus, the finishing die of release property and soil resistance excellence can be provided.Also can engage between metal base 10 and ceramic layer 20 by not shown adhesive linkage.
Metal base 10 can be formed with the intermetallic composite coating method in the past such as machining, spark machined.The physical vapor deposition (PVD) of such as sputtering, ion plating etc. can be utilized to form ceramic layer.
In the example in fig 1, the thickness of ceramic layer 20 is 0.1 μm ~ about 5 μm.The thickness of the adhesive linkage between metal base 10 and ceramic layer 20 is 0.01 μm ~ about 1 μm.
Fig. 2 is the figure in the cross section of the finishing die representing another embodiment.In the embodiment shown in figure 2, finishing die also comprises the intermediate layer 30 between base material 10 and ceramic layer 20.Intermediate layer 30 has the high and part that toughness that is Toughness Ratio ceramic layer 20 is high of the hardness of hardness ratio metal base 10.Thereby, it is possible to suppression ceramic layer 20 cracks or ceramic layer 20 is peeled off from metal base 10.
In the example in figure 2, the thickness in intermediate layer 30 is 0.2 μm ~ about 5 μm.Identical with the example of Fig. 1, the thickness of ceramic layer 20 is 0.1 μm ~ about 5 μm.
Next, utilize Fig. 3 ~ Fig. 5, the structure in intermediate layer 30 is described in more detail.In the example in figure 3, intermediate layer 30 has cushion 31A, 31B and adhesive linkage 32A, 32B, and in the example in fig. 4, intermediate layer 30 has cushion 31 and adhesive linkage 32A, 32B, in the example of fig. 5, intermediate layer 30 has cushion 31A, 31B and adhesive linkage 32A ~ 32D.
That is, cushion as Fig. 3, be made up of multilayer as shown in Figure 5, also can be made up of individual layer as shown in Figure 4.Adhesive linkage also can be made up of individual layer such both sides at cushion as shown in Figure 3, Figure 4, also can be made up of multilayer in the side of cushion as shown in Figure 5, be made up of at opposite side individual layer, and, also can be made up of multilayer in the both sides of cushion.
In addition, in the intermediate layer 30 of Fig. 5, what also substantially can become intermediate layer is provided with the adhesive linkage be made up of individual layer or multilayer between cushion 31A, 31B.In addition, when above-mentioned cushion (intermediate layer of essence) is provided with the adhesive linkage bonding with other layer, above-mentioned intermediate layer becomes the layer comprising adhesive linkage.
In addition, in the diagram, can directly cushion 31 be engaged with metal base 10.And, in the diagram, can directly cushion 31 be engaged with ceramic layer 20.
Such as, can utilize the physical vapor deposition (PVD) of sputtering, ion plating etc. that cushion is formed together with adhesive linkage.
Preferably, the hardness of cushion goes the mode uprised to change with ceramic layer 20 side that metal base 10 lateral stiffness low from hardness is high.Such as, when cushion 31A, 31B of such as Fig. 3, lit-par-lit structure as shown in Figure 5, low by the hardness of the cushion 31B making hardness ratio ceramic layer 20 side of the cushion 31A of metal base 10 side, hardness can be made periodically to change.In addition, when cushion 31 of monolayer constructions will as shown in Figure 4, by making composition change on the thickness direction of cushion (such as reducing nitrogen concentration along with near metal base 10), hardness can be made to change continuously.
Cushion such as comprises M-A system, and (M is titanium, chromium, nickel, zirconium, aluminium or silicon, and A is nitrogen, carbon or oxygen.) nitride, carbide, oxide.
Adhesive linkage is such as made up of the oxide of the metallic monomer of titanium, chromium, nickel, zirconium, yttrium, aluminium, silicon, the mixture of these metallic monomer or above-mentioned metallic monomer or the oxide containing multiple above-mentioned metallic monomer.
The raw material of raw material and the formation adhesive linkage selecting to form cushion can be suitable for and it is combined.In addition, the thickness (total) of cushion is 0.2 μm ~ about 5 μm.
Next, utilize Fig. 6, the raising of the release property of embodiments of the invention is described.Fig. 6 is the shaping actions finishing die (metal base being implemented to the finishing die of hard chromium plating) of the finishing die of one embodiment of the present of invention and comparative example being carried out to pre-determined number, evaluates by measuring each knockout press the experimental result that release property obtains.
Learn with reference to Fig. 6, adopt the finishing die of embodiments of the invention, compared with the finishing die of comparative example, knockout press reduces, and utilizes ceramic layer 20 to form the finishing die of release property excellence.
Next, utilize Fig. 7, Fig. 8, the raising of the soil resistance of embodiments of the invention is described.Fig. 7, Fig. 8 represent the photo using the finishing die of embodiments of the invention and the finishing die of comparative example to carry out the bottom surface of this finishing die after the shaping actions of pre-determined number (Fig. 7: 1000 times, Fig. 8: 300 times).
With reference to Fig. 7, Fig. 8, significant spot can not be recognized carry out 1000 shaping actions in the finishing die (Fig. 7) of embodiments of the invention after, on the other hand, in the finishing die (Fig. 8) of comparative example, after carrying out 300 shaping actions, except recognizing the adhesion of resin in A portion, identify the accumulation of die forging burr in addition in B portion.And, recognize variable color in whole die cavity bottom surface.Learn from above result, ceramic layer 20 can be utilized to form the finishing die of soil resistance excellence.
So, adopting the finishing die of present embodiment, by the finishing die using ceramic layer 20 to form release property and soil resistance excellence, and by using metal base 10, the crackle of finishing die, defect can be suppressed.And, utilize intermediate layer 30, the joint construction between metal base 10 and ceramic layer 20 can be improved, and suppress that ceramic layer 20 cracks, ceramic layer 20 is peeled off from metal base 10.
In addition, above-mentioned finishing die such as can be used in injection molding forming, transfer modling is shaped, compression molding.
When transfer modling is shaped (or compression molding), can resin material be used, the semiconductor chip making to be installed on substrate in the die cavity being provided with ceramic layer seal molding (or compression molding) in the packaging part (formed products) corresponding with the shape of this die cavity.
Above, embodiments of the present invention are illustrated, but should think that embodiment of disclosure is all illustrate but not limit in all.Represent scope of the present invention by claim, scope of the present invention can think all changes in the meaning and right that comprise and be equal to claim.

Claims (16)

1. a finishing die, it uses when shaping formed products, wherein,
This finishing die comprises:
Metal base material; And
Ceramic layer, it is located on described base material, comprises the cation of yittrium oxide, nitrogen and 4A race element, and contacts with described formed products.
2. finishing die according to claim 1, wherein,
This finishing die also comprises the adhesive linkage between described base material and described ceramic layer.
3. a finishing die, it uses when shaping formed products, wherein,
This finishing die comprises:
Metal base material;
Ceramic layer, it comprises the cation of yittrium oxide, nitrogen and 4A race element, and contacts with described formed products; And
Intermediate layer, it is between described base material and described ceramic layer.
4. finishing die according to claim 3, wherein,
This finishing die also comprises the adhesive linkage between described base material and described intermediate layer.
5. finishing die according to claim 3, wherein,
This finishing die also comprises the adhesive linkage between described intermediate layer and described ceramic layer.
6. finishing die according to claim 3, wherein,
Described intermediate layer is formed as individual layer.
7. finishing die according to claim 3, wherein,
Described intermediate layer is formed as multilayer.
8. finishing die according to claim 3, wherein,
Described intermediate layer is formed as multilayer, is provided with adhesive linkage between at least two-layer intermediate layer in described multilayer intermediate layer.
9. according to the finishing die in claim 2,4,5,8 described in any one, wherein,
Described adhesive linkage is formed as individual layer.
10. according to the finishing die in claim 2,4,5,8 described in any one, wherein,
Described adhesive linkage is formed as multilayer.
11. finishing dies according to claim 3, wherein,
Described intermediate layer has the high part of the toughness of ceramic layer described in the high and Toughness Ratio of the hardness of base material described in hardness ratio.
12. finishing dies according to claim 3, wherein,
Described in the hardness ratio of described intermediate layer at least in the surface element office of described ceramic layer side, the hardness of base material is high.
13. finishing dies according to claim 3, wherein,
Described intermediate layer comprises cushion, and the mode that the hardness of this cushion uprises to go to described ceramic layer side from described substrate side changes.
14. finishing dies according to claim 3, wherein,
Described intermediate layer comprises cushion, and this cushion makes hardness change continuously by making the composition in described intermediate layer change.
15. finishing dies according to claim 3, wherein,
The part comprising M-A based nitride, carbide, oxide is contained in described intermediate layer, and M is titanium, chromium, nickel, zirconium, aluminium or silicon, and A is nitrogen, carbon or oxygen.
16. according to the finishing die in claim 2,4,5,8 described in any one, wherein, described adhesive linkage comprises the part of the oxide with titanium, chromium, nickel, zirconium, yttrium, aluminium, the metallic monomer of silicon, the mixture of these metallic monomer or described metallic monomer or the oxide containing multiple described metallic monomer.
CN201510199771.2A 2014-05-09 2015-04-23 Forming mold Pending CN105082414A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014097793A JP6366348B2 (en) 2014-05-09 2014-05-09 Mold
JP2014-097793 2014-05-09

Publications (1)

Publication Number Publication Date
CN105082414A true CN105082414A (en) 2015-11-25

Family

ID=54564171

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510199771.2A Pending CN105082414A (en) 2014-05-09 2015-04-23 Forming mold

Country Status (4)

Country Link
JP (1) JP6366348B2 (en)
KR (2) KR20150128545A (en)
CN (1) CN105082414A (en)
TW (1) TWI574813B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017165612A (en) * 2016-03-16 2017-09-21 Towa株式会社 Translucent material, low adhesion material and molding member
JP6837506B2 (en) * 2019-01-28 2021-03-03 Towa株式会社 Resin molding equipment and manufacturing method of resin molded products

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200523219A (en) * 2004-01-07 2005-07-16 Asia Optical Co Inc Multilayer core used in glass molding
CN101291805A (en) * 2006-04-11 2008-10-22 东和株式会社 Low-adhesion material, mold for shaping resin and stainproof material
JP2009226775A (en) * 2008-03-24 2009-10-08 Towa Corp Low-adhesive material and its manufacturing method, molding mold and its manufacturing method, antifouling material and its manufacturing method
TW201117939A (en) * 2009-10-09 2011-06-01 Towa Corp Low-adhesion material, stain-proof material, molding die, and processes for production thereof
CN202322973U (en) * 2011-11-28 2012-07-11 机械科学研究总院先进制造技术研究中心 Superhigh-temperature forming die

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4134238B2 (en) * 2007-03-14 2008-08-20 Towa株式会社 Evaluation method of adhesion
JP4931944B2 (en) 2009-02-10 2012-05-16 神港精機株式会社 High hardness coating and method for forming the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200523219A (en) * 2004-01-07 2005-07-16 Asia Optical Co Inc Multilayer core used in glass molding
CN101291805A (en) * 2006-04-11 2008-10-22 东和株式会社 Low-adhesion material, mold for shaping resin and stainproof material
JP2009226775A (en) * 2008-03-24 2009-10-08 Towa Corp Low-adhesive material and its manufacturing method, molding mold and its manufacturing method, antifouling material and its manufacturing method
TW201117939A (en) * 2009-10-09 2011-06-01 Towa Corp Low-adhesion material, stain-proof material, molding die, and processes for production thereof
CN202322973U (en) * 2011-11-28 2012-07-11 机械科学研究总院先进制造技术研究中心 Superhigh-temperature forming die

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
马小娥: "《材料试验与测试技术》", 31 March 2008, 中国电力出版社 *

Also Published As

Publication number Publication date
KR20170040152A (en) 2017-04-12
JP2015214070A (en) 2015-12-03
TWI574813B (en) 2017-03-21
KR20150128545A (en) 2015-11-18
TW201600299A (en) 2016-01-01
JP6366348B2 (en) 2018-08-01
KR102009074B1 (en) 2019-08-08

Similar Documents

Publication Publication Date Title
CN101380659B (en) Mould for cold forging and manufacture method thereof
KR20060130196A (en) Coating for a cutting tool and corresponding production method
JP6614491B2 (en) Composite sintered body cutting tool and surface-coated composite sintered body cutting tool
US9427937B2 (en) Anti-wear coating
CN106574376B (en) Sliding element, in particular piston ring, and method for producing a sliding element
KR20080038080A (en) Metal mold for optical device forming and process for producing the same
US10456866B2 (en) Process for laser-assisted tool build and repair
CN105082414A (en) Forming mold
JP2008080352A (en) Hard material coated die for plastic working having excellent durability
JP6315197B2 (en) Composite sintered body cutting tool
WO2009083487A3 (en) Method for obtaining a metal microstructure and microstructure obtained according to said method
JP6853451B2 (en) Composite sintered body cutting tool
CN104755201A (en) Surface-coating material, cutting tool using the material and working machine using the material
CN102648305A (en) Coated article and method for making a coated article
WO2003064077A1 (en) Mold copper sheet for continuous casting manufacturing same
JP2017007062A (en) Composite sintered body cutting tool and surface-coated composite sintered body cutting tool
KR102460884B1 (en) Cover mold for hot stamping
CN106282919A (en) For the composite bed of cutter and the cutter including this composite bed and preparation method thereof
CN106003487A (en) Moulding die and material with low sealing property
CN103137361B (en) Metal key molding method
CN208555837U (en) Multilayer nut mold and multilayer screw mold
CN201136319Y (en) Metal workpieces with tungsten carbide coating
CN205853491U (en) A kind of multiple structure composite high-speed steel
RU46007U1 (en) MULTI-LAYER-CUTTING TOOL
WO2016104620A1 (en) Compound sintered compact cutting tool and compound sintered compact cutting tool with coated surface

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20151125

WD01 Invention patent application deemed withdrawn after publication